A crystalline radical polymerizable composition for electrical and electronic components exhibiting excellent metal adhesion, an electrical and electronic component using the composition, and a method for manufacturing the electrical and electronic component.

Abstract

To provide a crystalline radically polymerizable composition excellent in metal adhesion, excellent in fluidity, and excellent in handleability.SOLUTION: A crystalline radically polymerizable composition for electric and electronic components of the present invention contains at least a crystalline radically polymerizable compound, an inorganic filler, a silane coupling agent, an adhesion promoter, and a radical polymerization initiator. Further, in a preferred embodiment of the crystalline radically polymerizable composition for electric and electronic components of the present invention contains one or more selected from unsaturated polyesters, epoxy (meth)acrylates, urethane (meth)acrylates, polyester (meth)acrylates, polyether (meth)acrylates, radically polymerizable monomers, and radically polymerizable multimers.SELECTED DRAWING: None

Description

Technical Field

[0001] The present invention relates to a crystalline radically polymerizable composition for electric and electronic parts having excellent metal adhesion, an electric and electronic parts sealing body, a molded body, or a fixed body sealed, molded, or fixed with the composition, a granular material composed of the crystalline radically polymerizable composition for electric and electronic parts, and a method for producing an electric and electronic parts sealing body, a molded body, or a fixed body.

Background Art

[0002] Electric and electronic parts used in automobiles and electric appliances are protected by metal or resin materials in order to protect them from external factors such as dust, moisture, and impact. Sealing, molding, or fixing of electric and electronic parts with metal has high reliability but is expensive, so it has been replaced by a resin material for sealing, molding, or fixing that is inexpensive and has good productivity. In addition, by using a resin material for sealing, molding, or fixing electric and electronic parts instead of using metal, the electric and electronic parts that are sealed, molded, or fixed can be made smaller because they have electrical insulation, and the design freedom of the automobiles and electric appliances to be mounted is improved. In addition, since electric and electronic parts may be used under severe conditions in a high-temperature and high-humidity environment, when using a resin material, a thermosetting resin having excellent heat resistance is often used.

[0003] On the other hand, as a problem of resin materials, there is adhesion to metals such as gold, silver, copper, aluminum, nickel, and tin. In the field of electric and electronic parts, improvement of adhesion to lead frames (copper, gold, etc.) is desired. In addition, in the field of automotive parts, improvement of adhesion to aluminum die-castings, etc. is desired.

[0004] Recently, a liquid epoxy resin having good adhesion to resin substrates and metals and excellent mechanical strength and fluidity has been used.

[0005] With the increasing electronic control of automobiles, and the widespread adoption of mobile devices and consumer electronics, the use of semiconductors has increased significantly, and the importance of semiconductor encapsulation, molding, or fixing, which is one of the methods for encapsulating, molding, or fixing electrical and electronic components, is also growing. Tablet-shaped epoxy molding compounds (EMC) account for a large proportion of semiconductor encapsulation, molding, or fixing materials used in the encapsulation, molding, or fixing of semiconductors. EMC is used in transfer molding methods, which have high productivity, and has established high reliability due to its excellent physical properties such as adhesion and coefficient of thermal expansion. However, because it requires refrigerated storage and a post-curing process, there is a need to simplify its usage method.

[0006] For these reasons, methods for manufacturing semiconductor devices and acrylic resin compositions for semiconductor encapsulation used therein are conventionally known (for example, Patent Document 1). [Prior art documents] [Patent Documents]

[0007] [Patent Document 1] Japanese Patent Publication No. 2015-2204 [Overview of the project] [Problems that the invention aims to solve]

[0008] However, in the prior art, including the aforementioned Patent Document 1, molding such as sealing using liquid epoxy resin is carried out by relatively unproductive methods such as compression molding and casting. Therefore, a more productive manufacturing method is desired.

[0009] In the above-mentioned Patent Document 1, the acrylic resin composition for semiconductor encapsulation is liquid at room temperature. Because it is liquid at room temperature, it has very good fluidity, but because the acrylic resin composition is liquid at room temperature, it is sticky, and its workability and handling are poor, making it unsuitable for use with general-purpose molding machines that are used for solid pellets or tablets at room temperature. In addition, when molding by casting, air bubbles tend to remain in the resin composition, making it difficult to control the bubbles. Furthermore, compared to solid resin compositions, liquid resin compositions have the problem that when inorganic fillers are used, the fillers tend to settle, making it difficult to obtain uniform molded products.

[0010] Therefore, the present invention aims to provide a crystalline radical polymerizable composition that exhibits excellent metal adhesion and fluidity, as well as good handling properties. [Means for solving the problem]

[0011] The inventors of the present invention have conducted extensive and multifaceted studies on compositions containing at least a crystalline radical polymerizable compound from various perspectives, and as a result have discovered the present invention's crystalline radical polymerizable composition for electrical and electronic components that exhibits excellent metal adhesion.

[0012] In other words, the crystalline radical polymerizable composition for electrical and electronic components of the present invention comprises at least a crystalline radical polymerizable compound, an inorganic filler, a silane coupling agent, an adhesion promoter (excluding the silane coupling agent), and a radical polymerization initiator, wherein the melting point of the crystalline radical polymerizable compound is 30 to 150°C, and the adhesion promoter is a polar group selected from phosphoric acid, carboxylic acid, or carboxylate salt. of Organic compounds , or an organic compound selected from acrylate phosphate, carboxylic acid-modified triazole, zinc acrylate, zinc methacrylate, polysulfidesilane, or mercaptosilane. Furthermore, the proportion of the adhesion-imparting agent is, per 100 parts by mass of the radical polymerizable compound 15 From the mass part above 30 It is characterized by being less than or equal to parts by mass.

[0013] Furthermore, in a preferred embodiment of the crystalline radical polymerizable composition for electrical and electronic components of the present invention, the crystalline radical polymerizable compound is characterized by containing one or more selected from unsaturated polyester, epoxy (meth)acrylate, urethane (meth)acrylate, polyester (meth)acrylate, polyether (meth)acrylate, radical polymerizable monomer, and radical polymerizable polymer.

[0014] Furthermore, in a preferred embodiment of the crystalline radical polymerizable composition for electrical and electronic components of the present invention, For electrical and electronic components The crystalline radical polymerizable composition is characterized by being a solid at 23°C.

[0015] Furthermore, in a preferred embodiment of the crystalline radical polymerizable composition for electrical and electronic components of the present invention, the inorganic filler is the For electrical and electronic components It is characterized by being 50 to 95% by mass of the total amount of the crystalline radical polymerizable composition.

