Display devices and television receivers

Abstract

To provide a display device which allows heat to be dissipated from control members controlling a display panel.SOLUTION: A display device (1) provided herein comprises a display panel (2), a back cover (3) provided on a back surface (21) of the display panel, control members (4) for controlling the display panel, the control members having front surfaces (41) facing a back surface (31) of the back cover, and a frame (5) covering the back cover and a back surface of the control member. Multiple protrusions (32) protruding on the back side of the back cover are spaced apart from each other and are in contact with the front surfaces of the control members.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a display device and a television receiver.

Background Art

[0002] Patent Document 1 discloses an image display device including a display panel for displaying an image. FIG. 7 is a cross-sectional view showing the configuration of an image display device 1 according to Patent Document 1, which is a conventional technique.

[0003] As shown in FIG. 7, in the image display device 1, a back cover 3 is joined to the back surface 21 of the display panel 2 via an adhesive sheet 6. A thin portion 39 is formed at the lower part of the back cover 3. A driving IC 4 is disposed via a heat insulating member 20 on the back surface of the thin portion 39. The driving IC 4 is an IC that transmits various signals to the display panel 2 and generates heat during operation.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the above image display device 1, since the heat insulating member 20 is disposed on the display panel ② side of the driving IC 4, the possibility of heat conduction from the driving IC 4 to the display panel 2 is reduced. However, due to the heat insulating member 20, the driving IC 4 cannot radiate heat on the display panel 2 side, so the temperature may rise and deteriorate. In addition, there is also a possibility that the quality of the display panel 2 deteriorates due to heat generation of the driving IC 4.

[0006] One aspect of the present invention aims to dissipate heat of a control member that controls a display panel in a display device.

Means for Solving the Problems

[0007] To solve the above problems, a display device according to one aspect of the present invention comprises a display panel, a back cover provided on the back of the display panel, a control member having a front surface facing the back surface of the back cover and controlling the display panel, and a frame covering the back surface of the back cover and the back surface of the control member, wherein the back cover is provided with a plurality of protrusions projecting toward the back side, spaced apart from each other, and the plurality of protrusions are configured to contact the front surface of the control member.

[0008] Furthermore, a display device according to one aspect of the present invention comprises a display panel, a control member disposed on the back of the display panel for controlling the display panel, and a frame covering the back of the display panel and the back of the control member, wherein the frame is provided with a plurality of protrusions projecting toward the front side, spaced apart from each other, and the plurality of protrusions are configured to contact the back of the control member. [Effects of the Invention]

[0009] According to one aspect of the present invention, heat can be dissipated from the control member that controls the display panel in a display device. [Brief explanation of the drawing]

[0010] [Figure 1] This figure shows the configuration of a display device according to Embodiment 1 of the present invention. [Figure 2] This is a cross-sectional view showing the configuration of a display device according to Embodiment 2 of the present invention. [Figure 3] This is a cross-sectional view showing the configuration of a display device according to Embodiment 2 of the present invention. [Figure 4] This is a cross-sectional view showing the configuration of a display device according to Embodiment 3 of the present invention. [Figure 5] This figure shows the shape of the fins in a back cover, etc., according to Embodiments 1 to 3 of the present invention, and their effects. [Figure 6]This figure shows the shape of the fins and their effects in the back cover according to Embodiment 4 of the present invention. [Figure 7] This is a cross-sectional view showing the configuration of a conventional image display device. [Modes for carrying out the invention]

[0011] [Embodiment 1] The following describes in detail a display device 1 according to one embodiment of the present invention.

[0012] Figure 1 is a diagram showing the configuration of the display device 1 according to this embodiment. The upper left of Figure 1 is a perspective view of the display device 1. The upper right of Figure 1 is a cross-sectional view of the display device 1. The lower part of Figure 1 is a rear view of the lower part of the back cover 3. A television receiver equipped with the display device 1 is also included in the invention described herein.

[0013] As shown in Figure 1, the display device 1 comprises a single housing and includes a display panel 2, a back cover 3, a drive IC (control component) 4, a frame 5, an adhesive sheet 6, an FPC 7, and a source board 8. Note that the frame 5 and FPC 7 are omitted from the illustration in the upper left of Figure 1.

