Soles and shoes

Abstract

Provided is a sole that constitutes a part of a shoe. The sole includes: a cushioning part (210) that mitigates the impact applied to a foot when landing; and a support part (220) that has an elastic modulus that is higher than the elastic modulus of the cushioning part and that supports the foot. The support part (220) has a support surface (220a) provided around the cushioning part. The cushioning part (210) has a recessed surface (212) and a plurality of columnar bodies (214H, 214L). The cushioning part (210) includes: a high-elastic region (210H) adjacent to the support surface (220a); and a low-elastic region (210L) that is adjacent to the high-elastic region and that has an elastic modulus that is lower than the elastic modulus of the high-elastic region.

Description

[Technical Field]

[0001] This disclosure relates to soles and shoes. [Background technology]

[0002] Shoes with a structure that reduces the impact on the foot when landing are known. For example, U.S. Patent Application Publication No. 2015 / 0223560 discloses a midsole with multiple convex elements. The multiple convex elements have a shape that extends from a recessed surface provided on the surface of the midsole to the surface of the midsole. The multiple convex elements are formed across the entire midsole. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] U.S. Patent Application Publication No. 2015 / 0223560 Summary of the Invention [Problem to be solved by the invention]

[0004] In the sole described in U.S. Patent Application Publication No. 2015 / 0223560, it is conceivable to further improve the cushioning by, for example, lowering the modulus of elasticity of each convex element. However, doing so would increase the difference in modulus of elasticity at the boundary between the surface of the midsole and the convex element, which would increase the discomfort felt by the wearer.

[0005] An object of the present disclosure is to provide a sole and a shoe that can achieve both mitigation of the impact on the foot when landing and reduction of discomfort felt by the wearer. [Means for solving the problem]

[0006] A sole according to one aspect of this disclosure is a sole that forms part of a shoe and has a buffer section that absorbs the impact on the foot when landing, and a support section that has a modulus of elasticity higher than that of the buffer section and supports the foot, the support section having a support surface provided around the buffer section, the buffer section having a concave surface located at a height position recessed from the support surface, and a plurality of pillars each having a shape that extends from the concave surface to a height position the same as that of the support surface, and the buffer section has a high elasticity region adjacent to the support surface, and a low elasticity region adjacent to the high elasticity region and having a modulus of elasticity lower than that of the high elasticity region.

[0007] A shoe according to one aspect of the present disclosure includes the sole and an upper that is directly or indirectly connected to the sole and positioned above the sole. [Effects of the Invention]

[0008] According to this disclosure, it is possible to provide a sole and a shoe that can achieve both mitigation of the impact on the foot when landing and reduction of discomfort felt by the wearer. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a perspective view schematically illustrating a shoe according to a first embodiment of the present disclosure. [Figure 2] FIG. [Figure 3] FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2. [Figure 4] FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. [Figure 5] FIG. 2 is a plan view showing the buffer section and its vicinity. [Figure 6] FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. 5. [Figure 7] FIG. [Figure 8] FIG. 10 is a plan view showing a modified example of the columnar body. [Figure 9] FIG. 10 is a plan view showing a modified example of the columnar body. [Figure 10] FIG. 10 is a perspective view showing a modified example of the columnar body. [Figure 11] FIG. 10 is a perspective view showing a modified example of the columnar body. [Figure 12] 10A and 10B are diagrams illustrating modified examples of the region of the buffer portion. [Figure 13] 10A and 10B are diagrams illustrating modified examples of the region of the buffer portion. [Figure 14] 10A and 10B are diagrams illustrating modified examples of the region of the buffer portion. [Figure 15] 10A and 10B are diagrams illustrating modified examples of the region of the buffer portion. [Figure 16] FIG. 10 is a plan view of a shock-absorbing portion of a shoe sole according to a second embodiment of the present disclosure. [Figure 17] FIG. 10 is a plan view of a shock-absorbing portion of a shoe sole according to a third embodiment of the present disclosure. [Figure 18] FIG. 4 is a perspective view of a low-elasticity region of the buffer portion. [Figure 19] FIG. 19 is a cross-sectional view taken along line XIX-XIX in FIG. [Figure 20] 10A and 10B are diagrams illustrating modified examples of the low elasticity region. [Figure 21] 10A and 10B are diagrams illustrating modified examples of the low elasticity region. [Figure 22] 10A and 10B are plan views showing modified examples of the arrangement of the buffer portion and the low elasticity region. [Figure 23] 10A and 10B are plan views showing modified examples of the arrangement of the buffer portion and the low elasticity region. [Figure 24] 10A and 10B are plan views showing modified examples of the arrangement of the buffer portion and the low elasticity region. [Figure 25] 10A and 10B are plan views showing modified examples of the arrangement of the buffer portion and the low elasticity region. DETAILED DESCRIPTION OF THE INVENTION

