Sensor device

Abstract

To provide a sensor device that can reduce thermal influence on a sensor element and improve sensing accuracy.SOLUTION: A sensor device (1) comprises a substrate (2) having a heat generation portion, a casing (5) including an accommodation portion (27) accommodating the substrate, and sensor elements (3, 4) each including a temperature-sensitive resistor and being supported by the substrate. The accommodation portion is divided into a plurality of accommodation spaces (27a, 27b) on a side closer to the sensor element. The accommodation portion is divided into a first accommodation space (27a) and a second accommodation space (27b) via division plates, and the first accommodation space is formed on a side closer to the sensor element than the second accommodation space and widely as compared with the second accommodation space.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] This invention relates to a sensor device capable of measuring, for example, wind speed.

Background Art

[0002] There is known a thermal sensor device that exposes a heated flow detection resistance element to a fluid and detects the flow rate of the fluid based on the heat dissipation action at that time. The sensor device includes a temperature compensation resistance element in addition to the flow detection resistance element, and the flow detection resistance element and the temperature compensation resistance element are incorporated in a bridge circuit. When the flow detection resistance element receives the fluid, the temperature of the flow detection resistance element decreases and the resistance changes, whereby a differential output can be obtained by the bridge circuit. Based on this operation output, the flow rate of the fluid can be detected. For example, in Patent Document 1, each sensor element including a flow detection resistance element and a temperature compensation resistance element is supported separately from the substrate via lead wires.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, each sensor element is supported by a substrate, and the substrate is housed in a housing. A control unit electrically connected to each resistance element is provided on the substrate, and the control unit serves as a heat source. For this reason, there has been a problem that heat from the control unit is transmitted through the housing to the sensor element, resulting in a decrease in detection accuracy.

[0005] Therefore, the present invention has been made in view of the above problems, and an object thereof is to provide a sensor device capable of reducing the thermal influence on the sensor element and improving the detection accuracy. [Means for solving the problem]

[0006] The sensor device of the present invention comprises a substrate having a heating element, a housing having a housing for housing the substrate, and a sensor element supported on the substrate and equipped with a temperature-sensitive resistance element. The housing section is provided with a first housing space and a second housing space, the first housing space being closer to the sensor element than the second housing space, and having a first partition plate between the first housing space and the second housing space, and a second partition plate between the first housing space and the substrate and the sensor element. It is characterized by the following:

[0007] In this invention, before The first storage space is preferably formed to be wider than the second storage space. In the present invention, it is preferable that the substrate is screwed to the housing. [Effects of the Invention]

[0008] In the sensor device of the present invention, by dividing the housing space for the substrate into multiple sections, the thermal influence on the sensor element can be reduced, and the detection accuracy can be improved. [Brief explanation of the drawing]

[0009] [Figure 1] This is a perspective view of the sensor device in this embodiment. [Figure 2] Figure 1 is an exploded perspective view of the sensor device shown. [Figure 3] This is a cross-sectional view of the sensor element of this embodiment. [Figure 4] This is a circuit diagram of the sensor device according to this embodiment. [Figure 5] This is a front view of the substrate to which the sensor element of this embodiment is connected. [Figure 6] This is a front view showing the interior of the first housing portion of this embodiment. [Figure 7] This is a partially enlarged front view showing the circuit board of this embodiment assembled into the first housing. [Figure 8] (a) is a thermographic image showing the heat distribution of the sensor device in Experimental Example 1, and (b) is a schematic diagram of (a). [Figure 9](a) is a thermographic photograph showing the heat distribution of the sensor device of Experimental Example 2, and (b) is a schematic diagram of (a). [Figure 10] (a) is a thermographic photograph showing the heat distribution of the sensor device of Experimental Example 3, and (b) is a schematic diagram of (a).

Mode for Carrying Out the Invention

[0010] Hereinafter, an embodiment of the present invention (hereinafter abbreviated as "embodiment") will be described in detail. Note that the present invention is not limited to the following embodiments, and can be variously modified and implemented within the scope of the gist thereof.

