A transducer unit, a transducer assembly including a transducer unit, an ultrasonic probe including a transducer unit, an ultrasonic diagnostic apparatus including a transducer unit, and a method for manufacturing a transducer unit.

Abstract

To improve the reliability of the transducer unit while maintaining its size. [Solution] In one embodiment, a transducer unit 400 is provided. The transducer unit 400 includes a plurality of transducer subunits 441-446. Each of the plurality of transducer subunits 441-446 includes a plurality of elements 401 arranged in a first direction. Each of the plurality of elements 401 includes a layer of transducers. The plurality of transducer subunits are arranged in a second direction such that their respective corresponding elements are aligned in a second direction. The plurality of corresponding elements of the plurality of transducer subunits arranged in the second direction output an ultrasonic signal in response to an input electrical signal from a common input signal line.

Description

Technical Field

[0001] The present invention relates to a vibrator unit including an ultrasonic vibrator, and particularly to a vibrator unit including a plurality of vibrator sub-units.

Background Art

[0002] An ultrasonic vibrator receives high-frequency power from an oscillator and generates ultrasonic vibrations. The generated ultrasonic waves are used in various fields, such as ultrasonic cleaning machines for cleaning various parts, semi-finished products, products, etc., ultrasonic welding machines for joining plastics and metals, ultrasonic processing machines for cutting or severing a processing target, ultrasonic homogenizers for stirring a liquid, ultrasonic atomizing devices for atomizing a target liquid, ultrasonic measuring machines for irradiating a measurement target and analyzing the reflection, attenuation, refraction, etc. of the irradiated ultrasonic waves to measure the characteristics and structure of the measurement target, and ultrasonic treatment instruments for destroying (including heating cancer cells with ultrasonic waves to destroy them), stimulating (such as neuromodulation), etc. specific cells and foreign substances (including gallstones, kidney stones, urinary tract stones, bladder stones, accidentally ingested substances in the digestive tract, etc.) in the living body.

[0003] In order to correspond to the characteristics such as the size of the object irradiated with ultrasonic waves in such fields, it is required to irradiate ultrasonic waves over a predetermined area.

[0004] On the other hand, in order to manufacture a wiring for transmitting high-frequency power from an oscillator to an ultrasonic vibrator and an electrode attached to the ultrasonic vibrator at a predetermined position so that the required functions are exhibited, a vibrator unit including an ultrasonic vibrator, an electrode, etc. has been designed and manufactured conventionally.

[0005] As described above, when it is required to irradiate ultrasonic waves over a predetermined area, the vibrator unit also needs to be designed and manufactured to a size corresponding thereto.

[0006] Oscillator units are often manufactured through processes such as bonding multiple layers and / or machining such as dicing. However, the larger the size (dimensions) of the oscillator unit, the higher the likelihood of defects in the bonding between layers or undesirable damage to the oscillator unit during machining. Consequently, the larger the oscillator unit, the higher the likelihood of one or more of the following occurring: reduced yield, reduced product lifespan, or reduced product performance.

[0007] Figure 13A is a top view of a conventional transducer assembly 7010, Figure 13B is a cross-sectional view when the paper is cut along section AA, which divides the paper vertically, and Figure 13C is a cross-sectional view and its enlarged view when the paper is cut along section BB, which divides the paper horizontally. The example in Figure 13A shows a transducer assembly 10 for a 1D array medical ultrasound probe.

[0008] As shown in Figure 13A, the transducer unit 716 of this embodiment extends in the azimuth direction 40 from a first end 7185 to a second end 7187. The transducer unit 716 has a front surface 7181 that outputs an ultrasonic signal and a back surface 7185 that is connected to the FPC 20. As shown in Figure 11B, the transducer unit 716 of this embodiment includes a second acoustic matching layer 7161, a first acoustic matching layer 7163, a vibrating element 7164, and a metal layer 7165. The transducer 7164 is composed of a vibrating element that vibrates in response to a voltage signal. As will be apparent to those skilled in the art, the types and order of layers included in a conventional transducer unit 716 vary depending on the manufacturer and the type of object being tested. The types and order of layers shown in Figure 13B are just one example, and the present invention can draw background art on transducer units other than the specific transducer unit 716 shown herein. In Figure 13B, reference numeral 44 indicates the depth direction, and reference numeral 40 indicates the azimuth direction.

[0009] The vibrating element 7164 converts electrical signals into vibrations to generate ultrasonic waves, vibrates upon receiving echo signals, and converts these back into electrical signals. The vibrating element 7164 can be formed from known materials such as PZT ceramic. To achieve acoustic matching between the acoustic impedance of the vibrating element 7164 and the acoustic impedance of the subject, a multilayer structure is provided on the vibrating element 7164, consisting of a second acoustic matching layer 7161 and a first acoustic matching layer 7163. The second acoustic matching layer 7161 can be formed from known materials such as cross-linked polystyrene resin (REXOLITE: registered trademark). The first acoustic matching layer 7163 can be formed from known materials such as graphite. The ground electrode 7162 is connected to the first acoustic matching layer 7163.

[0010] An acoustic lens 12 is provided on the upper surface of the second acoustic matching layer 7161 to direct ultrasonic waves that efficiently focus onto the subject, and ultrasonic waves are transmitted and received through the acoustic lens 12. Since the acoustic lens 12 is protected by an acoustic window 28, it is possible to make the acoustic lens 12 from a material that is soft and easily scratched but has excellent acoustic properties, and a material suitable for ultrasonic wave propagation and refraction can be selected. Specifically, silicone rubber can be used as the material for the acoustic lens 12, as its acoustic impedance is close to that of water and it has excellent moldability and release properties.

[0011] The ultrasonic waves generated from the vibrating element 7164 are directed not only forward but also backward. A metal layer 7165 is provided to reflect the backward-directed ultrasonic waves, and a base block 22 made of sound-absorbing material is provided to absorb the backward-directed ultrasonic waves and suppress excess vibrations. Ultrasonic waves have the property of reflecting off hard objects. For this reason, the metal layer 7165 may be formed from a metal such as tungsten, in particular from tungsten carbide, which has high hardness. As will be apparent to those skilled in the art, tungsten carbide is an alloy of tungsten and carbon. Tungsten carbide is known as the second hardest material after diamond. In addition to its high hardness, tungsten carbide also has excellent wear resistance, corrosion resistance, impact resistance, and durability.

[0012] The FPC20 extends in the azimuth direction 40 from a first end 7208 to a second end 7209. The FPC20 has a front surface 7201 and a back surface 7203. The transducer unit 716 is formed on the front surface 7201 of the FPC20, forming the transducer assembly 7010. The FPC20 acts as a lead wire, transmitting electrical signals from the electronic component 32 (Figure 14) to the vibrating element 7164, and also transmitting electrical signals from the vibrating element 7164 to the electronic component 32 (Figure 14). The signal line 7166 connected to the metal layer 7165 of the transducer unit 716 is connected to the lead wire of the FPC20. Power from the cable 26 is also transmitted to the transducer unit 716 via the FPC20.

[0013] The example in Figures 13A-13C shows a transducer assembly 7010 for a 1D array medical ultrasound probe. The 1D array transducer unit 716 included in the transducer assembly 7010 includes a number of individual elements 7171 and grooves 7173 between the elements.

[0014] As shown in Figure 14A, each individual element 7171 is input via a corresponding input signal line 762 to which a corresponding delay has been applied to the transmit signal. In a particular embodiment, the transmit / receive beamformer 3 comprises a transmit pulse generation unit 48 and a transmit delay time control unit 46 that performs delay processing on the pulses generated by the transmit pulse generation unit 48. This allows the transducer unit 716 to output a transmit ultrasonic signal 54 focused at the focal point 56.

[0015] Furthermore, as shown in Figure 14B, the echo signals 58 from the reflection source 60 are received by individual elements 7171 and sent to the electronic component 32 via output signal lines 764 corresponding to each element 7171. By performing delay signal processing on the received signals from the output signal lines 764 to cancel out the difference in distance between each element 7171 and the reflection source 60, an image similar to that of a single oscillator can be obtained. The transmitting and receiving beamformer 3 includes a receiving delay time control 50 that performs delay processing on the received echo signals 58 and a combiner 52 that combines the delayed echo signals 58.

