Exposure equipment

Abstract

To provide exposure equipment capable of detecting positional deviation between a spatial light modulation device and a micro-lens array, even during an exposure operation.SOLUTION: Exposure equipment 100 comprises: a spatial light modulation device 41 comprising a plurality of pixel parts; a micro-lens array part 73 comprising a plurality of micro lenses 731, and condensing light emitted from each of the plurality of pixel parts on each of the plurality of micro lenses 731; a reflection region 732 provided on the micro-lens array part 73; a sensor part 74 for detecting reflectance which is light emitted from a prescribed position of the spatial light modulation device 41 and enters the reflection region 732 and then is reflected on the reflection region 732; and a positional deviation detection part 502 for detecting positional deviation between the spatial light modulation device 71 and the micro-lens array part 73, on the basis of detection information on the sensor part 74.SELECTED DRAWING: Figure 7

Description

Technical Field

[0001] The present disclosure relates to an exposure apparatus.

Background Art

[0002] There is known an exposure apparatus (so-called direct drawing apparatus) of a type that exposes a photosensitive material with a desired two-dimensional pattern by irradiating the photosensitive material with pattern light formed by spatial modulation.

[0003] In such an exposure apparatus, the formation of pattern light is performed using, for example, a spatial light modulator. As an example, a DMD (Digital Micromirror Device), which is a type of spatial light modulator, is a device in which a plurality of micromirrors are two-dimensionally arranged, and the angle formed by each micromirror with respect to incident light is controlled according to the pattern to be drawn, so that spatial modulation is applied to the incident light to form pattern light.

[0004] By the way, in an exposure apparatus that forms pattern light using a spatial light modulator, a microlens array (MLA) in which a plurality of microlenses are arranged may be provided on the optical path of the pattern light formed by the spatial light modulator (see, for example, Patent Documents 1 and 2). When the pattern light formed by the spatial light modulator is imaged on the microlens array through an imaging optical system or the like, the light incident from each pixel portion of the spatial light modulator (specifically, for example, each micromirror of the DMD) to each microlens is condensed and narrowed by the microlens, and a light spot (condensed spot) for one pixel is formed. That is, the pattern light formed by the spatial light modulator is shaped into a spot array composed of a plurality of condensed spots by passing through the microlens array. By irradiating a photosensitive material or the like with the pattern light shaped into a spot array, it is possible to realize fine drawing performance while maintaining a wide field of view.

Prior Art Documents

Patent Documents

[0005] [Patent Document 1] Japanese Patent Publication No. 2020-34619 [Patent Document 2] Japanese Patent Publication No. 2004-296531 [Overview of the project] [Problems that the invention aims to solve]

[0006] Incidentally, when shaping the patterned light formed by the spatial light modulator into a spot array through a microlens array, it is important that the spatial light modulator and the microlens array are in the correct positional relationship. Specifically, the correct positional relationship means that each pixel of the spatial light modulator corresponds one-to-one with each microlens of the microlens array, and that the light from each pixel is incident on the corresponding microlens and not on the adjacent microlens. That is, as illustrated in Figure 16(a), the image (pixel image) A formed on the microlens array by the light from each pixel of the spatial light modulator overlaps with the corresponding microlens 91 and does not overlap with the non-corresponding microlens 91. If a misalignment occurs between the spatial light modulator and the microlens array, and the correct positional relationship is lost, there is a possibility that some of the light from each pixel of the spatial light modulator may be incident on the microlens adjacent to the corresponding microlens. That is, if a misalignment occurs, as illustrated in Figure 16(b), there is a possibility that a part of the pixel image A may overlap with the non-corresponding microlens 91. This results in a decrease in the extinction ratio, and the sharpness of the image (exposure) deteriorates.