[0014] The display panel 2 is a panel that displays images, and is, for example, an organic light-emitting diode (OLED) display panel. The back cover 3 is formed from a metal plate-like member, such as aluminum or iron, and is a member created by pressing or other processes. The back cover 3 is provided on the back surface 21 of the display panel 2 and is, for example, bonded to the back surface 21 via an adhesive sheet 6. The back cover 3 functions as a heat dissipation member that releases heat from the display panel 2.

[0015] The driving IC 4 is an IC that drives (controls) the display panel 2 and is arranged on the back surface 31 of the back cover 3. The driving IC 4 has a front surface 41 facing the back surface 31 of the back cover 3. The frame 5 is a member that covers the back surface 31 of the back cover 3 and the back surface 42 of the driving IC 4, and is covered at least between the lower end of the back surface 31 of the back cover 3 and the upper end of the back surface 42 of the driving IC 4. The adhesive sheet 6 is, for example, a double-sided tape in which adhesives are arranged on both sides of a sheet-like base material, and is a double-sided tape with high thermal conductivity. The FPC 7 is an example of a wiring member that connects the display panel 2 and the source substrate 8. The source substrate 8 is an electronic circuit board that generates various signals such as a clock signal and transmits the various signals to the display panel 2 via the FPC 7.

[0016] A plurality of convex portions 32 protruding toward the back surface 31 are provided at intervals from each other between at least the lower end of the back surface 31 of the back cover 3 and the installation position of the driving IC 4. The plurality of convex portions 32 are configured to contact the front surface 41 of the driving IC 4. As shown in the upper left figure of FIG. 1, the plurality of convex portions 32 are, for example, in a direction parallel to the back surface 31 of the back cover 3, and are formed in a fin shape in which a plurality of rectangular parallelepipeds (convex portions 32) extending细长ly from the lower end to the upper end of the back cover 3 are arranged in parallel in the direction from the right end to the left end of the back cover 3. Since the plurality of convex portions 32 are spaced apart from each other, a concave portion 33 is formed therebetween.

[0017] And the back cover 3 has higher thermal conductivity than the driving IC 4, and the concave portion 33 of the back cover 3 is configured to contact air (medium) having higher thermal conductivity than the back cover 3. Therefore, when the driving IC 4 operates and the temperature rises, the heat of the driving IC 4 is conducted from the driving IC 4 to the back cover 3 and further dissipated from the back cover 3 to the air in the housing.

[0018] According to the above, the heat of the driving IC 4 is absorbed by the plurality of convex portions 32 of the back cover 3 that contact the front surface 41 of the driving IC 4 and is released from the portion that does not contact the driving IC 4. Therefore, heat dissipation on the display panel 2 side of the driving IC 4 can be achieved. Thereby, deterioration of the quality of the display panel 2 can be prevented.

[0019] Note that an internal space for accommodating the driving IC 4 is provided between the back cover 3 and the frame 5. The internal space is sealed at the upper part of the frame 5 by the frame 5 covering it. In this case, a through hole penetrating the internal space and the outside may be provided in the upper part of the frame 5.

[0020] Generally, in the display device 1, since telops and supers of television broadcasts are often displayed in bright primary colors at the lower part of the display panel 2, the lower part of the display panel 2 tends to become hot intensively.

[0021] The air that enters the housing of the display device 1 flows upward along the back surface 31 of the back cover 3 from the lower part of the back cover 3 whose temperature has risen due to heat conduction from the display panel 2.

[0022] At that time, heat dissipation of the back cover 3 is performed by the air absorbing the heat of the back cover 3. And the air that has absorbed the heat of the back cover 3 flows from the lower side to the upper side of the housing of the display device 1 due to thermal expansion.

[0023] (Effect of Embodiment 1) According to Embodiment 1, since the lower part of the back surface 31 of the back cover 3 is formed with a plurality of convex portions 32 (for example, fin shapes), the driving IC 4 comes into contact with the back cover 3 at a plurality of positions. Therefore, the heat generated in the driving IC 4 is likely to be dissipated to the back cover 3. In other words, heat dissipation of the driving IC 4 is efficiently performed. And by the heat dissipation of the driving IC 4, deterioration of the driving IC 4 can be suppressed.

[0024] 〔Embodiment 2〕 Embodiment 2 of the present invention will be described below. For the sake of convenience, components having the same function as those described in Embodiment 1 will be denoted by the same reference numerals, and their descriptions will not be repeated.

