Molding method and molding apparatus

Abstract

The present invention provides a shaping method and a shaping device by which a locally thickened region formed on a semi-cured layer can be further flattened.　This shaping method includes: a first discharge step of discharging a first curable viscous fluid from above a stage; a first flattening step in which the first curable viscous fluid discharged in the first discharge step is flattened by means of a roller by moving the stage in the opposite direction to a rotating direction of the roller; a first curing step in which the first curable viscous fluid flattened in the first flattening step is cured; a flattened layer formation step in which a flattened layer is formed on the stage by repeating the above three steps; a second discharge step in which a second curable viscous fluid is discharged onto the flattened layer; a semi-curing step in which the second curable viscous fluid discharged in the second discharge step is semi-cured; a semi-cured layer formation step in which a semi-cured layer is formed on the flattened layer by repeating the above two steps; and a second flattening step in which the semi-cured layer is flattened by the roller by moving the stage in the same direction as the rotating direction of the roller.

Description

Technical Field

[0001] The present disclosure relates to a shaping method and a shaping apparatus for performing shaping using a curable viscous fluid.

Background Art

[0002] Conventionally, technologies related to a shaping method for shaping an object using a curable viscous fluid such as an ultraviolet curable resin have been developed. Specifically, in this shaping method, for example, a curable viscous fluid is discharged by a discharging device, and the discharged curable viscous fluid is cured by irradiating it with ultraviolet rays, and a desired object is shaped with the cured cured layer. In Patent Document 1 below, the first unit layer in which the ultraviolet curable resin is discharged is irradiated with ultraviolet rays to be semi-cured, and the first unit layer is flattened by a flattening roller unit.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the above-described semi-curing step of the ultraviolet curable resin, local enlarged portions may be formed due to the surface tension of the ultraviolet curable resin. For example, the end portion of the shaped object or the central portion of a small shaped object having a width of several millimeters or less may become higher than the target height on the design data due to the surface tension. As a result, there is a risk that the shape of the upper layer and the shape of the completed shaped object are affected by the local enlarged portions.

[0005] In view of such circumstances, the present disclosure has been made, and an object thereof is to provide a shaping method and a shaping apparatus that can flatten local enlarged portions formed in a semi-cured layer more effectively.

Means for Solving the Problems

[0006] To solve the above problems, the molding method of the present disclosure includes: a first discharge step of dischargeing a first curable viscous fluid from above a stage; a first flattening step of moving the stage in the opposite direction to the rotation direction of the roller to flatten the first curable viscous fluid discharged in the first discharge step with the roller; a first curing step of curing the first curable viscous fluid flattened in the first flattening step; a flattening layer forming step of repeatedly performing the first discharge step, the first flattening step, and the first curing step to form a flattened layer on the stage; a second discharge step of dischargeing a second curable viscous fluid onto the flattened layer; a semi-curing step of semi-curing the second curable viscous fluid discharged in the second discharge step; a semi-cured layer forming step of repeatedly performing the second discharge step and the semi-curing step to form a semi-cured layer on the flattened layer; and a second flattening step of moving the stage in the same direction as the rotation direction of the roller to flatten the semi-cured layer with the roller.

[0007] Furthermore, the contents of this disclosure are not limited to implementation as a molding method, but are also extremely effective when implemented as a molding apparatus comprising an extrusion device, a roller, a curing device, and a control device. [Effects of the Invention]

[0008] In the manufacturing method and apparatus of this disclosure, in the first planarization step, the droplets of the first curable viscous fluid to be planarized are smaller compared to the second planarization step, and the intermolecular forces between the fluid itself and other components are weaker. Therefore, by moving the stage in the opposite direction to the rotation direction of the roller and performing planarization, the first curable viscous fluid can be transferred to the roller while performing rapid planarization, thereby shortening the molding time. On the other hand, in the semi-cured layer formation step, by repeatedly performing the second extrusion step and the semi-curing step, the fluid film of the second curable viscous fluid in the semi-cured layer becomes larger, and the intermolecular forces between the fluid itself and other components become stronger. Therefore, in the second planarization step, the stage is moved in the same direction as the rotation direction of the roller and planarization is performed. This allows the time for the second curable viscous fluid to move to the surface of the roller to be relatively long, thereby allowing the second curable viscous fluid to be appropriately transferred to the roller. As a result, compared to the case where the second curable viscous fluid is planarized by moving the stage in the opposite direction to the rotation direction of the roller, the locally increased portions of the semi-cured layer can be planarized more effectively. [Brief explanation of the drawing]

[0009] [Figure 1] A diagram showing the molding apparatus in this embodiment. [Figure 2] A block diagram showing the control unit. [Figure 3] A flowchart illustrating the details of the molding process. [Figure 4] A schematic diagram showing the process of ejecting UV-curing resin from an inkjet head. [Figure 5] A schematic diagram showing the process of flattening UV-curing resin using a planarization device. [Figure 6] A schematic diagram showing the state in which a flattened UV-curable resin is cured by the curing section to form the first flattened layer. [Figure 7] A schematic diagram showing the first flattened layer with a planarized surface. [Figure 8] A schematic diagram showing a semi-hardened layer with a smoothed surface. [Figure 9] A schematic diagram illustrating the enlarged portion. [Figure 10] Schematic diagram of the first leveling process. [Figure 11] Schematic diagram of the second leveling process. [Figure 12] A schematic diagram showing the process of ejecting metallic ink. [Figure 13] A schematic diagram showing the formation of metal wiring. [Modes for carrying out the invention]

[0010] (1. Configuration of the molding device 10) The following describes an embodiment of the molding method and molding apparatus of this disclosure. Figure 1 shows the molding apparatus 10 of this embodiment. As shown in Figure 1, the molding apparatus 10 comprises a transport device 20, a molding unit 22, a mounting unit 23, an inspection unit 24, and a control device 26 (see Figure 2). The transport device 20, the molding unit 22, the mounting unit 23, and the inspection unit 24 are arranged on a base 28 of the molding apparatus 10. The base 28 is generally rectangular in shape. In the following description, the longitudinal direction of the base 28 will be referred to as the X-axis direction, the short direction of the base 28 as the Y-axis direction, and the direction perpendicular to both the X-axis direction and the Y-axis direction will be referred to as the Z-axis direction.

