Endoscope equipment
The endoscope device addresses power consumption challenges by using solenoid-shaped coils that overlap axially for contactless power supply, enabling efficient power transmission without enlarging the connector.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- HOYA CORPORATION
- Filing Date
- 2022-11-10
- Publication Date
- 2026-05-07
AI Technical Summary
Conventional endoscope devices face challenges in handling increased power consumption without enlarging the connector portion due to limitations in coil coupling strength, particularly when using spiral-shaped coils.
The endoscope device employs solenoid-shaped power transmission and receiving coils that overlap partially in the axial direction, enabling contactless power supply between the processor and scope units, allowing for increased power transmission without enlarging the connector.
This configuration effectively handles increased power consumption without increasing the size of the connector portion, ensuring reliable power supply and signal transmission.
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Abstract
Description
Technical Field
[0001] The present invention relates to an endoscope device.
Background Art
[0002] Some endoscope devices are separated into a processor unit and a scope unit.The scope unit includes an endoscope. In the endoscope, an imaging module including a number of components such as an imaging element and a lens is disposed at the tip portion. Video signal cables, power supply cables, control cables, etc. are wired in the flexible tube portion of the scope unit.
[0003] For the connection between the processor unit and the scope unit, a medium-sized electrical connector or the like is used. A configuration for performing non-contact power supply at the connection portion is known. The connector of the scope unit includes a power receiving coil, and the connector of the processor unit includes a power transmitting coil.
[0004] Due to the increase in the resolution of the imaging element and the like, the power consumption of the scope unit may increase in the future.
[0005] Patent Document 1 describes an endoscope device that performs such non-contact power supply.
Prior Art Documents
Patent Documents
[0006]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0007] However, in the conventional technology, there is a problem that it is difficult to cope with an increase in power without increasing the size of the connector portion.
[0008] For example, in the configuration described in Patent Document 1, the transmitting coil and the receiving coil are arranged so that their axial end faces abut each other. In such a configuration, there is a limit to the strength of the coupling between the transmitting coil and the receiving coil. Therefore, if power consumption increases, there is a possibility of power shortage, and it becomes necessary to enlarge the connector portion.
[0009] Similarly, when using spiral-shaped coils (a spiral shape arranged in a plane), increased power consumption may lead to insufficient power, requiring a larger connector.
[0010] This invention was made to solve these problems, and aims to provide an endoscope device that can handle increased power without increasing the size of the connector portion. [Means for solving the problem]
[0011] An example of an endoscopic device according to the present invention is: A processor unit comprising a power transmission coil and a control board, A scope unit equipped with a power receiving coil and an endoscope, Equipped with, When the processor unit and the scope unit are coupled to each other, the power transmission coil and the power receiving coil overlap at least partially in the axial direction, making it possible to perform contactless power supply from the power transmission coil to the power receiving coil. [Effects of the Invention]
[0012] The endoscope device according to the present invention can handle increased power without increasing the size of the connector portion. [Brief explanation of the drawing]
[0013] [Figure 1] Block diagram of an endoscope device according to Embodiment 1 of the present invention. [Figure 2] More detailed configuration of the processor unit 20 and the scope unit 30. [Figure 3] A perspective view showing the specific structure of the connector section 20a included in the processor section 20. [Figure 4] Side view of the connector portion 20a in FIG. 3. [Figure 5] Front view of the connector portion 20a in FIG. 3. [Figure 6] Perspective view showing the specific structure of the connector portion 30a included in the scope portion 30. [Figure 7] Side view of the connector portion 30a in FIG. 6. [Figure 8] Front view of the connector portion 30a in FIG. 6. [Figure 9] Diagram explaining the relationship between the power transmission coil 21 and the power reception coil 31. [Figure 10] Perspective view showing the state in which the processor unit 20 and the scope unit 30 are coupled to each other. [Figure 11] Top view showing the state in FIG. 10. [Figure 12] Side view showing the state in FIG. 10.
Mode for Carrying Out the Invention
[0014] Hereinafter, embodiments of the present invention will be described based on the accompanying drawings. [Embodiment 1] FIG. 1 is a block diagram of an endoscope apparatus according to Embodiment 1 of the present invention. The endoscope apparatus 10 may be what is called an electronic endoscope or may be a device specialized for medical use. The endoscope apparatus 10 includes a processor unit 20 and a scope unit 30.