[0025] Figure 2 is a cross-sectional view showing the configuration of the display device 1a according to this embodiment. As shown in Figure 2, the display device 1a comprises a single housing and includes a display panel 2, a drive IC (control component) 4, a frame 5, a source board 8, and an inner plate 9.

[0026] The drive IC 4 is located on the back surface 21 of the display panel 2 and drives (controls) the display panel 2. The frame 5 is a component that covers the back surface 21 of the display panel 2 and the back surface 42 of the drive IC 4.

[0027] The frame 5 has a plurality of protrusions 52 that project toward the inner surface (front surface) 51, spaced apart from each other. The plurality of protrusions 52 are configured to contact the back surface 42 of the drive IC 4. The plurality of protrusions 52 are formed in the shape of fins, for example, with a plurality of rectangular parallelepipeds (protrusions 52) that extend elongated in a direction parallel to the inner surface 51 of the frame 5 and toward the lower end to the upper end of the frame 5, and arranged in parallel in a direction toward the right end to the left end of the frame 5.

[0028] The source board 8 is an electronic circuit board located on the back 21 of the display panel 2 that generates various signals such as clock signals and transmits these signals to the display panel 2. The inner plate 9 is located on the back 21 of the display panel 2 and functions as a heat sink to reduce the heat of the display panel 2.

[0029] As described above, the heat from the drive IC 4 is absorbed by the multiple protrusions 52 on the frame 5 that are in contact with the back surface 42 of the drive IC 4, and released from the parts that are not in contact with the drive IC 4. This allows for heat dissipation of the drive IC 4 on the frame 5 side. This prevents deterioration of the quality of the display panel 2.

[0030] Furthermore, an internal space housing the drive IC 4 is provided between the display panel 2 and the frame 5. This internal space is sealed at the top of the frame 5 by being covered by the frame 5. A through hole 53 is provided at the top of the frame 5 that penetrates the internal space to the outside.

[0031] As described above, the heat from the drive IC 4 is conducted to the multiple protrusions 52 that are in contact with the drive IC 4, and is released from the parts that are not in contact with the drive IC 4, and then conducted upward into the internal space. Since the through hole 53 is provided in the upper part of the frame 5, the heat can be released from the internal space to the outside. Therefore, further heat dissipation of the drive IC 4 can be achieved.

[0032] Figure 3 is a cross-sectional view showing the configuration of the display device 1b according to this embodiment. As shown in Figure 3, the display device 1b comprises a single housing and includes a display panel 2, a drive IC 4, a frame 5, a source board 8, and an inner plate 10.

[0033] The driver IC 4 is located on the back 21 of the display panel 2 and drives (controls) the display panel 2. The frame 5 covers the back 21 of the display panel 2, the back 42 of the driver IC 4, and the back 81 of the source board 8.

[0034] The source board 8 is an electronic circuit board located on the back surface 21 of the display panel 2 that generates various signals such as clock signals and transmits these signals to the display panel 2. The inner plate 10 is located on the back surface 21 of the display panel 2 and functions as a heat sink to reduce the heat of the display panel 2. The lower part of the inner plate 10 has a plurality of protrusions 102 that project toward the front and are spaced apart from each other. The plurality of protrusions 102 are configured to contact the back surface 42 of the drive IC 4. The plurality of protrusions 102 are formed in the shape of fins, for example, with a plurality of rectangular parallelepipeds (protrusions 102) that extend elongated in a direction parallel to the front surface of the inner plate 10 and toward the lower end to the upper end of the inner plate 10, and arranged in parallel in a direction toward the right end to the left end of the inner plate 10.

[0035] As described above, the heat from the drive IC 4 is absorbed by the multiple protrusions 102 on the inner plate 10 that are in contact with the back surface 42 of the drive IC 4, and is released from the parts that are not in contact with the drive IC 4. This allows for heat dissipation from the inner plate 10 side of the drive IC 4. This prevents deterioration of the quality of the display panel 2.

[0036] Furthermore, an internal space housing the drive IC 4 is provided between the display panel 2 and the inner plate 10 and frame 5. This internal space is sealed at the top of the inner plate 10 and frame 5 by covering it with the inner plate 10 and frame 5. A through hole 103 is provided at the top of the inner plate 10 that penetrates the internal space to the outside. A through hole 53 is provided at the top of the frame 5 that penetrates the internal space to the outside.

