Process for manufacturing light-emitting diodes

Abstract

1. A process for fabricating a light emitting diode (100), comprising the steps of: - fabricating a first segment (106) made of an inorganic semiconductor doped with a first type of conductivity; - fabricating a first emitting segment (108) made of an inorganic semiconductor through a mask (110) on a first region of the first segment; - moving the mask; - fabricating a second emitting segment (116) made of an inorganic semiconductor on a second region of the first segment; - fabricating a segment (128) made of an inorganic semiconductor doped with a second type of conductivity on at least the first and second emitting segments, wherein the first and second emitting segments have different chemical compositions and their band gaps are narrower or equal to the band gap of the segment made of the doped inorganic semiconductor.

Description

[Technical Field]

[0001] This invention relates to the field of manufacturing light-emitting diodes or LEDs. In particular, this invention relates to the manufacturing of display devices having LEDs, and more specifically, to the manufacturing of microdisplay devices having LEDs. [Background technology]

[0002] A display device, particularly a microdisplay device used for, for example, a smartphone screen, comprises a set of pixels. When the display device corresponds to a color screen, each pixel may comprise at least three LEDs or microLEDs, each forming a subpixel, each locally emitting one of three or fewer primary colors, namely red, green, and blue. In this case, these are called RGB pixels.

[0003] Such display devices are generally fabricated by assembling various LEDs on a support for a large number of pixels. This assembly step is difficult to perform without defects. This is especially critical when fabricating small, high-resolution display devices. Just one of these defects can create a "dead" pixel that does not emit the desired color, which is unacceptable for a display device intended for sale.

[0004] LEDs used in the fabrication of display devices generally contain organic materials and are called OLEDs (Organic Light-Emitting Diodes). The emission of three colors—red, green, and blue—is achieved by fabricating OLEDs from different organic materials. For each color, a structure with a large surface area is manufactured, and then, before final assembly, each is cut into smaller elements corresponding to the LED. This solution is costly and has limited reliability.

[0005] Furthermore, the brightness of display devices, including OLEDs, is limited, which is problematic, especially for pixels with very small dimensions used in high-resolution display devices.

[0006] This brightness can be improved by fabricating LEDs from inorganic semiconductors. For example, semiconductor materials containing nitrides make it possible to manufacture highly efficient LEDs for emitting blue light, and lighter LEDs for emitting green light. In particular, it is possible to fabricate GaN / InGaN heterostructures that form quantum wells and adjust the amount of indium incorporated therein to change the wavelength of the LED's emission. However, with these nitride-containing semiconductor materials, it is not possible to obtain LEDs that emit red light as efficiently as those that emit blue and green light using this same technique. Therefore, it is necessary to use a different system of materials, namely phosphide (GaP / GaInP) materials, to form red subpixels. This technical complexity for fabricating LEDs, as well as the difficulty of assembling a large number of LEDs without defects, currently limits the performance and size of display devices that can be fabricated with this technique.

[0007] It is also known that monochromatic LEDs can be fabricated by embedding rare earth element ions in GaN or AlN nanowires. However, this solution still faces problems related to the assembly of the subpixels fabricated in this way and the defects that result from it.

[0008] The document by S. Ichikawa et al., "Eu-doped GaN and InGaN monolithically stacked full-color LEDs with a wide color gamut", Appl. Phys. Express 14 031008 in 2021, proposes the fabrication of LEDs in the form of monolithic vertical stacks with three stacked active layers each emitting one of the primary colors. One of these active layers contains europium atoms and is used to produce red light emission. The other two active layers comprise InGaN quantum wells, and their chemical compositions are adjusted to emit blue for one of these two layers and green for the other of these two layers. The solution proposed in this document solves the assembly problems disclosed above, but requires a plurality of technical steps capable of creating each electrical contact of the LED at various levels of the stack.

Prior Art Documents

Non-Patent Documents

[0009]

Non-Patent Document 1

[0012] This method proposes fabricating at least two LEDs, where a first emitter and a portion of a doped semiconductor positioned on either side of the first emitter form the first LED. The first LED is geometrically defined (in shape and dimensions) on a plane parallel to the main surface of the mask (the surface with the largest surface area, through which the first aperture passes) by an opening in the mask that defines and positions the first emitter.

[0013] Similarly, a portion of the doped semiconductor positioned on either side of the second emitter forms a second LED. This second LED is geometrically defined (in shape and dimensions) on a plane parallel to the main surface of the mask (the surface with the largest surface area, through which the second opening passes) by an opening in the mask that moves relative to the fabrication of the first emitter and defines and positions the second emitter.

[0014] This method therefore proposes a technical solution for fabrication without complex steps, such as covering a considerable surface area of ​​several LEDs, without assembling these LEDs or creating electrical contacts on them.

[0015] This method allows for the fabrication of various LEDs that emit at different wavelength ranges at the same level by integrating them horizontally, while avoiding the disadvantages of vertical integration and the associated technical complexities.

[0016] This method proposes the localized fabrication of LEDs capable of emitting light at different wavelengths in the visible range, depending on the chemical composition of the fabricated emission section. The LEDs are thus fabricated sequentially in situ within the same semiconductor stack, thus avoiding the need for later assembly of the LEDs.

