Electrical equipment and pumping equipment

Abstract

To suppress damage of a terminal soldering portion due to the mass of an electronic element mounted on a substrate fixed to a housing of an electric device.SOLUTION: In a motor 10 of a pump apparatus 1, a substrate 19 comprises: a first terminal soldering portion 191 connected to a coil terminal 71; and a second terminal soldering portion 192 connected to a connector terminal 75. The substrate 19 is fixed to a housing 6 at two spots of a first fixing portion 97 and a second fixing portion 98. When a distance between a first electronic element E1 being a maximum mass element having the largest mass on the substrate 19 and the second fixing portion 98 being a proximate fixing portion A that is the closest to the first electronic element E1 in the two fixing portions is a first distance d1, and a distance between the proximate fixing portion A and a proximate soldering portion B that is the closest to the proximate fixing portion A in the plurality of first terminal soldering portions 191 and the plurality of second terminal soldering portions 192 is a second distance d2, the first distance d1 is smaller than the second distance d2.SELECTED DRAWING: Figure 5

Description

Technical Field

[0005] ,

[0001] The present invention relates to an electric device including a substrate to which terminals are connected by solder, and a pump device.

Background Art

[0002] Patent Document 1 describes a motor including a housing that houses a rotor and a stator. In the motor described in Patent Document 1, a plurality of connector terminals are connected to the housing. A substrate that electrically connects the connector terminal and the winding terminal is fixed to an end portion of the housing. A fixing portion that is fixed to the housing with a screw is provided on an outer peripheral edge of the substrate. The connector terminal and the winding terminal are arranged side by side along the outer peripheral edge of the substrate, and are passed through a hole penetrating the substrate and soldered.

Prior Art Document

[0006] In view of the above problems, the object of the present invention is to suppress poor conductivity at the terminal soldering portion caused by the mass of the elements mounted on the substrate. [Means for solving the problem]

[0007] To solve the above problems, the present invention provides an electrical device comprising a housing, a power consumption unit housed in the housing, and a substrate fixed to the end of the housing, wherein the substrate has a power supply terminal connected to the power consumption unit and a plurality of terminal soldering parts to which one terminal each is soldered, including a connector terminal held by the housing, and two fixing parts are provided to fix the edge of the substrate to the housing, wherein the distance between the largest mass element among the electronic elements fixed to the substrate and the nearest fixing part among the two fixing parts that is closest to the largest mass element is defined as the first distance, and the distance between the nearest fixing part and the nearest soldering part among the plurality of terminal soldering parts that is closest to the nearest fixing part is defined as the second distance, the first distance is characterized in that it is smaller than the second distance.

[0008] According to the present invention, since the housing and the substrate are fixed at two points, the deflection of the substrate is less than when they are fixed at one point. By reducing the deflection of the substrate, the stress applied to the terminal soldering area can be reduced, thereby suppressing damage to the terminal soldering area. Furthermore, in the present invention, the largest mass element fixed to the substrate and the fixing part closest to the largest mass element (proximity fixing part) The distance to the adjacent fixed part (first distance) is smaller than the distance between the terminal soldering part closest to the adjacent fixed part (adjacent soldering part) and the adjacent fixed part (second distance). This suppresses damage to the terminal soldering part caused by the moment force applied to the substrate from the largest mass element. In other words, with the above layout, the deflection of the adjacent soldering part is reduced, and the deflection of other terminal soldering parts is also reduced. Therefore, the stress applied to the terminal soldering parts can be reduced, and damage to the terminal soldering parts can be suppressed. Thus, poor conductivity at the terminal soldering parts can be suppressed.

[0009] In the present invention, it is preferable that the maximum mass element be positioned on a virtual line connecting the two fixed portions. This makes it less likely for the position where the moment force from the maximum mass element is applied to deform. Therefore, the maximum deformation of the substrate can be reduced, and thus the deflection of the terminal soldering portion can be reduced. As a result, damage to the terminal soldering portion can be suppressed, and poor conductivity at the terminal soldering portion can be suppressed.

[0010] In the present invention, when the substrate is divided into two regions, one side of the imaginary line connecting the two fixed portions is designated as the first region, and the side opposite the first region is designated as the second region, it is preferable that the maximum mass element be placed in the region with the smaller area between the first and second regions. In this way, the region to which the moment force from the maximum mass element is applied is less likely to deform. Therefore, the maximum deformation of the substrate can be reduced, and the deflection of the terminal soldering portion can be reduced. Thus, damage to the terminal soldering portion can be suppressed, and poor conductivity at the terminal soldering portion can be suppressed.

[0011] In the present invention, the substrate is circular or has a circular shape with a portion cut out, the imaginary line connecting the two fixing portions is located off-center from the center of the circle, and in the substrate, one side with respect to the imaginary line is designated as the first region, and the side opposite to the first region with respect to the imaginary line is designated as the second region. In this case, the maximum mass element is preferably placed in the region of the first and second regions that does not include the center. In this way, in a circular substrate, when the imaginary line connecting the fixing portions does not pass through the center of the substrate, the region to which the moment force from the maximum mass element is applied is less likely to deform. Therefore, the maximum deformation of the substrate can be reduced, and the deflection of the terminal soldering portion can be reduced. Thus, damage to the terminal soldering portion can be suppressed, and poor conductivity at the terminal soldering portion can be suppressed.

[0012] In the present invention, the plurality of terminal soldering portions comprises a first terminal soldering portion to which the connector terminals are soldered and a second terminal soldering portion to which the power supply terminals are connected. When the substrate is such that one side of a virtual line connecting the two fixed portions is designated as the first region and the side opposite to the first region with respect to the virtual line is designated as the second region, it is preferable that the first terminal soldering portion is located in one of the first and second regions, and the second terminal soldering portion is located in the other of the first and second regions. In this way, the first terminal soldering portion and the second terminal soldering portion are dispersed, making it easier to increase the distance between the fixed portion and the terminal soldering portion. Therefore, even if stress is generated in the fixed portion due to the difference in thermal expansion coefficients between the housing and the substrate, such stress is less likely to be transmitted to the terminal soldering portion. Thus, damage to the terminal soldering portion can be suppressed.