[0016] As described above, providing multiple individual elements 7171 and grooves 7173 between elements in the 1D array oscillator unit 716 offers advantages, but a problem has arisen where the elements 7171 are damaged during the manufacturing process. Figures 15A-15C show how some of the elements 7171 in the oscillator assembly 7010 have been damaged. Causes of this defect include poor adhesion of each layer, and stress that destroys the elements 7171 during dicing to form the grooves 7173, etc. Such defects may occur at random locations, or they may occur in large numbers in specific locations due to malfunctions in the manufacturing equipment, etc.

[0017] If defects as shown in Figures 15A-15C exist, the component (or final product) may fail performance evaluation tests, and the transducer assembly 7010 (or transducer unit 716) may need to be scrapped. Once a defect occurs in a faulty area 70, its effects propagate in the elevation direction 42, often causing the channel itself to cease functioning. Even if a good area 70 occurs, other areas may function, but the echo signal 58 from that channel will not have the required signal strength. [Prior art documents] [Patent Documents]

[0018] [Patent Document 1] Japanese Patent Application Publication No. 64-56039 [Overview of the Initiative] [Problems that the invention aims to solve]

[0019] Therefore, there is a need for novel technologies that can improve the reliability of a transducer unit while maintaining its size. This challenge is sometimes also faced by transducers that generate audible sound, such as piezoelectric buzzers, piezoelectric speakers, and electronic musical instruments. [Means for solving the problem]

[0020] In a first aspect of this disclosure, a transducer unit is provided. The transducer unit comprises a plurality of transducer subunits. Each of the plurality of transducer subunits comprises a plurality of elements arranged in a first direction. Each of the plurality of elements comprises a layer of transducers. The plurality of transducer subunits are arranged in a second direction such that their respective corresponding elements are aligned in a second direction. The plurality of corresponding elements of the plurality of transducer subunits arranged in the second direction are configured to output an ultrasonic signal in response to an input electrical signal from a common input signal line.

[0021] A second aspect of this disclosure provides an oscillator assembly comprising an oscillator unit having the features of the first aspect of this disclosure and a flexible printed circuit board (FPC) having a first end and a second end. Each of a plurality of oscillator subunits is arranged on the FPC across the first end and the second end. The FPC comprises a plurality of wirings and a plurality of vias. Each of the plurality of elements includes a matching layer arranged on top of the oscillator layer and connected to a ground electrode. Each of the plurality of elements is connected to a corresponding wiring via a corresponding via of the FPC.

[0022] A third aspect of this disclosure provides an oscillator assembly. The oscillator assembly includes an oscillator unit having the features of the first aspect of this disclosure, a flexible printed circuit board (FPC) having a first end and a second end, and an interposer. Each of a plurality of oscillator subunits is arranged on the FPC across the first end and the second end. The FPC comprises a plurality of vias. Each of the plurality of elements is arranged on the oscillator layer and includes a matching layer connected to a ground electrode. The plurality of oscillator subunits are arranged on the interposer via the FPC. The interposer includes a conductive layer extending in the second direction at positions corresponding to a plurality of corresponding elements of the plurality of oscillator subunits arranged in the second direction. The plurality of corresponding elements of the plurality of oscillator subunits arranged in the second direction are connected to the conductive layer of the interposer via corresponding vias of the FPC.

[0023] In a fourth aspect of the present disclosure, an ultrasonic probe is provided. The ultrasonic probe includes a transducer assembly having the features of the second or third aspect of the present disclosure disposed on a base block, and a probe case enclosing the base block and the transducer assembly.

[0024] In a fifth aspect of the present disclosure, an ultrasonic diagnostic apparatus is provided. The ultrasonic diagnostic apparatus includes an ultrasonic probe having the features of the fourth aspect of the present disclosure, an image processing unit that generates an ultrasonic image based on the ultrasonic signals collected by the ultrasonic probe, and a display device that displays the ultrasonic image.

[0025] In a sixth aspect of the present disclosure, a method for manufacturing a transducer unit is provided. The method for manufacturing a transducer unit manufactures a plurality of transducer sub-units. Each of the plurality of transducer sub-units includes a plurality of elements arranged in a first direction. The positions of defective elements included in each of the plurality of transducer sub-units are confirmed. The plurality of transducer sub-units are joined such that the number of defective elements is one or less in a second direction. The plurality of corresponding elements of the plurality of transducer sub-units arranged in the second direction are configured to output ultrasonic signals in response to an input electrical signal from a common input / output signal line and output an output electrical signal to the common input / output signal line in response to an input ultrasonic signal.

Brief Description of the Drawings

[0026] [Figure 1] It is a block diagram showing an example of the schematic configuration of an ultrasonic diagnostic system in an embodiment of the present invention. [Figure 2] It is an exploded view showing the internal structure of an ultrasonic probe. [Figure 3] It is a graph showing the relationship between the working area and the yield. [Figure 4] It is a conceptual diagram showing a state of manufacturing a transducer unit by a plurality of transducer sub-units. [Figure 5] It is a conceptual diagram showing a state of manufacturing a transducer unit by a plurality of transducer sub-units. [Figure 6]This is a conceptual diagram showing how an oscillator unit is manufactured using multiple oscillator subunits. [Figure 7] Figures 7A-7C are conceptual diagrams illustrating the structure of an oscillator assembly containing multiple oscillator subunits. [Figure 8A] This is a conceptual diagram to explain the structure of an FPC (Flexible Printed Circuit). [Figure 8B] This is a conceptual diagram to explain the structure of an FPC (Flexible Printed Circuit). [Figure 8C] This is a conceptual diagram to explain the structure of an FPC (Flexible Printed Circuit). [Figure 8D] This is a conceptual diagram to explain the structure of an FPC (Flexible Printed Circuit). [Figure 8E] This is a conceptual diagram to explain the structure of an FPC (Flexible Printed Circuit). [Figure 8F] This is a conceptual diagram to explain the structure of an FPC (Flexible Printed Circuit). [Figure 8G] This is a conceptual diagram illustrating the connection and placement of the ground wire. [Figure 9] Figure 9A is a conceptual diagram illustrating how an ultrasound probe outputs a transmitted ultrasound signal. Figure 9B is a conceptual diagram illustrating how an ultrasound probe receives an ultrasound echo signal. [Figure 10] This figure shows a vibrator assembly of another embodiment. [Figure 11] This figure shows a vibrator assembly of another embodiment. [Figure 12] This is a flowchart showing the process for manufacturing an oscillator assembly. [Figure 13] Figure 13A is a top view of a conventional transducer assembly. Figure 13B shows the cross-sectional structure of the transducer assembly in Figure 13A when cut at section AA. Figure 13C shows the cross-sectional structure of the transducer assembly in Figure 13A when cut at section BB, and is an enlarged view thereof. [Figure 14] Figure 14A is a conceptual diagram illustrating how an ultrasound probe outputs a transmitted ultrasound signal. Figure 14B is a conceptual diagram illustrating how an ultrasound probe receives an ultrasound echo signal. [Figure 15]Figure 15A is a top view of a conventional transducer assembly with defects. Figure 15B shows the cross-sectional structure of the transducer assembly in Figure 15A when cut along section AA. Figure 15C shows the cross-sectional structure of the transducer assembly in Figure 15A when cut along section BB. [Modes for carrying out the invention]

[0027] Embodiments of the invention will be described below. However, the claimed invention is not limited to the embodiments described herein. In particular, this disclosure will use a medical ultrasound diagnostic apparatus equipped with an ultrasonic probe as an example, but the present invention can be applied to transducer units and transducer assemblies in other fields. As described above, the present invention can be applied not only to transducer units included in ultrasonic generating devices such as ultrasonic cleaning machines, ultrasonic processing machines, ultrasonic homogenizers, ultrasonic atomizers, ultrasonic therapeutic instruments, and ultrasonic measuring instruments (including those for non-destructive testing of buildings, structures, various machinery and equipment, and for medical use), but also to transducer units that generate audible sound, such as piezoelectric buzzers, piezoelectric speakers, and electronic musical instruments.

