How to lift off a carrier board

Abstract

This invention provides a method for easily and reliably lifting off a carrier plate from a package. [Solution] The present invention provides a carrier plate lift-off method for obtaining a device by lifting off the carrier plate from a package 10 on which a device 40 is placed via an adhesive layer 30 on the upper surface of the carrier plate, the method comprising: a package preparation step of preparing a package having an overhang portion in which the outer circumference of the carrier plate extends beyond the device; and a carrier plate peeling step of bending the carrier plate and peeling it from the device by holding the device and supporting the lower surface of the carrier plate inside the overhang portion upward while pressing the upper surface of the overhang portion of the carrier plate downward.

Description

Technical Field

[0001] The present invention relates to a method for lifting off a carrier plate from a package formed by attaching a device to a carrier plate with an adhesive layer.

Background Art

[0002] As technologies for achieving higher density of semiconductor elements, FOWLP (Fan Out Wafer Level Package) and FOPLP (Fan Out Panel Level Package) have been proposed. In these technologies, a package (semiconductor package substrate) in which a plurality of devices are formed on a carrier plate is used. The carrier plate is a plate-like body made of glass, metal, ceramic, resin, etc. The devices include a wiring layer, a semiconductor chip, etc., and are covered with a mold such as resin.

[0003] In FOWLP, an adhesive layer with adhesiveness is provided on the carrier plate, a wiring layer is formed thereon, semiconductor chips are joined, and then resin molding is performed to produce a package. Then, the carrier plate is lifted off, that is, removed from the package.

[0004] For example, in Patent Document 1, after cutting and removing the outer peripheral side of the device of the package along the outer peripheral edge of the carrier plate, the carrier plate is lifted off from the device by pulling up the device while pressing the edge of the carrier plate downward.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] If the adhesive strength of the packaging's bonding layer is strong, simply pressing down on the edges of the carrier plate during lift-off may not be sufficient, as the applied force will be distributed throughout the entire package, making it difficult to detach. Furthermore, if the lifting force on the device is too strong, the device or carrier plate may be damaged.

[0007] Furthermore, during liftoff, the forces holding the carrier plate in place and the forces pulling the device up are suddenly released, causing the adhesive layer to peel off instantly, potentially damaging the device or carrier plate.

[0008] The present invention aims to provide a method for easily and reliably lifting off a carrier plate from a package. [Means for solving the problem]

[0009] The carrier plate lift-off method of the present invention is: A method for lifting off a carrier plate to obtain a device from a package in which a device is placed on the upper surface of the carrier plate via an adhesive layer, wherein the carrier plate is lifted off the package, A package preparation step of preparing a package having an overhang portion where the outer circumference of the carrier plate protrudes from the device, A carrier plate peeling step is performed in which, while holding the device, the carrier plate is bent and the carrier plate is separated from the device by supporting the lower surface of the carrier plate, which is inside the protruding portion of the carrier plate, upward, and pressing the upper surface of the protruding portion of the carrier plate downward, thereby supporting the carrier plate and separating the carrier plate from the device. Includes.

[0010] The carrier plate peeling step is, While holding the device, the upper surface of the protruding portion is designated as the first pressing portion, and the lower surface of the carrier plate, which is inside the first pressing portion, is designated as the first support position. By supporting the first support position upward and pressing the first pressing portion downward, the carrier plate flexes on the side of the first pressing portion with the first support position as the fulcrum, and the carrier plate detaches from the device from a first detachment start position near the first pressing portion. Furthermore, by moving the first support position away from the first pressing portion while pressing the first pressing portion downward, the carrier plate flexes further on the side of the first pressing portion, and the detachment of the carrier plate from the device is advanced, thus forming a first carrier plate detachment process.

[0011] The carrier plate peeling step is, In the first carrier plate peeling step, after the first support position has moved to the center of the package, The process may include a second carrier plate peeling step in which, while holding the device, the upper surface of the protruding portion is designated as the second pressing portion at a position on the package opposite to the first pressing portion, the lower surface of the carrier plate inside the second pressing portion is designated as the second support position, and the second pressing portion is pressed downward while supporting the second support position upward, causing the carrier plate to bend on the second pressing portion side with the second support position as a fulcrum, and the carrier plate peels away from the device from a second peeling start position near the second pressing portion. Furthermore, while pressing the second pressing portion downward, the second support position is moved away from the second pressing portion, causing the carrier plate to bend further on the second pressing portion side, further peeling the carrier plate from the device, and as the second support position moves to the center of the package, the carrier plate is completely peeled away from the device.

[0012] The package preparation step may include a device cutting step in which the outer circumference of the device is cut along the inside of the outer edge of the carrier plate, and the portion outside the cut portion is the protruding portion.

