Device
The device employs a spacer with a partially closed cylindrical shape to prevent sealing material from entering the connector housing, maintaining connector integrity and ensuring quality soldering by guiding excess material away from the housing.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- TAMURA KK
- Filing Date
- 2023-09-08
- Publication Date
- 2026-05-15
AI Technical Summary
Capillary action of molten sealing material can cause it to creep up along the outer surface of a connector housing, leading to poor contact at connection terminals when sealing a circuit board with a mounted connector.
A circuit board sealing device that uses a spacer with a partially closed cylindrical shape and no recessed corners to support the connector, ensuring a distance between the connector housing and the spacer, guiding the sealing material away from the housing and allowing visual inspection during soldering.
Prevents the inflow of sealing material into the connector housing, maintains connector integrity, and ensures quality soldering by guiding excess material to a safe space, thus preventing poor contact and ensuring reliable connections.
Smart Images

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Abstract
Description
Technical Field
[0001] The present invention relates to an apparatus incorporating a circuit board, particularly an apparatus in which the incorporated circuit board is sealed with a sealing material.
Background Art
[0002] In the process of manufacturing an apparatus incorporating a circuit board, materials such as molten resin are usually filled into the target locations in order to seal the circuit board in a case or join components together. At this time, if there are gaps or narrow and intricate shapes, the molten material may creep along such shapes due to capillary action, which may affect the performance of the apparatus. Therefore, conventionally, various measures have been taken for the target locations to suppress the creeping of the material (see, for example, Patent Documents 1 and 2).
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Patent Document 2
Summary of the Invention
Problems to be Solved by the Invention
[0004] In an internal board mounted in an apparatus, a connector may be mounted so as to facilitate connection with an external apparatus or board (external board). In such an apparatus, for a connector exposed from the case, a connector having connection terminals leading to the external board (hereinafter referred to as "external connector") is inserted, whereby the connection terminals of both sides come into contact with each other and a connection is established between the internal board and the external board.
[0005] Capillary action also occurs when sealing a circuit board on which a connector is mounted, and the molten sealing material can creep up along the outer surface of the connector housing. If the sealing material creeps up and reaches the inside of the housing, it will not be able to accept the external connector in the intended manner, which can lead to poor contact at the connection terminals, and countermeasures are required.
[0006] Therefore, the present invention aims to provide a technology for preventing the inflow of sealing material into the housing of a connector. [Means for solving the problem]
[0007] To solve the above problems, the present invention employs the following apparatus. Note that the following statements in parentheses are merely examples, and the present invention is not limited thereto.
[0008] In other words, the present invention is a device in which a built-in circuit board is sealed with a sealing material, and comprises a connector having a housing and one or more connection terminals fixed through the bottom of the housing, a spacer having a partially closed cylindrical shape with no recessed corners on its peripheral wall, receiving the connector and supporting it at a first bottom (floor plate), and allowing the connection terminals to be inserted through an opening surrounded by the first bottom and a second bottom (raised floor) connected thereto, and a circuit board on which the spacer rests and the connector is mounted.
[0009] In this embodiment of the device, since the connector is mounted on the circuit board via a spacer, it is possible to prevent the molten sealing material filled during the manufacturing process of the device from directly flowing around the connector housing and into the inside of the housing. Furthermore, since the spacer supporting the connector does not have recessed corners on its peripheral wall, capillary action is less likely to occur on the peripheral wall of the spacer when the molten sealing material is filled during the manufacturing process of the device, it is possible to suppress the creeping of the sealing material along the outer surface of the peripheral wall of the spacer during sealing.
[0010] More preferably, in the apparatus according to the above-described embodiment, the connector has a slit formed in a specific wall portion of the housing that is cut out downward from its upper end, and the spacer has opposing wall portions (the front wall portion and corner wall portion of the spacer) that are opposite to a specific wall portion (the front wall portion of the housing) in the peripheral wall portion that are connected to a second bottom portion, the second bottom portion being close to the specific wall portion, and a distance is secured between the height of the upper surface of the second bottom portion and the height of the lower end of the slit, and between the specific wall portion and the opposing wall portion.
