Image sensor unit and imaging device

Abstract

This imaging element unit is incorporated in a casing of an imaging device, and comprises: an imaging element having an imaging surface for capturing an image of a subject, and a rear surface that opposes the imaging surface; a circuit board that is attached to the rear surface and has an opening formed therein through which the rear surface is partially exposed; and a first heat conductive member and a second heat conductive member through which driving heat of the imaging element is conducted. The first heat conductive member is connected to the second heat conductive member and has a higher elasticity than the second heat conductive member, and the second heat conductive member is connected to the rear surface via the opening.

Description

Technical Field

[0001] The technology of the present disclosure relates to an imaging element unit and an imaging device.

Background Art

[0002] Japanese Patent No. 5168047 discloses a heat dissipation structure of an imaging element mounted on a shake correction unit, in which a heat dissipation member is provided in the vicinity of the shake correction unit, and a metal member and a heat dissipation member located in the vicinity of the imaging element in the shake correction unit are connected by a flexible member having heat conductivity. A camera having a heat dissipation structure of an imaging element, wherein the heat dissipation member has a ring shape surrounding the metal member, and a plurality of extending portions are formed on the outer peripheral edge thereof, and the plurality of extending portions are fixed to the lens barrel or the frame of the camera, is described.

[0003] Japanese Unexamined Patent Application Publication No. 特開2020-067632 discloses an imaging device including an imaging sensor, a sensor substrate on which the imaging sensor is mounted, and a metal holder having an outer shape larger than that of the imaging sensor. The sensor substrate is provided with an opening for exposing an exposed portion which is a part of the main surface of the imaging sensor, and the metal holder is configured to directly contact the exposed portion through the opening.

Summary of the Invention

[0004] One embodiment of the technology according to the present disclosure provides an imaging element unit and an imaging device capable of making a heat conduction member through which driving heat of an imaging element is conducted difficult to peel off from the imaging element.

Means for Solving the Problems

[0005] The image sensor unit of this disclosure is an image sensor unit built into the housing of an imaging device, and comprises an image sensor having an imaging surface for imaging a subject and a back surface facing the imaging surface, a circuit board attached to the back surface and having an opening formed therein that exposes a part of the back surface, and a first heat conductive member and a second heat conductive member to which the driving heat of the image sensor is conducted, wherein the first heat conductive member is connected to the second heat conductive member and has higher elasticity than the second heat conductive member, and the second heat conductive member is connected to the back surface via the opening.

[0006] The system is equipped with a vibration damping function that moves the image sensor in the plane direction of the imaging surface, and it is preferable that the first heat conductive member deforms in a way that can follow the movement of the image sensor due to the vibration damping function.

[0007] The second heat conductive member is preferably connected to a part of the back surface and has a first piece facing the back surface and a second piece bent from the first piece, with the first heat conductive member being connected to the second piece.

[0008] The second piece preferably extends in the direction normal to the imaging surface and the back surface.

[0009] The circuit board is equipped with a flexible substrate, and it is preferable that the flexible substrate is positioned on the opposite side of the first heat conductive member, with the second piece in between.

[0010] The second heat conduction member preferably has higher thermal conductivity than the first heat conduction member.

[0011] The second heat conductive member is preferably thicker than the first heat conductive member.

[0012] The aperture preferably exposes the central region on the back surface. The central region is preferably the area on which the image sensor identification information is written.

[0013] Preferably, the first heat conductive member is formed from a graphite sheet, and the second heat conductive member is formed from metal.

[0014] The imaging device of this disclosure comprises a housing and an image sensor unit built into the housing as described in any of the above.

[0015] The housing is preferably connected to the third heat conduction member, and the third heat conduction member is connected to the housing, allowing the heat to be conducted from the back surface.

[0016] The housing and the third heat conduction member are connected by a fourth heat conduction member, and the first and fourth heat conduction members are formed from graphite sheets, with the fourth heat conduction member preferably being thicker than the first heat conduction member. [Brief explanation of the drawing]

[0017] [Figure 1] This is a diagram of a digital camera. [Figure 2] This is a front-facing exploded perspective view of the image sensor unit. [Figure 3] This is a rear view perspective of the disassembled image sensor unit. [Figure 4] This is a rear view perspective of the main components of the image sensor unit after disassembly. [Figure 5] This is a perspective view of the first heat conduction member, the second heat conduction member, and the third heat conduction member. [Figure 6] These are plan views of the first heat conduction member, the second heat conduction member, and the third heat conduction member. [Figure 7] This is a cross-sectional view of the main part of the image sensor unit. [Figure 8] This is a perspective view of the third heat conduction member, the fourth heat conduction member, and the connecting member. [Figure 9] This is a simplified plan view of the first heat conduction member. [Figure 10] This figure shows the first heat conduction member before and after bending. [Figure 11] This figure shows how the first heat conduction member deforms. [Figure 12] This figure shows how the first heat conduction member deforms. [Figure 13] This diagram shows the heat conduction path for the drive of the image sensor. [Figure 14] This is a diagram showing a first heat conduction member with a triple structure. [Figure 15] This is a diagram showing an octagonal first heat conduction member. [Figure 16] This is a diagram showing a first heat conduction member in which the corners of the connection part of the outer layer and the corners of the connection part of the inner layer are recessed inward. [Figure 17] This is a diagram showing an imaging device unit having a fifth heat conduction member. [Figure 18] This is a diagram showing an imaging device unit having a fifth heat conduction member. [Figure 19] This is a simple plan view of the fifth heat conduction member.

Embodiments for Carrying out the Invention

[0018] Hereinafter, an example of an embodiment of the technology of the present disclosure will be described while referring to the drawings.

[0019] [First Embodiment] As an example, as shown in FIG. 1, the digital camera 2 includes a camera body 10. A lens mount 11 is provided on the front of the camera body 10. The lens mount 11 has a circular imaging aperture 12. An interchangeable imaging lens (not shown) is detachably attached to the lens mount 11. The digital camera 2 is an example of an “imaging device” according to the technology of the present disclosure. Also, the camera body 10 is an example of a “housing” according to the technology of the present disclosure.