[0013] After the package preparation step and before the carrier plate peeling step, The process may include forming a starting point at the first peeling initiation position, in which the adhesive strength of the adhesive layer is weakened to facilitate the peeling process.

[0014] The starting point formation step can be performed by inserting a starting point forming tool with a sharp tip between the device and the carrier plate to form the starting point.

[0015] The first carrier plate peeling step can support the carrier plate with a roller body that can roll on the lower surface of the carrier plate.

[0016] The aforementioned package is rectangular, In the first carrier plate peeling step, the corner of the protruding portion can be used as the first pressing portion.

[0017] The aforementioned package is rectangular, In the first carrier plate peeling step, the corner of the protruding portion and the two sides on the left and right of the corner can be used as the first pressing portion.

[0018] The aforementioned package is rectangular, In the first carrier plate peeling step, one side of the protruding portion can be designated as the first pressing portion.

[0019] Furthermore, the lift-off device of the present invention is A lift-off device for obtaining a device from a package in which a device is placed on the upper surface of a carrier plate via an adhesive layer, by lifting off the carrier plate, A holding means for holding the device, The package has an overhang portion where the outer circumference of the carrier plate extends beyond the device, and a pressing means that presses the upper surface of the overhang portion as a pressing part, A support means that supports the lower surface of the carrier plate, which is inside the pressing portion, in an upward direction, and provides support at the support position. Includes, By pressing the pressing portion downward with the pressing means, the carrier plate is bent with the support position supported by the support means as a fulcrum, and the pressing portion side is bent, and the carrier plate is peeled off from the device from the peeling start position near the pressing portion. Further, in a state where the pressing means presses the pressing portion downward, the support means moves the support position on the lower surface of the carrier plate in a direction away from the pressing portion from the support position, so that the pressing portion side of the carrier plate is bent and the peeling of the carrier plate from the device progresses.

Effect of the Invention

[0020] According to the method of the present invention, while supporting a part of the lower surface of the carrier plate, by pressing from above, the carrier plate is bent to peel the carrier plate from the device, and lift-off is performed. When bending the carrier plate, since the carrier plate is supported from the lower surface side, the carrier plate will not be peeled off instantly, and damage to the device and the carrier plate during lift-off can be reduced.

Brief Description of the Drawings

[0021] [Figure 1] FIG. 1 is a flowchart showing the lift-off process of a carrier plate according to an embodiment of the present invention. [Figure 2] FIG. 2 is a cross-sectional view of the package [Figure 3] FIG. 3 is an explanatory diagram showing the lift-off process. [Figure 4] FIG. 4 is an explanatory diagram showing the (C) starting point forming process. [Figure 5] FIG. 5 is an explanatory diagram showing the (D) carrier plate peeling process. [[ID=X]] <000XX0X> [Figure 6] FIG. 6 is a plan view of FIG. 5(b). [Figure 7] FIG. 7 is an explanatory diagram showing the carrier plate peeling process following FIG. 5. [Figure 8] FIG. 8 is an explanatory diagram showing another embodiment of the (D) carrier plate peeling process. [Figure 9]Figure 9 is an explanatory diagram showing yet another embodiment of the (D) carrier plate peeling process. [Modes for carrying out the invention]

[0022] The following description will detail one embodiment of the present invention with reference to the drawings. Note that the dimensions, particularly the thickness, are exaggerated in the drawings for ease of understanding.

[0023] The present invention relates to a method for lifting off, or removing, a carrier plate 20 from a package 10 in which a device 40 is formed on the carrier plate 20.

[0024] As one embodiment, the method of the present invention can be configured to include (A) a package preparation step, (B) an outer periphery mold removal step, (C) a starting point formation step, and (D) a carrier plate peeling step, as shown in Figure 1.

[0025] (A) The package preparation step is a step of forming an overhang portion of the carrier plate 20 that protrudes from the outer periphery of the device 40 of the package 10. In this embodiment, the package preparation step is a device cutting step in which an incision is made on the device 40 side of the package 10 that reaches the carrier plate 20 and cuts the device 40. (B) The outer periphery mold removal step is a step of removing a part of the mold 43 on the outer edge of the cut device 40. (C) The starting point formation step is a step of creating a starting point that will serve as a trigger to make it easier to peel off the carrier plate 20. (D) The carrier plate peeling step is a step of bending the carrier plate 20 and lifting off the carrier plate 20 from the device 40. Note that the present invention can lift off the carrier plate 20 by including at least steps (A) and (D).

[0026] First, we will explain the structure of package 10, and then we will explain each of the above processes.