[0017] Furthermore, this method does not use organic materials and potentially can achieve better brightness than that obtained with OLEDs.

[0018] Throughout this document, the term "LED" is used to refer to either an LED or a microLED, without distinguishing between their dimensions.

[0019] The band forbidden energies of the doped inorganic semiconductor portions may differ, in which case the band forbidden energy of one of the emission portions may be less than or equal to that of the portion of the doped inorganic material having the lowest band forbidden energy.

[0020] The differences in the chemical composition of the various emission units produced are due to the incorporation of ions of rare earth elements with different properties into the various emission units, and / or the presence of compounds containing atoms with different properties (e.g., AlGaN, InGaN, etc.), and / or the different ratios thereof (e.g., having X with a different value than Y, In X Ga (1-X) N and In Y Ga (1-Y) N) This can be obtained by manufacturing various discharge parts.

[0021] Each of the rare earth element ion incorporations that can be carried out in this method corresponds to the incorporation of at least one type of rare earth element ion. In other words, each incorporation can correspond to the incorporation of one or more different types of rare earth element ions, and optionally, atoms that do not correspond to rare earth element ions. For example, to optimize the chemical process of photoemission of rare earth element ions for a given color, it is possible to perform co-doping of different rare earth elements, optionally, with atoms that do not correspond to rare earth element ions, in the same emission unit. For example, for red emission, co-doping of europium and oxygen can be performed.

[0022] The incorporation of rare earth element ions in the sense of the present invention corresponds to the use of atomic streams containing rare earth elements in a frame, for example, by epitaxy of these emitters, such as an MBE type ("molecular beam epitaxy"), for fabricating the emitters.

[0023] Each of the light-emitting diodes produced may comprise a single emitter disposed between portions of doped inorganic semiconductor, or a stack of several emitters separated from each other by one or more barrier layers, the band-forbidden energy of which is greater than that of the emitter, and the stack is disposed between portions of doped inorganic semiconductor.

[0024] Furthermore, each step in fabricating the emission section to be implemented can form one or more emission sections, depending on the number of openings in the mask used.

[0025] The movement of the mask corresponds to the relative movement of the inorganic semiconductor portion doped according to a first type of conductivity on which the emission portion is fabricated. In other words, it is possible to move both the mask and / or the semiconductor portion.

[0026] A first rare earth element ion can be incorporated into the inorganic semiconductor of the first emission section, and / or a second rare earth element ion can be incorporated into the inorganic semiconductor of the second emission section.

[0027] According to certain exemplary embodiments, a first rare earth element ion can be incorporated into the inorganic semiconductor of the first emission section, and a second rare earth element ion having different properties from the first rare earth element ion can be incorporated into the inorganic semiconductor of the second emission section.

[0028] The method is as follows: After the fabrication of the second emission section, and before the fabrication of the inorganic semiconductor portion doped according to the second type of conductivity, - A step of moving the mask so that an opening is positioned facing at least one third region, separate from the first and second regions, of a portion of an inorganic semiconductor doped according to a first type of conductivity, and then - A step of fabricating at least one third emission part of an inorganic semiconductor on a portion of an inorganic semiconductor doped according to a first type of conductivity, through a mask, such that its chemical composition differs from that of the first and second emission parts and its forbidden band energy is less than or equal to that of the doped inorganic semiconductor portion. It can further include

[0029] According to certain exemplary embodiments, a third rare earth element ion having different properties from that of the first and second rare earth element ions can be incorporated into the third emission section, and / or the third emission section can contain a compound containing atoms of different properties, or in a ratio different from that of the compounds in the first and second emission sections.

[0030] Advantageously, the chemical compositions of the first, second, and third emitters can be selected such that each emits a wavelength corresponding to one of red, green, and blue light. In certain exemplary embodiments, the rare earth element ions incorporated into the first, second, and third emitters can be selected from europium (to enable red light emission), terbium and / or erbium (to enable green light emission), and thulium (to enable blue light emission). It is also possible to use praseodymium and / or holmium and / or cerium (to enable green light emission) ions.

[0031] The method is as follows: After the fabrication of the third emission section, and before the fabrication of the inorganic semiconductor portion doped according to the second type of conductivity, - The steps of moving the mask so that an opening is positioned facing at least one fourth region, separate from the first, second, and third regions, of the portion of the inorganic semiconductor doped according to a first type of conductivity, and then - A step of fabricating at least one fourth emission part of an inorganic semiconductor on a portion of an inorganic semiconductor doped according to a first type of conductivity, through a mask, wherein the chemical composition of the fourth emission part is similar to that of one of the first, second, and third emission parts. It can further include

[0032] According to certain exemplary embodiments, a fourth rare earth element ion having properties similar to those of a first, second, or third rare earth element ion can be incorporated into the fourth release section, and / or the fourth release section may contain a compound having atoms of similar properties, in a ratio similar to that of one of the compounds in the first, second, and third release sections.

[0033] In this case, the first, second, third, and fourth discharge sections can be advantageously manufactured so that they are arranged in a matrix.

[0034] The masks used for the fabrication of each part of the discharge section correspond to hard masks.