[0011] <Outline of the Sensor Device 1 of the Present Embodiment> FIG. 1 is a perspective view of the sensor device in the present embodiment. FIG. 2 is an exploded perspective view of the sensor device in FIG. 1. FIG. 3 is a cross-sectional view of the sensor element of the present embodiment. FIG. 4 is a circuit diagram of the sensor device of the present embodiment. FIG. 5 is a front view of the substrate to which the sensor element of the present embodiment is connected. FIG. 6 is a front view showing the inside of the first housing portion of the present embodiment. FIG. 7 is a partially enlarged front view showing the state in which the substrate of the present embodiment is incorporated into the first housing portion.

[0012] The X1-X2 direction and the Y1-Y2 direction shown in FIGS. 1 and 2 indicate two directions orthogonal to each other in the plane, and the Z1-Z2 direction shown in FIG. 1 indicates the height direction orthogonal to the X1-X2 direction and the Y1-Y2 direction.

[0013] The sensor device 1 of the present embodiment shown in FIGS. 1 and 2 includes a substrate 2 having a heat generating portion, a housing 5 that houses the substrate 2, and sensor elements 3 and 4 provided with a thermistor.

[0014] A protective cover 6 for protecting the sensor elements 3 and 4 from the outside is provided on the housing 5. However, in the present embodiment, the protective cover 6 is not an essential component. However, it is preferable to provide the protective cover 6 to appropriately protect the sensor elements 3 and 4 from the outside. In this embodiment, the protective cover 6 is integrally formed with the housing 5, but the protective cover 6 may be provided separately from the housing 5. As shown in FIGS. 1 and 2, the sensor elements 3 and 4 are arranged inside the protective cover 6 having a mesh structure.

[0015] As shown in FIGS. 1 to 3, the sensor elements 3 and 4 are formed in a shape that extends long in the height direction (Z1 - Z2 direction). Thus, the sensor elements 3 and 4 are rod-shaped, and specifically, they may be cylindrical or polygonal prism-shaped. Here, the sensor elements 3 and 4 in this embodiment are cylindrical and extend long in the height direction.

[0016] As shown in FIG. 2, lead wires 7a, 7b, 8a, and 8b are connected to both ends of each of the sensor elements 3 and 4, and each lead wire is connected to the substrate 2. The sensor element 3 is a first sensor element provided with a flow rate detection resistor 10, and the sensor element 4 is a second sensor element provided with a temperature compensation resistor 38.

[0017] The internal structure of the first sensor element 3 will be described using FIG. 3. As shown in FIG. 3, the first sensor element 3 includes a flow rate detection resistor 10 as a thermosensitive resistor, electrode caps 11 arranged on both sides of the flow rate detection resistor 10, and an insulating film 12 covering the flow rate detection resistor 10 and the electrode caps 11.

[0018] The flow rate detection resistor 10 is formed, for example, by forming a resistive film on the surface of a cylindrical substrate such as ceramic. Therefore, the flow rate detection resistor (thermosensitive resistor) 10 is formed over the entire circumferential direction. Here, the "entire circumferential direction" refers to the direction around the axis centered on the height direction (Z1 - Z2 direction) in which the first sensor element 3 extends. Although not shown, trimming is performed on the surface of the resistive film of the flow rate detection resistor 10 to adjust the resistance.

[0019] The outer surface of the first sensor element 3 includes an element surface 3a that functions as a flow rate detection surface, and an upper surface 3b and a lower surface 3c located above and below the element surface 3a.

[0020] As shown in Figure 3, the first lead wire 7a extends in the Z2 direction from the electrode cap 11 located on the lower surface 3c. The first lead wire 7b extends in the Z1 direction from the electrode cap 11 located on the upper surface 3b, then bends and extends in the Z2 direction. Therefore, as shown in Figure 3, the pair of lead wires 7a and 7b face each other with a predetermined distance between them in the X1-X2 direction, and both extend in the Z2 direction. The ends of the pair of lead wires 7a and 7b are connected to the substrate 2.

