Antenna modules and communication devices

Abstract

The present application provides an antenna module and a communication device. The antenna module includes a radiating element, a ground element, and a feeding element. The feeding element is a transmission line structure formed on an insulating support. The feeding element includes a feeding transmission portion and a grounding portion. The feeding transmission portion and the grounding portion have unequal widths and are configured to achieve current balance of the antenna module.

Description

Technical Field

[0001] [Technical Field] The present invention relates to the field of network communication technology, and particularly to an antenna module and a communication device.

Background Art

[0002] In a MIMO system, that is, a multiple-input multiple-output system, a plurality of transmission antennas and reception antennas are arranged, and specific data processing is performed to increase the communication capacity, thereby meeting the increasing communication service requirements. In a communication device, it is necessary to connect a plurality of antenna elements to a radio frequency chip on a main board via a power supply cable. The power supply cable is configured to supply power to the antenna elements. The power supply cable not only makes the internal space of the communication device messy, but also requires high processing accuracy to assemble and fix the power supply cable. As a result, it is difficult to reduce the cost of the communication device.

[0003] Therefore, how to ensure the antenna radiation performance Assuming that and realize a cable-free design in the building to simplify the internal structure of the communication device Simplification and reduce the assembly cost of the antenna module is a direction that the industry has been continuously exploring.

Summary of the Invention

[0004] This application provides an antenna module and a communication device for ensuring the radiation performance of the antenna Assuming that and realizing a cable-free design, thereby simplifying the internal structure of the communication device Simplification and having the advantage of low cost.

[0005] According to a first aspect, this application provides an antenna module including a radiation element, a ground element, and a power supply element. The radiation element and the ground element are stacked LayersThe power supply element is a transmission line structure formed on an insulating support. In a first direction, the power supply element is located on the side of the ground element away from the radiating element. The power supply element includes a power supply transmission section and a ground section. The power supply transmission section is isolated and insulated from the ground section. The width of the power supply transmission section includes a first width, and the width of the ground section includes a second width. The first width is not equal to the second width. The width of the power supply transmission section is the dimension of the power supply transmission section in a direction perpendicular to the extension path of the power supply transmission section, and the width of the ground section is the dimension of the ground section in a direction perpendicular to the extension path of the ground section.

[0006] In this application, the feeding element of a transmission line structure arranged on an insulating support supplies power to a radiating element, and the widths of the ground and feeding transmission sections are not equal. This enables current balance in the antenna module. The unequal width design of the feeding transmission and ground sections of the feeding element has a decoupling effect. In other words, this can eliminate or reduce the coupling effect on the radiating element generated by the feeding element, thereby improving the radiation performance of the antenna module. Specifically, the radiating element and ground element in the antenna module provided in this application form an asymmetric architecture. An asymmetric architecture means that the radiating element and the ground element have different structures. In a resonant state, the radiating element and the ground element generate a current imbalance. Specifically, the current on the radiating element and the current on the ground element have different amplitudes and different directions. In this application, the unequal width design of the feeding transmission and ground sections is used to solve the impedance mismatch problem caused by the current imbalance generated by the radiating element and the ground section. The unequal width design of the feeding transmission and ground sections achieves a current balance effect for the entire antenna module.

[0007] In possible implementations, the electrical length of the feed transmission section in its extended path is between 0.3λ and 0.7λ, where λ is the wavelength of the electromagnetic wave from the radiating element in the resonant state. Specifically, the electrical length of the feed transmission section may be 0.5λ. This solution ensures the repeatability of impedance matching in the antenna module by limiting the electrical length of the feed transmission section to a specific range (between 0.3λ and 0.7λ) and a specific value (0.5λ). The repeatability of impedance matching can be understood as the matched impedance being the same at both ends of the feed transmission section. In this way, there is no need to place another matching circuit on the feed transmission section to adjust the matched impedance.

[0008] In possible implementations, the extension paths of the feed transmission section and the ground section form a double parallel-line architecture. This can be understood as follows: the gap between the first feed end of the feed transmission section and the first ground end of the ground section is the same as the gap between the second feed end of the feed transmission section and the first ground end of the ground section. In addition, in the extension paths of the first feed end and the ground section, the gap between the first feed end and the ground section remains unchanged. Since the feed element is designed as a double parallel-line architecture, the feed element can form an equal-amplitude reverse current when the antenna module is operating, preventing the feed element from affecting the resonance of the radiating element. This ensures that the antenna module is a vertically polarized antenna and a good radiation pattern can be obtained.

[0009] In possible implementations, the total electrical length of the power transmission section in the second direction is between 0.15λ and 0.35λ, where λ is the wavelength of the electromagnetic wave from the radiating element in the resonant state, and the second direction is perpendicular to the first direction. In a specific implementation, the total electrical length of the power transmission section in the second direction is 0.25λ. By limiting the electrical length of the power transmission section in the second direction, induced current can be suppressed. This enables decoupling between the power transmission element and the radiating element, reduces coupling between them, and thereby improves the radiation efficiency of the radiating element.

[0010] In possible implementation configurations, the power supply transmission section of, Extending in the second direction several transmission lines These points are on the same straight line. This solution is a simple cable wiring solution for the power transmission section. The electrical length of the power transmission section can be easily controlled, and the effect of suppressing induced current becomes more pronounced.

[0011] In possible implementation configurations, the power supply transmission section of, Extending in the second direction several transmission lines This includes at least two transmission line segments, the at least two transmission line segments connected to each other via a transmission line extending in a first direction. The at least two transmission line segments may be parallel to each other. This solution is a specific cabling solution for a power supply transmission unit. In this application, different forms of power supply transmission units can be arranged based on different specific assembly and electromagnetic field environments of the antenna module, and different designs can be realized by adjusting specific transmission modes on the isolation setting. This is simple and easy to implement.

[0012] In possible implementations, the power transmission section and the ground section are coplanar. In other words, the power transmission section and the ground section are coplanar, meaning that the planes of the insulating support supporting the power transmission section and the ground section are the same. For example, if the insulating support is a circuit board structure, the power transmission section and the ground section are located on the same layer of the circuit board. The thickness of the power transmission section and the ground section is not considered in this application. The thickness of the power transmission section and the ground section may be different. However, if the power transmission section and the ground section are arranged on the same plane, they can be understood as being coplanar. Coplanar designs have lower manufacturing costs, and the positional relationship between the power transmission section and the ground section is easier to control.

[0013] In possible implementations, the plane on which the power transmission section is located and the plane on which the ground section is located are not coplanar. The power transmission section and the ground section are positioned opposite each other in a third direction (they may be directly opposite each other). The third direction is perpendicular to the second direction, and the third direction is also perpendicular to the first direction. In this solution, the power transmission section and the ground section form a non-coplanar transmission line architecture. For example, the power transmission section and the ground section may be located on different layers of the circuit board. Compared to a coplanar design, the non-coplanar transmission architecture provided in this solution has the advantage of saving space and reducing the area occupied on the board. The thickness of the circuit board is used solely for insulation between the power transmission section and the ground section, thereby reducing manufacturing costs.

[0014] In possible implementations, under resonant conditions, the currents on the power supply and transmission section and the currents on the ground section have equal amplitude, but their directions are opposite.

[0015] In possible implementations, the power transmission unit includes a first power supply end and a second power supply end, the first power supply end being electrically connected to a radiating element, and the second power supply end being electrically connected to a radio frequency chip on the main board of the communication device, and the power transmission unit extends in equal width from the first power supply end to the second power supply end, and / or The grounding section includes a first grounding end and a second grounding end, the first grounding end being electrically connected to a ground element, and the second grounding end being electrically connected to the ground on the main board of the communication device, and the grounding section extends with equal width from the first grounding end to the second grounding end.

[0016] In possible implementations, the power transmission unit includes a first power supply end and a second power supply end, the first power supply end being electrically connected to a radiating element, and the second power supply end being electrically connected to a radio frequency chip on the main board of the communication device, and from the first power supply end to the second power supply end, a portion of the power transmission unit extends with equal width, a portion of the power transmission unit extends with unequal width, and / or The grounding section includes a first grounding end and a second grounding end, the first grounding end being electrically connected to a ground element, and the second grounding end being electrically connected to the ground on the main board of the communication device, with a portion of the grounding section extending of equal width from the first grounding end to the second grounding end, and a portion of the grounding section extending of unequal width.

[0017] In possible implementations, the power transmission unit includes a first power supply terminal and a second power supply terminal, the first power supply terminal being electrically connected to a radiating element, and the second power supply terminal being electrically connected to a radio frequency chip on the main board of the communication device, and the first power supply terminal to the second 2 The power transmission section extends with equal width to the power supply end, The grounding section includes a first grounding end and a second grounding end, the first grounding end being electrically connected to a ground element, and the second grounding end being electrically connected to the ground on the main board of the communication device, with a portion of the grounding section extending of equal width from the first grounding end to the second grounding end, and a portion of the grounding section extending of unequal width.

[0018] In possible implementations, the grounding section includes a first grounding end and a second grounding end, the first grounding end being electrically connected to a ground element, and the second grounding end being electrically connected to the ground on the main board of the communication device, and the grounding section extends with equal width from the first grounding end to the second grounding end. The power supply transmission unit includes a first power supply terminal and a second power supply terminal, the first power supply terminal being electrically connected to a radiating element, and the second power supply terminal being configured to be electrically connected to a radio frequency chip on the main board of the communication device, and the first power supply terminal to the second 2 A portion of the power transmission section extends with equal width to the power supply end, while another portion extends with unequal width.

[0019] This application provides several combined solutions for the power transmission section and the grounding section. Equal-width designs for the power transmission section and the grounding section can be combined with unequal-width designs for the power transmission section and the grounding section. In certain implementations, the unequal-width design of the power transmission section may be a design where the width gradually changes. This helps in impedance adjustment.

[0020] In possible implementations, the antenna module includes a first plate and a second plate. The first plate is multiplied Layers The structure includes a first layer and a second layer. The radiating element is located in the first layer, and the ground element is located in the second layer. The second plate is an insulating support. The second plate includes a first edge and a second edge, which are positioned opposite each other, and a cable layer. The cable layer is located between the first edge and the second edge. The second plate is located to the side of the first plate. The first edge is connected to the first plate. The power supply element is located in the cable layer. An angle is formed between the cable layer and the first layer.

[0021] In this solution, the antenna module is provided with a first plate and a second plate. The manufacturing process is simple and the manufacturing cost is low. In addition, the antenna module has the advantage of being lightweight. This facilitates the design of a slim and short communication device. The first plate and the second plate may be a printed circuit board architecture. The power feeding element and the radiating element of the antenna module are a transmission line architecture arranged on the printed circuit board. The antenna module does not include a power feeding cable, and the communication device does not have a power feeding cable, so the internal structure of the communication device is simple. In addition, the position and shape of the transmission line are fixed and designed before assembling the antenna module. Therefore, it does not adversely affect the antenna during the assembly process. In addition, a low-loss substrate-level interconnect can be implemented between the first plate and the second plate. Thus, the assembly cost is low, and for the antenna module, the loss generated by the connection between the first plate and the second plate is low.