[0035] The steps for fabricating the doped inorganic semiconductor portion and emission portion may each include the implementation of epitaxy or deposition.

[0036] Advantageously, the doped inorganic semiconductor portion and emission portion may contain compounds containing nitrogen atoms and aluminum and / or gallium and / or indium atoms. Thus, III-N semiconductors fabricated in this manner can correspond to GaN, AlN, or InN and their ternary or quaternary alloys (AlGaN, InGaN, InAlN, AlGaInN). The use of such semiconductors containing nitrides is particularly advantageous because: - Due to the high gap value of the semiconductor, the efficiency of energy transfer to rare-earth element ions that can emit light is further increased. This is especially true for semiconductors containing nitrides of alloys including GaN, AlN, and AlGaN. - By incorporating Eu to create an emission unit capable of emitting red light, it is possible to manufacture other emission units that emit blue and green light using a group of nitride-containing semiconductors, particularly via InGaN.

[0037] In advantageous exemplary embodiments, the doped inorganic semiconductor portion and emission portion may include AlN.

[0038] Advantageously, the method may further include the step of fabricating at least one portion on a substrate called a base portion of the inorganic semiconductor doped according to a first type of conductivity, prior to the fabrication of a portion of the inorganic semiconductor doped according to a first type of conductivity, wherein the portion of the inorganic semiconductor doped according to a first type of conductivity is then fabricated on the base portion. Such a base portion makes it possible to initiate the growth of the first portion of the inorganic semiconductor doped according to a first type of conductivity on any type of substrate, in this case, for example, a semiconductor, amorphous, or metal.

[0039] Advantageously, the base portion contains or is composed of GaN.

[0040] The inorganic semiconductor portions and emission parts can be fabricated in the form of nanowires or planar layers. Fabricating the semiconductor portion in the form of nanowires is advantageous because it avoids the possibility of lateral diffusion of atomic species emitted during LED fabrication. Thus, it is possible to obtain overall separation of the various colors emitted by the various emission parts that are fabricated.

[0041] In this case, the method may further include a step of depositing an electrically insulating material between nanowires, which is performed after the fabrication of the inorganic semiconductor portion doped according to a second type of conductivity, when the inorganic semiconductor portion and emission portion are fabricated in the form of nanowires. This makes it possible to passivate the lateral sides of the nanowires in particular.

[0042] The first type of conductivity may correspond to the n type, and the second type of conductivity may correspond to the p type.

[0043] The method may be as follows: - A portion of an inorganic semiconductor doped according to the second type of conductivity is doped with magnesium and / or indium atoms, and / or - A portion of an inorganic semiconductor doped according to the first type of conductivity is doped with silicon and / or germanium atoms.

[0044] The electronic transitions involved in the photoemission of semiconductors incorporating rare earth element ions correspond to those occurring with deep electrons belonging to the electron layer 4f of the rare earth element ions. Screening of this layer by electrons from the outer layer makes the emission very stable and independent of the properties of the surrounding material, which may be crystalline or amorphous, semiconductor or insulator. When these rare earth element ions are introduced into a semiconductor, the electronic transitions occurring in electron layer 4f can be excited by the passage of electric current, and therefore, the return to the ground state can be accompanied by photoemission. On the one hand, the excitation and coupling effects, and on the other hand, the lifetime of the excited emission, are sensitive to the gap value of the semiconductor into which the rare earth element ions are incorporated. As the gap increases, the overall efficiency improves.

[0045] Advantageously, the method described herein allows the use of semiconductors with large gaps, such as AlN, by doping the p-doped semiconductor with magnesium and indium atoms, thereby making it possible to obtain a region of light emission with very good luminescence efficiency.

[0046] The presence of indium in an inorganic semiconductor doped according to a second type of conductivity allows for the incorporation of more magnesium doped atoms, since the resulting magnesium atomic concentration is proportional to the amount of indium present in the semiconductor, compared to the same semiconductor without indium. Therefore, the level of p-type doping that can be obtained in the second part of the semiconductor, for example, is greater in this case, allowing for greater current injection and a better distribution of current lines. For example, the presence of indium in AlN or AlGaN allows for an increase in the solubility of magnesium in these materials by a coefficient equal to approximately 10, thus improving the level of doping that can be obtained in this semiconductor.

[0047] When the semiconductor contains indium, the possibility of incorporating more magnesium atoms is not expected because these two types of atoms introduce compressive stress, especially when introduced separately into AlN. Thus, there is no deductive reason to preferentially introduce them simultaneously in terms of the accumulated elastic energy because the addition of indium does not contribute to the relaxation of the elastic stress brought about by the addition of magnesium.

[0048] The atomic concentration of magnesium in an inorganic semiconductor doped according to the second type of conductivity type is between 10 20 atoms / cm 3 and 10 21 atoms / cm 3 or 10 20 atoms / cm 3 or more, and / or the atomic concentration of silicon and / or germanium in an inorganic semiconductor doped according to the first type of conductivity type is between 10 19 atoms / cm 3 and 10 20 atoms / cm 3 Such a magnesium atomic concentration can be obtained, for example, when the ratio of the magnesium atomic concentration to the indium atomic concentration is between 1 and 20, or between 1 and 50, or even between 1 and 100, preferably about 10. This configuration enables, for example, a good level of p-type doping of the semiconductor by significantly reducing the effective ionization energy of magnesium at such levels of doping, and thus a good injection of current into the LED through electrical conduction of a second portion similar to or close to that of a metal electrode.