[0016] Furthermore, in a preferred embodiment of the crystalline polymerizable composition for electrical and electronic components of the present invention, a radical polymerizable compound 100 parts by mass The proportion of the crystalline radical polymerizable compound to the given amount is characterized by being 30 parts by mass or more.

[0018] Furthermore, the electrical and electronic components of the present invention are characterized by being sealed, molded, or fixed with the crystalline radical polymerizable composition for electrical and electronic components of the present invention.

[0019] Furthermore, the granular material of the present invention is characterized by comprising the crystalline radical polymerizable composition for electrical and electronic components of the present invention.

[0020] Furthermore, the present invention provides a method for manufacturing electrical and electronic components, characterized by comprising the step of sealing, molding, or fixing electrical and electronic components by insert molding using injection molding or transfer molding, with the granular material consisting of the crystalline radical polymerizable composition for electrical and electronic components of the present invention. [Effects of the Invention]

[0021] According to the crystalline radical-polymerizable composition for electric and electronic parts of the present invention, an effect of excellent handleability is exhibited. Further, according to the method for producing an electric and electronic part of the present invention, since the crystalline radical-polymerizable composition has an extremely low viscosity during heat melting at the time of injection molding and transfer molding, an advantageous effect that the fluidity required for sealing, molding, or fixing of the electric and electronic part can be ensured is exhibited.

[0022] Also, according to the present invention, an electric and electronic part sealed, molded, or fixed with the crystalline radical-polymerizable composition for electric and electronic parts can be provided. Specifically, for example, an electric and electronic part sealing, molding, or fixing body or the like can be provided.

[0023] Furthermore, according to the present invention, a method for producing an electric and electronic part sealing, molding, or fixing body having a step of sealing, molding, or fixing an electric and electronic part by an insert molding method using a granular material, powder, or tablet composed of the crystalline radical-polymerizable composition for electric and electronic parts can be provided.

Mode for Carrying Out the Invention

[0024] The crystalline radical-polymerizable composition for electric and electronic parts of the present invention is characterized by containing at least a crystalline radical-polymerizable compound, an inorganic filler, a silane coupling agent, an adhesion-imparting agent, and a radical polymerization initiator. This is because, by using the crystalline radical-polymerizable composition, as shown in the examples described later, a polymerizable composition excellent in fluidity and handleability can be realized. In the present specification, the crystalline radical-polymerizable composition for electric and electronic parts may be referred to as a crystalline radical-polymerizable composition.

[0025] Furthermore, in a preferred embodiment of the crystalline radical polymerizable composition for electrical and electronic components of the present invention, the crystalline radical polymerizable compound is characterized by containing one or more selected from unsaturated polyester, epoxy (meth)acrylate, urethane (meth)acrylate, polyester (meth)acrylate, polyether (meth)acrylate, radical polymerizable monomer, and radical polymerizable polymer.

[0026] Although the term "crystalline" is omitted, specifically, the crystalline radical polymerizable compound may include one or more selected from crystalline unsaturated polyester, crystalline epoxy (meth)acrylate, crystalline urethane (meth)acrylate, crystalline polyester (meth)acrylate, crystalline polyether (meth)acrylate, crystalline radical polymerizable monomer, and crystalline radical polymerizable polymer. Using these polymerizable compounds results in good mechanical properties and handling (the term "crystalline" may also be omitted below).

[0027] In this specification, a crystalline compound can be defined as a compound having a glass transition temperature and a melting temperature. These temperatures can be determined by thermal analysis equipment such as DSC (Differential Scanning Calorimeter) or TGDTA (Differential Thermal and Thermogravimetric Analysis). The crystalline compound in this invention can be defined as a compound whose melting temperature can be determined by thermal analysis equipment.

[0028] Furthermore, in the present invention, the adhesion-imparting agent is not particularly limited as long as it has excellent adhesion to metals. For example, as an adhesion-imparting agent, from the viewpoint of forming hydrogen bonds, examples include polar groups (phosphoric acid, carboxylic acid, carboxylate salt) or organic compounds having highly polar atoms (N, S). Automotive electrical and electronic components that are subjected to sealing, molding, or sealing of fixing materials contain metals in part. For example, gold wire in the case of IC chips, silver solder when brazing capacitors etc. to epoxy glass laminate substrates such as ECUs, copper wire wound around reactor turquoise, aluminum for harness connection terminals, etc. Sealed, molded, or fixed automotive electrical and electronic components are exposed to harsh environments (generally from -40°C to 150°C). At this time, the sealing body of the automotive electrical and electronic component undergoes repeated thermal expansion and contraction, so if delamination occurs at the interface between the sealing material etc. and the automotive electrical and electronic component, moisture and dust can enter the gap, leading to malfunction of the automotive electrical and electronic component. In the present invention, it is also possible to suppress such delamination by improving adhesion to each substrate. The mechanism involves the interaction (hydrogen bonding, etc.) between the adhering water or hydroxyl groups present on the metal substrate surface and the polar groups of the adhesion promoter, resulting in adhesion. Among these, there are combinations that work well together. For example, as shown in the examples described later, nitrogen-containing compounds (adhesion promoter 2 in the examples) and sulfur-containing compounds (adhesion promoters 5 and 6 in the examples) can be used for copper.

[0029] In a preferred embodiment, examples of adhesion-imparting agents that form hydrogen bonds include acrylate phosphate, carboxylic acid-modified triazole, zinc acrylate, zinc methacrylate, polysulfide silane, and mercaptosilane.

[0030] Furthermore, in a preferred embodiment of the crystalline radical polymerizable composition for electrical and electronic components of the present invention, the crystalline radical polymerizable compound is characterized in that, from the viewpoint of workability and moldability, the melting point of the crystalline radical polymerizable compound is 30 to 150°C, more preferably 30 to 120°C, and even more preferably 30 to 100°C. This is because using a crystalline radical polymerizable compound with a melting point in the range of 30 to 150°C allows for better handling compared to using a crystalline radical polymerizable compound with a melting point of less than 30°C or a crystalline radical polymerizable compound with a melting point higher than 150°C. If the melting point of the crystalline radical polymerizable compound is lower than the above range, it tends to become liquid at room temperature, which may make it difficult for the crystalline radical polymerizable composition to maintain its solid state. If the melting point of the crystalline radical polymerizable compound is higher than the above range, it approaches the molding temperature of the mold, which shortens the time from the start of flow to hardening, and may result in molding defects.