[0007] To prevent such situations from occurring, the spatial light modulator and the microlens array are aligned with sufficient precision during the assembly of the exposure apparatus so that they are in the correct relative positions. However, even if the spatial light modulator and the microlens array are aligned with sufficient precision during the assembly stage, when the exposure apparatus is actually operated and exposure operations are performed, various factors (for example, thermal expansion of the holding members that hold the spatial light modulator and the microlens array (thermal expansion in response to changes in ambient temperature, etc.), the release of residual stress when the spatial light modulator and the microlens array are assembled over time, vibrations caused by the exposure operation, etc.) can cause the relative positional relationship between the two to change, potentially resulting in a misalignment between them.

[0008] For example, Patent Document 1 proposes detecting misalignment between the DMD and the microlens array and adjusting their relative positions to reduce the misalignment. In this method, an adjustment mirror is provided on the DMD and an adjustment pattern is provided on the microlens array. The transmitted light emitted from the adjustment mirror and passing through the adjustment pattern is received by a sensor. Based on the sensor's detection information, the relative positions between the DMD and the microlens array are identified, and if misalignment occurs, at least one of the two is moved to reduce it.

[0009] In this configuration, the sensor is positioned downstream of the microlens array, for example, directly below the exposure head, in the optical path of the light irradiated from the DMD through the microlens array onto the object to be processed (e.g., a substrate on which a layer of photosensitive material is formed), in order to receive the transmitted light that has been emitted from the adjustment mirror provided on the DMD and passed through the adjustment pattern provided on the microlens array. However, in this case, for example, while the exposure operation is being performed, the object to be processed is positioned directly below the exposure head, making it difficult for the sensor to detect the transmitted light. In other words, it is difficult to detect positional shifts during the exposure operation.

[0010] This disclosure aims to provide a technology that can detect misalignment between a spatial light modulator and a microlens array, even during exposure operations. [Means for solving the problem]

[0011] The first embodiment is an exposure apparatus comprising: a spatial light modulator having a plurality of pixel units; a microlens array unit having a plurality of microlenses, each of which collects light from each of the plurality of pixel units; a reflection region provided in the microlens array unit; a sensor unit for detecting reflected light that is emitted from a predetermined position of the spatial light modulator and incident on the reflection region and reflected by the reflection region; and a positional misalignment detection unit for detecting a positional misalignment between the spatial light modulator and the microlens array unit based on the detection information from the sensor unit.

[0012] The second embodiment is an exposure apparatus according to the first embodiment, wherein the reflection region is concave.

[0013] A third embodiment is an exposure apparatus according to the second embodiment, wherein the sensor unit is positioned such that the normal of the sensor area passes through the focal point of the reflection area.

[0014] The fourth embodiment is an exposure apparatus according to any of the first to third embodiments, wherein the sensor area of ​​the sensor part is a two-dimensional area, and the position of the sensor part is defined such that the area in the sensor area where the reflected light is received is an area that includes a vertex.

[0015] The fifth aspect is an exposure apparatus according to the fourth aspect, wherein the position of the sensor portion is defined such that the position where the vertex appears in a proper state where there is no misalignment between the spatial light modulator and the microlens array portion is the center of the sensor region.

[0016] The sixth aspect is an exposure apparatus according to any of the first to third aspects, wherein the sensor area of ​​the sensor part is a one-dimensional area, and the position of the sensor part is defined such that the area in the sensor area where the reflected light is received is an area that includes the intersection of an edge nonparallel to the extending direction of the sensor area.

[0017] The seventh aspect is an exposure apparatus according to the sixth aspect, wherein the position of the sensor portion is defined such that the position where the intersection appears in a proper state where there is no misalignment between the spatial light modulator and the microlens array portion is the center of the sensor region.

[0018] The eighth aspect is an exposure apparatus according to any of the first to seventh aspects, wherein the dimension of the reflection region is larger than the spacing between the microlenses in the arrangement direction of the plurality of microlenses.

[0019] The ninth embodiment is an exposure apparatus according to any of the first to eighth embodiments, wherein each of the plurality of pixel portions is provided at a position corresponding to any of the grid points of the first grid pattern, each of the plurality of microlenses is provided at a position corresponding to any of the grid points of the second grid pattern corresponding to the first grid pattern, and the reflection region is provided in a region outside the array region of the plurality of microlenses at a position corresponding to any of the grid points of the second grid pattern.