[0020] The camera body 10 has a built-in image sensor unit 15. The image sensor unit 15 is equipped with a rectangular plate-shaped image sensor 16. The image sensor 16 is, for example, a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor. The image sensor 16 has a rectangular imaging surface 17 for imaging a subject. The imaging surface 17 receives subject light indicating the subject. As is well known, pixels that convert the received subject light into electrical signals are arranged in a two-dimensional manner on the imaging surface 17. The entire imaging surface 17 is exposed to the outside through the imaging aperture 12.

[0021] A CPU (Central Processing Unit) 18 is connected to the image sensor unit 15. The CPU 18 controls the operation of the image sensor unit 15. Although not shown in the diagram, the CPU 18 is also connected to ROM (Read Only Memory) and / or RAM (Random Access Memory) via a bus line. The CPU 18, memory, and bus line constitute the computer.

[0022] The image sensor unit 15 is equipped with an image stabilization function. The image stabilization function is a function to suppress the relative positional shift between the subject light incident on the image sensor 17 and the digital camera 2, which is caused by vibrations applied to the camera body 10. Vibrations applied to the camera body 10 include hand tremors of the user holding the camera body 10 and taking pictures of the subject.

[0023] Under the control of the CPU 18, the image sensor 16 is moved by the vibration stabilization function in a direction that cancels out the misalignment, by an amount that cancels out the misalignment. More specifically, the image sensor 16 is moved by the vibration stabilization function in the X-axis direction parallel to the side 19 of the imaging surface 17 of the image sensor 16, and / or in the Y-axis direction parallel to the side 20 that is perpendicular to the side 19, i.e., intersects the side 19 at a 90° angle. The X-axis direction and the Y-axis direction are examples of "plane directions" in the art of this disclosure. In this specification, the terms "orthogonal" and "90°" include not only the meaning of perfectly orthogonal and 90°, but also the meaning of approximately orthogonal and approximately 90°, which include tolerances in design and manufacturing. In this specification, the term "parallel" includes not only the meaning of perfectly parallel, but also the meaning of approximately parallel, which includes tolerances in design and manufacturing. Hereinafter, the side of side 19 will be referred to as "down," and the side opposite to side 19 with respect to the Y-axis direction will be referred to as "up." Additionally, the side with edge 20 is referred to as "left," and the side opposite to edge 20 in the X-axis direction is referred to as "right."

[0024] Herein, in this specification, "positional misalignment" refers to the phenomenon caused by the change in the optical axis OA relative to the subject due to vibration. "Optical axis OA" refers to the optical axis of the subject light incident on the imaging surface 17 through the imaging lens. A change in the optical axis OA means that the optical axis OA is tilted with respect to the reference axis (for example, the optical axis OA before the positional misalignment occurs) due to the positional misalignment. In this specification, canceling out positional misalignment includes not only eliminating positional misalignment but also reducing it.

[0025] In Figures 2 and 3, the image sensor unit 15 includes a fixed member 30, a movable member 31, and a yoke 32, etc. The fixed member 30 is positioned on the rear side of the camera body 10, and the yoke 32 is positioned on the front side of the camera body 10. The fixed member 30 is fixed to the camera body 10. The fixed member 30 and the yoke 32 are fixed with a gap between them in the Z-axis direction, which is perpendicular to the X-axis and Y-axis. The movable member 31 is positioned between the fixed member 30 and the yoke 32 via three balls 35, 36, and 37 of the same size. The movable member 31 can move (rotate around the Z-axis) in the X-axis direction and the Y-axis direction relative to the fixed member 30 and the yoke 32 via the balls 35-37. The Z-axis is parallel to the optical axis OA before the misalignment occurs.

[0026] The fixed member 30 holds magnets 40, 41, and 42. Magnets 40-42 are mounted on the front of the fixed member 30 facing the movable member 31. Each of the magnets 40-42 is a set consisting of a plate-shaped magnet with its north pole facing the movable member 31 and a plate-shaped magnet with its south pole facing the movable member 31. Magnet 40 is positioned in the lower center of the fixed member 30, with its long side aligned along the X-axis. Magnets 41 and 42 are aligned along the Y-axis. Magnet 41 is positioned in the upper left corner of the fixed member 30, with its long side aligned along the Y-axis. Magnet 42 is positioned in the lower left corner of the fixed member 30, with its long side aligned along the Y-axis.

[0027] In addition to magnets 40-42, plates 45, 46, and 47 are attached to the front of the fixing member 30. Plate 45 is located at the lower right corner of the fixing member 30, above magnet 40. Plate 46 is located on the left side of the fixing member 30, between magnets 41 and 42. Plate 47 is located at the upper right corner of the fixing member 30. Plate 45 supports the ball 35 so that it can roll, plate 46 supports the ball 36 so that it can roll, and plate 47 supports the ball 37 so that it can roll.

[0028] The fixed member 30 has square-shaped restricting openings 50 and 51 formed therein that restrict the range of movement of the movable member 31 in the XY plane. The restricting openings 50 and 51 are approximately the same size when viewed from the Z-axis direction. The restricting opening 50 is formed in the lower left corner of the fixed member 30, between the magnet 42 and the plate 45. The restricting opening 51 is formed in the upper right corner of the fixed member 30, to the left of the plate 47. In other words, the restricting openings 50 and 51 are positioned approximately diagonally opposite each other on the fixed member 30.

[0029] The fixing member 30 is provided with female threads 55, 56, 57, and 58 via spacers. Female thread 55 is located in the lower right corner of the fixing member 30. Female thread 56 is located in the upper left corner of the fixing member 30. Female thread 57 is located in the lower left corner of the fixing member 30. Female thread 58 is located in the upper right corner of the fixing member 30.

[0030] A relatively large rectangular access opening 59 is formed in the center of the fixed member 30. The access opening 59 is provided to allow access to the back surface of the movable member 31 from the back surface of the fixed member 30.

[0031] The movable member 31 holds the image sensor 16 and also holds coils 60, 61, and 62. The image sensor 16 is located in the center of the movable member 31. Coil 60 is located in the lower center of the movable member 31, facing the magnet 40 in the Z-axis direction. Coil 61 is located in the upper left corner of the movable member 31, facing the magnet 41 in the Z-axis direction. Coil 62 is located in the lower left corner of the movable member 31, facing the magnet 42 in the Z-axis direction. Coil 60 is positioned so that its long side is aligned with the X-axis direction. Coils 61 and 62 are aligned along the Y-axis direction. Coils 61 and 62 are each positioned so that their long sides are aligned with the Y-axis direction.