[0010] An embodiment of the present invention will be described with reference to the drawings. Note that in the drawings referred to below, the same or equivalent components are assigned the same numbers. In the following description, terms such as longitudinal direction, width direction, front, and rear are used. These directional terms indicate directions as seen from the perspective of a wearer wearing the shoe 1 placed on a flat surface such as the ground. For example, the front refers to the toe side, and the rear refers to the heel side. Furthermore, the medial side refers to the side of the first toe of the foot in the width direction, and the lateral side refers to the side of the fifth toe of the foot in the width direction.

[0011] (First embodiment) FIG. 1 is a perspective view schematically showing a shoe according to a first embodiment of the present disclosure. FIG. 2 is a plan view of the sole. FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2. FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 2. Although FIG. 2 shows a sole 10 for a left foot, this sole 10 can also be applied to a right foot, in which case it will be symmetrical to the sole 10 for the left foot. The shoe 1 of this embodiment is suitable for use as a running shoe, for example, but can also be applied as other sports shoes or walking shoes, and the shoe's intended use is not important.

[0012] As shown in FIGS. 1, 3 and 4, the shoe 1 includes a sole 10 and an upper 20.

[0013] The upper 20 is connected to the sole 10 and, together with the sole 10, forms a space for accommodating the foot. As shown in FIG. 3 , the upper 20 has an upper body 22 and a midsole 24. The upper body 22 covers the upper surface of the foot. The midsole 24 is connected to the lower part of the upper body 22 and forms the bottom of the upper 20. The midsole 24 is connected to the surface of the sole 10.

[0014] The sole 10 constitutes a part of the shoe 1. The sole 10 is connected to the lower part of the upper 20. The sole 10 has an outer sole 100 and a midsole 200.

[0015] The outer sole 100 constitutes the ground contact part and is made of rubber or the like.

[0016] The midsole 200 is provided on the outer sole 100. The upper 20 is disposed on the midsole 200. In other words, the midsole 200 is provided between the upper 20 and the outer sole 100.

[0017] The midsole 200 is formed, for example, from a resin foam material containing a resin material as a main component and a foaming agent and a cross-linking agent as secondary components. Resin foams such as polyolefin resin, polyurethane resin, nylon resin, and ethylene vinyl acetate copolymer are suitable for use as the resin material. Alternatively, the midsole 200 may be formed from a rubber foam material containing a rubber material as a main component and a plasticizer, foaming agent, reinforcing agent, and cross-linking agent as secondary components. Butadiene rubber, for example, is suitable for use as the rubber material. The midsole 200 is not limited to the above materials and may also be formed from a resin or rubber material that has adequate strength and excellent cushioning properties.

[0018] The midsole 200 has a forefoot region R1, a rearfoot region R2, and a midfoot region R3. The forefoot region R1 is a region located at the front in the longitudinal direction of the shoe 1. The rearfoot region R2 is a region located at the rear in the longitudinal direction of the shoe 1. The midfoot region R3 is a region located between the forefoot region R1 and the rearfoot region R2.

[0019] The forefoot region R1 is a region located in a range of approximately 0% to 30% of the total length of the shoe 1 from the front end to the rear end. The midfoot region R3 is a region located in a range of approximately 30% to 80% of the total length of the shoe 1 from the front end to the rear end. The rearfoot region R2 is a region located in a range of 80% to 100% of the total length of the shoe 1 from the front end to the rear end.

[0020] As shown in FIG. 2, the midsole 200 has a cushioning portion 210 and a support portion 220 .

[0021] The buffering section 210 is a section that absorbs the impact applied to the heel of the foot when landing. The buffering section 210 is provided at least in the rear foot region R2. In this embodiment, the buffering section 210 is provided in the region extending from the rear foot region R2 to the rear part of the midfoot region R3. The buffering section 210 is preferably formed within a range of 50% or less from the rear end of the shoe 1 along the center line SC of the shoe 1 (see FIG. 2). Note that the center line SC is not limited to the center line of the shoe 1, and may be a line corresponding to a straight line connecting the center of the calcaneus and the space between the first and second toes of a typical wearer of the shoe 1.

[0022] The buffer portion 210 has a front end 210a, a rear end 210b, an inner edge 210c, and an outer edge 210d.