[0013] In the present invention, the element with the largest mass is a capacitor, and the electronic element includes a noise-cutting filter element with the next largest mass after the capacitor, and the first terminal soldering portion, the capacitor, and the noise-cutting filter element are arranged in the region with the smaller area of ​​the first region and the second region, and the noise-cutting filter elementThe capacitor can be positioned closer to the first terminal soldering area than the capacitor. In this configuration, both of the two large electronic elements (capacitor and noise-cutting filter element) can be placed on the side of the substrate where the amount of deformation is small, thereby reducing the maximum deformation of the substrate. Consequently, damage to the terminal soldering area can be suppressed. Furthermore, this arrangement allows the connector terminal (first terminal soldering area), noise filter element, and capacitor to be arranged on the substrate in that order, making it easy to connect the elements when configuring a power supply circuit on the substrate.

[0014] In the present invention, it is preferable that the fixing portion is fixed to the housing by screws or crimping. This allows the substrate to be firmly fixed to the housing.

[0015] In the present invention, the housing preferably comprises a wall portion surrounding the substrate, and in the two fixing portions, the screws penetrate the substrate and are fastened to the columnar portions provided in the housing at positions spaced apart from the wall portion, with the substrate in contact with these columnar portions. In this way, even if the housing expands or contracts due to temperature changes, the stress caused by such deformation is less likely to be transmitted from the wall portion to the substrate via the columnar portions. Therefore, damage to the terminal soldering portions on the substrate can be suppressed.

[0016] The electrical device according to the present invention can be used as a motor. In this case, the housing contains a stator having a stator core with a plurality of salient poles arranged in the circumferential direction and a coil wound around the salient poles. A rotor is positioned inside the stator. The power consumption unit is the coil, and the power supply terminal is a winding terminal connected to the coil. By energizing the coil, the rotor is rotated relative to the stator. In this way, damage to the soldered terminals and poor conductivity of the soldered terminals can be suppressed on the circuit board to which the motor's winding terminals and connector terminals are soldered.

[0017] The motor according to the present invention can be used in a pump device. In this case, the pump device is provided with an impeller that is rotationally driven by the above electrical device (i.e., the motor).

Advantages of the Invention

[0018] According to the present invention, since the housing and the substrate are fixed at two locations, the deflection of the substrate is less than that in the case of being fixed at one location. By reducing the deflection of the substrate, the stress applied to the terminal soldering portion can be reduced, so that damage to the terminal soldering portion can be suppressed. Further, in the present invention, the distance (first distance) between the maximum mass element fixed to the substrate and the fixing portion (proximity fixing portion) closest to the maximum mass element is smaller than the distance (second distance) between the terminal soldering portion (proximity soldering portion) closest to the proximity fixing portion and the proximity fixing portion. Thereby, damage to the terminal soldering portion caused by the moment force applied from the maximum mass element to the substrate can be suppressed. That is, due to the above layout, the deflection of the proximity soldering portion is reduced, and the deflection of the other terminal soldering portions is also small. Therefore, the stress applied to the terminal soldering portion can be reduced, and damage to the terminal soldering portion can be suppressed. Thus, poor conduction of the terminal soldering portion can be suppressed.

Brief Description of the Drawings

[0019] [Figure 1] It is a perspective view of a pump device to which the present invention is applied. [Figure 2] It is a cross-sectional view of the pump device shown in FIG. 1. [Figure 3] It is an exploded perspective view showing the state where the cover is removed from the pump device shown in FIG. 1. [Figure 4] It is an exploded perspective view showing the state where the substrate is removed from the state shown in FIG. 3. [Figure 5] It is an explanatory view showing the layout of the fixing portion for fixing the substrate to the housing, the terminal soldering portion, and the electronic element.

Embodiments for Carrying Out the Invention

[0020] Hereinafter, a motor and a pump device according to an embodiment of the present invention will be described with reference to the drawings. In the following description, the axial direction means the direction in which the central axis L of the motor 10 extends, the radial direction on the inner side and the outer side in the radial direction means the radial direction centered on the central axis L, and the circumferential direction means the rotational direction centered on the central axis L.

[0021] (Overall Configuration) FIG. 1 is a perspective view of a pump device 1 to which the present invention is applied. FIG. 2 is a cross-sectional view of the pump device 1 shown in FIG. 1. As shown in FIGS. 1 and 2, the pump device 1 includes a case 2 having a suction pipe 21 and a discharge pipe 22, a motor 10 disposed on one axial side L1 with respect to the case 2, and an impeller 25 disposed in a pump chamber 20 inside the case 2. The impeller 25 is rotationally driven around the central axis L by the motor 10. The motor 10 includes a cylindrical stator 3, a rotor 4 disposed inside the stator 3, a resin housing 6 covering the stator 3, and a round bar-shaped support shaft 5 that rotatably supports the rotor 4. The support shaft 5 is made of metal or ceramic. In the pump device 所1 of the present embodiment, the fluid flowing through the pump chamber 20 is a liquid, and the pump device 1 is used under conditions where the environmental temperature and the fluid temperature are likely to change.

[0022] As shown in FIG. 2, the pump chamber 20 is provided between the case 2 and the housing 6. The case 2 constitutes a wall surface 23 on the other axial side L2 of the pump chamber 20 and a side wall 29 extending in the circumferential direction. As shown in FIG. 1, the case 2 includes a suction pipe 21 extending along the central axis L of the motor 10 and a discharge pipe 22 extending in a direction orthogonal to the central axis L of the motor 10. The suction pipe 21 is provided concentrically with respect to the central axis L.

[0023] In the motor 10, the stator 3 has a stator core 31, insulators 32 and 33 held by the stator core 31, and coils 35 wound around the stator core 31 via the insulators 32 and 33.

[0024] The rotor 4 includes a cylindrical portion 40 extending along the central axis L. The cylindrical portion 40 extends from the radially inner side of the stator 3 toward the pump chamber 20 and opens in the pump chamber 20. A cylindrical magnet 47 is held on the outer circumferential surface of the cylindrical portion 40. The magnet 47 faces the stator 3 radially inward. The magnet 47 is, for example, a neodymium bonded magnet.

