Antenna equipment and communication equipment

Abstract

To provide an antenna device capable of improving antenna gain without increasing the size of an antenna module.SOLUTION: An array antenna accommodated in a housing faces the inner surface of the housing and includes a plurality of antenna elements arranged at least one-dimensionally in a first direction. A plurality of waveguides are coupled to the plurality of antenna elements of the array antenna and extend from the plurality of antenna elements toward the inner surface of the housing, respectively. For two waveguides respectively coupled to two antenna elements adjacent to each other in the first direction, the distance in the first direction between the end faces on the inner surface side of the housing is wider than the distance in the first direction between the end faces on the array antenna side.SELECTED DRAWING: Figure 10

Description

Technical Field

[0001] The present invention relates to an antenna device and a communication device.

Background Art

[0002] An antenna device in which a dielectric spacer is disposed between a substrate provided with an array antenna and a dielectric cover is disclosed in Patent Document 1 below. A conductive layer is disposed around a region of the inner surface of the dielectric cover that faces the dielectric spacer, and a vertical conductive layer is disposed on the side surface of the dielectric spacer. Radio waves radiated from the array antenna pass through the dielectric spacer and the dielectric cover and are radiated to the outside. By suppressing the generation of surface waves by the conductive film, a good radiation pattern can be obtained.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Improvement of the gain of the array antenna is desired. By increasing the area of the array antenna, the gain can be improved. On the other hand, miniaturization of an antenna module including the array antenna and the substrate is desired. Increasing the area of the array antenna for gain improvement is contrary to the miniaturization of the antenna module.

[0005] An object of the present invention is to provide an antenna device capable of improving the antenna gain without increasing the size of the antenna module. Another object of the present invention is to provide a communication device equipped with this antenna device.

Means for Solving the Problems

[0006] According to one aspect of the present invention, The casing and An array antenna comprising a plurality of antenna elements housed in the aforementioned housing, facing the inner surface of the housing and arranged at least one-dimensionally in a first direction, A plurality of waveguides are coupled to each of the plurality of antenna elements of the array antenna, and each of the plurality of antenna elements extends toward the inner surface of the housing. Equipped with, With respect to two waveguides, among the plurality of waveguides, that are coupled to two adjacent antenna elements in the first direction, the spacing between the end faces on the inner surface of the housing in the first direction is wider than the spacing between the end faces on the array antenna side in the first direction. Each of the aforementioned plurality of waveguides is a metal waveguide, The housing is provided with a transparent window corresponding to each of the plurality of waveguides, and the radio waves radiated from each of the plurality of antenna elements are configured to pass through each of the plurality of waveguides and through the transparent window to be radiated to the outside. An antenna device will be provided.

[0007] According to another aspect of the present invention, The aforementioned antenna device, A high-frequency integrated circuit housed in the housing of the antenna device, which supplies high-frequency signals to multiple antenna elements of the array antenna, A communication device equipped with the following features is provided. [Effects of the Invention]

[0008] The inner end face of the waveguide housing acts as a secondary wave source. Because the spacing of the waveguide end faces acting as secondary wave sources in the first direction is wider than the spacing of the end faces on the array antenna side in the first direction, the effective area of ​​the antenna elements can be increased without increasing the dimensions of the array antenna, thereby improving the gain. [Brief explanation of the drawing]

[0009] [Figure 1] Figures 1A and 1B are a transmission perspective view and a cross-sectional view, respectively, of a portion of the antenna device according to the first embodiment. [Figure 2] Figure 2 is a cross-sectional view of an antenna device according to a modified example of the first embodiment. [Figure 3] Figures 3A, 3B, and 3C are cross-sectional views showing a more detailed structure of the antenna device according to the first embodiment or a modified version thereof. [Figure 4]Figures 4A and 4B are cross-sectional views showing a more specific structure of the antenna device according to the first embodiment or a modified example thereof. [Figure 5] Figures 5A, 5B, and 5C are cross-sectional views showing a more specific structure of the antenna device according to the first embodiment or a modified example thereof. [Figure 6] Figures 6A, 6B, and 6C are cross-sectional views showing a more specific structure of the antenna device according to the first embodiment or a modified example thereof. [Figure 7] Figure 7 is a cross-sectional view showing a more specific structure of the antenna device according to a modified example of the first embodiment. [Figure 8] Figures 8A and 8B are cross-sectional views showing a more specific structure of the antenna device according to the first embodiment. [Figure 9] Figure 9 is a cross-sectional view showing another more specific structure of the antenna device according to the first embodiment. [Figure 10] Figure 10A is a cross-sectional view of the antenna device according to the second embodiment, and Figure 10B is a cross-sectional view showing a more specific configuration of the antenna device according to the second embodiment. [Figure 11] [[ID=2,1]]Figure 11 is a diagram showing the arrangement of each component in the xz plane of the antenna device according to a modified example of the second embodiment. [Figure 12] Figure 12 is a cross-sectional view of the antenna device according to the third embodiment. [Figure 13] Figure 13 is a cross-sectional view of the antenna device according to the fourth embodiment. [Figure 14] Figure 14 is a cross-sectional view of the antenna device according to the fifth embodiment. [Figure 15] Figure 15 is a cross-sectional view of the antenna device according to the sixth embodiment. [Figure 16] Figure 16 is a cross-sectional view of the antenna device according to the seventh embodiment. [Figure 17] Figure is a cross-sectional view of the antenna device according to a modified example of the seventh embodiment. [Figure 18] Figure 18 is a block diagram of the communication device according to the eighth embodiment.

Best Mode for Carrying Out the Invention

[0010] [First Embodiment] Referring to FIGS. 1A and 1B, an antenna device according to the first embodiment will be described. FIGS. 1A and 1B are a perspective view and a cross-sectional view of a part of the antenna device according to the first embodiment, respectively. A substrate 10 is accommodated in a housing 50, and a plurality of antenna elements 11, for example, two antenna elements 11, are arranged on the substrate 10. The plurality of antenna elements 11 face a first region 55A on the inner surface of the housing 50 and are arranged side by side linearly, constituting an array antenna 12. A direction in which the plurality of antenna elements 11 are arranged is defined as the x direction, and an xyz orthogonal coordinate system is defined in which the normal direction of the first region 55A is the y direction. A direction from the antenna element 11 toward the first region 55A is defined as the positive direction of the y axis.