[0011] The transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32. The X-axis slide mechanism 30 includes an X-axis slide rail 34 and an X-axis slider 36. The X-axis slide rail 34 is mounted on a base 28 so as to extend in the X-axis direction. The X-axis slider 36 is held by the X-axis slide rail 34 so as to be slidable in the X-axis direction. Furthermore, the X-axis slide mechanism 30 has an electromagnetic motor 38 (see Figure 2), which drives the X-axis slider 36 to any position in the X-axis direction.

[0012] Further, the Y-axis slide mechanism 32 has a Y-axis slide rail 50 and a stage 52. The Y-axis slide rail 50 is disposed on the base 28 so as to extend in the Y-axis direction. One end of the Y-axis slide rail 50 in the Y-axis direction is connected to the X-axis slider 36. Thereby, the Y-axis slide rail 50 is movable in the X-axis direction as the X-axis slider 36 slides. The stage 52 is held slidably in the Y-axis direction by the Y-axis slide rail 50. Further, the Y-axis slide mechanism 32 has an electromagnetic motor 56 (see FIG. 2), and the stage 52 is moved to an arbitrary position in the Y-axis direction by driving the electromagnetic motor 56. Thereby, the stage 52 can be moved to an arbitrary position in the X-axis direction and the Y-axis direction on the base 28 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.

[0013] The stage 52 has a base 60, a holding device 62, and a lifting device 64. The base 60 is formed in a flat plate shape, and a base member 70 (see FIG. 4) is placed on the upper surface. The base member 70 is, for example, a metal plate such as iron or stainless steel. The holding device 62 is provided on both sides of the base 60 in the X-axis direction. The base member 70 is placed on the base 60 and is fixedly held with respect to the base 60 by sandwiching both edge portions in the X-axis direction by the holding device 62. Further, the lifting device 64 is disposed below the base 60 and raises and lowers the base 60 in the Z-axis direction.

[0014] The shaping unit 22 is a unit that shapes a structure on the base member 70 placed on the base 60 of the stage 52, and has a printing unit 72 and a curing unit 74. As shown in FIG. 4, the printing unit 72 has an inkjet head 75 and discharges a fluid in a thin film shape on the base member 70 placed on the base 60. As the fluid discharged by the inkjet head 75, an ultraviolet curable resin 76 (see FIG. 4) that is cured by ultraviolet rays can be adopted. The ultraviolet curable resin 76 is an example of the first and second curable viscous fluids of the present disclosure. In addition to the ultraviolet curable resin, other viscous fluids such as thermosetting resins can be adopted as the curable viscous fluid.

[0015] Further, in addition to the ultraviolet curable resin 76, the inkjet head 75 can eject, for example, a metal ink 77 (see FIG. 12). The metal ink 77 is an example of a fluid containing the metal particles of the present disclosure. The metal ink 77 is, for example, a dispersion of fine particles of a metal (such as silver) of nanometer size in a solvent, and is cured by firing with heat. The surface of the metal fine particles is coated with, for example, a dispersant, and aggregation in the solvent is suppressed.

[0016] When the inkjet head 75 ejects the ultraviolet curable resin 76, for example, the ultraviolet curable resin 76 is ejected from a plurality of nozzles by a piezo method using a piezoelectric element. Incidentally, the inkjet head 75 may eject the ultraviolet curable resin 76 from a plurality of nozzles by a thermal method in which the ultraviolet curable resin 76 is heated to generate bubbles and ejected from the nozzles. Further, when the inkjet head 75 ejects the metal ink 77, for example, the metal ink 77 is ejected from a plurality of nozzles by a piezo method using a piezoelectric element. Incidentally, the ejection device is not limited to the inkjet head 75 having a plurality of nozzles, and may be, for example, a dispenser having one nozzle. Further, the inkjet head 75 may separately include a nozzle for ejecting the metal ink 77 and a nozzle for ejecting the ultraviolet curable resin 76, or may share a nozzle for ejecting two viscous fluids. In the following description, when the ultraviolet curable resin 76 and the metal ink 77 are collectively referred to, they may be described as viscous fluids.

[0017] As shown in Figure 2, the curing unit 74 includes a planarizing device 78, an irradiation device 81, and a heater 82. The planarizing device 78 is a device that flattens the upper surface of the ultraviolet curing resin 76 or metal ink 77 ejected onto the base member 70 by the inkjet head 75. The planarizing device 78 includes a roller 79 and a recovery unit 80 (see Figure 5). The roller 79 is, for example, cylindrical in shape and rotates in contact with the flowable viscous fluid (ultraviolet curing resin 76 or metal ink 77) based on the control of the planarizing device 78, flattening the surface while transferring excess viscous fluid. The recovery unit 80 has, for example, a blade that protrudes toward the surface of the roller 79, scrapes off the viscous fluid transferred to the roller 79 with the blade, stores the scraped-off viscous fluid, and discharges it. The recovery unit 80 discharges the recovered viscous fluid into a waste liquid tank. The flattening device 78 flattens the surface of the viscous fluid by leveling the surface of the viscous fluid and scraping off any excess viscous fluid. The recovery unit 80 may return the recovered viscous fluid to the supply tank. Furthermore, the flattening by the flattening device 78 does not need to be performed every time the viscous fluid is discharged. For example, flattening may be performed only when a specific layer is formed.