[0021] The second sensor element 4 has a similar structure to that shown in Figure 3, but instead of the flow rate sensing resistor 10, it incorporates a temperature compensation resistor 38 that acts as a temperature-sensitive resistor.

[0022] As shown in Figure 4, the flow detection resistor 10, together with the temperature compensation resistor 38, constitutes a bridge circuit. As shown in Figure 4, the flow detection resistor 10, the temperature compensation resistor 38, and resistors 16 and 17 constitute a bridge circuit 18. As shown in Figure 4, the flow detection resistor 10 and resistor 16 constitute a first series circuit 19, and the temperature compensation resistor 38 and resistor 17 constitute a second series circuit 20. The first series circuit 19 and the second series circuit 20 are then connected in parallel to form a bridge circuit 18.

[0023] As shown in Figure 4, the output section 21 of the first series circuit 19 and the output section 22 of the second series circuit 20 are each connected to a differential amplifier (amplifier) ​​23. A feedback circuit 24, including the differential amplifier 23, is connected to the bridge circuit 18. The feedback circuit 24 includes transistors (not shown), etc.

[0024] Resistors 16 and 17 have a smaller temperature coefficient of resistance (TCR) than the flow detection resistor 10 and the temperature compensation resistor 38. The flow detection resistor 10 has a predetermined resistance value Rs1 when heated to a predetermined value higher than a predetermined ambient temperature, for example, and the temperature compensation resistor 38 is controlled to have a predetermined resistance value Rs2 at the aforementioned ambient temperature. Note that the resistance value Rs1 is smaller than the resistance value Rs2. Resistor 16, which constitutes the first series circuit 19 with the flow detection resistor 10, is a fixed resistor having a resistance value R1 similar to the resistance value Rs1 of the flow detection resistor 10. Resistor 17, which constitutes the second series circuit 20 with the temperature compensation resistor 38, is a fixed resistor having a resistance value R2 similar to the resistance value Rs2 of the temperature compensation resistor 38.

[0025] The flow detection resistor 10 is adjusted to a temperature higher than the ambient temperature. When the first sensor element 3 receives wind, the temperature of the heat-generating resistor, the flow detection resistor 10, decreases. As a result, the potential of the output section 21 of the first series circuit 19 to which the flow detection resistor 10 is connected fluctuates. This allows the differential amplifier 23 to produce a differential output. The feedback circuit 24 then applies a drive voltage to the flow detection resistor 10 based on the differential output. Based on the change in voltage required to heat the flow detection resistor 10, the microcontroller located on the circuit board 2 can calculate and output the wind speed. The microcontroller is electrically connected to each of the sensor elements 3 and 4 via lead wires 7a, 7b, 8a, and 8b.

[0026] Furthermore, the temperature compensation resistor 38 detects the temperature of the fluid itself and compensates for the effects of temperature changes in the fluid. In this way, by providing the temperature compensation resistor 38, the influence of temperature changes in the fluid on flow rate detection can be reduced, and flow rate detection can be performed with high accuracy. As described above, the temperature compensation resistor 38 has a sufficiently higher resistance than the flow rate detection resistor 10, and its temperature is set to be close to the ambient temperature. Therefore, even if the temperature compensation resistor 38 is exposed to wind, the potential of the output section 22 of the second series circuit 20 to which the temperature compensation resistor 38 is connected hardly changes. Consequently, using the potential of the output section 22 as the reference potential, a differential output based on the resistance change of the flow rate detection resistor 10 can be obtained with high accuracy. Note that the circuit configuration shown in Figure 4 is just one example and is not limited thereto.

[0027] <Board 2> The substrate 2 supporting the sensor elements 3 and 4 will be described using Figures 2 and 5. The substrate 2 is an insulating substrate and is not particularly limited, but it is preferably a general printed circuit board made of glass cloth impregnated with epoxy resin, for example, an FR4 substrate can be presented.