[0011] A waveguide 20 is coupled to the array antenna 12 and extends from the array antenna 12 toward the first region 55A. Here, "coupled" means electromagnetic coupling, meaning a state in which an electromagnetic field or electromagnetic wave flows from the array antenna 12 to the waveguide 20 or vice versa. More specifically, one waveguide 20 is coupled to the plurality of antenna elements 11. A cross-section of the waveguide 20 perpendicular to the y axis expands in the x direction from the array antenna 12 toward the first region 55A. In the z direction, the dimensions of the cross-section of the waveguide 20 are constant. Note that the waveguide 20 may be shaped to expand in both the x direction and the z direction from the array antenna 12 toward the first region 5�A.

[0012] When the array antenna 12 is viewed from the y-direction in a plan view, the multiple antenna elements 11 are contained within the end face 22 of the waveguide 20 on the array antenna 12 side (hereinafter sometimes referred to as the antenna-side end face). The x-direction dimensions of the end face 21 on the first region 55A side of the inner surface of the housing 50 (hereinafter sometimes referred to as the housing-side end face) and the antenna-side end face 22 of the waveguide 20 are denoted as Lx1 and Lx2, respectively. Dimension Lx1 can also be defined as the length from one end to the other in the x-direction of the housing-side end face 21 of the waveguide 20. Similarly, dimension Lx2 can also be defined as the length from one end to the other in the x-direction of the antenna-side end face 22 of the waveguide 20.

[0013] In the first embodiment, Lx1 > Lx2 holds true. Therefore, the area of ​​the end face 21 on the housing side of the waveguide 20 is larger than the area of ​​the end face 22 on the antenna side. For example, a metal waveguide is used as the waveguide 20. The "end face" of the waveguide 20 refers to the opening at the end of the metal waveguide. The internal space defined by the metal waveguide is filled with air.

[0014] When the first region 55A is viewed from above, a transparent window 51 made of dielectric material is provided in the housing 50, encompassing the end face 21 of the waveguide 20 on the housing side. The area around the transparent window 51 in the housing 50 is made of a metal wall 52. Radio waves radiated from the array antenna 12 pass through the waveguide 20, through the transparent window 51, and are radiated to the outside of the housing 50.

[0015] Next, we will describe the excellent effects of the first embodiment. In the antenna device according to the first embodiment, the antenna-side end face 22 of the waveguide 20 encompasses multiple antenna elements 11. That is, the area of ​​the antenna-side end face 22 is larger than the area of ​​the convex hull of the multiple antenna elements 11 (hereinafter sometimes simply referred to as the area of ​​the array antenna 12). Here, the convex hull refers to the polygon with the smallest area that encompasses the multiple antenna elements 11. Furthermore, the area of ​​the housing-side end face 21 of the waveguide 20 is larger than the area of ​​the antenna-side end face 22. The antenna elements 11 act as primary wave sources, and the housing-side end face 21 of the waveguide 20 acts as a secondary wave source. That is, each point on the housing-side end face 21 of the waveguide 20 becomes a wave source of secondary waves based on the Huygens-Fresnel principle. Because the area of ​​the end face 21 acting as a secondary wave source is larger than the area of ​​the array antenna 12, a higher gain can be obtained compared to when the array antenna 12 is used alone.

[0016] Furthermore, since the area of ​​the array antenna 12 is smaller than the end face 21 on the housing side of the waveguide 20, the antenna module including the array antenna 12 and the substrate 10 can be miniaturized.

[0017] Next, a modified example of the first embodiment will be described with reference to Figure 2. Figure 2 is a cross-sectional view of an antenna device according to a modified example of the first embodiment. In the first embodiment (Figures 1A and 1B), a metal waveguide is used as the waveguide 20. In contrast, in the modified example shown in Figure 2, a dielectric waveguide is used as the waveguide 20. The end face 21 on the housing side and the end face 22 on the antenna side of the waveguide 20 correspond to the end face facing the first region 55A of the dielectric waveguide and the end face facing the array antenna 12, respectively.

[0018] The dielectric constant of the dielectric material constituting the waveguide 20 is higher than the dielectric constant of the adjacent space across the side surface of the waveguide 20. As shown in the modified example in Figure 2, the same effect as in the first embodiment can be obtained even when a dielectric waveguide is used as the waveguide 20.

[0019] In the first embodiment, the internal space of the waveguide 20, which is a metal waveguide, is filled with air, but the internal space may be filled with a dielectric material. The excellent effects of adopting a configuration in which a dielectric material is filled will be described below.

[0020] The relative permittivity of dielectric materials such as the substrate 10 on which the array antenna 12 is mounted is generally between 2 and 8. Similarly, the relative permittivity of the dielectric material used in the transparent window 51 of the housing 50 is generally between 3 and 10. When the metal waveguide is filled with air, the relative permittivity of the internal space of the metal waveguide is 1. Therefore, impedance mismatch becomes large at the antenna-side end face 22 and the housing-side end face 21 of the waveguide 20. Filling the internal space of the metal waveguide with dielectric material reduces impedance mismatch. In particular, it is preferable to set the dielectric constant of the dielectric material filling the metal waveguide to an intermediate value between the dielectric constant of the substrate 10 and the dielectric constant of the transparent window 51.

[0021] Furthermore, the dielectric material within the metal waveguide functions as a heat path from the substrate 10 to the housing 50. When a heat source such as a high-frequency integrated circuit is mounted on the substrate 10, the heat dissipation characteristics from the heat source to the housing 50 can be improved.

[0022] Next, other modifications of the first embodiment will be described. In the antenna device according to the first embodiment, a one-dimensional array antenna is used as the array antenna 12, in which multiple antenna elements 11 are arranged in the x direction. However, a two-dimensional array antenna may also be constructed by arranging multiple antenna elements 11 two-dimensionally as the array antenna 12. For example, multiple antenna elements 11 may be arranged in a matrix in the xz plane. In this case as well, the antenna-side end face 22 of the waveguide 20 is arranged to encompass the multiple antenna elements 11. The waveguide 20 should have a shape such that the area of ​​the cross-section perpendicular to the y-axis gradually increases from the antenna-side end face 22 to the housing-side end face 21. For example, the waveguide 20 may have a truncated square pyramid shape.

[0023] In the antenna device according to the first embodiment, a transparent window 51 made of a dielectric material is placed in a portion of the metal wall 52 of the housing 50, but the portion of the metal wall 52 may also be made of a dielectric material. In this case, the margin for positioning between the waveguide 20 and the housing 50 is increased.