[0037] As described above, the heat from the drive IC 4 is conducted to the multiple protrusions 102 that are in contact with the drive IC 4, and is released from the parts that are not in contact with the drive IC 4, and is conducted upward into the internal space. Since through holes are provided in the upper part of the inner plate 10 and frame 5, the heat can be released from the internal space to the outside. Therefore, further heat dissipation of the drive IC 4 can be achieved.

[0038] (Effects of Embodiment 2) According to Embodiment 2, since air is allowed to escape from the back surface 42 of the drive IC 4, the back cover 3 can dissipate the heat absorbed from the drive IC 4 by heat conduction. By forming the frame 5 or inner plate 10 superimposed on the back surface 42 of the drive IC 4 into multiple protrusions (for example, fin shape), the speed at which air flows can be increased.

[0039] This allows for the exchange of heat not only within the drive IC 4 but also within the housing of the display device 1a or 1b. As a result, the inside of the housing can be cooled.

[0040] [Embodiment 3] Embodiment 3 of the present invention will be described below. For the sake of convenience, components having the same function as those described in Embodiments 1 and 2 will be denoted by the same reference numerals, and their descriptions will not be repeated.

[0041] Figure 4 is a cross-sectional view showing the configuration of the display device 1c according to this embodiment. As shown in Figure 4, the display device 1c comprises a single housing and includes a display panel 2, a back cover 3, a drive IC 4, a frame 5, an FPC 7, and a source board 8.

[0042] The back cover 3 has a plurality of protrusions 32 that project toward the rear side, spaced apart from each other. The plurality of protrusions 32 are configured to contact the front surface 41 of the drive IC 4. The plurality of protrusions 32 are formed in the shape of fins, for example, with a plurality of rectangular parallelepipeds (protrusions 32) that extend elongated in a direction parallel to the rear surface 31 of the back cover 3 and toward the upper end of the back cover 3, and arranged in parallel in a direction toward the right end to the left end of the back cover 3.

[0043] On the other hand, the frame 5 has a plurality of protrusions 52 that project toward the inner surface (front surface) 51, spaced apart from each other. The plurality of protrusions 52 are configured to contact the back surface 42 of the drive IC 4. The plurality of protrusions 52 are formed in the shape of fins, for example, with a plurality of rectangular parallelepipeds (protrusions 52) that extend elongated in a direction parallel to the inner surface 51 of the frame 5 and toward the lower end to the upper end of the frame 5, and arranged in parallel in a direction toward the right end to the left end of the frame 5.

[0044] Therefore, both the front surface 41 and the back surface 42 of the drive IC 4 will be in contact with multiple protrusions that form the shape of fins.

[0045] As described above, the heat from the drive IC 4 is absorbed by the multiple protrusions 52 on the frame 5 that are in contact with the back surface 42 of the drive IC 4, and is released from the parts that are not in contact with the drive IC 4, thus enabling heat dissipation of the drive IC 4 on the frame 5 side. This further prevents deterioration of the quality of the display panel 2.

[0046] In Figure 4, the back surface 42 of the drive IC 4 is connected to the multiple protrusions 52 via the FPC 7, but it may also be in direct contact with the multiple protrusions 52. Even if the back surface 42 of the drive IC 4 is connected to the multiple protrusions 52 via the FPC 7, the heat from the drive IC 4 will still be conducted to the multiple protrusions 52 via the FPC 7.

[0047] Furthermore, an internal space housing the drive IC 4 is provided between the back cover 3 and the frame 5. This internal space is sealed at the top of the frame 5 by being covered by the frame 5. In this case, a through hole may be provided at the top of the frame 5 that penetrates from the internal space to the outside.

[0048] (Effects of Embodiment 3) According to Embodiment 3, since the structure allows air to escape from the front 41 of the drive IC 4, the protrusion 32 of the back cover 3 can dissipate the heat absorbed from the front 41 of the drive IC 4 by thermal conduction. Also, since the structure allows air to escape from the back 42 of the drive IC 4, the heat absorbed from the back 42 of the drive IC 4 can dissipate from the inner surface 51 of the frame 5 by thermal conduction.

[0049] Next, by shaping the lower part of the back surface 31 of the back cover 3 that is in contact with the back surface 42 of the drive IC 4 into a fin shape (multiple protrusions 32), the speed at which air flows between the back cover 3 and the drive IC 4 can be increased. Also, by shaping the lower part of the inner surface 51 of the frame 5 that is in contact with the back surface 42 of the drive IC 4 into a fin shape (multiple protrusions 52), the speed at which air flows between the back cover 3 and the drive IC 4 can be increased.