[0018] Furthermore, the irradiation device 81 irradiates ultraviolet light onto the ultraviolet-curable resin 76 extruded onto the base member 70, for example. The ultraviolet-curable resin 76 hardens upon irradiation with ultraviolet light, forming a thin insulating layer (such as the first planarization layer 86 in Figure 6). The heater 82 is a device that heats the extruded metal ink 77. The metal ink 77 is fired by the heat applied from the heater 82, forming metal wiring. The firing of the metal ink 77 is a phenomenon in which, for example, by applying energy, the solvent vaporizes, a protective film of the metal nanoparticles is formed, i.e., the dispersant is decomposed, and the metal nanoparticles come into contact or fuse together, increasing the conductivity. By firing the metal ink, metal wiring can be formed. Details of the molding method will be described later. Note that the device for heating the metal ink 77 is not limited to the heater 82. For example, the molding apparatus 10 may include a laser irradiation device that irradiates the metal ink 77 with laser light as a device for heating the metal ink 77, or an atmosphere furnace that heats the first planarization layer 86 into which the metal ink 77 has been ejected.

[0019] Furthermore, the mounting unit 23 shown in Figure 1 is a unit for mounting various electronic components that are connected to metal wiring fabricated by the molding unit 22, and comprises a mounting section 83 and a supply section 84. The mounting section 83 has, for example, a suction nozzle (not shown) for picking up electronic components, and mounts the electronic components held by the suction nozzle onto the metal wiring. The supply section 84 has, for example, multiple tape feeders that feed out taped electronic components one by one, and supplies electronic components to the mounting section 83. Note that the supply section 84 is not limited to a configuration with tape feeders, but may also be a tray-type supply device that picks up and supplies electronic components from a tray.

[0020] For example, when the base member 70 moves to a position below the mounting unit 83 as the stage 52 moves, the mounting unit 23 moves the mounting unit 83 to the component supply position of the supply unit 84 and drives the supply unit 84 to supply the necessary components. The mounting unit 83 then uses a suction nozzle to attract and hold the electronic components from the component supply position of the supply unit 84 and mounts them onto the metal wiring etc. formed on the base member 70.

[0021] The inspection unit 24 is a unit that inspects the structure manufactured by the molding unit 22 and the mounting unit 23. The inspection unit 24 is equipped with an imaging device such as a camera. The control device 26 can determine whether or not the electronic components are properly mounted based on the image data captured by the inspection unit 24. The molding apparatus 10 may also be equipped with a laser microscope or the like to inspect the shape of the molded object (such as the unevenness of the smooth surface 93, which will be described later).

[0022] As shown in Figure 2, the control device 26 comprises a controller 102, a plurality of drive circuits 104, and a storage device 106. The plurality of drive circuits 104 are connected to the electromagnetic motors 38, 56, holding device 62, lifting device 64, inkjet head 75, planarizing device 78, irradiation device 81, heater 82, mounting unit 83, supply unit 84, and inspection unit 24. The controller 102 is a computer-based device equipped with a CPU, ROM, RAM, etc., and is connected to the plurality of drive circuits 104. The storage device 106 is equipped with RAM, ROM, hard disk, etc., and stores a control program 107 that controls the molding device 10. The controller 102 can control the operation of the transport device 20, molding unit 22, etc. by executing the control program 107 with its CPU.

[0023] In this embodiment, the molding apparatus 10, with the configuration described above, forms an insulating first planarization layer 86 (see Figure 6), a smooth layer 151 (see Figure 12), and conductive metal wiring 95 (see Figure 13) by curing ultraviolet-curable resin 76 or metal ink 77 as a viscous fluid. The molding apparatus 10 can fabricate structures of any shape by changing the shapes of the first planarization layer 86, the smooth layer 151, and the metal wiring 95. The molding apparatus 10 may also mount electronic components using a mounting unit 23 during the fabrication process. For example, the control program 107 contains three-dimensional data for each layer sliced ​​from the structure. The controller 102 forms the structure by discharging and curing the viscous fluid based on the data from the control program 107. The controller 102 also detects information such as the layer and position where electronic components are placed based on the data from the control program 107, and mounts the electronic components based on the detected information.

[0024] (2. Operation of the molding device 10) Next, as an example of the operation of the molding apparatus 10, a molding process in which metal wiring 95 is molded on the smooth layer 151 will be described. Figure 3 is a flowchart showing the contents of the molding process. When the control device 26 receives an instruction to start molding, for example, it executes a predetermined program of the control program 107 and starts the molding process shown in Figure 3. In the following description, the controller 102 executing the control program 107 to control each device may be simply referred to as "device name". For example, "the controller 102 moves the base 60" means "the controller 102 executes the control program 107 and controls the operation of the transport device 20 via the drive circuit 104, causing the base 60 to move through the operation of the transport device 20". Figures 4 to 8, 12 and 13 schematically show each step of the molding process. The directions shown in Figures 4 to 8, 12 and 13 (such as the X-axis direction) are examples.

[0025] First, the base member 70 is set on the base 60 of the stage 52. The setting of the base member 70 may be done by a person or automatically by the molding device 10. The controller 102 controls the transport device 20 to move the stage 52 with the base member 70 set on it below the molding unit 22. In the first ejection process shown in S11 of Figure 3, the controller 102 moves the stage 52 in the X-axis direction, for example as shown in Figure 4, and controls the inkjet head 75 of the printing unit 72 to eject the ultraviolet curing resin 76 onto the base member 70. The inkjet head 75 ejects the ultraviolet curing resin 76 onto the base member 70 in a thin film. The controller 102 may perform the ejection by the inkjet head 75 in S11 with only one scan (1 pass) along the X-axis direction, for example, or with multiple scans.