[0024] Next, with reference to Figures 3A to 8B, specific examples of fixing the waveguide 20 and the substrate 10 in the antenna device according to the first embodiment and its modified form will be described. Figures 3A to 8B are cross-sectional views showing a more detailed structure of the antenna device according to the first embodiment or its modified form.

[0025] In the specific example shown in Figure 3A, the waveguide 20 is defined by a cavity penetrating the conductive member 23. The surface of the conductive member 23 facing the first region 55A is fixed to the inner surface of the housing 50 via an adhesive layer 24. A substrate 10 on which multiple antenna elements 11 are arranged is fixed to the conductive member 23 via the adhesive layer 24. An adhesive, double-sided tape, etc., can be used as the adhesive layer 24. In a configuration where the outer circumference of the housing-side end face 21 of the waveguide 20 substantially coincides with the outer circumference of a dielectric transparent window 51, the metal wall 52 of the housing 50 functions as a waveguide connected to the waveguide 20.

[0026] In the specific example shown in Figure 3B, the adhesive layer 24 is also placed on the end face 21 on the housing side and the end face 22 on the antenna side of the waveguide 20, i.e., the area corresponding to the opening. In the example shown in Figure 3B, for example, when adhesive is applied to the inner surface of the housing 50 or the substrate 10 and the conductive member 23 is bonded, it is not necessary to precisely adjust the area to which the adhesive is applied, thus simplifying the manufacturing process. Furthermore, when double-sided tape is used for the adhesive layer 24, it is not necessary to cut the double-sided tape in the area corresponding to the end face 21 on the housing side and the end face 22 on the antenna side of the waveguide 20, thus simplifying the manufacturing process.

[0027] In the specific example shown in Figure 3C, a dielectric waveguide is used as the waveguide 20. One end face 21 of the dielectric waveguide is fixed to the first region 55A on the inner surface of the housing 50 via an adhesive layer 24. The substrate 10 is fixed to the other end face 22 of the dielectric waveguide via the adhesive layer 24.

[0028] In the specific example shown in Figure 4A, the conductive member 23 defining the waveguide 20 is fixed to the metal wall 52 of the housing 50 by screws 25. The substrate 10 is fixed to the conductive member 23 by screws 26. The metal wall 52 of the housing 50 and the conductive member 23 may be made of the same metal material, or different metal materials may be used. Alternatively, the metal wall 52 of the housing 50 and the conductive member 23 may be manufactured as a single unit. In this case, screws 25 are not necessary.

[0029] In the specific example shown in Figure 4B, a dielectric waveguide is used as the waveguide 20. A dielectric waveguide support member 27 is in contact with the side surface of the waveguide 20. The dielectric constant of the dielectric waveguide support member 27 is lower than that of the dielectric material constituting the waveguide 20. The dielectric waveguide support member 27 surrounds the waveguide 20 from the side. The dielectric waveguide support member 27 is fixed to the metal wall 52 of the housing 50 by screws 25. The substrate 10 is fixed to the dielectric waveguide support member 27 by screws 26.

[0030] In the specific example shown in Figure 5A, the conductive member 23 defining the waveguide 20, the substrate 10, and the heat dissipation member 16 are fixed to the housing 50 by a fixing member 28. The fixing member 28 includes a bottom portion 28A, a side wall portion 28B, and a mounting portion 28C. The fixing member 28 is made of, for example, metal. The conductive member 23, the substrate 10, the heat dissipation member 16, and the bottom portion 28A are stacked in order from a first region 55A on the inner surface of the housing 50. The side wall portion 28B extends from the edge of the bottom portion 28A toward the first region 55A. A mounting portion 28C, which is bent outward in an L-shape, is provided at the end of the side wall portion 28B. The mounting portion 28C is fixed to the metal wall 52 of the housing 50 by screws 29.

[0031] The conductive member 23, the substrate 10, and the heat dissipation member 16 are fixed to the housing 50 by frictional force when pressed against the first region 55A by the fixing member 28. The fixing member 28 and the screws 29 constitute a support for supporting the waveguide 20, the substrate 10, and the heat dissipation member 16 in the housing 50. In place of the screws 29, other fasteners may be used to mechanically fix the fixing member 28 to the housing 50. Heat is dissipated from the substrate 10 to the metal wall 52 of the housing 50 via the heat dissipation member 16 and the fixing member 28. Heat dissipation can be further improved by bringing the outer peripheral side of the conductive member 23 into contact with the side wall portion 28B of the fixing member 28.

[0032] In the specific example shown in Figure 5B, a dielectric waveguide is used instead of the waveguide 20 defined by the conductive member 23 in the specific example shown in Figure 5A. The other configurations are the same as those in the specific example shown in Figure 5A.

[0033] In the specific example shown in Figure 5C, the high-frequency integrated circuit 60 is mounted on the surface of the substrate 10 shown in the specific example in Figure 5A, opposite to the surface facing the waveguide 20. The heat dissipation member 16 is positioned between the high-frequency integrated circuit 60 and the bottom 28A of the fixing member 28. Alternatively, the dielectric waveguide shown in Figure 5B may be used as the waveguide 20. In the configuration shown in Figure 5C, the heat generated by the high-frequency integrated circuit 60 is dissipated to the housing 50 via the heat dissipation member 16 and the fixing member 28. Instead of the high-frequency integrated circuit 60, a system-in-package (SiP) containing the high-frequency integrated circuit may be mounted.

[0034] In the specific example shown in Figure 6A, instead of the fixing member 28 in the specific example shown in Figure 5A, a support portion 56 is used that is integrally molded and integrated with the metal wall 52 of the housing 50. The support portion 56 includes a bottom portion 56A that faces the first region 55A at a distance, and a side wall portion 56B that extends from the periphery of the bottom portion 56A to the metal wall 52. A conductive member 23 defining the waveguide 20 and a substrate 10 are inserted between the first region 55A and the bottom portion 56A. A heat dissipation member may be inserted between the substrate 10 and the bottom portion 56A.

[0035] In the specific example shown in Figure 6B, a dielectric waveguide is used instead of the waveguide 20 defined by the conductive member 23 in the specific example shown in Figure 6A. A dielectric waveguide support member 27, as shown in the specific example in Figure 4B, is positioned to the side of the waveguide 20. In the specific example shown in Figure 6B, a heat dissipation member may also be inserted between the substrate 10 and the bottom 56A.

