electronic machines

Abstract

To provide an electronic apparatus capable of improving reliability of sensing by a sensor element mounted on a substrate with elasticity.SOLUTION: An electronic apparatus includes a first substrate, a second substrate, a pressure-sensitive layer, and an elastic member that covers the first substrate, the second substrate, and the pressure-sensitive layer. The first substrate includes a first insulating base material including a plurality of first island-shaped parts and a plurality of first band-shaped parts and formed in a mesh shape, a wire disposed on the first band-shaped part, and a sensor electrode disposed on the first island-shaped part and electrically connected to the wire. The second substrate includes a second insulating base material including a plurality of second island-shaped parts and a plurality of second band-shaped parts and formed in a mesh shape, and a common electrode disposed below the second island-shaped part and the second band-shaped part and formed in a mesh shape. The elastic member includes a cut that is formed around the first island-shaped part and the second island-shaped part and opens when the elastic member extends.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] Embodiments of the present invention relate to electronic devices.

Background Art

[0002] In recent years, the use of flexible substrates having flexibility and stretchability has been studied in various fields. For example, a usage form in which a flexible substrate having sensor elements arranged in a matrix is attached to a curved surface such as a housing of an electronic device or a human body can be considered.

[0003] However, in sensing by sensor elements mounted on such a flexible substrate, an error may occur before and after the expansion and contraction of the flexible substrate.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] An object of the present embodiment is to provide an electronic device capable of improving the reliability of sensing by sensor elements mounted on a stretchable substrate.

Means for Solving the Problems

[0006] An electronic device according to one embodiment includes a first substrate, a second substrate facing the first substrate, a pressure-sensitive layer disposed between the first substrate and the second substrate, and an expandable member covering the first substrate, the second substrate, and the pressure-sensitive layer. The first substrate includes a first insulating substrate formed in a mesh pattern, comprising a plurality of first island-shaped portions and a plurality of first strip-shaped portions connecting two adjacent first island-shaped portions, wiring disposed on the first strip-shaped portions, and sensor electrodes disposed on the first island-shaped portions and electrically connected to the wiring. The second substrate includes a plurality of second island-shaped portions and a plurality of second strip-shaped portions connecting two adjacent second island-shaped portions, comprising a second insulating substrate formed in a mesh pattern, and common electrodes disposed below the second island-shaped portions and the second strip-shaped portions and formed in a mesh pattern. The expandable member includes notches formed around the first island-shaped portions and the second island-shaped portions, which open when the expandable member is extended. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 is a schematic plan view of an electronic device according to one embodiment. [Figure 2] Figure 2 is a magnified plan view of a portion of the first substrate shown in Figure 1. [Figure 3] Figure 3 is a magnified plan view of a portion of the second substrate shown in Figure 1. [Figure 4] Figure 4 is a magnified plan view of a part of the electronic device before it is extended. [Figure 5] Figure 5 is a cross-sectional view of the electronic device cut along line A and B in Figure 4. [Figure 6] Figure 6 is a magnified plan view of a portion of the electronic device after it has been extended. [Figure 7] Figure 7 is a cross-sectional view of the electronic device cut along line CD in Figure 6. [Figure 8] Figure 8 is a cross-sectional view showing another configuration example of the electronic device according to the same embodiment. [Figure 9] Figure 9 is a cross-sectional view showing yet another configuration example of the electronic device according to the same embodiment. [Modes for carrying out the invention]

[0008] The embodiments will be described below with reference to the drawings. Furthermore, the disclosure is merely an example, and any modifications that a person skilled in the art could easily conceive while maintaining the spirit of the invention are naturally included within the scope of the present invention. In addition, the drawings may schematically represent the width, thickness, shape, etc. of each part compared to the actual embodiment in order to clarify the explanation, but these are merely examples and do not limit the interpretation of the present invention. In addition, in this specification and each drawing, the same reference numerals are used for components that perform the same or similar functions as those described above with respect to previously shown drawings, and redundant detailed explanations may be omitted as appropriate.

[0009] Figure 1 is a schematic plan view of an electronic device 1 according to one embodiment. In this embodiment, the first direction D1, the second direction D2, and the third direction D3 are defined as shown in the figure. The first direction D1 and the second direction D2 are parallel to the main surface of the electronic device 1 and intersect each other. The third direction D3 is perpendicular to the first direction D1 and the second direction D2 and corresponds to the thickness direction of the electronic device 1. In this embodiment, the first direction D1 and the second direction D2 intersect perpendicularly, but they may intersect at angles other than perpendicular. In this specification, the direction toward the tip of the arrow indicating the third direction D3 is referred to as "up," and the direction opposite to the tip of the arrow is referred to as "down." Furthermore, it is assumed that there is an observation position for observing the electronic device 1 on the side of the tip of the arrow indicating the third direction D3, and viewing the D1-D2 plane defined by the first direction D1 and the second direction D2 from this observation position is called a plan view.