[0022] In a possible implementation form, the grounding part is electrically connected to the ground element through the connection between the first edge and the first plate. A connection structure is arranged at the joint between the first plate and the second plate. The connection structure is configured to realize the electrical connection between the power feeding transmission part and the radiating element. In this application, in the process of assembling and connecting the first plate and the second plate, the electrical connection between the power feeding element and the radiating element and the electrical connection between the power feeding element and the ground element can be implemented. Such electrical connections are highly reliable and have little loss.

[0023] In a possible implementation form, the first plate is provided with holes penetrating through the first layer and the second layer. The second plate includes a plug structure protruding from the first edge. At least a part of the plug structure is located within the holes. The connection structure includes the holes and the plug structure. The connection structure further includes a conductive connection portion. The conductive connection portion is electrically connected between the radiation element and the power supply transmission portion. This solution provides a specific design of the connection structure. The plug structure fits into the holes, realizing easy assembly and easy electrical connection.

[0024] In a possible implementation form, the holes are through-holes. The holes include a first open end and a second open end. The plug structure is inserted into the holes from the first open end. The conductive connection portion is welded to the radiation element from the side of the second open end. The power supply transmission portion and the radiation element are electrically connected by welding on the side of the second open end, and there is sufficient working space for the operation. Thereby, the assembly cost of the antenna module is reduced and the welding yield is ensured.

[0025] In a possible implementation form, the first layer is the upper surface of the first plate, and the second layer is the lower surface of the first plate. The first open end is located on the lower surface, and the second open end is located on the upper surface. In this solution, since the radiation element is arranged on the upper surface of the first plate and the ground element is arranged on the lower surface of the first plate, the volume of the antenna module becomes smaller and the communication device becomes thinner.

[0026] In a possible implementation form, the second edge of the second plate is connected to the main board of the communication device. The grounding portion of the power supply element is electrically connected to the ground plane on the main board. The power supply transmission portion is electrically connected to the radio frequency chip on the main board through a transmission line arranged on the main board. In this solution, the connection relationship between the position of the second edge of the second plate and the main board is restricted. An external cable is not required, and only the circuit board cable (transmission line structure) within the main board is needed to implement the grounding of the grounding portion and the electrical connection between the power supply transmission portion and the radio frequency chip.

[0027] In possible implementations, the first primary antenna is positioned on a second plate. The radiating element, ground element, and feeding element form the second primary antenna. The resonant frequency of the first primary antenna is the first frequency. The resonant frequency of the second primary antenna is the second frequency. The second frequency is higher than the first frequency.

[0028] In possible implementations, the first frequency is 2.4 GHz and the second frequency is 5 GHz. Hz That is the case.

[0029] In possible implementations, the antenna module includes multiple antenna elements. Each antenna element includes one first primary antenna and one second primary antenna. The antenna element further includes a first decoupling structure and a second decoupling structure. The first decoupling structure is located on a second plate. The antenna module further includes a third plate. The third plate and the second plate are arranged in a cross pattern, and the second decoupling structure is located on the third plate. In this application, the distance between the two first primary antennas is reduced, and the first and second primary antennas are arranged on the same support, saving space on the main board and facilitating the design of a small-scale antenna module. The first decoupling structure and the second decoupling structure are, Ensure isolation, and thereby, Radiation effect between the two first primary antennas rate They are arranged to improve performance.

[0030] In this application, the distance between the two first primary antennas is set between 0.2 times the wavelength and 0.8 times the wavelength, and the isolation between the two first primary antennas is improved in combination with the first and second decoupling structures. The distance between the two first primary antennas is between 0.2 times the wavelength and 0.8 times the wavelength. If the first decoupling structure is not placed on each antenna element, when the two first primary antennas are in a resonant state, the two first primary antennas receive signals from each other, resulting in signal interference and insufficient isolation.

[0031] In possible implementations, the second plate and the third plate The end of the first decoupling structure, away from the first plate, is connected to the main board of the communication device. In a direction perpendicular to the ground plane on the main board of the communication device, the longest distance between the first decoupling structure and the ground plane is the cross-sectional height of the first decoupling structure. The cross-sectional height of the first decoupling structure is between 0.01 times the wavelength and 0.16 times the wavelength. The distance between the first decoupling structure and the first primary antenna is the first distance. The distance between the first decoupling structure and the first primary antenna of an adjacent antenna element is the second distance. Both the first and second distances are between 0.1 times the wavelength and 0.6 times the wavelength. The second decoupling structure is configured to reduce the amount of coupling between the first primary antenna and the first primary antenna of an adjacent antenna element. The resonant frequency of the second decoupling structure is either higher than or lower than the first frequency.

[0032] In this application, the first decoupling structure is positioned to achieve small antenna dimensions. This facilitates the thin design of the communication device and further solves the problem of isolation between adjacent first primary antennas. By controlling the cross-sectional height of the first decoupling structure, the distance between the first decoupling structure and the first primary antenna, and the distance between the first decoupling structure and the adjacent first primary antenna, the isolation between adjacent first primary antennas in a limited space is improved and the impact on the radiation efficiency of the first primary antenna is reduced. As a result, there is no obvious dip in the simulation diagram of the radiation efficiency of the first primary antenna.

[0033] In this application, the resonant frequency of the second decoupling structure is adjusted so that its resonant frequency is not the same as the first frequency, but slightly higher or lower. This achieves decoupling between the first primary antennas, thereby improving isolation and reducing the impact on the antenna's radiation efficiency. Specifically, when the second decoupling structure resonates, a drop in efficiency occurs for electromagnetic waves at the resonant frequency of the second decoupling structure. In the case of the first primary antenna, the drop in efficiency caused by the second decoupling structure avoids the in-band frequency of the first primary antenna's resonance (i.e., the first frequency), and thus the influence of the second decoupling structure on the radiation efficiency of the first primary antenna can be reduced.

[0034] In possible implementations, the radiating element, ground element, and feeding element form a horizontally arranged vertically polarized antenna.

[0035] According to a second aspect, the present application provides a communication device comprising a radio frequency chip and an antenna module in any one of the possible implementation forms of the first aspect. The radio frequency chip is configured to process electromagnetic wave signals received and transmitted by the antenna module. [Brief explanation of the drawing]

[0036] To more clearly illustrate the embodiments of the present invention or the technical solutions in the background art, the accompanying drawings illustrating the embodiments of the present invention or the background art will be described below. [Figure 1] This is an assembly drawing of a communication device in a certain direction, according to one implementation configuration of this application. [Figure 2] This is an assembly drawing of a communication device in a different orientation, according to one implementation configuration of this application. [Figure 3] This is a three-dimensional exploded view of a communication device according to one implementation configuration of this application. [Figure 4] This is a cross-sectional view of a communication device according to one implementation configuration of this application. [Figure 5]This is a diagram showing the inside of a second housing of a communication device according to one implementation embodiment of this application. [Figure 6] This figure shows the arrangement (distribution) of at least some electronic components on the underside of the main board of a communication device according to one implementation embodiment of this application. [Figure 7] This is a three-dimensional exploded view of an antenna module according to one implementation configuration of this application. [Figure 8] This is a three-dimensional exploded view of an antenna module in a different orientation, according to one implementation configuration of this application. [Figure 9] This is a cross-sectional view of an antenna module according to one implementation configuration of this application. [Figure 9A] This shows the positional relationship between the radiating element and the ground element of the antenna module in a specific implementation configuration of this application. [Figure 9B] This shows the positional relationship between the radiating element and the ground element of the antenna module in a specific implementation configuration of this application. [Figure 9C] This shows the positional relationship between the radiating element and the ground element of the antenna module in a specific implementation configuration of this application. [Figure 10] This diagram shows the conventional method of supplying power to an antenna module via a power supply cable. [Figure 11] This is a diagram of a power supply element in an antenna module according to one implementation embodiment of this application. [Figure 12] This is a diagram of a power supply element in an antenna module according to one implementation embodiment of this application. [Figure 13] This is a diagram of a power supply element in an antenna module according to one implementation embodiment of this application. [Figure 14] This is a diagram of a power supply element in an antenna module according to one implementation embodiment of this application. [Figure 15] This is a diagram of a power supply element in an antenna module according to one implementation embodiment of this application. [Figure 16] This is a diagram of a power supply element in an antenna module according to one implementation embodiment of this application. [Figure 17]This is a diagram of a power supply element in an antenna module according to one implementation embodiment of this application. [Figure 18] This is a cross-sectional view of a disassembled antenna module according to one implementation configuration of this application. [Figure 19] Figure 18 is a cross-sectional view of the assembled antenna module in the configuration shown. [Figure 20] This is a cross-sectional view of a disassembled antenna module according to one implementation configuration of this application. [Figure 21] Figure 20 is a cross-sectional view of the assembled antenna module in the configuration shown. [Figure 22] This is a three-dimensional exploded view of an antenna module according to one implementation configuration of this application. [Figure 23] Figure 22 shows the marked dimensions of an antenna module in one implementation configuration. [Modes for carrying out the invention]

[0037] The terms used in this application are defined as follows:

[0038] A wireless AP, or access point, is a wireless access point. Simply put, a wireless AP is a wireless switch in a wireless network. Wireless APs are access points for mobile device users to access wired networks and are widely used for network coverage in various scenarios, including enterprise-level scenarios such as education and healthcare. Wireless APs may be used in home broadband, corporate internal network deployments, etc., with wireless coverage ranges from tens to hundreds of meters. Generally, wireless APs also have an access point client mode. Specifically, wireless links can be established between APs to extend the coverage of the wireless network.

[0039] MIMO, or Multi-Input Multi-Output (MIMO) technology, uses multiple transmitting and receiving antennas at both the transmitting and receiving ends, transmitting and receiving signals through these multiple antennas to improve communication quality. This allows for efficient use of spatial resources, enables multi-input multi-output through multiple antennas, and increases the system's channel capacity without increasing spectral resources or antenna transmission power. This technology has clear advantages and is therefore considered a core technology for next-generation communications.

[0040] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings of embodiments of the present invention.

[0041] Figures 1 and 2 are each Figure 3 is an assembly drawing of a communication device according to one implementation configuration of this application. Figure 4 is a cross-sectional view of a communication device according to one implementation configuration of this application. Figure 5 is an inside view of the second housing 102 of the communication device according to one implementation configuration of this application.