[0028] Embodiments of the present invention will be described below with reference to the drawings. The ultrasound diagnostic apparatus 1 shown in Figure 1 comprises an ultrasound probe 2, a transmitting and receiving beamformer 3, an echo data processing unit 4, a display processing unit 5, a display unit 6, an operation unit 7, a control unit 8, and a storage unit 9. The ultrasound diagnostic apparatus 1 is configured as a computer.

[0029] The ultrasonic probe 2 is configured to have multiple ultrasonic transducers arranged in an array (see Figure 3), and transmits ultrasound to the object to be examined using these ultrasonic transducers and receives the echo signal.

[0030] The ultrasonic probe 2 transmits and receives ultrasound waves to the object being inspected. The transmitting / receiving beamformer 3 supplies electrical signals to the ultrasonic probe 2 for transmitting ultrasound waves under predetermined scanning conditions, based on control signals from the control unit 8. The transmitting / receiving beamformer 3 also performs signal processing such as A / D conversion and phase addition on the echo signals received by the ultrasonic probe 2, and outputs the processed echo data to the echo data processing unit 4.

[0031] The echo data processing unit 4 processes the echo data output from the transmitting and receiving beamformer 3 to create an ultrasonic image. For example, the echo data processing unit 4 creates B-mode data by performing B-mode processing such as logarithmic compression and envelope detection.

[0032] The display processing unit 5 converts the data input from the echo data processing unit 4 using a scan converter to create ultrasound image data. For example, the display processing unit 5 converts B-mode data to create B-mode image data and displays an ultrasound image on the display unit 6 based on the ultrasound image data. The ultrasound image is, for example, a B-mode image based on the aforementioned B-mode image data.

[0033] The display unit 6 is an LCD (Liquid Crystal Display) or an organic EL (Electro-Luminescence) display, etc. The operation unit 7 is a device in which the user inputs instructions and information. For example, the operation unit 7, although not specifically shown, includes a keyboard and also includes a pointing device such as a mouse or trackball.

[0034] The control unit 8 is a processor such as a CPU (Central Processing Unit). The control unit 8 reads programs stored in the memory unit 9 and controls each part of the ultrasound diagnostic device 1. For example, the control unit 8 reads a program stored in the memory unit 9 and uses the read program to execute the functions of the transmitting / receiving beamformer 3, the echo data processing unit 4, and the display processing unit 5.

[0035] The control unit 8 may execute all of the functions of the transmit / receive beamformer 3, all of the functions of the echo data processing unit 4, and all of the functions of the display processing unit 5 by program, or it may execute only some of the functions by program. If the control unit 8 executes only some of the functions, the remaining functions may be executed by hardware such as circuits. The functions of the transmit / receive beamformer 3, echo data processing unit 4, and display processing unit 5 may be implemented by hardware such as circuits.

[0036] The memory unit 9 includes semiconductor memory such as HDD (Hard Disk Drive), SSD (Solid State Drive), RAM (Random Access Memory), and ROM (Read Only Memory).

[0037] The ultrasound diagnostic device 1 may have all of the following as its storage unit 9: HDD, SSD, RAM, and ROM. Alternatively, the storage unit 9 may be a portable storage medium such as a CD (Compact Disk) or DVD (Digital Versatile Disk). The program executed by the control unit 8 is stored in a non-transient storage medium such as an HDD or ROM. Alternatively, the program may be stored in a portable, non-transient storage medium such as a CD or DVD.

[0038] When applying the present invention to an irradiation-only device that irradiates with ultrasound but does not receive ultrasound signals, the transmitting / receiving beamformer 3 may be a transmitting beamformer 3, and the echo data processing unit 4, display processing unit 5, and display unit 6 become unnecessary components.

[0039] Figure 2 is an exploded perspective view showing the internal structure of an ultrasound probe. In this embodiment, the ultrasound probe 2 is a convex-type ultrasound probe. The convex-type ultrasound probe is equipped with an acoustic window 28 having a convex curved surface and emits ultrasound that diffuses radially. Convex-type ultrasound probes are used for abdominal ultrasound examinations, etc. The ultrasound probe 2 may be a linear type or other type of ultrasound probe instead of a convex type.

[0040] In Figure 2, the probe 2 is shown in a state where its bottom surface is in contact with a support surface such as a desk or table. Therefore, the front surface of the probe 2 is described as the top surface, and the opposite surface as the bottom surface. However, in some embodiments, the top and bottom surfaces of the probe 2 can have exactly the same structure. In this case, when the probe 2 is placed upside down, the top surface of the probe 2 can be called the bottom surface, and the bottom surface of the probe 2 can be called the top surface. Considering this point, the top and bottom surfaces of the probe 2 shown in Figures 2 and 3 could also be considered the sides of the probe 2, but for the sake of the reader's understanding, these two surfaces will be described as the top and bottom surfaces of the probe 2.

[0041] In this embodiment, a metal inner housing 30 is placed inside the probe case 24 of the ultrasonic probe 2. The inner housing 30 dissipates the heat generated in the transducer assembly 10 and prevents the heat generated in the transducer assembly 10 from being transmitted to the subject. The upper portion 301 and the lower portion 302 of the inner housing 30 are joined to each other by adhesive. The inner surface of the probe case 24 is attached to the outer surface of the inner housing 30 by adhesive. The upper portion 241 and the lower portion 242 of the probe case 24 are also joined to each other by adhesive. The front end of the probe case 24 is bonded to the acoustic window 28, and the rear end of the probe case 24 is bonded to the cable 26.

[0042] A chassis 38 is positioned inside the inner housing 30. One or more electronic components (not shown) are arranged inside the chassis 38. One or more electronic components include an ASIC (application-specific integrated circuit). In certain embodiments of the present invention, the electronic components (not shown) are detachably connected to a cable 26 by a connector (not shown), and also detachably connected to a vibrator assembly 10 by other connectors (not shown). This allows power from the cable to be supplied to the electronic components (not shown) and the vibrator assembly 10. It also enables the transmission of bidirectional signals via the cable 26.

[0043] As shown in Figure 2, the acoustic window 28 is joined to the probe case 24 at the tip of the ultrasonic probe 2. In this example, the cable 26 is joined to the probe case 24 at the rear end of the ultrasonic probe 2. In some embodiments of the present invention, an acoustic lens 12 is mounted on the back of the acoustic window 28 shown in Figure 2. The transducer assembly 10 and the acoustic lens 12 are also coupled so that they are acoustically connected. The transducer assembly 10 is then screwed to the chassis 38, and the electronic components and cables of the transducer assembly 10 are connected with connectors. The position where the connectors are connected may be below or to the side of the transducer assembly 10. The upper portion 301 and the bottom portion 302 of the inner housing 30 are then joined to each other so that they enclose or sandwich the transducer assembly 10. The upper portion 241 and the bottom portion 242 of the probe case 24 are then joined to each other so that they enclose or sandwich these components. The inner surface of the probe case 24 near the tip has a shape corresponding to the first wall portion. The inner surface of the probe case 24 and the first wall portion are joined together with adhesive.

[0044] For the assembly of the ultrasonic probe 2, adhesives with excellent chemical resistance and UV resistance, such as silicone-based adhesives or epoxy resin-based adhesives, are preferred. From the viewpoint of miniaturization, the thickness of the adhesive should preferably be 5 mm or less. Also, from the viewpoint of adhesive strength, the thickness of the adhesive should preferably be 0.3 mm or more. More preferably, the adhesive should have a thickness of 1 to 4 mm. The adhesive applied to each part may be the same adhesive or different adhesives.

[0045] Figure 3 is a graph 80 showing the relationship between the work area 86 and the yield 88. The inventors of this application have discovered that the work area 86 greatly affects the yield 88. As the work area 86 (width in the example of Figure 15) increases, the probability of defects increases linearly. The convex probe used for abdominal ultrasound examination, as illustrated in Figure 2, generally has a width of about 4-7 cm. Point 82 in Figure 3 shows the yield (approximately 50%) when manufacturing a transducer unit 400 with 150 elements and a width of 9 cm, and point 84 in Figure 3 shows the yield (approximately 95%) when manufacturing a transducer unit 400 with 150 elements and a width of 1 cm. In other words, the yield improves when the width of the elevation direction 42 of the transducer unit 400 being manufactured is shorter. Note that it is not possible to make the width of the elevation direction 42 infinitely shorter, and it is not easy to make it shorter than 5 mm. Shortening the width of the elevation direction 42 can improve yield, but it reduces the intensity of the transmitted ultrasonic signal 54. As a result, the intensity of the echo signal 58 from the reflector 60 also decreases.