[0026] Next, in the first planarization process of S13, the controller 102 rotates the roller 79 of the planarization device 78 on the upper surface of the thin film-like ultraviolet-curable resin 76 to perform planarization. As shown by the arrow in Figure 5, the controller 102 moves the base member 70 (stage 52) in a movement direction 133 that is opposite to the rotation direction 131 of the roller 79, and plans the ultraviolet-curable resin 76 discharged in the first discharge process with the roller 79. For example, the controller 102 rotates the roller 79 in a counterclockwise rotation direction 131 in Figure 5 around a rotation axis parallel to the Y-axis direction. The controller 102 also moves the stage 52 in a movement direction 133 (direction toward the back in Figure 5) that is along the X-axis direction and opposite to the rotation direction 131. The opposite direction to the rotation direction 131 here means, for example, parallel to the upper surface of the stage 52, tangential to the roller 79, and opposite to the rotation direction 131. In this embodiment, the roller 79 is fixed in position in the XYZ axis directions. The controller 102 uses the lifting device 64 to raise the stage 52 to a position where the roller 79 contacts the ultraviolet curing resin 76 discharged onto the base member 70, thereby performing flattening. The controller 102 also increases (makes faster) the rotational speed of the roller 79 in the rotational direction 131 compared to the movement speed of the stage 52 in the movement direction 133.

[0027] The roller 79 comes into contact with the UV-curing resin 76 in a flowable state, transfers the UV-curing resin 76 to the roller 79, scrapes it up, and collects it with the recovery unit 80, while flattening the surface of the UV-curing resin 76. Note that the operating directions of the base member 70 and the roller 79 described above are just examples. For example, the roller 79 may be configured to move in the X-axis direction, and the controller 102 may move the roller 79 in the movement direction 133 or the opposite direction to the movement direction 133 while rotating it in the rotation direction 131 to perform the flattening.

[0028] Next, in the first curing treatment of S15, the controller 102 irradiates the planarized ultraviolet-curable resin 76 with ultraviolet light using the irradiation device 81. As shown in Figure 6, the irradiation device 81 cures the ultraviolet-curable resin 76 by irradiating the thin film-like spread ultraviolet-curable resin 76 (see Figure 5) with ultraviolet light, forming an insulating first planarization layer 86. This forms a first planarization layer 86 having a planarized first planarization surface 86A on its surface.

[0029] Next, the controller 102 determines whether or not a first planarization layer 86 of a predetermined thickness has been formed (S17). The controller 102 makes a negative determination in S17 until the thickness reaches a value specified by, for example, a setting in the control program 107 or an external input (S17: NO). The controller 102 can determine the thickness of the formed first planarization layer 86 based on, for example, the size of the droplets of ultraviolet curing resin 76 ejected from the inkjet head 75, the number of times S11 to S15 have been repeatedly executed, etc. The controller 102 laminates an insulating layer by repeatedly executing the processes of S11 to S15, forming a first planarization layer 86 having a first planarization surface 86A on its surface and having a predetermined thickness. Note that the controller 102 does not have to execute the first planarization process in S13 every time S11 is executed. For example, the controller 102 may execute the first planarization process in S13 every time S11 and S15 are executed multiple times.

[0030] If the controller 102 determines in S17 that it has formed a first planarization layer 86 of a predetermined thickness (S17: YES), then in the second ejection process in S19, it ejects ultraviolet curing resin 76 onto the first planarization surface 86A in order to smooth the first planarization surface 86A of the first planarization layer 86. By repeatedly executing S11 to S15, a planarized first planarization surface 86A can be formed on the surface of the first planarization layer 86. Figure 7 schematically shows the first planarization layer 86 with a planarized surface. As shown in Figure 7, fine irregularities 91 are formed on the first planarization surface 86A of the planarized first planarization layer 86 due to, for example, differences in the amount of ultraviolet curing resin 76 ejected from the nozzle of the inkjet head 75 or the size of the droplets of ultraviolet curing resin 76. The height of these irregularities 91 may be, for example, ±10 μm, which is extremely small compared to the size of the roller 79. Therefore, even if the first planarized surface 86A of the first planarized layer 86 is planarized with the roller 79, it is difficult to planarize down to the fine irregularities 91. In this disclosure, a surface on which these fine irregularities 91 are formed is defined as a planarized surface. Furthermore, a surface on which these fine irregularities 91 are reduced, or on which the surface irregularities become ±1 μm or less (it can be assumed that the original irregularities 91 have disappeared), is defined as a smoothed surface.

[0031] When irregularities 91 are formed on the first planarized surface 86A, variations in the thickness of the metal wiring occur when metal wiring is formed on this first planarized surface 86A. Alternatively, the metal wiring may not be completely fired in areas with greater thickness (metal particles may not come into contact or fuse), which may reduce the conductivity of the metal wiring. As a result, the resistance value of the metal wiring becomes uniform, making it difficult to obtain the desired high-frequency characteristics.

[0032] Therefore, the controller 102 performs smoothing by again dispensing ultraviolet-curable resin 76 onto the first flattened surface 86A of the flattened first flattening layer 86 to reduce or eliminate the irregularities 91. In the second dispensing process of S19 in Figure 3, the controller 102 uses the inkjet head 75 to dispensing ultraviolet-curable resin 76 onto the first flattened surface 86A. In the following description, when distinguishing between the ultraviolet-curable resin 76 of the first dispensing process of S11 and the ultraviolet-curable resin 76 of the second dispensing process of S19, the ultraviolet-curable resin 76 of S19 will be referred to as the second ultraviolet-curable resin 76A. The controller 102 sets the amount of the second ultraviolet-curable resin 76A dispensed in S19 to an amount corresponding to the size of the irregularities 91. For example, if the height of the formed irregularities 91 is high (the grooves are deep), the controller 102 performs a process to increase the dispensing amount of the inkjet head 75. Furthermore, the controller 102 may dispense the second ultraviolet curing resin 76A at a constant discharge rate regardless of the size of the irregularities 91.

