Laminate, laminate with IC, method for manufacturing a laminate, method for manufacturing a laminate with IC
By centrally positioning the antenna body within the laminate using a through-hole design, warping is suppressed, ensuring stable manufacturing and connection of the IC module.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- DAI NIPPON PRINTING CO LTD
- Filing Date
- 2022-02-25
- Publication Date
- 2026-05-21
AI Technical Summary
Existing laminates with IC modules experience warping due to the antenna being positioned far from the center, which affects handling during manufacturing.
The laminate design includes a first antenna layer with a through hole, a second antenna layer superimposed on the first, with the antenna body located centrally, and an antenna connection portion extending through the through hole, connected to a conductive plate via an anisotropic conductive film.
This design effectively suppresses warping of the laminate during manufacturing by centrally locating the antenna body, maintaining structural integrity and facilitating easy connection with the IC module.
Smart Images
Figure 0007863292000001 
Figure 0007863292000002 
Figure 0007863292000003
Abstract
Description
Technical Field
[0001] The present disclosure relates to a laminate, a laminate with an IC having the laminate, a method for manufacturing the laminate, and a method for manufacturing the laminate with an IC.
Background Art
[0002] For example, as cards such as credit cards, cash cards, ID cards, etc., laminates with an IC (Integrated Circuit) are used. Alternatively, as data pages in booklets such as passports, laminates with an IC are incorporated and used. As described in Patent Document 1, as a laminate with an IC, a so-called dual interface card having both functions of contact communication and non-contact communication is known. The laminate with an IC has an IC module and a laminate that supports the IC module. For contact communication, the IC module is exposed on the surface of the laminate with an IC. For non-contact communication, the laminate has an antenna connected to the IC module.
[0003] The IC module is attached to the laminate using an anisotropic conductive film. The anisotropic conductive film has adhesiveness. By using the anisotropic conductive film, the IC module can be attached to the laminate, and at the same time, the antenna of the laminate and the IC module can be easily connected.
Prior Art Documents
Patent Documents
[0004]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0005] Since the IC module is exposed on the surface of the IC-equipped laminate, when connecting the IC module to the antenna using an anisotropic conductive film, the antenna in the laminate is located near the surface. The antenna is positioned far from the center in the thickness direction of the laminate. When the antenna is positioned far from the center, warping of the laminate may occur during manufacturing. Warping of the laminate can adversely affect the handling of the IC-equipped laminate.
[0006] This disclosure aims to suppress warping of laminates. [Means for solving the problem]
[0007] The laminates disclosed herein are A first antenna layer having a through hole extending in a first direction, A second antenna layer superimposed on the first antenna layer in the first direction, A laminate comprising an antenna having an antenna body portion disposed between the first antenna layer and the second antenna layer, and an antenna connection portion extending from the antenna body portion through the interior of the through hole, The antenna body is located in the central part of the laminate in the first direction.
[0008] In the laminate of the present disclosure, the central portion may be a portion within 5% of the length of the laminate in the first direction, from the center of the laminate in the first direction.
[0009] In the laminate of the present disclosure, the length of the laminate in the first direction may be 0.68 mm or more and 0.84 mm or less.
[0010] In the laminate of the present disclosure, the ratio of the area of the through-hole to the area of the first antenna layer in a plan view may be 0.05% or more and 4% or less.
[0011] The laminates disclosed herein are The system further comprises a conductive plate in which at least a portion overlaps the through hole, The antenna connection part may be connected to the conductive plate near the antenna main body part.
[0012] In the laminate of the present disclosure, a recess may be provided at a position overlapping the through hole.
[0013] The laminate with an IC of the present disclosure is the above-described laminate, an IC module disposed in the recess, and an anisotropic conductive film that adheres the IC module to the conductive plate.