[0042] Refer to Figures 1, 2, 3, and 4. In one implementation configuration, the communication device 100 is a wireless AP. The communication device 100 includes a first housing 101 and a second housing 102. The first housing 101 and the second housing 102 are fixed to each other and enclosed together to form the internal space G of the communication device 100. In the application environment of the communication device 100, the first housing 101 is the lower housing and the second housing 102 is the upper housing. The first housing 101 is connected to a bearing material. For example, the first housing 101 is in contact with a desktop, wall, or support surface of another carrier. The periphery of the second housing 102 is typically , blocking There is no shielding and it is exposed to the air. In one implementation configuration, the first housing 101 is a housing (e.g., a metal housing) that has a conductor material and shielding function.

[0043] Refer to Figure 2. On the outer surface of the first housing 101, the first housing 101 includes an intermediate region R1 and an edge region R2 surrounding the intermediate region. The intermediate region R1 is configured to house a connector socket 1011 (for example, a socket corresponding to a network port or a socket corresponding to an optical fiber port) and to house an external cable. bottom Block 1012 is placed at the intersection of the intermediate region R1 and the edge region R2. Specifically, the intermediate region R1 is a square, and there are four corners of the intermediate region R1 bottom Block 1012 is positioned. A heat sink 1013 is positioned in the edge region R2. The heat sink 1013 is configured to dissipate heat from the heat-generating elements within the communication device. The heat sink 1013 is positioned around the connector socket 1011 and includes a plurality of fins. Each fin extends from the junction between the edge region R2 and the intermediate region R1 to the outer edge of the edge region R2. An opening 1014 is further provided in the edge region R2. The opening 1014 communicates the internal space G of the communication device 100 with the outside. The opening 1014 is, Internet of Things Io T) It is positioned for mounting the card module. An IoT card can be understood as an Internet of Things card, i.e., a chip for network access of a device.

[0044] Please refer to Figure 3. In a specific implementation configuration, multiple accommodation spaces G1 are formed on the inner surface of the first housing 101. Adjacent accommodation spaces G1 are separated by a lower partition plate 1015. via, are partitioned from each other. Multiple housing spaces G1 are arranged independently of each other. Multiple housing spaces G1 are configured to house the electronic components of the communication device 100. Since the housing spaces G1 are independent of each other, the first housing 101 forms a shielding cover structure for the electronic components. Thus, the first housing 101 of the communication device 100 provided in this application integrates the functions of housing and shielding cover. The first housing 101 is coupled to the main board 103 of the communication device 100. In this way, the first housing 101 forms multiple shielding covers arranged on the main board 103 to shield different electronic components on the main board 103. Thus, in this application, there is no need to arrange an additional shielding cover structure between the housing and the main board of the communication device 100. This facilitates a thin design for the communication device. The second housing 102 is made of a non-conductive material (e.g., plastic). The antenna module is located inside the second housing 102. The second housing 102 is designed as a non-conductive material. This does not affect the radiation efficiency of the antenna.

[0045] Refer to Figures 3 and 4. The main board 103 is located inside the communication device 100. The main board 103 is fixed in an internal space G enclosed by the first housing 101 and the second housing 102. The main board 103 includes a bottom surface S1 and an top surface S2. The bottom surface S1 faces the inner surface of the first housing 101, and the top surface S2 faces the inner surface of the second housing 102. The electronic components on the main board 103 include a CPU, CPU peripheral circuits, multiple radio frequency chips, a baseband chip, an antenna module, and other functional modules (such as a power supply module, a Bluetooth module, a network port, and an optical fiber port). On the main board 103, the main heat-generating components and components requiring electromagnetic shielding are located on the bottom surface S1, and the electronic components requiring electromagnetic shielding are located in the accommodating space G1 formed by the first housing 101, which has a function similar to that of a shielding cover. The main heat-generating components are located in the first housing 101 viaIt dissipates heat. For example, electronic components such as the CPU, baseband chip, radio frequency chip, power module, Bluetooth module, network port, fiber optic port, and IoT card module are located on the lower surface S1 of the main board 103. The antenna module 10 is located on the upper surface S2 of the main board 103. Since the second housing 102 is made of a non-conductive material, the side of the antenna module 10 away from the main board 103 is a clearance space. This helps to ensure antenna performance. The antenna module 10 is located in the edge region of the main board 103, and the intermediate region enclosed by the antenna module 10 is configured to accommodate the CPU peripheral circuitry.

[0046] Refer to Figure 5. In one implementation configuration, the second housing 102 includes a plate body 1021 and an upper partition plate 1022 protruding from the inner surface of the plate body 1021. The upper partition plate 1022 and the plate body 1021 may be an integral structure. In one embodiment, the upper partition plate 1022 is configured to improve the strength of the plate body 1021 and ensure the flatness of the plate body 1021. In another embodiment, the upper partition plate 1022 encloses a plurality of partitioned spaces G2 on the inner surface of the plate body 1021. In the assembled state, the antenna elements of the antenna module 10 are arranged corresponding to different partitioned spaces G2. In a direction perpendicular to the main board 103, the orthographic projections of the antenna elements of the antenna module 10 on the second housing 102 are located separately within the partitioned spaces G2.

[0047] Refer to Figure 6. In one implementation configuration, the CPU located in the intermediate region is positioned on the lower surface S1 of the main board 103. The 2G and 5G radio frequency chips and baseband chip are positioned above the CPU. The radio frequency chips and baseband chips may be independent chips. Multiple 2G radio frequency antennas and multiple 5G radio frequency chips may be positioned based on antenna positioning requirements. Similarly, multiple baseband antennas may also be positioned based on antenna frequency and positioning requirements. The Bluetooth chip is positioned to the left of the CPU. The IoT card module is positioned to the right of the CPU. The 6G baseband chip, 6G radio frequency chip, network port, fiber optic port, DC power supply, and power transformer module are positioned below the CPU. The radio frequency chip and baseband chip within the 6G baseband chip and 6G radio frequency chip... Pu is They can be independent chips. In the case of radio frequency chips, multiple 6G radio frequency antennas can be arranged based on antenna arrangement requirements. Similarly, multiple baseband antennas can also be antennas. frequency and may be arranged based on arrangement requirements. The communication device provided in this application may further include other electronic components, such as other processors, such as CPLD logic chips or PHY chips.

[0048] As shown in Figure 3, in this application, the antenna module 10 is directly mounted on the upper surface S2 of the main board 103, and the feed cable for the antenna within the antenna module 10 is directly mounted within the main board 103 (for example, a microstrip on the main board 103 forms the feed system), eliminating the need for additional feed cables. The antenna module 10 is assumed to be independently fixed to an antenna substrate. For example, the antenna substrate can generally be a metal substrate and is mounted on the main board. LayersThe radio frequency chip supplies power to the antenna module via a power supply cable. In this architecture, not only does the antenna board occupy space in the communication device, but the power supply cable also needs to occupy space in the communication device. In addition, the assembly of the antenna board and the power supply cable complicates the internal structure of the communication device. Regarding the signal of the antenna module, the signal quality for power supply via the power supply cable is located within the main board 103 and is lower than the signal quality for direct power supply via the cable used as the power supply structure in this application.

[0049] The antenna module 10 provided in this application is a MIMO antenna system. The antenna module 10 comprises a plurality of antenna groups (a plurality of antenna elements). The antenna groups have different operating frequencies. Generally, the antenna module may include two or more antennas operating at a first frequency and two or more antennas operating at a second frequency. For example, in one implementation, the antenna module includes three antenna groups. The first group is a first-frequency antenna (e.g., a 2.4G antenna with an operating bandwidth of 2.4GHz to 2.5GHz), the second group is a second-frequency antenna (e.g., a 5G antenna with an operating bandwidth of 5.15GHz to 5.85GHz), and the third group is a third-frequency band antenna (e.g., a 6G antenna with an operating bandwidth of 5.925GHz to 7.125GHz). Each antenna group includes a plurality of independent antennas. Independent antennas mean that the antennas have independent power sources and independent radiators and can perform antenna functions independently. In a particular implementation, the antenna module includes four 2.4G antennas, four 5G antennas, and four 6G antennas. An antenna element may have one antenna of a single frequency (for example, one antenna element may contain only one 6G antenna), or one antenna element may have two antennas of different frequencies. For example, one antenna element may contain one 2.4G antenna and one 5G antenna.

[0050] To ensure the operational efficiency of all antennas, isolation between antennas is necessary when they are operating. Port-to-port isolation is used to quantify the influence between antennas. Higher port-to-port isolation indicates less influence between two antennas. Generally, longer distances between antennas indicate better isolation. However, longer distances between antennas affect the miniaturization design of communication devices. Therefore, to reduce the board space occupied and obtain a smaller communication device, the distance between antennas must be shortened. For low-frequency antennas, the safe distance between two adjacent low-frequency antennas is long. Generally, multiple low-frequency antennas are distributed to different corners of the circuit board to achieve isolation between antennas. However, this does not translate to a good circuit board layout. In addition, to achieve better antenna performance, the radio frequency chips connected to the antennas also need to be distributed. If the radio frequency chips are centrally located and the antennas are distributed, some antennas will undoubtedly be connected to the radio frequency chips via long cables, resulting in radio frequency signal loss.

[0051] Please refer to Figure 3. In this application, the antenna module 10 is located on the upper surface S2 of the main board 103, and the antenna module 10 includes a plurality of antenna elements. In a particular implementation, the antenna module 10 includes eight antenna elements. Four of the antenna elements integrate antennas at a first frequency and a second frequency. For example, there are four 2.4G antennas and four 5G antennas. In other words, each antenna element includes one antenna for the first frequency and one antenna for the second frequency (this can be understood as follows: one 2.4G antenna and one 5G antenna are located on one antenna support and are located corresponding to the same positions on the main board 103). Specifically, in this implementation, the four 2.4G antennas are located adjacent to each other, all 2.4G antennas are located on the same side of the central region of the main board 103, and the corresponding positions of the four 2.4G antennas and four 5G antennas on the main board 103 are the same. It can be understood that the first frequency is a low frequency and the second frequency is a high frequency. When antenna performance and isolation are satisfied, the substrate space occupied by the high-frequency antenna is smaller than the substrate space occupied by the low-frequency antenna. In this application, the second frequency antenna is used as a reference azimuth position for placement. When multiple second frequency antennas are placed in appropriate positions, the first frequency antenna is placed in the position of the corresponding second frequency antenna, and then the isolation and performance of the first frequency antenna are adjusted by using decoupling techniques. Such a design can reduce the substrate space occupied by the antenna module, leading to a smaller, lighter, and thinner design for the communication device. Specifically, in this application, the specific positions of four 5G antennas on the main board 103 are first set, then four 2.4G antennas are placed on the feeding circuit board of the four 5G antennas, and then 2.4 G A decoupling structure for the antenna is placed. This is adjacent to 2.4 G Isolation between containers is ensured, and each container is 2.4 G The radiation efficiency of the container is also ensured.