[0015]
[0016] [[ID=Processor unit 20 includes a power transmission coil 21 and a control board 22. The control board 22 functions as a control device that controls the processor unit 20 or the entire endoscope apparatus 10, and can be configured using, for example, a computer including arithmetic means and storage means. The scope unit 30 comprises a power receiving coil 31 and an endoscope 32. The endoscope 32 may have a known configuration, but for example, it may include, in order from the tip, a rigid part that does not deform, a flexible part that can be actively bent in response to operation, a flexible part that can be passively deformed, etc. An image sensor (described later with reference to Figure 2, etc.) is attached to the rigid part.
[0017] The processor unit 20 or the scope unit 30 may include an operating unit for operating the endoscope 32. The user of the endoscope device 10 can control the operation of the endoscope 32 by operating the operating unit. For example, the bendable portion of the endoscope 32 bends in response to the operation of the operating unit. The bendable portion can be realized using a well-known mechanism incorporated into a general electronic endoscope, for example, by pulling an operating wire linked to the rotation of a knob included in the operating unit to bend the bendable portion.
[0018] The endoscope 32 can be inserted into any body cavity within the body, including its tip, and can be inserted into areas such as the bronchi, bile ducts, pancreas, hepatic ducts, and urinary tract.
[0019] The processor unit 20 and the scope unit 30 are configured to be detachable from each other, i.e., to be separably coupled. When the processor unit 20 and the scope unit 30 are coupled to each other, contactless power supply from the power transmission coil to the power receiving coil is possible.
[0020] Figure 2 shows a more detailed configuration of the processor unit 20 and the scope unit 30. In the processor unit 20, the second controller 212 controls the power transmission coil 21, thereby controlling the power supplied to the scope unit 30. The power source for the supplied power may be a battery built into the processor unit 20 or an external power source.
[0021] Furthermore, the second controller 212 processes signals transmitted and received between it and the scope unit 30. The subsequent signal processing circuit 270 processes the input and output signals of the second controller 212. The first controller 211 controls the second controller 212 and the subsequent signal processing circuit 270.
[0022] In particular, the second controller 212 controls the laser driver 260, and the laser driver 260 controls the laser diode 250. The laser diode 250 transmits control optical signals to the scope unit 30, thereby controlling the operation of the scope unit 30.
[0023] Photodiodes 221, 222, and 223 receive optical signals representing images from the scope unit 30 (for example, images captured by the image sensor 40), convert them into electrical signals, and transmit them to their respective transimpedance amplifiers 231, 232, and 233, and further to the subsequent limiting amplifiers 241, 242, and 243. The limiting amplifiers 241, 242, and 243 amplify the electrical signals and transmit them to the second controller 212. The second controller 212 then acquires the video signal.
[0024] In the scope unit 30, the first controller 311 controls the current monitoring unit 33. The current monitoring unit 33 controls a circuit including a power receiving coil 31 and a resistor 34, thereby controlling the power supplied from the processor unit 20 and supplying it to other parts of the scope unit 30.
[0025] Furthermore, the first controller 311 receives the video signal from the image sensor 40 and transmits it to the laser drivers 361, 362, and 363. The laser drivers 361, 362, and 363 control the corresponding laser diodes 351, 352, and 353, respectively. The laser diodes 351, 352, and 353 transmit optical signals for the video signal to the processor unit 20. The optical signals from the laser diodes 351, 352, and 353 of the scope unit 30 are received, for example, by the photodiodes 221, 222, and 223 of the processor unit 20, respectively.
[0026] The photodiode 320 receives a control optical signal from the processor unit 20, converts it into an electrical signal, and transmits it to the transimpedance amplifier 330 and then to the subsequent limiting amplifier 340. The limiting amplifier 340 amplifies the electrical signal and transmits it to the second controller 312. As a result, the second controller 312 receives the control signal.
[0027] In the example shown in Figure 2, the image sensor 40 is not included in the scope unit 30, but in a modified example, the image sensor 40 may be included in the scope unit 30. Although not shown in Figure 2, the processor unit 20 and the scope unit 30 each have an optical path for illumination light (described later). Light for illuminating the target to be imaged by the image sensor 40 is transported through this optical path.