[0014] The method for manufacturing the laminate of the present disclosure includes a step of providing a through hole extending in the first direction in a first antenna layer, a step of disposing a conductive plate on a first side of the first antenna layer in the first direction, a step of disposing an antenna on a second side of the first antenna layer in the first direction, a step of drawing an antenna connection part of the antenna into the through hole, and a step of connecting the antenna connection part to the second side of the conductive plate in the first direction, wherein the antenna main body part of the antenna is located at the central part of the laminate in the first direction.
[0015] The method for manufacturing the laminate of the present disclosure may further include a step of providing a recess at a position overlapping the through hole.
[0016] The method for manufacturing the laminate with an IC of the present disclosure includes a step of manufacturing a laminate by the above-described method for manufacturing a laminate, and a step of disposing an IC module in the recess so as to be adhered to the conductive plate by an anisotropic conductive film.
Effect of the Invention
[0017] According to the present disclosure, warping of the laminate can be suppressed.
Brief Description of the Drawings
[0018] [Figure 1] Figure 1 is a plan view of an ID card as an example of a laminate with an IC. [Figure 2] Figure 2 is a cross-sectional view taken along line II-II of Figure 1. [Figure 3] Figure 3 is a plan view showing the inside of the laminate with an IC except for a part of the laminate with an IC. [Figure 4] Figure 4 is a diagram for explaining the manufacturing process of the laminate with an IC. [Figure 5] Figure 5 is a diagram for explaining the manufacturing process of the laminate with an IC. [Figure 6] Figure 6 is a diagram for explaining the manufacturing process of the laminate with an IC. [Figure 7] Figure 7 is a diagram for explaining the manufacturing process of the laminate with an IC. [Figure 8] Figure 8 is a diagram for explaining the manufacturing process of the laminate with an IC. [Figure 9] Figure 9 is a diagram for explaining the manufacturing process of the laminate with an IC. [Figure 10] Figure 10 is a diagram for explaining the manufacturing process of the laminate with an IC. [Figure 11] Figure 11 is a diagram for explaining the manufacturing process of the laminate with an IC. [Figure 12] Figure 12 is a cross-sectional view showing a conventional laminate with an IC.
Mode for Carrying Out the Invention
[0019] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. The scales, aspect ratios, etc. in the drawings attached to this specification are changed and exaggerated from those of the actual objects for the sake of illustration and easy understanding.
[0020] Figure 1 shows a card as an example of an IC-equipped laminate 1. The IC-equipped laminate 1 may also be incorporated into a booklet such as a passport. Figure 1 shows a plan view of the IC-equipped laminate 1 observed from the first side s1 in the first direction d1. The first direction d1 is the thickness direction of the IC-equipped laminate 1. The first side s1 in the first direction d1 is the front side of the IC-equipped laminate 1, and the second side s2 in the first direction d1 is the back side of the IC-equipped laminate 1.
[0021] The IC-equipped laminate 1 is in the form of a thin plate. As shown in Figure 1, the IC-equipped laminate 1 has a substantially rectangular shape in plan view. The IC-equipped laminate 1 comprises an IC module 10 and a laminate 20. The IC module 10 is exposed on the surface of the IC-equipped laminate 1. The IC module 10 of the IC-equipped laminate 1 is equipped with both contact communication and contactless communication functions. The IC-equipped laminate 1 is a dual-interface card. The IC-equipped laminate 1 can perform two different functions through contact communication and contactless communication.
[0022] Figure 2 is a cross-sectional view along line II-II in Figure 1. Although Figure 2 shows a gap between the IC module 10 and the laminate 20, in reality there is almost no gap. As shown in Figure 2, the IC module 10 includes a substrate 11, an IC chip 12, a molding resin 13, and a conductive pad 15. The substrate 11 supports the IC chip 12 and the conductive pad 15. Circuits for contact communication are formed on the substrate 11. The substrate 11 is made of a flexible resin such as glass epoxy resin or polyimide resin, with copper circuits provided on one side. The circuits are connected to the IC chip 12. The IC chip 12 has a CPU (Central Processing Unit), RAM (Random Access Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), flash memory, etc., which perform operations such as communication control, various controls, calculations, and memory access, and processes information obtained through contact and contactless communication. The molding resin 13 protects the IC chip 12. The conductive pad 15 is a terminal for connecting the antenna 30 (described later) of the laminate 20 to the IC chip 12 for contactless communication. The conductive pad 15 is made of, for example, copper.