[0033] Next, the controller 102 performs a semi-curing treatment on the second UV-curable resin 76A extruded in S19 (S23). The controller 102 irradiates the second UV-curable resin 76A with ultraviolet light from the irradiation device 81 to semi-cure it (see Figure 6). The semi-cured state refers to a state in which viscosity has decreased and fluidity has improved, but the physical properties are not yet completely stable. The semi-cured state is, for example, a state in which, when a new second UV-curable resin 76A is extruded on a layer of semi-cured second UV-curable resin 76A, the extruded second UV-curable resin 76A does not mix with the layer, but is cured to the extent that it sits on top of the semi-cured layer. The controller 102 semi-cures the second UV-curable resin 76A by, for example, reducing the intensity of the ultraviolet light irradiated onto the second UV-curable resin 76A (light intensity), the scanning speed of the ultraviolet light scanning, the number of scans, the irradiation time, and the number of irradiations compared to a normal curing treatment (such as the first curing treatment in S15).

[0034] The controller 102, similar to S17 described above, repeatedly performs the processes S19 to S23 until a semi-cured layer of a predetermined thickness is formed (S25:NO), thereby laminating the semi-cured second ultraviolet-curable resin 76A. As shown in Figure 8, a semi-cured layer 92 is formed on the first planarization layer 86 by laminating the semi-cured second ultraviolet-curable resin 76A. The semi-cured second ultraviolet-curable resin 76A spreads and smooths out the fine irregularities 91 of the first planarization surface 86A due to the leveling effect, forming a smooth surface 93. The leveling effect here refers to the phenomenon in which the surface area of ​​the liquid is minimized due to surface tension. Although it also depends on the viscosity of the liquid, over time the thin film formed by the second ultraviolet-curable resin 76A changes to a flatter (more uniform) film thickness. The second ultraviolet-curable resin 76A spreads out when dispensed onto the first planarization surface 86A, filling in the irregularities 91.

[0035] When the controller 102 forms a semi-cured layer 92 of a predetermined thickness (S25:YES), it performs a second planarization process (S27). Here, during the formation of the semi-cured layer 92 in S19 to S25, or during subsequent curing, localized enlargements are formed due to the surface tension of the second ultraviolet-curable resin 76A. In detail, Figure 9 is a schematic diagram illustrating the enlargement 135. As shown in Figure 9, for example, when a small-width object 139 is fabricated with a width 137 in the X-axis direction of a few millimeters or less, an enlargement 135 that bulges upward in the Z-axis direction is formed in the semi-cured layer 92 due to the surface tension of the second ultraviolet-curable resin 76A. Also, for example, when an object 141 is fabricated with a width in the X-axis direction or Y-axis direction of a certain width (e.g., 3 mm) or more, an enlargement 135 that bulges upward is formed at the ends of the object 141 in the X-axis direction or Y-axis direction. Each of the fabricated objects 139 and 141 has an enlarged portion 135 that protrudes above a predetermined height 143. This predetermined height 143 is a target height defined, for example, by the three-dimensional data of the control program 107, and is the height at which the smooth surface 93 is formed.

[0036] Furthermore, if molding is continued on the semi-cured layer 92, for example, the UV-curing resin extruded onto the augmented portion 135 will have a stronger adhesion force to the substrate (augmented portion 135) due to surface tension compared to UV-curing resin printed on a flat surface such as the smooth surface 93. Therefore, if the same amount of UV-curing resin is extruded onto the augmented portion 135 and the smooth surface 93, and the same planarization process is performed, the augmented portion 135 will remain in the molded object. As a result, the thickness and molding accuracy of the finished molded object will be reduced. In addition, there is a risk that the augmented portion 135 and the roller 79 may come into contact during the planarization process, causing damage to part of the molded object, or that fragments of the molded object may be collected in the recovery unit 80.

[0037] Therefore, the controller 102 executes the second flattening process in S27 to reduce the size of the enlarged portion 135 (suppress the enlargement). The controller 102 moves the stage 52 to the position of the flattening device 78 and adjusts the height of the stage 52 so that the lower end of the roller 79 is positioned on the smooth surface 93, i.e., at a predetermined height 143, as shown in Figure 9. As described above, in this embodiment, the position of the roller 79 in the X-axis and Y-axis directions is fixed. Then, with this position fixed, the roller 79 rotates and performs flattening by aligning the position where it contacts the semi-cured layer 92 with the position of the upper surface (smooth surface 93) of the semi-cured layer 92 in the design data. This transfers and collects the second ultraviolet curing resin 76A contained in the enlarged portion 135 protruding from the smooth surface 93 to the roller 79, thereby reducing the size of the enlarged portion 135 and flattening it. The second flattening process may also be performed while moving the roller 79 without fixing its position. Additionally, the position of the roller 79 may be slightly above or below the smooth surface 93.

[0038] Furthermore, the method for aligning the position of the roller 79 with the position of the upper surface of the semi-cured layer 92 is not particularly limited. Based on the three-dimensional data of the control program 107, the position of the lower end of the roller 79 may be aligned with the target height for creating the smooth surface 93. Alternatively, the height of the upper surface of the semi-cured layer 92 may be measured by experimentally creating a molded object, and the position of the roller 79 may be adjusted. Or, before executing S27 in the actual molding process, the height of the upper surface of the molded semi-cured layer 92 may be measured using a sensor or the like, and the position of the roller 79 may be adjusted. Alternatively, the position of the stage 52 may be fixed, and the position of the roller 79 in the Z-axis direction may be adjusted to align with the position of the upper surface of the semi-cured layer 92. Alternatively, both the stage 52 and the roller 79 may be moved in the Z-axis direction for adjustment.

