Fuse and method for manufacturing the same

Abstract

A fuse according to one embodiment disclosed herein may include a printed circuit board, a conductive pattern disposed on the printed circuit board, a film disposed on both sides of the conductive pattern or on top of the conductive pattern such that at least a portion of the top of the conductive pattern is open, and a coating agent disposed on the conductive pattern and the film.

Description

Technical Field

[0001] The present invention claims the benefit of priority based on Korean Patent Application No. 10-2021-0147220 filed on October 29, 2021, and all the contents disclosed in the literature of the Korean patent application are incorporated herein by reference in their entirety. The embodiments disclosed in this document relate to fuses and a method of manufacturing the same.

Background Art

[0002] In recent years, research and development of secondary batteries have been actively conducted. Here, a secondary battery is a battery that can be charged and discharged, and includes both conventional Ni / Cd batteries, Ni / MH batteries, etc. and recent lithium-ion batteries. Among secondary batteries, lithium-ion batteries have the advantage of having a much higher energy density compared to conventional Ni / Cd batteries, Ni / MH batteries, etc. In addition, since lithium-ion batteries can be manufactured in a small and lightweight form, they are used as a power source for mobile devices. In recent years, their usage range has been extended to the power source of electric vehicles and they have attracted attention as a next-generation energy storage medium.

[0003] In the case of a sensing line of a battery, problems such as fire may occur due to a high voltage, so a fuse must be used to prevent problems such as fire. When a conductive pattern is used in a form in which heat can accumulate on the sensing line on a PCB, burning may occur on the upper film when the temperature at which the conductive pattern operates is reached, and sufficient insulation resistance may not be ensured after the conductive pattern is disconnected.

Summary of the Invention

Problems to be Solved by the Invention

[0004] One object of the embodiments disclosed in this document is to provide a fuse in which less burning occurs on the upper film of a conductive pattern and a method of manufacturing the same. One objective of the embodiments disclosed herein is to provide a fuse and a method for manufacturing the same that can prevent the phenomenon of reduced insulation resistance due to opening the upper film of the conductive pattern, and can prevent the upper part from swelling due to gas generated inside when the conductive pattern is in operation.

[0005] The technical problems of the embodiments disclosed herein are not limited to those mentioned above, and other technical problems not mentioned above will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0006] A fuse according to one embodiment disclosed herein may include a printed circuit board (PCB), a conductive pattern disposed on the PCB, a film disposed on both sides of the conductive pattern or on top of the conductive pattern such that at least a portion of the area above the conductive pattern is open, and a coating agent disposed on top of the conductive pattern and the film.

[0007] In one embodiment, the coating agent may include a flame-retardant material. In one embodiment, the flame-retardant material may include a V0 grade flame retardant.

[0008] In one embodiment, the shape of at least a portion of the open area may be rectangular or circular. In one embodiment, the conductive pattern can be implemented on the PCB in a meandering shape so that heat can be accumulated.

[0009] In one embodiment, the film can be placed on both sides of the conductive pattern at a distance from the conductive pattern. In one embodiment, the film can be positioned to cover both sides of the upper part of the conductive pattern.

[0010] In one embodiment, the bonding force of the coating agent can be set so that it can be physically separated when gas is filled between the conductive pattern and the coating agent.

[0011] In one embodiment, the film may further include a dummy region positioned on top of the film to limit heat dissipation. In one embodiment, the dummy region may contain copper. In one embodiment, the dummy region can be arranged excluding the upper part of the fused portion of the conductive pattern.

[0012] A method for manufacturing a fuse according to one embodiment disclosed herein may include the steps of: forming a conductive pattern to be placed on the PCB; forming a film to be placed on both sides of the conductive pattern or on top of the conductive pattern such that at least a portion of the upper part of the conductive pattern is open; and forming a coating agent to be placed on top of the conductive pattern and the film. [Effects of the Invention]

[0013] A fuse according to one embodiment disclosed herein, and a method for manufacturing the same, can prevent the phenomenon of film burning and subsequent decrease in insulation resistance by leaving a portion of the upper part of the conductive pattern open.