[0011] According to this embodiment of the apparatus, a distance is ensured between the height of the lower end of the slit formed in a specific wall of the housing and the height of the upper surface of the second bottom of the spacer adjacent to the specific wall. Therefore, if the sealing material creeps up from the gap between the specific wall of the housing and the second bottom of the spacer during sealing, it is possible to prevent the sealing material from flowing beyond the lower end of the slit into the interior of the housing.
[0012] Furthermore, since a distance is maintained between a specific wall of the housing and the opposing wall of the spacer, if the sealing material creeps up from the gap during sealing, it can be guided to the space above the second floor section, allowing a certain amount of sealing material to accumulate there, thus preventing the sealing material from flowing into the inside of the housing.
[0013] More preferably, in the apparatus of the above-described embodiment, the spacer is provided with a second bottom at a higher position than the first bottom, and the lower part of the portion that is smaller in height than the other parts forming the opposing wall is connected to the second bottom. In addition, the spacer is provided with a leg at least at one location on the underside of the second bottom, having a height up to the height of the lower surface of the first bottom.
[0014] In the device of this aspect, when the connector is mounted on the circuit board, the spacer lands on the connector, thereby forming an opening surrounded by the upper surface of the circuit board and the second bottom of the spacer, and the inside of the spacer can be visually recognized through this opening. Therefore, according to the configuration of this device, when mounting the connector, soldering can be performed while checking the state of solder bridging from the above-mentioned opening, which can contribute to ensuring the quality of the product.
Advantages of the Invention
[0015] As described above, according to the present invention, it is possible to prevent the inflow of the sealing material into the housing of the connector.
Brief Description of the Drawings
[0016] [Figure 1] It is a perspective view of the current sensor 100 of the embodiment. [Figure 2] It is an exploded perspective view of the current sensor 100. [Figure 3] It is an exploded perspective view showing the connector 120 and its peripheral part enlarged. [Figure 4] It is a perspective view of the spacer 130. [Figure 5] It is a plan view, a front view, and a bottom view of the spacer 130. [Figure 6] It is a perspective view and a plan view showing the state where the connector 120 is mounted on the circuit board 110 via the spacer 130. [Figure 7] It is a front view showing the state where the connector 120 is mounted on the circuit board 110 via the spacer 130. [Figure 8] It is a longitudinal sectional view showing the state where the connector 120 is mounted on the circuit board 110 via the spacer 130. [Figure 9] It is a view showing the spacer 130' as a comparative example. [Figure 10] It is a drawing substitute photograph showing a comparison of the verification results regarding the spacer 130 of the embodiment and the spacer 130' of the comparative example. [Figure 11] It is a plan view showing the spacers 230 and 330 of the modified example.
Best Mode for Carrying Out the Invention
[0017] Hereinafter, regarding an embodiment of the present invention, as an example of an apparatus in which a built-in circuit board is sealed with a sealing material, a current sensor will be taken as an example and described with reference to the drawings.
[0018] FIG. 1 is a perspective view of a current sensor 100 according to an embodiment. The current sensor 100 includes a case body 102 having a substantially rectangular annular shape. The case body 102 is roughly divided into a housing portion 102a formed in advance with a material such as resin to form a housing space for components such as a magnetic core and a circuit board, and a sealing portion 102b formed by curing a sealing material (for example, urethane resin) filled after accommodating the components in the housing portion 102a. A connector 120 for connecting an external connector to the current sensor 100 is mounted on the sealed circuit board. The connector 120 is exposed from a corner of the sealing portion 102b.
[0019] In addition, two mounting plates 104 are provided at the ends of the case body 102, and each mounting plate 104 has a fastening hole 104a. The current sensor 100 is fixed to the installation location with a fastening member through the mounting plate 104 and the fastening hole 104a.