[0039] Furthermore, unlike the first planarization process in S13, the controller 102 moves the stage 52 in a movement direction 145 which is the same direction as the rotation direction 131 of the roller 79, as shown in Figure 9, to planarize the semi-cured layer 92 with the roller 79. Here, the same direction as the rotation direction 131 means, for example, parallel to the upper surface of the stage 52, tangential to the roller 79, and in the same direction as the rotation direction 131. As described above, the position of the roller 79 is fixed, so the roller 79 rotates while its position in the movement direction 145 of the stage 52, for example in the X-axis direction, is fixed. Here, Figure 10 is a schematic diagram of the first planarization process. In the first planarization process in S13, for example, planarization is performed after one first discharge process (S11). For this reason, the UV-curing resin 76 targeted in the first planarization process has smaller individual droplets compared to the state in which multiple layers of the semi-cured second UV-curing resin 76A are stacked, as in the second planarization process. The intermolecular forces between the UV-curing resin 76 and the droplets themselves, as well as between the droplets and the cured film (the already cured portion of the first planarization layer 86), are weak (see arrow in Figure 10). In such cases, by reversing the rotation direction 131 and the movement direction 133, force is applied from the roller 79 to the UV-curing resin 76 in the direction of arrow 147 shown in Figure 10, transferring the excess UV-curing resin 76 to the roller 79, enabling quick and efficient planarization. As a result, the molding time can be reduced.

[0040] On the other hand, Figure 11 is a schematic diagram of the second planarization process. In the second planarization process in S27, for example, the cycles S19 to S23 are executed multiple times to fill in the irregularities 91, and the semi-cured second UV-curing resin 76A is laminated. Therefore, even if one tries to transfer and recover it quickly as in the first planarization process, the liquid film formed by droplets of the second UV-curing resin 76A is large, and the intermolecular forces between the droplets themselves and between the droplets and the first planarization layer 86 are strong (see arrows in Figure 11). Consequently, if planarization is performed with the movement direction 133 and rotation direction 131 reversed as in the first planarization process, there is a risk that the second UV-curing resin 76A may not be sufficiently recovered (transferred). Therefore, by making the rotation direction 131 of the roller 79 and the movement direction 145 of the stage 52 the same direction, the time for the second ultraviolet curing resin 76A to move onto the surface of the roller 79, i.e., the transfer time, can be increased, allowing the excess second ultraviolet curing resin 76A to be more reliably transferred to the roller 79, recovered, and flattened. The enlarged portion 135 can be made smaller more reliably.

[0041] Furthermore, as described above, the controller 102 increases (speeds up) the rotation speed of the roller 79 in the rotation direction 131 compared to the movement speed of the stage 52 in the movement direction 133 during the first planarization process. For example, the controller 102 sets the rotation speed of the roller 79 to several times the movement speed of the stage 52. This allows the roller 79 to rotate faster during the first planarization process, where intermolecular forces are weaker and droplets are easier to transfer compared to the second planarization process, thereby increasing the amount transferred to the roller 79 per unit time and shortening the time required for the first planarization process. As a result, the molding time can be shortened.

[0042] Furthermore, in the second planarization process, the controller 102 makes the movement speed of the stage 52 in the movement direction 145 the same as the rotation speed of the roller 79 in the rotation direction 131. This eliminates the difference in relative movement speed between the roller 79 and the second UV-curing resin 76A on the stage 52, creating a state where the roller 79 appears to be pressing down on the second UV-curing resin 76A from above. In the second planarization process, where intermolecular forces are stronger and droplet transfer is more difficult than in the first planarization process, eliminating the relative movement between the roller 79 and the second UV-curing resin 76A allows for more reliable transfer of excess second UV-curing resin 76A to the roller 79.

[0043] When controller 102 executes S27, it performs a second curing treatment to cure the semi-cured layer 92 (S29). Controller 102 moves stage 52 to irradiation device 81 and irradiates the semi-cured layer 92 that has undergone the second planarization treatment with ultraviolet light. The second ultraviolet curing resin 76A hardens as its viscosity increases due to the irradiation with ultraviolet light, filling in the irregularities 91. A smooth layer 151 formed on top of the first planarization layer 86 is created by curing the semi-cured layer 92 (see Figure 12). The smooth surface 93 formed on the upper surface of the smooth layer 151 becomes a surface with reduced or no irregularities 91 due to the leveling effect described above. In addition, the smooth surface 93 becomes a surface with reduced or no increased portion 135 due to the second planarization treatment.

[0044] Next, the controller 102 forms metal wiring at predetermined locations on the smooth surface 93 based on the three-dimensional data of the control program 107. More specifically, in the metal fluid ejection process of S31, the controller 102 controls the inkjet head 75 to eject a thin film of metal ink 77 onto the smooth surface 93 of the smooth layer 151 (see Figure 12). In the conductor formation process of S33, the controller 102 heats and bakes the metal ink 77 ejected onto the smooth surface 93 using the heater 82 (see Figure 13). In S35, the controller 102 determines whether or not it has been able to form metal wiring 95 of the desired thickness and shape. For example, the controller 102 makes a negative determination in S35 up to a predetermined number of times (S35: NO), and repeatedly executes S31 and S33 to form the desired metal wiring 95 on the smooth surface 93. The desired metal wiring 95 here refers to metal wiring 95 that satisfies the required thickness, shape, position, and electrical characteristics. The controller 102 repeatedly executes S31 and S33 up to a preset number of times, then makes a positive determination in S35 (S35: YES), and executes S37. This makes it possible to fabricate the first planarization layer 86 (wiring substrate) with the metal wiring 95 formed on the smooth surface 93.