[0031] Furthermore, when only crystalline radical polymerizable compounds with a melting point below 30°C are used, there is a tendency for them to not easily form a crystalline radical polymerizable composition that is solid at 23°C. On the other hand, when only crystalline radical polymerizable compounds with a melting point above 150°C are used, in injection molding, the crystalline radical polymerizable composition tends to have poor stability in the cylinder because the cylinder temperature and the mold temperature are close when plasticizing the composition in the cylinder.

[0032] Furthermore, in a preferred embodiment of the crystalline radical polymerizable composition for electrical and electronic components of the present invention, the crystalline radical polymerizable composition is characterized by being solid at 23°C, from the viewpoint of ease of handling of the crystalline radical polymerizable compound. The above range was chosen because the shape of the composition does not change under the manufacturing, molding, and transportation environment of the crystalline radical polymerizable composition, thus enabling continuous production using general-purpose manufacturing equipment and conditions. Note that "solid" can mean a substance whose shape and volume do not easily change due to external force.

[0033] Furthermore, in a preferred embodiment of the crystalline radical polymerizable composition for electrical and electronic components of the present invention, from the viewpoint of product quality, the inorganic filler can be 50 to 95% by mass, more preferably 55 to 93% by mass, and even more preferably 60 to 90% by mass, relative to the total amount of the crystalline radical polymerizable composition. The reason for setting the range above is that if the amount of inorganic filler is less than the above range, the shrinkage rate will be large and the molded product will deform, and if it is more than the above range, the melt viscosity during molding will be high, putting a load on the insert and potentially damaging the insert.

[0034] Furthermore, in a preferred embodiment of the crystalline radical polymerizable composition for electrical and electronic components of the present invention, from the viewpoint of maintaining a solid state, the ratio of the crystalline radical polymerizable compound to the total amount of radical polymerizable compound can be 30 parts by mass or more, more preferably 40 parts by mass or more, and even more preferably 50 parts by mass or more. The reason for setting the range above is that if the ratio of the crystalline radical polymerizable compound is less than the above range, it may become difficult to form a solid.

[0035] Furthermore, in a preferred embodiment of the crystalline radical polymerizable composition for electrical and electronic components of the present invention, from the viewpoint of maintaining a solid state, the radical polymerizable compound 100 parts by mass The proportion of the adhesion agent to the composition is 5 parts by mass or more and 50 parts by mass or less, more preferably 15 parts by mass or more and 30 parts by mass or less. The above range is set because if the amount of adhesion agent is less than the above range, the adhesion effect to the metal substrate cannot be obtained, and if the amount of adhesion agent is more than the above range, the crystalline radical polymerizable composition may not solidify easily.

[0036] Furthermore, the electrical and electronic components of the present invention are characterized by being sealed, molded, or fixed using the crystalline radical polymerizable composition for electrical and electronic components of the present invention. The crystalline radical polymerizable composition for electrical and electronic components of the present invention can be used in electrical and electronic components, for example, for sealing, molding, or fixing electrical and electronic components. For example, when the crystalline radical polymerizable composition for electrical and electronic components of the present invention is used for sealing, molding, or fixing, it can be specifically used to make an electrical and electronic component encapsulant, an electrical and electronic component molded body, or an electrical and electronic component fixed body, and an electrical and electronic component that has been sealed, molded, or fixed using the crystalline radical polymerizable composition for electrical and electronic components of the present invention can be obtained.

[0037] Furthermore, the granular material of the present invention is characterized by comprising the crystalline radical polymerizable composition for electrical and electronic components of the present invention. Although the present invention is described as a granular material, it may also be a powder, tablet, or the like. That is, in cases other than granular material, the powder, tablet, etc. of the present invention may comprise the crystalline radical polymerizable composition for electrical and electronic components of the present invention.

[0038] Furthermore, the method for manufacturing electrical and electronic components of the present invention is characterized by comprising the step of sealing, molding, or fixing electrical and electronic components by insert molding using injection molding or transfer molding, with the granular material consisting of the crystalline radical polymerizable composition for electrical and electronic components of the present invention.

[0039] Encapsulations for electrical and electronic components can include inserts. Examples of molded bodies for electrical and electronic components include test pieces for obtaining mechanical and thermal properties. Examples of fixed bodies for electrical and electronic components include those in which electrical and electronic components are fixed to housings, units, modules, devices, and other component parts. Encapsulations for electrical and electronic components are molded bodies that enclose capacitors, integrated circuits, etc., which are bonded to a substrate. Electrical and electronic components bonded to a substrate are susceptible to damage from the flow pressure of injection molding or transfer molding using high-viscosity molding materials. In this invention, electrical and electronic components can include not only so-called electrical and electronic components but also printed circuit boards, wire harnesses, temperature sensors, semiconductors, etc. Therefore, these encapsulations, molds, or fixed bodies for electrical and electronic components can also be used for semiconductor encapsulations, molds, or fixed bodies. In short, the compositions of the present invention can be widely applied to encapsulations, molds, or fixed bodies where handling properties and fluidity are required.

[0040] Compositions with low melt viscosity and good fluidity are soft even at room temperature, which can lead to handling problems. Furthermore, soft compositions can form lumps, causing fusion of the composition in the hopper during injection molding, fusion of pre-formed tablets during transfer molding, and even shape changes that prevent them from entering the tablet insertion holes in the transfer molding machine. This invention achieves both fluidity and ease of handling, resulting in excellent productivity.

[0041] <Method for manufacturing unsaturated polyester> The unsaturated polyester used in the present invention can, for example, be produced by a known dehydration condensation reaction of an unsaturated polybasic acid, a saturated polybasic acid, and glycols, and typically has an acid value of 2 to 40 mg KOH / g. In the production of the unsaturated polyester, a crystalline unsaturated polyester can be produced by appropriately selecting and combining the acid components of the unsaturated polybasic acid and saturated polybasic acid, as well as the selection and combination of glycols and their blending ratios.

[0042] Examples of unsaturated polybasic acids include maleic acid, maleic anhydride, fumaric acid, citraconic acid, mesaconic acid, itaconic acid, tetrahydrophthalic acid, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, and glutaconic acid.

[0043] Examples of saturated polybasic acids include phthalic acid, phthalic anhydride, isophthalic acid, terephthalic acid, succinic acid, adipic acid, sebatic acid, azelaic acid, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, endomethylenetetrahydrophthalic anhydride, hetic acid, and tetrabromphthalic anhydride.