[0020] The tenth embodiment is an exposure apparatus according to any of the first to ninth embodiments, comprising an operation control unit that causes an exposure operation to be performed in parallel, in which a spatial light modulator is used to form patterned light and the formed patterned light is irradiated onto an object to be processed through a microlens array unit, and a positional misalignment detection operation to be performed in which the sensor unit is used to detect the reflected light and the positional misalignment detection unit is used to detect the positional misalignment. [Effects of the Invention]

[0021] In the first aspect, light emitted from a predetermined position of the spatial light modulator and incident on the reflection region of the microlens array unit is detected by the sensor unit as reflected light reflected by the reflection region. When the positional relationship between the spatial light modulator and the microlens array unit changes, changes occur in the position where the reflected light is received by the sensor unit, etc. That is, the position where the reflected light is received by the sensor unit, etc., reflects the positional relationship between the spatial light modulator and the microlens array unit, and by detecting changes in the position where the reflected light is received, etc., it is possible to detect the misalignment between the spatial light modulator and the microlens array unit. Here, in detecting the misalignment, since the reflected light reflected by the microlens array unit is used, the sensor unit is arranged upstream of the microlens array unit with respect to the optical path of the light irradiated from the spatial light modulator through the microlens array unit to the object to be processed, and detects the reflected light here. Therefore, regardless of the position of the member (for example, the stage on which the substrate, which is the object to be processed, is placed) arranged downstream of the microlens array unit with respect to the optical path, it is possible to detect the misalignment, and even during the exposure operation, it is possible to detect the misalignment.

[0022] According to the second aspect, since the reflection region is concave, the amount of misalignment between the spatial light modulator and the microlens array unit is detected after being enlarged at an enlargement ratio corresponding to the radius of curvature of the concave surface. Therefore, the detection sensitivity of the misalignment can be sufficiently increased.

[0023] According to the third aspect, the reflected light reflected by the reflection region can be effectively received in the sensor region of the sensor unit.

[0024] According to the fourth aspect, the positional relationship between the spatial light modulator and the microlens array unit can be easily specified from the position of the apex.

[0025] According to the fifth aspect, since the position where the apex appears in the proper state is the center of the sensor region, it is possible to detect misalignments in all directions of 360 degrees.

[0026] According to the sixth aspect, the positional relationship between the spatial light modulator and the microlens array can be easily determined from the location of the intersection.

[0027] According to the seventh embodiment, since the position where the intersection appears in the proper state is the center of the sensor area, positional deviations in both positive and negative directions can be detected.

[0028] According to the eighth aspect, it is possible to generate sufficient reflected light that reflects the change in the positional relationship between the spatial light modulator and the microlens array.

[0029] According to the ninth embodiment, light emitted from any pixel of the spatial light modulator can be incident on the reflective region, just as on each microlens. In other words, reflected light can be formed using spare pixels in the spatial light modulator that are not used to form the pattern light.

[0030] According to the tenth embodiment, for example, even if a positional misalignment occurs between the spatial light modulator and the microlens array during the exposure operation, this can be detected in real time. [Brief explanation of the drawing]

[0031] [Figure 1] This is a side view showing a schematic configuration of the exposure apparatus according to the embodiment. [Figure 2] This is a plan view showing the schematic configuration of the exposure apparatus. [Figure 3] Block diagram showing the hardware configuration of the control unit. [Figure 4] This is a perspective view showing the schematic configuration of the exposure unit. [Figure 5] This is a diagram illustrating the optical system of the exposure head. [Figure 6] This is a schematic plan view of DMD. [Figure 7] This is a schematic plan view of the MLA section. [Figure 8] This is a schematic cross-sectional view of the MLA section. [Figure 9]This diagram illustrates how light incident on the reflective region is received by the sensor. [Figure 10] This diagram illustrates how light incident on the reflective region is received by the sensor. [Figure 11] This is a schematic side view showing the holding unit that holds the spatial light modulator and MLA section. [Figure 12] This is a diagram to explain the exposure process. [Figure 13] This diagram shows the processing flow related to the positional misalignment detection operation. [Figure 14] This diagram illustrates how light incident on a reflective region is received by a modified sensor unit. [Figure 15] This diagram illustrates how light incident on a reflective region is received by a modified sensor unit. [Figure 16] This is a schematic diagram illustrating a misalignment between the spatial light modulator and the MLA section. [Modes for carrying out the invention]