[0045] In this case, when metal ink 77 is ejected and cured onto the first flattened surface 86A on which irregularities 91 are formed to form metal wiring 95, the thickness of the metal wiring 95 becomes uneven due to the irregularities 91. This may lead to problems such as increased resistance of the metal wiring 95, disconnection, and a decrease in high-frequency characteristics. In contrast, the molding apparatus 10 of this embodiment reduces the fine irregularities 91 and increased portions 135 of the first flattened surface 86A, and by ejecting the metal ink 77 onto the reduced smooth surface 93, it is possible to form metal wiring 95 with a more uniform thickness. As a result, the resistance of the metal wiring 95 can be reduced to a desired value, and the occurrence of disconnection can be suppressed.

[0046] Next, in S37, the controller 102 performs other processing. For example, the controller 102 may eject metallic ink 77 from the inkjet head 75 onto the metal wiring 95 and control the mounting unit 23 to position the electronic component so that the ejected ink and the terminals of the electronic component make contact. The controller 102 connects the electronic component to the metal wiring 95 (circuit) by firing the metallic ink 77 with the heater 82. Alternatively, if further fabrication of the first planarization layer 86 or the metal wiring 95 is required, the controller 102 may repeat the processing from S11. The controller 102 may also control the inspection unit 24 to perform an inspection of the completed structure (such as the first planarization layer 86 with the electronic component attached). When the controller 102 executes S37, it completes the fabrication process shown in Figure 3. This makes it possible to fabricate the desired structure.

[0047] According to the above-described embodiment, the following effects are achieved. The controller 102 of the molding apparatus 10 performs a first ejection process (S11) in which ultraviolet curing resin 76 is ejected from above the stage 52, a first flattening process (S13) in which the stage 52 is moved in the opposite direction to the rotation direction 131 of the roller 79 to flatten the ultraviolet curing resin 76 ejected in S11 with the roller 79, and a first curing process (S15) in which the ultraviolet curing resin 76 flattened in S13 is cured. The controller 102 repeatedly performs S11, S13, and S15 until a predetermined thickness is reached (S17:NO) to form a first flattened layer 86. The controller 102 also performs a second ejection process (S19) in which second ultraviolet curing resin 76A is ejected onto the first flattened layer 86, and a semi-curing process (S23) in which the second ultraviolet curing resin 76A ejected in S19 is partially cured. The controller 102 repeatedly executes S19 and S23 until a predetermined thickness is reached (S25:NO) to form a semi-hardened layer 92 on the first planarized layer 86. Then, the controller 102 moves the stage 52 in the same direction as the rotation direction 131 of the roller 79 to flatten the semi-hardened layer 92 with the roller 79 (S27).

[0048] According to this, in S13, by moving the stage 52 in the opposite direction to the rotation direction 131 of the roller 79 to perform flattening, the UV-curing resin 76 can be transferred to the roller 79 while performing flattening quickly, thereby shortening the molding time. Furthermore, in S23, by moving the stage 52 in the same direction as the rotation direction 131 of the roller 79 to perform flattening, the time for the second UV-curing resin 76A of the semi-cured layer 92 to move onto the surface of the roller 79 can be made relatively longer, enabling proper transfer. As a result, compared to the case where the stage 52 is moved in the opposite direction to the rotation direction 131 of the roller 79 to flatten the second UV-curing resin 76A, the localized increase 135 of the semi-cured layer 92 can be flattened more effectively.

[0049] Furthermore, as shown in Figure 2, the controller 102 of the control device 26 includes a first discharge unit 110, a first planarization unit 111, a first hardening unit 112, a planarization layer forming unit 113, a second discharge unit 115, a semi-hardening unit 116, a semi-hardened layer forming unit 117, and a second planarization unit 118. The first discharge unit 110, etc., are processing modules realized, for example, by executing a control program 107 in the CPU of the controller 102. The first discharge unit 110, etc., may also be configured in hardware instead of software.

[0050] The first ejection unit 110 is a functional unit that ejects ultraviolet-curable resin 76 from an inkjet head 75 above the stage 52. The first flattening unit 111 is a functional unit that moves the stage 52 in the opposite direction to the rotation direction 131 of the roller 79, and flattens the ultraviolet-curable resin 76 ejected by the first ejection unit 110 with the roller 79. The first curing unit 112 is a functional unit that cures the ultraviolet-curable resin 76 flattened by the first flattening unit 111 with the curing unit 74. The flattening layer forming unit 113 is a functional unit that repeatedly executes S11, S13, and S15 to form a first flattening layer 86 on the stage 52. The second ejection unit 115 is a functional unit that ejects a second ultraviolet-curable resin 76A from an inkjet head 75 onto the first flattening layer 86. The semi-curing unit 116 is a functional unit that semi-cures the second ultraviolet-curable resin 76A ejected by the second ejection unit 115 with the curing unit 74. The semi-hardened layer forming section 117 is a functional section that repeatedly performs steps S19 and S23 to form a semi-hardened layer 92 on top of the first flattening layer 86. The second flattening section 118 is a functional section that moves the stage 52 in the same direction as the rotation direction 131 of the roller 79 to flatten the semi-hardened layer 92 with the roller 79.

[0051] Incidentally, in the above embodiment, the curing unit 74 is an example of a curing device. The inkjet head 75 is an example of an ejection device. The ultraviolet curing resin 76 is an example of a first curable viscous fluid. The metal ink 77 is an example of a fluid containing metal particles. The second ultraviolet curing resin 76A is an example of a second curable viscous fluid. The first planarization layer 86 is an example of a planarization layer. The metal wiring 95 is an example of a conductor. S11 is an example of the first ejection process and planarization layer formation process. S13 is an example of the first planarization process and planarization layer formation process. S15 is an example of the first curing process and planarization layer formation process. S19 is an example of the second ejection process and semi-cured layer formation process. S23 is an example of the semi-curing process and semi-cured layer formation process. S27 is an example of the second planarization process. S29 is an example of the second curing process. S31 is an example of the metal fluid ejection process. S33 is an example of a conductor formation process.