[0020] FIG. 2 is an exploded perspective view of the current sensor 100. For convenience of explanation, in FIG. 2, the current sensor 100 in a state where it is rotated 90 degrees from the state shown in FIG. 1 and laid down horizontally with the connector 120 facing upward is shown exploded. In addition, illustration of the sealing portion 102b and fine components is omitted.
[0021] First, two U-shaped magnetic cores 106 are housed in the housing section 102a with their open end faces facing each other, and a predetermined gap 107 between them. Next, a partition plate 108 is inserted. The partition plate 108 has claws 108b at the tips of portions that extend downward from four locations at the ends of the rectangular frame section 108a. These claws 108b engage with claw receivers provided on the inner circumferential surface of the housing section 102a (in a position not visible in Figure 2), thereby fixing the partition plate 108 to the housing section 102a. The partition plate 108 also has a rectangular hole 108c at a position that overlaps with the gap 107 in the rectangular frame section 108a.
[0022] The circuit board 110 has two ICs 112 (for example, Hall ICs) with built-in magnetic elements mounted in positions that fit into the gap 107 during assembly, and multiple terminals connected to the ICs 112 protrude from the top of the circuit board 110 through through holes. In addition, a connector 120 is mounted on the corner of the circuit board 110 via a spacer 130. The shape of the spacer 130 and the mounting of the connector 120 via it will be described in detail later with reference to another drawing.
[0023] The circuit board 110 is placed on the partition plate 108 by fitting the protrusion 102c provided on the inner surface of the housing portion 102a into the notch 110a formed near the mounting position of the connector 120. As a result, the IC 112 is placed in the gap 107 through the rectangular hole 108c. Finally, the housing portion 102a is filled with sealing material, and the sealing portion 102b is formed when this sealing material solidifies.
[0024] Figure 3 is an exploded perspective view showing a magnified view of the connector 120 and its surrounding area. To facilitate understanding of the invention, the vertical and horizontal directions in Figure 3 will be defined as the vertical and horizontal directions of each component, and their shapes and structures will be described accordingly. Note that the circuit board 110 is shown with the area other than the mounting area of the connector 120 omitted, and the circuit and lands are also omitted (the same applies to subsequent figures).
[0025] The connector 120 is a male connector fixed to the bottom of a housing 122 made of insulating material, with four connection terminals 124 passing through it. Although not visible in Figure 3, the bottom of the housing 122 is closed. The spacer 130 is also made of insulating material and has an opening 130a and a base plate portion 130b at its bottom. The connector 120 is received and supported by the base plate portion 130b, while the connection terminals 124 are inserted through the opening 130a.
[0026] The circuit board 110 has four through-holes 110b, corresponding to the number of connection terminals 124. The lower ends of the four connection terminals 124 are inserted into the four through-holes to position the connector 120 on the circuit board 110, and the spacer 130 supporting the connector 120 lands on the circuit board 110. Then, soldering is performed from the back side of the circuit board 110 to mount the connector 120 onto the circuit board 110.
[0027] In the illustrated example, the two through-holes 110b2 sandwiched between the two through-holes on either side have a larger diameter, but the diameter of each individual through-hole can be changed as appropriate depending on the situation. Furthermore, the number of connection terminals and the corresponding number of through-holes can also be changed as appropriate.
[0028] Figures 4 and 5 show the spacer 130. Figure 4(A) is an upper perspective view, Figure 4(B) is a lower perspective view, Figure 5(A) is a top view, Figure 5(B) is a front view, and Figure 5(C) is a bottom view.