[0050] Therefore, the airflow velocity inside the housing of the display device 1c can be increased, allowing for the exchange of air between the housing and the outside air. This enables the dissipation of heat from the drive IC 4, as well as the heat accumulated inside the housing, to the outside. As a result, the inside of the housing can be cooled.

[0051] [Embodiment 4] Embodiment 4 of the present invention will be described below. For the sake of convenience, components having the same function as those described in Embodiments 1 to 3 of the present invention will be denoted by the same reference numerals, and their descriptions will not be repeated.

[0052] Figure 5 shows the shape of the fins in the back cover 3, etc., according to embodiments 1 to 3 of the present invention, and their effects. The upper part of Figure 5 shows the appearance of the back surface 31 of the back cover 3 and the effect of heat dissipation. The Z direction is parallel to the back surface 31 of the back cover 3, perpendicular to the boundary line between the part of the back surface 31 with fins and the part without fins, and indicates the direction from the part with fins to the part without fins. As shown in the upper part of Figure 5, since the height of the fins on the back cover 3 from the back surface 31 is uniform, the effect of heat dissipation changes abruptly at the boundary line and becomes uniform thereafter. Accordingly, the temperature of the display panel 2 changes abruptly at the boundary line and becomes uniform thereafter.

[0053] The lower part of Figure 5 shows the display state of the display panel 2 according to embodiments 1 to 3. If there is a rapid temperature difference between the part with fins and the part without fins, a significant difference in brightness will appear at the boundary line, as shown in the lower part of Figure 5.

[0054] Furthermore, Figure 5 is applicable not only to the back cover 3 of Embodiment 1, but also to the frame 5 and inner plate 10 of Embodiment 2, and the back cover 3 and frame 5 of Embodiment 3.

[0055] Figure 6 shows the shape of the fins in the back cover 3a according to this embodiment and their effects. The back cover 3a is an improvement over the back cover 3.

[0056] The upper part of Figure 6 shows the appearance of the back surface 31a of the back cover 3a and its heat dissipation effect. The explanation for the Z direction is the same as in Figure 5. The height of the multiple protrusions 32a gradually decreases from the bottom to the top of the back cover 3a relative to the back surface 31a.

[0057] The multiple protrusions 32a, for example, have their heights changed in stages. Also, the multiple protrusions 32a and recesses 33a, for example, have their widths changed in stages. As shown in the upper part of Figure 6, the multiple protrusions 32a consist of three layers, for example, protrusions 32a1, 32a2, and 32a3. The height from the back surface 31a increases in the order of protrusions 32a1, 32a2, and 32a3. Also, protrusion 32a2 is narrower than protrusions 32a1 and 32a3. As a result, since the height of the fins on the back cover 3 from the back surface 31 is stepped, the heat dissipation effect changes gradually from the boundary line. Accordingly, the temperature of the display panel 2 changes gradually from the boundary line.

[0058] The lower part of Figure 6 shows the display state of the display panel 2 according to this embodiment. As shown in the lower part of Figure 6, by eliminating the abrupt temperature difference between the part with fins and the part without fins, the difference in brightness can be prevented from becoming noticeable.

[0059] Furthermore, Figure 6 is applicable not only to the back cover 3a of this embodiment, but also to improvements to the frame 5 and inner plate 10 of Embodiment 2, and the back cover 3 and frame 5 of Embodiment 3.

[0060] (Effects of Embodiment 4) According to Embodiment 4, the height of the multiple protrusions 32a gradually decreases from the bottom to the top relative to the back surface 31a of the back cover 3a, thus avoiding rapid temperature changes in the display panel 2, and preventing significant differences in brightness on the display panel 2.

[0061] [Variation] The embodiments of the present invention are not limited to embodiments 1 to 4 described above. For example, in the embodiments described above, the shape of the fins was shown to be formed on the lower part of the back surface 31 of the back cover 3, for example, but the range (formation area) is not limited to that. The shape of the fins may be formed from the lower part to the upper part of the back surface 31 of the back cover 3, for example.