[0046] Figure 4 is a conceptual diagram illustrating a transducer assembly 410 that includes a transducer unit 400 capable of providing improved yield and the required signal strength. The transducer assembly 410 in Figure 4 can be the transducer assembly 10 in Figure 2. As shown in Figure 4, the transducer assembly 410 includes a transducer unit 400 and a flexible printed circuit board (FPC) 510.

[0047] The transducer unit 400 is made up of several transducer subunits 441-446. In this example, the transducer unit 400 is made up of six transducer subunits 441-446. Each of the six transducer subunits 441-449 contains several elements 171 arranged in the azimuth direction 40. Each of the several elements 171 contains several layers as described in Figure 13B. That is, each of the transducer subunits 441-449 contains a second acoustic matching layer 161, a first acoustic matching layer 163, a vibrating element 164, and a metal layer 165 (Figure 7A). The several transducer subunits 441-446 are arranged in the elevation direction 42 such that their respective corresponding elements are aligned in the elevation direction 42. The several corresponding elements of the several transducer subunits 441-446 arranged in the elevation direction 42 are configured to output an ultrasonic signal in response to an input electrical signal from a common input signal line 62. In the example shown in Figure 4, each of the multiple oscillator subunits 441-449 contains 30 elements 171 and is connected to 30 input / output signal lines.

[0048] In the case of the convex-shaped ultrasonic probe 2 shown in Figure 2, the width in the elevation direction 42 is typically 4-7 cm, so the number of transducer subunits 441-446 is 2-8, more preferably 4-6. This range allows for a balance between reducing both output reduction and increasing defects. The number and width of transducer subunits 441-446 can be flexibly changed according to the actual yield and signal strength measurements. Furthermore, the manufacturing process can be simplified by making the width of each transducer subunit 441-446 the same. However, the widths of some or all of the transducer subunits 441-446 can also be manufactured to be different.

[0049] Each of the transducer subunits 441-446 in Figure 4 can have a structure almost identical to the conventional transducer assembly 7010 shown in Figures 13A-C. However, apart from the width in the elevation direction 42, at least the position of the ground electrode is changed. The position of the signal electrode, etc., can be the same as that of the conventional transducer assembly 710. In the transducer unit 716 in Figures 13A-C, the ground electrode 7162 is positioned at the upper and lower ends of the elevation direction 42. In contrast, in each of the transducer subunits 441-446 in Figure 4, the ground electrodes 421 and 423 are positioned at the left end (ground electrode 421) and right end (ground electrode 423) of the azimuth direction 40. This shortens the distance between transducer subunits (for example, the distance between transducer subunit 443 and transducer subunit 445) and increases the signal intensity per unit area. In the example shown in Figure 4, a metal film 167 connected to the first acoustic matching layer 163 is provided on the bottom surface of the second acoustic matching layer 161. The second acoustic matching layer 161, with the metal film 167 on its bottom surface, can be provided for each transducer subunit 441-446, for every two transducer subunits 441-446, for every three transducer subunits 441-446, or for all six transducer subunits 441-446. The metal film 167 may be provided over the entire width of the second acoustic matching layer 161 in the elevation direction 42. In other embodiments, it may be provided at a position corresponding to a portion of the width of the first acoustic matching layer 163 in the elevation direction 42. The metal film 167 functions as a ground electrode layer 167 and is connected to ground electrodes 421, 423. The transducer subunits (transducer subunit 443 and transducer subunit 445) can be directly bonded together with adhesive or indirectly joined via the flexible substrate 510. When the transducer subunits are directly bonded together, the adhesive layer becomes the joint between them. When they are indirectly joined via the flexible substrate 510, the portion of the flexible substrate 510 that supports the transducer subunit becomes the joint between them. When the second acoustic matching layer 161 is provided over all of the transducer subunits 441-446, the second acoustic matching layer 161 also becomes the joint between those transducer subunits.

[0050] Each of the transducer subunits 441-446 in Figure 4 can be manufactured using a manufacturing process substantially similar to that of the transducer unit 716 shown in Figures 13A-C. Each of the transducer subunits 441-446 in Figure 4 can be manufactured by first creating them as a group connected in the azimuth direction 40, and then cutting them in the elevation direction 42. By first creating them as a group connected in the azimuth direction 40 and then cutting them in the elevation direction 42, efficient dicing can be achieved. In another embodiment, two or more transducer subunits 441-446 (e.g., 2-100) are created connected in the elevation direction 42, and then the individual transducer subunits are created by cutting them in the azimuth direction 40.

[0051] The ground electrodes 421 and 423 of the transducer subunits 441-446 can be protected by covering them with reinforcing resins 425 and 427, respectively. The reinforcing resins 425 and 427 prevent deterioration of the ground electrodes 421 and 423 due to exposure, ensure their insulation, and prevent the ground electrodes 421 and 423 from becoming pathways for noise intrusion. The reinforcing resin 425 on the first end 208 side can extend in the elevation direction 42 to cover the entire ground electrode 421 on the first end 208 side. Similarly, the reinforcing resin 427 on the second end 209 side can extend in the elevation direction 42 to cover the entire ground electrode 423 on the second end 209 side. In other embodiments, the reinforcing resin 425 on the first end 208 side is provided in multiple sections that extend in the elevation direction 42 to cover a portion of the ground electrode 421 on the first end 208 side. The same applies to the reinforcing resin 427 on the second end 209 side. The reinforcing resin 427 can be made from a polyimide-based or polyester-based insulating film such as Kapton, or from a protective coating of polyimide-based, polyester-based, epoxy resin-based, polyurethane-based, silicone resin-based, or acrylic resin. The grounding electrodes 421 and 423 are connected to the grounding wiring via vias provided in the FPC 510 in the same manner as in the prior art. The transducer subunits 441-446 are prone to stress concentration at the ends during assembly and are therefore prone to damage, so it is desirable to provide the reinforcing resin 425 when manufacturing the transducer subunits 441-446 (before the completion of the transducer unit 400). However, it may also be provided after manufacturing the transducer subunits 441-446 and after attaching the transducer subunits 441-446 to the FPC 510. In other embodiments, the reinforcing resin 425 is provided at least twice, before and after attaching the transducer subunits 441-446 to the FPC 510.

[0052] Unlike the conventional 1D array transducer unit 716 in Figure 13, the transducer unit 400 created from the transducer subunits 441-446 in Figure 4 has a matrix of elements. Conventional 2D array ultrasonic transducer units also have a matrix of elements, with each element connected to a corresponding signal line. In contrast, the multiple elements 171 of the transducer unit 400 in Figure 4, which are arranged in the elevation direction 42, are connected to a common signal line. 2D arrays are sometimes used for cardiac imaging, etc. In the case of a 2D array, since the signal of each element is input, a larger ASIC is required compared to a 1D array.

[0053] In the embodiment shown in Figure 4, this common signal line functions as a common input / output signal line. When the present invention is applied to an ultrasonic irradiation device that does not have a function to receive ultrasonic signals, the common signal line functions as a common input signal line from electronic component 32.

[0054] In the example shown in Figure 4, the multiple corresponding elements of the multiple transducer subunits 441-446 arranged in the elevation direction are configured to output an ultrasonic signal 54 in response to an input electrical signal from common input / output signal lines 62 and 64, and to output an output electrical signal to the common input / output signal lines 62 and 64 in response to an input ultrasonic signal 58. Since ultrasonic signals 54 are output from six elements 171 in each of the 30 channels, the intensity is sufficient, enabling a reduction in defects occurring in the narrow transducer subunits 441-446. In addition, it is possible to output an output electrical signal of sufficient intensity. In the example shown in Figure 4, the width 460 in the elevation direction of each of the multiple transducer subunits 441-446 is 5mm-20mm, more preferably 8-14mm, and even more preferably 10-12mm. The connection between each element of the transducer subunits 441-446 and the common input / output signal lines 62 and 64 will be described later with reference to Figures 8A-8F and 11A-11C.