[0032] The embodiments will be described below with reference to the attached drawings. Note that the components described in these embodiments are merely examples and are not intended to limit the scope of this disclosure to them alone. Furthermore, in the drawings, the dimensions or number of parts may be exaggerated or simplified as needed for ease of understanding.

[0033] Expressions indicating relative or absolute positional relationships (e.g., "in one direction," "along one direction," "parallel," "orthogonal," "center," "concentric," "coaxial," etc.) shall, unless otherwise specified, not only strictly represent the positional relationship but also represent a state in which the object is relatively displaced in terms of angle or distance within a tolerance or range in which equivalent functionality is obtained. Similarly, expressions indicating equality (e.g., "identical," "equal," "homogeneous," etc.) shall, unless otherwise specified, not only represent a state in which the object is quantitatively exactly equal but also represent a state in which there is a difference in which tolerance or equivalent functionality is obtained. Furthermore, expressions indicating shape (e.g., "circular," "square," "cylindrical," etc.) shall, unless otherwise specified, not only strictly represent the shape geometrically but also represent a shape within a range in which equivalent effects are obtained, and may include features such as concavity or chamfers. Finally, expressions such as "equipped," "possessed," "contains," and "have" a component are not exclusive expressions that exclude the existence of other components. Furthermore, the expression "at least one of A, B, and C" includes "A only," "B only," "C only," "any two of A, B, and C," and "all of A, B, and C."

[0034] <1. Schematic configuration of the exposure apparatus> The schematic configuration of the exposure apparatus 100 according to the embodiment will be described with reference to Figures 1 and 2. Figure 1 is a side view showing the schematic configuration of the exposure apparatus 100. Figure 2 is a plan view showing the schematic configuration of the exposure apparatus 100. In the figures referred to below, for the sake of explanation, an XYZ coordinate system is shown in which the sub-scanning direction is defined as the "X direction", the main scanning direction as the "Y direction", and the direction perpendicular to these as the "Z direction". In addition, in the figures referred to below, the elements shown are simplified and exaggerated for explanatory purposes, and their arrangement and shape are also schematic. Furthermore, the illustration of some elements has been omitted.

[0035] The exposure apparatus 100 is a direct-writing type exposure apparatus that irradiates the object to be processed with spatially modulated pattern light (drawing light) according to the pattern to be drawn, thereby drawing (exposing) the pattern. Such an exposure apparatus is also called a direct-writing apparatus or a pattern exposure apparatus. Specifically, the object to be processed is, for example, a substrate W on which a layer R of photosensitive material such as resist is formed, and its upper surface (the upper surface of the photosensitive material layer R) is the surface to be exposed (Figure 12). The substrate W referred to here includes semiconductor substrates, printed circuit boards, color filter substrates provided in liquid crystal display devices, glass substrates for flat panel displays provided in liquid crystal display devices or plasma display devices, magnetic disk substrates, optical disk substrates, solar cell panel substrates, etc. The shape of the substrate W may be rectangular or circular. In the figure, a rectangular substrate W is shown as an example.

[0036] The exposure apparatus 100 includes, for example, a stage 1, a stage drive mechanism 2, a stage position measuring unit 3, an exposure unit 4, and a control unit 5.

[0037] (Stage 1) Stage 1 is a part for holding the substrate W, which is the object to be processed, and is provided on the base 101. Specifically, Stage 1 has, for example, a flat plate shape, and the substrate W is held on its upper surface in a horizontal position (a position in which the main surface is aligned with the horizontal plane). A plurality of suction holes (not shown) may be provided on the upper surface of Stage 1, and by creating negative pressure (suction pressure) in the plurality of suction holes, the substrate W placed on the upper surface of Stage 1 may be held on Stage 1 in a fixed state relative to the upper surface.