[0025] In the rotor 4, a disc-shaped flange portion 45 is formed at the other end L2 in the axial direction of the cylindrical portion 40, and a disc 26 is connected to the flange portion 45 from the other L2 in the axial direction. A central hole 260 is formed in the center of the disc 26. On the surface of the disc 26 facing the flange portion 45, a plurality of blade portions 261 are formed at equal angular intervals, extending radially outward from around the central hole 260 in an arc shape, and the disc 26 is fixed to the flange portion 45 via the blade portions 261. Thus, the flange portion 45 and the disc 26 constitute the impeller 25 connected to the cylindrical portion 40 of the rotor 4. In this embodiment, the disc 26 is inclined toward the flange portion 45 as it extends radially outward.

[0026] In the rotor 4, a cylindrical radial bearing 11 is held radially inside the cylindrical portion 40 by a method such as crimping. The rotor 4 is rotatably supported on the support shaft 5 via the radial bearing 11. One end L1 of the support shaft 5 in the axial direction is held in a shaft hole 65 formed in the bottom wall 63 of the housing 6. The case 2 has a receiving portion 280 formed on the other end L2 of the support shaft 5, facing the pump chamber 20 and limiting the range of motion of the support shaft 5 toward the pump chamber 20. The case 2 is equipped with three support portions 27 extending from the inner circumferential surface of the suction pipe 21 toward the motor 10. A cylindrical portion 28 is formed at the end of the support portion 27, with the support shaft 5 positioned inside, and the receiving portion 280 is provided at the bottom of the other L2 in the axial direction of the cylindrical portion 28. An annular thrust bearing 12 is mounted on the other end L2 of the support shaft 5, and the thrust bearing 12 is positioned between the radial bearing 11 and the cylindrical portion 28. Here, at least a portion of the end L1 of the support shaft 5 and the shaft hole 65 have a D-shaped cross-section. Also, the end L2 of the support shaft 5 and the hole of the thrust bearing 12 have a D-shaped cross-section. Therefore, rotation of the support shaft 5 and the thrust bearing 12 relative to the housing 6 is prevented.

[0027] The housing 6 is a resin sealing member 60 that covers the stator 3 from both radial and axial sides. The resin sealing member 60 is made of polyphenylene sulfide (PPS). The stator 3 is integrated with the resin sealing member 60 by insert molding. The housing 6 is a partition member having a first partition wall portion 61 facing the wall surface 23 on the other axial side L2 of the pump chamber 20, a second partition wall portion 62 interposed between the stator 3 and the magnet 47, and a bottom wall 63 provided at one end L1 of the second partition wall portion 62. The housing 6 also includes a cylindrical body portion 66 that covers the stator 3 from the outside in the radial direction.

[0028] Figure 3 is an exploded perspective view showing the pump device 1 shown in Figure 1 with the cover 18 removed. Figure 4 is an exploded perspective view showing the circuit board 19 removed from the state shown in Figure 3. Note that Figures 3 and 4 are views from a direction that is inverted axially with respect to Figures 1 and 2, with one side L1 in the axial direction being the upper side of the drawing.

[0029] As shown in Figures 2 and 3, a cover 18 is fixed to one end L1 of the housing 6 from the axial side L1. A circuit board 19, which controls the power supply to the coil 35, is placed between the cover 18 and the bottom wall 63 of the housing 6.

[0030] As shown in Figures 3 and 4, the substrate 19 and the housing 6 are provided with two fixing parts for fixing the edge of the substrate 19 to the housing 6. In this embodiment, the fixing parts include a first fixing part 97 and a second fixing part 98 spaced circumferentially apart from the first fixing part 97. The second fixing part 98 is provided at a position circumferentially offset from the radially opposite position to the first fixing part 97. The housing 6 includes a first columnar part 67 protruding from the bottom wall 63 to one side L1 in the axial direction, and a second columnar part 68 protruding from the bottom wall 63 to one side L1 in the axial direction at a position circumferentially spaced apart from the first columnar part 67. In addition, the edge of the substrate 19 is provided with two notches 197 and 198 spaced circumferentially apart. The first fixing part 97 is formed by fastening a first screw 91, which passes through one notch 197, to the first columnar part 67, and the second fixing part 98 is formed by fastening a second screw 92, which passes through the other notch 198, to the second columnar part 68. The first screw 91 and the second screw 92 are tapping screws.

[0031] The circuit board 19 is provided with multiple first terminal soldering sections 191, to which metal winding terminals 71 protruding from the stator 3 through the bottom wall 63 of the housing 6 and onto one side L1 in the axial direction are connected by solder, and second terminal soldering sections 192, to which metal connector terminals 75 held by the housing 6 are connected by solder. The circuit board 19 is mounted with a circuit that electrically connects the second terminal soldering sections 192 and the first terminal soldering sections 191. The circuit mounted on the circuit board 19 consists of multiple electronic elements, including the first electronic element E1, second electronic element E2, and third electronic element E3 described later, and a wiring pattern (see Figure 5).

[0032] The housing 6 includes a cylindrical connector housing 69 that extends radially outward from a body portion 66 surrounding the outer circumference of the stator 3. The connector terminals 75 are bent such that one end is connected to the circuit board 19 and the other end is located inside the connector housing 69. Therefore, when the connector is connected to the connector housing 69, the drive current generated by the circuit mounted on the circuit board 19 is supplied to each coil 35 via the first terminal soldering portion 191 and the winding terminals 71. As a result, the rotor 4 rotates around the central axis L of the motor 10. This causes the impeller 25 to rotate inside the pump chamber 20, creating negative pressure inside the pump chamber 20, so that fluid is drawn into the pump chamber 20 from the suction pipe 21 and discharged from the discharge pipe 22.