[0044] Examples of glycols include ethylene glycol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,8-octanediol, propylene glycol, diethylene glycol, triethylene glycol, dipropylene glycol, neopentyl glycol, 1,3-butanediol, hydrogenated bisphenol A, bisphenol A propylene oxide compounds, cyclohexanedimethanol, and dibromoneopentyl glycol.

[0045] In the present invention, among crystalline unsaturated polyesters, fumaric acid is used as the unsaturated polybasic acid, isophthalic acid or terephthalic acid as the saturated polybasic acid, and ethylene glycol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,8-octanediol, or cyclohexanedimethanol are preferred as the main glycol components.

[0046] <Method for manufacturing epoxy (meth)acrylate> The epoxy (meth)acrylate used in the present invention can be produced by known methods. A crystalline epoxy (meth)epoxy acrylate can be obtained by appropriately selecting an epoxy resin and an unsaturated monobasic acid in the presence or absence of a known inhibitor and a known esterification catalyst, in an inert gas stream or in an air atmosphere. If necessary, other radical polymerizable monomers or organic solvents can be added to the reaction to lower the melt viscosity of the reaction system.

[0047] The epoxy (meth)acrylate in the present invention can, for example, be an epoxy (meth)acrylate having a double bond of acrylate or methacrylate at the molecular end, obtained by adding acrylic acid or methacrylic acid to an epoxy resin having two or more glycidyl ether groups in one molecule. An epoxy (meth)acrylate resin obtained by dissolving epoxy (meth)acrylate in a radically polymerizable monomer and / or radically polymerizable polymer may also be used. Examples of epoxy resins having two or more glycidyl ether groups in one molecule include bisphenol-type epoxy resins from bisphenol A, bisphenol F, bisphenol S, etc., or their derivatives; bixylenol-type epoxy resins from bixylenol and its derivatives; biphenol-type epoxy resins from biphenol and its derivatives; naphthalene-type epoxy resins from naphthalene and its derivatives; and novolac-type epoxy resins. These can be used individually or in mixtures of two or more. The epoxy equivalent, which is an indicator of the molecular weight of the epoxy resin, is preferably 174 to 2000 eq / g.

[0048] <Method for manufacturing urethane (meth)acrylate> Furthermore, the urethane (meth)acrylate in the present invention can, as an example, be an isocyanate at the molecular end obtained by reacting a diisocyanate with a polyalcohol and / or polyester polyol and / or polyether polyol having two or more hydroxyl groups in one molecule, and / or by reacting a compound having an alcoholic hydroxyl group and one or more acrylate or methacrylate groups with one or more isocyanates in one molecule, or by first reacting a diisocyanate with a compound having an alcoholic hydroxyl group and one or more acrylate or methacrylate groups so that an isocyanate group remains, and then reacting the remaining isocyanate group with a polyalcohol and / or polyester polyol and / or polyether polyol having two or more hydroxyl groups in one molecule to obtain a urethane acrylate having a double bond of acrylate or methacrylate at the molecular end. In the production of urethane (meth)acrylate, crystalline urethane (meth)epoxy acrylate can be obtained by appropriately selecting a combination of isocyanate and polyalcohol and / or polyester polyol and / or polyether polyol, and a compound having an alcoholic hydroxyl group and one or more acrylate or methacrylate groups. Urethane (meth)acrylate resins may also be obtained by dissolving urethane acrylate or urethane methacrylate in a radically polymerizable monomer and / or radically polymerizable polymer such as styrene or diethylene glycol dimethacrylate. These can be used alone or in mixtures of two or more.

[0049] The above-mentioned compound having an alcoholic hydroxyl group and one or more acrylate or methacrylate groups can be hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, phenoxyhydroxypropyl (meth)acrylate, trimethylolpropanedi (meth)acrylate, dipropylene glycol mono (meth)acrylate, etc.

[0050] Furthermore, the polyalcohols having two or more hydroxyl groups in one molecule include, for example, neopentyl glycol, ethylene glycol, 1,3-propanediol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,7-heptanediol, 1,8-octanediol, 1,9-nonanediol, 1,10-decanediol, propylene glycol, diethylene glycol, dipropylene glycol, trimethylene glycol, hydrogenated bisphenol A, bisphenol A ethylene oxide adduct, bisphenol A propylene oxide adduct, etc. The polyester polyols having two or more hydroxyl groups in one molecule include, for example, neopentyl glycol, ethylene glycol, propylene glycol, diethylene glycol, dipropylene glycol, trimethylene glycol, hydrogenated bisphenol A, bisphenol A ethylene oxide adduct, etc. A saturated polyester polyol with a molecular weight of 1000 to 2000 obtained by a dehydration condensation reaction between polyalcohols such as bisphenol A propylene oxide adducts and polybasic acids such as adipic acid, (anhydride) phthalic acid, isophthalic acid, terephthalic acid, and trimellitic acid, and a polyether polyol having two or more hydroxyl groups in one molecule, can be used alone or in combination of two or more, such as polyethylene glycol, polypropylene glycols with a molecular weight of 300 to 2000 obtained by a ring-opening reaction of ethylene oxide or propylene oxide, or polycaprolactone obtained by a ring-opening reaction of caprolactone.

[0051] Examples of compounds having two or more isocyanate groups in a single molecule include aromatic and / or aliphatic polyisocyanate compounds, such as tolylene diisocyanate, diphenylmethane diisocyanate, hydrogenated diphenylmethane diisocyanate, 1,6-hexamethylene diisocyanate, isophorone diisocyanate, xylylene diisocyanate, hydrogenated xylylene diisocyanate, trifunctional isocyanates having an isocyanurate ring obtained by triply modifying a bifunctional isocyanate compound, and commercially available isocyanate prepolymers modified with polyols. These can be used individually or in combination of two or more types.

[0052] <Method for manufacturing polyester (meth)acrylate> Furthermore, the polyester (meth)acrylate in the present invention may, for example, be a polyester acrylate or polyester methacrylate having a double bond of acrylate or methacrylate at the molecular end, obtained by esterifying a polyester polyol with acrylic acid or methacrylic acid, or by reacting an acid-terminated polyester with an acrylate or methacrylate having a glycidyl group. In the production of polyester (meth)acrylate, a crystalline polyester (meth)acrylate can be obtained by appropriately selecting a polyester polyol with acrylic acid or methacrylic acid, or an acid-terminated polyester with an acrylate or methacrylate having a glycidyl group. A polyester acrylate resin or polyester methacrylate resin may also be obtained by dissolving polyester acrylate or polyester methacrylate in a radically polymerizable monomer and / or radically polymerizable polymer such as styrene or diethylene glycol dimethacrylate. These can be used alone or in mixtures of two or more.