[0010] The electronic device 1 is a pressure sensor and, as shown in Figure 1, comprises a first substrate SUB1, a second substrate SUB2, a circuit board 2, and a controller 3. The circuit board 2 is, for example, a flexible printed circuit board and is electrically connected to each terminal in the terminal region TA of the first substrate SUB1. The controller 3 is mounted on the circuit board 2, but may also be mounted on the first substrate SUB1. The first substrate SUB1 and the second substrate SUB2 are bonded together by an outer peripheral seal 4. The first substrate SUB1 and the second substrate SUB2 are flexible and stretchable.

[0011] As shown in Figure 1, the electronic device 1 has an active region AA and a frame-shaped peripheral region PA surrounding the active region AA. The active region AA is the region where the sensor elements described later are arranged, and may also be called the sensing region. The peripheral region PA is the region where various peripheral circuits, such as drivers described later, are arranged.

[0012] As shown in Figure 1, the electronic device 1 further comprises multiple scan lines GL, multiple signal lines SL, multiple sensor elements 5, scan line driver DR1, signal line driver DR2, and the like. The multiple scan lines GL, multiple signal lines SL, and multiple sensor elements 5 are located in the active region AA, while the scan line driver DR1 and signal line driver DR2 are located in the peripheral region PA. Each of the multiple scan lines GL extends in the first direction D1 and is aligned in the second direction D2. Each of the multiple scan lines GL is connected to the scan line driver DR1. Each of the multiple signal lines SL extends in the second direction D2 and is aligned in the first direction D1. Each of the multiple signal lines SL is connected to the signal line driver DR2. Each of the multiple sensor elements 5 is located at the intersection of the scan lines GL and the signal lines SL and is electrically connected to the scan lines GL and the signal lines SL. A specific example of the configuration of the sensor elements 5 will be described later.

[0013] FIG. 2 is an enlarged plan view of a part (active region AA) of the first substrate SUB1 shown in FIG. 1. The first substrate SUB1 includes an insulating base material 10 (first insulating base material) that supports scanning lines GL and signal lines SL, and sensor electrodes SE that constitute the sensor element 5.

[0014] The insulating base material 10 includes a plurality of body portions 11 (first island-shaped portions), and hinge portions 12 and 13 (first strip-shaped portions) formed integrally with the body portions 11, and is formed in a mesh shape having an opening OP1. The insulating base material 10 has flexibility and can be formed of, for example, polyimide, but is not limited to this example.

[0015] The plurality of body portions 11 are arranged in a matrix in the first direction D1 and the second direction D2 at intervals from each other. Each of the body portions 11 is formed in, for example, a quadrangular shape (rhombus shape) in plan view. Note that the body portions 11 may be formed in other polygonal shapes, or may be formed in a circular shape or an elliptical shape.

[0016] The hinge portion 12 extends generally in the first direction D1 and is arranged in the second direction D2. The hinge portion 12 connects the plurality of body portions 11 arranged in the first direction D1. The hinge portion 13 extends generally in the second direction D2 and is arranged in the first direction D1. The hinge portion 13 connects the plurality of body portions 11 arranged in the second direction D2. The hinge portions 12 and 13 are each formed in a meandering shape (meander shape) in plan view.

[0017] The scanning line GL extends overlapping the hinge portion 12. The signal line SL extends overlapping the hinge portion 13. That is, both the scanning line GL and the signal line SL are formed in a meandering shape. The scanning line GL and the signal line SL are electrically connected to the sensor electrode SE through contact holes not shown in the figure.

[0018] FIG. 3 is a plan view showing an enlarged view of a part (active region AA) of the second substrate SUB2 shown in FIG. 1. The second substrate SUB2 includes a common electrode CE constituting the sensor element 5 and an insulating base material 30 (second insulating base material) that supports the common electrode CE.

[0019] The insulating base material 30 includes a plurality of body portions 31 (second island portions), and hinge portions 32 and 33 (second strip portions) formed integrally with the body portions 31, and is formed in a mesh shape having an opening OP2. The insulating base material 30 has flexibility and can be formed of, for example, polyimide, polyethylene terephthalate, polydimethylsiloxane, etc., but is not limited to this example.