[0028] As shown in Figures 2 and 5, the substrate 2 is formed in the shape of a plate extending in the Z1-Z2 direction. As shown in Figure 5, the substrate 2 has a sensor section 2a on the Z1 side that supports the sensor elements 3 and 4, a drive substrate 2b equipped with a control unit such as a microcontroller, and a connecting section 2c that connects the sensor section 2a and the drive substrate 2b.

[0029] The control unit is electrically connected to the sensor elements 3 and 4 and configures the electrical circuit described in Figure 4 based on the detection information from the sensor elements 3 and 4. The control unit includes active and passive elements such as various resistors, as well as connectors 36 and 37.

[0030] As shown in Figures 2 and 5, screw holes 2d are formed in the drive board 2b. It is preferable that the screw holes 2d be formed above the heat-generating section (towards Z1).

[0031] Furthermore, in this embodiment, a light-emitting unit 9, such as an LED, is provided near the connecting portion 2c of the drive board 2b. For example, the light-emitting unit 9 can be turned on when wind of a predetermined strength or higher is detected, or it can be made to blink according to the wind strength, allowing wind information to be visually recognized by the operation control of the control unit. Note that whether or not to place the light-emitting unit 9 is optional.

[0032] As shown in Figure 5, the sensor section 2a has multiple fixing holes 14 formed in a horizontal row (X1-X2 direction), and the lead wires 7a, 7b, 8a, and 8b connected to the sensor elements 3 and 4 are inserted into each fixing hole 14 and fixedly supported. As a result, the sensor elements 3 and 4 are positioned spaced apart above the substrate 2 (in the Z1 direction). Furthermore, the sensor portion 2a has an elongated hole 15 that extends laterally towards the connecting portion 2c.

[0033] The width dimension of the sensor unit 2a (length in the X1-X2 direction) is greater than the width dimension of the drive board 2b.

[0034] Furthermore, as shown in Figures 2 and 5, the width dimension (length in the X1-X2 direction) of the connecting portion 2c is smaller than the width dimension of the sensor portion 2a and the drive board 2b, and it has a constricted shape at the position of the connecting portion 2c. In addition, multiple tiny holes 25 are formed in the connecting portion 2c.

[0035] <Enclosure 5> The housing 5 is divided into a front housing 5a that houses the circuit board 2 on the sensor element side 3 and 4, and a rear housing 5b located at the rear end of the front housing 5a that houses the drive circuit board 2b of the circuit board 2.

[0036] (Front end housing 5a) As shown in Figure 2, the front end housing 5a is divided into a first housing section 31 and a second housing section 32. Since the first housing section 31 and the second housing section 32 are substantially the same shape, the structure of the first housing section 31 will be described. As shown in Figures 2 and 6, a concave housing portion 27 is formed on the inner surface of the first housing portion 31.

[0037] The housing section 27 is divided into a first housing space 27a and a second housing space 27b in the height direction (Z1-Z2 direction) by a plurality of partition plates 35, 40, and 43. The first housing space 27a is the space for housing the sensor section 2a when the first housing section 31 and the second housing section 32 are combined, and the second housing space 27b is the space for housing the drive board 2b. The partition plate 40 located on the ceiling side of the first housing space 27a is provided with a plurality of small holes 29, and these small holes 29 lead to the housing section 27.

[0038] As shown in Figure 6, the width dimension (length in the X1-X2 direction) T1 of the first housing space 27a is larger than the width dimension T2 of the second housing space 27b. This allows the sensor unit 2a and the drive board 2b to be appropriately housed in their respective housing spaces 27a and 27b when the first housing 31 and the second housing 32 are combined. The width dimension T1 of the first housing space 27a is wider than the width dimension of the sensor unit 2a, and the width dimension T2 of the second housing space 27b is wider than the width dimension of the drive board 2b.