[0023] The front end 210a is a portion located at the front end in the longitudinal direction. As shown in Fig. 2, the front end 210a is located outward in the width direction from the center line SC.

[0024] The rear end portion 210b is a portion located at the rear end in the longitudinal direction. As shown in Fig. 2, the rear end portion 210b is located approximately on the center line SC.

[0025] The inner edge 210c connects the front end 210a and the rear end 210b, and forms the inner edge in the width direction of the buffer section 210. The inner edge 210c has a front edge 210c1 and a rear edge 210c2.

[0026] The front edge 210c1 constitutes the front portion of the inner edge 210c in the longitudinal direction. The front edge 210c1 has a shape that gradually curves inward in the width direction from the front end 210a to the rear end 210b. In this embodiment, the front edge 210c1 has a shape that curves inward in the width direction. However, the front edge 210c1 may also have a shape that curves outward in the width direction, or may be formed linearly.

[0027] The rear edge 210c2 constitutes the rear portion of the inner edge 210c in the longitudinal direction. The rear edge 210c2 has a shape that gradually curves outward in the width direction toward the rear end 210b. In this embodiment, the rear edge 210c2 has a shape that curves inward in the width direction. However, the rear edge 210c2 may also have a shape that curves outward in the width direction or may be formed linearly.

[0028] The outer edge 210d connects the front end 210a and the rear end 210b, and forms the outer edge of the buffer section 210 in the width direction.

[0029] The buffer portion 210 has a concave surface 212 and a plurality of pillars 214 . The concave surface 212 is located at a height recessed from the surface (including the support surface 220a described below) of the midsole 200 in the area surrounding the buffer portion 210. As shown in Fig. 6, the concave surface 212 has a base surface 212a and an inclined surface 212b.

[0030] The base surface 212 a is substantially parallel to the surface of the pillar 214 . The inclined surface 212b is inclined with respect to the base surface 212a. The inclined surface 212b is formed in a region A (the region shaded in FIG. 5) including the inner edge portion 210c. The inclined surface 212b has a shape that gradually approaches the surface of the columnar body 214 from an edge A1 located within the buffer section 210 in the region A toward the outer edge A2 of the buffer section 210. For example, in a cross section taken along line VI-VI in FIG. 5, as shown in FIG. 6, the inclined surface 212b has a shape that gradually approaches the surface of the columnar body 214 from the outer side to the inner side in the width direction. The inclined surface 212b may be formed flat as shown in FIG. 6, or may be formed to be curved so as to be convex upward or downward. The rear end of the region A is located inside the center line SC in the width direction.

[0031] Each pillar 214 has a shape that extends from the concave surface 212 to the same height as the support surface 220a. The surface of each pillar 214 is preferably formed into a polygonal shape in a plan view, and is particularly preferably formed into a polygonal shape with pentagons or more sides. In this embodiment, each pillar 214 is formed into a hexagonal pillar shape. Note that the corners of the pillars 214 are not necessarily corners in the strict sense, and may be rounded or C-cut.

[0032] The dimension g (see FIG. 5) between a pair of adjacent pillars 214 is equal to or greater than the height dimension h (see FIG. 7) of the pillars 214. The dimension g is smaller than the length of each side of the surface of the pillars 214.

[0033] In a plan view of the columnar body 214, the largest dimension D (see FIG. 5) of the columnar body 214 in a direction perpendicular to the axial direction of the columnar body 214 is equal to or greater than the height dimension h of the columnar body 214. The height dimension h is preferably set to 0.5 mm or greater. The height dimension h is set to 30% or less of the thickness T (see FIG. 7) of the sole 10. The height dimension h means the distance from the concave surface 212 to the surface of the columnar body 214.

[0034] The position of the pillars 214 is set so that at least a portion of the pillars 214 is disposed within a circle X (see FIG. 5) whose center is 15% to 25% of the dimension L (see FIG. 2) of the portion of the ground contact surface of the outer sole 100 other than the toe roll-up portion 101, measured from the rear end RP (see FIG. 5) of the ground contact surface of the outer sole 100 forward along the heel center HC. The diameter of the circle X is 40% of the length between portions of the edge of the ground contact surface of the outer sole 100 that pass through the center and intersect with a line perpendicular to the heel center HC. In this embodiment, a plurality of pillars 214 are disposed within the circle X. The circle X is located rearward of the front end of the edge A1 in the longitudinal direction. The heel center HC refers to the line connecting the center of the calcaneus and the space between the third and fourth toes of a typical wearer of the shoe 1.