[0027] <Package 10> Figure 2 is a cross-sectional view of a package 10 according to one embodiment of the present invention. The package 10 has an adhesive layer 30 on the upper surface of a carrier plate 20, and a device 40 is formed on the adhesive layer 30. Note that the package 10 of this embodiment is just one example, and the present invention is not limited to the structure described herein, as long as the package 10 has a device 40 attached to the carrier plate 20 via an adhesive layer 30.

[0028] The carrier plate 20 can be made of a plate-like material such as glass, ceramic, resin, silicon, or metal, but is not limited to these. The carrier plate 20 only needs to have sufficient rigidity to withstand the formation of the device 40 and delamination from the device 40, and its thickness is appropriately determined depending on the material. The thickness of a typical carrier plate 20 is 2 mm or less.

[0029] The carrier plate 20 is typically rectangular or circular in shape, with rectangular plates often measuring 600mm square or less. Circular plates are often measuring 300mm in diameter or less. Of course, the shape and dimensions of the carrier plate 20 are not limited to these.

[0030] An adhesive layer 30 is formed on the upper surface of the carrier plate 20. The adhesive layer 30 is formed in one or multiple layers using a metal film, an insulating film, an adhesive resin, etc. The adhesive layer 30 is formed over the entire or nearly entire surface of the carrier plate 20 and has sufficient adhesive strength to hold the device 40 on the carrier plate 20. On the other hand, when peeling and removing the carrier plate 20 from the device 40, it is preferable to use an adhesive layer 30 that does not damage the device 40 and leaves as little residue of the device 40 as possible. The thickness of the adhesive layer 30 is generally 0.02 mm or less, but is not limited to this.

[0031] Additionally, an extra coating layer can be placed between the carrier plate 20 and the adhesive layer 30, or between the adhesive layer 30 and the device 40.

[0032] As shown in Figure 2, the device 40 has a configuration that includes, for example, a wiring layer 41, a semiconductor chip 42, a mold 43, and the like. The wiring layer 41 is a redistribution layer (RDL) or an RDL interposer, and is formed on the carrier plate 20. The wiring layer 41 can be provided, for example, by repeatedly forming a resist on the carrier plate 20, performing copper plating, and then peeling off the resist to form an insulating layer.

[0033] One or more semiconductor chips 42 are placed on the wiring layer 41 and bonded together, and then covered with a mold 43 made of resin or the like to obtain a package 10 in which the device 40 is provided on the carrier plate 20, as shown in Figure 2. The device 40 is generally 4 mm or less in thickness, but is not limited to this.

[0034] The mold 43 can be applied to cover the entire or nearly entire surface of the carrier plate 20. Figure 3(a) is a plan view of the package 10. In the illustration, the mold 43 is formed leaving the outer perimeter of the carrier plate 20 untouched. If the outer perimeter of the carrier plate 20 extends beyond the device 40, the device cutting step in the package preparation step (A) and the outer perimeter mold removal step (B) can be omitted.

[0035] Furthermore, in the carrier plate peeling process (D) described later, the package 10 needs to adsorb and hold the upper surface of the device 40. For this reason, it is preferable to polish the device 40 so that the surface of the mold 43 becomes flat.

[0036] <Lift-off method> Then, the carrier plate 20 is lifted off the device 40 from the fabricated package 10. Below, we will describe a square package 10 as shown in Figure 3.

[0037] The lift-off method may include the four steps shown in Figure 1: (A) package preparation step (device cutting step), (B) outer periphery mold removal step, (C) starting point formation step, and (D) carrier plate peeling step.

[0038] (A) Package preparation process (device cutting process) The package preparation step is a step of forming a pressing portion for pushing the carrier plate 20 downward in order to lift off the carrier plate 20. If the outer circumference of the carrier plate 20 has an overhang portion that extends beyond the device 40, the package preparation step is completed and the device cutting step can be omitted. If the carrier plate 20 does not have an overhang portion, or if there is an overhang portion but it is too narrow to press, a step is performed to form a cut 45 that reaches the carrier plate 20 on the outer circumference of the unnecessary part of the device 40 prior to lift-off. The device cutting step is also called the dicing step. In this embodiment, the device cutting step is described as essential, but if the area corresponding to reference numeral 47 in Figure 3(c) has already been formed on the carrier plate 20 in the package preparation step (A), the device cutting step is unnecessary.

[0039] In the device cutting process, the outer circumference of the device 40 is cut along the inside of the outer edge of the carrier plate 20, as shown by the dashed line 45a in Figure 3(a), to form a notch 45 in the device 40. The notch 45 can be formed using a rotary blade or a cutter. The left side of Figure 3(b) is a plan view of the package 10 with the notch 45 formed, and the right side is a cross-sectional view along line bb. In this embodiment, since the package 10 is square, the notch 45 is formed along the edge of the carrier plate 20. If the package is circular, the notch will be circular. The depth of the notch 45 is at least deep enough to cut the device 40, preferably deep enough to cut the adhesive layer 30 as well.