[0039] Furthermore, the depth of the first storage space 27a (length in the Y2 direction) is greater than the depth of the second storage space 27b. Therefore, as shown in Figure 1, the outer surface of the portion of the front end housing 5a, which is a combination of the first housing portion 31 and the second housing portion 32, where the first storage space 27a is provided, protrudes outward in the planar direction (the plane formed by the X1-X2 direction and the Y1-Y2 direction) more than the outer surface of the portion where the second storage space 27b is provided.

[0040] Furthermore, a notch 35a is formed in the center of the partition plate 35. This notch 35a is the point through which the connecting portion 2c of the substrate 2 passes, and the width dimension T3 of the notch 35a is formed to be smaller than the width dimensions T1 and T2 of the first and second storage spaces, respectively. The width dimension T3 of the notch 35a is approximately the same as the width dimension of the connecting portion 2c. Also, the depth dimension of the notch 35a is approximately the same as the thickness of the connecting portion 2c. The first storage space 27a, the second storage space 27b, and the notch 35a are in communication with each other. Furthermore, a partition plate 43 is also provided on the bottom side of the second storage space 27b, and a notch 43a is formed in the center of the partition plate 43. The width dimension T4 of this notch 43a is approximately the same as that of the drive board 2b.

[0041] (Rear end housing 5b) As shown in Figure 2, the rear end housing 5b is constructed by combining a third housing portion 33 and a fourth housing portion 34. The third housing portion 33 is provided with a screw hole 33a in the same position as the screw hole 2d formed in the drive board 2b. The third housing portion 33 is provided with a window 33b that can be exposed to the outside through the connector 36.

[0042] Although not shown in the diagram, the inner surface of the third housing portion 33 is provided with a housing space capable of accommodating the drive board 2b.

[0043] The fourth housing section 34 is provided with an internal storage space 34a capable of accommodating the drive board 2b. Partition plates 44 and 45 are provided on the ceiling side of the storage space 34a. When the front housing section 5a and the rear housing section 5b are combined, the partition plates 43 and 44 come into contact with each other, and the second storage space 27b and the storage space 34a are separated by the partition plates 43, 44, and 45. Note that partition plate 45 is not provided in the third housing section 33. Furthermore, a cylindrical screw receiver 34b is formed in the housing space 34a at the same position as the screw hole 2d formed in the drive board 2b. Note that the cylindrical screw receiver 34b is not provided in the third housing portion 33. Although not shown, the fourth housing portion 34 is provided with a window that can be exposed to the outside through the connector 37.

[0044] <Assembly of enclosure 5 and circuit board 2> The first housing portion 31 and the fourth housing portion 34, and the second housing portion 32 and the third housing portion 33 shown in Figure 2 are combined, the substrate 2 is sandwiched in the storage space between them, and the first housing portion 31 and the second housing portion 32, and the third housing portion 33 and the fourth housing portion 34 are fitted together with their corresponding protrusions and recesses.

[0045] Furthermore, the screw 39 is inserted into the screw hole 33a, and the circuit board 2 and the housing 5 are fixed together with the screw 39. The screw 39 may be made of resin, but it is preferable that it be made of metal.

[0046] Figure 7 is a front view showing the substrate 2 housed in the first housing portion 31 that constitutes the front end housing 5a. As shown in Figure 7, the sensor portion 2a is housed in the first housing space 27a of the first housing portion 31, and the drive substrate 2b is housed in the second housing space 27b of the first housing portion 31. At this time, lead wires 7a, 7b, 8a, and 8b that fix the sensor elements 3 and 4 can be passed through a plurality of small holes 29 provided in the partition plate 40. As a result, the sensor elements 3 and 4 are supported in a state where they protrude upward from the partition plate 40 of the housing 5. In addition, the connecting portion 2c of the substrate 2 is passed through the position of the notch 35a formed in the partition plate 35. With the above, the substrate 2 can be properly housed in the housing portion 27 of the first housing portion 31. Although not shown in the diagram, the second housing portion 32 also has a housing portion 27 similar to that of the first housing portion 31, and the substrate 2 near the sensor elements 3 and 4 can be housed in the housing portion 27 of the front end housing 5a, which is formed by combining the first housing portion 31 and the second housing portion 32.