[0020] The plurality of body portions 31 are arranged in a matrix in the first direction D1 and the second direction D2 with a space therebetween. Each of the body portions 31 is formed in, for example, a quadrangular shape (rhombus shape) in a plan view. Note that the body portion 31 may be formed in other polygonal shapes, or may be formed in a circular shape or an elliptical shape.

[0021] The hinge portion 32 extends generally in the first direction D1 and is arranged in the second direction D2. The hinge portion 32 connects the plurality of body portions 31 arranged in the first direction D1. The hinge portion 33 extends generally in the second direction D2 and is arranged in the first direction D1. The hinge portion 33 connects the plurality of body portions 31 arranged in the second direction D2. The hinge portions 32 and 33 are each formed in a meandering shape (meander shape) in a plan view.

[0022] The body portion 31 has the same shape as the body portion 11 of the insulating base material 10 and overlaps the body portion 11 in a plan view. The hinge portion 32 has the same shape as the hinge portion 12 of the insulating base material 10 and overlaps the hinge portion 12 in a plan view. The hinge portion 33 has the same shape as the hinge portion 13 of the insulating base material 10 and overlaps the hinge portion 13 in a plan view. The opening OP2 of the insulating base material 30 has the same shape as the opening OP1 of the insulating base material 10 and overlaps the opening OP1 in a plan view.

[0023] The common electrode CE extends overlapping the body portion 31 and the hinge portions 32 and 33. In other words, the common electrode CE is formed in a mesh-like manner with openings OP2, similar to the insulating substrate 30 described above.

[0024] Figure 4 is a plan view of a portion of the electronic device 1 shown in Figure 1 (active region AA), and is a plan view showing the electronic device 1 before extension (electronic device 1 in a state where no tensile force is applied).

[0025] The electronic device 1 includes a first substrate SUB1 and a second substrate SUB2, as well as an expandable member EM. The expandable member EM is positioned to cover the first substrate SUB1 and the second substrate SUB2, and the expandable member EM fills the opening OP1 in the mesh-like insulating substrate 10 of the first substrate SUB1 and the opening OP2 in the mesh-like insulating substrate 30 of the second substrate SUB2. In other words, the opening OP1 in the insulating substrate 10 and the opening OP2 in the insulating substrate 30 are filled with the expandable member EM.

[0026] In the expandable member EM, notches EM1 are formed around each body portion 11 and 31. The notches EM1 are formed to penetrate from the top surface to the bottom surface of the expandable member EM. The notches EM1 are formed along each side of the square (rhomboid) shaped body portions 11 and 31, with four notches EM1 formed for each body portion 11 and 31. It is desirable that the notches EM1 be formed at a predetermined distance from each side (end) of the body portions 11 and 31. Specifically, it is desirable that the notches EM1 be formed at a distance of at least 10 μm from each side (end) of the body portions 11 and 31. Although Figure 4 illustrates the case where the notches EM1 are formed in a straight line, the notches EM1 are not limited to this example and may be formed in any shape (for example, wavy or triangular). Note that, of the elements shown in Figure 4, elements other than the expansion joint EM have already been explained with reference to Figures 2 and 3, so a detailed explanation of them will be omitted here.

[0027] Figure 5 is a cross-sectional view of the electronic device 1 cut along line A and B in Figure 4. Here, we will mainly describe the configuration of the sensor element 5. As shown in Figure 5, the sensor element 5 includes a switching element SW, a sensor electrode SE, a common electrode CE, a pressure-sensitive layer 40, and the like.

[0028] First, the configuration of the first substrate SUB1 will be described. The insulating substrate 10 has a film thickness of, for example, 10 μm. A switching element SW is placed on the insulating substrate 10. In Figure 5, the switching element SW is shown in a simplified manner, but in reality, the switching element SW includes semiconductor layers and electrodes for each layer (for example, a gate electrode formed by a part of the scan line GL, a source electrode formed by a part of the signal line SL, a drain electrode formed in the same layer as the signal line SL, etc.). An insulating layer 20 is placed on the insulating substrate 10 and the switching element SW. The insulating layer 20 is composed of at least one insulating film and covers the switching element SW. A sensor electrode SE is placed on the insulating layer 20. The sensor electrode SE is placed in a position that overlaps with the body portion 11 of the insulating substrate 10. The sensor electrode SE is formed of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO). Although not shown in Figure 5, the switching element SW and the sensor electrode SE are electrically connected via a contact hole.