[0035] The support section 220 has a higher elastic modulus than the buffer section 210 and is a section that supports the foot. In this embodiment, the support section 220 supports the midfoot region of the foot. The support section 220 is provided at least in the midfoot region R3. The elastic modulus is essentially synonymous with the compressive elastic modulus in the thickness direction of the sole 10.

[0036] The support section 220 has a support surface 220a. The support surface 220a is provided in front of the buffer section 210. Specifically, the support surface 220a constitutes the surface of the part of the midsole 200 in front of the buffer section 210. In other words, the concave surface 212 is located at a height recessed from the support surface 220a. The support surface 220a has a shape that extends from one end to the other end in the width direction.

[0037] The support portion 220 has an inner support portion 222. The inner support portion 222 has a shape that extends inward in the width direction from the inner edge portion 210c. More specifically, the inner support portion 222 has a shape that extends inward in the width direction from the front edge portion 210c1. The surface of the inner support portion 222 is continuously connected to the support surface 220a.

[0038] The surface of the midsole 200 in the area surrounding the buffer portion 210, i.e., the surface including the support surface 220a and the surface of the medial support portion 222, is bonded to the midsole 24 with an adhesive. On the other hand, the buffer portion 210 is not bonded to the midsole 24.

[0039] In this embodiment, as shown in FIGS. 3 and 4, the midsole 200 has a top midsole 201, a bottom midsole 202, and a shock absorbing portion 203.

[0040] The bottom midsole 202 is provided on the outer sole 100 . The top midsole 201 is connected to the surface of the rear part of the bottom midsole 202. A buffer part 210 and an inner support part 222 are formed on the surface of the top midsole 201. The support part 220 is formed near the boundary between the top midsole 201 and the bottom midsole 202 in a plan view (corresponding to FIG. 2).

[0041] The shock absorbing portion 203 is a portion that absorbs the shock that is applied mainly to the heel when landing. The shock absorbing portion 203 is made of a material having a hardness that is lower than the hardness of the top midsole 201 and the hardness of the bottom midsole 202. The shock absorbing portion 203 is made of, for example, a foam material or a non-foam material of a polymer composition.

[0042] 2, the shock absorbing portion 203 is provided around the rear portion of the buffer portion 210. The shock absorbing portion 203 is provided at a position where it does not overlap with the buffer portion 210 in the thickness direction of the sole 10. In other words, in a plan view, the shock absorbing portion 203 is spaced apart from the buffer portion 210. However, the shock absorbing portion 203 may also be provided at a position where it overlaps with the buffer portion 210 in the thickness direction.

[0043] As described above, in the sole 10 of this embodiment, the shock absorbing portion 210 provided in the rear foot region R2 reduces the impact on the heel when landing, and further, the support portion 220 that supports the midfoot portion (arch) of the foot has a support surface 220a having a shape that extends from one end to the other end in the width direction of the shoe 1, thereby suppressing collapse of the arches of the foot (medial longitudinal arch and lateral longitudinal arch).

[0044] In this embodiment, each pillar 214 may be formed in a cylindrical shape as shown in Fig. 8. Alternatively, each pillar 214 may be formed in a triangular prism shape as shown in Fig. 9.

[0045] 10, each pillar-shaped body 214 may be formed of a cushioning material having a pillar-shaped outer shape. This cushioning material has, as its outer surface, a first end face ES1 and a second end face ES2 that face each other in the axial direction, which is the direction in which the axis line AX1 extends, and a plurality of connecting faces CS that connect the periphery of the first end face ES1 and the periphery of the second end face ES2.

[0046] The first end face ES1 has an outer shape of an N-sided polygon (N is an integer equal to or greater than 3) when viewed along the axial direction. The second end face ES2 has an outer shape of an M-sided polygon (M is an integer equal to or greater than 4 and greater than N) when viewed along the axial direction.

[0047] (MN) vertices P are provided at intermediate positions in the axial direction on the peripheral surface defined by the multiple connecting surfaces CS. One first ridge line L1 is provided from the (MN) vertices P to one of the N vertices of the first end face ES1. Two second ridge lines L2 are provided from the (MN) vertices P to two circumferentially adjacent vertices of the M vertices of the second end face ES2. (2×NM) third ridge lines L3 are provided from the remaining vertex of the N vertices of the first end face ES1 to the remaining vertex of the M vertices of the second end face ES2.

[0048] The ridges included in the first ridge L1, the second ridge L2, and the third ridge L3 do not intersect with each other, and multiple connection surfaces CS are defined by the ridges included in the first ridge L1, the second ridge L2, and the third ridge L3.