[0033] As shown in Figure 2, in the stator 3, the stator core 31 comprises an annular portion 311 extending in an annular shape and a plurality of salient poles 312 projecting radially inward from the annular portion 311. The salient poles 312 are arranged circumferentially at a constant pitch. The stator core 31 is made of a magnetic material. This is a laminated core formed by stacking thin magnetic plates. In this embodiment, the stator core 31 is manufactured by bending a linearly extending member into an annular shape and then welding the ends of the annular portion 311 together.

[0034] Insulator 32 overlaps the stator core 31 from one side L1 in the axial direction, and insulator 33 overlaps the stator core 31 from the other side in the axial direction. Insulators 32 and 33 each comprise a plurality of segmented insulators 320 and 330, which are divided circumferentially to correspond to each of the plurality of salient poles 312. Each segmented insulator 320 comprises an outer peripheral portion 321 that overlaps the annular portion 311 of the stator core 31 from the axial direction, an inner peripheral portion 322 that protrudes axially from the radially inner end of the salient pole 312, and a cylindrical portion forming portion 323 that connects the outer peripheral portion 321 and the inner peripheral portion 322. Similarly, each segmented insulator 330 comprises an outer peripheral portion 331 that overlaps the annular portion 311 of the stator core 31 axially, an inner peripheral portion 332 that protrudes axially from the radially inner end of the salient pole 312, and a cylindrical portion 333 that connects the outer peripheral portion 331 and the inner peripheral portion 332. The coil 35 is wound around the salient pole 312 via the cylindrical portions 323 and 333.

[0035] Motor 10 is a three-phase motor. Therefore, the multiple coils 35 are composed of U-phase coils, V-phase coils, and W-phase coils. The U-phase coils, V-phase coils, and W-phase coils are arranged sequentially in the circumferential direction. In this embodiment, there are three of each of the U-phase coils, V-phase coils, and W-phase coils, for a total of nine coils 35. Therefore, there are nine divided insulators 320 and 330, and the nine divided insulators 320 and 330 have the same configuration.

[0036] In this configuration, the three U-phase coils are each composed of a single winding 350. The V-phase and W-phase coils are constructed similarly. As shown in Figure 2, the outer surface of the outer peripheral portion 321 of the nine divided insulators 330 is provided with guide grooves 335 for arranging the windings 350 (jumping wires) that extend circumferentially when winding the coils 35.

[0037] (Winding terminals) As shown in Figure 4, the housing 6 holds four winding terminals 71 (71(U), 71(V), 71(W), 71(C)). Each winding terminal 71 is arranged circumferentially along the inner surface of the body portion 66. Each of the four winding terminals 71 comprises a plate portion 710 oriented radially in the thickness direction, a substrate connection portion 711 extending axially on one side L1 of the plate portion 710 in the axial direction, and an elastic portion 712 that meanders in a shape that folds back circumferentially between the plate portion 710 and the substrate connection portion 711. The winding terminal 71 also comprises a leg portion (not shown) extending from the plate portion 710 to the other side L2 in the axial direction and held by the split insulator 320, and a winding holding portion (not shown) bent to hold the winding 350. Most of the plate portion 710 and the winding holding portion are covered by the housing 6 (resin sealing member 60) by insert molding, and the elastic portion 712 and the substrate connection portion 711 protrude to one side L1 of the bottom wall 63 of the housing 6.

[0038] A split insulator 320 corresponding to one of the three U-phase coils holds a winding terminal 71(U) connected to the starting end of one winding 350 that constitutes the U-phase coil. A split insulator 320 corresponding to one of the three V-phase coils holds a winding terminal 71(V) connected to the starting end of one winding 350 that constitutes the V-phase coil. A split insulator 320 corresponding to one of the three W-phase coils holds a winding terminal 71(W) connected to the starting end of one winding 350 that constitutes the W-phase coil. Furthermore, another split insulator 320 holds a common terminal (not shown) and a winding terminal 71(C) connected to the common terminal.

[0039] As shown in Figure 3, insert the circuit board connection portion 711 of the winding terminal 71 into the hole in the circuit board 19 and solder it. This constitutes the second terminal soldering portion 192. The winding terminal 71 has an elastic portion 712 between the plate portion 710, which is fixed to the divided insulator 320 via the legs, and the board connection portion 711, which is soldered to the substrate 19. As a result, the elastic portion 712 can absorb the stress applied to the winding terminal 71. Therefore, the transmission of stress from the winding terminal 71 to the substrate 19 can be suppressed by the elastic portion 712. For example, when the substrate 19 bends due to stress applied to the substrate 19, it is possible to suppress the stress applied to the second terminal soldering portion 192 and damage to the solder of the second terminal soldering portion 192. Also, when the motor 10 is driven, even if the heat generated in the coil 35 is transmitted to the winding terminal 71 and the winding terminal 71 expands due to thermal expansion, it is possible to suppress the application of stress to the substrate 19 via the winding terminal 71, thereby suppressing the bending of the substrate 19 and damage to the circuit. Furthermore, when the stator 3 is sealed in resin, even if the winding terminals 71 expand due to heat from the resin, it is possible to suppress the application of stress to the substrate 19 via the winding terminals 71, thereby preventing the substrate 19 from bending and damaging the circuit.

[0040] (substrate) Figure 5 is an explanatory diagram showing the fixing part for fixing the substrate 19 to the housing 6, the terminal soldering part, and the layout of the electronic components. In this specification, the direction perpendicular to the central axis L of the motor 10 is called the first direction X, and the direction perpendicular to the central axis L and perpendicular to the first direction X is called the second direction Y. The second direction Y is the direction connecting the circumferential center of the connector housing 69 and the central axis L of the motor 10. In Figure 5, the center line Cx of the substrate 19 in the first direction X and the center line Cy of the substrate 19 in the second direction Y are shown as dashed lines. The intersection of the center lines Cx and Cy is the center point P of the substrate 19. The central axis L of the motor 10 intersects the center point P of the substrate 19.