[0052] As shown in Figures 3 and 4, there is no power supply cable used to supply power to the antenna module 10 inside the communication device 100. The internal structure of the communication device 100 is simple, which improves the efficiency of the assembly process, reduces assembly costs, and facilitates maintenance of the communication device 100. The implementation of this application provides a cable-free power supply antenna module 10. The antenna module 10 is connected to the upper surface S2 of the main board 103.

[0053] Figure 7 shows an antenna module 10 in a certain direction according to one implementation configuration of this application. three This is a dimensional decomposition diagram. Figure 8 shows the antenna module 10 shown in Figure 7 in a different direction. Ru 3 This is a dimensional exploded view. Figure 9 is a cross-sectional view of the antenna module 10 shown in Figure 7. Please refer to Figures 7, 8, and 9. The antenna module 10 includes a radiating element 20, a ground element 30, and a feeding element 40. The radiating element 20 and the ground element 30 are connected by a multiplier. Layers The ground element 30 is stacked between the main board 103 and the radiating element 20. The ground element 30 and the main board 103 are facing each other without contact. The direction in which the radiating element 20 and the ground element 30 are stacked is called the first direction A1. In the first direction A1, the power supply element 40 is located on the side of the radiating element 20 that is away from the ground element 30. teeth, The orientation may be perpendicular to the main board 103. The radiating element 20, ground element 30, and power supply element 40 are all metal transmission line structures or metal patch structures. In the specific implementation of this application, the radiating element 20, ground element 30, and power supply element 40 are arranged on an insulating support, which is assembled on the main board. The insulating support may be a circuit board composition or another form of structure.

[0054] Below, we will first describe the specific structure and positional relationship of the radiating element 20, the ground element 30, and the power supply element 40.

[0055] Refer to Figures 7, 8, and 9. The radiating element 20 is located on top of the antenna module 10, which can be understood as the position where the antenna module 10 is separated from the main board 103. The radiating element 20 is adjacent to the second housing 102. The radiating element 20 includes an input interface 21, a power divider element 22, and a plurality of radiating sub-elements 23. The plurality of radiating sub-elements 23 are arranged around the input interface 21. For example, the plurality of radiating sub-elements 23 are arranged in an annular region. The power divider element 22 and the radiating sub-elements 23 may be arranged in a one-to-one correspondence. The power division element 22 is Between the radiating sub-element 23 and the input interface 21 Individually The power dividers 22 and radiating sub-elements 23 may be arranged in a one-to-many correspondence. For example, in the implementation shown in Figure 7, one power divider 22 is connected to correspond to two radiating sub-elements 23. The radiating element 20 includes four power dividers 22 and eight radiating sub-elements 23. The input interface 21 is the power supply location for the radiating element 20, and the input interface 21 is configured to be electrically connected to the power supply element 40. input Interface 21 is electrically connected to all power division elements 22.

[0056] In a specific implementation, the input interface 21 is located at the center of the radiating element 20, the power division element 22 surrounds the input interface 21, and the multiple radiating sub-elements 23 surround the power division element 22. fruit, The radiating element 20 may have a rotationally symmetric structure around the input interface 21. The shape of each radiating sub-element 23 may be rod-shaped, arc-shaped, L-shaped, etc., but is not limited to these. In one implementation configuration, the operating frequency of the radiating element 20 in the resonant state is 5G. HzThe electrical length of each radiating sub-element 23 is one-quarter of the electromagnetic wave wavelength of the operating frequency of the radiating element 20. In one implementation configuration, the power division element 22 and the multiple radiating sub-elements 23 are on the same plane. For example, the power division element 22 and the multiple radiating sub-elements 23 are a metal microstrip structure arranged on the same layer of the circuit board. In another implementation configuration, the surface on which the power division element 22 is located is different from the surface on which the multiple radiating sub-elements 23 are located. For example, the power division element 22 and the multiple radiating sub-elements 23 are arranged on different layers of the circuit board. The power division element 22 may be located in an intermediate layer of the circuit board, and the multiple radiating sub-elements 23 may be located in a surface layer of the circuit board.

[0057] The ground element 30 has a metal layer structure. For example, in one mounting configuration, the ground element 30 is a copper foil placed in a layer of the circuit board (which may be an intermediate or surface layer of the circuit board). In another mounting configuration, the ground element 30 may alternatively be a metal sheet structure, and the ground element 30 may be fixed to the surface of the circuit board (by using adhesive or by welding). In one mounting configuration, a notch 31 is formed in the central region of the ground element 30, and the position of the notch 31 is used to accommodate the connection structure between the radiating element 20 and the feeding element 40. The specific form of the ground element 30 may be a ring. The outer edge of the ground element 30 may be circular, square, or polygonal, and the inner edge of the ground element 30 may also be circular, square, or polygonal.

[0058] Figures 9A, 9B, and 9C are each This shows the positional relationship between the radiating element 20 and the ground element 30 in a specific implementation configuration of this application. Please refer to Figure 9A. In one implementation form , The inner edge of the land element 30 is positioned correspondingly to the periphery of the input interface 21. Specifically, the vertical projection of the inner edge of the ground element 30 on the plane in which the radiating element 20 is located is positioned around the input interface 21. Please refer to Figure 9B. Alternatively , releaseThe vertical projection of the inner edge of the ground element 30 on the plane in which the radiating element 20 is located may be located inside the input interface 21. See Figures 9A, 9B, and 9C. The vertical projection of the ground element 30 on the plane in which the radiating element 20 is located coincides with at least a portion of the power division element 22. As shown in Figure 9A, the outer edge of the ground element 30 is adjacent to the inner edge of the radiating sub-element 23, or the outer edge of the ground element 30 is located between the inner edge of the radiating sub-element 23 and the input interface 21. See Figure 9B. Alternatively, the outer edge of the ground element 30 may coincide with the inner edge of the radiating sub-element 23. See Figure 9C. In one implementation, a portion of the projection of the ground element 30 on the plane in which the radiating element 20 is located coincides with the power division element 22, and the other portion coincides with a portion of the radiating sub-element 23.

[0059] Refer to Figures 7, 8, and 9. The power supply element 40 is located between the ground element 30 and the main board 103. Specifically, the power supply element 40 is a transmission line structure formed on an insulating support. In the first direction, the power supply element 40 is located on the side of the ground element away from the radiating element 20. The power supply element 40 is electrically connected to a radio frequency chip on the main board 103 and is configured to supply power to the radiating element 20. The radio frequency chip is electrically connected to the power supply element 40 via a transmission line located on the main board 103.

[0060] Figure 10 shows a conventional solution in which the power supply signal is transmitted between the antenna module and the main board via a radio frequency cable. Referring to Figure 10, the antenna module is located above the main board. Power is supplied to the antenna module via a power supply cable. but Grounding on the main board Connected The location is the first connection point P1, and the power supply cable but Radiation element 20 ConnectedThe location includes the second connection point P2 and the third connection point P3. The specific location of the first connection point P1 on the main board, the specific location of the second connection point P2 on the antenna module, the specific location of the third connection point P3 on the antenna module, the length of the feed cable between the first connection point P1 and the second connection point P2, the length of the feed cable between the second connection point P2 and the third connection point P3, and the length of the feed cable between the third connection point P3 and the feed point of the radiating element 20 are all important factors that affect the radiation efficiency of the antenna module. In the design and assembly process, to precisely control the many important factors that affect the radiation efficiency of the antenna module , written by Business hours But it was long, Specialized technical support is required. As a result, the manufacturing cost of communication equipment becomes very high. Therefore, the conventional solution in which the power supply signal is transmitted via radio frequency cable not only complicates the internal structure of the communication equipment but also complicates the assembly process of the radio frequency cable. The aforementioned important factors that affect the radiation efficiency of the antenna must be taken into consideration, and it is difficult to ensure good radiation performance of the antenna. In general, radio frequency cable cable Wiring routes, length of radio frequency cables, etc., are related to the antenna. of This has a significant impact on consistency, board-level layout, antenna indicators, and link insertion loss.

[0061] The antenna module 10 provided in this application uses an external radio frequency cable for power supply. Use need There is no The radiating element 20 is excited by using the transmission line located within the main board 103 and the power supply element 40 (which is also a transmission line structure) located on the insulating support. ru. This eliminates the impact on antenna performance caused by conventionally designed radio frequency cables. In the antenna module 10 provided in this application, all carriers for transmitting electromagnetic wave signals between the radiating element 20 and the radio frequency chip are transmission line structures arranged on a circuit board or other insulating support, so the internal structure of the communication device is simple. In addition, the position and shape of the transmission lines are fixedTherefore, it is designed before assembling the antenna module 10. Consequently, the assembly process does not adversely affect the antenna.

[0062] For specific structural details of the power supply element 40, please refer to the implementation configurations shown in Figures 11, 12, 13, and 14.

[0063] Refer to Figure 11. The power supply element 40 has a power supply transmission section 41 and a ground section 42. A gap is provided between the power supply transmission section 41 and the ground section 42. The power supply transmission section 41 is connected to the ground section 42 using an insulating medium 43. separation The insulating medium 43 between the power transmission section 41 and the ground section 42 may be air, insulating material of an insulating support, insulating adhesive, etc. The width of the power transmission section 41 includes a first width WS, and the width of the ground section 42 includes a second width WG. In order to achieve current balance of the antenna module 10, the first width WS is not equal to the second width WG. The unequal width design of the power transmission section 41 and the ground section 42 of the power transmission element 40 has a decoupling function. The width of the power transmission section 41 is in a direction perpendicular to the extension path of the power transmission section 41. Power supply transmission unit 41 The dimensions are such that the width of the grounding portion 42 is in the direction perpendicular to the extension path of the grounding portion 42. Ground contact portion 42 These are the dimensions. Specifically, in one mounting configuration, the power supply transmission unit 41 extends with equal width in the first direction A1, and the power supply transmission unit 41 also extends with equal width in the second direction A2. death,The grounding portion 42 extends with equal width in the first direction A1, and the grounding portion 42 also extends with equal width in the second direction A2. As shown in Figure 11, the first width WS includes the width WS1 of the portion of the transmission line of the power supply transmission unit 41 that extends in the first direction A1 and the width WS2 of the portion of the transmission line of the power supply transmission unit 41 that extends in the second direction A2, and the second width WG includes the width WG1 of the portion of the transmission line of the grounding portion 42 that extends in the first direction A1 and the width WG2 of the portion of the transmission line of the grounding portion 42 that extends in the second direction A2. The width WS1 of the portion of the transmission line of the power supply transmission unit 41 that extends in the first direction A1 may be equal to or different from the width WS2 of the portion of the transmission line of the power supply transmission unit 41 that extends in the second direction A2. The width WG1 of the portion of the transmission line of the grounding section 42 extending in the first direction A1 may be equal to or different from the width WG2 of the portion of the transmission line of the grounding section 42 extending in the second direction A2. In this application, the non-equality of the first width WS and the second width WG means the following: the width WS1 of the portion of the transmission line of the power supply transmission section 41 extending in the first direction A1 is not equal to the width WG1 of the portion of the transmission line of the grounding section 42 extending in the first direction A1, and the width WS2 of the portion of the transmission line of the power supply transmission section 41 extending in the second direction A2 is not equal to the width WG2 of the portion of the transmission line of the grounding section 42 extending in the second direction A2.