[0053] <Method for producing polyether (meth)acrylate> Furthermore, the polyether (meth)acrylate in the present invention may, for example, be a polyether acrylate or polyether methacrylate having a double bond of acrylate or methacrylate at the molecular terminus, obtained by esterifying a polyether polyol with acrylic acid or methacrylic acid, or by reacting an acid-terminated polyether with an acrylate or methacrylate having a glycidyl group. In the production of polyether (meth)acrylate, a crystalline polyester (meth)acrylate can be obtained by appropriately selecting a polyether polyol with acrylic acid or methacrylic acid, or an acid-terminated polyester with an acrylate or methacrylate having a glycidyl group. A polyether acrylate resin or polyether methacrylate resin may also be obtained by dissolving polyether acrylate or polyether methacrylate in a radically polymerizable monomer and / or radically polymerizable polymer such as styrene or diethylene glycol dimethacrylate. These can be used alone or in mixtures of two or more.

[0054] In a preferred embodiment, the crystalline radical polymerizable monomers that are solid at 30-150°C in the present invention include ethoxylated isocyanuric acid triacrylate (melting point approximately 50°C), polyethylene glycol di(meth)acrylate (melting point 35-53°C), methoxypolyethylene glycol(meth)acrylate (melting point 33-40°C), behenyl acrylate (melting point 46°C), tetramethylpiperinidyl methacrylate (melting point 56-60°C), and trimetallyl isocyanurate. It may contain one or more compounds selected from the following: (melting point 83-87°C), diacetone acrylamide (melting point approximately 56°C), dimethyl itacronate (melting point 36°C), vinyl stearate (melting point 36°C), N-vinylcarbazole (melting point 67°C), N-methylolacrylamide (melting point 71-75°C), acrylamide (melting point 84°C), tolylenediarylcarbamate (melting point 85-110°C), maleimide (melting point 93°C), acenaphthylene (melting point 95°C), etc. Using these crystalline radical polymerizable compounds results in good handling properties.

[0055] The radical polymerizable monomers used in this invention can be liquid at room temperature, as long as the purpose is not impaired. Examples include vinyl aromatic compounds such as styrene monomers having a vinyl group, α-methylstyrene, vinyltoluene, and α-chlorostyrene; vinyl esters such as vinyl acetate, vinyl propionate, vinyl lactate, vinyl butyrate, and beova monomer (manufactured by Shell Chemical Corporation); and (meth)acrylic acid esters such as methyl acrylate, ethyl acrylate, n-butyl acrylate, methyl methacrylate, ethyl methacrylate, and n-butyl methacrylate.

[0056] Furthermore, difunctional or more radical polymerizable monomers such as triallyl cyanurate, diethylene glycol dimethacrylate, diallyl tetrabrom phthalate, phenoxyethyl acrylate, 2-hydroxyethyl acrylate, 1,6-hexanediol diacrylate, diallyl phthalate having an allyl group, and triallyl isocyanurate can be used. These radical polymerizable monomers may be used individually or in combination of two or more.

[0057] The radical polymerizable polymers used in this invention can be diallyl phthalate prepolymers, tyke prepolymers, epoxy prepolymers, urethane prepolymers, or acrylate prepolymers. These radical polymerizable polymers may be used individually or in combination of two or more types.

[0058] In the crystalline radical polymerizable composition for electrical and electronic components of the present invention, inorganic fillers may be incorporated. Examples of inorganic fillers include calcium carbonate, magnesium carbonate, barium carbonate, calcium hydroxide, aluminum hydroxide, magnesium hydroxide, magnesium oxide, alumina, silica, zinc oxide, mica, aluminum nitride, and boron nitride, of which silica is preferred from the viewpoint of fluidity. These may be used individually or in combination of two or more.

[0059] As the inorganic filler, one with an average particle size of 100 μm or less, preferably 0.01 to 50 μm, can be used. By using an inorganic filler having the above average particle size, a crystalline radical polymerizable composition for electrical and electronic components with excellent fluidity and strength during molding can be obtained.

[0060] In the crystalline radical polymerizable composition for electrical and electronic components of the present invention, various additives that adhere closely to inorganic fillers and reinforcing materials, such as (meth)acrylate compounds having polar groups and coupling agents, can be incorporated.

[0061] The (meth)acrylate compound having a polar group is not particularly limited, but examples include (meth)acrylate compounds in which substituents containing atoms other than carbon and hydrogen are ester-bonded. Examples of substituents include hydroxyl groups, epoxy groups, glycidyl ether groups, tetrahydrofurfuryl groups, isocyanate groups, carboxyl groups, alkoxysilyl groups, phosphate ester groups, lactone groups, oxetane groups, tetrahydropyranyl groups, amino groups, etc. The coupling agent is not particularly limited, but examples include silane-based coupling agents and titanate-based coupling agents. Examples of silane coupling agents include epoxysilanes, aminosilanes, cationic silanes, vinylsilanes, acrylicsilanes, mercaptosilanes, and composites thereof.

[0062] Of these, acrylic silane coupling agents are preferred from the viewpoint of improving strength. In addition, any other additives can be used as long as they do not impair the objective of the present invention.

[0063] In the crystalline radical polymerizable composition for electrical and electronic components exhibiting excellent metal adhesion according to the present invention, various additives that adhere to metals such as gold, silver, copper, iron, stainless steel, aluminum, nickel, tin, lead, zinc, palladium, and magnesium can be incorporated, such as (meth)acrylate compounds having polar groups, coupling agents, metal (meth)acrylate compounds, sulfide compounds, benzotriazole compounds, thiazole compounds, imidazole compounds, pyrazole compounds, isocyanuric acid compounds, and the like.

[0064] The (meth)acrylate compounds having polar groups are not particularly limited, but examples include (meth)acrylate compounds in which substituents containing atoms other than carbon and hydrogen are ester-bonded. Examples of substituents include hydroxyl groups, epoxy groups, glycidyl ether groups, tetrahydrofurfuryl groups, isocyanate groups, carboxyl groups, alkoxysilyl groups, phosphate ester groups, lactone groups, oxetane groups, tetrahydropyranyl groups, amino groups, and the like.

[0065] The coupling agent is not particularly limited, but for example, silane-based coupling agents and titanate-based coupling agents can be used. As for silane coupling agents, for example, epoxysilane-based, aminosilane-based, cationicsilane-based, vinylsilane-based, acrylicsilane-based, mercaptosilane-based, and composite systems thereof can be used.