[0041] As shown in Figures 3, 4, and 5, the substrate 19 has a planar shape in which a part of a circle centered on the central axis L of the motor 10 is cut out by a straight line perpendicular to the radial direction. Therefore, the outer edge of the substrate 19 has an arc portion 19a and a straight portion 19b perpendicular to the radial direction. The end 64 on one side L1 of the housing 6 has an arc-shaped wall portion 640 surrounding the arc portion 19a of the substrate 19 and a planar portion 641 extending linearly along the straight portion 19b of the substrate 19 (see Figure 4). The planar portion 641 extends in the first direction X and is located radially inward of the connector housing 69.

[0042] The outer edge of the substrate 19 is provided with locking recesses 199 into which locking projections 645, which protrude radially inward from the arc-shaped wall portion 640, fit. The substrate 19 is positioned in the circumferential direction by the locking projections 645 and the locking recesses 199. As shown in Figure 5, the locking projections 645 and locking recesses 199 are arranged at three locations spaced apart in the circumferential direction on one side L1 of the second direction Y (i.e., radially opposite to the straight portion 19b) with respect to the center line Cx of the substrate 19 in the first direction X. The locking projection 645 and locking recess 199 located in the center in the circumferential direction are positioned near the center line Cx. The other two locking projections 645 and locking recesses 199 are positioned on the opposite side of the center line Cx and are positioned near the center line Cy.

[0043] The two fixing parts (first fixing part 97 and second fixing part 98) that secure the circuit board 19 to the housing 6, and the multiple first terminal soldering parts 191 and multiple second terminal soldering parts 192 are arranged along the outer edge of the circuit board 19.

[0044] As shown in Figure 5, the first fixing part 97 and the second fixing part 98 are positioned symmetrically with respect to the center line Cx in the first direction X. The first fixing part 97 is positioned X1 to one side of the center of the substrate 19 in the first direction X, and the second fixing part 98 is positioned X2 to the other side of the center of the substrate 19 in the first direction X. Furthermore, the first fixing part 97 and the second fixing part 98 are positioned off-center from the center of the substrate 19 in the second direction Y, and are positioned Y2 to the other side of the second direction Y from the center line Cy in the second direction Y.

[0045] Figure 5 shows a dashed-dot line S connecting the first fixing part 97 and the second fixing part 98. The dashed-dot line S extends in the first direction X and is perpendicular to the second direction Y. The dashed-dot line S is located off-center from the intersection of the center lines Cx and Cy (i.e., the center point P of the substrate 19) and is shifted to the other side Y2 of the second direction Y relative to the center point P.

[0046] Multiple first terminal soldering points 191 are located on one side Y1 of the second direction Y with respect to the virtual line S. In this embodiment, there are 4 winding terminals 71, and there are 4 first terminal soldering points 191. The 4 first terminal soldering points 191 are arranged circumferentially along the arc portion 19a. The 4 first terminal soldering points 191 are distributed in a manner with respect to the center line Cx of the substrate 19 in the first direction X, with 2 points each on one side X1 and the other side X2 of the first direction X.

[0047] Multiple second terminal soldering points 192 are located on the other side Y2 of the second direction Y with respect to the virtual line S. In this embodiment, there are 4 connector terminals 75, and there are 4 second terminal soldering points 192. The 4 second terminal soldering points 192 are arranged at regular intervals along the straight section 19b in the first direction X. The 4 second terminal soldering points 192 are distributed in a manner with respect to the center line Cx of the substrate 19 in the first direction X, with 2 points each on one side X1 and the other side X2 of the first direction X.

[0048] Thus, in this embodiment, both the angular range in which the multiple first terminal soldering portions 191 are arranged and the angular range in which the multiple second terminal soldering portions 192 are arranged are regions that include the center of the first direction X of the substrate 19.

[0049] (Layout of electronic components) The substrate 19 has a circuit mounted on it for supplying drive current to the coil 35, and on the substrate side opposite to the cover 18, multiple electronic elements, including the first electronic element E1, the second electronic element E2, and the third electronic element E3, are mounted. In Figure 5, the positions where the first electronic element E1, the second electronic element E2, and the third electronic element E3 are fixed are indicated by dashed lines.

[0050] The first electronic element E1 is the largest mass element among the electronic elements placed on the substrate 19. The second electronic element E2 is the second largest mass element among the electronic elements placed on the substrate 19. The third electronic element E3 is the third largest mass element among the electronic elements placed on the substrate 19. In this embodiment, the first electronic element E1 (largest mass element) is a capacitor. The second electronic element E2 is a noise-cutting filter element. The third electronic element E3 is an IC element. The mass of the first electronic element E1 is, for example, 0.82 g. The mass of the second electronic element E2 is, for example, 0.5 g. The mass of the third electronic element E3 is, for example, 0.13 g. Note that the type (function) and mass of each electronic element may differ from those described above.

[0051] In this embodiment, considering the deflection of the substrate 19 due to the moment force applied to the substrate 19 by the large mass electronic elements, the arrangement of electronic elements and terminal soldering parts on the substrate 19 is as shown in Figure 5. As shown in Figure 5, the first electronic element E1, which is the largest mass element, is located on the other side X2 of the center line Cx in the first direction X. Therefore, if the nearest fixing part to the first electronic element E1, which is the largest mass element, is designated as the adjacent fixing part A, then in the arrangement shown in Figure 5, the adjacent fixing part A is the second fixing part 98.

[0052] Furthermore, if we define the nearest soldering point B as the point closest to the nearest fixing point A (second fixing point 98) among all the terminal soldering points, then in the arrangement shown in Figure 5, the nearest soldering point B is the first terminal soldering point 191 adjacent to the nearest fixing point A on one side CW in the circumferential direction. The nearest soldering point B is one of four first terminal soldering points 191 that are arranged circumferentially at the end of the substrate on the other side Y2 in the second direction Y. Of the 1s, this is the first terminal soldering portion 191 located on the other side CCW in the circumferential direction.