[0023] As shown in Figure 2, the IC-equipped laminate 1 further includes an anisotropic conductive film 18. The anisotropic conductive film 18 adheres the conductive pads 15 of the IC module 10 to the conductive plate 35 of the laminate 20, which will be described later. The anisotropic conductive film 18 connects the IC module 10 to the antenna 30 via the conductive plate 35. The anisotropic conductive film 18 is a layer of thermosetting resin containing fine metal particles. The anisotropic conductive film 18 is not conductive in its initial state, but when heat-pressed, only the parts under pressure become conductive as the metal particles connect to each other. The length of the anisotropic conductive film 18 in the first direction d1 is, for example, 30 μm or more and 50 μm or less.
[0024] The laminate 20 supports the IC module 10. The laminate 20 is in the form of a thin plate. In plan view, the laminate 20 has a substantially rectangular shape. The length of the laminate 20 in the first direction d1 is, for example, 0.68 mm or more and 0.84 mm or less, preferably 0.76 mm or more and 0.84 mm or less. The laminate 20 is provided with a recess 20R on the first side s1 in the first direction d1, at a position that overlaps with the through hole 21C described later. The IC module 10 is placed in the recess 20R. The recess 20R is sized and shaped to appropriately accommodate the IC module 10. The depth of the recess 20R is appropriately designed depending on the IC module 10 to be placed, but is, for example, 0.18 mm or more and 0.25 mm or less.
[0025] The laminate 20 includes a first antenna layer 21A, a second antenna layer 21B, a first inner layer 22A, a second inner layer 22B, a first core layer 23A, a second core layer 23B, a first oversheet layer 24A, a second oversheet layer 24B, a concealing layer 25, a pattern layer 26, a magnetic recording section 29, an antenna 30, and a conductive plate 35. As shown in Figure 2, the pattern layer 26, concealing layer 25, first oversheet layer 24A, first core layer 23A, first inner layer 22A, first antenna layer 21A, second antenna layer 21B, second inner layer 22B, second core layer 23B, and second oversheet layer 24B are stacked in that order from the first side s1 to the second side s2 in the first direction d1.
[0026] Each component of the laminate 20 will be described below.
[0027] The first antenna layer 21A supports the antenna 30 from the first side s1 in the first direction d1. The second antenna layer 21B covers the antenna 30 on the first antenna layer 21A. The second antenna layer 21B protects the antenna 30. The second antenna layer 21B is superimposed on the first antenna layer 21A on the second side s2 in the first direction d1. The first antenna layer 21A is provided with a through hole 21C extending in the first direction d1. The first antenna layer 21A is provided with two through holes 21C. The size of the through hole 21C is such that the antenna connection portion 32 of the antenna 30 (described later) can extend through it, and the antenna connection portion 32 can be welded to the conductive plate 35 through the through hole 21C. The through hole 21C may be divided into, for example, a portion through which the antenna connection portion 32 extends and a portion for housing the molded resin 13. The size of the through hole 21C in plan view is, for example, 2 mm. 2 20mm or more 2 The following conditions apply: The ratio of the area of the through-hole 21C to the area of the first antenna layer 21A in a plan view is preferably 0.05% to 4%. The length of the first antenna layer 21A in the first direction d1 is, for example, 0.05 mm to 0.35 mm. The length of the second antenna layer 21B in the first direction d1 is, for example, 3 mm to 6 mm.
[0028] The first inner layer 22A adheres the first antenna layer 21A and the first core layer 23A. The second inner layer 22B adheres the second antenna layer 21B and the second core layer 23B. The lengths of the first inner layer 22A and the second inner layer 22B in the first direction d1 are, for example, 0.03 mm or more and 0.1 mm or less. The first inner layer 22A and the second inner layer 22B are made of materials having various adhesive or tackiness properties. The materials of the first inner layer 22A and the second inner layer 22B are, for example, polyvinyl chloride (PVC) or glycol-modified polyethylene terephthalate (PET-G).