[0014] A fuse according to one embodiment disclosed herein, and a method for manufacturing the same, can prevent the phenomenon in which the upper part of the conductive pattern bulges due to gas generated inside when the conductive pattern is in operation.

[0015] A fuse according to one embodiment disclosed herein, and a method for manufacturing the same, can provide a stable structure that minimizes the open area above the conductive pattern and prevents movement of the conductive pattern.

[0016] The fuse and its manufacturing method according to an embodiment disclosed in this document use a coating agent with a high flame retardant grade, and can prevent a fire from occurring on the PCB during the operation of the conductive pattern.

[0017] The fuse and its manufacturing method according to an embodiment disclosed in this document can set the bonding force of the coating agent so that the conductive pattern and the coating agent are physically separated during the operation of the conductive pattern.

[0018] The fuse and its manufacturing method according to an embodiment disclosed in this document can minimize the heat release in the area where disconnection is attempted using a dummy on the film. In addition to this, various effects directly or indirectly grasped by this document can be provided.

Brief Description of the Drawings

[0019] [Figure 1] It is a diagram showing a fuse according to an embodiment disclosed in this document. [Figure 2] It is a block diagram showing a cross-section of a fuse according to an embodiment disclosed in this document. [Figure 3] It is a diagram showing an example where the upper part of a fuse according to an embodiment disclosed in this document is open. [Figure 4] It is a diagram showing an example where the upper part of a fuse according to an embodiment disclosed in this document is open. [Figure 5] It is a diagram showing an example where the upper part of a fuse according to an embodiment disclosed in this document is open. [Figure 6] It is a diagram showing the dummy area of a fuse according to an embodiment disclosed in this document. [Figure 7] It is a diagram showing a cross-section of a fuse according to another embodiment disclosed in this document. [Figure 8] It is a flowchart showing the manufacturing method of a fuse according to an embodiment disclosed in this document.

Modes for Carrying Out the Invention

[0020] Hereinafter, the embodiments disclosed in this document will be described in detail with reference to exemplary drawings. When assigning reference numerals to the components of each drawing, it should be noted that the same components are assigned the same numerals as much as possible when they are shown on other drawings. Further, when explaining the embodiments disclosed in this document, if a specific explanation of a related known configuration or function is determined to hinder the understanding of the embodiments disclosed in this document, the detailed explanation thereof will be omitted.

[0021] When explaining the components of the embodiments disclosed in this document, terms such as first, second, A, B, (a), (b), etc. may be used. Such terms are merely for distinguishing the components from other components, and the essence, order, or procedure of the components are not limited by such terms. Also, unless otherwise defined, all terms used here, including technical or scientific terms, have the same meaning as commonly understood by those having ordinary knowledge in the technical field to which the embodiments disclosed in this document belong. Terms defined as in a generally used dictionary should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and should not be interpreted in an ideal or overly formal sense unless clearly defined in this application.

[0022] FIG. 1 is a diagram showing a fuse according to an embodiment disclosed in this document. Referring to FIG. 1, a fuse 100 according to an embodiment disclosed in this document can include a printed circuit board (PCB) 110, a conductive pattern 120, a film 130, and a coating agent 140.

[0023] The printed circuit board 110 can include a PCB or an FPCB. The conductive pattern 120 can be placed on the printed circuit board 110. For example, the conductive pattern 120 can be implemented in a meandering shape on the printed circuit board 110 so that heat can be accumulated. In another example, the conductive pattern 120 may include copper. In this case, the conductive pattern 120 can operate at temperatures above 1040°C. In yet another example, the conductive pattern 120 can melt at temperatures above a set temperature.

[0024] The film 130 can be placed on both sides of the conductive pattern 120 or on top of the conductive pattern 120. The film 130 can be placed such that at least a portion of the area on top of the conductive pattern 120 is open. For example, the film 130 can be placed on both sides of the conductive pattern 120 at a distance from the conductive pattern 120. In one embodiment, since the film 130 is placed such that at least a portion of the area on top of the conductive pattern 120 is open, burning does not occur even if high heat is generated during the disconnection process of the conductive pattern 120. In one embodiment, the shape of the at least portion of the area on top of the conductive pattern 120 that is open may be a rectangle, a circle, or a polygon.