[0049] A method for fabricating a display device is also proposed, including the implementation of a method for fabricating a light-emitting diode as described above.

[0050] This method can be advantageously employed to fabricate display devices having RGB pixels, i.e., pixels comprising at least three subpixels, each emitting wavelengths corresponding to red, green, and blue. However, more generally, this method can be employed to fabricate display devices having pixels comprising at least two subpixels, each emitting different wavelengths that do not necessarily correspond to RGB pixels.

[0051] This method does not have the drawbacks of assembling several subpixels, each of which is manufactured separately to form a pixel on a display device.

[0052] This method can be used to fabricate display devices with a large surface area. By later assembling some of these devices, it is possible to increase the size of the final device by any large factor to reach that of a computer or television screen or wall display.

[0053] Throughout this document, the term “on” is used without distinguishing the spatial orientation of the element to which the term relates. For example, in the feature “on the surface of a part,” this surface of the part is not necessarily upward-facing, but can correspond to a surface oriented in any direction. Furthermore, the placement of a first element on a second element should be understood as either placing the first element directly on the second element without any intervening elements between the first and second elements, or placing the first element on the second element using one or more intervening elements positioned between the first and second elements.

[0054] This invention will be better understood by referring to the accompanying drawings while reading the description of the exemplary embodiments, which are given purely for informational purposes and not for limiting purposes. [Brief explanation of the drawing]

[0055] [Figure 1] This figure shows the steps taken in a method for manufacturing an object-oriented light-emitting diode according to the first embodiment of the present invention. [Figure 2] This figure shows the steps taken in a method for manufacturing an object-oriented light-emitting diode according to the first embodiment of the present invention. [Figure 3] This figure shows the steps taken in a method for manufacturing an object-oriented light-emitting diode according to the first embodiment of the present invention. [Figure 4] This figure shows the steps taken in a method for manufacturing an object-oriented light-emitting diode according to the first embodiment of the present invention. [Figure 5] This figure shows the steps taken in a method for manufacturing an object-oriented light-emitting diode according to the first embodiment of the present invention. [Figure 6] This figure shows the steps taken in a method for manufacturing an object-oriented light-emitting diode according to the first embodiment of the present invention. [Figure 7] This figure shows the steps taken in a method for manufacturing an object-oriented light-emitting diode according to the first embodiment of the present invention. [Figure 8] This figure shows a light-emitting diode obtained by carrying out a method for manufacturing a light-emitting diode for the object of the present invention, according to an alternative form of the first embodiment. [Figure 9] This figure shows a light-emitting diode obtained by carrying out a method for manufacturing a light-emitting diode for the object of the present invention, according to a second embodiment. [Figure 10] This figure shows a display device manufactured by carrying out a method that achieves the objectives of the present invention. [Modes for carrying out the invention]

[0056] Identical, similar, or equivalent parts of the various figures described below share the same reference number to facilitate transitions from one figure to another.

[0057] The various parts shown in the diagram are not necessarily shown to a uniform scale in order to make the diagram easier to read.

[0058] It should be understood that the various possibilities (alternative forms and embodiments) are not mutually exclusive and can be combined with each other.

[0059] A method for manufacturing an LED 100 according to the first embodiment is described below in relation to Figures 1 to 7.

[0060] In the exemplary embodiments described herein, the LED 100 is fabricated in the form of nanowires created by epitaxy on a substrate 102, which include, for example, a semiconductor such as silicon, sapphire, or another material.

[0061] Advantageously, the epitaxy steps performed here to form nanowires correspond to steps in plasma-assisted molecular beam epitaxy or PA-MBE. Alternatively, these steps can correspond to deposition steps such as, for example, metal-organic chemical vapor deposition or MOCVD, metal-organic vapor epitaxy or MOVPE, or pulsed laser deposition or PLD.

[0062] To form these nanowires, in the first step, a semiconductor doped according to a first type of conductivity, preferably GaN, is fabricated by growth during nanowire formation. The fabrication of these base portions 104 is optional. These base portions 104 make it possible to later grow other parts of the material for the LED 100.

[0063] In this exemplary embodiment, the first type of conductivity corresponds to type n.

[0064] An inorganic semiconductor 106 doped according to a first type of conductivity, here, a portion of n-doped AlN, is then fabricated by growth on portion 104 (see Figure 1). For example, n-doping can be obtained by introducing silicon and / or germanium atoms into the material of portion 106. The concentration of the dopant in the semiconductor of portion 106 is, for example, 10 17 atoms / cm 3 from 10 20 atoms / cm 3 , to have an advantage, 10 19 atoms / cm 3 from 10 20 atoms / cm 3 The dimensions of each portion 106 parallel to the direction of nanowire growth (the dimensions parallel to axis Z in Figures 1 to 7) are, for example, equal to 500 nm, and more generally, between 100 nm and 1000 nm.