[0064] This solution , salary The widths of the power transmission section 41 and the grounding section 42 are different (i.e., the first width WS and the second width WG are not equal). This is because, Achieves current balance for antenna module 10, The coupling effect on the radiating element 20 generated by the power supply element 40 can be eliminated or reduced, thereby improving the radiation performance of the antenna module 10. Transmission line structure, Placed on an insulating support ta By using the electrical element 40, the matching problem of the antenna module 10 can be solved.

[0065] The radiating element 20 and ground element 30 in the antenna module provided in this application form an asymmetric architecture. An asymmetric architecture means that the radiating sub-elements 23 of the radiating element 20 and the ground element 30 have different structures. In a resonant state, the radiating element 20 and the ground element 30 generate a current imbalance. Specifically, the current on the radiating element 20 and the current on the ground element 30 have unequal amplitudes and different directions. This application solves the impedance mismatch caused by the current imbalance generated by the radiating element 20 and the ground element 30 by using an unequal-width design of the feed transmission section 41 and the ground section 42. Overall This can achieve a current balancing effect.

[0066] The power supply transmission section 41 and the grounding section 42 of the power supply element 40 are double parallel lines Power supply The architecture is formed. The microstrip-shaped power division element 22 is combined with the dual parallel line feeding architecture of the feeding element 40. When the widths of the power transmission section 41 and the ground section 42 are equal, impedance mismatch occurs due to current imbalance. In addition, the feeding element 40 and the radiating element 20 generate mutual coupling effects, and as a result, antenna pattern of change brought about This affects the radiation performance of the antenna. In this application, by arranging the feed transmission section 41 and ground section 42 of unequal width, the feed element 40 has both a balun function and a decoupling function. As a result, current balance of the antenna module 10 is achieved and the radiation efficiency is improved.

[0067] Refer to Figure 11. I want to be treated that way.The power transmission unit 41 includes a first power supply terminal 411 and a second power supply terminal 412. The first power supply terminal 411 is electrically connected to the radiating element 20, and the second power supply terminal 412 is configured to be electrically connected to a radio frequency chip on the main board 103 in the communication device. The extension path of the power transmission unit 41 is a path for transmitting radio frequency signals between the first power supply terminal 411 and the second power supply terminal 412, or a path through which current flows. The grounding unit 42 includes a first grounding terminal 421 and a second grounding terminal 422. The first grounding terminal 421 is electrically connected to the ground element 30, and the second grounding terminal 422 is electrically connected to the ground on the main board 103 (i.e., the ground plane on the main board). The extension path of the grounding unit 42 is the first ground edge 4 21 and the second grounding edge 4 This is the path through which current flows between 22 and the radiating element 20. In the first direction, the first feed end 411 is located between the second feed end 412 and the radiating element 20, and the first ground end 421 is located between the second ground end 422 and the radiating element 20.

[0068] In one implementation configuration, the electrical length of the power transmission unit 41 in its extended path is between 0.3λ and 0.7λ. Specifically, the electrical length of the power transmission unit 41 may be 0.5λ, where λ is the wavelength of the electromagnetic wave from the radiating element 20 in the resonant state. By limiting the electrical length of the power transmission unit 41 to a specific range (between 0.3λ and 0.7λ) and a specific value (0.5λ), the power transmission unit 41 is given a balun function, ensuring the repeatability of impedance matching in the antenna module. The repeatability of impedance matching can be understood as the impedance being the same at the two ends of the power transmission unit 41, namely the first feed end 411 and the second feed end 412. In this way, there is no need to place another matching circuit on the power transmission unit 41 to adjust the matching impedance. As shown in Figure 11, in the extension path of the power supply transmission unit 41, the electrical length of the power supply transmission unit 41 may be the sum of the electrical length H1 of the power supply transmission unit 41 in the first direction A1 and the electrical length L1 of the power supply transmission unit 41 in the second direction A2. The electrical length H1 of the power supply transmission unit 41 in the first direction A1 may be between 0.1λ and 0.35λ (for example, 0.25λ), and the electrical length L1 of the power supply transmission unit 41 in the second direction A2 may be between 0.1λ and 0.35λ (for example, 0.25λ).

[0069] In one implementation configuration, the extension paths of the power transmission section 41 and the ground section 42 form a double parallel line architecture. This can be understood as follows: the gap between the first feed end 411 of the power transmission section 41 and the first ground end 421 of the ground section 42 is the same as the gap between the second feed end 412 of the power transmission section 41 and the first ground end 421 of the ground section 42. In addition, in the extension paths of the first feed end 411 and the ground section 42, the gap between the first feed end 411 and the ground section 42 remains unchanged, so the feeding element 40 forms a double parallel line architecture. In this way, the feeding element 40 can form a reverse current of equal amplitude when the antenna module is operating, preventing the feeding element 40 from affecting the resonance of the radiating element 20. This ensures that the antenna module is a vertically polarized antenna and a good radiation pattern can be obtained. A reverse current with equal amplitude can be understood as follows: the direction of the current on the power supply transmission unit 41 is opposite to the direction of the current on the grounding unit 42, but the amplitude of the current on the power supply transmission unit 41 is equal to the amplitude of the current on the grounding unit 42. The amplitude of the current is the maximum value of the alternating current in one period.

[0070] The extension paths of the power supply transmission unit 41 and the grounding unit 42 include an extension path in a first direction A1 and an extension path in a second direction A2. The second direction A2 is perpendicular to the first direction A1. The extension path of the power supply transmission unit 41 in the first direction A1 can be understood as follows: in one implementation, a portion of the transmission line of the power supply transmission unit 41 extends in the first direction A1; in another implementation, a portion of the transmission line of the power supply transmission unit 41 has a component perpendicular to the first direction A1. In other words, a portion of the transmission line of the power supply transmission unit 41 tends to extend obliquely with respect to the first direction A1, i.e., to extend in either the first direction A1 or the second direction A2. In one implementation of this application, the total electrical length L1 of the power supply transmission unit 41 in the second direction A2 is between 0.1λ and 0.35λ. In a specific implementation configuration, the total electrical length L1 of the power supply transmission section 41 in the second direction A2 is 0.25λ, where λ is the wavelength of the electromagnetic wave from the radiating element 20 in the resonant state. By limiting the electrical length of the power supply transmission section 41 in the second direction A2, induced current can be suppressed. This enables decoupling between the power supply element 40 and the radiating element 20, reduces coupling between the power supply element 40 and the radiating element 20, and thereby improves the radiation efficiency of the radiating element 20.

[0071] The specific form of the power supply transmission section 41 and the grounding section 42 may be a simple L-shaped transmission line architecture, or it may be formed by combining multiple L-shaped transmission lines, or it may include arc-shaped transmission lines, sawtooth transmission lines, wavy transmission lines, etc. In one implementation, as shown in Figure 11, several transmission lines of the power supply transmission section 41 extending in the second direction A2 are on the same line. This solution is a simple cable wiring solution for the power supply transmission section 41. The electrical length of the power supply transmission section 41 is easily controlled, and the effect of suppressing induced current becomes more pronounced. In a particular implementation, the power supply transmission section 41 includes a first segment 413, a second segment 414, and a third segment 415. The first segment 413 extends in the second direction A2. The second segment 414 and the third segment 415 are connected to the two ends of the first segment 413, respectively, and both extend in the first direction A1. The second segment 414 is connected between the first segment 413 and the radiating element 20. The third segment 415 is connected between the first segment 413 and the transmission line located on the main board 103 and used to connect the radio frequency chip. The electrical length of the first segment 413 is between 0.1λ and 0.35λ (for example, it may be 0.25λ). The sum of the electrical lengths of the second segment 414 and the third segment 415 is between 0.1λ and 0.35λ (for example, it may be 0.25λ). 3The sum of the electrical lengths of the second segment 414 and the third segment 415 is the electrical length (0.5λ) on the extension path of the power transmission unit 41. In another implementation, there may be an angle between the extending direction of the first segment 413 and the second direction A2. For example, the first segment 413 is inclined at 15 degrees with respect to the second direction A2 (this angle value is merely an example for illustrative purposes and is not limited to this solution; other angle values ​​may be used). The electrical length of the components of the first segment 413 in the second direction A2 is 0.25λ. Similarly, there may be angles between the second segment 414 and the first direction A1, and between the third segment 415 and the first direction A1. The sum of the electrical lengths of the components of the second segment 414 in the first direction A1 and the electrical lengths of the components of the third segment 415 in the first direction A1 is between 0.1λ and 0.35λ (for example, it may be 0.25λ).

[0072] In this implementation, as shown in Figure 11, the grounding section 42 has a two-segment structure. The grounding section 42 includes a fourth segment 423 and a fifth segment 424. The fourth segment 423 and the first segment 413 may extend in parallel. The fourth segment 423 and the first segment 413 may be parallel to each other. The fifth segment 424 and the third segment 415 extend in parallel. The fifth segment 424 and the third segment 415 may be parallel to each other. The electrical length of the fourth segment 423 may be between 0.1λ and 0.35λ (for example, 0.25λ), and the electrical length of the fifth segment 424 may be between 0.1λ and 0.35λ (for example, 0.25λ). The fourth segment 423 is directly connected to the ground element 30 of the antenna module 10, and may be directly connected by welding or fixed by using a conductive adhesive.

[0073] For another implementation configuration, please refer to Figure 12. The main difference between the implementation configuration shown in Figure 12 and the implementation configuration shown in Figure 11 is that the grounding section 42 has a three-segment structure. The grounding section 42 further includes a sixth segment 425 in addition to the fourth segment 423 and the fifth segment 424. The sixth segment 425 and the second segment 414 extend in parallel. An L-shaped transmission line architecture can be formed between the sixth segment 425 and the fourth segment 423. The end of the sixth segment 425 away from the fourth segment 423 is connected to the ground element 30 of the feed element 40. The extending direction of both the sixth segment 425 and the fifth segment 424 can be the first direction A1. The combined electrical length of the sixth segment 425 and the fifth segment 424 is between 0.1λ and 0.35λ (for example, it may be 0.25λ). In this implementation, the fourth segment 423 is isolated from the ground element 30 of the antenna module 10 by using an insulating medium.

[0074] In one implementation configuration, as shown in the implementation configurations of Figures 11 and 12, the fourth segment 423 and the fifth segment 424 are perpendicular to each other, forming an L-shaped transmission line architecture, and the first segment 413 and the third segment 415 also form an L-shaped transmission line architecture. The first segment 413 and the second segment 414 also form an L-shaped transmission line architecture. In another implementation configuration, the angle between the fourth segment 423 and the fifth segment 424 may be greater than or less than 90 degrees. Similarly, the angles between the first segment 413 and the third segment 415, and between the first segment 413 and the second segment 414, may also be greater than or less than 90 degrees.