[0052] (3. Others) Furthermore, this disclosure is not limited to the above embodiments, and can be implemented in various forms with various modifications and improvements based on the knowledge of those skilled in the art. For example, the content and order of each step in the manufacturing process shown in Figure 3 are just examples. For instance, in the manufacturing process shown in Figure 3, a first planarization layer 86 is fabricated on the base member 70 of the stage 52, and a smoothing layer 151 is fabricated on the first planarization layer 86, but this is not the only option. For example, a smoothing layer 151 may be fabricated on the base member 70, a first planarization layer 86 may be fabricated on the smoothing layer 151, and then another smoothing layer 151 may be fabricated on the first planarization layer 86. Furthermore, the controller 102 does not need to form metal wiring 95. Furthermore, in S13, the controller 102 may set the rotation speed of the roller 79 to be the same as, or less than, the movement speed of the stage 52. Furthermore, in S27, the controller 102 may set the movement speed of the stage 52 to be greater than or less than the rotation speed of the roller 79. Although the molding apparatus 10 had the roller 79 in a fixed position, it may also be configured in a way that it is not fixed. The molding apparatus 10 may perform planarization by moving the roller 79 in each of the XYZ axes during each planarization step (process). Furthermore, the controller 102 does not require the mounting of electronic components.

[0053] The first curable viscous fluid and the second curable viscous fluid in this disclosure are not limited to the ultraviolet-curable resin 76, but can be various curable viscous fluids that harden by light, heat, etc. Therefore, the method for hardening the first curable viscous fluid and the second curable viscous fluid is not limited to ultraviolet light. The first curable viscous fluid and the second curable viscous fluid may be different types of curable viscous fluids. The fluid containing metal particles in this disclosure is not limited to the silver-containing metal ink 77, but can also be a fluid containing other metals. In the above embodiment, a molding apparatus 10 for manufacturing a wiring board was used as the molding apparatus of the present disclosure, but it is not limited to this. Various manufacturing apparatuses that perform molding using a first curable viscous fluid and a second curable viscous fluid can be used as the manufacturing apparatus of the present disclosure. [Explanation of Symbols]

[0054] 10 Molding device, 26 Control device, 52 Stage, 74 Curing unit (curing device), 75 Inkjet head (ejector), 76 UV-curable resin (first curable viscous fluid), 76A Second UV-curable resin (second curable viscous fluid), 77 Metal ink (fluid containing metal particles), 79 Roller, 86 First planarization layer (planarization layer), 92 Semi-cured layer, 93 Smooth surface, 95 Metal wiring (conductor), 110 First ejector unit, 111 Planarization unit, 112 First curing unit, 113 Planarization layer forming unit, 115 Second ejector unit, 116 Semi-cured unit, 117 Semi-cured layer forming unit, 118 Second planarization unit, 131 Rotation direction, 151 Smooth layer.

Claims

1. A first discharge step in which a first curable viscous fluid is discharged from above the stage, A first flattening step is performed by moving the stage in the opposite direction to the rotation direction of the roller, thereby flattening the first curable viscous fluid discharged in the first discharge step using the roller, A first curing step is performed to cure the first curable viscous fluid that has been flattened by the first planarization step, A planar layer formation step is performed by repeatedly executing the first discharge step, the first planar step, and the first curing step to form a planar layer on the stage, A second discharge step of discharging a second curable viscous fluid onto the planarized layer, A semi-curing step for semi-curing the second curable viscous fluid discharged in the second discharge step, A semi-hardened layer formation step is performed by repeatedly carrying out the second discharge step and the semi-hardening step to form a semi-hardened layer on the flattened layer, A second planarization step involves moving the stage in the same direction as the rotation direction of the roller to flatten the semi-hardened layer with the roller, A molding method that includes this.

2. In the first planarization step, The molding method according to claim 1, wherein the rotation speed of the roller is made greater than the movement speed of the stage.

3. In the aforementioned second planarization step, The molding method according to claim 1 or claim 2, wherein the moving speed of the stage and the rotation speed of the roller are made the same.

4. In the aforementioned second planarization step, The molding method according to any one of claims 1 to 3, wherein the position of the roller in the direction of movement of the stage is fixed, and the position in which the roller contacts the semi-hardened layer is aligned with the position of the upper surface of the semi-hardened layer in the design data, and flattening is performed by the roller.

5. A second curing step involves curing the semi-cured layer that has been flattened by the second planarization step to form a smooth layer having a smooth surface, A metal fluid discharge step in which a fluid containing metal particles is discharged onto the smooth surface, A conductor forming step involves curing the fluid containing the metal particles discharged in the metal fluid discharge step to form a metallic conductor on the smooth surface, A molding method according to any one of claims 1 to 4, including the following:

6. Discharge device and Laura and, A curing device, Control device and Equipped with, The control device is A first discharge unit that discharges a first curable viscous fluid from above the stage by the discharge device, The stage is moved in the opposite direction to the rotation direction of the roller, and the first curable viscous fluid discharged by the first discharge unit is flattened by the roller in the first flattening unit, A first curing unit that cures the first curable viscous fluid, which has been flattened by the first flattening unit, using the curing device, A flattening layer forming unit that repeatedly performs the processing by the first discharge unit, the first flattening unit, and the first hardening unit to form a flattened layer on the stage, A second discharge unit for discharging a second curable viscous fluid onto the surface of the planarized layer using the discharge device, A semi-curing section in which the second curable viscous fluid discharged by the second discharge section is partially cured by the curing device, A semi-hardened layer forming unit that repeatedly performs the processing by the second discharge unit and the semi-hardened unit to form a semi-hardened layer on the flattened layer, A second flattening section moves the stage in the same direction as the rotation direction of the roller to flatten the semi-hardened layer with the roller, A molding device equipped with the following features.

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