[0038] (Stage drive mechanism 2) The stage drive mechanism 2 is a mechanism for moving the stage 1 relative to the base 101 and is provided on the base 101. Specifically, the stage drive mechanism 2 includes, for example, a rotation mechanism 21 for rotating the stage 1 in the rotational direction (rotational direction around the Z axis), a sub-scanning mechanism 22 for moving the stage 1 (specifically, the support plate 201 that supports the stage 1 via the rotation mechanism 21) in the sub-scanning direction (X direction), and a main scanning mechanism 23 for moving the stage 1 (specifically, the base plate 202 that supports the support plate 201 via the sub-scanning mechanism 22) in the main scanning direction (Y direction).

[0039] The rotation mechanism 21 is a mechanism that rotates the stage 1 in the rotational direction (rotational direction around the Z axis) and is disposed on the support plate 201. In other words, the stage 1 is supported on the support plate 201 via the rotation mechanism 21. Specifically, the rotation mechanism 21 rotates the stage 1 around a rotation axis C that passes through the center of the upper surface of the stage 1 (and by extension, the center of the substrate W held on the upper surface) and is aligned with the direction normal to the upper surface (a direction perpendicular to the upper surface). The specific configuration of the rotation mechanism 21 may be anything, but as an example, the rotation mechanism 21 can be configured to include a rotation shaft portion 211 that is positioned so that its axis coincides with the rotation axis C and is fixed to the stage 1 at its upper end, and a rotation drive unit (specifically, for example, a rotary motor) 212 that is connected to the lower end of the rotation shaft portion 211 and rotates it around its axis.

[0040] The sub-scanning mechanism 22 is a mechanism that moves the support plate 201 (and by extension, the stage 1 supported thereon) in the sub-scanning direction (X direction), and is provided between the support plate 201 and the base plate 202. In other words, the stage 1 is supported on the base plate 202 via the rotation mechanism 21, the support plate 201, and the sub-scanning mechanism 22. Specifically, the sub-scanning mechanism 22 includes, for example, a linear motor 221 that extends in the sub-scanning direction and is provided between the support plate 201 and the base plate 202. Specifically, the linear motor 221 includes, for example, a stator 221a laid on the upper surface of the base plate 202 and a mover 221b provided on the lower surface of the support plate 201. Furthermore, the sub-scanning mechanism 22 includes a guide unit 222 provided between the support plate 201 and the base plate 202. Specifically, the guide unit 222 includes, for example, a pair of guide members 222a, 222a laid on the upper surface of the base plate 202 and extending in the sub-scanning direction, and a sliding member (e.g., a ball bearing) 222b fixed to the support plate 201 and slidably provided relative to each guide member 222a. In this configuration, when the linear motor 221 is operated, the support plate 201 moves on the base plate 202 in the sub-scanning direction while being guided by the guide unit 222. At this time, as each sliding member 222b moves while sliding relative to each guide member 222a, the support plate 201 moves smoothly in the sub-scanning direction.

[0041] The main scanning mechanism 23 is a mechanism that moves the base plate 202 (and by extension, the stage 1, which is supported on the base plate 202 via the sub-scanning mechanism 22 and the support plate 201) in the main scanning direction (Y direction), and is provided between the base plate 202 and the base frame 101. In other words, the stage 1 is supported on the base frame 101 via the rotation mechanism 21, the support plate 201, the sub-scanning mechanism 22, the base plate 202, and the main scanning mechanism 23. Specifically, the main scanning mechanism 23 includes, for example, a linear motor 231 that extends in the main scanning direction and is provided between the base plate 202 and the base frame 101. Specifically, the linear motor 231 includes, for example, a stator laid on the upper surface of the base frame 101 and a mover provided on the lower surface of the base plate 202. Furthermore, the main scanning mechanism 23 includes a guide unit 232 provided between the base plate 202 and the base frame 101. Specifically, the guide unit 232 includes, for example, a pair of guide members 232a, 232a laid on the upper surface of the base 101 and extending in the main scanning direction, and a sliding member (e.g., a ball bearing) 232b fixed to the base plate 202 and slidably provided relative to each guide member 232a. In this configuration, when the linear motor 231 is operated, the base plate 202 moves on the base 101 in the main scanning direction while being guided by the guide unit 232. At this time, as each sliding member 232b moves while sliding relative to each guide member 232a, the base plate 202 moves smoothly in the main scanning direction.