[0029] The first core layer 23A and the second core layer 23B support each component of the laminate 20. The lengths of the first core layer 23A and the second core layer 23B in the first direction d1 are, for example, 0.25 mm or more and 0.38 mm or less.
[0030] The first oversheet layer 24A and the second oversheet layer 24B, together with the first core layer 23A and the second core layer 23B, support each component of the laminate 20. The lengths of the first oversheet layer 24A and the second oversheet layer 24B in the first direction d1 are, for example, 0.05 mm or more and 0.10 mm or less.
[0031] The materials for the first antenna layer 21A, the second antenna layer 21B, the first core layer 23A, the second core layer 23B, the first oversheet layer 24A, and the second oversheet layer 24B are synthetic resins such as polyvinyl chloride resin, vinyl acetate resin, vinyl chloride-vinyl acetate copolymer resin, butadiene resin, acrylonitrile-butadiene-styrene copolymer resin, polycarbonate resin, polyamide resin, cellulose resin, polyolefin such as polyester, polyethylene, and polypropylene, polyvinyl alcohol, acrylic resin, polymethyl methacrylate resin, styrene resin, urethane resin, fluororesin, or mixtures thereof.
[0032] The concealing layer 25, when observed from the first side s1 in the first direction d1, conceals the components of the laminate 20 located beyond the concealing layer 25 on the second side s2 in the first direction d1. In particular, the concealing layer 25 conceals the magnetic recording section 29. The concealing layer 25 is, for example, silver, black, gold, or red. The length of the concealing layer 25 in the first direction d1 is, for example, 1 μm to 5 μm. The concealing layer 25 is made of, for example, aluminum.
[0033] The pattern layer 26 forms a pattern 26A that is displayed on the first side s1 in the first direction d1 of the IC-equipped laminate 1, as shown in Figure 1. The pattern 26A may include not only a pattern that provides design aesthetics, but also information such as text. This information may include, for example, the name or membership number of the owner of the IC-equipped laminate 1. The length of the pattern layer 26 in the first direction d1 is, for example, 1 μm or more and 5 μm or less. The pattern layer 26 is formed, for example, by printing ink onto the opacity layer 25.
[0034] The magnetic recording section 29 enables magnetic recording in the IC-equipped laminate 1, thereby granting it the function of a magnetic card. The laminate 20 has two magnetic recording sections 29. One magnetic recording section 29 is located on the first side s1 of the first core layer 23A in the first direction d1 and is covered by the first oversheet layer 24A. The other magnetic recording section 29 is located on the second side s2 of the second core layer 23B in the first direction d1 and is covered by the second oversheet layer 24B. The two magnetic recording sections 29 are located at the same position in a plan view and extend in one direction. In the example shown in Figure 1, the magnetic recording sections 29 extend parallel to the long side of the rectangular IC-equipped laminate 1. The magnetic recording sections 29 are made of a material such as a magnetic material, for example, iron oxide.
[0035] Antenna 30 is used for contactless communication of IC module 10. Antenna 30 is a single wire. Antenna 30 is connected to IC module 10. When radio waves from an external source pass through antenna 30, an electric current flows through antenna 30. This current allows IC module 10 to communicate with the outside world without contact. Antenna 30 has an antenna body 31 and an antenna connection part 32.
[0036] The antenna body 31 is the middle portion of a single antenna 30. As shown in Figure 2, the antenna body 31 is located between the first antenna layer 21A and the second antenna layer 21B. In other words, the antenna body 31 is embedded in the first antenna layer 21A and the second antenna layer 21B. The antenna body 31 is located in the central portion 20C of the laminate 20 in the first direction d1. The central portion 20C is, for example, a portion within 5%, preferably within 3%, and more preferably within 1%, of the length of the laminate 20 in the first direction d1 from the center of the laminate 20 in the first direction d1. For example, the portion within 5% of the length of the laminate 20 in the first direction d1 from the center of the laminate 20 in the first direction d1 is the portion from the end of the laminate 20 in the first direction d1 to 45% or more and 55% or less of the length of the laminate 20 in the first direction d1.