[0055] As mentioned above, the likelihood of any of the narrow transducer subunits 441-446 in Figure 4 experiencing elemental failure is low. Figure 5 is a conceptual diagram illustrating the case where a transducer unit 400 is manufactured using multiple transducer subunits 441-446 in the event of elemental failure in one of the transducer subunits 441-446.

[0056] As described above, the conventional 1D array oscillator unit 716 shown in Figure 13 has its components molded as a single unit, so if there is a defect in some elements, the entire unit becomes defective. In the example in Figure 5, the oscillator unit 400 is manufactured by combining multiple oscillator subunits 441-446, so the probability of the oscillator unit 400 itself being defective can be dramatically reduced. That is, as shown in Figure 5, even if a defect 451 occurs in any of the elements 401 of the oscillator subunits 441-446, the effect will not propagate to the oscillator subunits adjacent in the elevation direction 42. Also, the probability of multiple defective elements 451 being included in the element group that makes up one channel is extremely low. For example, the element group that makes up the ninth channel contains five good elements 453 and one defective element 451. As a result, the output reduction is approximately 16.7%, which is a level that can be sufficiently passed for performance evaluation tests of the component (or final product). If the group of elements constituting one channel contains fewer than five good elements 453 and two or more defective elements 451, it is possible that the performance evaluation test will not pass, but the likelihood of such a situation occurring is extremely low. Furthermore, by making the number of divisions of the combined oscillator subunits finer, even if there are defective parts, they can be distributed evenly on the oscillator assembly 410, making it possible to produce a good product by combining defective parts. If it is identified that the output is reduced in a particular channel, the program of the electronic component 32 can be modified to amplify the input signal to that channel relative to the other channels, and the output signal from that channel can be amplified relative to the other channels, thereby leveling the output with the other channels.

[0057] Figure 6 is a conceptual diagram illustrating the process for manufacturing a transducer unit 400 that can further reduce the yield compared to the embodiment shown in Figure 5.

[0058] In the embodiment shown in Figure 5, the transducer unit 400 and transducer assembly 410 were manufactured without inspecting the transducer subunit. In contrast, in the embodiment shown in Figure 6, performance evaluation tests are performed after the transducer subunit has been manufactured.

[0059] In the example shown in Figure 6, performance evaluation tests reveal that three oscillator subunits 442, 444, and 446 contain the defective element 451. The oscillator subunits 442, 444, and 446 containing the defective element 451 are excluded, and the six oscillator subunits 441, 443, 445, and 447-449, which do not contain the defective element 451, are used to manufacture the oscillator unit 400 and oscillator assembly 410.

[0060] In another embodiment, oscillator subunits 442, 444, and 446, which are found to contain a defective element 451 through performance evaluation tests, are not excluded. The performance evaluation tests identify the location of the defective element 451 within each oscillator subunit. Then, as shown in Figure 5, the multiple corresponding elements of the multiple oscillator subunits arranged in the elevation direction 42 are combined such that no more than two defective elements 451 are included. That is, the multiple corresponding elements of the multiple oscillator subunits arranged in the elevation direction 42 include one or fewer defective elements and multiple good elements.

[0061] If a combination occurs in which multiple corresponding elements of multiple transducer subunits arranged in the elevation direction 42 include two or more defective elements 451, it is possible to prevent two or more defective elements 451 from being included in the elevation direction 42 by replacing the faulty transducer subunit with another transducer subunit, or by reversing the left and right orientation of the faulty transducer subunit. In certain embodiments, each transducer subunit has a structure that is symmetrical in the vertical and horizontal directions of the plane of Figure 5, and the transducer subunits can be reversed vertically and horizontally and joined together. Each transducer subunit has a structure that is symmetrical at 180° with respect to the center point of the transducer subunit, and the transducer subunits can be reversed vertically and horizontally (rotated 180° clockwise or counterclockwise; however, the vertical direction (along the direction of ultrasonic irradiation) remains unchanged) and joined together. In this way, even if there are defective parts, good products can be manufactured by combining defective parts by distributing them evenly on the transducer assembly 410.

[0062] By detecting defects before completion, identifying their location, and replacing them with good parts, or by combining some defective parts to manufacture the overall mass-produced component, the final yield can be adjusted before completion. This is particularly effective for types of transducer assemblies with low yields, and adopting this structure allows for planned manufacturing. Since the final ultrasonic probe is constructed by combining multiple transducer subunits of sub-components whose performance quality is known in advance, the yield can be predicted and managed beforehand.

[0063] Figures 7A-7C are conceptual diagrams illustrating the structure of a vibrator assembly 410, which includes multiple vibrator subunits. Figure 7A is a conceptual diagram of the vibrator assembly 410 in Figure 7B, cut along the azimuth direction 40 passing through the center of one of the vibrator subunits. Figure 7B is a top view of the vibrator assembly 410. Figure 7C is a conceptual diagram illustrating the connection between the multiple vibrator subunits included in the vibrator assembly 410 in Figure 7B and multiple flexible printed circuit boards.

[0064] As shown in Figure 7A, the transducer assembly 410 of this embodiment includes transducer subunits 441-449, each containing multiple elements 171 having the same multiple layers 161-165 as in Figures 13A-13C. As described in Figure 4, a metal film 167 is provided on the bottom surface of the second acoustic matching layer 161, which connects to the first acoustic matching layer 163. The metal film 167 can be made of a conductive material such as gold or copper. In the example of Figure 7, elements 535 used for grounding are placed at both ends of each transducer subunit 441-446 in the azimuth direction 40. The elements 535 used for grounding may have the same multiple layers as the elements 171. In addition, the elements 535 used for grounding may have a grounding metal coating 169 on its azimuth direction 40 side. The grounding metal coating 169 connects the metal film 167 and the metal layers 165. If the element 535 used for grounding has the same multiple layers as element 171, then the element 535 used for grounding can be manufactured using the same process as the other elements 171, thereby reducing costs. If the element 535 used for grounding has the same multiple layers as element 171, then since the first acoustic matching layer 163 is a conductor, the grounding metal coating 169 can be provided only on the side surface of the vibrating element 164, thereby enabling electrical connection between the metal film 167 and the metal layer 165. In other embodiments, the element 535 used for grounding does not have the same multiple layers as element 171, but has a conductive top surface, a conductive bottom surface, and a conductive path connecting them. Also, the FPC 510 of the vibrator assembly 410 in Figure 7A includes multiple layers 521, 523.

[0065] As shown in Figure 7B, the first layer 521 of the FPC 510 contains multiple ground wires 525 connected to the ground electrode 421 (or 423). The elevation direction 42 side 403 of the transducer assembly 410 does not include the ground electrode 7162 shown in Figure 13A. The multiple ground wires 525 are connected to the grounding wiring via vias provided in the FPC 510 in the same manner as in the prior art.

[0066] As shown in Figure 7C, multiple adhesive layers 511 are provided on the upper surface of the first layer 521 of the FPC 510 at positions corresponding to the elements, and the corresponding elements are bonded to the first layer 521 of the FPC 510. A via 513 penetrating the FPC 510 is shown in the center of the adhesive layer 511. Also, as shown in Figure 7C, multiple signal lines 520 are provided inside the second layer 523 of the FPC 510. The multiple signal lines 520 connect each channel to the corresponding connector 530. If there are 30 channels, at least 30 signal lines 520 are required. The connection between the connector 530 and the electronic component 32 can be done using the same method as in the prior art. Although the example in Figures 7A-7C describes a two-layer FPC 510, the FPC 510 can contain any number of layers, such as three, four, five, six, etc. In Figure 7C, the connectors 530 are provided at both ends of the transducer assembly 410, but they may also be provided at other locations, such as directly below the group of elements 451 or at the ends in the elevation direction 42.