[0075] For one implementation configuration, please refer to Figure 13. Power supply transmission unit 41 of, Extending in the second direction A2 transmission lineThe transmission line includes at least two transmission line segments, which are parallel to each other but not collinear. The vertical distance from the segment of the transmission line extending in the second direction A2 to the ground element 30 of the antenna module 10 is different. This solution is a specific cabling solution for the power supply transmission unit 41. In this application, different forms of the power supply transmission unit 41 can be arranged based on different specific assembly and electromagnetic field environments of the antenna module, and different designs can be realized by adjusting specific transmission modes on the isolation setting. This is simple and easy to implement. At least two transmission line segments are connected via a transmission line extending in the first direction A1. In this implementation, extending in the first direction A1 and extending in the second direction A2 can be understood as follows: it may coincide with the first direction A1, or it may form an angle with the first direction A1, but has a component perpendicular to the first direction A1; or it may coincide with the second direction A2, or it may be perpendicular to the second direction A 2 An angle may be formed with the second direction A2, but it has a component perpendicular to the second direction A2. In a particular implementation, the power supply transmission unit 41 has two transmission lines extending in the second direction A2, and the power supply transmission unit 41 has a five-segment structure. In other words, the power supply transmission unit 41 includes two transmission line segments extending in the second direction and three transmission line segments extending in the first direction A1. The sum of the electrical lengths of the two transmission line segments extending in the second direction A2 is between 0.1λ and 0.35λ (for example, it may be 0.25λ), and the sum of the electrical lengths of the three transmission line segments in the first direction A1 is between 0.1λ and 0.35λ (for example, it may be 0.25λ).

[0076] In the implementation configurations shown in Figures 11, 12, and 13, the power transmission unit 41 and the grounding unit 42 may be on the same plane, meaning that the power transmission unit 41 and the grounding unit 42 are located on the same plane. In other words, the plane of the insulating support supporting the power transmission unit 41 and the grounding unit 42 is the same. For example, if the insulating support is a circuit board structure, the power transmission unit 41 and the grounding unit 42 are located on the same layer of the circuit board. The thickness of the power transmission unit 41 and the grounding unit 42 is not considered in this application. The thickness of the power transmission unit 41 and the thickness of the grounding unit 42 may be different. However, if the power transmission unit 41 and the grounding unit 42 are arranged on the same plane, it can be understood that they are on the same plane. Coplanar designs have lower manufacturing costs, and the positional relationship between the power transmission unit and the grounding unit is easier to control.

[0077] If the insulating support is of a different type, the power transmission section 41 and the grounding section 42 are located on the same surface of the insulating support. In this configuration, the power transmission section 41 extends with equal width from the first power supply end 411 to the second power supply end 412. The grounding section 42 also extends with equal width from the first grounding end 421 to the second grounding end 422. The width of the grounding section 42 is greater than the width of the power transmission section 41.

[0078] Alternatively, the power transmission section 41 and the ground section 42 of the power supply element 40 in the implementation configurations shown in Figures 11, 12, and 13 do not have to be on the same plane. For example, when the power supply element 40 is placed on a circuit board, the power transmission section 41 and the ground section 42 may be located separately on different layers of the circuit board, but the structure and positional relationship of the projections of the power transmission section 41 and the ground section 42 on the same surface of the circuit board is the architecture shown in Figures 11, 12, and 13.

[0079] For other implementation configurations, please refer to Figures 14, 15, 16, and 17. The plane on which the power transmission unit 41 is located and the plane on which the grounding unit 42 is located are not coplanar. In other words, the power transmission unit 41 and the grounding unit 42 form a non-coplanar transmission line architecture. In Figures 14 and 15, the power transmission unit 41 and the grounding unit 42 are located on two surfaces of the circuit board. The power transmission unit 41 is represented using solid lines and internal cross-sectional lines to indicate that the surface on which the power transmission unit 41 is located on the circuit board is a visible surface. The grounding unit 42 is represented using dashed lines and blanks (no cross-sectional lines). The surface on which the grounding unit 42 is located on the circuit board is an invisible surface. Specifically, the implementation configurations shown in Figures 14, 15, 16, and 17 show that the power transmission section 41 and the ground section 42 are located on different layers of the circuit board 43, but the projections of the power transmission section 41 and the ground section 42 on the same surface of the circuit board 43 overlap at least partially. Compared to a coplanar design, the non-coplanar transmission architecture provided in this solution has the advantage of saving space and reducing the area occupied on the board. The thickness of the circuit board is used solely for insulation between the power transmission section and the ground section, thereby reducing manufacturing costs. The circuit board 43 includes a first surface 431, a second surface 432, an upper edge 433, and a lower edge 434. The first surface 431 and the second surface 432 are arranged facing each other in a third direction A3. The power transmission section 41 is located on the first surface 431, and the ground section 42 is located on the second surface 432. Both the power transmission section 41 and the ground section 42 extend from the lower edge 434 to the upper edge 433. The circuit board 43 includes a plug structure 435. The plug structure 435 protrudes from the upper edge 433. The plug structure 435 is configured to be electrically connected to the radiating element 20. Specifically, a conductive connection section 436 is located on the plug structure 435, and the conductive connection section 436 is electrically connected to the power transmission section 41. The first grounding end 421 of the ground section 42 extends to the upper edge 433 and is configured to be electrically connected to the ground element 30. A clamp groove 437 is provided on the lower edge 434, and the clamp groove 437 is used to fix the circuit board to another circuit board or support.In a third direction A3 (for example, the third direction A3 may be the thickness direction of the circuit board), the power transmission section 41 faces the ground section 42 directly. The third direction A3 is perpendicular to the second direction A2, and the third direction A3 is also perpendicular to the first direction A1. The extended solutions and specific embodiments of the power transmission section 41 in the first direction A1 and the second direction A2 are the same as those in the implementation shown in Figure 11, and the extended solutions and specific embodiments of the ground section 42 in the first direction A1 and the second direction A2 are the same as those of the power transmission section 41. In one implementation, the power transmission section 41 and the ground section 42 of the antenna module provided by this solution may be located on two surfaces of the circuit board (for example, the front and rear surfaces).

[0080] In the implementation shown in Figure 14, the power transmission unit 41 extends with equal width from the first power supply end 411 to the second power supply end 412. from Second grounding terminal 422 to The grounding section 42 also extends with equal width. However, the width of the power supply transmission section 41 is different from the width of the grounding section 42.

[0081] In the implementation shown in Figure 15, the power transmission unit 41 (having the same structural configuration as the power transmission unit 41 in the implementation shown in Figure 14) extends with equal width from the first power supply end 411 to the second power supply end 412. from Second grounding terminal 422 to A portion of the ground contact portion 42 extends with equal width, and a portion of the ground contact portion 42 extends with unequal width. Specifically, the portion of the ground contact portion 42 extending in the second direction extends with equal width, the upper half of the portion of the ground contact portion 42 extending in the first direction extends with equal width, and the lower half of the portion of the ground contact portion 42 extending in the first direction extends with unequal width. The portion of the ground contact portion 42 extending with unequal width has a trapezoidal structure that is narrower at the top and wider at the bottom. In other implementations, the portion of the ground contact portion 42 extending with unequal width may be alternatively arranged in a different shape (e.g., square or circular) or in a different location (e.g., located in the portion extending in the second direction or in the upper half of the portion extending in the first direction).

[0082] The power supply transmission section and grounding section, which extend with uneven widths, may extend with gradually changing widths to facilitate impedance adjustment.

[0083] In the implementation shown in Figure 16, with respect to the power transmission section 41, a portion of the power transmission section 41 extends with equal width from the first power supply end 411 to the second power supply end 412, while a portion of the power transmission section 41 extends with unequal width. With respect to the grounding section 42, the first grounding end 421 from Second grounding terminal 422 to The contact portion 42 extends with equal width.

[0084] In the implementation shown in Figure 17, with respect to the power supply transmission section 41, a portion of the power supply transmission section 41 extends with equal width from the first power supply end 411 to the second power supply end 412, while a portion of the power supply transmission section 41 extends with unequal width. With respect to the grounding section 42, the first grounding end 421 from Second grounding terminal 422 to A portion of the contact area 42 extends with equal width, while a portion of the contact area 42 extends with unequal width.

[0085] Refer to Figures 7, 8, and 9. In one implementation configuration, the antenna module 10 includes a support 15 containing a printed circuit board. The antenna module 10 is formed by a radiating element 20, a ground element 30, and a feeding element 40 formed on the support 15. This has advantages such as ease of manufacture and low manufacturing cost. The support 15 has a first plate 151, a second plate 152, and a third plate 153. The radiating element 20 and the ground element 30 are formed on the first plate 151. The second plate 152 is an insulating support for arranging the feeding element 40. The second plate 152 and the third plate 153 are arranged to intersect and both are located between the first plate 151 and the main board 103. The specific structure of the second plate 152 may be the same as the structure of the circuit board 43 in the implementation configuration shown in Figure 14.

[0086] Please refer to Figures 18 and 19. The first plate 151 is stacked LayersThe first plate 152 has a first layer 1511 and a second layer 1512. In one mounting configuration, the first layer 1511 is the upper surface of the first plate 151, and the second layer 1512 is the lower surface of the first plate 151. The radiating element 20 is located on the first layer 1511, and the ground element 30 is located on the second layer 1512. The second plate 152 includes a first edge 1522 and a second edge 1523 that are arranged opposite each other, and a cable layer 1521. The cable layer 1521 is located between the first edge 1522 and the second edge 1523. The second plate 152 is located to the side of the first plate 151. The first edge 1522 is connected to the first plate 151. The power supply element 40 is located on the cable layer 1521. An angle is formed between the cable layer 1521 and the first layer 1511. Specifically, the cable layer 1521 may be perpendicular to the first layer 1511. The main board 103, ground element 30, and radiating element 20 are stacked in order in the first direction A1. Layers The main board 103, the second plate 152, and the first plate 151 are connected in order in the first direction A1. The main board 103 and the first plate 151 can be arranged parallel to each other. For example, the main board 103 and the first plate 151 are in a horizontal arrangement, and the second plate 152 is vertical. Direct delivery The antenna module 10 is in a stationary state. Both the first plate 151 and the second plate 152 are flat structures, and the second plate 152 can be connected perpendicularly between the main board 103 and the first plate 151. In this solution, the antenna module 10 is provided with the first plate 151 and the second plate 152. The manufacturing process is simple and the manufacturing cost is low. In addition, the antenna module 10 has the advantage of being lightweight. This makes it easier to design slim and short communication devices.

