Grinding device

The grinding device addresses the challenges of attaching and detaching grinding wheels by using a detachable mechanism with a wheel cover and coupling portions for one-touch operations, ensuring safe and efficient use of general-purpose grinding wheels.

JP7841894B2Active Publication Date: 2026-04-07TOKYO SEIMITSU CO LTD
View PDF 5 Cites 0 Cited by

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2022-02-02
Publication Date
2026-04-07

AI Technical Summary

Technical Problem

Existing grinding devices for semiconductor wafers face challenges in safely and efficiently attaching and detaching grinding wheels due to unstable connections, risk of damage during manual handling, and the need for specialized grinding wheels, limiting the use of general-purpose products.

Method used

A grinding device with a detachable mechanism featuring a wheel cover and coupling portions at the axial centers of the spindle flange and wheel cover, allowing for one-touch attachment and detachment of the grinding wheel, while protecting the grinding wheel during operations.

Benefits of technology

Enables safe and efficient attachment and detachment of grinding wheels, protecting the grinding wheel from damage and allowing for the use of general-purpose products, enhancing operational safety and efficiency.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 0007841894000001
    Figure 0007841894000001
  • Figure 0007841894000002
    Figure 0007841894000002
  • Figure 0007841894000003
    Figure 0007841894000003
Patent Text Reader

Abstract

To provide a grinder in which a grinding wheel with a grindstone on its lower surface side can be safely attached to and detached from a discoid spindle flange.SOLUTION: A grinder 10 for processing a wafer W includes: a grinding wheel 22 provided with a grindstone 22B on its lower surface side; a discoid spindle flange 17 rotating together with the grinding wheel 22 while attachably / detachably holding the grinding wheel 22; a wheel cover 24 which is attached to the spindle flange 17 while covering an exterior side of the grinding wheel 22 from the lower surface side of the grinding wheel 22; and an attachment and detachment mechanism 25 which includes a female part 25B and a male part 25A inserted to the female part 25B and capable of being attached to and detached from the female part 25B, and in which the female part 25B is provided at an approximate shaft center of the spindle flange 17, and the male part 25A is provided at an approximate shaft center of the wheel cover 24.SELECTED DRAWING: Figure 3
Need to check novelty before this filing date? Find Prior Art

Citation Information

Patent Citations

  • JP1975015886U

  • JP1982112860U

  • Grinding wheel mounting method

    JP2008207277A

  • Grindstone part protection member and wheel case

    JP2021010988A

  • JP309673A