[0029] As shown in Figure 4(A), the spacer 130 has a rectangular tube shape with a bottom in part. Specifically, the peripheral wall of the rectangular tube is formed by corner wall portions 130d being connected at obtuse angles to both sides of the front wall portion 130c, side wall portions 130e being connected at obtuse angles to the corner wall portions 130d, and side wall portions 130e being connected at approximately right angles to both sides of the rear wall portion 130f. In other words, the spacer 130 has a rectangular tube shape with a partially bottomed shape that forms an approximately rectangular outline in plan view, with two of the four corners included in the outline being cut off and connected by flat walls. Specifically, it has a shape in which the approximately right-angle corners formed when the front wall portion 130c and the side wall portions 130e are directly connected are chamfered, and the corner wall portion 130d is connected between the front wall portion 130c and the side wall portion 130e.
[0030] As shown in Figure 4(B), at the bottom of the spacer 130, a floor plate portion 130b, with a large cutout in the front area, is connected to the lower ends of each part that make up the perimeter wall. The front wall portion 130c has a smaller height dimension than the other parts that make up the perimeter wall, and a raised floor portion 130g is connected to its lower end. The bottom surface of the raised floor portion 130g is higher than the bottom surface of the floor plate portion 130b, and three legs 130h extend downward from the raised floor portion 130g. As a result, four inverted groove-shaped portions (hereinafter referred to as "inverted grooves") 130k are formed on the underside of the raised floor portion 130g, penetrating in the front-to-back direction.
[0031] As shown in Figure 4(B) and Figure 5(A), the raised floor section 130g is connected to the front wall section 130c and the corner wall section 130d, and is connected to the floorboard section 130b near the corner wall section 130d. The connection between the floorboard section 130b and the raised floor section 130g forms an opening 130a surrounded by them. Also, as shown in Figure 5(B), the three legs 130h and the four inverted grooves 130k are provided at approximately equal intervals in the width direction. The floorboard section 130b can be seen from each inverted groove 130k. From this, it can be seen that the height of the legs 130h, i.e., the depth of the inverted grooves 130k, is greater than the thickness of the floorboard section 130b.
[0032] Figures 6 and 7 show the connector 120 mounted on the circuit board 110 via the spacer 130. Figure 6(A) is a perspective view thereof, Figure 6(B) is a plan view thereof, Figure 7(A) is a front view thereof, and Figure 7(B) is an enlarged view of a portion of the front view.
[0033] As shown in Figure 6(A), the housing 122 has two elongated slits 122b cut out downward from the upper end of the front wall portion 122a, and a claw 122c between the two slits 122b. The slits 122b and claw 122c are designed to match the shape of the female external connector that is inserted into the connector 120 when the current sensor 100 is in use, and the presence of the claw 122c ensures that the connectors are securely mated together. In addition, the claw 122c bends slightly forward when the external connector is inserted, but since there is space in front of the claw 122c, the spacer 130 does not interfere with the claw 122c.
[0034] Incidentally, in the connector 120, the lower end of the slit 122b is located at approximately 1 / 3 the height of the front wall portion 122a (see Figure 3). This height is lower than the surface level of the sealing material that is filled on top of the circuit board 110 in the housing portion 102a of the case body 102. Therefore, if the connector 120 were to be mounted by directly resting it on the circuit board 110, the sealing material would flow into the interior of the housing 122 from the slit 122b, hindering the connection between the connector 120 and the external connector.
[0035] One possible solution to this problem is to raise the entire peripheral wall of the housing, including the front wall, while maintaining the depth of the slit. However, this solution is undesirable because raising the peripheral wall increases the degree to which the connector protrudes, thus expanding the outermost dimensions of the product.
[0036] Therefore, in this embodiment, in order to reliably prevent the inflow of sealing material into the connector housing while suppressing the expansion of the outermost dimensions of the product as much as possible, the connector 120 is mounted on the circuit board 110 via a spacer 130 of the shape described above. Due to the interposition of the spacer 130, the position of the slit 122b is raised by the thickness of the base plate portion of the spacer 130 that supports the connector 120. As shown in Figure 7(A), in the mounted state of the connector 120, the lower end of the slit 122b is shielded by the front wall portion 130c of the spacer.