[0032] A magnet 65 is held in the yoke 32. A magnetic material 66 is attached to coil 61, and a magnetic material 67 is attached to coil 62. Magnet 65 is, for example, a neodymium magnet. Magnetic materials 66 and 67 are, for example, thin iron plates. Magnet 65 is positioned to cover coil 60, increasing the driving force of coil 60. Magnetic materials 66 and 67 are aligned along the Y-axis. Magnetic material 66 is located on the upper end side of coil 61, and magnetic material 67 is located on the lower end side of coil 62.

[0033] As mentioned above, the coil 60 is positioned opposite the magnet 40 in the Z-axis direction, so the magnet 65 is also positioned opposite the magnet 40 in the Z-axis direction. Therefore, the magnet 65 is attracted to the magnet 40 while fixed to the yoke 32.

[0034] Similarly, since coil 61 is positioned opposite magnet 41 with respect to the Z-axis direction as described above, magnetic material 66 is also positioned opposite magnet 41 with respect to the Z-axis direction. Therefore, magnetic material 66 is attracted to magnet 41. Also, since coil 62 is positioned opposite magnet 42 with respect to the Z-axis direction as described above, magnetic material 67 is also positioned opposite magnet 42 with respect to the Z-axis direction. Therefore, magnetic material 67 is attracted to magnet 42.

[0035] Recesses 70, 71, and 72 are formed on the back surface of the movable member 31 facing the fixed member 30. Recess 70 is located at the lower right corner of the movable member 31, facing the plate 45 in the Z-axis direction. Recess 71 is located between coils 61 and 62 on the left side of the movable member 31, facing the plate 46 in the Z-axis direction. Recess 72 is located at the upper right corner of the movable member 31, facing the plate 47 in the Z-axis direction. Recess 70 accommodates the ball 35 so as to be able to roll, recess 71 accommodates the ball 36 so as to be able to roll, and recess 72 accommodates the ball 37 so as to be able to roll. When viewed from above in the Z-axis direction, the size of recesses 70 to 72 is slightly larger than the diameter of balls 35 to 37. Also, the depth of recesses 70 to 72 in the Z-axis direction is slightly smaller than the diameter of balls 35 to 37.

[0036] On the back of the movable member 31, a cylindrical projection 80 is provided, which protrudes toward the fixed member 30 at a position opposite to the restricting opening 50 in the Z-axis direction. Additionally, a cylindrical projection 81 is provided on the back of the movable member 31, which protrudes toward the fixed member 30 at a position opposite to the restricting opening 51 in the Z-axis direction. The projection 80 is inserted through the restricting opening 50. Similarly, the projection 81 is inserted through the restricting opening 51. Therefore, projections 80 and 81 act as restricting pins that restrict the movement of the movable member 31 in the XY plane.

[0037] The yoke 32 is a magnetic material, such as a thin iron plate, and is roughly C-shaped. The yoke 32 forms a magnetic circuit with the magnets 40-42, increasing the magnetic flux received by the coils 60-62.

[0038] Male screws 85, 86, 87, and 88 are attached to the yoke 32. Male screws 85 to 88 are fastened and secured to female screws 55 to 58 of the fixing member 30. This fixes the fixing member 30 and the yoke 32, and holds the movable member 31 movably between the fixing member 30 and the yoke 32.

[0039] The image sensor unit 15 is equipped with a pair of voice coil motors (VCMs). The pair of VCMs is a first VCM and a second VCM. The first VCM is equipped with a magnet 40 and a coil 60, and a yoke 32, and generates power to move the movable member 31 in the Y-axis direction. On the other hand, the second VCM is equipped with a magnet 41 and a coil 61, a magnet 42 and a coil 62, and a yoke 32, and generates power to move the movable member 31 in the X-axis direction. More specifically, the first VCM generates power to move the movable member 31 in the Y-axis direction by the magnetic force of the magnet 40 and the current flowing through the coil 60. The second VCM generates power to move the movable member 31 in the X-axis direction by the magnetic force of the magnet 41 and the current flowing through the coil 61, as well as the magnetic force of the magnet 42 and the current flowing through the coil 62.

[0040] Although not shown in the diagram, the movable member 31 is equipped with a Hall element for detecting the position of the movable member 31, and a temperature sensor for measuring the temperature around the Hall element. The CPU 18 takes the difference between the position of the movable member 31 detected by the Hall element and the target position of the movable member 31 to correct the misalignment, and performs feedback control to drive the VCM to eliminate the difference. If the difference is large, the power from the VCM becomes relatively large, and conversely, if the difference is small, the power from the VCM becomes relatively small. The CPU 18 also corrects the temperature drift of the Hall element using the temperature measured by the temperature sensor.

[0041] As shown in Figure 4, a rectangular plate-shaped circuit board 90, approximately the same size as the image sensor 16, is attached to the back surface 89 of the image sensor 16 facing the imaging surface 17. The circuit board 90 is formed of a resin such as epoxy. A rectangular opening 91 is formed in the circuit board 90. The opening 91 is formed in the center of the circuit board 90 and exposes the central region 92 of the back surface 89 of the image sensor 16. The central region 92 is a predetermined size area centered on the center point C of the back surface 89 of the image sensor 16 and surrounding the center point C. Identification information 98 of the image sensor 16 is written in the central region 92. The opening 91 is formed to allow viewing of this identification information 98. The identification information 98 is, for example, a two-dimensional barcode for navigating to an internet page containing a management number and management information. Note that the central region 92 is an example of a "part of the back surface" related to the technology of this disclosure.

[0042] The circuit board 90 is equipped with electrical circuits such as the control circuit, drive circuit, and power supply circuit for the image sensor 16. face Connectors 93 and 94 are provided at the lower end. Also, on the back of the circuit board 90 face A connector 95 is provided at the left end.