[0040] (B) Outer edge mold removal process The outer periphery mold removal step is a step in which, if the device cutting step (A) is performed, unnecessary mold portion 43a of the cut device 40 is removed. To reiterate, if the area corresponding to reference numeral 47 in Figure 3(c) is already formed on the carrier plate 20 in the package preparation step (A), the device cutting step is unnecessary, and this step is also unnecessary.

[0041] The outer perimeter mold removal process involves removing the obstructing mold portion 43a to form a region 47 that will serve as a path for the starting point forming tool 50 (see Figure 4), in order to create a starting point 46 for inserting the starting point forming tool 50 (see Figure 4) in the subsequent starting point forming process (C). Note that if the carrier plate 20 can be lifted off by the carrier plate peeling process (D), these processes are unnecessary, even if the outer perimeter mold removal process (B) and the starting point forming process (C) are not performed.

[0042] In this embodiment, in the carrier plate peeling step (D), the carrier plate 20 is lifted off by pushing it downward from opposing corners 11 of the package 10, as shown in Figures 3(e) and 4. Therefore, the starting point 46 is the corner 11. Consequently, the obstructing mold portion is the part labeled 43a in Figure 3(b). Note that the starting point 46 is not limited to the corner 11, but may be formed on any side or opposing side (see Figure 9).

[0043] The obstructive mold portion 43a can be removed by cutting or other means. Figure 3(c) is a plan view of the package 10 after the obstructive mold portion 43a has been removed. The area from which the mold portion 43a has been removed is indicated by reference numeral 47.

[0044] (C) Starting point formation process The starting point formation step, as shown in Figures 3(d) and 4, is the step of forming a starting point 46 that serves as a trigger for lifting off the carrier plate 20. The starting point 46 is a portion where the adhesive strength has been weakened by temporarily peeling off the adhesive layer 30 that adheres the carrier plate 20 and the device 40, so that peeling can be performed smoothly in the next (D) carrier plate peeling step, and it becomes the starting position for peeling off the carrier plate 20. As described above, in this embodiment, the starting point 46 is formed at the corner 11.

[0045] Figure 4 is an explanatory diagram of the (C) starting point formation process. The starting point 46 can be formed using a starting point forming tool 50 with a sharp tip, such as a metal cutting tool, knife, chisel, needle, or spatula made of steel. The starting point forming tool 50 shown is a chisel-shaped cutting tool.

[0046] First, when forming the starting point 46 with the starting point forming tool 50, the carrier plate 20 is held in place to prevent the package 10 from moving. For example, as shown in Figure 4(a), the carrier plate 20 can be held in place by vacuum suction using a suction unit 60 that has a vacuum suction function.

[0047] In this state, as shown by the arrow in Figure 4(a), the starting point forming tool 50 is brought close to the package 10, and as shown in Figure 4(b), the starting point forming tool 50 is brought close to the package 10 from the direction of arrow P in the area 47 where the obstructing mold portion 43a has been removed. Then, as shown in Figure 4(c), the starting point forming tool 50 is inserted between the carrier plate 20 and the device 40, in the illustration, between the adhesive layer 30 and the device 40. The insertion amount of the starting point forming tool 50 is preferably about 0.5 mm to 10 mm, and the insertion speed is preferably about 15 mm / s to 50 mm / s. This creates an opportunity for the carrier plate 20 and the device 40 to separate, and this opportunity becomes the starting point 46 of separation in the next step (D) carrier plate separation step, i.e., the separation start position.

[0048] As shown in Figure 4(b), if the starting point forming tool 50 has a rectangular tip, instead of inserting it straight into the device 40, inserting it from the corner of the device 40 with the tip angled as shown in the figure allows the starting point forming tool 50 to penetrate successfully between the device 40 and the adhesive layer 30. Preferably, the insertion angle α is 0° to 45°. If the carrier plate 20 is a glass substrate, an insertion angle α of 5° or less is preferable to prevent cracking of the carrier plate 20.

[0049] Furthermore, it is preferable to bring the starting point forming tool 50 close to the edge of the device 40 so that it slides along the adhesive layer 30, and to insert the starting point forming tool 50 at a certain degree of inclination rather than parallel to the adhesive layer 30. The tilt angle β of the starting point forming tool 50 is preferably between 0° and 45°.