[0067] Figures 8A-8F illustrate how the signal lines 520 are arranged and connected in the FPC 510. Since the arrangement and connection of the signal lines 520 can be symmetrical, only the right-hand portion of the FPC 510 is shown. Figures 8A-8F use a six-layer FPC 510 as an example. A via 513 can be represented in three dimensions: the FPC layer 5131 where the via exists, the channel 5132 where the via exists, and the oscillator subunit 5133 where the via exists. For example, the via 513 shown by the leader line in Figure 8A is the via 513 in the first FPC layer, the 20th channel, and the sixth oscillator subunit from the top.

[0068] Furthermore, the connector 530 shown on the right side of Figure 8A can be represented by four different numbers. For example, the connector 530 shown by the leader line in Figure 8A, the first FPC layer 5301, the sixth oscillator subunit 5302 from the top, and the connector 5303 in the second row and first column. Each connector 530 is connected to the signal line 520 of the element 171 of the corresponding channel. For example, the signal line 520 corresponding to the element from via 513(1,20,6) connected to the metal layer 165 of element 171 is connected to connector 530(1,6,2,1).

[0069] Figure 8B shows the second layer of the FPC 510, Figure 8C shows the third layer, Figure 8D shows the fourth layer, Figure 8E shows the fifth layer, and Figure 8F shows the sixth layer. Each layer is interchangeable. As shown in Figures 8A-8F, the signal lines 520 from all elements 171 are connected to the corresponding connectors 530. In addition, the signal lines 530 from elements 171 of a particular channel are connected to a particular matrix of the connector 530, and the particular matrices of the connector 530 are connected to each other. For example, connectors 530(1,6,2,1) in Figure 8A, connectors 530(2,1,2,1) in Figure 8B, connectors 530(3,2,2,1) in Figure 8C, connectors 530(4,3,2,1) in Figure 8D, connectors 530(5,4,2,1) in Figure 8E, and connectors 530(6,5,2,1) in Figure 8F are connected to common input / output signal lines 62 and 64 shown in Figure 9. The connection between connectors 530 and electronic components 32 can be performed by known methods. Although Figures 8A-8F show a 6-layer FPC510, a 3-layer FPC510 can be created by integrating two layers into one. Furthermore, a 2-layer FPC510 can be created by integrating three layers into one. Reducing the number of layers in the FPC510 can lighten the device, but it also reduces the spacing between signal lines 520, leading to a problem of increased trace capacitance.

[0070] Figure 8G illustrates how the ground wire 533 is positioned and connected. The first acoustic matching layer 163 of each transducer subunit 441-449 is connected to the ground wire 533, which extends in the azimuth direction 40. The ground wire 533 is connected to an element 535 used for grounding. The element 535 used for grounding is connected to the corresponding connector 530 via the ground wire 533. In this example, it is connected to the connector 530 in the third row, fifth column. The connection between the connector 530 and ground can be made by known methods.

[0071] The elements 171 connected as shown in Figures 8A-8G can perform the transmission and reception shown in Figures 14A and 14B. That is, as shown in Figure 9A, each of the elements 171 groups constituting individual channels is input to the corresponding input signal line 62 with a corresponding delay applied to the transmission signal. The transmit / receive beamformer 3 includes a transmit pulse generation unit 48 and a transmit delay time control unit 46 that performs delay processing on the pulses generated by the transmit pulse generation unit 48. As a result, the elements 171 group can output a transmit ultrasonic signal 54 focused at the focal point 56.

[0072] Furthermore, as shown in Figure 9B, the echo signals 58 from the reflection source 60 are received by each group of elements 171 for individual channels and sent to the electronic component 32 via output signal lines 64 corresponding to each channel. By performing delay signal processing on the received signals from the output signal lines 64 to cancel out the difference in distance between each channel and the reflection source 60, an image similar to that of a single oscillator can be obtained. In a particular embodiment, the transmitting and receiving beamformer 3 includes a receiving delay time control 50 that performs delay processing on the received echo signals 58 and a combiner 52 that combines the delayed echo signals 58.

[0073] Figure 10 shows an oscillator assembly 410 of another embodiment. In this example, the signal lines 531 for each channel pass through vias that extend through multiple layers 521, 523 of the FPC 510 and are connected to the electronic component 32 via wiring directly beneath each channel. Similarly, the ground wire 533 passes through vias that extend through multiple layers 521, 523 of the FPC 510 and is taken out from the bottom of the FPC 510 at the end of the oscillator unit and connected to the ground wiring. By placing the electrical wiring of the element directly beneath the element, it is possible to use shorter wiring than the signal lines that extend within the FPC 510.

[0074] Figures 11A-11C are conceptual diagrams illustrating a specific embodiment in which the signal line 531 passes through vias that extend through multiple layers 521, 523 of the FPC 510 and is taken out directly below each channel.

[0075] As shown in Figure 11A, the transducer assembly 410 in Figure 11A includes an interposer 550. Also, as shown in Figures 11A and 11B, the elements 535 at both ends of the transducer assembly 410 are used as ground. Ground wires 533 extending to the bottom of the elements 535 at both ends used as ground are connected to a ground electrode layer 167 extending to both ends of the transducer assembly 410 by a ground metal coating 169 provided on the side of the element 535 used for grounding, as described in Figure 7. As shown in Figure 11C, the interposer 550 has a signal metal layer 543 extending in the elevation direction 42 at positions corresponding to each channel. The respective signal lines 531 of each element extend directly below each element and are connected to the signal metal layer 543 of the interposer 550. A metal layer 543 for signals of the interposer 550 is connected to a corresponding signal line 555 that extends in the azimuth direction 40 of the interposer 550 to either a first end 551 or a second end 553.

[0076] The elements 535 at both ends, used as ground, are connected to a metal layer 541 for earthing. The metal layer 541 for earthing of the interposer 550 is connected to a corresponding earth wire 557 that extends to the first end 551 or the second end 553 in the azimuth direction 40 of the interposer 550. The signal lines 555 are connected to the electronic components 32 by known methods, and the earth wires 557 are connected to the earth wiring by known methods. Each of the signal lines 555 is a signal line that connects to a plurality of elements 171 aligned in the elevation direction 42 of a particular channel, and becomes part of the common input / output signal lines 62, 64 shown in Figure 9. The connection between the FPC0 and the interposer is made by ACF bonding, ACF bonding, or adhesive.

[0077] In this way, multiple elements corresponding to specific channels (across multiple transducer subunits) aligned in the elevation direction 42 are connected to a common signal line (common input / output signal line). The multiple elements corresponding to specific channels simultaneously output ultrasonic signals with the same delay information in response to an input electrical signal from the corresponding single signal metal layer 543, and output an output electrical signal to the common input / output signal line in response to the input ultrasonic signal.

[0078] Figures 4-11 illustrate the case using a 1D type oscillator assembly 410 as an example. However, the oscillator assembly 410 may be of a different type than the 1D type, such as a 1.25D type, 1.5D type, 1.75D type, or annular type. In the case of the 1.25D type, 1.5D type, and 1.75D type, the present invention can be realized by dividing the element extending in the elevation direction 42 into multiple parts in the elevation direction 42 and connecting common input / output signal lines to the divided elements. In the case of the annular type, the present invention can be realized by dividing the element extending in the circumferential direction into multiple parts in the circumferential direction and connecting common input / output signal lines to the divided elements.

[0079] Next, referring to Figure 12, the process for manufacturing the oscillator assembly will be described. The process begins at 601. In step 603, a plurality of oscillator subunits are created, each containing a plurality of elements arranged in the azimuth direction. As described above, in a particular embodiment, each of the plurality of elements 171 of the oscillator subunit includes a second acoustic matching layer 161, a first acoustic matching layer 163, a vibrating element 164, and a metal layer 165.

[0080] The process of creating multiple oscillator subunits, each containing multiple elements, may include the steps of manufacturing them together such that at least two of the multiple oscillator subunits are connected in their longitudinal direction (azimuth direction 40), and the steps of separating the connected multiple oscillator subunits into two or more.

[0081] In step 605, the presence and location of a faulty element in each of the multiple transducer subunits are confirmed. Whether or not a faulty element is present in each transducer subunit, and where it is located, can be confirmed by known methods. Such tests include impedance measurement, operational tests by applying voltage (resonance frequency measurement, echo signal analysis), X-ray image analysis, and ultrasonic image analysis.