[0066] The metal (meth)acrylate compound is not particularly limited, but examples include zinc (meth)acrylate, potassium (meth)acrylate, sodium (meth)acrylate, magnesium (meth)acrylate, calcium (meth)acrylate, barium (meth)acrylate, strontium (meth)acrylate, nickel (meth)acrylate, copper (meth)acrylate, etc.

[0067] The sulfide compound is not particularly limited, but examples include alkoxylyl disulfide, alkoxylyl trisulfide, alkoxysilyl tetrasulfide, alkoxysilyl polysulfide, phenolic disulfide, phenolic trisulfide, phenolic tetrasulfide, and phenolic polysulfide.

[0068] Benzotriazole compounds are not particularly limited, but examples include 2-(2'-hydroxy-5'-methylphenyl)benzotriazole, 2-(2'-hydroxy-3'-tert-butyl-5'-methylphenyl)-5-chlorobenzotriazole, 2-(2'-hydroxy-3'5'-di-tert-aminophenyl)benzotriazole, 2-(2'-hydroxy-5'-tert-octylphenyl)benzotriazole, 2,2'-methylenebis[6-(2H-benzotriazol-2-yl)-4-tert-octylphenol], 6-(2-benzotriazolyl)-4-tert-octyl-6' -tert-butyl-4'-methyl-2,2'-methylenebisphenol, 1,2,3-benzotriazole, 1-[N,N-bis(2-ethylhexyl)aminomethyl]benzotriazole, carboxybenzotriazole, 1-[N,N-bis(2-ethylhexyl)aminomethyl]methylbenzotriazole, 2,2'-[[(methyl-1H-benzotriazole-1-yl)methyl]imino]bisethanol, etc. can be used.

[0069] Thiazole compounds are not particularly limited, but examples include 2-mercaptobenzothiazole, 2-(methylthio)benzothianol, 2-chlorobenzothianol, 2-(methylthio)-2-thiazoline, 2-methylbenzothiazole, 5-methoxy-2-methylbenzothiazole, 2-methyl-4,5,7-trifluorobenzothianol, 2-aminobenzothianol, 2-amino-6-methylbenzothianol, 2-amino-4-methoxybenzothianol, 4-methyl-2-mercaptobenzothianol, 3-chlorobenzothianol -1,2-benzoisothianol, (benzothiazole-2-ylthio)succinic acid, S-benzothiazole-2-yl dodecanethioate, benzothiazole-2-yl bis(2-ethylhexyl)dithiocarbanoate, 1-(1,2-benzisothiazole-3-yl)piperazine, N,N-bis(2-ethylhexyl)-2-benzothiazolyl sulfenamide, benzothiazole-2-yl dibenzyldithiocarbamate, 2-(2-hydroxyphenyl)benzothiazole, etc. can be used.

[0070] The imidazole compounds are not particularly limited, but examples include 4-formylimidazole, 4-methyl-2-phenylimidazole, 2-formylimidazole, 4-amino-5-cyanoimidazole, 4-methyl-2-phenylimidazole, 4-hydroxymethylimidazole hydrochloride, 2-hydroxymethylimidazole hydrochloride, 4-imidazole carboxylic acid, 1H-imidazole-4-carbothioic acid, 5-cyano-1H-imidazole-4-carboxamide, 2-bromoimidazole, and 2-mercaptoimidazole.

[0071] The pyrazole compounds are not particularly limited, but examples include pyrazole, 3-amino-5-tert-butylpyrazole, 1-allyu-3,5-dimethylpyrazole, 3-aminopyrazole, 3,5-dimethylpyrazole, and the like.

[0072] The isocyanuric acid compounds are not particularly limited, but examples include zinc isocyanurate.

[0073] Of these, phosphate acrylate compounds are preferred from the viewpoint of improving strength. In addition, any other additive can be used as long as it does not impair the purpose of the present invention.

[0074] In the present invention's crystalline radical polymerizable composition for electrical and electronic components exhibiting excellent metal adhesion, a thermal decomposition type organic peroxide or polymerization inhibitor commonly used in unsaturated polyester resin compositions and radical polymerizable compositions can be used as a radical polymerization initiator.

[0075] Examples of organic peroxides include t-butylperoxy-2-ethylhexyl monocarbonate, 1,1-di(t-hexylperoxy)cyclohexane, 1,1-di(t-butylperoxy)-3,3,5-trimethylcyclohexane, t-butylperoxyoctoate, benzoyl peroxide, methyl ethyl ketone peroxide, acetylacetone peroxide, t-butylperoxybenzoate, and dicumyl peroxide. These may be used individually or in combination of two or more.

[0076] Among these, from the viewpoint of molding conditions and storage stability, it is preferable to use an organic peroxide with a 10-hour half-life temperature of 100°C or higher, and specifically, dicumyl peroxide can be suitably used.

[0077] Polymerization inhibitors include quinones such as hydroquinone, monomethyl ether hydroquinone, toluhydroquinone, di-t-4-methylphenol, monomethyl ether hydroquinone, phenothiazine, t-butylcatechol, parabenzoquinone, and pyrogallol, as well as 2,6-di-t-butyl-p-cresol, 2,2-methylene-bis-(4-methyl-6-t-butylphenol), and 1,1,3-tris-(2-methyl-4-hydroxy-5-t-butylphenicol). Examples of phenolic compounds such as butane, and piperidine-1-oxyl compounds such as 4-hydroxy-2,2,6,6-tetramethylpiperidine-1-oxyl, 4-oxo-2,2,6,6-tetramethylpiperidine-1-oxyl, 4-methoxy-2,2,6,6-tetramethylpiperidine-1-oxyl, 4-carboxy-2,2,6,6-tetramethylpiperidine-1-oxyl, and 2,2,6,6-tetramethylpiperidine-1-oxyl. By using these, thickening during filling in molding can be suppressed, and a radical polymerizable composition with low melt viscosity can be obtained. These may be used individually or in combination of two or more.

[0078] In the crystalline radical polymerizable composition for electrical and electronic components of the present invention, reinforcing materials can be incorporated. By using reinforcing materials, a crystalline radical polymerizable composition for electrical and electronic components with excellent strength properties and dimensional stability can be obtained.

[0079] The reinforcing material used in this invention is typically glass fiber, which is used in fiber-reinforced plastics such as BMC (Bulk Molding Compound) and SMC (Sheet Molding Compound). However, it is not limited to glass fiber, and other materials can also be used.