[0049] 10, the first end face ES1 has a flat pentagonal shape when viewed along the axial direction, and the second end face ES2 has a flat hexagonal shape when viewed along the axial direction. That is, in this example, N is 5 and M is 6. The number of vertices P is 1. The multiple connection surfaces CS include one curved surface having a substantially triangular shape, three curved surfaces having a substantially quadrangular shape, and two curved surfaces having a substantially pentagonal shape, for a total of six curved surfaces.

[0050] When a compressive load is applied to the buffer material along its axial direction, not only does a stress field occur that causes compressive deformation along the axial direction, but also a stress field that causes shear deformation. This is because the multiple connection surfaces CS all extend in a direction that intersects with the axial direction, creating a complex stress field due to the external shape. In other words, because the main axis of deformation of the buffer material is different from the load direction (i.e., the axial direction of the buffer material), shear deformation is much more likely to occur than in rectangular or cylindrical buffer materials where the main axis is aligned.

[0051] Therefore, the amount of deformation per volume increases as shear deformation becomes more likely to occur, resulting in high deformability. Therefore, by setting each pillar 214 to the above-mentioned buffer material, high buffer function is exhibited.

[0052] Alternatively, as shown in FIG. 11, each pillar 214 may be made up of a buffer structure including a buffer unit formed by combining a plurality of buffer materials into a unit.

[0053] Each of the plurality of cushioning materials is made of the cushioning material shown in Fig. 10. The plurality of cushioning materials are arranged adjacent to each other so that, of the plurality of connecting surfaces CS that each of the cushioning materials has, the connecting surfaces defined by the first ridge line L1 and the second ridge line L2 face each other with a gap G therebetween. The size of each gap G is approximately constant.

[0054] In the example shown in Figure 11, the multiple buffer materials consist of four buffer materials in total: two first buffer materials with pentagonal first end faces ES1 and hexagonal second end faces ES2, and two second buffer materials with rectangular first end faces ES1 and pentagonal second end faces ES2. The two first buffer materials and the two second buffer materials are alternately arranged around the axis AX2 of the buffer unit, and the orientations of the two first buffer materials along the axial direction are opposite to those of the two second buffer materials along the axial direction. This gives the buffer unit an overall outer shape of a roughly hexagonal prism.

[0055] In this embodiment as well, the buffering function of the buffer section 210 is enhanced. As shown in FIGS. 12 to 15, the formation area of ​​the buffer section 210 can be changed in various ways.

[0056] (Second embodiment) Next, a buffer portion 210 of a sole 10 according to a second embodiment of the present disclosure will be described with reference to Fig. 16. In the second embodiment, only the portions different from the first embodiment will be described, and the description of the same structure, action, and effect as in the first embodiment will not be repeated.

[0057] In this embodiment, the multiple columns 214 of the buffer section 210 include three inner columns 214a arranged in a row along the longitudinal direction on the inner side in the width direction, three outer columns 214b arranged in a row along the longitudinal direction on the outer side in the width direction, and three central columns 214c arranged in a row along the longitudinal direction between the inner columns 214a and the outer columns 214b. In plan view, the surface of each outer column 214b is formed in a triangular shape. In plan view, the surface of each central column 214c is formed in a substantially pentagonal shape. A concave surface 212 is provided between the outer column 214b and the central column 214c. The pair of outer column 214b and central column 214c adjacent to each other in the width direction with the concave surface 212 sandwiched between them has an overall outer shape that is substantially hexagonal.

[0058] (Third embodiment) Next, a buffer portion 210 of a sole 10 according to a third embodiment of the present disclosure will be described with reference to Figures 17 to 19. In the third embodiment, only the parts different from the first embodiment will be described, and the description of the same structure, action, and effect as in the first embodiment will not be repeated.

[0059] In this embodiment, the support surface 220a is provided around the buffer section 210, and the buffer section 210 has a high elasticity region 210H and a low elasticity region 210L. In Fig. 17, the outline of the low elasticity region 210L is indicated by a thick line.

[0060] The high elasticity region 210H is adjacent to the support surface 220a. The structure of the high elasticity region 210H is the same as that of the first embodiment. That is, the high elasticity region 210H has a concave surface 212 and a plurality of pillars 214H. The high elasticity region 210H has a shape that surrounds the entire periphery of the low elasticity region 210L.

[0061] The low elasticity region 210L is adjacent to the high elasticity region 210H and has a lower elastic modulus than the high elasticity region 210H. The hardness of the low elasticity region 210L is approximately HC25 to HC40 on the Asker C hardness scale. The low elasticity region 210L is formed in a position in the thickness direction of the sole 10 that overlaps with the calcaneus of the wearer of the shoe 1. In this embodiment, the low elasticity region 210L includes four pillars 214L.