[0036] In the specific example shown in Figure 6C, the high-frequency integrated circuit 60 is mounted on the surface of the substrate 10 shown in the specific example in Figure 6A, opposite to the surface facing the waveguide 20. Alternatively, the dielectric waveguide shown in Figure 6B may be used as the waveguide 20. In the configuration shown in Figure 6C, the heat generated by the high-frequency integrated circuit 60 is dissipated to the housing 50 via the support portion 56. Instead of the high-frequency integrated circuit 60, a system-in-package (SiP) containing the high-frequency integrated circuit may be mounted. A heat dissipation member may be inserted between the high-frequency integrated circuit 60 and the bottom portion 56A.

[0037] In the specific example shown in Figure 7, a dielectric waveguide is used as the waveguide 20, and the transparent window 51 of the housing 50 and the waveguide 20 are integrally molded. For example, the waveguide 20 and the transparent window 51 are formed from the same dielectric material. Alternatively, they may be formed from different dielectric materials. The substrate 10 is fixed to the antenna-side end face 22 of the waveguide 20 via an adhesive layer 24.

[0038] In the specific example shown in Figure 8A, the conductive member 23 defining the waveguide 20 is fixed to the inner surface of the housing 50 via an adhesive layer 24. The substrate 10 is mounted on the motherboard 57 via solder 58. By fixing the motherboard 57 to a predetermined position within the housing 50, the relative position between the antenna-side end face 22 of the waveguide 20 and the substrate 10 is fixed.

[0039] In the specific example shown in Figure 8B, the substrate 10 and the conductive member 23 are mounted on the motherboard 57 via solder 58. The conductive member 23 is provided with a recess 23A that is continuous with the waveguide 20 via the antenna-side end face 22 (opening) of the waveguide 20. The substrate 10 is placed within the recess 23A. By housing the motherboard 57 in a predetermined position within the housing 50, the relative position between the housing-side end face 21 of the waveguide 20 and the transparent window 51 is fixed.

[0040] In the specific example shown in Figure 9, an antenna module 45 is mounted on a motherboard 57. The antenna module 45 includes a substrate 10, an antenna element 11, a high-frequency integrated circuit 60, a sealing resin layer 43, a plurality of conductor pillars 41, and a conductor film 42. The high-frequency integrated circuit 60 is mounted on the surface of the substrate 10 opposite to the waveguide 20 side. The sealing resin layer 43 seals the high-frequency integrated circuit 60. The plurality of conductor pillars 41 penetrate the sealing resin layer 43 in the thickness direction. The conductor film 42 is located on the surface of the sealing resin layer 43 facing the motherboard 57 and is connected to some of the plurality of conductor pillars 41. The conductor film 42 and the conductor pillars 41 not connected to the conductor film 42 are fixed to the motherboard 57 via solder 58.

[0041] Multiple conductive pillars 41 and conductive films 42 function as heat transfer paths, and the heat generated in the high-frequency integrated circuit 60 is dissipated to the motherboard 57 via these heat transfer paths. The conductive films 42 may be in contact with the top surface of the high-frequency integrated circuit 60 (the side opposite to the substrate 10). By adopting this configuration, the heat dissipation characteristics can be improved. Instead of the high-frequency integrated circuit 60, a system-in-package (SiP) with a high-frequency integrated circuit or the like built in may be mounted.

[0042] [Second Example] Next, the antenna device according to the second embodiment will be described with reference to Figures 10A and 10B. Hereafter, the explanation of components common to the antenna device according to the first embodiment (Figures 1A and 1B) will be omitted.

[0043] Figure 10A is a cross-sectional view of an antenna device according to the second embodiment. In the first embodiment (Figure 1B), one waveguide 20 is coupled to multiple antenna elements 11. In contrast, in the antenna device according to the second embodiment, one waveguide 20 is coupled to each of the multiple antenna elements 11. For example, the antenna device according to the second embodiment has two antenna elements 11 and two waveguides 20, with a one-to-one correspondence between the antenna elements 11 and the waveguides 20. A metal waveguide is used as the waveguide 20. A transparent window 51 of the housing 50 is also provided for each of the multiple waveguides 20.

[0044] The area of ​​each cross-section of the waveguide 20 parallel to the y-direction is constant from the antenna-side end face 22 to the housing-side end face 21. The two waveguides 20 are inclined such that the distance between them increases from the antenna-side end face 22 to the housing-side end face 21. Therefore, the x-direction distance G1 of the housing-side end faces 21 of the two waveguides 20 coupled to two adjacent antenna elements 11 in the x-direction is wider than the x-direction distance G2 of the antenna-side end faces 22. Here, "distance" refers to the distance between their geometric centers. In this case as well, similar to the first embodiment (Figure 1A), the length Lx1 from one end to the other in the x-direction of the housing-side end face 21 of the multiple waveguides 20 is longer than the length Lx2 from one end to the other in the x-direction of the antenna-side end face 22.

[0045] Figure 10B is a cross-sectional view showing a more specific configuration of the antenna device according to the second embodiment. Waveguides 20 are defined by two cavities that penetrate the conductive member 23. The conductive member 23 is fixed to the inner surface of the housing 50 via an adhesive layer 24. The substrate 10 is fixed to the conductive member 23 via the adhesive layer 24.

[0046] Next, the superior effects of the second embodiment will be described. In the second embodiment, each of the end faces 21 on the housing side of the two waveguides 20 acts as a secondary wave source. The area of ​​the convex hull encompassing the multiple secondary wave sources is larger than the area of ​​the array antenna 12 consisting of multiple antenna elements 11. Therefore, as in the first embodiment, the gain of the array antenna 12 can be improved.

[0047] In the first embodiment (Figure 1B), radio waves radiated from multiple antenna elements 11 overlap within a single waveguide 20. This can make directivity control difficult. In contrast, in the antenna device according to the second embodiment, multiple secondary wave sources and multiple antenna elements 11 correspond one-to-one, allowing for independent control of the phase of the secondary wave sources. Therefore, directivity control is easier compared to the first embodiment.

[0048] Furthermore, in the first embodiment (Figure 1B), the cross-sectional area of ​​the waveguide 20 is large, making it easy for higher-order modes to occur within the waveguide 20. In contrast, the antenna device according to the second embodiment has a smaller cross-sectional area for each of the multiple waveguides 20 compared to the antenna device according to the first embodiment, thus suppressing the generation of higher-order modes.