[0037] Figure 3 is a plan view of the IC-equipped laminate 1, excluding the components located on the first side s1 in the first direction d1 from the antenna 30. In the example shown in Figure 3, the antenna body 31 is arranged to circle around the outer circumference of the laminate 20 multiple times.
[0038] The antenna connection section 32 is located near both ends of a single antenna 30. A single antenna 30 has two antenna connection sections 32. Each of the two antenna connection sections 32 extends from the antenna body 31 through different through holes 21C in the first antenna layer 21A and connects to a different conductive plate 35. The antenna connection section 32 is built into the first antenna layer 21A. The antenna connection section 32 connects the antenna body 31, located in the central section 20C, to the conductive plate 35. The antenna connection section 32 is welded to the conductive plate 35.
[0039] The antenna 30 is, for example, a copper wire covered with an insulator. The diameter of the antenna 30 is, for example, 0.08 mm or more and 0.12 mm or less.
[0040] The conductive plate 35 connects the antenna 30 and the IC module 10. At least a portion of the conductive plate 35 overlaps the through hole 21C. The antenna connection portion 32, which extends through the through hole 21C, connects to the conductive plate 35. The antenna connection portion 32 connects to the conductive plate 35 from near the antenna body portion 31, in other words, from the second side s2 in the first direction d1. The conductive plate 35 is connected to the conductive pad 15 of the IC module 10 via the anisotropic conductive film 18.
[0041] The laminate 20 has two conductive plates 35. The two conductive plates 35 are separated from each other. Each of the two conductive plates 35 connects a different antenna connection portion 32 to a different conductive pad 15 of the IC module 10.
[0042] The conductive plate 35 is a plate-shaped member. The length of the conductive plate 35 in the first direction d1 is, for example, 0.07 mm or more and 0.13 mm or less. The conductive plate 35 is made of, for example, copper.
[0043] Next, an example of a manufacturing method for the IC-equipped laminate 1 will be described.
[0044] As shown in Figure 4, a first antenna member 21X is prepared that includes portions that will become multiple first antenna layers 21A. In the following, we will consider the portion of the first antenna member 21X that will become one first antenna layer 21A after the manufacture of the IC-equipped laminate 1.
[0045] As shown in Figure 5, through holes 21C extending in the first direction d1 are provided in each portion of the first antenna layer 21A of the first antenna member 21X. In the example shown in Figure 5, two through holes 21C are provided. The through holes 21C are provided at positions corresponding to the positions where the IC module 10 will be placed in the manufactured laminate 20. The through holes 21C are provided, for example, by laser or die punching.
[0046] As shown in Figure 6, two conductive plates 35 are placed on the first side s1 in the first direction d1 of each portion of the first antenna layer 21A of the first antenna member 21X. The conductive plates 35 are positioned so that at least a portion of them overlaps the through hole 21C. In the illustrated example, the conductive plates 35 cover the entire through hole 21C.
[0047] As shown in Figure 7, the antenna 30 is positioned on the second side s2 in the first direction d1 of each portion of the first antenna layer 21A of the first antenna member 21X. Figure 8 is a plan view of the first antenna layer 21A shown in Figure 7, observed from the second side s2 in the first direction d1. First, one antenna connection portion 32 is pulled into one through hole 21C. Next, the antenna body portion 31 is positioned so as shown in Figure 8, making multiple turns along the outer circumference of the first antenna layer 21A. Then, the other antenna connection portion 32 is pulled into the other through hole 21C.
[0048] The antenna connection portion 32 is connected to the second side s2 of the first direction d1 of the conductive plate 35 via the through hole 21C, for example by welding.