[0062] The low-elasticity region 210L may be made of any material that is highly elastic, but may also be made of the same resin foam as the high-elasticity region 210H, such as polyolefin resin, polyurethane resin, nylon resin, or ethylene-vinyl acetate copolymer. In this case, as described below, the low-elasticity region 210L may have a hollowed-out structure or the foaming rate of the material that makes up the low-elasticity region 210L may be adjusted to have a lower elastic modulus than the high-elasticity region 210H. When both are made of the same material, they may be formed integrally or as separate members.

[0063] The low elasticity region 210L is preferably formed of a polymer composition. In this case, examples of the polymer contained in the polymer composition include olefin polymers such as olefin elastomers and olefin resins. Examples of olefin polymers include polyethylene (e.g., linear low density polyethylene (LLDPE), high density polyethylene (HDPE), etc.), polypropylene, ethylene-propylene copolymers, propylene-1-hexene copolymers, propylene-4-methyl-1-pentene copolymers, propylene-1-butene copolymers, ethylene-1-hexene copolymers, ethylene-4-methyl-pentene copolymers, ethylene-1-butene copolymers, 1-butene-1-hexene copolymers, 1-butene-4-methyl-pentene, ethylene-methacrylic acid copolymers, ethylene-methyl methacrylate copolymers, ethylene-methacrylic acid ... Examples of the polyolefin include ethyl acrylate copolymer, ethylene-butyl methacrylate copolymer, ethylene-methyl acrylate copolymer, ethylene-ethyl acrylate copolymer, ethylene-butyl acrylate copolymer, propylene-methacrylic acid copolymer, propylene-methyl methacrylate copolymer, propylene-ethyl methacrylate copolymer, propylene-butyl methacrylate copolymer, propylene-methyl acrylate copolymer, propylene-ethyl acrylate copolymer, propylene-butyl acrylate copolymer, ethylene-vinyl acetate copolymer (EVA), and propylene-vinyl acetate copolymer.

[0064] The polymer may be an amide polymer such as an amide elastomer or an amide resin, etc. Examples of the amide polymer include polyamide 6, polyamide 11, polyamide 12, polyamide 66, and polyamide 610.

[0065] The polymer may also be an ester polymer such as an ester elastomer or an ester resin, etc. Examples of the ester polymer include polyethylene terephthalate and polybutylene terephthalate.

[0066] The polymer may be a urethane polymer such as a urethane elastomer or a urethane resin, etc. Examples of the urethane polymer include polyester polyurethane and polyether polyurethane.

[0067] The polymer may also be a styrene-based polymer such as a styrene-based elastomer or a styrene-based resin. Examples of styrene-based elastomers include styrene-ethylene-butylene copolymer (SEB), styrene-butadiene-styrene copolymer (SBS), hydrogenated SBS (styrene-ethylene-butylene-styrene copolymer (SEBS)), styrene-isoprene-styrene copolymer (SIS), hydrogenated SIS (styrene-ethylene-propylene-styrene copolymer (SEPS)), styrene-isobutylene-styrene copolymer (SIBS), styrene-butadiene-styrene-butadiene (SBSB), and styrene-butadiene-styrene-butadiene-styrene (SBSBS). Examples of styrene-based resins include polystyrene, acrylonitrile-styrene resin (AS), and acrylonitrile-butadiene-styrene resin (ABS).

[0068] Furthermore, the polymer may be, for example, an acrylic polymer such as polymethyl methacrylate, a urethane-based acrylic polymer, a polyester-based acrylic polymer, a polyether-based acrylic polymer, a polycarbonate-based acrylic polymer, an epoxy-based acrylic polymer, a conjugated diene polymer-based acrylic polymer and hydrogenated products thereof, a urethane-based methacrylic polymer, a polyester-based methacrylic polymer, a polyether-based methacrylic polymer, a polycarbonate-based methacrylic polymer, an epoxy-based methacrylic polymer, a conjugated diene polymer-based methacrylic polymer and hydrogenated products thereof, a polyvinyl chloride resin, a silicone-based elastomer, butadiene rubber (BR), isoprene rubber (IR), chloroprene (CR), natural rubber (NR), styrene-butadiene rubber (SBR), acrylonitrile-butadiene rubber (NBR), butyl rubber (IIR), or the like.

[0069] 17 to 19, each pillar 214L in the low elasticity region 210L has a lightening portion 215. The lightening portion 215 is configured as a through-hole that penetrates the pillar 214L in the thickness direction of the sole 10. However, the lightening portion 215 may also be configured as a recess that is recessed from the surface of the pillar 214L toward the concave surface 212.