[0049] Next, an antenna device according to a modified example of the second embodiment will be described with reference to Figure 11. Figure 11 shows the arrangement of each component in the xz plane of the antenna device according to a modified version of the second embodiment. In the second embodiment (Figure 10A), multiple antenna elements 11 are arranged one-dimensionally in a line in the x direction. In contrast, in the modified version shown in Figure 11, multiple antenna elements 11 are arranged in a matrix. For example, they are arranged in a 2x2 matrix with the x direction as the row direction.

[0050] Each of the multiple antenna elements 11 is connected to a waveguide 20. A metal waveguide is used as the waveguide 20. The antenna elements 11 are enclosed in the antenna-side end face 22 of the waveguide 20. The multiple waveguides 20 are inclined to move away from each other from the antenna-side end face 22 toward the housing-side end face 21. The geometric center of the multiple end faces 22 is denoted as C0. When the multiple waveguides 20 are viewed from the y-direction in a plan view, the housing-side end face 21 is positioned by translating the antenna-side end face 22 toward the geometric center C0.

[0051] In the modified example shown in Figure 11, the area of ​​the convex hull encompassing the end faces 21 on the housing side of the multiple waveguides 20 is larger than the area of ​​the convex hull encompassing the multiple antenna elements 11. Therefore, it is possible to improve the gain of the array antenna while suppressing an increase in the size of the antenna module.

[0052] [Third Embodiment] Next, the antenna device according to the third embodiment will be described with reference to Figure 12. The following description will omit details of components common to the antenna device according to the first embodiment (Figures 1A and 1B).

[0053] Figure 12 is a cross-sectional view of an antenna device according to the third embodiment. A second region 55B is connected to a first region 55A on the inner surface of the housing 50 via a linear corner 53 extending in the z direction. Note that the corner 53 does not necessarily have to be a sharp corner formed by the intersection of two planes. For example, the first region 55A and the second region 55B may be connected via a curved surface having a certain curvature, or they may be connected via an oblique plane to both the first region 55A and the second region 55B. The antenna device according to the third embodiment includes a plurality of antenna elements facing the first region 55A, as well as a plurality of antenna elements facing the second region 55B. The plurality of antenna elements facing the first region 55A are referred to as the first antenna elements 11A, and the plurality of antenna elements facing the second region 55B are referred to as the second antenna elements 11B.

[0054] For example, a substrate bent into an L-shape is used as the substrate 10. The second region 55B is, for example, perpendicular to the x-direction. The direction from the second antenna element 11B towards the second region 55B is defined as the positive x-axis direction.

[0055] Multiple second antenna elements 11B are arranged in a direction (y-direction) parallel to the x-direction, parallel to a virtual plane (xy-plane) that is perpendicular to the first region 55A, and parallel to the second region 55B. Multiple first antenna elements 11A constitute a first array antenna 12A, and multiple second antenna elements 11B constitute a second array antenna 12B. Multiple first antenna elements 11A and multiple second antenna elements 11B are arranged one-dimensionally along a bent straight line parallel to the x-direction and y-direction, and can be considered to constitute a single array antenna.

[0056] Similar to the array antenna 12, waveguide 20, and transparent window 51 in the first embodiment (Figure 1B), the first waveguide 20A and the first transparent window 51A are arranged for the first array antenna 12A, and the second waveguide 20B and the second transparent window 51B are arranged for the second array antenna 12B. Metal waveguides or dielectric waveguides are used as the first waveguide 20A and the second waveguide 20B.

[0057] The length Ly1 from one end to the other in the y-direction of the housing-side end face 21B of the second waveguide 20B is longer than the length Ly2 from one end to the other in the y-direction of the antenna-side end face 22B.

[0058] Next, we will describe the excellent effects of the third embodiment. In the third embodiment, the gain of both the first array antenna 12A and the second array antenna 12B can be improved without increasing the size of the antenna module. Furthermore, by operating the first array antenna 12A and the second array antenna 12B simultaneously as beamforming antennas, the beamforming coverage range can be widened.

[0059] Next, a modified example of the third embodiment will be described. In the antenna device according to the third embodiment, the corner 53 connecting the first region 55A and the second region 55B is a right angle, but the angle between the first region 55A and the second region 55B is not limited to a right angle. For example, the angle of the corner 53 may be obtuse. Alternatively, the corner 53 may be rounded, or a sloped surface may be provided that is inclined toward the first region 55A and the second region 55B, so that the first region 55A and the second region 55B are connected via the sloped surface. Furthermore, in the antenna device according to the third embodiment, an L-shaped substrate is used as the substrate 10, but two different flat substrates may be used.

[0060] [Fourth embodiment] Next, the antenna device according to the fourth embodiment will be described with reference to Figure 13. The following description will omit details of components common to the antenna device according to the third embodiment (Figure 12).

[0061] Figure 13 is a cross-sectional view of the antenna device according to the fourth embodiment. In the antenna device according to the third embodiment (Figure 12), one first waveguide 20A is coupled to multiple first antenna elements 11A of the first array antenna 12A, and one second waveguide 20B is coupled to multiple second antenna elements 11B of the second array antenna 12B. In contrast, in the antenna device according to the fourth embodiment, one first waveguide 20A is coupled to each of the multiple first antenna elements 11A of the first array antenna 12A. Similarly, one second waveguide 20B is coupled to each of the multiple second antenna elements 11B of the second array antenna 12B. Multiple first transparent windows 51A and multiple second transparent windows 51B are arranged for each of the multiple first waveguides 20A and multiple second waveguides 20B.

[0062] The relative positions and shapes of the first array antenna 12A, the first waveguide 20A, and the first transparent window 51A are the same as those of the array antenna 12, waveguide 20, and transparent window 51 in the antenna device according to the second embodiment (Figure 10A). The relative positions and shapes of the second array antenna 12B, the second waveguide 20B, and the second transparent window 51B are also the same as those of the array antenna 12, waveguide 20, and transparent window 51 in the antenna device according to the second embodiment (Figure 10A).

[0063] The first waveguide 20A closest to corner 53 and the second waveguide 20B closest to corner 53 extend almost parallel to each other. The geometric centers of the housing-side end face 21A and antenna-side end face 22A of the first waveguide 20A closest to corner 53, the housing-side end face 21B and antenna-side end face 22B of the second waveguide 20B closest to corner 53 are denoted as CA1, CA2, CB1, and CB2, respectively. The distance G1 between geometric centers CA1 and CB1 is approximately equal to the distance G2 between geometric centers CA2 and CB2.