[0087] In an alternative implementation, the radiating element 20, the ground element 30, and the power supply element 40 may be instead arranged on a different type of insulating support, for example, on a one-piece plastic support formed by injection molding. One portion of the plastic support is configured to accommodate the radiating element 20 and the ground element, and the other portion of the plastic support is configured to accommodate the power supply element 40. The plastic support may be cylindrical, square, or otherwise suitable for supporting the radiating element 20, the ground element, and the power supply element 40.

[0088] Refer to Figures 18 and 19. In this solution, the ground portion 42 is electrically connected to the ground element 30 via a connection between the first edge portion 1522 and the first plate 151. Specifically, in one implementation configuration, the first edge portion 1522 is in contact with the first plate 151. The ground portion 42 may be electrically connected to the ground element 30 via contact between the ground portion 42 in the cable layer 1521 and the ground element 30 on the first plate 151, or the ground portion 42 may be stably connected to the ground element 30 by welding. In one implementation configuration, the ground element 30 is located on the surface of the first plate 151, and the ground portion 42 is located on the surface of the second plate 152. If the first plate 151 is in contact with the second plate 152, the ground element can be fixed to the ground portion 42 by welding. The semicircular black areas in Figure 19 represent the welding locations. The implementation configuration shown in Figure 19 merely provides a schematic representation of the welding relationship between the grounding portion 42 and the ground element 30, and does not constitute a limitation to a specific welding location or welding structure.

[0089] Refer to Figures 18 and 19. A connecting structure 50 is positioned at the junction between the first plate 151 and the second plate 152, and the connecting structure 50 can be understood as a structure similar to a connector, or a structure in which a plug matches a jack. The connecting structure 50 is configured to realize an electrical connection between the power transmission unit 41 and the radiating element 20. In this application, the electrical connection between the power transmission unit 40 and the radiating element 20 and the electrical connection between the power transmission unit 40 and the ground element 30 can be made in the process of assembling and connecting the first plate 151 and the second plate 152. Such an electrical connection is highly reliable and has low loss. In one implementation configuration, in this application, the electrical connection between the power transmission unit 41 and the radiating element 20 is realized through a match between a structure protruding from the edge of the second plate 152 and a hole structure on the first plate 151. Specifically, the first plate 151 is provided with a hole 1513 that penetrates the first layer 1511 and the second layer 1512. The second plate 152 includes a plug structure 435 that protrudes from the first edge 1522. At least a portion of the plug structure 435 is located within the hole 1513. The connection structure 50 includes the hole 1513 and the plug structure 435, and the connection structure 50 further includes a conductive connection portion 436. As shown in Figure 19, the conductive connection portion 436 is electrically connected between the radiating element 20 and the power supply transmission unit 41. The conductive connection portion 436 may include a conductive layer, a conductive sheet, a conductive adhesive, or solder that is electrically connected between the radiating element 20 and the power supply transmission unit 41.

[0090] As shown in Figures 18 and 19, in one mounting configuration, the hole 1513 on the first plate 151 is a through hole. The hole 1513 has a first open end E1 and a second open end E2. The plug structure 435 is inserted into the hole 1513 from the first open end E1. The conductive connector 436 is welded to the radiating element 20 from the second open end E2 side. The first layer 1511 is the upper surface of the first plate 151, and the second layer 1512 is the lower surface of the first plate 151. The first open end E1 is located on the lower surface, and the second open end E2 is located on the upper surface.

[0091] As shown in Figure 19, the second edge 1523 of the second plate 152 is connected to the main board 103 of the communication device. A ground plane 103G is located inside the main board 103, and a radio frequency chip 103F is located on the main board 103. The power supply transmission unit 41 of the power supply element 40 is electrically connected to the radio frequency chip 103F via a transmission line within the main board 103, and the ground portion 42 of the power supply element 40 is electrically connected to the ground plane 103G within the main board 103. Figure 19 schematically shows the connection method between the ground portion 42 and the ground plane 103G on the main board 103, and the connection method between the power supply transmission unit 41 and the radio frequency chip 103F via the transmission line. The specific location of the ground plane 103G, the specific location of the radio frequency chip 103F, and the specific form of the transmission line are not limited. It can be understood that the main board 103 has a multilayer circuit board structure. The ground plane 103G may be one of the layers, the transmission line may be located in one of the layers, and the radio frequency chip 103F may be placed on the surface of the main board 103. In one mounting configuration, the radio frequency chip 103F is placed on the surface of the main board 103, away from the antenna module 10, and an electromagnetic shielding space (shown in Figure 3) is formed by the structure of the first housing 101 of the communication device 100 and the main board 103.

[0092] Refer to Figures 20 and 21. The difference between the mounting configurations shown in Figures 20 and 21 and those shown in Figures 18 and 19 is that in the mounting configurations shown in Figures 18 and 19, the inner wall of the hole 1513 on the first plate 151 is made of the insulating material of the first plate 151. In other words, the inner wall of the hole 1513 does not have a conductive structure. The conductive connector 436 is welded to the radiating element 20 from the second open end E2. In the mounting configurations shown in Figures 20 and 21, a conductive layer 1514 is placed on the inner wall of the hole 1513 of the first plate 151, and the conductive layer 1514 is electrically connected to the radiating element 20. The plug structure 435 is inserted into the hole 1513 of the first plate 151, and the electrical connection between the conductive connector 436 and the conductive layer 1514 can be achieved inside the hole 1513 by using a conductive adhesive or solder. In this solution, the strength and stability of the electrical connection of the connection structure 50 between the power supply transmission unit 41 and the radiating element 20 are improved.

[0093] Refer to Figures 7, 8, and 9. In addition to the plug structure 435 for connecting the first edge 1522 of the second plate 152 to the first plate 151, the second plate 152 further includes positioning rods 1524 protruding from the first edge 1522. In one configuration, there are two positioning rods 1524, which are symmetrically arranged on both sides of the plug structure 435. Correspondingly, the first plate 151 is provided with positioning holes 1515 arranged in a one-to-one correspondence with the positioning rods 1524. Specifically, there are two positioning holes 1515, which are symmetrically arranged on both sides of a hole 1513. The positioning rods 1524 are inserted into the positioning holes 1515 respectively to secure the first plate 151 to the second plate 152. The third plate 153 is also fixed to the first plate 151 via alignment between the positioning rod and the positioning hole.

[0094] For specific implementation configurations, please refer to Figure 8. The antenna module further includes a reflecting element 60 and a lumped element 70. The lumped element 70 is mounted on the reflecting element 60, and the operation of the reflecting element 60 is controlled by controlling the lumped element 70. Switching between the high-density state and the isotropic state of the antenna module is achieved by the operation of the reflecting element 60.

[0095] In a specific implementation, the first primary antenna 10A1 is placed on the second plate 152. The radiating element 20, ground element 30, and feeding element 40 form the second primary antenna 10A2. The resonant frequency of the first primary antenna 10A1 is the first frequency, and the resonant frequency of the second primary antenna 10A2 is the second frequency. The second frequency is higher than the first frequency. The first frequency is 2.4 GHz, and the second frequency is 5 GHz. Hz The antenna module 10 includes a plurality of antenna elements 10A. Each antenna element 10A includes one first primary antenna 10A1 and one second primary antenna 10A2.

[0096] Referring to Figures 22 and 23, Figure 23 is a diagram showing the marked distances and marked heights of the antenna module in the implementation configuration shown in Figure 22. The distance D3 between the first primary antenna 10A1 and the first primary antenna 10A1 of the adjacent antenna element 10A is between 0.2 times the wavelength and 0.8 times the wavelength.

[0097] The antenna element 10A further includes a first decoupling structure 13 and a second decoupling structure 14. The first decoupling structure 13 is located on a second plate 152, and the second decoupling structure 14 is located on a third plate 153. The ends of the second plate 152 and the third plate 153, away from the first plate 151, are connected to the main board 103 of the communication device. In a direction perpendicular to the ground plane of the main board 103 of the communication device, the longest distance between the first decoupling structure 13 and the ground plane 103G of the main board 103 is the cross-sectional height H1 of the first decoupling structure 13. The cross-sectional height H1 of the first decoupling structure 13 is between 0.01 times the wavelength and 0.16 times the wavelength. The distance between the first decoupling structure 13 and the first primary antenna 10A1 is the first distance D1. The distance between the first decoupling structure 13 and the first primary antenna 10A1 of the adjacent antenna element 10A is the second distance D2. Both the first distance D1 and the second distance D2 are between 0.1 times the wavelength and 0.6 times the wavelength.

[0098] The first distance D1 is the distance between the phase center of the first decoupling structure 13 and the phase center of the first primary antenna 10A1. The second distance D2 is the distance between the phase center of the first decoupling structure 13 and the phase center of the first primary antenna 10A1 of the adjacent antenna element 10A. In this application, the first decoupling structure 13 is positioned to achieve small dimensions for the entire antenna module. This facilitates the thin design of the communication device and further solves the problem of isolation between the first primary antennas 10A1 of adjacent antenna elements. By controlling the cross-sectional height of the first decoupling structure 13, the distance between the first decoupling structure 13 and the first primary antenna 10A1, and the distance between the first decoupling structure 13 and the first primary antenna 10A1 of the adjacent antenna element, the isolation between adjacent first primary antennas 10A1 in a limited space can be improved and the impact on the radiation efficiency of the first primary antennas 10A1 can be reduced. There is no obvious dip in the simulation diagram of the radiation efficiency of the adjacent first primary antenna 10A1.

[0099] In the antenna module 10 provided in this application, the antenna elements 10A are designed to have the same architecture. In the process of assembling multiple antenna elements 10A onto the main board 103, since the structure of all antenna elements 10A is the same, it is not necessary to consider the specific structure of each antenna element 10A. The antenna elements 10A need to be positioned based only on the location of the radio frequency chip. Thus, this mounting configuration helps to simplify the assembly process of the communication device, reduce assembly costs, and improve manufacturing efficiency.

[0100] The second decoupling structure 14 is configured to reduce the amount of coupling between the first primary antenna 10A1 and the first primary antenna 10A1 of the adjacent antenna element 10A, and the resonant frequency of the second decoupling structure 14 is either higher than or lower than the first frequency. The frequency difference between the resonant frequency of the second decoupling structure 14 and the first frequency is between 0.03 GHz and 0.33 GHz. By limiting the resonant frequency of the second decoupling structure 14 to the range of (fL-0.33 GHz) to (fL-0.03 GHz) or (fH+0.03 GHz) to (fH+0.33 GHz), isolation can be improved without introducing a drop in efficiency in the bandwidth. Here, fL to fH is the frequency range of the first primary antenna 10A1 (i.e., the first frequency). For example, fL to fH is 2.4 GHz to 2.5 GHz.