[0025] The coating agent 140 can be placed on top of the conductive pattern 120 and the film 130. For example, the coating agent 140 may include a flame-retardant material. In one embodiment, the flame-retardant material may include a V0 grade flame retardant. That is, the coating agent 140 can prevent fire (flames) even if high heat is generated when the conductive pattern 120 is operating. The coating agent 140 can cover at least a portion of the area on top of the conductive pattern 120 that is exposed by the film 130.

[0026] The coating agent 140 may include a material with low heat absorption. For example, the coating agent 140 may be made of a material with low heat absorption so that the conductive pattern 120 can be easily broken in the area in contact with the conductive pattern 120.

[0027] When the conductive pattern 120 is in operation, the gas generated inside may cause the upper part of the conductive pattern 120 to bulge. However, the coating agent 140 covering the upper part of the conductive pattern 120 can prevent this bulging phenomenon.

[0028] In one embodiment, the bonding force of the coating agent 140 can be set so that it physically separates from the conductive pattern 120 when gas fills the space between the conductive pattern 120 and the coating agent 140. For example, when an overcurrent is applied to the conductive pattern 120, heat may be applied to the film 130 and adhesive, generating gas, which may cause separation between the conductive pattern 120 and the coating agent 140. The conductive pattern 120 needs to operate quickly to prevent separation due to gas, but the bonding force of the coating agent 140 can be set so that it physically separates from the conductive pattern 120 when an overcurrent is applied to the conductive pattern 120.

[0029] In one embodiment, the film 130 or coating agent 140 can cover the upper part of the conductive pattern 120, and thus a stable structure can be provided that prevents the movement of the conductive pattern 120.

[0030] Figure 2 is a block diagram showing a cross-section of a fuse according to one embodiment disclosed in this document. Referring to Figure 2, a printed circuit board 110 can be placed at the bottom of the fuse 100.

[0031] A conductive pattern 120 can be placed on top of the printed circuit board 110. In some embodiments, a film or adhesive may be further included between the printed circuit board 110 and the conductive pattern 120.

[0032] The film 130 can be attached to the top of the printed circuit board 110 and positioned such that at least a portion of the area above the conductive pattern 120 is open. Figure 2 shows, but is not limited to, an example in which the film 130 is positioned such that the entire area above the conductive pattern 120 is open.

[0033] The film 130 can be placed on both sides of the conductive pattern 120. For example, the film 130 can be placed on both sides of the conductive pattern 120 at a distance from the conductive pattern 120.

[0034] The coating agent 140 can be positioned to cover the upper parts of the conductive pattern 120 and the film 130. For example, in areas where the film 130 does not cover the upper part of the conductive pattern 120, the coating agent 140 can cover the upper part of the conductive pattern 120.

[0035] Figures 3 to 5 show examples of a fuse with an open top according to one embodiment disclosed in this document. Referring to Figure 3, the film 130 included in the fuse 100 according to one embodiment disclosed herein can leave at least a portion of the upper part 10 of the conductive pattern 120 open. For example, the film 130 can be positioned so that at least a portion of the upper part 10 of the conductive pattern 120 is open, and the coating agent 140 can be positioned to cover the film 130 and the upper part of the conductive pattern 120.

[0036] The open portion 10 at the top of the conductive pattern 120 is rectangular in shape, but the larger the open portion 10, the more difficult it is to fix the conductive pattern 120, and the less stable it becomes. In other words, if the open portion 10 is large, the conductive pattern 120 will move, and even if the conductive pattern 120 operates and breaks, a short circuit may occur again. Therefore, the open portion 10 must be minimized.

[0037] Referring to Figure 4, the film 130 included in the fuse 100 according to one embodiment disclosed herein can open up at least a portion of the upper part 20 of the conductive pattern 120. For example, the shape of at least a portion of the 20 may be rectangular.