[0037] Furthermore, when the spacer 130 lands on the circuit board 110, an opening is formed surrounded by the inverted groove 130k and the upper surface 110c of the circuit board 110, and the inside of the spacer 130 can be seen through this opening. Soldering is performed from the back side (bottom surface 110d side) of the circuit board 110 to the connection terminal 124 that is passed through the through hole, and at that time, the worker can look inside the spacer 130 through the opening and check the condition of the soldering while working.
[0038] To facilitate understanding of the invention, Figure 7(B) shows a magnified view of the soldering process in the area enclosed by line VII in Figure 7(A). The through-hole 110b2 on the left is in a completed soldering state, while the through-hole 110b1 on the right is in a state where soldering is in progress. In this embodiment, soldering can be performed while checking whether there is insufficient solder coming up from the opening (thick framed area in the figure) surrounded by the inverted groove 130k and the upper surface 110c of the circuit board 110, so that the solder SD can be sufficiently distributed into the through-hole 110b and the land (not shown).
[0039] Figure 8 is a longitudinal cross-sectional view showing the connector 120 mounted on the circuit board 110 via the spacer 130. In Figure 8 (A), VIII in Figure 6 A -VIII A This is a cross-sectional view along the line, and in Figure 8 (B) corresponds to VIII in Figure 6. B -VIII B This is a cross-section along the line.
[0040] The raised portion 130g of the spacer 130 is in close proximity to the front wall portion 122a of the housing 122, separated by a small gap 130s. A distance D1 is maintained between the upper surface level of the raised portion 130g and the lower end level 122d of the slit 122b. A distance D2, significantly exceeding the gap 130s, is maintained between the front wall portion 122a of the housing and the front wall portion 130c of the spacer. Furthermore, distances D3 of varying magnitudes are maintained between the front wall portion 122a of the housing and the corner wall portion 130d of the spacer, depending on the position. When sealing the product, the sealing material is filled to a level FL that is higher than the lower end level 122d of the slit 122b and lower than the upper end level of the front wall portion 130c of the spacer.
[0041] The sealing material flows around and under the spacer 130 along the circuit board 110, and also flows under the housing 122 through the inverted groove 130k of the spacer, and can crawl up the gap 130s. In this embodiment, since a distance D1 is secured between the upper surface level of the raised portion 130g and the level of the lower end 122d of the slit 122b, it is possible to prevent the sealing material that crawls up from the gap 130s from reaching the slit 122b.
[0042] Furthermore, since a distance D2 is secured between the front wall portion 122a of the housing and the front wall portion 130c of the spacer, and a distance D3 is secured between the front wall portion 122a of the housing and the corner wall portion 130d of the spacer, even if the sealing material creeps up from the gap 130s, it can be guided to the upper space 130t above the raised floor portion 130g. A certain amount of sealing material can be retained in the upper space 130t, and even if the sealing material is filled up to level FL, the amount of sealing material retained in the upper space 130t will not exceed the level of the lower end 122d of the slit 122b. Therefore, it is possible to prevent the sealing material that creeps up from the gap 130s from flowing into the interior of the housing 122.
[0043] Figure 9 shows spacer 130' as a comparative example. Figure 9(A) is a plan view of spacer 130', and Figures 9(B) and (C) are longitudinal cross-sectional views when the connector 120 is mounted on the circuit board 110 via spacer 130'. Figures 9(B) and (C) are obtained by replacing the spacer 130 of the embodiment in the cross-sectional views of Figures 8(A) and (B) with the spacer 130' of the comparative example.
[0044] As shown in Figure 9(A), in the comparative example spacer 130', a corner wall portion 130d' is connected between the front wall portion 130c' and the side wall portion 130e', forming a roughly right-angle recess. The spacer 130' has a shape that secures space for receiving the connector 120 and the minimum space necessary to prevent interference between the front claw of the connector and the front wall portion 130c'.