[0070] The inner circumferential surface of the pillar 214L that defines the lightening portion 215 is inclined so that the lightening portion 215 gradually becomes larger as it is separated from the concave surface 212. The outer surface of the pillar 214L is inclined so that it gradually becomes wider as it approaches the concave surface 212. However, the inner circumferential surface and the outer surface may be perpendicular to the concave surface 212.

[0071] The low elastic region 210L has connecting portions 216L that connect adjacent columns 214L. As shown in Fig. 19, the thickness of the connecting portions 216L is smaller than the thickness of each column 214L.

[0072] As described above, in the sole 10 of this embodiment, the shock applied to the foot when landing is reduced by the buffer section 210. Furthermore, since the buffer section 210 has the high elasticity region 210H adjacent to the support surface 220a and the low elasticity region 210L adjacent to the high elasticity region 210H, the difference in elastic modulus between the support section 220, the high elasticity region 210H, and the low elasticity region 210L is reduced. This reduces the discomfort felt by the wearer.

[0073] As shown in FIG. 20, the low elastic region 210L may have three pillars 214L.

[0074] Also in this embodiment, the pillars 214H in the high elasticity region 210H and the pillars 214L in the low elasticity region 210L are not limited to a hexagonal pillar shape. For example, each pillar 214H, 214L may be formed in a triangular pillar shape as shown in Fig. 21, or may be formed in a cylindrical shape (not shown). As in the first embodiment, the surface of each pillar 214H, 214L is preferably formed in a polygonal shape in a plan view, and particularly preferably in a polygonal shape with 5 or more sides.

[0075] Furthermore, the position where the low elasticity region 210L is formed is not limited to the rear foot region R2. As shown in Figures 22 to 25, the low elasticity region 210L may be formed in the region extending from the forefoot region R1 to the midfoot region R3. In these embodiments, the impact applied to the forefoot or midfoot is reduced.

[0076] In the example shown in Fig. 22, the low elasticity region 210L is provided in the center of the cushioning section 210 in the foot width direction, and has seven pillars 214L. In the example shown in Fig. 23, the low elasticity region 210L is provided in the center of the cushioning section 210 in the foot width direction, and has four pillars 214L. In the example shown in Fig. 24, the low elasticity region 210L is provided in the region of the cushioning section 210 on the lateral side of the foot in the foot width direction, and has four pillars 214L. In the example shown in Fig. 25, the low elasticity region 210L is provided in the region of the cushioning section 210 on the medial side of the foot in the foot width direction, and has four pillars 214L.

[0077] Furthermore, the low elasticity region 210L does not have to be entirely surrounded by the high elasticity region 210H. As shown in Fig. 24, a part of the low elasticity region 210L may be directly adjacent to the support surface 220a. In the examples of Figs. 22, 23, and 25, the entire periphery of the low elasticity region 210L is surrounded by the high elasticity region 210H.

[0078] 25, the low elasticity region 210L may be formed at a position that overlaps with the ball of the foot of the wearer of the shoe 1. As shown in FIG.

[0079] [Aspect] It will be appreciated by those skilled in the art that the exemplary embodiments described above are examples of the following aspects.

[0080] A sole according to one aspect of this disclosure is a sole that forms part of a shoe and has a buffer section that absorbs the impact on the foot when landing, and a support section that has a modulus of elasticity higher than that of the buffer section and supports the foot, the support section having a support surface provided around the buffer section, the buffer section having a concave surface located at a height position recessed from the support surface, and a plurality of pillars each having a shape that extends from the concave surface to a height position the same as that of the support surface, and the buffer section has a high elasticity region adjacent to the support surface, and a low elasticity region adjacent to the high elasticity region and having a modulus of elasticity lower than that of the high elasticity region.

[0081] In this sole, the shock absorber absorbs the impact on the foot when landing. Furthermore, because the shock absorber has a high-elasticity region adjacent to the support surface and a low-elasticity region adjacent to the high-elasticity region, the difference in elastic modulus between the support surface, the high-elasticity region, and the low-elasticity region is small. This reduces the discomfort felt by the wearer.

[0082] Preferably, the pillars in the low elasticity region have a lightening portion. In this case, the lightening portion may be formed by a through-hole that penetrates the pillars in the thickness direction of the sole.

[0083] The low elasticity region is preferably made of a material having a lower hardness than the material forming the high elasticity region.

[0084] It is also preferable that the high elasticity region has a shape that surrounds the entire periphery of the low elasticity region.