[0082] In step 607, multiple oscillator subunits are joined together so that the number of defective elements is one or less in the elevation direction. In the embodiment shown in Figure 6, oscillator subunits in which defective elements 451 are confirmed to be present are excluded, and oscillator subunits in which no defective elements 451 are confirmed to be present are joined together to create an oscillator unit. In this case, the number of defective elements is 0 in the elevation direction. In the embodiment shown in Figure 5, the location of the defective elements 451 is confirmed, and multiple oscillator subunits are joined together so that the number of defective elements is one or less in the elevation direction.

[0083] The process of joining multiple oscillator subunits may include the steps of arranging the multiple oscillator subunits on an interposer and connecting the multiple conductive layers, which are arranged corresponding to the positions of multiple elements of the multiple oscillator subunits, extend in the elevation direction 42, and are aligned in the azimuth direction 40, to the multiple elements of the multiple oscillator subunits via vias formed in the interposer. The process is completed in step 409.

[0084] Further embodiments of the present invention can be provided by the embodiments described below. [Embodiment 1] It is a vibrator unit, The vibrator unit includes a plurality of vibrator subunits, Each of the plurality of oscillator subunits includes a plurality of elements arranged in a first direction, Each of the aforementioned plurality of elements includes a layer of oscillators, The plurality of oscillator subunits are arranged in the second direction such that their respective corresponding elements are aligned in the second direction. A transducer unit in which multiple corresponding elements of the multiple transducer subunits arranged in the second direction are configured to output an ultrasonic signal in response to an input electrical signal from a common input signal line. [Embodiment 2] The aforementioned common input signal line functions as a common input / output signal line. A transducer unit according to any of the preceding embodiments, wherein a plurality of corresponding elements of the plurality of transducer subunits arranged in the second direction are configured to output an ultrasonic signal in response to an input electrical signal from the common input / output signal line, and to output an output electrical signal to the common input / output signal line in response to the input ultrasonic signal. [Embodiment 3] The oscillator unit according to any of the preceding embodiments, wherein the plurality of corresponding elements of the plurality of oscillator subunits arranged in the second direction include one or fewer defective elements and a plurality of good elements. [Embodiment 4] The plurality of oscillator subunits are, The nth oscillator subunit and The (n+1)th oscillator subunit, The joint between the nth oscillator subunit and the (n+1)th oscillator subunit, Includes, A vibrator unit according to any of the preceding embodiments, where n is a natural number. [Embodiment 5] The aforementioned n oscillator subunit is A plurality of elements arranged in the first direction between the first end and the second end, A ground electrode connected to each of the plurality of elements of the n vibrator subunit, and positioned closer to the first or second end of the n vibrator subunit than to the plurality of elements of the n vibrator subunit, Includes, The aforementioned n+1 oscillator subunit is A plurality of elements arranged in the first direction between the first end and the second end, A ground electrode connected to each of the plurality of elements of the n+1 oscillator subunit, and positioned closer to the first or second end of the n+1 oscillator subunit than to the plurality of elements of the n+1 oscillator subunit, Includes, The vibrator unit according to any of the preceding embodiments, wherein the vibrator layer of the nth vibrator subunit and the vibrator layer of the n+1th vibrator subunit are electrically connected. [Embodiment 6] A vibrator unit according to any of the preceding embodiments, comprising a reinforcing resin layer disposed on the ground electrode of the nth vibrator subunit, the ground electrode of the n+1th vibrator subunit, and the region between the nth vibrator subunit and the n+1th vibrator subunit. [Embodiment 7] The first direction mentioned above is the azimuth direction. The vibrator unit according to any of the preceding embodiments, wherein the second direction is the elevation direction. [Embodiment 8] The vibrator unit is a vibrator unit according to any of the preceding embodiments, comprising 4 to 6 vibrator subunits. [Embodiment 9] A vibrator unit as described in any of the preceding embodiments, A flexible printed circuit board (FPC) having a first end and a second end, Includes, Each of the plurality of transducer subunits is arranged on the FPC across the first end and the second end, The FPC comprises multiple wirings and multiple vias, Each of the plurality of elements includes a matching layer placed on top of the oscillator layer and connected to a ground electrode, A vibrator assembly in which each of the plurality of elements is connected to the corresponding wiring via the corresponding via of the FPC. [Embodiment 10] A vibrator unit as described in any of the preceding embodiments, A flexible printed circuit board (FPC) having a first end and a second end, Interposer and, Includes, Each of the plurality of transducer subunits is arranged on the FPC across the first end and the second end, The FPC has multiple vias, Each of the plurality of elements includes a matching layer placed on top of the oscillator layer and connected to a ground electrode, The plurality of oscillator subunits are arranged on the interposer via the FPC, The interposer includes a conductive layer extending in the second direction at positions corresponding to a plurality of corresponding elements of the plurality of oscillator subunits arranged in the second direction, A vibrator assembly in which multiple corresponding elements of the multiple vibrator subunits arranged in the second direction are connected to the conductive layer of the interposer via corresponding vias of the FPC. [Embodiment 11] The interposer extends in the first direction between the first end and the second end, The aforementioned interposer, A plurality of conductive layers are arranged corresponding to the positions of the plurality of elements of the plurality of oscillator subunits, each extending in the second direction, A grounding electrode positioned closer to the first end and / or the second end of the interposer than the plurality of conductive layers, A signal wiring connected to each of the plurality of conductive layers of the interposer and extending in the first direction, The grounding wiring connected to the grounding electrode of the interposer, A vibrator assembly as described in any of the preceding embodiments, including the one described above. [Embodiment 12] A base block containing sound-absorbing material, A vibrator assembly according to any of the preceding embodiments, disposed on the base block, A probe case enclosing the base block and the transducer assembly, Ultrasound probes, including... [Embodiment 13] The ultrasonic probe is a convex or linear ultrasonic probe, as described in any of the preceding embodiments. [Embodiment 14] The ultrasound probe is a 1D, 1.25D, 1.5D, or 1.75D type ultrasound probe for ultrasound imaging, as described in any of the preceding embodiments. [Embodiment 15] An ultrasonic probe as described in any of the preceding embodiments, An image processing unit that generates an ultrasound image based on the ultrasound signal collected by the ultrasound probe, A display device for displaying the ultrasound image, An ultrasound diagnostic device equipped with the following features. [Embodiment 16] A method for manufacturing an oscillator unit, A step of manufacturing a plurality of oscillator subunits, wherein each of the plurality of oscillator subunits includes a plurality of elements arranged in a first direction, The steps include: confirming the location of a faulty element in each of the plurality of oscillator subunits; A step of joining a plurality of transducer subunits such that the number of defective elements is one or less in a second direction, wherein a plurality of corresponding elements of the plurality of transducer subunits arranged in the second direction are configured to output an ultrasonic signal in response to an input electrical signal from a common input / output signal line, and to output an output electrical signal to the common input / output signal line in response to the input ultrasonic signal, Methods that include... [Embodiment 17] The step of joining the plurality of vibrator subunits is: The steps include arranging the plurality of oscillator subunits on the interposer, The steps include connecting a plurality of conductive layers, which are arranged in accordance with the positions of a plurality of elements of the plurality of vibrator subunits, extending in the second direction and aligned in the first direction, to the plurality of elements of the plurality of vibrator subunits via vias formed in the interposer, A method of any of the prior embodiments, including [Embodiment 18] The step of manufacturing the plurality of oscillator subunits is: A step of manufacturing together at least two of the plurality of vibrator subunits so that they are connected in the first direction, The steps include cutting off at least two of the plurality of oscillator subunits, A method of any of the prior embodiments, including

[0085] It should be noted that the invention is not limited to this embodiment, and various modifications are possible without departing from the spirit of the invention. [Explanation of symbols]