[0047] <Regarding the effects of this embodiment> The sensor device 1 of this embodiment is characterized in that the inside of the front end housing 5a near the sensor elements 3 and 4 is divided into multiple housing spaces 27a and 27b by multiple partition plates 35, 40, 43, 44, and 45, and the sensor unit 2a and the drive board 2b are arranged in each housing space 27a and 27b.

[0048] As a result, when the control unit, which is the heat source of the drive board 2b, generates heat and that heat is transferred to the sensor elements 3 and 4 by the rising airflow, the partition plates 35, 40, 43, 44, and 45 can separate the heat, thereby reducing the amount of heat transferred to the sensor elements 3 and 4.

[0049] In this embodiment, the substrate 2 and the housing 5 are fastened together with screws. The screws 39 are inserted into the screw receivers 34b of the fourth housing portion 34, passing through screw holes 2d and 33a provided in the third housing portion 33 and the substrate 2.

[0050] While the position of the screw 39 is not limited, positioning the screw 39 above the heat-generating area of ​​the substrate 2 (towards the sensor elements 3 and 4) allows heat to be dissipated to the outside via the screw 39, and more preferably reduces the amount of heat transmitted to the sensor elements 3 and 4. It is preferable that the screw 39 be made of metal to further enhance the heat dissipation effect.

[0051] Furthermore, as shown in Figures 6 and 7, the first housing space 27a of the housing section 27, which is closer to the sensor elements 3 and 4, is wider than the second housing space 27b, which is further away from the sensor elements 3 and 4. This further reduces the thermal impact on the sensor elements 3 and 4 caused by heat diffusing into the air in front of the partition plate 35 and then circulating around from outside the housing due to rising air currents.

[0052] Furthermore, by reducing the width of the connecting portion 2c that connects the sensor portion 2a and the drive board 2b, and by creating a structure in which the connecting portion 2c passes through a notch 35a formed in the partition plate 35, the amount of heat transmitted from the drive board 2b to the sensor elements 3 and 4 via the connecting portion 2c can be reduced, thereby more effectively reducing the thermal impact on the sensor elements 3 and 4.

[0053] Furthermore, the sensor portion 2a has an elongated hole 15, and the connecting portion 2c has multiple holes 25, which allows for more effective promotion of thermal separation.

[0054] As described above, the structure of the sensor device 1 of this embodiment allows for a thermal separation effect, reduces thermal influence on the sensor elements 3 and 4, and maintains good detection accuracy.

[0055] <Others> As shown in Figure 1, a protective cover 41 is provided on the partition plate 40 located on the ceiling side of the front end housing 5a, and the sensor elements 3 and 4 are housed inside the protective cover 41.

[0056] The protective cover 41 surrounds the sensor elements 3 and 4 with a plurality of support columns 42 that extend diagonally with respect to the longitudinal direction (Z1-Z2 direction) of the sensor elements 3 and 4. In this embodiment, the plurality of support columns 42 intersect in a grid pattern.

[0057] In this embodiment, when wind acts on the sensor elements 3 and 4 from all 360 degrees around them, the wind, regardless of the direction from which it blows, passes through the protective cover 41 and acts on the first sensor element 3 equipped with the flow detection resistor 10. Therefore, the first sensor element 3 can detect the flow rate due to the action of wind from all 360 degrees around it. As a result, the protective cover 41 adequately protects the sensor elements 3 and 4 from the outside, and provides omnidirectional protection of the sensor elements 3 and 4 in all 360 degrees around them.

[0058] Furthermore, although the housing 5 is divided into four parts in this embodiment, it may be divided into two parts, or it may be a single, integrated housing without division.

[0059] In the above description, the sensor device 1 was explained as detecting wind, but the fluid to be detected may be other than wind, such as gas or liquid. [Examples]

[0060] The effects of the present invention will be explained below with reference to examples and comparative examples of the present invention. However, the present invention is not limited in any way by the following examples.