[0064] Next, we will describe the excellent effects of the fourth embodiment. In the antenna device according to the fourth embodiment, similar to the antenna device according to the second embodiment (Figure 10A), it is possible to improve the gain of the first array antenna 12A and the second array antenna 12B, facilitate directivity control, and suppress the generation of higher-order modes. Furthermore, similar to the antenna device according to the third embodiment (Figure 12), by operating the first array antenna 12A and the second array antenna 12B simultaneously as beamforming antennas, the beamforming coverage range can be widened.

[0065] [Fifth Example] Next, the antenna device according to the fifth embodiment will be described with reference to Figure 14. The following description will omit details of components common to the antenna device according to the fourth embodiment (Figure 13).

[0066] Figure 14 is a cross-sectional view of the antenna device according to the fifth embodiment. In the antenna device according to the fourth embodiment (Figure 13), the first waveguide 20A closest to the corner 53 and the second waveguide 20B closest to the corner 53 extend almost parallel to each other. In contrast, in the antenna device according to the fifth embodiment, the first waveguide 20A closest to the corner 53 and the second waveguide 20B closest to the corner 53 extend away from each other from the substrate 10 toward the inner surface of the housing 50. As a result, the distance G1 between geometric centers CA1 and CB1 is wider than the distance G2 between geometric centers CA2 and CB2.

[0067] Next, we will describe the excellent effects of the fifth embodiment. In the antenna device according to the fifth embodiment, the spacing G1 is wider compared to the antenna device according to the fourth embodiment. Therefore, when the end faces 21A and 21B on the housing side of the first waveguide 20A and the second waveguide 20B that are closest to the corner 53 are operated as secondary wave sources, it is possible to improve the gain.

[0068] [Sixth Example] Next, the antenna device according to the sixth embodiment will be described with reference to Figure 15. The following description will omit details of components common to the antenna device according to the second embodiment (Figure 10A).

[0069] Figure 15 is a cross-sectional view of the antenna device according to the sixth embodiment. In the antenna device according to the second embodiment (Figure 10A), a patch antenna is used as the antenna element 11. In contrast, in the antenna device according to the sixth embodiment, a microstrip line-waveguide converter 31 functions as the antenna element. An example of the configuration of the microstrip line-waveguide converter 31 will be described below.

[0070] When the substrate 10 is viewed from above, the ends 35 of the microstrip lines provided within the substrate 10 are located within the antenna-side end faces 22 of the waveguide 20. The microstrip lines are coupled to the waveguide 20 at their ends 35, and the coupling point constitutes the microstrip line-waveguide converter 31. Ground planes 32 and 33 are located on the waveguide 20 side surface of the substrate 10 and in the same layer as the microstrip lines, respectively. A back short section 34 is located in a layer deeper than the ends 35 of the microstrip lines. When the microstrip lines are coupled to the waveguide 20 in the microstrip line-waveguide converter 31, the high-frequency signals transmitted through the microstrip lines are transmitted through the waveguide 20 and radiated to the outside of the housing 50.

[0071] Next, we will describe the excellent effects of the sixth embodiment. In the sixth embodiment, the arrangement and shape of the multiple waveguides 20 are the same as those of the waveguides 20 in the antenna device according to the second embodiment (Figure 10A). Compared to a configuration in which each of the multiple waveguides 20 extends perpendicularly to the first region 55A on the inner surface of the housing 50, the area of ​​the convex hull of the secondary wave source is increased. Therefore, it is possible to improve the gain of the antenna device. Furthermore, when the antenna element 11 is realized as a resonant antenna such as a patch antenna or dipole antenna, the dimensions of the antenna element are about half the wavelength of the radio wave in the operating frequency band. Therefore, a wider area than about half the wavelength must be secured for each antenna element. In contrast, the antenna device according to the sixth embodiment does not have such constraints, so it is possible to make the antenna module smaller.

[0072] [Seventh Example] Next, the antenna device according to the seventh embodiment will be described with reference to Figure 16. The following description will omit details of components common to the antenna device according to the third embodiment (Figure 12).

[0073] Figure 16 is a cross-sectional view of the antenna device according to the seventh embodiment. In the antenna device according to the third embodiment (Figure 12), the first region 55A and the second region 55B intersect at approximately a right angle at the corner 53 of the housing 50. In contrast, in the antenna device according to the seventh embodiment, the inner surface corresponding to the corner 53 includes a curved surface. This curved surface is referred to as the third region 55C. The outer surface of the housing 50 is also curved to reflect the shape of the curved surface.

[0074] In the antenna device according to the third embodiment (Figure 12), an L-shaped substrate bent at almost a right angle is used as the substrate 10. In contrast, in the antenna device according to the seventh embodiment, the substrate 10 is a substrate with a curved surface in the region facing the curved third region 55C on the inner surface of the housing 50. Furthermore, the third antenna element 11C facing the third region 55C is arranged in the curved region of the substrate 10.

[0075] The third waveguide 20C is coupled to the third antenna element 11C and extends from the third antenna element 11C toward the third region 55C. In the antenna device according to the third embodiment (Figure 12), the first waveguide 20A and the second waveguide 20B spread out from the antenna-side end faces 22A and 22B toward the housing-side end faces 21A and 21B. In contrast, in the antenna device according to the seventh embodiment, the cross-sectional area of ​​the first waveguide 20A, the second waveguide 20B, and the third waveguide 20C is constant from the antenna-side end faces 22A, 22B, and 22C toward the housing-side end faces 21A, 21B, and 21C. A third transparent window 51C that transmits radio waves is provided in the region of the third waveguide 20C corresponding to the housing-side end face 21C.

[0076] The distance between the first waveguide 20A and the third waveguide 20C widens from the antenna-side end faces 22A and 22C towards the housing-side end faces 21A and 21C. Specifically, the distance G2 between the geometric center CA1 of the housing-side end face 21A of the first waveguide 20A and the geometric center CC2 of the antenna-side end face 22C of the third waveguide 20C is greater than the distance G1 between the geometric center CA1 of the housing-side end face 21A of the first waveguide 20A and the geometric center CC1 of the housing-side end face 21C of the third waveguide 20C. The positional relationship between the second waveguide 20B and the third waveguide 20C is similar.