[0038] The upper portion of the open conductive pattern 120 may consist of multiple regions 20. For example, as shown in Figure 4, the upper portion of the region 20 may consist of multiple rectangles. Another example is that, since the upper portion of the open conductive pattern 120 must be minimized, the film 130 can open up a portion of the upper portion of the conductive pattern 120 through multiple rectangle regions.

[0039] Referring to Figure 5, the film 130 included in the fuse 100 according to one embodiment disclosed herein can open up at least a portion of the upper part 30 of the conductive pattern 120. For example, the shape of at least a portion of the 30 may be circular.

[0040] The upper portion of the open conductive pattern 120 may consist of multiple regions 30. For example, as shown in Figure 5, the upper portion of the region 30 may consist of multiple circles. Another example is that, since the upper portion of the open conductive pattern 120 must be minimized, the film 130 can open up a portion of the upper portion of the conductive pattern 120 through multiple circular regions.

[0041] Figure 6 shows a dummy region of a fuse according to one embodiment disclosed in this document. Referring to Figure 6, the fuse 100 according to one embodiment disclosed in this document may further include a dummy area 150.

[0042] The dummy region 150 can be placed on top of the film 130. For example, the dummy region 150 can be placed on top of the film 130 to limit heat dissipation. Another example is that the dummy region 150 can be placed on top of the film 130 to minimize heat dissipation. The film 130 can be placed on top of the conductive pattern 120, but if only the film 130 is placed, it may be weak and prone to tearing, so the dummy region 150 can be placed on top of the film 130 to protect it. In one embodiment, the dummy region 150 may contain copper.

[0043] The dummy region 150 can be positioned excluding the upper part of the fused section of the conductive pattern 120. For example, the dummy region 150 can be removed or minimized above the fused section of the conductive pattern 120 to minimize heat dissipation. Therefore, the fused section of the conductive pattern 120 may be more prone to disconnection.

[0044] In one embodiment, the dummy region 150 can be realized in the shape shown in Figure 6. However, it is not limited to this, and the dummy region 150 can be realized in various shapes, where it is located on the upper part of the film 130 and not on the upper part of the heat-cut portion of the conductive pattern 120.

[0045] Figure 7 shows a cross-section of a fuse according to another embodiment disclosed in this document. Referring to Figure 7, a fuse 200 according to other embodiments disclosed in this document may include a printed circuit board 210, a conductive pattern 220, a film 230, and a coating agent 240. In one embodiment, the printed circuit board 210, the conductive pattern 220, the film 230, and the coating agent 240 may each be substantially identical to the printed circuit board 110, the conductive pattern 120, the film 130, and the coating agent 140 of Figure 1.

[0046] The film 230 can be positioned on top of the conductive pattern 220 such that at least a portion of the upper part of the conductive pattern 220 is open. For example, the film 230 can be positioned to cover both sides of the upper part of the conductive pattern 220. The coating agent 240 can cover the top of the film 230 and the conductive pattern 220.

[0047] In one embodiment, the conductive pattern 220 of the fuse 200 shown in Figure 7, according to another embodiment disclosed herein, can be opened up at least a portion of its upper portion by the film 230, as shown in Figures 3 to 5.

[0048] Figure 8 is a flowchart showing a method for manufacturing a fuse according to one embodiment disclosed in this document. Referring to Figure 8, a method for manufacturing a fuse 100 according to one embodiment disclosed in this document may include the steps of: forming a conductive pattern (S110) on a printed circuit board; forming a film (S120) on both sides of the conductive pattern or on top of the conductive pattern such that at least a portion of the area on top of the conductive pattern is open; and forming a coating agent (S130) on top of the conductive pattern and the film.

[0049] In the step (S110) of forming a conductive pattern to be placed on a printed circuit board, a conductive pattern 120 can be formed to be placed on top of the PCB 110. For example, the conductive pattern 120 may have a meandering shape on the PCB so that heat from the PCB 110 can accumulate.

