Books with IC tags

Abstract

To provide a book with an IC tag that can be easily manufactured, capable of suppressing excessive pressure from being applied on an IC chip.SOLUTION: The book with the IC tag includes an IC tag 20 having the IC chip attached on an end paper. The IC tag 20 is attached at a position that is separated by a prescribed distance or more from a circumference of the end paper.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a book to which an IC tag is attached. The manufacturing method of this book is also mentioned.

Background Art

[0002] It is becoming possible to attach an IC tag using an IC inlay to a book and perform overall logistics management including production history management and sales management at a retail store. As a result, more detailed management becomes possible, and it is expected to improve the convenience for consumers who purchase books.

[0003] Patent Document 1 discloses an electronically tagged book produced by center stitching binding. In this book, a part of the throat of the cover that becomes the binding edge of the folded sheet in the main text is removed to form a recess, and a chip is placed inside to prevent deterioration of the performance of the electronic tag.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In Patent Document 1, although a part of the pressure acting on the chip can be reduced due to its structure, since a part of the main text that has no direct relation to the electronic tag needs to be processed, the manufacturing process becomes complicated for the whole book. This is not limited to center stitching binding, but is the same for hardcover overbinding manufactured by wireless binding or the like.

[0006] In view of the above circumstances, an object of the present invention is to provide a book with an IC tag that can be easily manufactured and suppresses excessive pressure from acting on the IC chip.

Means for Solving the Problems

[0007] The present invention relates to a book with an IC tag, in which an IC tag having an IC chip is attached to the endpaper. It has a hard cover made of cloth, cardboard on the front and cardboard on the back. In this book with an IC tag, the IC tag is located at a predetermined distance from the edge of the endpaper. A position that is separate and does not interfere with the folded edge of the cover cloth. It is attached to [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a book with an IC tag that can be easily manufactured and that can suppress excessive pressure being applied to the IC chip. [Brief explanation of the drawing]

[0009] [Figure 1] This figure shows the main body of a book with an IC tag according to one embodiment of the present invention. [Figure 2] This is a diagram showing the front endpaper of a book with an IC tag. [Figure 3] This diagram shows one of the manufacturing processes for the hardcovers attached to books equipped with IC tags. [Figure 4] This is a diagram showing the completed hardcover. [Figure 5] This diagram shows one of the manufacturing processes for books with IC tags. [Figure 6] This is a schematic diagram illustrating one step in another example of the manufacturing procedure for books with IC tags. [Figure 7] This is a schematic diagram illustrating one step in another example of the manufacturing procedure for books with IC tags. [Figure 8] This is a schematic cross-sectional view showing a modified example of the IC tag according to the present invention. [Figure 9] This is a schematic cross-sectional view showing a modified example of the IC tag according to the present invention. [Modes for carrying out the invention]

[0010] A first embodiment of the present invention will be described with reference to Figures 1 to 7. Figure 1 shows the main body 10 of the IC tag-equipped book (hereinafter simply referred to as "book") according to this embodiment. The main body 10 is in a state before the hard cover, which will be described later, is attached, and comprises a main text 11 containing multiple pages on which text, images, etc. are printed, and a front endpaper 12 and a back endpaper (not shown) arranged to sandwich the main text 11. In the main body 10 according to this embodiment, the IC tag 20 is attached to the front endpaper 12.

[0011] The basic structure of the main body 10 is publicly known, and it can be manufactured by gluing the front and back endpapers, which are folded in half, to the first and last signatures that make up the main text 11, and then stacking multiple signatures and binding them together. Various known methods such as perfect binding, thread binding, and perfect binding can be used for the binding process. The back of the main body 10 may be reinforced with land deed paper, shade cloth, or the like.

[0012] Figure 2 shows the front endpaper 12 according to this embodiment. The basic configuration of the IC tag 20 is known and includes a substrate 21 on which an antenna 22 is provided on one side, and an IC chip 25 electrically connected to the antenna. The base material 21 can be a sheet made of paper, plastic, or the like. The antenna 22 can be formed by etching a metal layer or arranging metal wires. The IC chip 25 stores various types of information, including basic information of the booklet to which it is attached and individual information for identifying each booklet, which are selected as appropriate according to the management method and purpose. There are no particular restrictions on how the IC tag 20 is attached to the front endpaper 12, but a simple method is to provide an adhesive layer on one side of the base material 21 to form a label and attach it to the front endpaper 12.

[0013] Figures 3 and 4 show the structure and manufacturing procedure of the hard cover according to this embodiment. As shown in Figure 2, the hard cover 50 comprises a cover cloth 51 that constitutes the outer surface of the book, front and back cardboard 52 and 53 that provide rigidity to the front and back covers, and reinforcing paper 54 for joining the spine. As shown in FIG. 3, the front cardboard 52, the reinforcing paper 54, and the back cardboard 53 are sequentially arranged and bonded to the inner surface of the cover cloth 51. As shown in FIG. 4, when the peripheral edge portion of the cover cloth 51 is folded back and bonded so as to cover a part of the front cardboard 52, the reinforcing paper 54, and the back cardboard 53, the hard cover 50 is completed.

[0014] As shown in FIG. 5, with the back portion of the main body 10 aligned with the reinforcing paper 54 of the completed hard cover 50, and the front facing-back 12 joined to the front cardboard 52 and the back facing-back joined to the back cardboard 53, the main body 10 and the hard cover 50 are integrated, and the book according to this embodiment is completed.

[0015] In the book with an IC tag according to this embodiment, the IC tag 20 is attached to the central portion of the front facing-back 12. Therefore, when the front facing-back 12 is joined to the hard cover 50, it is prevented that the IC tag 20 and the folded-back portion of the cover cloth 51 overlap and interfere with each other. Further, after joining, the folded-back portion of the cover cloth 51 functions as a spacer, so that even when books with IC tags are stacked, excessive pressure acting on the IC chip 25 is preferably suppressed.