[0086] 1: Ultrasound diagnostic equipment 2: Ultrasound probe 3: Transmit / receive beamformer 4: Echo Data Processing Unit 5: Display Processing Unit 6: Display section 7:Operation unit 8: Control Unit 9: Storage part 10: Oscillator Assembly 12: Acoustic Lens 161:Second acoustic matching layer 163: 1st acoustic matching layer 164: Vibration element 165: Metal layer 167: Ground electrode layer / metal film 169: Grounding metal coating 171: element 20: Flexible Printed Circuit Board (FPC) 208: First end 209: Second end 22: Base block / sound absorbing material 24: Probe case 241:Top side part 242: Bottom side part 26: Cable 28: Acoustic window 30: Inner Housing 301:Top side part 302: Bottom side part 32: Electronic components 38: Chassis 40: Azimuth direction 42: Elevation direction 44: Depth direction 46: Transmission delay time control 48: Transmit pulse generation unit 50: Reception delay time control 52: Synthesizer 54: Transmitting ultrasonic signal 56:Focus 58: Echo signal 60:Reflection source 62: Input signal line 64: Output signal line 70: Defective parts 86:Work area 88: Yield 400: Transducer Unit 401: Element 410: Oscillator Assembly 421, 423: Ground electrode 425, 427: Reinforcement resin 441-449: Transducer subunit 451: Defective element 460: Width in the elevation direction 510: Flexible Printed Circuit Board (FPC) 511: Adhesive layer 513: Beer 5131: Layer of FPC where vias exist 5132: Channels where Beer exists 5133: Via-containing transducer subunit 520: Signal line 521: The first layer of the FPC 523: The second layer of the FPC 525: Ground wire 530: Connector 5301: Layer of the FPC where the connector is located 5302: Transducer subunit with connector 5303: Connector rows and columns 531: Signal line 533: Ground wire 535: Elements used for grounding 541: Metal layer for grounding 543: Metal layer for signaling 550: Interposer 551: First end 553: Second end 555: Signal line 557: Ground wire 716: Transducer Unit 7166: Signal line 7173: Grooves between elements 7181: Surface 7185: First end 7187: Second end 7201: Surface 7203: Back side

Claims

1. It is a vibrator unit, The vibrator unit includes a plurality of vibrator subunits, Each of the plurality of oscillator subunits includes a plurality of elements arranged in the azimuth direction, Each of the aforementioned plurality of elements includes a layer of oscillators, The plurality of oscillator subunits are arranged in the elevation direction such that their respective corresponding elements are aligned in the elevation direction. Multiple corresponding elements of the multiple transducer subunits arranged in the elevation direction are configured to be driven in response to an input electrical signal from a common input signal line to output an ultrasonic signal. vibrator unit.

2. The aforementioned common input signal line functions as a common input / output signal line. The transducer unit according to claim 1, wherein a plurality of corresponding elements of the plurality of transducer subunits arranged in the elevation direction are configured to output an ultrasonic signal in response to an input electrical signal from the common input / output signal line, and to output an output electrical signal to the common input / output signal line in response to the input ultrasonic signal.

3. The plurality of corresponding elements of the plurality of oscillator subunits arranged in the elevation direction are, The oscillator unit according to claim 1, comprising one or fewer defective elements and a plurality of good elements.

4. The plurality of oscillator subunits are, The nth oscillator subunit and The (n+1)th oscillator subunit, The joint between the nth oscillator subunit and the (n+1th) oscillator subunit, Includes, The oscillator unit according to claim 3, wherein n is a natural number.

5. The aforementioned n oscillator subunit is A plurality of elements arranged in the azimuth direction between the first end and the second end, A ground electrode connected to each of the plurality of elements of the n vibrator subunit, and positioned closer to the first or second end of the n vibrator subunit than to the plurality of elements of the n vibrator subunit, Includes, The aforementioned n+1 oscillator subunit is A plurality of elements arranged in the azimuth direction between the first end and the second end, A ground electrode connected to each of the plurality of elements of the n+1 oscillator subunit, and positioned closer to the first or second end of the n+1 oscillator subunit than to the plurality of elements of the n+1 oscillator subunit, Includes, The vibrator unit according to claim 4, wherein the vibrator layer of the n vibrator subunit and the vibrator layer of the n+1 vibrator subunit are electrically connected.

6. The vibrator unit according to claim 5, further comprising a reinforcing resin layer disposed on the ground electrode of the nth vibrator subunit, the ground electrode of the n+1th vibrator subunit, and the region between the nth vibrator subunit and the n+1th vibrator subunit.

7. The vibrator unit of claim 4, wherein no printed circuit board having a surface determined by the azimuth direction and the depth direction is disposed between the n vibrator subunit and the n+1 vibrator subunit.

8. The transducer unit according to claim 7, wherein the transducer unit includes four to six transducer subunits.

9. The transducer unit according to claim 2, A flexible printed circuit board (FPC) having a first end and a second end, Includes, Each of the plurality of vibrator subunits is arranged on the FPC across the first end and the second end, The FPC comprises multiple wirings and multiple vias, Each of the plurality of elements includes a matching layer placed on top of the oscillator layer and connected to a ground electrode, Each of the aforementioned plurality of elements is connected to the corresponding wiring via the corresponding via of the FPC. Oscillator assembly.

10. The transducer unit according to claim 2, A flexible printed circuit board (FPC) having a first end and a second end, Interposer and, Includes, Each of the plurality of vibrator subunits is arranged on the FPC across the first end and the second end, The FPC has multiple vias, Each of the plurality of elements includes a matching layer placed on top of the oscillator layer and connected to a ground electrode, The plurality of oscillator subunits are arranged on the interposer via the FPC, The interposer includes a conductive layer extending in the elevation direction at positions corresponding to a plurality of corresponding elements of the plurality of oscillator subunits arranged in the elevation direction, A vibrator assembly in which a plurality of corresponding elements of the plurality of vibrator subunits arranged in the elevation direction are connected to the conductive layer of the interposer via corresponding vias of the FPC.

11. The interposer extends in the azimuth direction between the first end and the second end, The aforementioned interposer, Arranged corresponding to the positions of multiple elements of the multiple oscillator subunits, each having multiple conductive layers extending in the elevation direction, A grounding electrode positioned closer to the first end and / or the second end of the interposer than the plurality of conductive layers, A signal wiring connected to each of the plurality of conductive layers of the interposer and extending in the azimuth direction, The grounding wiring connected to the grounding electrode of the interposer, The oscillator assembly according to claim 10, including the following:

12. A base block containing sound-absorbing material, A vibrator assembly according to claim 10 or 11, disposed on the base block, A probe case enclosing the base block and the transducer assembly, Ultrasound probes, including...

13. The ultrasonic probe according to claim 12, wherein the ultrasonic probe is a convex or linear ultrasonic probe.

14. The ultrasonic probe according to claim 12, wherein the ultrasonic probe is a 1D, 1.25D, 1.5D, or 1.75D type ultrasonic probe for ultrasound imaging.

15. The ultrasonic probe according to claim 12, An image processing unit that generates an ultrasound image based on the ultrasound signal collected by the ultrasound probe, A display device for displaying the ultrasound image, An ultrasound diagnostic device equipped with the following features.

16. A method for manufacturing an oscillator unit, A step of manufacturing a plurality of oscillator subunits, wherein each of the plurality of oscillator subunits includes a plurality of elements arranged in the azimuth direction, The steps include: confirming the location of a faulty element in each of the plurality of oscillator subunits; A step of joining a plurality of transducer subunits such that the number of defective elements is one or less in the elevation direction, wherein a plurality of corresponding elements of the plurality of transducer subunits arranged in the elevation direction are configured to be driven in response to an input electrical signal from a common input / output signal line to output an ultrasonic signal, and to output an output electrical signal to the common input / output signal line in response to the input ultrasonic signal, Methods that include...

17. The step of joining the plurality of vibrator subunits is: The steps include arranging the plurality of oscillator subunits on the interposer, The steps include connecting a plurality of conductive layers, which are arranged in accordance with the positions of a plurality of elements of the plurality of oscillator subunits, extending in the elevation direction and aligned in the azimuth direction, to the plurality of elements of the plurality of oscillator subunits via vias formed in the interposer, The method according to claim 16, including the method described in claim 16.

18. The step of manufacturing the plurality of oscillator subunits is: The steps include manufacturing a plurality of oscillator subunits together such that at least two of them are connected in the azimuth direction, The steps include cutting off at least two of the plurality of oscillator subunits, The method according to claim 16, including the method described in claim 16.

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