[0050] Then, by inserting the starting point forming tool 50 between the carrier plate 20 and the device 40, or between the adhesive layer 30 and the device 40 in the figure, a starting point 46 is formed where the adhesive force between the carrier plate 20 and the device 40 is weakened. Note that in Figure 3(d), etc., the starting point 46 is shown in color, but in reality the starting point 46 is on the underside of the device 40 and is not visible in the plan view.

[0051] (D) Carrier plate peeling process Next, the carrier plate 20 is lifted off from the device 40. As shown in Figures 5 and 6, in this invention, the carrier plate 20 is lifted off by supporting its lower surface upward and pressing the pressing portion 23 on the outer circumference of the starting point 46 downward, with the support position 24 acting as the fulcrum and the pressing portion 23 as the point of force, causing the carrier plate 20 to bend. Figure 5 is a view of Figure 6 in the direction of arrow N.

[0052] The lift-off can be performed by a lift-off device that includes a holding means 70 for the device 40, a pressing means 80 for pressing the upper surface of the carrier plate 20 downward, and a support means 90 for supporting the lower surface of the carrier plate 20 upward.

[0053] The holding means 70 for the device 40 is, for example, a suction unit or suction pad having a vacuum suction function. The holding means 70 holds the upper surface of the device 40.

[0054] The pressing means 80 has a rod-shaped or plate-shaped pressing member 81. The pressing member 81 shown in the figure is rod-shaped. The pressing member 81 presses downward on the upper surface of the carrier plate 20 outside the cutout 45, in the region 47 from which the obstructing mold portion 43a has been removed. The upper surface of the carrier plate 20 pressed by the pressing member 81 is referred to as the pressing portion 23. If the outer peripheral mold removal process in (B) is not performed, the pressing portion 23 becomes the upper surface of the obstructing mold portion 43a of the device 40. Also, if an overhang portion that extends beyond the device 40 is formed on the carrier plate 20 in the package preparation process in (A), the upper surface of the carrier plate 20 corresponding to the overhang portion becomes region 47.

[0055] The pressing means 80 can include a cylinder or actuator and pushes the pressing portion 23 downward Q with a predetermined pressing force. The downward movement amount of the pressing means 80 is referred to as the amount of indentation.

[0056] The support means 90 has a support member 91 that supports the lower surface of the carrier plate 20 in an upward direction. The support member 91 supports the carrier plate 20 from below at a position inside the pressing portion 23. While supporting the lower surface of the carrier plate 20 in an upward direction, the support member 91 is capable of moving its support position 24 in a direction away from the pressing portion 23 in accordance with the amount of pressure applied by the pressing means 80. For example, the support member 91 is a rotatable roller body that is pressed against the lower surface of the carrier plate 20 and moves in a direction R away from the pressing portion 23. In this embodiment, the pressing portion 23 is a corner portion 11, and as shown in Figure 6, the support member 91 is configured to move along the diagonal line towards a corner portion 11a located diagonally opposite to the corner portion 11, as indicated by the arrow R, and the length of the roller body is longer than the diagonal of the carrier plate 20.

[0057] Then, as shown in Figures 5(a) and 6, the support member 91 is placed against the lower surface of the carrier plate 20 while the upper surface of the device 40 is held by the holding means 70. The support member 91 is positioned slightly inward from the pressing portion 23 and perpendicular to the diagonal line connecting the corners 11 and 11a. The initial position of the support member 91 is preferably about 10 mm to 100 mm from the corner 11.

[0058] Next, as shown in Figure 5(b), the pressing portion 23 (outside the notch 45) on the upper surface of the device 40 is pressed downward Q by the pressing member 81. As a result, the carrier plate 20 flexes with the support position 24 as the fulcrum and the pressing portion 23 as the point of force application. In this embodiment, the starting point 46 weakens the adhesive force of the adhesive layer 30 that adheres the carrier plate 20 and the device 40, so peeling can easily begin with the starting point 46 as the peeling start position.

[0059] While pressing the pressing portion 23 with the pressing member 81, the support member 91 is moved diagonally away from the pressing portion 23, as shown by the arrow R in Figures 5(c) and 6. This causes the support position 24 of the support member 91 to move away from the pressing portion 23, causing the carrier plate 20 to bend further and the peeling of the carrier plate 20 to progress. The amount of pressure applied by the pressing member 81 is preferably about 0.5 mm to 10 mm after it makes contact with the carrier plate 20.

[0060] Then, by moving the support member 91 to the corner 11a facing the pressing portion 23, the carrier plate 20 can be completely detached from the device 40.

[0061] Furthermore, if the distance between the pressing portion 23 and the support position 24 becomes long, the deflection of the carrier plate 20 will increase, potentially causing the carrier plate 20 to break or fracture. In this case, the support member 91 should not be moved to the opposing corners of the carrier plate 20, but rather to approximately the center of the carrier plate 20, so that the opposite side or corner facing the pressing portion 23 becomes the pressing portion when the carrier plate 20 is partially detached.