[0043] One end of the flexible circuit board 96 is connected to connectors 93 and 94. The other end of the flexible circuit board 96 is pulled out to the back side of the fixed member 30 through the access opening 59 (see Figure 7). The other end of the flexible circuit board 96 is connected to the CPU 18 and a power supply circuit (not shown) that supplies power from the battery. One end of the flexible circuit board 97 (see Figure 1) is connected to connector 95. The other end of the flexible circuit board 97 wraps around to the front of the movable member 31 and is connected to the image sensor 16. In summary, the other end of the flexible circuit board 97 is connected to the image sensor 16, and one end of the flexible circuit board 97 is connected to connector 95. Then, one end of the flexible circuit board 96 is connected to connectors 93 and 94, and the CPU 18, etc. are connected to the other end of the flexible circuit board 96. Therefore, the image sensor 16, the circuit board 90, the CPU 18, etc. are connected via the flexible circuit board 97, connectors 95, 93 and 94, and the flexible circuit board 96.

[0044] The image sensor unit 15 further includes a first heat conductive member 100, a second heat conductive member 101, and a third heat conductive member 102, to which the driving heat of the image sensor 16 is conducted.

[0045] The first heat conduction member 100 is connected to the second heat conduction member 101 and the third heat conduction member 102. Drive heat is conducted to the first heat conduction member 100 from the second heat conduction member 101. The first heat conduction member 100 also conducts drive heat to the third heat conduction member 102. The second heat conduction member 101 is connected to the central region 92 of the back surface 89 of the image sensor 16 exposed by the opening 91. Drive heat is conducted to the second heat conduction member 101 from the central region 92.

[0046] The first heat conduction member 100 and the second heat conduction member 101 are fixed together with adhesive. A female screw 68 is formed in the fixing member 30. A through hole 103 is formed in the first heat conduction member 100. A male screw 104 is attached to the third heat conduction member 102. The male screw 104 passes through the through hole 103 of the first heat conduction member 100 and is fastened and fixed to the female screw 68 of the fixing member 30. In this way, the first heat conduction member 100 and the third heat conduction member 102 are fixed together.

[0047] The first heat conductive member 100 is formed from a graphite sheet. The graphite sheet is constructed by laminating the graphite sheet body with a resin film such as PET (Polyethylene Terephthalate) film. The thickness of the graphite sheet body is, for example, 70 μm, and the thickness of the resin film is, for example, 5 μm.

[0048] The second heat conduction member 101 and the third heat conduction member 102 are metal plates, such as copper plates. Therefore, the second heat conduction member 101 and the third heat conduction member 102 have higher rigidity than the first heat conduction member 100, which is made of a graphite sheet. In other words, the first heat conduction member 100 has higher elasticity than the second heat conduction member 101 and the third heat conduction member 102.

[0049] As an example, as shown in Figures 5 and 6, the first heat conductive member 100 has a double-layer structure having an outer layer 110 and an inner layer 111. The inner layer 111 is connected to the outer layer 110 via a connecting portion 112 (see also Figure 9, etc.) and is positioned in the space surrounded by the outer layer 110. An attachment portion 113 with an insertion hole 103 is provided on the upper part of the outer layer 110.

[0050] The outer layer 110 and the inner layer 111 are both hexagonal. The outer layer 110 consists of a first sheet portion 115, a second sheet portion 116 having the same length as the first sheet portion 115 and facing the first sheet portion 115, and a pair of V-shaped connecting portions 117 connecting the first sheet portion 115 and the second sheet portion 116. Similarly, the inner layer 111 consists of a first sheet portion 118, a second sheet portion 119 having the same length as the first sheet portion 118 and facing the first sheet portion 118, and a pair of V-shaped connecting portions 120 connecting the first sheet portion 118 and the second sheet portion 119. The first sheet portion 115 and the second sheet portion 116, as well as the first sheet portion 118 and the second sheet portion 119, are planar.

[0051] The second heat conductive member 101 has a first piece 125 and a second piece 126. The first piece 125 is parallel to the imaging surface 17 and back surface 89 of the image sensor 16 and faces the back surface 89 of the image sensor 16. The first piece 125 is connected to the central region 92 of the back surface 89. The second piece 126 is bent 90° from the first piece 125 and extends in the direction normal to the imaging surface 17 and back surface 89 of the image sensor 16. The direction normal to the imaging surface 17 and back surface 89 of the image sensor 16 is the Z-axis direction (the direction of the optical axis OA before misalignment occurs). The second piece 126 has approximately the same size as the space between the first sheet portion 115 of the outer layer portion 110 and the first sheet portion 118 of the inner layer portion 111.

[0052] The second heat conduction member 101 is connected to the first heat conduction member 100 through the second piece 126. More specifically, the second piece 126 is inserted into the space between the first sheet portion 115 of the outer layer portion 110 and the first sheet portion 118 of the inner layer portion 111, and is held in place between the first sheet portion 115 and the first sheet portion 118. Double-sided tape is attached to the portions of the first sheet portion 115 and the first sheet portion 118 that come into contact with the second piece 126. The adhesive of this double-sided tape fixes the first sheet portion 115 and the first sheet portion 118 and the second piece 126, and consequently the first heat conduction member 100 and the second heat conduction member 101 in place.

[0053] The third heat conduction member 102 has a first piece 127 and a second piece 128. The first piece 127, like the first piece 125 of the second heat conduction member 101, is parallel to the imaging surface 17 and back surface 89 of the image sensor 16 and is wing-shaped with elongated X-axis direction. The second piece 128, like the second piece 126 of the second heat conduction member 101, is bent 90° from the first piece 127 and extends in the direction normal to the imaging surface 17 and back surface 89 of the image sensor 16.

[0054] The third heat conduction member 102 is connected to the first heat conduction member 100 through the second piece 128. More specifically, the second piece 128 is inserted into the space between the second sheet portion 116 of the outer layer 110 and the second sheet portion 119 of the inner layer 111, and is held in place between the second sheet portion 116 and the second sheet portion 119. The second piece 128 is provided with a claw 129 that hooks onto the edge of the second sheet portion 119.

[0055] The thickness TH2 of the second heat conduction member 101 is greater than the thickness TH1 of the first heat conduction member 100. The thickness TH1 of the first heat conduction member 100 is, for example, 80 μm, and the thickness of the second heat conduction member 101 is, for example, 1 mm. Although not shown in the figures, the thickness of the third heat conduction member 102 is also greater than the thickness TH1 of the first heat conduction member 100, for example, 1 mm.