[0016] Also, since the IC tag 20 is attached to the front facing-back 12 at a position away from the peripheral edge portion, even when a ground ticket paper, a cold gauze, etc. are attached to the back portion of the main body, they do not interfere with each other, and it is also possible to prevent excessive pressure from acting on the IC chip 25 due to these members. Thus, in the book with an IC tag according to this embodiment, without specially processing the text, it is possible to preferably suppress excessive pressure from acting on the IC chip 25. As a result, even when a large number of books are stacked during the manufacturing process or the distribution process, good non-contact communication is possible, and various management regarding the books can be performed well.

[0017] From the viewpoint of fully achieving the effects described above, it is preferable that the IC tag 20 be positioned at a certain distance from the periphery of the endpaper. Specifically, by attaching the IC tag 20 at a distance of 15 mm or more from the periphery in the vertical direction of the book (12a and 12b shown in Figure 2), 20 mm or more from the periphery located on the spine side of the book (the side with the endpaper fold) (12c shown in Figure 2), and 15 mm or more from the periphery located on the fore-edge side opposite the spine (12d shown in Figure 2), interference with each of the above-mentioned parts can be reliably avoided.

[0018] In the book according to this embodiment, the IC tag 20 does not necessarily have to be attached to the front endpaper, but may be attached to the back endpaper. Furthermore, the IC tag 20 does not necessarily have to be attached to the surface that is joined to the hard cover; it may be attached to any surface of the endpaper.

[0019] The book according to this embodiment is not limited to one bound using endpapers with IC tags pre-attached. Therefore, the book according to this embodiment may also be produced by attaching IC tags to the endpapers of a completed hardcover book. For example, when a hardcover book is placed in an automatic bookbinding machine that applies covers and sashes, the front and back covers are opened during the process of applying the covers, as shown in Figure 6. By combining the automatic bookbinding machine with a labeler and attaching the labeled IC tag 20 to a predetermined position on the endpapers that are exposed when the front and back covers are opened, books with IC tags according to this embodiment can be efficiently produced.

[0020] Alternatively, if the number of hardcover books to be printed is small, as shown in Figure 7, the worker W may open the front or back cover of the books and sequentially place them in the labeler 100, and the labeler 100 may attach the IC tags to the designated locations on the endpapers.

[0021] Although various embodiments of the present invention have been described, the specific configuration is not limited to these embodiments, and modifications and combinations of the configuration that do not depart from the spirit of the present invention are also included. Some modifications are given below as examples, but these are not exhaustive, and other modifications are also possible. Two or more of these modifications may be combined as appropriate.

[0022] In the endpaper according to the present invention, a paper layer may be attached so as to cover the IC tag. This makes it possible to print various characters and markings on the area where the IC tag is attached, making it easier to adapt to a booklet. Covering the formed printed layer with an overcoat layer made of resin or the like prevents bleed-through when other pages of the booklet come into contact with it. Alternatively, the IC tag base material 21 can be made of paper, and as shown in Figure 8, an adhesive layer 30 can be provided on the surface where the antenna 22 and IC chip 25 are located, thereby enabling printing on the area where the IC tag is attached without the need for a separate paper layer. This configuration also has the advantage of enabling printing without increasing the thickness of the IC tag.

[0023] When an adhesive layer is provided on an IC tag, as shown in Figure 9, a non-adhesive portion 40 may be provided on the peripheral edge of the surface of the base material 21 on which the adhesive layer 30 is provided in plan view. In this case, even if the plan view area of ​​the adhesive layer 30 increases due to the pressure applied during attachment and spreads onto the non-adhesive portion 40, the adhesive layer 30 will not stick to the non-adhesive portion 40, and when the pressure is released, the plan view area will return to its original size. As a result, it is possible to suppress the adhesive layer 30 from protruding from the base material 21 in the plan view of the IC tag, and to effectively prevent problems such as the protruding adhesive layer sticking to other pages. The non-adhesive portion 40 can be formed by applying and drying an easy-release agent, or by known adhesive-killing treatments, etc. This effect can be further enhanced by setting the area where the adhesive layer is applied to be slightly smaller than the planar dimensions of the substrate, so that even when the maximum expected pressure is applied, the adhesive layer 30 does not extend beyond the substrate 21 in the planar view of the IC tag.

[0024] The shape of the IC tag antenna is not limited to that shown in the above embodiment, and can be set as appropriate according to the required communication characteristics, etc. [Explanation of symbols]

[0025] 12 Front endpaper 20 IC tags 25 IC chips 30 Adhesive layer 40 Non-adhesive area 50 Hardcover 51 Cover cloth 52 Cardboard Front 53 Cardboard backing

Claims

1. An IC tagged book in which an IC tag having an IC chip is attached to the endpaper, It has a hard cover with a cloth cover, a cardboard front, and a cardboard back. The IC tag is attached at a predetermined distance or more from the periphery of the endpaper and in a position that does not interfere with the folded portion of the cover cloth. Books with IC tags.

2. The IC tag is attached at a position at least 15 mm away from any edge of the lining. A book with an IC tag as described in claim 1.

3. The IC tag has a paper layer covering the IC chip, The paper layer comprises a printed layer and an overcoat layer covering the printed layer. A book with an IC tag as described in claim 1.

4. The aforementioned IC tag is It is joined to the endpaper by an adhesive layer provided on one side. In a plan view, a non-adhesive portion surrounding the adhesive layer is provided on one of the surfaces. A book with an IC tag as described in claim 1.

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