[0065] The first emitters 108 of an inorganic semiconductor, in this case AlN, are then fabricated by growing them through a mask 110 having an opening 112 positioned facing a first region 114 of portion 106 (see Figure 2). These first emitters 108 are intended to be portions of a first LED that produce light emission in a first range of wavelengths. For this purpose, during the growth of the first emitters 108, ions of a first rare earth element are incorporated into the semiconductor of the first emitters 108. For example, when the first emitters 108 are intended to emit red light, the incorporated ions of the first rare earth element may correspond to europium ions.

[0066] After the first discharge section 108 is fabricated, the mask 110 is moved so that the opening 112 of section 106 is positioned facing a second region 122, which is separate from the first region 114.

[0067] Next, a second emission section 116 of an inorganic semiconductor, in this case AlN, is fabricated by growing it through the mask 110 facing the opening 112 (see Figure 3). These second emission sections 116 are intended to be the portion of a second LED that produces light emission in a second range of wavelengths. For this reason, the second emission sections 116 are fabricated so that their chemical composition differs from that of the first emission section 108. In the first embodiment, to obtain this difference in chemical composition between the first emission section 108 and the second emission section 116, during the growth of the second emission section 116, ions of a second rare earth element, which have different properties from the ions of the first rare earth element, are incorporated into the semiconductor of the second emission section 116. For example, when the second emission section 116 is intended to emit green light, the incorporated second rare earth element ions could correspond to terbium and / or erbium ions.

[0068] In the exemplary embodiment described herein, the mask 110 is moved again so that the opening 112 is positioned facing a third region of portion 106, separate from the first region 114 and the second region 122.

[0069] Next, a third emitter 124 made of an inorganic semiconductor, in this case AlN, is fabricated by growing it through a mask 110 facing the opening 112. These third emitters 124 are intended to be the third LED portion that produces light emission in a third range of wavelengths. For this reason, the third emitters 124 are fabricated so that their chemical composition differs from that of the first emitters 108 and the second emitters 116. In the first embodiment, in order to obtain this difference in chemical composition between one third emitter 124 and the other first emitter 108 and the second emitters 116, a third rare earth element ion, which has different properties from the first and second rare earth element ions, is incorporated into the semiconductor of the third emitter 124 during its growth. For example, when the third emitter 124 is intended to emit blue light, the incorporated third rare earth element ion may correspond to a thulium ion.

[0070] In the exemplary embodiments described herein, the mask 110 is moved again so that the opening 112 is positioned facing a fourth region of portion 106, distinct from the first, second, and third regions.

[0071] Next, a fourth emitter 126 of an inorganic semiconductor, in this case AlN, is fabricated by growing it through the mask 110, facing the opening 112. These fourth emitters 126 are intended to be a fourth LED portion that produces light emission at wavelengths similar to one of the first, second, or third range wavelengths. For this reason, the fourth emitters 126 are fabricated so that their chemical composition is similar to that of the first emitter 108, or the second emitter 116, or the third emitter 124. In the first embodiment, in order to obtain this chemical composition similarity between the fourth emitter 126 and the first emitter 108, or the second emitter 116, or the third emitter 124, ions of the fourth rare earth element, which have similar properties to those of the first, second, or third rare earth element ions, are incorporated into the semiconductor of the fourth emitter 126 during its growth. For example, it is advantageous that the fourth emitter 126 is intended to emit red light, like the first emitter 108. This is because this color corresponds to the least efficient light emission, and the fourth rare earth element ion incorporated may, in this case, correspond to a europium ion.

[0072] Figure 4 schematically shows an example of the distribution of the manufactured discharge sections 108, 116, 124, and 126 as viewed from above. In this example, these discharge sections 108, 116, 124, and 126 are arranged by forming a matrix, i.e., rows and columns.

[0073] The dimensions of the respective emission sections 108, 116, 124, and 126, which are parallel to the direction of nanowire growth (parallel to axis Z in Figures 1 to 7), are, for example, between 5 nm and 50 nm.

[0074] In a single molecular beam epitaxy apparatus, the atomic flow generated by the cell used makes an angle α with respect to the perpendicular to the surface on which the epitaxy is performed. The value of this angle α depends particularly on the apparatus and the cell used, and is, for example, between 25° and 30°. Assuming that the substrate 102 rotates during growth, the diameter d of the surface region on which the epitaxy is performed and on which the surface density of the epitaxial material is highest is... eff The value of depends on the thickness e of the mask used, the dimensions d of the opening through which epitaxy is performed (for example, the diameter for an opening with a circular cross-section, or the dimension of one of the sides for an opening with a square or rectangular cross-section), and the angle α according to the following formula: d eff = d-2·e·tan(α)

[0075] This configuration is schematically shown in Figure 5. In this figure, the atomic flow generated during epitaxy is responsible for reference number 127.

[0076] For example, if α=25°, d=5μm, and e=1μm, d eff The value is approximately equal to 4 μm.