[0056] As an example, as shown in Figure 7, the flexible substrate 96, which is pulled out through the access opening 59, is positioned on the opposite side from the first heat conductive member 100, with the second piece 126 of the second heat conductive member 101 in between.

[0057] As an example, as shown in Figure 8, the fourth heat conductive member 135 is attached to the third heat conductive member 102 by adhesive. The fourth heat conductive member 135 is formed from a graphite sheet, similar to the first heat conductive member 100. The thickness TH4 of the fourth heat conductive member 135 is greater than the thickness TH1 of the first heat conductive member 100 (see Figure 6). The thickness TH4 of the fourth heat conductive member 135 is, for example, 500 μm.

[0058] A connecting member 136 is further attached to the fourth heat conductive member 135 by adhesive. The connecting member 136, like the second heat conductive member 101 and the third heat conductive member 102, is a metal plate, such as a copper plate. The connecting member 136 is connected to the top plate 137 of the camera body 10. The top plate 137 of the camera body 10 is, for example, a magnesium plate or an aluminum plate.

[0059] As an example, as shown in Figure 9, the outer layer 110 of the first heat conductive member 100 is hexagonal as described above, and therefore has six corners 140, 141, 142, 143, 144, and 145. The inner layer 111 is also hexagonal, and therefore has six corners 146, 147, 148, 149, 150, and 151. Corners 140-145 and 146-151 function as bends that allow deformation to follow the movement of the image sensor 16 due to the vibration damping function. Corners 140-145 protrude outwards. Similarly, corners 146-151 also protrude outwards. In other words, the first heat conductive member 100 has a pantograph-like shape. Note that in Figure 9, the first heat conductive member 100 has been simplified by omitting the illustration of the mounting part 113, etc. The same applies to Figures 11 and 12, etc.

[0060] As an example, as shown in Figure 10, the first heat conductive member 100 is formed by folding the dashed line portion of a single sheet-like material 160. Specifically, first, the connecting portion 112 is folded to bring the portion that will become the outer layer 110 and the portion that will become the inner layer 111 facing each other. Then, the portions that will become the corners 146 to 151 are folded to form the inner layer 111, and then the portions that will become the corners 140 to 145 are folded to form the outer layer 110. Finally, the portion that will become the mounting portion 113 is folded to complete the first heat conductive member 100.

[0061] The first heat conductive member 100 has a reinforcing layer 161. The reinforcing layer 161 is a resin film, for example, a PET film with a thickness of 40 μm. The reinforcing layer 161 is provided on two sides that make up the connecting portion 117 and the connecting portion 120, but not on the corners 144, 145, 150, and 151 that function as bending portions. Naturally, the two sides that make up the connecting portion 117 and the connecting portion 120 are thicker than the corners 144, 145, 150, and 151 that function as bending portions by the amount of the reinforcing layer 161.

[0062] As an example, as shown in Figures 11 and 12, the first heat conductive member 100 deforms to follow the movement of the image sensor 16 due to the vibration damping function. Figure 11 shows how the first heat conductive member 100 deforms by expanding and contracting in the vertical direction in accordance with the movement of the image sensor 16 along the Y-axis direction due to the vibration damping function. Figure 12 shows how the first heat conductive member 100 deforms by tilting in the left-right direction in accordance with the movement of the image sensor 16 along the X-axis direction due to the vibration damping function.

[0063] Next, the operation of the above configuration will be explained. In the digital camera 2, when shooting that places a relatively large load on the image sensor 16, such as shooting video at 120 frames per second (4K / 120p) with a resolution equivalent to 4K, the image sensor 16 generates a considerable amount of heat during operation.

[0064] In the image sensor unit 15 of this example, the heat generated by the image sensor 16 during operation follows a conduction path as shown in Figure 13. Specifically, the heat generated by the image sensor 16 during operation is first conducted from the back surface 89 of the image sensor 16 to the second heat conduction member 101 connected to the central region 92 of the back surface 89. Subsequently, the heat is conducted from the second heat conduction member 101 to the first heat conduction member 100, which is connected through the second piece 126 of the second heat conduction member 101.

[0065] The heat generated by the drive is conducted to the third heat conduction member 102, which is connected through the second piece 128. Furthermore, the drive heat is conducted from the third heat conduction member 102 to the fourth heat conduction member 135, and from the fourth heat conduction member 135 to the connecting member 136. Then, the heat is conducted through the connecting member 136 to the top plate 137 of the camera body 10, and the heat is dissipated to the outside through the top plate 137.

[0066] The image sensor unit 15 has a movable member 31 that can move relative to the fixed member 30 and the yoke 32. The movable member 31 holds the image sensor 16. Therefore, the image sensor 16 moves along with the movement of the movable member 31. If a misalignment of subject light incident on the imaging surface 17 occurs due to user hand tremors, etc., the movable member 31, and consequently the image sensor 16, are moved by an amount that cancels out the misalignment in the direction controlled by the CPU 18. Following the movement of the image sensor 16 due to this vibration damping function, the first heat conductive member 100 is deformed as shown in Figures 11 and 12.

[0067] As described above, the image sensor unit 15 comprises an image sensor 16 having an imaging surface 17 for imaging a subject and a back surface 89 facing the imaging surface 17, a circuit board 90 attached to the back surface 89, and a first heat conductive member 100 and a second heat conductive member 101 to which the driving heat of the image sensor 16 is conducted. The circuit board 90 has an opening 91 that exposes the central region 92 of the back surface 89 of the image sensor 16. The first heat conductive member 100 is connected to the second heat conductive member 101 and has higher elasticity than the second heat conductive member 101. The second heat conductive member 101 is connected to the back surface 89 via the opening 91. Since the second heat conductive member 101, which is relatively rigid and resistant to deformation, is directly connected to the image sensor 16, it is possible to make it more difficult for the heat conductive member to peel off the image sensor 16 than when the first heat conductive member 100, which is relatively elastic and easily deformable, is directly connected to the image sensor 16.

[0068] The image sensor unit 15 is equipped with a vibration isolation function that moves the image sensor 16 in the planar direction. As shown in Figures 11 and 12, the first heat conductive member 100 deforms to follow the movement of the image sensor 16 due to the vibration isolation function. Therefore, the effect of the heat conductive member being less likely to peel off, achieved by directly connecting the second heat conductive member 101, which has relatively high rigidity and is less prone to deformation, to the image sensor 16, can be more effectively demonstrated.