[0101] The distances D4 and D5 between the second decoupling structure 14 and the first primary antenna 10A1 are between 0.05 times the wavelength and 0.6 times the wavelength. The distances D4 and D5 between the second decoupling structure 14 and the first primary antenna 10A1 may be shorter than the distance between the first decoupling structure 13 and the first primary antenna 10A1 (first distance D1), or shorter than the distance between the first decoupling structure 13 and the first primary antenna 10A1 of the adjacent antenna element 10A (second distance D2).

[0102] In this application, the resonant frequency of the second decoupling structure 14 is adjusted so that the resonant frequency of the second decoupling structure 14 is not the same as the first frequency, but slightly higher or lower. This achieves decoupling between the first primary antennas 10A1 of adjacent antenna elements 10A, thereby improving isolation and reducing the impact on the radiation efficiency of the antennas. Specifically, when the second decoupling structure 14 generates resonance, a drop in efficiency occurs for electromagnetic waves at the resonant frequency of the second decoupling structure 14. In the case of the first primary antenna 10A1 of adjacent antenna elements 10A, the drop in efficiency caused by the second decoupling structure 14 avoids the in-band frequency of resonance (i.e., the first frequency) of the first primary antenna 10A1 of the adjacent antenna element 10A, and the influence of the second decoupling structure 14 on the radiation efficiency of the first primary antenna 10A1 of the adjacent antenna element 10A can be reduced.

[0103] In this application, the distance between the two first primary antennas is shortened, and the first primary antenna 10A1 and the second primary antenna 10A2 are arranged on the same support, thereby saving space on the main board 103 and facilitating the design of a small antenna module. The distance between the two first primary antennas 10A1 is between 0.2 times the wavelength and 0.8 times the wavelength. If the first decoupling structure is not placed on each antenna element, when the two first primary antennas 10A1 are in a resonant state, the two first primary antennas will receive signals from each other, resulting in signal interference and insufficient isolation. Therefore, in this application, the distance between the two first primary antennas 10A1 is set between 0.2 times the wavelength and 0.8 times the wavelength, and the first decoupling structure 13 and the second decoupling structure 14 are provided. Ensure isolation, and thereby, Two first primary ante Na radioactive effect rate They are arranged to improve performance.

[0104] In this application, the first decoupling structure 13 is positioned to achieve small antenna dimensions. This facilitates the thin design of the communication device and further solves the isolation problem between adjacent first primary antennas 10A1. By controlling the cross-sectional height of the first decoupling structure 13, the distance between the first decoupling structure 13 and the first primary antenna 10A1, and the distance between the first decoupling structure 13 and adjacent first primary antennas 10A1, the isolation between adjacent first primary antennas 10A1 in a limited space can be improved, and the impact on the radiation efficiency of the first primary antennas 10A1 can be reduced. As a result, there is no obvious dip in the simulation diagram of the radiation efficiency of the first primary antennas 10A1.

[0105] In this application, the resonant frequency of the second decoupling structure 14 is adjusted so that the resonant frequency of the second decoupling structure is not the same as the first frequency, but slightly higher or lower. This achieves decoupling between the first primary antennas 10A1, thereby improving isolation and reducing the impact on the antenna's radiation efficiency. Specifically, when the second decoupling structure 14 resonates, a drop in efficiency occurs for electromagnetic waves at the resonant frequency of the second decoupling structure 14. In the case of the first primary antenna 10A1, the drop in efficiency caused by the second decoupling structure 14 avoids the in-band frequency of resonance of the first primary antenna 10A1 (i.e., the first frequency), and thus the influence of the second decoupling structure 14 on the radiation efficiency of the first primary antenna 10A1 can be reduced.

[0106] Finally, it should be noted that the embodiments described above are for illustrative purposes only and not to limit the present application. Although this application is described in detail with reference to the embodiments described above, those skilled in the art should understand that modifications can still be made to the technical solutions described in the embodiments described above, or equivalent substitutions can be made to some of their technical features, without departing from the scope of the technical solutions of the embodiments of this application.

Claims

1. It is an antenna module, Stacked radiating elements and ground elements, A power supply element, wherein the power supply element is a transmission line structure formed on an insulating support, in a first direction, the power supply element is located on the side of the ground element away from the radiating element, the power supply element comprises a power supply transmission section and a ground section, the power supply transmission section is separated and insulated from the ground section, the width of the power supply transmission section includes a first width, the width of the ground section includes a second width, the first width is not equal to the second width, the width of the power supply transmission section is the dimension of the power supply transmission section in a direction perpendicular to the extension path of the power supply transmission section, and the width of the ground section is the dimension of the ground section in a direction perpendicular to the extension path of the ground section. An antenna module equipped with the following features.

2. The antenna module according to claim 1, wherein in the extension path of the power supply transmission unit, the electrical length of the power supply transmission unit is between 0.3λ and 0.7λ (including 0.3λ and 0.7λ), and λ is the wavelength of the electromagnetic wave of the radiating element in a resonant state.

3. The antenna module according to claim 2, wherein the extension path of the power supply transmission section and the extension path of the grounding section form a double parallel line architecture.

4. The antenna module according to any one of claims 1 to 3, wherein the total electrical length of the power supply transmission section in the second direction is between 0.15λ and 0.35λ, where λ is the wavelength of the electromagnetic wave of the radiating element in a resonant state, and the second direction is perpendicular to the first direction.

5. The antenna module according to claim 4, wherein the power supply transmission section is formed by combining a plurality of L-shaped transmission lines, each of the plurality of L-shaped transmission lines includes a transmission line segment extending in the second direction, and the transmission line segments are on the same straight line.

6. The antenna module according to claim 4, wherein several transmission lines extending in the second direction of the power supply transmission unit include at least two transmission line segments, and the at least two transmission line segments are connected to each other via transmission lines extending in the first direction.

7. The antenna module according to any one of claims 1 to 3, wherein the power supply transmission unit and the grounding unit are on the same plane.

8. The antenna module according to any one of claims 1 to 3, wherein the plane on which the power supply transmission unit is located and the plane on which the grounding unit is located are not on the same plane, the power supply transmission unit and the grounding unit are arranged facing each other in a third direction, the third direction is perpendicular to the second direction, and the third direction is also perpendicular to the first direction.

9. The power supply transmission unit includes a first power supply end and a second power supply end, the first power supply end being electrically connected to the radiating element, and the second power supply end being electrically connected to a radio frequency chip on the main board of the communication device, and the power supply transmission unit extends from the first power supply end to the second power supply end with equal width and / or The grounding portion includes a first grounding end and a second grounding end, the first grounding end being electrically connected to the ground element, and the second grounding end being electrically connected to the ground on the main board of the communication device, and the grounding portion extends with equal width from the first grounding end to the second grounding end. The antenna module according to any one of claims 1 to 3.

10. The power supply transmission unit includes a first power supply end and a second power supply end, the first power supply end is electrically connected to the radiating element, and the second power supply end is configured to be electrically connected to a radio frequency chip on the main board of the communication device, and a portion of the power supply transmission unit extends from the first power supply end to the second power supply end with equal width, a portion of the power supply transmission unit extends with unequal width, and / or The grounding portion includes a first grounding end and a second grounding end, the first grounding end being electrically connected to the ground element, and the second grounding end being electrically connected to the ground on the main board of the communication device, and from the first grounding end to the second grounding end, a portion of the grounding portion extends with equal width, and a portion of the grounding portion extends with unequal width. The antenna module according to any one of claims 1 to 3.

11. The power supply transmission unit includes a first power supply end and a second power supply end, the first power supply end being electrically connected to the radiating element, and the second power supply end being electrically connected to a radio frequency chip on the main board of the communication device, and the power supply transmission unit extends with equal width from the first power supply end to the second power supply end. The grounding portion includes a first grounding end and a second grounding end, the first grounding end being electrically connected to the ground element, and the second grounding end being electrically connected to the ground on the main board of the communication device, and from the first grounding end to the second grounding end, a portion of the grounding portion extends with equal width, and a portion of the grounding portion extends with unequal width. The antenna module according to any one of claims 1 to 3.

12. The grounding portion includes a first grounding end and a second grounding end, the first grounding end being electrically connected to the ground element, and the second grounding end being electrically connected to the ground on the main board of the communication device, and the grounding portion extends with equal width from the first grounding end to the second grounding end. The power supply transmission unit includes a first power supply terminal and a second power supply terminal, wherein the first power supply terminal is electrically connected to the radiating element, and the second power supply terminal is electrically connected to the radio frequency chip on the main board of the communication device, and a portion of the power supply transmission unit extends from the first power supply terminal to the first power supply terminal with equal width, and a portion of the power supply transmission unit extends with unequal width. The antenna module according to any one of claims 1 to 3.

13. The antenna module comprises a first plate and a second plate, The first plate comprises a stacked first layer and a second layer, the radiating element is located in the first layer, and the ground element is located in the second layer. The second plate is the insulating support, and the second plate includes a first edge and a second edge arranged opposite to each other, and a cable layer, the cable layer being located between the first edge and the second edge, the second plate being located to the side of the first plate, the first edge being connected to the first plate, the power supply element being arranged in the cable layer, and an angle being formed between the cable layer and the first layer. The antenna module according to any one of claims 1 to 3.

14. The antenna module according to claim 13, wherein the ground portion is electrically connected to the ground element via a connection between the first edge portion and the first plate, a connection structure is disposed at the joint between the first plate and the second plate, and the connection structure is configured to realize an electrical connection between the power supply transmission portion and the radiating element.

15. The antenna module according to claim 14, wherein the first plate is provided with a hole penetrating the first layer and the second layer, the second plate includes a plug structure protruding from the first edge, at least a portion of the plug structure is located within the hole, the connection structure includes the hole and the plug structure, the connection structure further includes a conductive connection portion, the conductive connection portion is electrically connected between the radiating element and the power supply transmission portion.

16. The antenna module according to claim 15, wherein the hole is a through hole, the hole includes a first open end and a second open end, the plug structure is inserted into the hole from the first open end, and the conductive connection portion is welded to the radiating element from the side of the second open end.

17. The antenna module according to claim 16, wherein the first layer is the upper surface of the first plate, the second layer is the lower surface of the first plate, the first open end is located on the lower surface, and the second open end is located on the upper surface.

18. The antenna module according to claim 13, wherein the second edge of the second plate is connected to the main board of the communication device, the ground portion of the power supply element is electrically connected to a ground plane on the main board, and the power supply transmission unit is electrically connected to a radio frequency chip on the main board via a transmission line arranged on the main board.

19. The antenna module according to claim 13, wherein a first primary antenna is arranged on the second plate, the radiating element, the ground element, and the feeding element form a second primary antenna, the resonant frequency of the first primary antenna is a first frequency, the resonant frequency of the second primary antenna is a second frequency, and the second frequency is higher than the first frequency.

20. A communication device comprising a radio frequency chip and an antenna module according to any one of claims 1 to 3, wherein the antenna module is electrically connected to the radio frequency chip.

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