[0062] Specifically, the carrier plate peeling process is defined as follows: the process described above is designated as the first carrier plate peeling process, the initial pressing part is designated as the first pressing part 23, the opposing pressing part as the second pressing part 23a, the initial support position as the first support position 24, the support position on the opposite side as the second support position 24a, and the starting point 46 as the first peeling start position. The second carrier plate peeling process, following the first carrier plate peeling process shown in Figure 5(c), is as shown in Figure 7. That is, the pressing force of the pressing member 81 that was pressing the first pressing part 23 is released, and the support member 91 is moved to the opposite side or corner, which is shown on the right in the figure, as shown in Figure 7(a). The position where the support member 91 contacts the carrier plate 20 is the second support position 24a, and the starting point 46 on the right in the figure is the second peeling start position. Note that on the left side, the adhesive layer 30 between the carrier plate 20 and the device 40 has already been peeled off, but the carrier plate 20 is on a flat surface due to the restoring force. The areas where the adhesive layer 30 has peeled off are indicated by the thick lines 31 in the figure.

[0063] From this state, as shown in Figure 7(b), while the pressing member 81 pushes down the second pressing portion 23a in a downward Q' direction when it is in the position opposite the first pressing portion 23, the support member 91 is moved in a direction R' away from the second pressing portion 23a, as shown in Figure 7(c), causing the carrier plate 20 to bend with the second support position 24a as the fulcrum and the second pressing portion 23a as the point of force application, and the carrier plate 20 separates from the device 40.

[0064] Then, the support member 91 moves the pressing member 81 and the support member 91 to the center of the carrier plate 20, and once it connects to the left half where the peeling was performed earlier, the peeling is complete and the carrier plate 20 can be lifted off from the device 40, as shown in Figure 3(e).

[0065] The device 40, from which the carrier board 20 has been lifted off, is divided into multiple device chips as needed and mounted on substrates for various electronic devices.

[0066] <(D) Other embodiments of the carrier plate peeling process> If the pressing portion 23 is at the corner of the device 40, the support member 91 will move, and if the distance between the pressing portion 23 and the support position 24 increases, the deflection of the carrier plate 20 will increase, potentially causing the carrier plate 20 to break. Therefore, as shown in Figure 8(a), the pressing member 81a can be made into an L-shaped bar, the bent portion 82 of the pressing member 81a can be aligned with the starting corner 11, and the two bar members 83, 83 extending from the bent portion 82 can be aligned along the two sides 12, 12 that sandwich the corner 11 of the device 40 to cause separation.

[0067] More specifically, with the support member 91 supporting the lower surface of the carrier plate 20 inside the corner 11, the pressing member 81a is brought closer to the device 40, as shown in Figure 8(b). At this time, the pressing member 81a is moved downward so that the bent portion 82 contacts the corner 11 of the device 40, and the bar members 83, 83 are at an angle, with the bent portion 82 making the first contact with the device 40. As a result, as shown in Figure 8(c), the carrier plate 20 bends with the support position 24 by the support member 91 as the fulcrum and the pressing member 81a as the point of force application, and separates from the device 40.

[0068] Then, while moving the pressing member 81a downwards, the support position 24 of the support member 91 is moved to the inner circumference side of the carrier plate 20. As a result, as shown in Figure 8(d), the pressing member 81a causes the bar member 83 to press against the side 12 of the carrier plate 20. At this time, the bent portion of the carrier plate 20 makes surface contact with the bar member 83 while remaining straight. Therefore, the pressing portion 23 is the entire contact area with the bar member 83, but the strongest force is applied to the proximal portion of the contact area that is closest to the support position 24. Since this proximal portion becomes the point of force application, the distance from the support position 24, which acts as the fulcrum, can be kept approximately constant. In addition, the deflection angle of the carrier plate 20 is limited to the inclination angle of the bar member 83. Therefore, the carrier plate 20 does not bend excessively, and damage to the carrier plate 20 due to bending can be reduced.

[0069] Preferably, as shown in Figure 8(d), when the planar movement distance of the support member 91 is X, and as shown in Figures 8(c) and (d), when the vertical movement distance is Z-Z', the inclination γ of the pressing member 81a (Figure 8(b)) is made to coincide with (Z-Z') / X. This makes it possible to keep the distance between the fulcrum (support position 24) and the point of force application (pressing part 23) constant, and to allow peeling to proceed with a constant force.