[0077] diameter d eff Around this region having , another region in the shape of a ring with a width equal to e·tan(α) is also formed by epitaxy. The surface density of rare earth element ions obtained in this other region is given by a diameter d eff It is equal to half of what is deposited in the region having d. The growth rate in the other region is also equal to the diameter d eff It is reduced by half compared to the central region containing it. Therefore, the density of rare earth element ions is constant across the entire zone of diameter d.

[0078] Therefore, the optimization of the size and shape of the fabricated LEDs depends, in particular, on the appropriate selection of parameters e and d of the mask used.

[0079] Furthermore, for example, each opening is positioned on a plane parallel to the surface on which epitaxy is performed, for example, 2 × 2 μm. 2 and 5 × 5 μm 2 It may have a rectangular or square cross-section with dimensions between the two. One of the openings has dimensions of 2 × 2 μm. 2 When equal to , the number of nanowire portions positioned facing such an opening is, for example, equal to 400.

[0080] Figure 6 illustrates an example of an operating mode for fabricating the emitters 108, 116, 124, and 126 through a mask 110 used for fabricating these emitters. In this figure, the atomic stream 127 is delivered through the mask 110, which is rigidly connected to a device that allows the mask 110 to be moved along axis Z (to move the mask 110 closer to a desired distance from the deposition surface) and along axes X and Y (to change the position of the zone exposed to the atomic beam on which growth is performed).

[0081] The mask can be fabricated outside of the growing process, i.e., outside the frame where the growth is performed. This mask can be fabricated, for example, from a silicon wafer on which SiN is deposited to limit wafer contamination via low-percentage bonding of atomic flow on the SiN, through which openings are fabricated, for example, by lithography. This lithography can also form ribs, which provide good mechanical rigidity to the mask.

[0082] In a second type of conductive inorganic semiconductor, portion 128 of p-doped AlN is fabricated by growth on portions 108, 116, 124, and 126. No mask is used for the growth of these portions 128, as is the case with the fabrication of portion 106.

[0083] Here, p-type doping is advantageously obtained by incorporating magnesium and indium atoms into portion 128. Advantageously, the atomic concentration of magnesium in the semiconductor of these portions 128 is 10 17 atoms / cm3 from 10 21 atoms / cm 3 During this period, to have an advantage, 10 20 atoms / cm 3 from 10 21 atoms / cm 3 It is between these two points.

[0084] In the growth of the semiconductor portion 128 by MBE, fluxes of aluminum, activated nitrogen, indium, and optionally gallium are delivered onto the growth surface corresponding to the upper surfaces of emission portions 108, 116, 124, and 126. A magnesium flux is also delivered for the semiconductor to be p-doped with magnesium atoms. The values ​​of these fluxes, i.e., the amount of each of these chemical elements delivered, are selected according to the desired composition of the semiconductor portion 128, in particular, such that the atomic concentration of indium is between 0 and 1%, preferably 0.1%. With the presence of this indium flux, the atomic concentration of magnesium in the semiconductor portion 128 is proportional to the amount of indium incorporated into this semiconductor, for example, 10 17 atoms / cm 3 from 10 21 atoms / cm 3 During this period, to have an advantage, 10 20 atoms / cm 3 from 10 21 atoms / cm 3 This refers to an atomic concentration of magnesium between 0.1% and 1%.

[0085] During the fabrication of part 128 by MOCVD growth, the elements used for semiconductor growth are organometallic precursors, such as trimethylaluminum or triethylaluminum used as an aluminum source, ammonia used as a nitrogen source, trimethylindium or triethylindium used as an indium source, and optionally trimethylgallium or triethylgallium used as a gallium source. Magnesium atoms can be obtained by suitable precursors, such as a solution of magnesiumene or Mg(Cp)2. The concentrations of indium and magnesium that can be obtained by MOCVD can be similar to those obtained by MBE.

[0086] The dimensions of each section 128 along axis Z are, advantageously, very short, between 50 nm and 300 nm, and preferably between 50 nm and 100 nm, so as to optimize the injection of current into the resulting pixels 101.

[0087] Advantageously, the structure of the fabricated nanowire is completed by growing short portions 130 of strongly p-doped GaN, which facilitates the creation of electrical contacts with the fabricated LED. The thickness (dimension along axis Z) of portion 130 is, for example, between 20 nm and 30 nm.

[0088] The diameter of each nanowire formed by portions 104, 106, 108 (or one of portions 116, 124, 126) and 128 is, for example, between 100 nm and 150 nm. The period or repetition rate at which the nanowires are fabricated corresponds to the distance between the centers of two adjacent nanowires, but is, for example, between 150 nm and 300 nm. According to certain exemplary embodiments, the value of the period may be equal to twice the value of the diameter of one of the nanowires.

[0089] According to a particular exemplary embodiment, the fabricated parts 128 and 130 have a diameter d effBy positioning it on the center of the discharge sections 108, 116, 124, and 126, it is possible to avoid differences in discharge intensity that may arise due to differences in characteristics between these centers and the rest of the discharge sections 108, 116, 124, and 126.

[0090] Next, electrical contacts 131 can be deposited onto the fabricated structure. These electrical contacts 131 include a conductive and transparent material, such as indium tin oxide (ITO).