[0085] This more reliably reduces the discomfort felt by the wearer. The buffer portion may also be provided in a rear foot region that overlaps with the rear foot of a wearer of the shoe in the thickness direction of the sole.

[0086] In this manner, the impact on the rear foot is reduced. In this case, it is preferable that the low elasticity region is formed in a position in the thickness direction of the sole that overlaps with the calcaneus of the wearer of the shoe.

[0087] In this embodiment, impacts applied to the heels in particular are effectively alleviated. The cushioning portion may also be provided in a region extending from the forefoot region that overlaps the forefoot of the wearer of the shoe in the thickness direction of the sole to the midfoot region that overlaps the midfoot of the wearer of the shoe in the thickness direction of the sole.

[0088] In this embodiment, the impact on the forefoot and midfoot is reduced. In this case, it is preferable that the low elasticity region is formed in a position in the thickness direction of the sole that overlaps with the ball of the foot of the wearer of the shoe.

[0089] In this embodiment, the impact on the ball of the foot in particular is effectively alleviated. A shoe according to one aspect of the present disclosure includes the sole and an upper that is directly or indirectly connected to the sole and positioned above the sole.

[0090] In the shoe, the upper may have a midsole connected to the surface of the sole, and in this case, it is preferable that the support surface is bonded to the midsole, and the buffer part is not bonded to the midsole.

[0091] This prevents the adhesive from getting into spaces between adjacent columns, thereby preventing the buffering effect of the buffer section from being reduced.

[0092] It should be noted that the embodiments disclosed herein are illustrative in all respects and should not be considered limiting. The scope of the present invention is defined by the claims, not by the description of the above embodiments, and further includes all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0093] 1 shoe, 10 sole, 20 upper, 100 outer sole, 200 midsole, 201 top midsole, 202 bottom midsole, 203 shock absorbing portion, 210 buffer portion, 210a front end portion, 210b rear end portion, 210c inner edge portion, 210c1 front edge portion, 210c2 rear edge portion, 210d outer edge portion, 210H high elasticity region, 210L low elasticity region, 212 concave surface, 212a base surface, 212b inclined surface, 214 pillar-shaped body, 214a outer pillar-shaped body, 214b inner pillar-shaped body, 214c central pillar-shaped body, 214H pillar-shaped body, 214L pillar-shaped body, 215 lightening portion, 216L connecting portion, 220 support portion, 220a support surface, 222 Medial support, R1 forefoot region, R2 hindfoot region, R3 midfoot region.

Claims

1. A sole that constitutes a part of a shoe, A cushioning part that reduces the impact on the foot when landing, a support portion that has a higher elastic modulus than the buffer portion and supports the foot, the support portion has a support surface provided around the buffer portion, The buffer section is a concave surface located at a height recessed from the support surface; a plurality of pillars each having a shape extending from the concave surface to a position at the same height as the support surface; The buffer section is a highly elastic region adjacent the support surface; a low elasticity region adjacent to the high elasticity region and having a modulus of elasticity lower than that of the high elasticity region.

2. The sole according to claim 1 , wherein the pillars in the low elasticity region have a lightening portion.

3. The sole according to claim 2 , wherein the hollowed portion is formed by a through-hole that penetrates the columnar body in the thickness direction of the sole.

4. The sole according to claim 1 , wherein the low elasticity region is made of a material having a lower hardness than a material forming the high elasticity region.

5. The sole according to claim 1 , wherein the high elasticity region has a shape that surrounds the entire periphery of the low elasticity region.

6. The sole according to claim 1 , wherein the buffer portion is provided in a rear foot region that overlaps a rear foot portion of a wearer of the shoe in a thickness direction of the sole.

7. The sole according to claim 6 , wherein the low elasticity region is formed at a position in the thickness direction of the sole that overlaps with the heel bone of the wearer of the shoe.

8. 8. The sole according to claim 1, wherein the buffer portion is provided in a region extending from a forefoot region that overlaps with a forefoot of a wearer of the shoe in the thickness direction of the sole to a midfoot region that overlaps with a midfoot of the wearer of the shoe in the thickness direction of the sole.

9. The sole according to claim 8 , wherein the low-elasticity region is formed in a position in the thickness direction of the sole that overlaps with the ball of the foot of the wearer of the shoe.

10. A sole according to any one of claims 1 to 9; an upper connected directly or indirectly to the sole and positioned above the sole.

11. the upper has a midsole connected to a surface of the sole; the support surface is bonded to the insole; The shoe of claim 10 , wherein the dampener is not glued to the insole.

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