[0077] The first antenna element 11A, the third antenna element 11C, and the second antenna element 11B are arranged one-dimensionally along a curved curve that follows the surface of the curved substrate 10, forming an array antenna. The direction of the curve along which the first antenna element 11A, the third antenna element 11C, and the second antenna element 11B follow is referred to as the first direction D1. The length L2 from one end to the other in the first direction D1 of the antenna-side end faces 22A, 22C, and 22B of the multiple waveguides consisting of the first waveguide 20A, the third waveguide 20C, and the second waveguide 20B is less than the length L1 from one end to the other in the first direction D1 of the housing-side end faces 21A, 21C, and 21B.

[0078] Next, we will describe the excellent effects of the seventh embodiment. In the seventh embodiment, the range of the first direction D1 in which the secondary wave sources generated by the first waveguide 20A, the third waveguide 20C, and the second waveguide 20B are located is larger than the range of the first direction D1 in which the first antenna element 11A, the third antenna element 11C, and the second antenna element 11B are located. Therefore, the gain of the antenna device can be improved.

[0079] Next, an antenna device according to a modified example of the seventh embodiment will be described with reference to Figure 17. Figure 17 is a cross-sectional view of an antenna device according to a modification of the seventh embodiment. In the antenna device according to the seventh embodiment, a substrate 10 with a substantially uniform thickness is used. In contrast, in the modification shown in Figure 17, the thickness of the curved portion is thinner than the thickness of the portions facing the first region 55A and the second region 55B, respectively. Such a substrate 10 can be manufactured, for example, by thinning a portion of a flat substrate with a uniform thickness and then curving the thinned portion. Alternatively, two flat substrates may be connected with a flexible substrate, and the flexible substrate may be curved.

[0080] In the antenna device according to the seventh embodiment (Figure 16), the inner surface of the corner 53 of the housing 50 (third region 55C) is a curved surface. In contrast, in the modified example shown in Figure 17, the third region 55C is composed of a plane that is inclined with respect to both the first region 55A and the second region 55B. The first region 55A and the second region 55B are connected via the inclined third region 55C.

[0081] Two first antenna elements 11A are arranged side by side in the first direction D1, facing the first region 55A. The third antenna element 11C is, for example, a dipole antenna. A high-frequency integrated circuit (RFIC) 60 is mounted on the side of the portion facing the first region 55A that is opposite to the side facing the first region 55A. The high-frequency integrated circuit 60 is connected to the first antenna element 11A, the second antenna element 11B, and the third antenna element 11C via a plurality of feed lines 15 arranged on the substrate 10.

[0082] Next, an antenna device according to another modification of the seventh embodiment will be described. In the antenna device according to the seventh embodiment, the first antenna element 11A, the second antenna element 11B, and the third antenna element 11C are arranged one-dimensionally in the first direction D1, but they may also be arranged two-dimensionally.

[0083] [Eighth Example] Next, a communication device according to the eighth embodiment will be described with reference to Figure 18. The communication device according to the eighth embodiment includes an antenna device according to any embodiment or a modified version of one of the first to seventh embodiments.

[0084] Figure 18 is a block diagram of a communication device according to the eighth embodiment. The communication device according to the eighth embodiment includes a baseband integrated circuit (BBIC) 80, a high-frequency integrated circuit (RFIC) 60, and an antenna device 40. As the antenna device 40, an antenna device according to any embodiment or a variation thereof from the first to seventh embodiments is used. The antenna device 40 includes a plurality of antenna elements 11. The plurality of antenna elements 11 include, for example, the antenna element 11 of the first embodiment (Figures 1A and 1B), the first antenna element 11A and the second antenna element 11B of the third embodiment (Figure 12), the first antenna element 11A, the second antenna element 11B, and the third antenna element 11C of the seventh embodiment (Figure 16).

[0085] The baseband integrated circuit 80 and the high-frequency integrated circuit 60 are housed in a housing 50 common to the housing 50 of the antenna device 40 (Figure 1A, etc.). For example, the high-frequency integrated circuit 60 is mounted on the substrate 10 of the antenna device according to a modified example of the seventh embodiment shown in Figure 17.

[0086] The high-frequency integrated circuit 60 includes an intermediate frequency amplifier 61, an up / down converter mixer 62, a transmit / receive selector switch 63, a power divider 64, multiple phase shifters 65, multiple attenuators 66, multiple transmit / receive selector switches 67, multiple power amplifiers 68, multiple low-noise amplifiers 69, and multiple transmit / receive selector switches 70.

[0087] First, let's explain the transmission function. An intermediate frequency signal is input from the baseband integrated circuit 80 to the up / down converter mixer 62 via the intermediate frequency amplifier 61. The up / down converter mixer 62 upconverts the intermediate frequency signal to generate a high frequency signal. The generated high frequency signal is input to the power divider 64 via the transmit / receive selector switch 63. Each of the high frequency signals distributed by the power divider 64 is input to the antenna element 11 via the phase shifter 65, attenuator 66, transmit / receive selector switch 67, power amplifier 68, and transmit / receive selector switch 70.

[0088] Next, the receiving function will be described. The high-frequency signals received by each of the multiple antenna elements 11 are input to the power divider 64 via the transmit / receive selector switch 70, low-noise amplifier 69, transmit / receive selector switch 67, attenuator 66, and phase shifter 65. The high-frequency signals combined in the power divider 64 are input to the up / down conversion mixer 62 via the transmit / receive selector switch 63. The up / down conversion mixer 62 down-converts the high-frequency signals to generate intermediate frequency signals. The generated intermediate frequency signals are input to the baseband integrated circuit 80 via the intermediate frequency amplifier 61. Alternatively, the up / down conversion mixer 62 may employ a direct conversion method in which it directly down-converts the high-frequency signals to baseband signals.

[0089] Next, we will describe the excellent effects of the eighth embodiment. Since the antenna device 40 included in the communication device according to the eighth embodiment is an antenna device according to any embodiment or a variation thereof from the first to seventh embodiments, the gain of the antenna device can be improved.