[0062] On the other hand, on the back surface 31 of the back cover 3, the fin shape (multiple protrusions) may be provided only in the area facing the drive IC 4. In this case, since multiple protrusions are provided only in the area facing the drive IC 4 on the back cover 3, etc., there are no unnecessary parts, and heat dissipation of the control member can be achieved efficiently.

[0063] Next, Embodiment 4 shows an example in which the height of the multiple protrusions 32a is changed in stages, but the shape is not limited to this. The multiple protrusions may, for example, have a fin shape with a gentle slope, and more specifically, the height of the fin from the back surface 31 may be higher at the bottom and gradually lower towards the top.

[0064] Furthermore, in the above embodiment, the through-hole 53 in the frame 5 and the through-hole 103 in the inner plate 10 were shown as single holes, but the structure is not limited to this. The through-hole may, for example, consist of many small holes.

[0065] Furthermore, in the above embodiment, as shown in Figures 5 and 6, the fin shape is shown as being formed in the Z direction, but it is not limited to that direction. The fin shape may be formed, for example, on the back surface 31 of the back cover 3, such as radiating outwards from a position corresponding to the drive IC 4 (or converging at that position).

[0066] 〔summary〕 A display device according to embodiment 1 of the present invention comprises a display panel, a back cover provided on the back of the display panel, a control member having a front surface facing the back of the back cover and controlling the display panel, and a frame covering the back of the back cover and the back of the control member, wherein the back cover is provided with a plurality of protrusions projecting toward the back side, spaced apart from each other, and the plurality of protrusions are configured to contact the front surface of the control member.

[0067] In the display device according to aspect 2 of the present invention, in aspect 1, the frame is provided with a plurality of protrusions that project toward the front side, spaced apart from each other, and the plurality of protrusions may be configured to contact the back surface of the control member.

[0068] A display device according to aspect 3 of the present invention comprises a display panel, a control member disposed on the back of the display panel for controlling the display panel, and a frame covering the back of the display panel and the back of the control member, wherein the frame is provided with a plurality of protrusions that project toward the front side, spaced apart from each other, and the plurality of protrusions are configured to contact the back of the control member.

[0069] In the display device according to aspect 4 of the present invention, as in aspects 1 to 3 above, the upper part of the frame may be provided with a through hole that penetrates from the internal space housing the control member to the outside.

[0070] In the display device according to aspect 5 of the present invention, in aspects 1 to 4 described above, the height of the plurality of protrusions may gradually decrease from the bottom to the top.

[0071] In the display device according to embodiment 6 of the present invention, the plurality of protrusions may be provided only in the region facing the control member, as in embodiments 1 to 4 above.

[0072] The present invention is not limited to the embodiments described above, and various modifications are possible within the scope of the claims. Embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included in the technical scope of the present invention. Furthermore, new technical features can be formed by combining the technical means disclosed in each embodiment. [Explanation of symbols]

[0073] 1 Display device 2 Display Panel 21 Back 3. Back cover 31 Back 32 Convex part 4. Drive IC (control component) 41 Front 42 Back 5 frames 52 Convex part 53 Through hole 10 Inner Plate 102 Convex part 103 Through hole

Claims

1. Display panel and, A back cover is provided on the back of the aforementioned display panel, Having a front surface facing the back of the back cover, and a control member for controlling the display panel, A frame that covers the back of the back cover and the back of the control member, Equipped with, The control member is provided at the lower part of the back cover, The air for dissipating heat from the back cover is configured to flow from the bottom to the top of the back cover, along the back surface of the back cover. Multiple first protrusions are provided spaced apart from each other on the lower rear surface of the back cover, at least from the lower end to the location where the control member is installed, projecting toward the rear side. The plurality of first protrusions are formed in a fin shape, extending elongated from the lower end to the upper end of the back cover, with their height gradually decreasing from the bottom to the top, in order to avoid rapid temperature changes in the display panel, and are configured to contact the front surface of the control member. A display device characterized by the following features.

2. The frame is provided with a plurality of second protrusions that project toward the front, spaced apart from each other. The plurality of second protrusions are configured to contact the back surface of the control member. The display device according to feature 1.

3. The upper part of the frame is provided with a through hole that penetrates from the internal space housing the control member to the outside. The display device according to claim 1 or 2.

4. The plurality of second protrusions are provided only in the region facing the control member. The display device according to feature 2.

5. A television receiver characterized by comprising the display device described in any one of claims 1 to 4.

Images