[0080] Examples of glass fibers include E-glass (alkali-free glass for electrical use), C-glass (alkali-containing glass for chemical use), A-glass (acid-resistant glass), and S-glass (high-strength glass), which are made from silicate glass and borosilicate glass. These can be used in the form of long fibers (roving), short fibers (chopped strands), or milled fibers. Furthermore, these glass fibers can also be used after surface treatment.

[0081] Furthermore, in the crystalline radical polymerizable composition for electrical and electronic components of the present invention, other inorganic fillers may be appropriately blended, as long as they do not impair the fluidity of the composition or its properties when used as a encapsulant, molding material, or fixing material.

[0082] Examples of these include oxides and their hydrates, inorganic foamed particles, and hollow particles such as silica balloons.

[0083] In the crystalline radical polymerizable composition for electrical and electronic components of the present invention, a mold release agent can be used. As the mold release agent, waxes such as fatty acid-based, fatty acid metal salt-based, and mineral-based waxes, which are generally used in thermosetting resins, can be used, and in particular, fatty acid-based, fatty acid metal salt-based, and waxes that have excellent heat discoloration resistance can be suitably used.

[0084] Examples of these release agents include stearic acid, zinc stearate, aluminum stearate, calcium stearate, and paraffin wax. These release agents may be used individually or in combination of two or more.

[0085] Release agents can also be used as external release agents, such as release agents that are sprayed or applied to the mold as needed, or molding materials that contain release agents.

[0086] In addition to these components, the present invention may optionally include curing catalysts, polymerization inhibitors, colorants, thickeners, wetting and dispersing agents, surface modifiers, viscosity reducers, flow modifiers, and other organic and inorganic additives to adjust the curing conditions of the crystalline radical polymerizable composition.

[0087] <Method for producing crystalline radical polymerizable compositions> The crystalline radical polymerizable composition for electrical and electronic components of the present invention can be manufactured by blending each component, thoroughly mixing them uniformly using a mixer, blender, etc., then preparing and granulating it using a heat-pressure kneader, extruder, etc.

[0088] Furthermore, the granular material, powder, and tablets of the present invention are characterized by comprising the crystalline radical polymerizable composition for electrical and electronic components of the present invention. The granular material comprising the crystalline radical polymerizable composition for electrical and electronic components of the present invention may also be in the form of pellets.

[0089] Furthermore, the electrical and electronic components of the present invention, specifically, for example, electrical and electronic component encapsulants, molded bodies, or fixed bodies, are characterized by being encapsulated, molded, or fixed by molding granules, powders, or tablets made from the crystalline radical polymerizable composition for electrical and electronic components of the present invention. The electrical and electronic component encapsulants, molded bodies, or fixed bodies can be molded by conventional methods using various thermosetting composition molding methods.

[0090] Furthermore, because the crystalline radical polymerizable composition for electrical and electronic components of the present invention is dry-molded and has good thermal stability during melting, melt-heat molding methods such as injection molding, injection compression molding, transfer molding, and compression molding can be suitably used as molding methods.

[0091] Among these methods, injection molding using an injection molding machine and transfer molding using a transfer molding machine are particularly preferred. Injection molding allows for shorter molding times, and transfer molding allows for the molding of many molded bodies at once, making it possible to manufacture complex-shaped electrical and electronic component encapsulants, molded bodies, or fixed bodies.

[0092] <Electrical and electronic component encapsulants, molded bodies, or fixed bodies, and methods for manufacturing electrical and electronic component encapsulants, molded bodies, or fixed bodies> The electrical and electronic component encapsulants, molded bodies, or fixed bodies of the present invention can be manufactured by encapsulating, molding, or fixing electrical and electronic components by insert molding using the crystalline radical polymerizable composition for electrical and electronic components of the present invention. Here, the crystalline radical polymerizable composition for electrical and electronic components of the present invention may be one in which all components constituting the crystalline radical polymerizable composition are separately heated and kneaded in advance, or in which some or all of the components are mixed and heated and kneaded immediately before injection into the mold.

[0093] While the temperature and pressure of the crystalline radical polymerizable composition during mold injection are not particularly limited, when using an injection molding machine, a crystalline radical polymerizable composition temperature of 60-130°C, a mold temperature of 130-190°C, and a crystalline radical polymerizable composition pressure of 0.1-10 MPa are preferable, as these reduce damage to electrical and electronic components. When using a transfer molding machine, a mold temperature of 130-190°C and a crystalline radical polymerizable composition pressure of 0.1-10 MPa are preferable. [Examples]

[0094] The following describes in more detail one embodiment of the present invention with reference to examples, but the present invention is not limited in any way to these examples.

[0095] <Examples of manufacturing radical polymerizable compositions for electrical and electronic components> Examples 1-8 and Comparative Example 1 The crystalline radical polymerizable compositions of Examples 1 to 8 shown in Table 1 were blended in the amounts specified in Table 1, uniformly prepared using a pressurized, heated, and cooled kneader, and then fed into an extruder and hot-cut to obtain granules. Some of the granular and lump radical polymerizable compositions were powdered using a pulverizer.

[0096] The following ingredients were used in the formulation. (1) Polymerizable compound 1. Crystalline radical polymerizable compound 1: Urethane methacrylate (2-hydroxyethyl methacrylate adduct of 1,6-hexamethylene diisocyanate) 2. Amorphous radical polymerizable compound 2: Bisphenol A type epoxy methacrylate (methacrylic acid adduct of bisphenol A type epoxy resin) 3. Crystalline radical polymerizable monomer 1: Ethoxylated isocyanuric acid triacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., A-9300)

[0097] (2) Inorganic filler 1. Inorganic filler 1: Fused silica (manufactured by Denka Co., Ltd., average particle size 24 μm)

[0098] (3) Additives 1. Silane coupling agent: Methacrylic silane (KBM-503, manufactured by Shin-Etsu Chemical Co., Ltd.)

[0099] (4) Adhesion-enhancing agent 1. Adhesion enhancer 1: Acrylate phosphate (JPA-514, manufactured by Johoku Chemical Industry Co., Ltd.) 2. Adhesion enhancer 2: Carboxylic acid-modified triazole (CBT-1, manufactured by Johoku Chemical Industry Co., Ltd.) 3. Adhesion enhancer 3: Zinc acrylate (ZDA-100, manufactured by Asada Chemical Industries, Ltd.) 4. Adhesion enhancer 4: Zinc methacrylate (M-CP, manufactured by Asada Chemical Industries, Ltd.) 5. Adhesion enhancer 5: Polysulfide silane (CABRUS, manufactured by Osaka Soda Co., Ltd.) 6. Adhesion enhancer 6: Mercaptosilane (KBM-803, manufactured by Shin-Etsu Chemical Co., Ltd.)