[0070] In this embodiment as well, the support member 91 is moved to approximately the center of the carrier plate 20, and with the carrier plate 20 partially peeled off, it presses against the opposite corner 11a, while simultaneously moving the support member 91 to the opposite side to further peel it off. In this case, the initial pressing point becomes the first pressing point 23, and the pressing point on the opposite side becomes the second pressing point 23a. Also, the initial support position becomes the first support position 24, and the support position on the opposite side becomes the second support position 24a.

[0071] In the above embodiments, the corners 11 of the square package 10 are pressed or the pressing is performed from the corners 11a. However, as shown in Figure 9, one side 13 of the package 10 may also be pressed. In this case, the starting point 46 should be formed along one side 13, rather than at a corner. Furthermore, the pressing member can be a member 81b that is long in the width direction.

[0072] Furthermore, in the embodiment shown in Figure 9, the pressing members 81b may be arranged parallel to each other with respect to the starting point 46, and the lift-off may be performed by pressing them so that the starting point 46 side contacts the carrier plate 20 first, as in the embodiment shown in Figure 8.

[0073] In these embodiments, a square package 10 is used in all cases, but the present invention can also lift off the carrier plate 20 with a circular package. For example, in the embodiments of Figures 5 to 7, a part of the outer circumference of the circular package, and in the embodiment of Figure 8, the outer circumference arc or a semicircle of the outer circumference can be pressed to form the pressing area.

[0074] Furthermore, if the adhesive layer 30 is made of a material whose adhesive strength decreases with heating, the pressing member 81, support member 91, holding means 70, etc. can be heated to reduce the adhesive strength of the adhesive layer 30, thereby making lift-off easier.

[0075] The above description is for the purpose of explaining the present invention and should not be interpreted as limiting or restricting the scope of the invention described in the claims. Furthermore, it goes without saying that the configuration of each part of the present invention is not limited to the above embodiments and can be modified in various ways within the technical scope described in the claims.

[0076] In this specification, the pressing member 81 presses the pressing portion 23 downward, and the support member 91 supports the carrier plate 20 upward. However, the device 40 may be positioned with its bottom surface and the carrier plate 20 with its top surface; in this case, the top and bottom directions can be reversed. Furthermore, the device 40 and the carrier plate 20 can be positioned vertically for lift-off, in which case the pressing and supporting directions become lateral. The present invention is also implementable in these directions and falls within the technical scope of the present invention. [Examples]

[0077] <Example 1> Package 10, shown in Table 1, was fabricated.

[0078] [Table 1]

[0079] After performing (A) a device cutting process (package preparation process) and (B) an outer periphery mold removal process on this package 10, (C) a starting point formation process and (D) a carrier plate peeling process were carried out under the following conditions using the equipment configured as shown in Table 1.

[0080] In the starting point formation process (C), the insertion angle α of the starting point forming tool 50 shown in Figure 4 is 0°, the tilt angle β is 15°, and the insertion amount is 2 mm.

[0081] In the carrier plate peeling process (D), an L-shaped pressing member 81a shown in Figure 8 was used, and the support member 91 was a roller body. The inclination γ of the pressing member 81a was 2.9°, the amount of pressing (Z-Z') of the pressing member 81a was 2 mm, and the initial position of the support member 91 was 40 mm from the corner 11.

[0082] As a result of the above, the starting point 46 was formed by the starting point formation process (C), and the carrier plate 20 was lifted off from the device 40 by the carrier plate peeling process (D).

[0083] <Example 2> Package 10, shown in Table 2, was prepared.

[0084] [Table 2]

[0085] For this package 10, following the same procedure as in Example 1, (A) device cutting process (package preparation process) and (B) outer periphery mold removal process were performed, and then (C) starting point formation process and (D) carrier plate peeling process were carried out under the following conditions using the equipment configured as shown in Table 2.

[0086] In the starting point formation process (C), the insertion angle α of the starting point forming tool 50 shown in Figure 4 is 15°, the tilt angle β is 15°, and the insertion amount is 3 mm.

[0087] In the carrier plate peeling process (D), an L-shaped pressing member 81a shown in Figure 8 was used, and the support member 91 was a roller body. The inclination γ of the pressing member 81a was 4.3°, the amount of pressing (Z-Z') of the pressing member 81a was 3 mm, and the initial position of the support member 91 was 40 mm from the corner 11.