[0049] As shown in Figure 9, a second antenna member 21Y, which includes portions that will become multiple second antenna layers 21B, is superimposed on a first antenna member 21X, which includes portions that will become multiple first antenna layers 21A, from the second side s2 in the first direction d1. The antenna body 31 is positioned between the portions that will become the first antenna layers 21A and the portions that will become the second antenna layers 21B. On the first antenna member 21X, from the first side s1 in the first direction d1, a first inner member 22X, which includes portions that will become multiple first inner layers 22A, a first core member 23X, which includes portions that will become multiple first core layers 23A, a first oversheet member 24X, which includes portions that will become multiple first oversheet layers 24A, a concealing member 25X, which includes portions that will become multiple concealing layers 25, and a pattern member 26X, which includes portions that will become multiple pattern layers 26 are superimposed in order. On the second antenna member 21Y, starting from the second side s2 in the first direction d1, the second inner member 22Y, which includes portions that will become multiple second inner layers 22B, the second core member 23Y, which includes portions that will become multiple second core layers 23B, and the second oversheet member 24Y, which includes portions that will become multiple second oversheet layers 24B are stacked in order. The magnetic recording section 29 is heat-transferred onto the first oversheet member 24X and the second oversheet member 24Y. Through the above process, a laminated member 20X is manufactured, which includes portions that will become multiple laminates 20. The laminated member 20X is called a multi-faceted sheet or multi-faceted sheet because multiple laminates 20 are provided on one surface before being punched out one by one.
[0050] The antenna body 31 is located in the center of the laminated member 20X in the first direction d1.
[0051] The laminated member 20X is heated while pressure is applied in the first direction d1. The pressure applied to the laminated member 20X is, for example, 10 kg / m 2 More than 30kg / m 2 The process is as follows: The laminated member 20X is heated, for example, to a temperature between 100°C and 150°C. After that, the laminated member is cooled. Each component contained in the laminated member 20X fuses together and becomes a single unit.
[0052] Multiple laminates 20 are punched out from the laminate member 20X using, for example, a metal blade, so that each laminate 20 has one antenna 30. Through the above process, a laminate 20 is produced having a first antenna layer 21A, a second antenna layer 21B, a first inner layer 22A, a second inner layer 22B, a first core layer 23A, a second core layer 23B, a first oversheet layer 24A, a second oversheet layer 24B, a concealing layer 25, a pattern layer 26, a magnetic recording section 29, an antenna 30, and a conductive plate 35, as shown in Figure 10.
[0053] As shown in Figure 11, a recess 20R is provided from the first side s1 in the first direction d1 at a position overlapping the through hole 21C of the laminate 20, in other words, at a position overlapping the conductive plate 35. The recess 20R is provided by a cutting device equipped with a cutting tool such as an end mill. When the recess 20R is formed, a part of the conductive plate 35 is exposed.
[0054] A portion of the recess 20R provided in the first antenna layer 21A may be provided at the same time as the through-hole 21C. Figure 10 shows a configuration in which a hole is provided between the two through-holes 21C in the first antenna layer 21A before the recess 20R is provided, but it is not limited to this configuration. The hole provided in Figure 10 is not required, and a hole may be formed between the through-holes 21C when providing the recess 20R.
[0055] An anisotropic conductive film 18 and an IC module 10 are placed in the recess 20R so as to cover the exposed conductive plate 35 from the first side s1 in the first direction d1. The conductive pads 15 of the IC module 10 are in contact with the anisotropic conductive film 18. By heating the IC module 10 while applying pressure to the laminate 20 in the first direction d1, the IC module 10 is bonded to the conductive plate 35 by the anisotropic conductive film 18. The anisotropic conductive film 18 becomes conductive in the first direction d1. The IC module 10 and the antenna 30 are connected via the anisotropic conductive film 18 and the conductive plate 35. Through the above steps, the IC module 10 is placed in the recess 20R, and an IC-equipped laminate 1 as shown in Figure 2 is manufactured.