[0053] When the distance between the proximity fixing part A and the first electronic element E1 (maximum mass element) is set as the first distance d1, and the distance between the proximity fixing part A and the proximity solder part B is set as the second distance d2, the first electronic element E1 is arranged at a position satisfying the condition d1 < d2. When vibration is applied to the substrate 19, since the moment force applied to the position of the first electronic element E1 is large, the position of the first electronic element E1 deflects greatly. In this embodiment, since a layout satisfying d1 < d2 is adopted, the deflection of the substrate 19 at the position of the proximity solder part B is smaller than the deflection at the position of the first electronic element E1. Also, since the distances between the other terminal soldering parts and the proximity fixing part A are all larger than d2, the deflection of the substrate 19 at the other terminal soldering parts is even smaller.

[0054] The first electronic element E1 (maximum mass element) is located on the virtual line S. Here, "being located on the virtual line S" means that it is sufficient if a part of the electronic element is located on the virtual line S, and it is not limited to an arrangement where the center of gravity of the electronic element is located on the virtual line S. In the arrangement shown in FIG. 5, the center of gravity P1 of the first electronic element E1 is not on the virtual line S but is shifted to the other side Y2 in the second direction Y from the virtual line S, but a part of the first electronic element E1 is located on the virtual line S. Since the substrate 19 is fixed to the housing 6 at two locations, the substrate 19 deflects around the virtual line S connecting the two fixing points. Therefore, if the position where the moment force from the electronic element is applied is on the virtual line S, the deflection of the substrate 19 is small.

[0055] In the substrate 19, of the two regions partitioned by the virtual line S, the region that does not include the center point P of the substrate 19 is defined as the first region S1, and the region where the center point P is located is defined as the second region S2. Then, the area of the first region S1 is smaller than that of the second region S2. In this embodiment, the first electronic element E1, the second electronic element E2, and the third electronic element E3 are all arranged on the virtual line S or within the first region S1.

[0056] When a large-mass electronic element is placed off the imaginary line S, it is placed in the smaller area of ​​the first area S1 and the second area S2. In this embodiment, the second electronic element E2, which has the second largest mass, is placed in the first area S1. Since a smaller area area has less deflection, placing a large-mass electronic element in the first area S1 reduces the deflection of the substrate 19.

[0057] In the arrangement shown in Figure 5, the second electronic element E2 (noise-cutting filter element) is positioned closer to the first terminal soldering portion 191 than the first electronic element E1 (capacitor). More specifically, the second electronic element E2 is located on the other side Y2 of the second direction Y relative to the first electronic element E1, and the second terminal soldering portion 192, which is connected to the connector terminal 75, is located on the other side Y2 of the second direction Y relative to the second electronic element E2. When configuring the power supply circuit, the current supplied from the connector terminal 75 is supplied to the first electronic element E1 (capacitor) via the second electronic element E2 (noise-cutting filter element).

[0058] The third electronic element E3 is located on the virtual line S. The third electronic element E3 is located on one side X1 of the center line Cx in the first direction X.

[0059] (Main effects and benefits of this form) As described above, the pump device 1 of this embodiment comprises a motor 10 and an impeller 25 that is rotationally driven by the motor 10. The motor 10 has a housing 6 that houses the stator 3 and a substrate 19 fixed to the end of the housing 6. The substrate 19 has a plurality of first terminal soldering parts 191 to which a plurality of winding terminals 71 connected to the coil 35 of the stator 3 are soldered one by one, and a plurality of second terminal soldering parts 192 to which a plurality of connector terminals 75 held by the housing 6 are soldered one by one. The edge of the substrate 19 is fixed to the housing 6. Two fixing points are provided: a first fixing point 97 and a second fixing point 98. The first distance d1 is defined as the distance between the first electronic element E1, which is the largest mass element among the electronic elements fixed to the substrate 19, and the nearest fixing point A (second fixing point 98) that is closest to the largest mass element (first electronic element E1) among the two fixing points. The second distance d2 is defined as the distance between the nearest fixing point A and the nearest soldering point B that is closest to the nearest fixing point A among the multiple first terminal soldering points 191 and multiple second terminal soldering points 192. In this case, the first distance d1 is smaller than the second distance d2.

[0060] In this embodiment, the housing 6 and the substrate 19 are fixed at two points. Therefore, when vibration is applied to the substrate 19 due to disturbances, etc., the deflection of the substrate 19 is less than when the substrate 19 is fixed at only one point. When the substrate 19 is less likely to deflect, cracks are less likely to occur in the solder on the substrate 19. Therefore, cracks are less likely to occur in the solder of the first terminal soldering portion 191 and the second terminal soldering portion 192, and thus poor conductivity of the first terminal soldering portion 191 and the second terminal soldering portion 192 can be suppressed.

[0061] Furthermore, in this embodiment, the distance (first distance d1) between the largest mass element (first electronic element E1) fixed to the substrate 19 and the adjacent fixing part A is smaller than the distance (second distance d2) between the adjacent solder part B and the adjacent fixing part A. This allows the deflection of the substrate 19 caused by the moment force applied from the largest mass element to be reduced at the location of the adjacent solder part B. Moreover, the deflection at the locations of the other terminal soldering parts is even less than the deflection at the location of the adjacent solder part B. Therefore, damage to the first terminal soldering part 191 and the second terminal soldering part 192 caused by the moment force applied to the substrate 19 from the mass point of the largest mass element (i.e., the occurrence of solder cracks) can be suppressed, and thus poor conductivity of the first terminal soldering part 191 and the second terminal soldering part 192 can be suppressed.

[0062] In this embodiment, since the largest mass element (first electronic element E1) is positioned on a virtual line S connecting the first fixed part 97 and the second fixed part 98, the substrate 19 is less likely to deform at the position where the moment force from the first electronic element E1 is applied. Therefore, the amount of deformation of the substrate 19 can be reduced, and the deflection of the first terminal soldering part 191 and the second terminal soldering part 192 can be reduced. Thus, damage to the first terminal soldering part 191 and the second terminal soldering part 192 can be suppressed, and poor conductivity of the first terminal soldering part 191 and the second terminal soldering part 192 can be suppressed.