[0028] Figures 3 to 5 show the specific structure of the connector section 20a included in the processor section 20. Figure 3 is a perspective view, Figure 4 is a side view, and Figure 5 is a front view.
[0029] The connector portion 20a has a mating recess 20b, into which the mating projection 30b of the scope portion 30 (described later using Figures 6-8) can be mated. A coil support projection 26 is formed in the mating recess 20b. The coil support projection 26 has a cylindrical convex surface extending in a predetermined axial direction, and the power transmission coil 21 is arranged along this convex surface (only the position of the power transmission coil 21 is shown in Figures 3 and 5). In other words, the power transmission coil 21 is wound around the coil support projection 26.
[0030] The power transmission coil 21 is formed in a solenoid shape rather than a spiral shape. In this specification, a spiral shape refers to a vortex shape in which the coil is wound while changing the winding diameter in a plane, and a solenoid shape refers to a helical shape in which the coil is wound while progressing axially in a cylindrical surface. Thus, in this embodiment, the power transmission coil 21 is wound along a cylindrical surface.
[0031] A power transmission cable 25 is connected to the power transmission coil 21, and power is supplied to the power transmission coil 21 via the power transmission cable 25. In this embodiment, the processor unit 20 includes two power transmission coils 21.
[0032] Furthermore, the aforementioned photodiodes 221, 222, and 223 and the laser diode 250 are arranged facing the mating recess 20b (Figure 5). The processor unit 20 may also further include an optical transmission member for transmitting light between these components and the outside, and such an optical transmission member may be arranged facing the mating recess 20b.
[0033] The processor unit 20 is equipped with an optical path 27 for illumination light, which is positioned facing the mating recess 20b. The optical path 27 guides illumination light from a light source located inside or outside the processor unit 20 to the mating recess 20b.
[0034] Figures 6 to 8 show the specific structure of the connector section 30a included in the scope section 30. Figure 6 is a perspective view, Figure 7 is a side view, and Figure 8 is a front view.
[0035] The connector portion 30a has a mating projection 30b. As described above, this mating projection 30b can be mated into the mating recess 20b of the processor portion 20. A coil support recess 36 is formed in the mating projection 30b. The coil support recess 36 has a cylindrical concave surface extending in a predetermined axial direction, and the power receiving coil 31 is arranged along this concave surface (only the position of the power receiving coil 31 is shown in Figures 6 and 8). That is, the power receiving coil 31 is wound around the coil support recess 36.
[0036] The receiving coil 31, like the transmitting coil 21, is formed in a solenoid shape rather than a spiral shape. In other words, in this embodiment, the receiving coil 31 is also wound along a cylindrical surface.
[0037] A power transmission cable 35 (not shown in Figures 6-8; see Figure 9) is connected to the power receiving coil 31, and power is supplied from the power receiving coil 31 to the other parts of the scope unit 30 via this power transmission cable 35. In this embodiment, the scope unit 30 is equipped with two power receiving coils 31.
[0038] Furthermore, the aforementioned photodiode 320 and laser diodes 351, 352, and 353 are arranged on the end face of the mating projection 30b. The scope portion 30 may also be further equipped with an optical transmission member for transmitting light between these components and the outside, and such an optical transmission member may be arranged on the end face of the mating projection 30b.
[0039] The scope unit 30 is equipped with an optical path 37 for illumination light, and the optical path 37 is positioned via the end face of the fitting projection 30b. The optical path 37 transports illumination light, which is delivered from the processor unit 20 side, to other parts of the scope unit 30 (for example, the tip or an illumination unit located near the image sensor 40).
[0040] The relationship between the power transmission coil 21 and the power receiving coil 31 will be explained using Figure 9. The outer diameter of the power transmission coil 21 is smaller than the inner diameter of the power receiving coil 31, and the power transmission coil 21 can be inserted into the power receiving coil 31 such that they overlap each other axially (partially or entirely). In this embodiment, the coil support projection 26 of the processor unit 20 is inserted into the coil support recess 36 of the scope unit 30 by fitting the fitting projection 30b of the scope unit 30, thereby inserting the power transmission coil 21 into the power receiving coil 31.