[0056] For example, in a conventional IC-equipped laminate 101, such as the one shown in Figure 12 which is a dual interface card, the IC module 110 may be positioned on the laminate 120 by an anisotropic conductive film 118. The IC module 110 is exposed on the surface of the IC-equipped laminate 101 for contact communication. Because the anisotropic conductive film 118 is thin, the antenna 130 for contactless communication is positioned near the IC module 110, in other words, near the surface of the IC-equipped laminate 101, on the laminate 120. To put it another way, as shown in Figure 12, in a conventional IC-equipped laminate 101, the antenna 130 is positioned far from the center 120C in the first direction d1, which is the thickness direction of the laminate 120. When the antenna 130 is positioned far from the center 120C, the laminate 120 may warp when pressure is applied during the manufacturing process of the laminate 120.
[0057] In the laminate 20 of this embodiment, the antenna 30 has an antenna body portion 31 and an antenna connection portion 32. The antenna connection portion 32 extends from the antenna body portion 31 through the interior of the through hole 21C. Because the antenna connection portion 32 can extend close to the surface of the laminate 20, the antenna body portion 31 can be located in the central portion 20C in the first direction d1 of the laminate 20. Even if pressure is applied during the manufacturing process of the laminate 20, warping of the laminate 20 is suppressed.
[0058] Specifically, the central portion 20C where the antenna body 31 is located is within 5% of the length of the laminate 20 in the first direction d1, from the center of the laminate 20 in the first direction d1. By positioning the antenna body 31 within this range, warping of the laminate 20 is effectively suppressed.
[0059] The length of the laminate 20 in the first direction d1 is between 0.68 mm and 0.84 mm. Because the length of the laminate 20 in the first direction d1 is small, the laminate 20 is prone to warping when pressure is applied during the manufacturing process. By positioning the antenna body 31 at the central part 20C of the laminate 20 in the first direction d1, the effect of suppressing warping of the laminate 20 is sufficiently achieved.
[0060] The ratio of the area of the through-hole 21C to the area of the first antenna layer 21A in a plan view is between 0.05% and 4%. Even with the through-hole 21C provided, the strength of the first antenna layer 21A can be appropriately maintained, and even if the first antenna layer 21A deforms, the deformation is absorbed by the through-hole 21C, thus suppressing warping of the laminate 20. By using a through-hole 21C of an appropriate size, the antenna connection part 32 can be appropriately connected to the second side s2 in the first direction d1 of the conductive plate 35. By using a through-hole 21C of an appropriate size, when a recess 20R is provided in the laminate 20, it is suppressed that the connection between the antenna connection part 32 and the conductive plate 35 is severed by cutting equipment or the like, preventing the connection between the antenna connection part 32 and the conductive plate 35 from being cut away.
[0061] The antenna connection portion 32 connects to the conductive plate 35 from near the antenna body portion 31. In other words, the antenna connection portion 32 connects to the second side s2 of the conductive plate 35 in the first direction d1. The recess 20R is provided from the first side s1 in the first direction d1. When providing the recess 20R in the laminate 20, it is prevented that the connection between the antenna connection portion 32 and the conductive plate 35 is severed by cutting equipment or the like, for example, by cutting the portion where the antenna connection portion 32 and the conductive plate 35 are connected, such as a welded portion.
[0062] A recess 20R is provided in a position that overlaps with the through-hole 21C. At least a portion of the conductive plate 35 overlaps with the through-hole 21C. By positioning the IC module 10 in the recess 20R, it can be easily connected to the antenna 30 via the conductive plate 35.
[0063] An anisotropic conductive film 18 adheres the IC module 10 to the conductive plate 35. Because the anisotropic conductive film 18 is thinner than conductive paste, the laminate 20 can be made thinner.