[0061] In the experiment, we prepared three types of sensor devices: Experimental Example 1 with the structure shown in Figure 1; Experimental Example 2, which removed screw 39 from Figure 1; and Experimental Example 3, which removed screw 39 and partition plates 35, 40, 43, 44, and 45 from Figure 1.

[0062] To verify the thermal separation effect in each experimental example, the temperature change on the substrate surface was observed using a thermograph (manufactured by Avionics Japan Co., Ltd.).

[0063] Figure 8 shows the results of Experimental Example 1, Figure 9 shows the results of Experimental Example 2, and Figure 10 shows the results of Experimental Example 3. In Figures 8 to 10, (a) is a thermographic image showing the heat distribution, and (b) is a schematic diagram of (a). Note that in each (a), an index of the temperature level is shown on the right, but in each (b), the index is shown in a simplified form for easier understanding.

[0064] In each diagram, P1 refers to the vicinity of the light-emitting part, P2 to the vicinity of the microcontroller, P3 to the vicinity of the heat source, P4 to a position slightly closer to the second housing space than the partition plate, and P5 to the vicinity below the first sensor element.

[0065] The lower the temperature near the first sensor element of P5, the greater the thermal separation effect. In Experimental Example 1, the temperature of P5 was 27.1°C, in Experimental Example 2, it was 28.6°C, and in Experimental Example 3, it was 29.2°C. It was found that Experimental Example 1 could achieve the lowest temperature.

[0066] Thus, in Experimental Example 3, where the partition plates 35, 40, 43, 44, 45 and the screw 39 were removed, the thermal separation effect was lower than in Experimental Example 2, where the partition plates 35, 40, 43, 44, 45 were provided but the screw 39 was removed, and in Experimental Example 1, where both the partition plates 35, 40, 43, 44, 45 and the screw 39 were present. Therefore, the thermal separation effect of providing the partition plate 35 was demonstrated.

[0067] Furthermore, in Experimental Example 2, where partition plates 35, 40, 43, 44, and 45 were provided but the screw 39 was removed, the thermal separation effect was lower than in Experimental Example 1, which had both partition plates 35, 40, 43, 44, and 45 and the screw 39. Therefore, the thermal separation effect of providing the screw 39 was proven. [Industrial applicability]

[0068] This invention improves the heat separation effect, provides highly accurate detection characteristics, and can be applied to various applications. For example, it can be applied to air conditioning equipment, wind control systems, and analytical applications. [Explanation of Symbols]

[0069] 1: Sensor device 2: Circuit board 2a: Sensor unit 2b: Drive board 2c: Connecting part 2d: screw hole 3: First sensor element 4: Second sensor element 5: Cabinet 5a: Front end housing 5b: Rear end housing 6: Protective cover 7a, 7a, 8a, 8b: Lead wires 9: Light-emitting part 10: Resistor for flow detection 18: Bridge Circuit 21, 22: Output section 23: Differential amplifier 24: Feedback Circuit 27: Containment Unit 27a: First containment space 27b: Second containment space 31: First enclosure section 32: Second enclosure section 33: Third enclosure section 34: Fourth enclosure section 35, 40, 43, 44, 45: Partition plates 35a: Notch 36, 37: Connectors 38: Temperature compensation resistor 39: Screw 41: Protective cover 42: Strut

Claims

1. It comprises a substrate having a heating element, a housing having a housing for housing the substrate, and a sensor element having a temperature-sensitive resistance element and supported on the substrate, The aforementioned storage section is provided with a first storage space and a second storage space. The first housing space is closer to the sensor element than the second housing space. A sensor device characterized by having a first partition plate between the first housing space and the second housing space, and a second partition plate between the first housing space and the substrate and the sensor element.

2. The sensor device according to claim 1, characterized in that the first storage space is formed to be wider than the second storage space.

3. The sensor device according to claim 1 or 2, characterized in that the substrate is screwed to the housing.

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