[0041] In this way, with the processor unit 20 and the scope unit 30 coupled to each other, the power transmission coil 21 and the power receiving coil 31 overlap at least partially in the axial direction, making it possible to perform contactless power supply from the power transmission coil 21 to the power receiving coil 31. The contactless power supply method can be, for example, an electromagnetic induction method, but it may also be a resonance method or another method.
[0042] Thus, by using solenoid-shaped power transmission coils 21 and power receiving coils 31, and configuring them to supply power with at least a portion overlapping in the axial direction, relatively high power can be supplied. For this reason, the endoscope device 10 according to Embodiment 1 of the present invention can handle increased power without increasing the size of the connector portion.
[0043] Figures 10 to 12 show the processor unit 20 and the scope unit 30 (more specifically, the connector part 20a of the processor unit 20 and the connector part 30a of the scope unit 30) connected to each other. Figure 10 is a perspective view, Figure 11 is a top view, and Figure 12 is a side view.
[0044] When the processor unit 20 and the scope unit 30 are coupled together, as described above, the cylindrical convex surface of the coil support projection 26 and the cylindrical concave surface of the coil support recess 36 fit together. Furthermore, in this state, as described above, the power transmission coil 21 and the power receiving coil 31 overlap in the axial direction, making it possible to supply power from the power transmission coil 21 to the power receiving coil 31 without contact.
[0045] In this state, the laser diode 250 of the processor unit 20 and the photodiode 320 of the scope unit 30 enable the transmission and reception of optical signals, thereby transmitting control signals to the scope unit 30. Furthermore, in this state, the laser diodes 351, 352, and 353 of the scope unit 30 and the photodiodes 221, 222, and 223 of the processor unit 20 enable the transmission and reception of optical signals, thereby transmitting video signals to the processor unit 20.
[0046] Furthermore, in this state, the optical path 27 for illumination light of the processor unit 20 and the optical path 37 for illumination light of the scope unit 30 are coupled. This allows illumination light to be transmitted to the scope unit 30.
[0047] [Differentiation] Within the scope of the present invention, various modifications can be made to Embodiment 1 described above. Specifically, the following modifications are possible.
[0048] In Embodiment 1, the number of power transmission coils 21 and power receiving coils 31 is two each, but each may be one, or three or more each.
[0049] In Embodiment 1, the processor unit 20 and the scope unit 30 are connected by the fitting of the fitting recess 20b and the fitting projection 30b, but it is also possible to connect them by a method other than fitting.
[0050] Furthermore, in the case of mating, it is possible to swap the protrusions and recesses with each other. For example, the processor unit 20 may have a mating protrusion and a coil support recess, and the scope unit 30 may have a mating recess and a coil support projection.
[0051] The transmission and reception of control signals and / or video signals between the processor unit 20 and the scope unit 30 are not limited to optical signals. Furthermore, when optical signals are used, the transmission direction may be from the processor unit 20 to the scope unit 30, or conversely, from the scope unit 30 to the processor unit 20 (both of these are included in Embodiment 1).
[0052] The processor unit 20 may be equipped with a coupling detection switch that detects when the processor unit 20 and the scope unit 30 are coupled to each other. Alternatively, the scope unit 30 may be equipped with such a coupling detection switch instead of, or in addition to, the processor unit 20.
[0053] As a specific example of a coupling detection switch, the switch plate 20c shown in Figure 5 can be used. The switch plate 20c is positioned on the end face of the mating recess 20b of the processor unit 20 and is biased toward the inside of the mating recess 20b by, for example, a spring. When the processor unit 20 and the scope unit 30 are coupled to each other, the switch plate 20c is pushed by the mating projection 30b of the scope unit 30 and moves, thereby enabling the coupling to be detected. Note that the specific structure of the coupling detection switch is not limited to this plate shape.
[0054] The processor unit 20 and the scope unit 30 may be provided with a metal connection path for discharging static electricity. This path may be provided separately from the coupling detection switch and the signal ground.