[0069] Furthermore, if the first heat conductive member 100 is directly connected to the image sensor 16, the thickness TH1 of the first heat conductive member 100 needs to be increased to improve conductivity. A thicker thickness TH1 increases the repulsive force of the first heat conductive member 100, making it more difficult for it to deform in accordance with the movement of the image sensor 16 due to the vibration damping function. However, in this example, it is not necessary to make the thickness TH1 of the first heat conductive member 100 that thick. Therefore, the first heat conductive member 100 can deform in accordance with the movement of the image sensor 16 due to the vibration damping function with less resistance than when it is directly connected to the image sensor 16.

[0070] As shown in Figure 5, the second heat conductive member 101 has a first piece 125 connected to the central region 92 and facing the back surface 89, and a second piece 126 bent from the first piece 125. The first heat conductive member 100 is connected to the second piece 126. Therefore, the first heat conductive member 100 deforms to follow the movement of the second piece 126, rather than the movement of the image sensor 16 itself. If the first heat conductive member 100 were to deform to follow the movement of the image sensor 16 itself, it would need to have a complex structure, but since it deforms to follow the movement of the second piece 126, the first heat conductive member 100 can have a simple structure.

[0071] Furthermore, the second piece 126 extends in the direction normal to the imaging surface 17 and the back surface 89. This allows the first heat conductive member 100 to have a simpler configuration. The angle at which the second piece 126 is bent from the first piece 125 may be less than 90° or greater than 90°.

[0072] The image sensor unit 15 includes a flexible substrate 96 attached to the circuit board 90. As shown in Figure 7, the flexible substrate 96 is positioned on the opposite side of the first heat conductive member 100, with the second piece 126 of the second heat conductive member 101 in between. Therefore, there is no risk of the flexible substrate 96 and the first heat conductive member 100 coming into contact and disrupting the signal to and / or from the image sensor 16.

[0073] As shown in Figure 6, the thickness TH2 of the second heat conduction member 101 is greater than the thickness TH1 of the first heat conduction member 100. Therefore, the heat conduction efficiency of the second heat conduction member 101 can be increased.

[0074] The thermal conductivity of the graphite sheet forming the first heat conduction member 100 is 1600 W / m·K. On the other hand, the thermal conductivity of the copper forming the second heat conduction member 101 is 390 W / m·K, which is lower than that of the graphite sheet. However, as described above, if the thickness TH2 of the second heat conduction member 101 is made thicker than the thickness TH1 of the first heat conduction member 100, the lower thermal conductivity can be compensated for. This makes it possible to make the thermal conductivity of the second heat conduction member 101 higher than that of the first heat conduction member 100. If the thermal conductivity of the second heat conduction member 101 is higher than that of the first heat conduction member 100, the driving heat can be smoothly conducted from the second heat conduction member 101 to the first heat conduction member 100.

[0075] In addition, the thermal conductivity of the second heat conduction member 101 is made higher than that of the first heat conduction member 100 by increasing the thickness TH2 of the second heat conduction member 101, but this is not limited to this. Instead of increasing the thickness TH2 of the second heat conduction member 101, or in addition to this, the thermal conductivity of the second heat conduction member 101 may be made higher than that of the first heat conduction member 100 by forming the second heat conduction member 101 from a material with a higher thermal conductivity than that of the first heat conduction member 100.

[0076] As shown in Figure 4, the opening 91 of the circuit board 90 exposes the central region 92 of the back surface 89 of the image sensor 16. Of the back surface 89 of the image sensor 16, the central region 92 is where the operating heat of the image sensor 16 is highest. Therefore, the operating heat of the image sensor 16 can be dissipated more effectively.

[0077] Furthermore, the central region 92 is the area where the identification information 98 of the image sensor 16 is written. Therefore, the aperture 91 formed to allow viewing of the identification information 98 can be effectively used for dissipating the heat generated by the operation of the image sensor 16.

[0078] As shown in Figure 2, the first heat conduction member 100 is formed from a graphite sheet, and the second heat conduction member 101 and the third heat conduction member 102 are formed from metal. Therefore, the first heat conduction member 100 can be given appropriate elasticity, and the second heat conduction member 101 and the third heat conduction member 102 can be given appropriate rigidity.

[0079] As shown in Figure 9, the first heat conduction member 100 has an outer layer 110 and an inner layer 111 connected to the outer layer 110 and located in the space surrounded by the outer layer 110. Both the outer layer 110 and the inner layer 111 have bends (angles 140-145 and 146-151) that allow deformation to follow the movement of the image sensor 16 due to the vibration damping function. Therefore, compared to the case with only the outer layer 110, it is possible to dissipate the heat generated by the operation of the image sensor 16 more efficiently. As a result, shooting that places a relatively large load on the image sensor 16, such as 4K / 120p video recording, can be performed for a longer period than before. In addition, by making the first heat conduction member 100 a double structure, the installation space for the heat conduction member can be saved.

[0080] As shown in Figure 10, the first heat conductive member 100 is formed by folding a single sheet of material 160. Therefore, the first heat conductive member 100 can be formed more easily compared to the case where the outer layer 110 and the inner layer 111 are formed from separate materials and then joined together.

[0081] As shown in Figure 5, the first heat conductive member 100 includes a first sheet portion 115 and a first sheet portion 118, a second sheet portion 116 and a second sheet portion 119 facing the first sheet portion 115 and the first sheet portion 118, and the first sheet portion 115 and the second 2 Seat section 116 A connecting part 117 that connects them, and 1 Seat section 118 It is composed of the first heat conductive member 100 and a connecting portion 120 that connects the second sheet portion 119. Therefore, the first heat conductive member 100 can deform smoothly in accordance with the movement of the image sensor 16 due to the vibration damping function.

[0082] Furthermore, as shown in Figure 9, the outer layer 110 and the inner layer 111 have angles 140-145 and 146-151 that protrude outward, functioning as bending points. This allows for a larger space to be surrounded by the outer layer 110, making it easier to form the inner layer 111.