[0045] As shown in Figure 9(B), when the comparative example spacer 130' is used, the raised portion 130g' of the spacer 130' is in close proximity to the front wall portion 122a of the housing 122, separated only by a small gap 130s'. Because the raised portion 130g' is at a high position and the upper surface level of the raised portion 130g' roughly coincides with the level of the lower end 122d of the slit 122b, if the sealing material crawls upward from the gap 130s', it is difficult to guide the sealing material into the space 130t' above the raised portion 130g', and there is a risk that the sealing material will flow into the interior of the housing 122 from the slit 122b.
[0046] Furthermore, as shown in Figure 9(C), when using the comparative example spacer 130', only a gap 130s' exists between the front wall portion 122a of the housing and the corner wall portion 130d' of the spacer. Therefore, if the sealing material gets into this gap, it is likely to creep up.
[0047] Figure 10 is a photographic substitute drawing that shows a comparison of the verification results for the spacer 130 of the embodiment and the spacer 130' of the comparative example. Since it is difficult to illustrate the way the sealing material creeps up onto each spacer (the degree of capillary action), a photograph is used in place of the drawing.
[0048] As shown in Figure 10 (B-1), in the comparative example spacer 130', a significant amount of sealing material creeps up into the recessed portion of its corner wall 130d'. In contrast, as shown in Figure 10 (A-1), in the embodiment spacer 130, there are no recessed portions throughout the entire peripheral wall, and the creeping up of the sealing material is effectively prevented.
[0049] Furthermore, the area enclosed by the dashed line in Figure 10 (A-2) is shown in an enlarged view in Figure 10 (A-3), and the area enclosed by the dashed line in Figure 10 (B-2) is shown in an enlarged view in Figure 10 (B-3). From Figure 10 (B-3), it can be seen that in the comparative example, the sealing material has crawled up the gap between the front wall portion 122a of the housing and the raised floor portion 130g', coming very close to the lower end 122d of the slit, and that the sealing material has also wrapped around and crawled up the gap between the front wall portion 122a of the housing and the corner wall portion 130d'.
[0050] In contrast, as can be seen from (A-3) in Figure 10, in this embodiment, the raised floor portion 130g is located in a position that is not visible in the photograph, and no creeping of the sealing material occurs near the lower end 122d of the slit. Furthermore, it can be seen that almost no creeping of the sealing material occurs in the gap between the spacer 130 and the front wall portion 122a of the housing. The superiority of the spacer 130 in the embodiment is clear from this comparison of verification results.
[0051] Figure 11 is a plan view showing modified spacers 230 and 330. In the spacer 130 of the embodiment described above, a flat corner wall portion 130d was connected between the front wall portion 130c and the side wall portion 130e. However, the shape of the connection point between the front wall portion and the side wall portion is not limited to this, and any shape is acceptable as long as the peripheral wall does not have a corner portion that is recessed inward (in the direction of the central axis of the cylinder).
[0052] For example, as shown in the first modified spacer 230 in Figure 11(A), the front wall portion 230c and the side wall portion 230e may be connected by a curved surface. Alternatively, if there are no spatial constraints around the connector mounting location, the front wall portion 330c and the side wall portion 330e may be directly connected, as shown in the second modified spacer 330 in Figure 11(B). Spacers of these shapes can also effectively prevent the sealing material from creeping up along the wall surface.
[0053] By mounting the connector 120 on the circuit board 110 with either the spacer 130 of the above embodiment or the modified spacers 230 or 330 interposed therebetween, the following advantages can be obtained.
[0054] (1) The spacer has a partially closed-bottom cylindrical shape, and its peripheral wall does not have corners that are recessed inward (in the direction of the central axis of the cylinder), so when sealing the product with sealing material, it is possible to prevent the sealing material from creeping up along the outer surface of the peripheral wall.
[0055] (2) The bottom of the spacer is provided with an inverted groove. When the spacer lands on the circuit board, an opening is formed between the inverted groove and the top surface of the circuit board. The inside of the spacer can be seen through this opening, allowing the soldering process to be checked while soldering the connector terminals that pass through the through-holes of the circuit board, thus maintaining the quality of the soldering.