[0055] This disclosure includes the following specific details: [Specific matter 1] A processor unit comprising a power transmission coil and a control board, A scope unit equipped with a power receiving coil and an endoscope, Equipped with, In a state where the processor unit and the scope unit are coupled to each other, the power transmission coil and the power receiving coil overlap at least partially in the axial direction, and non-contact power supply from the power transmission coil to the power receiving coil is possible. Endoscope equipment. [Specific matter 2] The endoscope apparatus according to specific item 1, wherein the power transmission coil and the power receiving coil are wound along a cylindrical surface. [Specific matter 3] One of the processor unit and the scope unit is provided with a cylindrical convex surface. The other of the processor unit and the scope unit is provided with a cylindrical concave surface. Both the power transmission coil and the power receiving coil are arranged along the convex or concave surface, In a state in which the processor unit and the scope unit are coupled to each other, the convex surface and the concave surface fit together. Endoscopic device as specified in item 1. [Specific matter 4] The aforementioned processor unit comprises a plurality of power transmission coils, The scope unit comprises a plurality of the power receiving coils. Endoscopic device as specified in item 1. [Specific matter 5] One of the processor unit and the scope unit includes a light-emitting element, The other of the processor unit and the scope unit includes a light-receiving element. In a state where the processor unit and the scope unit are coupled to each other, the light-emitting element and the light-receiving element are capable of transmitting and receiving optical signals. Endoscopic device as specified in item 1. [Specific matter 6] The processor unit and the scope unit each include an optical path for illumination light, In a state where the processor unit and the scope unit are coupled to each other, the respective optical paths are coupled. Endoscopic device as specified in item 1. [Specific matter 7] The endoscope apparatus according to specific item 1, wherein at least one of the processor unit and the scope unit is equipped with a coupling detection switch for detecting when the processor unit and the scope unit are coupled to each other. [Explanation of symbols]
[0056] 10… Endoscope equipment 20…Processor section 21... Power transmission coil 22…Control board 25… Power transmission cables 26... Coil support protrusion 27…Light path for illumination 30...Scope section 31... Power receiving coil 32…Endoscopy 33…Current monitoring section 34… Resistance 35... Power transmission cables 36…Coil support recess 37…Light path for illumination 40…Image sensor 20a... Connector part 20b…Recess for fitting 20c… Switchboard 211...First Controller 212... Second controller 221-223... Photodiode (light-receiving element) 231-233...Transimpedance amplifiers 241-243... Limiting amplifier 250… Laser diode (light-emitting element) 260… Laser Driver 270... Subsequent signal processing circuit 30a... Connector part 30b…Matching protrusion 311...First Controller 312... Second controller 320... Photodiode (light-receiving element) 330…Transimpedance amplifier 340... Limiting amplifier 351-353... Laser diode (light-emitting element) 361-363... Laser Driver
Claims
1. A processor unit comprising a power transmission coil and a control board, A scope unit equipped with a power receiving coil and an endoscope, Equipped with, In a state where the processor unit and the scope unit are coupled to each other, the power transmission coil and the power receiving coil overlap at least partially in the axial direction, and non-contact power supply from the power transmission coil to the power receiving coil is possible. The processor unit comprises a mating recess and a cylindrical convex surface, The scope portion comprises a fitting protrusion and a cylindrical concave surface. The power transmission coil is arranged along the convex surface, and the power receiving coil is arranged along the concave surface. In a state in which the processor unit and the scope unit are connected to each other by the fitting recess and the fitting protrusion, the convex surface and the concave surface are fitted to each other, The tip of the power receiving coil does not protrude from the tip surface of the fitting projection. The tip of the power transmission coil does not protrude from the open end of the fitting recess. Endoscope equipment.
2. The endoscope apparatus according to claim 1, wherein the power transmission coil and the power receiving coil are wound along a cylindrical surface.
3. The aforementioned processor unit comprises a plurality of power transmission coils, The scope unit comprises a plurality of the power receiving coils. The endoscopic apparatus according to claim 1.
4. One of the processor unit and the scope unit includes a light-emitting element, The other of the processor unit and the scope unit includes a light-receiving element. In a state where the processor unit and the scope unit are coupled to each other, the light-emitting element and the light-receiving element are capable of transmitting and receiving optical signals. The endoscopic apparatus according to claim 1.
5. The processor unit and the scope unit each include an optical path for illumination light, In a state where the processor unit and the scope unit are coupled to each other, the respective optical paths are coupled. The endoscopic apparatus according to claim 1.
6. The endoscope apparatus according to claim 1, wherein at least one of the processor unit and the scope unit is provided with a coupling detection switch for detecting when the processor unit and the scope unit are coupled to each other.
Citation Information
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