[0083] As shown in Figure 10, the first heat conductive member 100 has reinforcing layers 161 on two sides that constitute the connecting portion 117 and connecting portion 120, except for the corners 144, 145, 150, and 151 that function as bending portions. The two sides that constitute the connecting portion 117 and connecting portion 120 are thicker than the corners 140-145 and 146-151 that function as bending portions by the amount of the reinforcing layers 161. This prevents unintended deformation of the two sides that constitute the connecting portion 117 and connecting portion 120. Furthermore, since the reinforcing layers 161 are not provided on the corners 140-145 and 146-151 that function as bending portions, the first heat conductive member 100 can deform without significant resistance in accordance with the movement of the image sensor 16 due to the vibration damping function. Furthermore, reinforcing layers 161 may be provided on the first sheet portion 115 and the first sheet portion 118, as well as on the second sheet portion 116 and the second sheet portion 119.

[0084] The first heat conduction member 100 is connected to the image sensor 16 via the second heat conduction member 101 and to the camera body 10 via the third heat conduction member 102. As shown in Figure 5, the second heat conduction member 101 and the third heat conduction member 102 are sandwiched between the outer layer 110 and the inner layer 111. This improves the efficiency of heat transfer from the second heat conduction member 101 to the first heat conduction member 100, and the efficiency of heat transfer from the first heat conduction member 100 to the third heat conduction member 102. It also increases the holding force of the second heat conduction member 101 and the third heat conduction member 102 by the first heat conduction member 100. The third heat conduction member 102 may also constitute part of the camera body 10.

[0085] As shown in Figure 8, a fourth heat conductive member 135, made of a graphite sheet, is connected between the third heat conductive member 102 and the top plate 137 of the camera body 10. The thickness TH4 of the fourth heat conductive member 135 is greater than the thickness TH1 of the first heat conductive member 100. Unlike the first heat conductive member 100, the fourth heat conductive member 135 does not deform to follow the movement of the image sensor 16 due to the vibration damping function. Therefore, unlike the first heat conductive member 100, it is not necessary to make the thickness TH1 relatively thin in order to achieve smooth deformation at the expense of some heat conduction efficiency, and sufficient conduction efficiency can be ensured by making the thickness TH4 thicker.

[0086] The inner layer 111 is not limited to one. For example, as shown in Figure 14, the first heat conductive member 170 may have a triple structure with one outer layer 171 and two inner layers 172 and 173 arranged in the space surrounded by the outer layer 171. Also, the shape of the first heat conductive member is not limited to a hexagon. For example, as shown in Figure 15, the outer layer 181 and inner layer 182 may be octagonal. Furthermore, as shown in Figure 16, the first heat conductive member 190 may have corners 195 and 196 of the connection part 193 of the outer layer 191, and corners 197 and 198 of the connection part 194 of the inner layer 192 recessed inward. The first heat conductive member 190 has a shape that is like a "Σ" combined with its mirror image.

[0087] [Second Embodiment] As an example, as shown in Figures 17 and 18, the image sensor unit 200 of the second embodiment has a fifth heat conductive member 201. The fifth heat conductive member 201 is located opposite the side surface 202 of the image sensor 16 that connects the imaging surface 17 and the back surface 89, and is positioned within a space formed by a flexible substrate 97 that is connected to the image sensor 16 and wraps around to the front of the movable member 31. The driving heat of the image sensor 16 is conducted to the fifth heat conductive member 201 from the side surface 202. In addition, a sixth heat conductive member 203, which is made of a metal plate, is connected to the fifth heat conductive member 201. The sixth heat conductive member 203 is connected to the side plate of the camera body 10, etc. The driving heat from the fifth heat conductive member 201 is conducted to the camera body 10 through the sixth heat conductive member 203.

[0088] The fifth heat conductive member 201 is formed from a graphite sheet, similar to the first heat conductive member 100, and has high elasticity. The fifth heat conductive member 201 deforms to follow the movement of the image sensor 16 due to the vibration damping function, similar to the first heat conductive member 100. However, unlike the first heat conductive member 100, the fifth heat conductive member 201 has a structure without an inner layer.

[0089] As an example, as shown in Figure 19, the fifth heat conductive member 201 is a hexagon with six corners 205, 206, 207, 208, 209, and 210, similar to the first heat conductive member 100. Corners 205 to 210 function as bends that allow deformation to follow the movement of the image sensor 16 due to the vibration damping function. Also, similar to the first heat conductive member 100, the fifth heat conductive member 201 is composed of a first sheet portion 211, a second sheet portion 212 having the same length as the first sheet portion 211 and facing the first sheet portion 211, and a pair of V-shaped connecting portions 213 that connect the first sheet portion 211 and the second sheet portion 212. The angles θ5 of angles 209 and 210, which function as bends in the connection portion 213, are acuter than the angles θ1 (see Figure 9) of angles 144 and 145, and angles 150 and 151, which function as bends in the connection portions 117 and 120 of the first heat conductive member 100.

[0090] As described above, the image sensor unit 200 of the second embodiment includes a fifth heat conductive member 201. The fifth heat conductive member 201 is positioned opposite the side surface 202 of the image sensor 16 that connects the imaging surface 17 and the back surface 89. Drive heat is conducted to the fifth heat conductive member 201 from the side surface 202. The fifth heat conductive member 201 deforms so as to follow the movement of the image sensor 16 due to the vibration damping function. The fifth heat conductive member 201 has a bend that enables deformation to follow the movement of the image sensor 16 due to the vibration damping function. Therefore, drive heat can be dissipated more effectively without hindering the movement of the image sensor 16 due to the vibration damping function.

[0091] The fifth heat conductive member 201 is composed of a first sheet portion 211, a second sheet portion 212 facing the first sheet portion 211, and a connecting portion 213 connecting the first sheet portion 211 and the second sheet portion 212. Therefore, the fifth heat conductive member 201 can deform smoothly to follow the movement of the image sensor 16 due to the vibration damping function, while ensuring a connection portion with the sixth heat conductive member 203, etc.