[0088] As a result of the above, the starting point 46 was formed by the starting point formation process (C), and the carrier plate 20 was lifted off from the device 40 by the carrier plate peeling process (D). [Explanation of symbols]

[0089] 10 packages 11 corners 11a Corner 20 Carrier board 23 Pressing part 24 Support position 30 Adhesive layer 40 devices 45 cuts 46 Starting point 50 Starting point forming tool 60 Adsorption Units 70 Retention means 80 Pressing means 81 Pressing member 90 Support means 91 Support member

Claims

1. A method for lifting off a carrier plate to obtain a device from a package in which a device is placed on the upper surface of the carrier plate via an adhesive layer, wherein the carrier plate is lifted off the package, A package preparation step of preparing a package having an overhang portion where the outer circumference of the carrier plate protrudes from the device, A carrier plate peeling step is performed in which, while holding the device, the carrier plate is bent and the carrier plate is separated from the device by supporting the lower surface of the carrier plate, which is inside the protruding portion of the carrier plate, upward, and pressing the upper surface of the protruding portion of the carrier plate downward, thereby supporting the carrier plate and separating the carrier plate from the device. A method for lifting the carrier board off the package, including how to do so.

2. The carrier plate peeling step is, This is a first carrier plate peeling process in which, while holding the device, the upper surface of the protruding portion is designated as the first pressing portion, and the lower surface of the carrier plate, which is inside the first pressing portion, is designated as the first support position. While supporting the first support position upward, the first pressing portion is pressed downward, causing the carrier plate to bend on the side of the first pressing portion with the first support position as the fulcrum, and the carrier plate peels away from the device from a first peeling start position near the first pressing portion. Furthermore, while pressing the first pressing portion downward, the first support position is moved away from the first pressing portion, causing the carrier plate to bend further on the side of the first pressing portion, and the peeling of the carrier plate from the device progresses. A method for lifting off a carrier plate from the package described in claim 1.

3. The carrier plate peeling step is, In the first carrier plate peeling step, after the first support position has moved to the center of the package, The process includes a second carrier plate peeling step in which, while holding the device, the upper surface of the protruding portion is designated as the second pressing portion at a position on the package opposite to the first pressing portion, the lower surface of the carrier plate inside the second pressing portion is designated as the second support position, and the second support position is supported upward while the second pressing portion is pressed downward, causing the carrier plate to bend on the second pressing portion side with the second support position as the fulcrum, and the carrier plate peels away from the device from a second peeling start position near the second pressing portion, and further, while pressing the second pressing portion downward, the second support position is moved away from the second pressing portion, causing the carrier plate to bend further on the second pressing portion side, further peeling the carrier plate from the device, and as the second support position moves to the center of the package, the carrier plate is completely peeled away from the device. A method for lifting off a carrier plate from the package described in claim 2.

4. The package preparation step includes a device cutting step of cutting the outer periphery of the device along the inner edge of the outer periphery of the carrier plate, wherein the portion outside the cut portion becomes the protruding portion. A method for lifting off a carrier plate from the package described in claim 2.

5. After the package preparation step and before the carrier plate peeling step, The process includes forming a starting point at the first peeling initiation position, in which the adhesive strength of the adhesive layer is weakened to facilitate peeling, A method for lifting off a carrier plate from the package described in claim 2.

6. The starting point formation step involves forming the starting point by inserting a starting point forming tool with a sharp tip between the device and the carrier plate. A method for lifting off a carrier plate from the package according to claim 5.

7. The first carrier plate peeling step involves supporting the carrier plate with a roller body that can roll against the lower surface of the carrier plate. A method for lifting off a carrier plate from the package described in claim 2.

8. The aforementioned package is rectangular, The first carrier plate peeling step involves using the corner of the protruding portion as the first pressing portion. A method for lifting off a carrier plate from the package described in claim 2.

9. The aforementioned package is rectangular, The first carrier plate peeling step involves using the corner of the protruding portion and the two sides on either side of the corner as the first pressing portion. A method for lifting off a carrier plate from the package described in claim 2.

10. The aforementioned package is rectangular, The first carrier plate peeling step involves using one side of the protruding portion as the first pressing portion. A method for lifting off a carrier plate from the package described in claim 2.

11. A lift-off device for obtaining a device from a package in which a device is placed on the upper surface of a carrier plate via an adhesive layer, by lifting off the carrier plate, A holding means for holding the device, The package has an overhang portion where the outer circumference of the carrier plate extends beyond the device, and a pressing means that presses the upper surface of the overhang portion as a pressing part, A support means that supports the lower surface of the carrier plate, which is inside the pressing portion, in an upward direction, and provides support at the support position. Includes, The pressing means presses the pressing portion downward, causing the carrier plate to flex on the side of the pressing portion, with the support position supported by the support means acting as a fulcrum, and the carrier plate detaches from the device from the detachment initiation position near the pressing portion. Furthermore, while the pressing means is pressing the pressing portion downward, the support means moves the support position on the lower surface of the carrier plate away from the support position relative to the pressing portion, causing the carrier plate to flex on the side of the pressing portion and accelerating the detachment of the carrier plate from the device. Lift-off device.

Images