[0056] (3) When the spacer accepts the connector, the front wall of the connector housing and the raised portion of the spacer are in close proximity with only a small gap between them. However, a certain distance is maintained between the lower end level of the slit formed in the front wall of the housing and the upper surface level of the raised portion of the spacer, as well as between the front wall of the housing and the front wall and corner walls of the spacer (the wall portion of the spacer facing the front wall of the housing). Therefore, even if sealing material creeps up from the gap during product sealing, it can be guided into the space above the raised portion and kept at a level lower than the lower end of the slit, thus preventing the sealing material from flowing into the housing from the slit.
[0057] The present invention can be implemented in various ways without being limited to the embodiments and modifications described above.
[0058] In accordance with the shape of the connector 120, which has a roughly rectangular outline in plan view, the spacer 130 of the embodiment and the spacers 230 and 330 of the modified examples all have a shape in which the outline in plan view includes multiple corners, but the peripheral wall does not have corners that are recessed inward. However, the shape of the spacer can be appropriately changed according to the shape of the connector. For example, the spacer may have a shape with a roughly circular or elliptical outline in plan view (a shape in which the outline in plan view does not include corners).
[0059] In the spacer 130 of this embodiment, three legs 130h are provided at approximately equal intervals on the underside of the raised floor portion 130g, but the number and position of the legs 130h are not limited to this and can be changed as appropriate. For example, only one leg 130h may be provided in the center of the raised floor portion 130g in the width direction.
[0060] The shape and structure of the spacer 130 interposed between the circuit board 110 and the connector 120 when mounting the connector 120 to the current sensor 100 can be applied to various devices other than current sensors that have a structure in which the circuit board is sealed with a sealing material.
[0061] Furthermore, the structures shown in the embodiments and other descriptions are merely preferred examples, and it goes without saying that the present invention can be suitably implemented by adding various elements to the basic structure or by substituting parts of it. [Explanation of Symbols]
[0062] 100 Current Sensor (Device) 102 Case Body 110 Circuit board 120 connectors 122 Housing 122a Front wall section (specific wall section) 122b Slit 124 Connection terminals 130 Spacer 130a aperture 130b Floor plate part (1st bottom part) 130c Front wall (opposite wall) 130d Corner wall section (opposing wall section) 130g raised platform (second bottom) 130h legs 130k inverted groove
Claims
1. A device in which the internal circuit board is sealed with a sealing material, A connector having a housing and one or more connection terminals fixed through the bottom of the housing, The peripheral wall has a partially closed cylindrical shape with no inwardly recessed or height-extending portion, and the connector is received with the connector protruding above the peripheral wall and supported on the upper surface of the first bottom, and the connection terminal is inserted through the opening surrounded by the first bottom and the second bottom connected thereto, and the peripheral wall faces a spacer separated by a specific wall of the housing, The circuit board on which the spacer is placed and the connector is mounted, A device equipped with.
2. In the apparatus according to claim 1, The aforementioned connector is A slit is formed in the aforementioned specific wall portion, cutting out downwards from its upper end. The previous spacer is The apparatus is characterized in that an opposing wall portion in the peripheral wall portion that faces the specific wall portion is connected to the second bottom portion, the second bottom portion is close to the specific wall portion, and a distance is secured between the height of the upper surface of the second bottom portion and the height of the lower end of the slit, and between the specific wall portion and the opposing wall portion.
3. In the apparatus according to claim 2, The previous spacer is The apparatus is characterized in that the second bottom is provided at a higher position than the first bottom, and the lower part of a portion that forms part of the opposing wall and has a smaller height dimension than other parts of the opposing wall is connected to the second bottom.
4. In the apparatus described in claim 3, The previous spacer is The apparatus is characterized in that at least one leg is provided on the lower side of the second bottom, having a height up to the height of the lower surface of the first bottom.