[0100] (5) Release agent: Zinc stearate (GF-200, manufactured by NOF Corporation)

[0101] (6) Coloring agent: Carbon black (CB40, manufactured by Mitsubishi Chemical Corporation)

[0102] (7) Polymerization initiator: Dicumyl peroxide (Percumyl D, manufactured by NOF Corporation)

[0103] (8) Polymerization inhibitor: parabenzoquinone (PBQ, manufactured by Seiko Chemical Co., Ltd.)

[0104] <Properties of radically polymerizable compounds> The melting points of crystalline and amorphous radical polymerizable compounds were measured and are shown in Table 1.

[0105] [Table 1]

[0106] <Methods for evaluating compound properties, composition properties, and physical properties>

[0107] (1) Hardness The measurement method followed JIS K 7215. The hardness of the crystalline radical polymerizable compositions of Examples 1-8 and Comparative Example 1 shown in Table 1 was measured using a durometer (Nishi-Tokyo Seimitsu Co., Ltd. WR-105D). The radical polymerizable composition, temperature-controlled at 90°C, was formed into a flat plate of approximately 100 mm × 100 mm × 10 mm and cooled and solidified in a constant temperature chamber at 23°C. The uncured radical polymerizable composition, temperature-controlled at 23°C, was placed on a horizontal, hard surface. The pressure reference surface of the durometer was pressed against the surface of the radical polymerizable composition as quickly as possible without impact, while keeping it parallel to the surface, to ensure good contact between the pressure reference surface and the radical polymerizable composition. The maximum indicated value of the indicator was read quickly within 1 second. The results are shown in Tables 2 and 3. The target hardness was 10, with 20 or higher being excellent, 10 or higher being good, and less than 10 being acceptable.

[0108] (2) Flow length The measurement method followed the EIMS T-901 standard. The flow length was measured using the crystalline radical polymerizable compositions of Examples 1-8 and Comparative Example 1 shown in Table 1, on an auxiliary ram-type transfer molding machine equipped with a spiral flow mold. The spiral flow mold was heated to 165°C. The spiral flow mold used had a material injection port in the center, with a semicircular spiral curve groove with a radius of 1.6 mm starting from the injection port. A predetermined amount of radical polymerizable composition was weighed out so that the thickness of the material would be in the range of 1-10 mm. The plunger was raised, the radical polymerizable composition was poured into the pot, and a pressure of 3.2 MPa was immediately applied to start the transfer molding. After the plunger stopped moving, the mold was opened 180 seconds after the start of measurement and the molded product was removed. The length to the glossy part at the tip of the molded product, or the length of the glossy part plus half the length of the low-density part beyond it, was read. The results are shown in Tables 2 and 3. The target flow length was set at 50 cm, with 100 cm or more being considered excellent, 50 cm or more being good, and less than 50 cm being acceptable. However, even if the above strict standards are not met, depending on the desired application and required quality, conditions may be met even if the length is less than 50 cm, so this should be considered as a guideline.

[0109] (3) Adhesion For the measurements, the crystalline radical polymerizable compositions of Examples 1-8 and Comparative Example 1 shown in Table 2 were shaped into tablets with a diameter of 10 mm and a height of 20 mm. These tablets were then placed on a metal substrate and cured in a 175°C oven for 30 minutes to obtain test specimens for evaluating metal adhesion. The adhesion of these test specimens to the cured portion on the metal substrate was evaluated by hand according to the following criteria. ×: Interfacially detached △: Partially fractured ○: Items that have undergone cohesive failure.

[0110] [Table 2]

[0111] As shown in Table 2, the crystalline radical polymerizable composition for electrical and electronic components in the present invention is solid at 23°C, making it easy to handle, highly fluid, and exhibiting good metal adhesion. [Industrial applicability]

[0112] The crystalline radical polymerizable composition for electrical and electronic components of the present invention and electrical and electronic components using the same have good adhesion, a high glass transition temperature, and excellent heat resistance, making it possible to improve the durability of various connectors, harnesses, semiconductor encapsulants, molded bodies, and fixed bodies used in automotive, telecommunications, computer, and home appliance applications, as well as electrical and electronic components such as encapsulants, molded bodies, fixed bodies, switches, sensors, and other electrical and electronic components with printed circuit boards.

Claims

1. A crystalline radical polymerizable composition for electrical and electronic components comprising at least a crystalline radical polymerizable compound, an inorganic filler, a silane coupling agent, an adhesion promoter (excluding the silane coupling agent), and a radical polymerization initiator, wherein the melting point of the crystalline radical polymerizable compound is 30 to 150°C, the adhesion promoter is an organic compound having a polar group selected from phosphoric acid, a carboxylic acid, or a carboxylate salt, or an organic compound selected from acrylate phosphate, carboxylic acid-modified triazole, zinc acrylate, zinc methacrylate, polysulfide silane, or mercaptosilane, and the proportion of the adhesion promoter is 15 parts by mass or more and 30 parts by mass or less per 100 parts by mass of the radical polymerizable compound.

2. The crystalline radical polymerizable composition for electrical and electronic components according to claim 1 is characterized in that the crystalline radical polymerizable compound comprises one or more selected from unsaturated polyester, epoxy (meth)acrylate, urethane (meth)acrylate, polyester (meth)acrylate, polyether (meth)acrylate, radical polymerizable monomer, and radical polymerizable polymer.

3. The crystalline radical polymerizable composition for electrical and electronic components according to claim 1 or 2, characterized in that it is a solid at 23°C.

4. The crystalline radical polymerizable composition for electrical and electronic components according to any one of claims 1 to 3, characterized in that the inorganic filler is 50 to 95% by mass of the total amount of the crystalline radical polymerizable composition for electrical and electronic components.

5. The crystalline radical polymerizable composition for electrical and electronic components according to any one of claims 1 to 4, characterized in that the ratio of the crystalline radical polymerizable compound to 100 parts by mass of the radical polymerizable compound is 30 parts by mass or more.

6. An electrical and electronic component sealed, molded, or fixed with the crystalline radical polymerizable composition for electrical and electronic components described in any one of Claims 1 to 5.

7. Granules comprising a crystalline radical polymerizable composition for electrical and electronic components according to any one of Claims 1 to 5.

8. A method for manufacturing electrical and electronic components, comprising the step of sealing, molding, or fixing electrical and electronic components by insert molding by injection molding or transfer molding using granular material made from the crystalline radical polymerizable composition for electrical and electronic components described in Claim 7.

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