[0064] The laminate 20 of this embodiment comprises a first antenna layer 21A having a through hole 21C extending in a first direction d1, a second antenna layer 21B superimposed on the first antenna layer 21A in the first direction d1, an antenna 30 having an antenna body portion 31 disposed between the first antenna layer 21A and the second antenna layer 21B, and an antenna connection portion 32 extending from the antenna body portion 31 through the inside of the through hole 21C, wherein the antenna body portion 31 is located in the central portion 20C of the laminate 20 in the first direction d1. With such a laminate 20, warping of the laminate 20 can be suppressed even if pressure is applied during the manufacturing process of the laminate 20.
[0065] The embodiments of this disclosure are not limited to those described above, but include various modifications that a person skilled in the art could conceive, and the effects of this disclosure are not limited to those described above. In other words, various additions, modifications, and partial deletions are possible, as long as they do not deviate from the conceptual idea and spirit of this disclosure derived from the claims and their equivalents. [Explanation of Symbols]
[0066] 1. Stacked body with IC 10 IC modules 11 circuit boards 12 IC chips 15 conductive pads 18 Anisotropic conductive film 20 Laminate 20C central part 20R recess 21A First antenna layer 21B Second Antenna Layer 21C through hole 22A First Inner Layer 22B Second Inner Layer 23A First Core Layer 23B Second Core Layer 24A First Oversheet Layer 24B Second Oversheet Layer 25 Concealment layer 26 Image Layers 26A Design 29 Magnetic recording section 30 Antennas 31 Antenna main body 32 Antenna connection section 35 Conductive Plate
Claims
1. A first antenna layer having a through hole extending in a first direction, A second antenna layer superimposed on the first antenna layer in the first direction, A laminate comprising an antenna having an antenna body portion disposed between the first antenna layer and the second antenna layer, and an antenna connection portion extending from the antenna body portion through the interior of the through hole, The antenna body is located in the central part of the laminate in the first direction, A laminate in which the ratio of the area of the through-hole to the area of the first antenna layer in a plan view is 0.05% or more and 4% or less.
2. The system further comprises a conductive plate in which at least a portion overlaps the through hole, The laminate according to claim 1, wherein the antenna connection portion is connected to the conductive plate from near the antenna body portion.
3. A first antenna layer having a through hole extending in a first direction, A second antenna layer superimposed on the first antenna layer in the first direction, A laminate comprising an antenna having an antenna body portion disposed between the first antenna layer and the second antenna layer, and an antenna connection portion extending from the antenna body portion through the interior of the through hole, The antenna body is located in the central part of the laminate in the first direction, The system further comprises a conductive plate in which at least a portion overlaps the through hole, The antenna connection portion is a laminate that connects to the conductive plate from near the antenna body.
4. The laminate according to claim 2 or 3, wherein a recess is provided at a position overlapping the through hole.
5. The laminate according to claim 4, The IC module arranged in the recess, A laminate with an IC, comprising an anisotropic conductive film for bonding the IC module to the conductive plate.
6. The laminate according to any one of claims 1 to 5, wherein the central portion is a portion within 5% of the length of the laminate in the first direction, from the center of the laminate in the first direction.
7. The laminate according to any one of claims 1 to 6, wherein the length of the laminate in the first direction is 0.68 mm or more and 0.84 mm or less.
8. A step of providing a through hole extending in a first direction in the first antenna layer, A step of placing a conductive plate on the first side of the first antenna layer in the first direction, The steps include: arranging the antenna on the second side of the first direction of the first antenna layer, The steps include: pulling the antenna connection portion of the antenna into the through hole; A method for manufacturing a laminate, comprising the step of connecting the antenna connection portion to the second side of the conductive plate in the first direction, A method for manufacturing a laminate, wherein the antenna body portion of the antenna is located in the central part of the laminate in the first direction.
9. The method for manufacturing a laminate according to claim 8, further comprising the step of providing a recess at a position overlapping the through hole.
10. A step of manufacturing a laminate by the method for manufacturing a laminate described in claim 9, A method for manufacturing an IC-equipped laminate, comprising the steps of: arranging the IC module in the recess so as to adhere it to the conductive plate with an anisotropic conductive film.