[0050] In step (S120) of forming a film to be placed on both sides of the conductive pattern or on top of the conductive pattern such that at least a portion of the upper part of the conductive pattern is open, the film 130 can be formed such that at least a portion of the upper part of the conductive pattern 120 is open. For example, the film 130 can be placed on both sides of the conductive pattern 120 or on top of the conductive pattern 120. Another example is that the film 130 can open at least a portion of the upper part of the conductive pattern 120 in a rectangular or circular shape.

[0051] In step (S130) of forming a coating agent to be placed on top of the conductive pattern and film, the coating agent 140 can be formed on top of the conductive pattern 120 and film 130. For example, the coating agent 140 may include a flame retardant material, which may include a V0 grade flame retardant. In another example, the bonding force of the coating agent 140 can be set so that it can be physically separated when gas is filled between the conductive pattern 120 and the coating agent 140.

[0052] The above description is merely illustrative of the technical concept disclosed in this document, and a person with ordinary skill in the art to which the embodiments disclosed in this document belong can make various modifications and variations without departing from the essential characteristics of the embodiments disclosed in this document.

[0053] Therefore, the embodiments disclosed herein are for illustrative purposes only, not to limit, the technical ideas disclosed herein, and such embodiments do not limit the scope of the technical ideas disclosed herein. The scope of protection for the technical ideas disclosed herein shall be interpreted in accordance with the claims described below, and all technical ideas within an equivalent scope shall be interpreted as being included in the scope of rights of this document.

Claims

1. A printed circuit board and A conductive pattern arranged on the printed circuit board, A film is placed on top of the conductive pattern such that a portion of the upper part of the conductive pattern is open, A conductive pattern in which a portion of the aforementioned area is open, and a coating agent disposed on the upper part of the film, Includes, The aforementioned coating agent is A fuse in which the bonding force between the conductive pattern and the coating agent is set so that they can be physically separated when gas is filled between the conductive pattern and the coating agent.

2. A printed circuit board, A conductive pattern arranged on the printed circuit board, A film is placed on top of the conductive pattern such that a portion of the upper part of the conductive pattern is open, A conductive pattern in which a portion of the aforementioned area is open, and a coating agent disposed on the upper part of the film, A fuse that includes, A fuse further comprising a dummy region positioned on top of the film to limit heat dissipation from the conductive pattern.

3. The fuse according to claim 2, wherein the dummy region comprises copper.

4. The aforementioned dummy area is, The fuse according to claim 2, wherein the conductive pattern is arranged excluding the upper part of the fused portion.

5. The fuse according to any one of claims 1 to 4, wherein the coating agent includes a flame-retardant material.

6. The aforementioned flame-retardant material is The fuse according to claim 5, comprising a flame retardant of V0 grade.

7. The fuse according to any one of claims 1 to 4, wherein the shape of at least a portion of the open area is rectangular or circular.

8. The fuse according to any one of claims 1 to 4, wherein the conductive pattern has a meandering shape on the printed circuit board so as to allow heat to accumulate.

9. The aforementioned film is The fuse according to any one of claims 1 to 4, wherein the fuse is arranged to cover at least a portion of both sides of the upper part of the conductive pattern.

10. The aforementioned printed circuit board is A fuse according to any one of claims 1 to 4, comprising a PCB (Printed Circuit Board) or an FPCB (Flexible Printed Circuit Board).

11. The steps include forming a conductive pattern on a printed circuit board, The steps include forming a film to be placed on top of the conductive pattern such that a portion of the upper part of the conductive pattern is open, The steps include forming a conductive pattern in which a portion of the aforementioned area is open and a coating agent to be placed on top of the film, Includes, The aforementioned coating agent is A method for manufacturing a fuse, wherein the bonding force between the conductive pattern and the coating agent is set so that they can be physically separated when gas is filled between the conductive pattern and the coating agent.

12. The steps of forming a conductive pattern to be placed on a printed circuit board, The steps include forming a film to be placed on top of the conductive pattern such that a portion of the upper part of the conductive pattern is open, The steps include forming a conductive pattern in which a portion of the aforementioned area is open and a coating agent to be placed on top of the film, The steps include: forming a dummy region positioned on the upper part of the film to limit heat dissipation from the conductive pattern; A method for manufacturing fuses, including...

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