[0090] The embodiments described above are illustrative, and it goes without saying that partial substitution or combination of the configurations shown in different embodiments is possible. Similar effects and benefits from similar configurations in multiple embodiments will not be mentioned sequentially for each embodiment. Furthermore, the present invention is not limited to the embodiments described above. For example, it will be obvious to those skilled in the art that various modifications, improvements, and combinations are possible. [Explanation of symbols]

[0091] 10 circuit boards 11 Antenna elements 11A First Antenna Element 11B Second Antenna Element 11C Third Antenna Element 12 Array Antennas 12A First Array Antenna 12B Second Array Antenna 15 Power line 16 Heat dissipation components 20 Waveguides 20A Waveguide 1 20B 2nd waveguide 20C 3rd waveguide 21 End face of waveguide on the housing side 21A End face of the first waveguide on the housing side 21B End face of the second waveguide on the housing side 21C End face of the third waveguide on the housing side 22 End face of the waveguide on the antenna side 22A Antenna-side end face of the first waveguide 22B Antenna-side end face of the second waveguide 22C Third waveguide antenna side end face 23 Conductive members 23A Recess provided in the conductive member 24 Adhesive layer 25, 26 screws 27 Dielectric waveguide support member 28 Fixing member 28A Bottom of the fixing member 28B Side wall portion of the fixing member 28C Mounting part of the fixing member 29 screws 31 Microstrip Line-Waveguide Converter 32, 33 Ground Plane 34 Back Short Section 35 End of microstrip track 40 Antenna equipment 41 Conductor Pillar 42 Conductor film 43 Sealing resin layer 45 Antenna Modules 50 cabinets 51 Transparent window 51A First transparent window 51B Second transparent window 51C Third transparent window 52 metal wall 53 Corner 55A First area of ​​the inner surface of the enclosure 55B Second area of ​​the inner surface of the enclosure Third area on the inner surface of the 55C enclosure 56 Support part 56A bottom 56B Side wall part 57 Motherboards 58 Solder 60. High-Frequency Integrated Circuits (RFICs) 61 Intermediate frequency amplifier 62 Mixer for Up / Down Conversion 63 Transmit / Receive Switch 64 Power Divider 65 Phase shifter 66 Attenuator 67 Transmit / Receive Switch 68 Power Amplifier 69 Low-noise amplifier 70 Transmit / Receive Switch 80 Baseband Integrated Circuits

Claims

1. The casing and An array antenna comprising a plurality of antenna elements housed in the aforementioned housing, facing the inner surface of the housing and arranged at least one-dimensionally in a first direction, A plurality of waveguides are coupled to each of the plurality of antenna elements of the array antenna, and each of the plurality of antenna elements extends toward the inner surface of the housing. Equipped with, With respect to two waveguides, among the plurality of waveguides, that are coupled to two adjacent antenna elements in the first direction, the spacing between the end faces on the inner surface of the housing in the first direction is wider than the spacing between the end faces on the array antenna side in the first direction. Each of the aforementioned plurality of waveguides is a metal waveguide, An antenna device in which a transparent window is provided in the housing, one for each of the plurality of waveguides, and radio waves radiated from each of the plurality of antenna elements pass through each of the plurality of waveguides and through the transparent window to be radiated to the outside.

2. The casing and An array antenna comprising a plurality of antenna elements housed in the aforementioned housing, facing the inner surface of the housing and arranged at least one-dimensionally in a first direction, A plurality of waveguides are coupled to each of the plurality of antenna elements of the array antenna, and each of the plurality of antenna elements extends toward the inner surface of the housing, A substrate on which the array antenna is arranged, A motherboard on which the aforementioned circuit board is mounted, An adhesive layer for fixing the plurality of waveguides to the housing and Equipped with, With respect to two waveguides, among the plurality of waveguides, that are coupled to two adjacent antenna elements in the first direction, the spacing between the end faces on the inner surface of the housing in the first direction is wider than the spacing between the end faces on the array antenna side in the first direction. An antenna device in which the motherboard is fixed to the enclosure, thereby positioning the array antenna to be coupled to the plurality of waveguides.

3. The casing and An array antenna comprising a plurality of antenna elements housed in the aforementioned housing, facing the inner surface of the housing and arranged at least one-dimensionally in a first direction, A plurality of waveguides are coupled to each of the plurality of antenna elements of the array antenna, and each of the plurality of antenna elements extends toward the inner surface of the housing, A substrate on which the array antenna is arranged, The array antenna is coupled to the plurality of waveguides in a positional relationship with the substrate and the motherboard on which the plurality of waveguides are mounted. Equipped with, With respect to two waveguides, among the plurality of waveguides, that are coupled to two adjacent antenna elements in the first direction, the spacing between the end faces on the inner surface of the housing in the first direction is wider than the spacing between the end faces on the array antenna side in the first direction. An antenna device in which the motherboard is fixed to the enclosure.

4. The antenna device according to any one of claims 1 to 3, wherein each of the plurality of antenna elements of the array antenna is a patch antenna.

5. Each of the array antenna elements includes an end of a microstrip line, The antenna device according to any one of claims 1 to 3, wherein the coupling points between each of the plurality of antenna elements of the array antenna and each of the plurality of waveguides constitute a microstrip line-waveguide converter.

6. The antenna device according to claim 2 or 3, wherein each of the plurality of waveguides is a metal waveguide.

7. The antenna device according to claim 1, wherein a dielectric material is filled inside the metal waveguides that constitute each of the plurality of waveguides.

8. The inner surface of the housing includes a first region and a second region that are continuous via a corner, Some of the antenna elements of the array antenna face the first region, and the remaining antenna elements face the second region. The antenna device according to any one of claims 1 to 3, wherein the plurality of waveguides include a plurality of first waveguides and a plurality of second waveguides, each of the plurality of first waveguides is coupled to a plurality of antenna elements facing the first region, and the plurality of second waveguides is coupled to a plurality of antenna elements facing the second region.

9. A substrate on which the array antenna is arranged, Support portion for fixing the substrate and the plurality of waveguides to the housing It also has the following features: The support portion includes a bottom portion positioned at a distance from the first region on the inner surface of the housing where the array antennas face each other, and a side wall portion extending from the bottom portion to the inner surface of the housing and fixed to the housing. The antenna device according to claim 1, wherein the plurality of waveguides and the substrate are arranged between the first region and the bottom portion.

10. The antenna device according to claim 9, wherein the support portion is fixed to the housing by a fastener or is integrally molded with the housing.

11. The substrate further comprises a high-frequency integrated circuit mounted on the side opposite to the side of the plurality of waveguides, The antenna device according to claim 9, wherein the high-frequency integrated circuit is thermally bonded to the bottom.

12. The antenna device according to claim 11, further comprising a heat dissipation member disposed between the high-frequency integrated circuit and the bottom portion.

13. An antenna device according to any one of claims 1 to 3, A high-frequency integrated circuit housed in the housing of the antenna device, which supplies high-frequency signals to multiple antenna elements of the array antenna, A communication device equipped with this device.

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