[0092] Furthermore, the angle θ5 of the bent portion of the connection portion 213 of the fifth heat conductive member is acuter than the angle θ1 of the bent portions of the connection portions 117 and 120 of the first heat conductive member 100. As a result, the repulsive force of the fifth heat conductive member 201 can be reduced, and the fifth heat conductive member 201 can deform without significant resistance, following the movement of the image sensor 16 due to the vibration damping function. In addition, as the distance between the first sheet portion 211 and the second sheet portion 212 decreases, the fifth heat conductive member 201 becomes more compact than the first heat conductive member 100. As a result, it can be placed in relatively narrow spaces, such as in a position facing the side surface 202 of the image sensor 16 and within the space formed by the flexible substrate 97.

[0093] The fifth heat conductive member 201 is formed from a graphite sheet. This allows the fifth heat conductive member 201 to have appropriate elasticity.

[0094] Similar to the first heat conductive member 100, the fifth heat conductive member 201 may have a multi-layer structure. Also, as shown in the example in Figure 15, the fifth heat conductive member 201 may be octagonal. Furthermore, as shown in the example in Figure 16, the fifth heat conductive member 201 may have a structure in which the corners of the connection part are recessed inward.

[0095] While a CPU 18 has been given as an example of a processor that controls the operation of the image sensor unit 15, it is not limited to this. Instead of the CPU 18, or in addition to it, a programmable logic device (PLD), such as an FPGA (Field Programmable Gate Array), which is a processor whose circuit configuration can be changed after manufacturing, and / or a dedicated electrical circuit with a circuit configuration specifically designed to perform a particular process, such as an ASIC (Application Specific Integrated Circuit), may be used.

[0096] In the first embodiment described above, plates 45-47 are provided on the fixed member 30 and recesses 70-72 are provided on the movable member 31, but the invention is not limited to this. Plates 45-47 may be provided on the movable member 31 and recesses 70-72 on the fixed member 30. Also, in the first embodiment described above, magnets 40-42 are provided on the fixed member 30 and coils 60-62 are provided on the movable member 31, but the invention is not limited to this. Magnets 40-42 may be provided on the movable member 31 and coils 60-62 on the fixed member 30.

[0097] The number of sets of balls 35-37, plates 45-47, and recesses 70-72 is not limited to three sets, but may be four or more sets.

[0098] The image sensor unit of this disclosure can also be applied to imaging devices other than the example digital camera 2, such as smartphones, tablet devices, or surveillance cameras.

[0099] The technology disclosed herein can be appropriately combined with the various embodiments and / or variations described above. Furthermore, it is understood that various configurations can be adopted without departing from the spirit of the invention, and are not limited to the embodiments described above.

[0100] The descriptions and illustrations presented above are detailed explanations of the technical aspects of this disclosure and are merely examples of the technical aspects. For example, the above descriptions of the structure, function, operation, and effect are examples of the structure, function, operation, and effect of the technical aspects of this disclosure. Therefore, it goes without saying that you may delete unnecessary parts, add new elements, or replace elements in the descriptions and illustrations presented above, as long as you do not deviate from the essence of the technical aspects of this disclosure. Furthermore, in order to avoid confusion and facilitate understanding of the technical aspects of this disclosure, explanations of common technical knowledge and the like that do not require special explanation to enable the implementation of the technical aspects of this disclosure have been omitted from the descriptions and illustrations presented above.

[0101] In this specification, "A and / or B" is synonymous with "at least one of A and B." That is, "A and / or B" means that it may be A alone, or B alone, or a combination of A and B. Furthermore, in this specification, the same concept as "A and / or B" applies when expressing three or more things linked by "and / or."

[0102] All documents, patent applications, and technical standards described herein are incorporated by reference to the same extent as if each individual document, patent application, and technical standard were specifically and individually noted to be incorporated by reference.

Claims

1. This is an image sensor unit built into the housing of the imaging device. An image sensor having an imaging surface for capturing an image of a subject and a back surface facing the imaging surface, A circuit board attached to the back surface and having an opening formed therein that exposes a part of the back surface, A first heat conduction member and a second heat conduction member through which the driving heat of the image sensor is conducted, A vibration damping function that moves the image sensor in the plane direction of the imaging surface, A third heat conductive member formed of metal, Equipped with, The first heat conductive member is connected to the second heat conductive member and has higher elasticity than the second heat conductive member. The second heat conductive member is connected to the back surface through the opening, The first heat conductive member is deformable to follow the movement of the image sensor due to the vibration damping function, and has an outer layer and an inner layer connected to the outer layer and located in the space surrounded by the outer layer. The outer layer and the inner layer have a bend that allows them to deform in accordance with the movement of the image sensor due to the vibration damping function. The second heat conductive member and the third heat conductive member each have a first piece facing the back surface and a second piece bent from the first piece and extending in the direction normal to the imaging surface and the back surface. The second piece of the second heat conductive member is inserted into the space between the outer layer and the inner layer and fixed to the first heat conductive member while being sandwiched between the outer layer and the inner layer. The second piece of the third heat conductive member is inserted into the space between the outer layer and the inner layer on the opposite side from the second piece of the second heat conductive member, and is fixed to the first heat conductive member while being sandwiched between the outer layer and the inner layer. Image sensor unit.

2. The circuit board is equipped with a flexible circuit board, The image sensor unit according to claim 1, wherein the flexible substrate is arranged on the opposite side of the second piece from the first heat conductive member.

3. The image sensor unit according to claim 1 or claim 2, wherein the second heat conductive member has higher thermal conductivity than the first heat conductive member.

4. The image sensor unit according to claim 3, wherein the second heat conductive member is thicker than the first heat conductive member.

5. The image sensor unit according to any one of claims 1 to 3, wherein the opening exposes the central region of the back surface.

6. The image sensor unit according to claim 5, wherein the central region is a region on which identification information of the image sensor is written.

7. The first heat conductive member is formed from a graphite sheet, The image sensor unit according to any one of claims 1 to 6, wherein the second heat conductive member is formed of metal.

8. The casing and The housing is housed within the image sensor unit described in any one of claims 1 to 7, An imaging device equipped with the following features.

9. The imaging device according to claim 8, wherein the housing is connected to the third heat conductive member and the drive heat is conducted from the back surface.

10. The housing and the third heat conductive member are connected by a fourth heat conductive member. The first heat conductive member and the fourth heat conductive member are formed from graphite sheets. The imaging apparatus according to claim 9, wherein the fourth heat conductive member is thicker than the first heat conductive member.

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