[0091] This step of fabricating the electrical contacts 131 may be preceded by passivation and planarization steps, which correspond to, for example, the deposition of an electrical insulating material between nanowires. This deposition is, for example, of the ALD type (atomic layer deposition). The material to be deposited is, for example, aluminum oxide or SiO2 or any other electrical insulating material suitable for such deposition. The deposition of this insulating material allows for the passivation of the lateral surfaces of the nanowires and limits the non-radiative recombination of carriers on surface defects that are detrimental to the efficiency of the LED 100. The deposition of this insulating material also allows for imparting a certain degree of mechanical resistance to the entire nanowire. A polishing step can then be performed to form a flat surface that facilitates the deposition of the electrical contacts 131.

[0092] Figure 7 schematically shows one of the LEDs 100 obtained after performing the steps described above.

[0093] In the exemplary embodiments described above, the material produced by growth corresponds to AlN or GaN. More generally, each of the various parts, 104, 106, 108, 116, 124, 126, 128, and 130, can contain compounds containing nitrogen atoms as well as aluminum and / or gallium and / or indium atoms. For example, according to one alternative embodiment, each nanowire part 104 and 106 can correspond to a single part of a material such as n-doped GaN or n-doped AlGaN.

[0094] Instead of the first embodiment described above, it is possible to manufacture part 106 directly on the substrate 102 without manufacturing part 104.

[0095] Instead of the first embodiment described in which the materials for the various parts are fabricated in the form of nanowires, these various parts can be fabricated in the form of layers of material deposited continuously on the substrate 102. Unlike nanowires, which form separate vertical structures adjacent to each other on the substrate 102, the layers deposited on the substrate 102 are continuous between two adjacent LEDs 100. Figure 8 schematically shows a cross-sectional view of the structure obtained according to this alternative embodiment. The techniques employed to form such layers are advantageously MOCVD or PLD type deposition.

[0096] In the first embodiment described above, the light-emitting region of the LED 100 is obtained through the incorporation of rare earth element ions in the emission section, leading to the acquisition of emission sections with different chemical compositions.

[0097] In the second embodiment, the light-emitting region of the LED 100 can be obtained by fabricating a structure having one or more quantum wells or MQWs (multiple quantum wells) between portions 106 and 128.

[0098] Figure 9 schematically shows an exemplary embodiment of the LED 100 according to this second embodiment. In this exemplary embodiment, emission zones are formed in each nanowire by quantum wells of InGaN disposed between two GaN barrier layers 134. As in the first embodiment, the quantum wells forming the emission zones are fabricated through a mask 110 to fabricate a series of emission zones on various regions of portion 106 that are capable of emitting different wavelengths. In contrast to the first embodiment, in which the wavelengths emitted by the active region depend on the type of rare earth element ion into which they are incorporated, in this second embodiment, the wavelengths emitted by the various portions depend on the properties and / or atomic ratios of the compounds in the emission zones, such as the concentration of indium in the quantum well containing InGaN (which may be between 1% and 10%, preferably between 1% and 5%). As in the first embodiment, the chemical composition of the wells can be selected to form emission zones capable of emitting wavelengths corresponding to red, other portions capable of emitting wavelengths corresponding to green, and other portions capable of emitting wavelengths corresponding to blue.

[0099] In the example shown in Figure 9, each fabricated nanowire comprises a single emission portion positioned between two barrier layers 134. Alternatively, the barrier layers between which the emission portion is positioned can be formed from doped inorganic semiconductor portions 106 and 128.

[0100] Furthermore, each nanowire may comprise a stack of several emitters separated from each other by one or more barrier layers, such as barrier layer 134, the band-forbidden energy of which is greater than that of the emitters, and this stack may also be arranged between portions of a doped inorganic semiconductor.

[0101] Various alternative forms described above for the first embodiment can be applied to the second embodiment.

[0102] Furthermore, according to an alternative embodiment of the second embodiment, one or more emission units 108, 116, 124, 126 can be formed by quantum wells or stacks of several stacked quantum wells, in which rare earth element ions are incorporated. Such an alternative embodiment is advantageous in that the emission units (made of, for example, InGaN) positioned between barrier layers determine the carrier confinement zone, maximizing their presence near the rare earth element ions and thus maximizing the efficiency of the excitation of the rare earth element ions.

[0103] According to other alternative configurations, it is possible to have several release sections that incorporate rare earth element ions and / or one or more other release sections that do not incorporate rare earth element ions.

[0104] In all embodiments and alternative forms described above, for example, a display device 1000 corresponding to a screen can be obtained by creating pixels of this device 1000 with the LEDs 100 described above. For example, each pixel of such a device 1000 can be formed by four LEDs 100 arranged to form a 2x2 matrix. Such a device 1000 is schematically shown in Figure 10. [Explanation of Symbols]

[0105] 100 Light-emitting diodes, LEDs 101 pixels 102 circuit boards 104 section, base part 106 parts, first segment 108 First discharge section, discharge section, part, first discharge segment 110 masks 112 Aperture 114 The first area 116 Second discharge section, discharge section, part, second discharge segment 122 Second Domain 124 Third discharge section, discharge section, part 126 Fourth discharge section, discharge section, part 127 Atomic current 128 parts, segments 130 portions 131 Electrical contacts 134 Barrier layer 1000 display devices, devices