[0029] Next, the configuration of the second substrate SUB2 will be described. The insulating substrate 30 has a film thickness of, for example, 50 μm. A common electrode CE is placed beneath the insulating substrate 30. The common electrode CE is positioned to overlap with the body portion 31 of the insulating substrate 30 and the hinge portions 32 and 33, which are not shown in Figure 5. The common electrode CE is formed of an organic conductive material.

[0030] A pressure-sensitive layer 40 is positioned between the first substrate SUB1 and the second substrate SUB2. The pressure-sensitive layer 40 is positioned at least in a location that overlaps with the body portion 11 of the insulating substrate 10 and the body portion 31 of the insulating substrate 30. The pressure-sensitive layer 40 contains an insulator 41 and conductive particles 42. When pressure is applied from the second substrate SUB2 side, the conductive particles 42 contained in the pressure-sensitive layer 40 come into contact with the sensor electrode SE and the common electrode CE. The electronic device 1 detects the change in contact resistance caused by the conductive particles 42 coming into contact with the sensor electrode SE and the common electrode CE, and measures the magnitude of the pressure applied to the electronic device 1.

[0031] The first substrate SUB1, the second substrate SUB2, and the pressure-sensitive layer 40 are covered by an expandable member EM. This allows the first substrate SUB1, the second substrate SUB2, and the pressure-sensitive layer 40 to be fixed together by the expandable member EM, thereby suppressing displacement of the elements constituting the sensor element 5 when pressure is applied from the second substrate SUB2 side.

[0032] As shown by the dashed line in Figure 5, the expandable member EM has a notch EM1 formed at a predetermined distance from the ends of the body portions 11 and 31. When the expandable member EM is not extended (in other words, when no tensile force is applied to the expandable member EM), a small force acts in the contraction direction, so as shown in Figure 5, the notch EM1 remains closed and does not open.

[0033] Figure 6 is an enlarged plan view of a portion of the electronic device 1 shown in Figure 1 (active region AA), showing the electronic device 1 after extension (electronic device 1 under tensile force). Figure 7 is a cross-sectional view of the electronic device 1 cut along line CD in Figure 6.

[0034] In the extended electronic device 1, the meandering hinge portions 12, 13, 32, and 33 extend and become straight, as shown in Figure 6. Also, in the extended electronic device 1, as shown in Figures 6 and 7, the notch EM1 formed in the expandable member EM opens up to form an opening OP3. As described above, since the notch EM1 is formed at a predetermined distance (specifically, about 10 μm away) from each side (end) of the body portions 11 and 31, the opening OP3 does not come into contact with (interfere with) the body portions 11 and 31. In other words, it is desirable that the notch EM1 be formed at a distance such that when it opens to form the opening OP3 during the extension of the expandable member EM, the opening OP3 does not come into contact with the body portions 11 and 31.

[0035] By forming notches EM1 around the body portions 11 and 31, and creating openings OP3 when stretched, the tensile force applied to the body portions 11 and 31 can be mitigated. This reduces the tensile force applied to the sensor element 5, which is positioned to overlap with the body portions 11 and 31, thereby suppressing changes in the thickness of the pressure-sensitive layer 40 that constitutes the sensor element 5 before and after stretching. If the thickness of the pressure-sensitive layer 40 changes before and after stretching, it is possible that different pressure values ​​may be measured even if the same amount of pressure is applied before and after stretching. However, according to the configuration of this embodiment, as described above, it is possible to suppress changes in the thickness of the pressure-sensitive layer 40 before and after stretching, so that the accuracy (reliability) of pressure measurement can be improved compared to a configuration in which notches EM1 are not formed.

[0036] Unlike the configuration described above, the electronic device 1 may further include an adhesive layer AD, as shown in Figure 8, which bonds the configuration on the first substrate SUB1 side and the configuration on the second substrate SUB2 side and seals the pressure-sensitive layer 40. As shown in Figure 8, the adhesive layer AD is positioned to overlap with the outer circumference of the body portion 11 of the insulating substrate 10 and the body portion 31 of the insulating substrate 30. Even with this configuration, the fact that the notches EM1 are formed around the body portions 11 and 31 remains unchanged, so it is possible to obtain the same effects as described above.