[0063] In this embodiment, when the substrate 19 is configured such that one side of the imaginary line S connecting the first fixing portion 97 and the second fixing portion 98 is designated as the first region S1, and the side opposite to the first region S1 with respect to the imaginary line S is designated as the second region S2, the largest mass element (first electronic element E1) is placed in the region with the smaller area (first region S1) of the first region S1 and the second region S2. Therefore, the substrate 19 is less prone to deformation because the area of ​​the region to which the moment force from the first electronic element E1 is applied is small. As a result, the amount of deformation of the substrate 19 can be reduced, and the deflection of the first terminal soldering portion 191 and the second terminal soldering portion 192 can be reduced. Thus, damage to the first terminal soldering portion 191 and the second terminal soldering portion 192 can be suppressed.

[0064] More specifically, the substrate 19 in this embodiment has a circular shape with a portion cut out, and the imaginary line S connecting the first fixing portion 97 and the second fixing portion 98 is located off-center from the center point P of the circle. If the substrate 19 is divided into a first region S1 on one side with respect to the imaginary line S and a second region S2 on the opposite side of the imaginary line S, the first electronic element E1 is placed in the region of the substrate 19 that does not include the center point P. With this configuration, the region to which the moment force from the first electronic element E1 is applied is less likely to deform, and the amount of deformation of the substrate 19 is reduced. Therefore, damage to the first terminal soldering portion 191 and the second terminal soldering portion 192 located at the edge of the substrate 19 can be suppressed.

[0065] In this embodiment, the substrate 19 includes a first terminal soldering section 191 to which the connector terminals 75 are soldered, and a second terminal soldering section 192 to which the winding terminals 71 are connected. The layout of these terminal soldering sections on the substrate 19 is such that, when one side of a virtual line S connecting the first fixing section 97 and the second fixing section 98 is designated as the first region S1 and the side opposite to the virtual line S is designated as the second region S2, the second terminal soldering section 192 is located in the first region S1 and the first terminal soldering section 191 is located in the first region S1. In this way, the terminal soldering sections (first terminal soldering section 191 and second terminal soldering section 192) can be distributed on both sides of the virtual line S, making it easier to increase the distance between the fixing sections (first fixing section 97, second fixing section 98) and the terminal soldering sections. Therefore, even if stress is generated in the fixed part due to the difference in thermal expansion coefficients between the housing 6 and the substrate 19, this stress is less likely to be transmitted to the first terminal soldering part 191 and the second terminal soldering part 192, thus the first terminal soldering part 191 and the second terminal soldering part 192 are less likely to be damaged.

[0066] Furthermore, in this embodiment, the first terminal soldering portion 191 and the second terminal soldering portion 192 are positioned in regions including the center of the substrate 19 in the first direction X, in the first region S1 and the second region S2, respectively. Therefore, the first terminal soldering portion 191 and the second terminal soldering portion 192 are spaced apart in the second direction Y from the first fixing portion 97 and the second fixing portion 98, respectively. Thus, even if stress is generated in the first fixing portion 97 and the second fixing portion 98 due to the difference in thermal expansion coefficients between the resin housing 6 and the substrate 19, such stress is less likely to be transmitted to the first terminal soldering portion 191 and the second terminal soldering portion 192, making them less susceptible to damage.

[0067] In this embodiment, the largest mass element (first electronic element E1) is a capacitor. The electronic elements mounted on the substrate 19 include a noise-cutting filter element (second electronic element E2), which has the second largest mass after the capacitor (first electronic element E1), and the first electronic element E1 and the second electronic element E2 are arranged in the first region S1. The noise-cutting filter element is positioned closer to the second terminal soldering area 192 than the capacitor (first electronic element E1). In this way, both of the two large mass electronic elements are placed in the first region S1 (a region with a small area). Therefore, the deflection of the substrate 19 is small, and damage to the first terminal soldering area 191 and the second terminal soldering area 192 can be suppressed. In addition, this arrangement results in a sequence of connector terminal 75 (second terminal soldering area 192), noise filter element, and capacitor, making it easy to connect the elements when configuring a power supply circuit.

[0068] In this embodiment, the first fixing part 97 and the second fixing part 98 are configured to fix the substrate 19 to the housing 6 with screws, but the fixing method is not limited to screws. For example, a configuration in which a crimping part is provided at the end 64 of the housing 6 and the substrate 19 is fixed by crimping may be adopted. By fixing with screws or crimping, the substrate 19 can be firmly fixed to the housing 6. Alternatively, the substrate 19 may be fixed by sandwiching the end of the substrate 19 between the cover 18 and the housing 6.

[0069] In this embodiment, the housing 6 is provided with a wall portion 640 surrounding the substrate 19, and the first fixing portion 97 and the second fixing portion 98 are fastened to the first columnar portion 67 and the second columnar portion 68, respectively, which are located in the housing 6 at positions radially inward from the wall portion 640, with the substrate 19 in contact with them, by the first screw 91 and the second screw 92 passing through the substrate 19 and fastening to the first columnar portion 67 and the second columnar portion 68. In this way, even if the housing 6 expands or contracts due to temperature changes, the stress caused by such deformation is less likely to be transmitted from the wall portion 640 to the substrate 19 via the first columnar portion 67 and the second columnar portion 68. Therefore, damage to the first terminal soldering portion 191 and the second terminal soldering portion 192 caused by deformation of the substrate 19 can be suppressed.

[0070] In this embodiment, when viewed from the axial direction, at least a part of the first columnar portion 67, and At least a portion of the second columnar portion 68 overlaps the annular portion 311 of the stator core 31. Here, since the stator core 31 holds a plurality of divided insulators 320, when viewed from the axial direction, at least a portion of the first columnar portion 67 and at least a portion of the second columnar portion 68 can be configured to overlap the annular portion 311 of the stator core 31 via the space between two adjacent divided insulators 320. In this way, even if the housing 6 expands or contracts due to temperature changes, the deformation of the first columnar portion 67 and the second columnar portion 68 can be suppressed by the stator core 31. Therefore, the expansion or contraction of the housing 6 is less likely to be transmitted to the substrate 19 via the first columnar portion 67 and the second columnar portion 68.