Claims

1. at least, The steps include: fabricating at least one portion (106) of an inorganic semiconductor doped according to a first type of conductivity; The steps include: fabricating at least one first emission portion (108) of an inorganic semiconductor by passing it through at least one mask (110) having at least one opening (112) disposed on the portion (106) of the inorganic semiconductor doped according to the first type of conductivity type, the portion (106) of the inorganic semiconductor doped according to the first type of conductivity type, Steps include moving the mask (110) such that the opening (112) is positioned facing at least one second region (122) of the portion (106) of the inorganic semiconductor doped according to the first type of conductivity, which is separate from the first region (114); The steps include: fabricating at least one second emission portion (116) of the inorganic semiconductor on the portion (106) of the inorganic semiconductor doped according to the first type of conductivity, through the mask (110); The steps include: fabricating at least one portion (128) of an inorganic semiconductor doped according to a second type of conductivity opposite to the first type of conductivity, on at least the first and second emission portions (108, 116); Includes, A method for manufacturing a light-emitting diode (100) such that the chemical compositions of the first and second emission portions (108, 116) are different from each other, and their band-forbidden energies are less than or equal to those of the portions (106, 128) of the doped inorganic semiconductor.

2. The method according to claim 1, wherein a first rare earth element ion is incorporated into the inorganic semiconductor of the first emission unit (108), and / or a second rare earth element ion is incorporated into the inorganic semiconductor of the second emission unit (116).

3. The method according to claim 2, wherein the first rare earth element ion is incorporated into the inorganic semiconductor of the first emission unit (108), and the second rare earth element ion having different properties from the first rare earth element ion is incorporated into the inorganic semiconductor of the second emission unit (116).

4. After the fabrication of the second discharge portion (116), and before the fabrication of the portion (128) of the inorganic semiconductor doped according to the second type of conductivity, The steps of moving the mask (110) such that the opening (112) is positioned facing at least one third region of the portion (106) of the inorganic semiconductor doped according to the first type of conductivity, separate from the first and second regions (114, 122), and then The steps include: fabricating at least one third emission portion (124) of an inorganic semiconductor on the portion (106) of the inorganic semiconductor doped according to the first type of conductivity, through the mask (110), such that its chemical composition differs from that of the first and second emission portions (108, 116) and its band-forbidden energy is less than or equal to that of the portion (106, 128) of the doped inorganic semiconductor; The method according to any one of claims 1 to 3, further comprising:

5. The method according to claim 4, wherein the chemical composition of the first, second, and third emission units (108, 116, 124) is selected such that each of the first, second, and third emission units emits a wavelength corresponding to one of red, green, and blue.

6. After the third discharge portion (124) has been fabricated, and before the portion (128) of the inorganic semiconductor doped according to the second type of conductivity, Steps include moving the mask (110) so that the opening (112) is positioned facing at least one fourth region of the portion (106) of the inorganic semiconductor doped according to the first type of conductivity, separate from the first, second, and third regions (114, 122), and then The steps include: fabricating at least one fourth emission portion (126) of an inorganic semiconductor on the portion (106) of the inorganic semiconductor doped according to the first type of conductivity, through the mask (110), wherein the chemical composition is similar to that of one of the first, second, and third emission portions (108, 116, 124); The method according to claim 4 or 5, further comprising:

7. The method according to any one of claims 1 to 6, wherein the portions (106, 128) and emission portions (108, 116, 124, 126) of the doped inorganic semiconductor contain a compound comprising an atom of nitrogen and an atom of aluminum and / or gallium and / or indium.

8. The method according to any one of claims 1 to 7, further comprising the step of fabricating at least one portion (104) on a substrate, preferably a semiconductor base portion, which is doped according to the first type of conductivity, the portion (106) of the inorganic semiconductor doped according to the first type of conductivity, the portion (106) of the inorganic semiconductor doped according to the first type of conductivity, the portion (104 method according to any one of claims 1 to 7.

9. The method according to claim 8, wherein the base portion (104) contains GaN.

10. The method according to any one of claims 1 to 9, wherein the portions (106, 128) and emission portions (108, 116, 124, 126) of the inorganic semiconductor are fabricated in the form of nanowires or planar layers.

11. The method according to claim 10, further comprising the step of depositing an electrically insulating material between the nanowires, performed after the fabrication of the portion (128) of the inorganic semiconductor doped according to the second type of conductivity, when the portions (106, 128) and the emission portions (108, 116, 124, 126) of the inorganic semiconductor are fabricated in the form of nanowires.

12. The method according to any one of claims 1 to 11, wherein the first type of conductivity corresponds to type n, and the second type of conductivity corresponds to type p.

13. The portion (128) of the inorganic semiconductor doped according to the second type of conductivity is doped with magnesium and / or indium atoms, and / or The method according to any one of claims 1 to 12, wherein the portion (106) of the inorganic semiconductor doped according to the first type of conductivity is doped with atoms of silicon and / or germanium.

14. A method for manufacturing a display device (1000), comprising carrying out a method for manufacturing a light-emitting diode (100) according to any one of claims 1 to 13.

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