[0037] Furthermore, although this embodiment illustrates a configuration in which the sensor element 5 includes a pressure-sensitive layer 40, the invention is not limited to this example. For example, as shown in Figure 9, the sensor element 5 may have a sensor sheet SS instead of a pressure-sensitive layer 40. The sensor sheet SS is positioned below the common electrode CE on the second substrate SUB2 side and faces the sensor electrode SE. The configuration on the second substrate SUB2 side, including the sensor sheet SS, and the configuration on the first substrate SUB1 side are bonded together by an adhesive layer AD. A gap is provided between the sensor sheet SS and the sensor electrode SE, and when pressure is applied from the second substrate SUB2 side, the sensor sheet SS comes into contact with the sensor electrode SE. The electronic device 1 detects the change in contact resistance caused by the sensor sheet SS coming into contact with the sensor electrode SE and measures the pressure applied to the electronic device 1. Even with this configuration, the fact that notches EM1 are formed around the body portions 11 and 31 remains unchanged, so it is possible to obtain the same effects as described above.

[0038] In the embodiment described above, the hinge portions 12 and 13 of the insulating substrate 10, the scan line GL, the signal line SL, the hinge portions 32 and 33 of the insulating substrate 30, and the common electrode CE were all described as being formed in a meandering shape. However, these may also be formed in a zigzag shape, or in a curved shape combining multiple curves with different curvatures.

[0039] Furthermore, in the embodiment described above, the common electrode CE is positioned on the second substrate SUB2 side, but the common electrode CE may also be positioned on the first substrate SUB1 side. In this case, considering the manufacturing process, it is desirable that the common electrode CE be formed in the same layer and from the same material as the sensor electrode SE. Also, in this case, considering the manufacturing process, it is desirable that the common electrode CE be positioned only in a location that overlaps with the body portion 11, and not in a location that overlaps with the hinge portions 12 and 13 or in the opening OP1.

[0040] According to the embodiment described above, it is possible to provide an electronic device 1 that can improve the reliability of sensing by sensor elements 5 mounted on a stretchable first substrate SUB1 and a second substrate SUB2.

[0041] Although several embodiments of the present invention have been described, these embodiments are presented as examples only and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims of the invention and its equivalents. [Explanation of symbols]

[0042] 1...Electronic device, SUB1...First substrate, SUB2...Second substrate, 10...Insulating substrate, 11...Body part, 12,13...Hinge part, GL...Scanning line, SL...Signal line, SE...Sensor electrode, 30...Insulating substrate, 31...Body part, 32,33...Hinge part, CE...Common electrode, 40...Pressure-sensitive layer, EM...Expandable member, EM1...Notch.

Claims

1. First substrate and A second substrate facing the first substrate, A pressure-sensitive layer disposed between the first substrate and the second substrate, The device comprises the first substrate, the second substrate, and an expandable member covering the pressure-sensitive layer, The first substrate is, A first insulating substrate formed in a mesh shape includes a plurality of first island-shaped portions and a plurality of first strip-shaped portions connecting two adjacent first island-shaped portions, Wiring arranged on the first strip-shaped portion, Includes a sensor electrode positioned on the first island-shaped portion and electrically connected to the wiring, The aforementioned second substrate is A second insulating substrate formed in a mesh shape includes a plurality of second island-shaped portions and a plurality of second strip-shaped portions connecting two adjacent second island-shaped portions, A common electrode, which is arranged below the second island-shaped portion and the second strip-shaped portion and is formed in a mesh-like manner, is included. The expandable member includes notches formed around the first island-shaped portion and the second island-shaped portion, which open when the expandable member is extended. electronic equipment.

2. The aforementioned notches are formed at a predetermined distance from the ends of the first island-shaped portion and the second island-shaped portion. The electronic device according to claim 1.

3. The aforementioned notches are formed at a distance from the ends of the first and second island-shaped portions such that they do not come into contact with the first and second island-shaped portions when the expandable member is extended and opens. The electronic device according to claim 2.

4. The aforementioned notches are formed at a position at least 10 μm away from the ends of the first island portion and the second island portion. The electronic device according to claim 3.

5. The first island-shaped portion and the second island-shaped portion are formed in a rectangular shape and overlap each other in a plan view. The aforementioned notches are formed in a straight line along each side of the first island-shaped portion and the second island-shaped portion, at a predetermined distance from each side. The electronic device according to claim 1.

6. The device further comprises an adhesive layer positioned in a plan view that overlaps with the outer periphery of the first island-shaped portion and the second island-shaped portion, and which adheres the first substrate and the second substrate together. The electronic device according to claim 1.

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