[0071] [Other embodiments] In the above embodiment, the present invention was applied to a motor 10 comprising a housing 6 that houses a stator 3 and a substrate 19 fixed to the housing 6, wherein the stator 3 comprises a coil 35 as a power consumption unit and a winding terminal 71 as a power supply terminal to the coil 35. However, the present invention is also applicable to electrical devices other than the motor 10. That is, the present invention is applicable to an electrical device having a housing, a power consumption unit housed in the housing, and a substrate fixed to the end of the housing, wherein the substrate has multiple terminal soldering sections to which one terminal each is soldered, including power supply terminals connected to the power consumption unit and connector terminals held by the housing. The power consumption unit can be any electrical or electronic component or unit to which current is supplied from terminals connected to the substrate.

[0072] Furthermore, although the motor 10 in this embodiment is used in the pump device 1, the present invention is also applicable to motors used in equipment other than the pump device 1. [Explanation of Symbols]

[0073] 1...Pump device, 2...Case, 3...Stator, 4...Rotor, 5...Support shaft, 6...Housing, 10...Motor, 11...Radial bearing, 12...Thrust bearing, 18...Cover, 19...Base plate, 19a...Arch section, 19b...Straight section, 20...Pump chamber, 21...Suction pipe, 22...Discharge pipe, 23...Wall surface, 25...Impeller, 26...Disc, 27...Support section, 28...Cylindrical section, 29...Side wall, 31...Stator core, 32, 33...Insulator, 35...Coil 40...Cylindrical section, 45...Flange section, 47...Magnet, 60...Resin sealing member, 61...First partition section, 62...Second partition section, 63...Bottom wall, 64...End section, 65...Shaft hole, 66...Body section, 67...First columnar section, 68...Second columnar section, 69...Connector housing, 71, 71(U), 71(V), 71(W)..., 71(C) Winding terminal, 75...Connector terminal, 97...First fixing section, 98...Second fixing section, 191...First terminal soldering section, 192...Second terminal solder Attachment part, 197, 198... Notch, 199... Locking recess, 260... Central hole, 261... Wing part, 280... Receiving part, 311... Annular part, 312... Salient pole, 320, 330... Split insulator, 321, 331... Outer circumference part, 322, 332... Inner circumference part, 323, 333... Cylindrical part forming part, 335... Guide groove, 350... Winding, 640... Wall part, 641... Flat part, 645... Locking projection, 710... Plate part, 711... Substrate connection part, 712... Elastic Part, A...proximity fixing part, B...proximity soldering part, CW...one side in the circumferential direction, CCW...the other side in the circumferential direction, Cx...center line, Cy...center line, d1...first distance, d2...second distance, E1...first electronic element, E2...second electronic element, E3...third electronic element, L...central axis, L1...one side in the axial direction, L2...the other side in the axial direction, P...center point of the substrate, P1...centroid of the first electronic element, S...virtual line, S1...first region, S2...second region, X...first direction, Y...second direction

Claims

1. It comprises a housing, a power consumption unit housed in the housing, and a substrate fixed to the end of the housing, The substrate includes a power supply terminal connected to the power consumption unit and a plurality of terminal soldering sections to which one terminal each is soldered, including a connector terminal held in the housing. Two fixing portions are provided for fixing the edge of the substrate to the housing. The distance between the largest mass element among the electronic elements fixed to the substrate and the closest proximity fixing part among the two fixing parts to the largest mass element is defined as the first distance. When the distance between the aforementioned proximity fixing portion and the proximity soldering portion that is closest to the proximity fixing portion among the plurality of terminal soldering portions is defined as the second distance, An electrical device characterized in that the first distance is smaller than the second distance.

2. The electrical device according to claim 1, characterized in that the maximum mass element is arranged on a virtual line connecting the two fixed portions.

3. In the aforementioned substrate, when one side of a virtual line connecting the two fixing portions is designated as the first region, and the side opposite to the first region with respect to the virtual line is designated as the second region, The electrical device according to claim 1, characterized in that the maximum mass element is arranged in the region with the smaller area among the first region and the second region.

4. The substrate is circular or has a circular shape with a part of it cut out. The imaginary line connecting the two fixed parts is located off-center from the circle. In the substrate, when one side with respect to the virtual line is designated as the first region and the side opposite to the first region with respect to the virtual line is designated as the second region, The electrical device according to claim 1, characterized in that the maximum mass element is arranged in the region of the first region and the second region that does not include the center.

5. The plurality of terminal soldering sections include a first terminal soldering section to which the connector terminals are soldered, and a second terminal soldering section to which the power supply terminals are connected. In the aforementioned substrate, with respect to the imaginary line connecting the two fixed portions, one side is designated as the first region. When the area opposite to the first region with respect to the aforementioned imaginary line is defined as the second region, The first terminal soldering portion is located in one of the first region and the second region. The electrical device according to claim 1, characterized in that the second terminal soldering portion is arranged in the other of the first region and the second region.

6. The element with the largest mass is a capacitor, and the electronic elements include a noise-cutting filter element which has the next largest mass after the capacitor. The first terminal soldering portion, the capacitor, and the noise cut filter element are arranged in the region with the smaller area of ​​the first region and the second region. The electrical device according to claim 5, characterized in that the noise cut filter element is positioned closer to the first terminal soldering portion than the capacitor.

7. The electrical device according to any one of claims 1 to 6, characterized in that the fixing part is fixed to the housing by screws or crimping.

8. The housing comprises a wall portion surrounding the substrate, The electrical device according to claim 7, characterized in that at the two fixing points, the screw penetrates the substrate and fastens to the columnar portion provided in the housing at a position spaced apart from the wall portion, with the substrate in contact with the columnar portion.

9. The housing contains a stator comprising a stator core having a plurality of salient poles arranged in the circumferential direction and coils wound around the salient poles, and a rotor is positioned inside the stator. The power consumption unit is the coil, The power supply terminal is a winding terminal connected to the coil, The electrical device according to any one of claims 1 to 8, characterized in that it is a motor that rotates the rotor relative to the stator by energizing the coil.

10. A pump device comprising an electrical device as described in claim 9, and an impeller that is rotationally driven by the electrical device.

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