[0042] (Stage position measurement unit 3) The stage position measurement unit 3 measures the position of stage 1. Specifically, the stage position measurement unit 3 includes, for example, an emission unit that emits laser light from outside stage 1 toward stage 1, a light receiving unit that receives reflected light from stage 1, and a measurement unit that measures the position of stage 1 (for example, the position of stage 1 along the main scanning direction (Y position)) based on the interference of the reflected light and the emitted light (a so-called interferometric laser measuring instrument). However, the specific configuration of the stage position measurement unit 3 is not limited to this. That is, the stage position measurement unit 3 does not necessarily have to be configured using a laser measuring instrument, and may be configured using, for example, a linear scale.

[0043] (Exposure section 4) The exposure unit 4 forms spatially modulated pattern light according to the pattern to be drawn (exposed) (for example, a circuit pattern), and irradiates the substrate W with this light to draw (expose) the pattern. The exposure unit 4 is supported by a support frame 102 provided on the base 101. That is, a gate-shaped support frame 102 is provided above the base 101, traversing the base 101 along the sub-scanning direction (X direction), and the exposure unit 4 is supported by this support frame 102. The configuration of the exposure unit 4 will be described in detail later.

[0044] (Control Unit 5) The control unit 5 controls the operation of each part of the exposure apparatus 100 and performs various calculations. It is composed of, for example, a general-purpose computer with electrical circuits or a microcomputer. Specifically, as shown in Figure 3, the control unit 5 includes, for example, a CPU (Central Processor Unit) 51 as a central processing unit responsible for data processing (function as an arithmetic circuit), a ROM (Read Only Memory) 52 for storing basic programs, a RAM (Random Access Memory) 53 used as a workspace when the CPU 51 performs data processing, a storage device 54 composed of non-volatile storage devices such as flash memory and hard disk drives, and a bus line 55 connecting these to each other. The control unit 5 may also be connected to a display unit 56 for displaying various data and images, and an operation unit 57 for receiving various commands from the operator. The display unit 56 can be implemented using, for example, a general-purpose CRT monitor, liquid crystal display, or touch panel. The operation unit 57 can be implemented using, for example, various buttons, various keys, a mouse, a keyboard, a touch panel, or a microphone. Furthermore, the ROM 52 (or storage device 54) stores a program P that defines the processing to be performed by the control unit 5, and the CPU 51 executes this program P, thereby enabling the control unit 5 to perform the processing defined by the program P. However, some or all of the processing performed by the control unit 5 may be performed by dedicated hardware such as a dedicated logic circuit (for example, a dedicated processor).

[0045] <2. Exposure section 4> <2-1. Structure> Next, the configuration of the exposure unit 4 will be explained with reference to Figures 1, 2, and 4. Figure 4 is a perspective view showing the schematic configuration of the exposure unit 40 provided in the exposure unit 4.

[0046] The exposure unit 4 comprises one or more exposure units 40 (nine in the example in Figure 2). Each exposure unit 40 includes a light source unit 41 and an exposure head 42. However, if the exposure unit 4 comprises multiple exposure units 40, each of the multiple exposure units 40 may be provided with an individual light source unit 41, or the light source unit 41 may be shared among two or more exposure units 40. That is, a light source unit 41 may be provided that corresponds one-to-one with an exposure head 42, or a light source unit 41 may be provided that is shared among multiple exposure heads 42.

[0047] The exposure unit 40 is supported by a support frame 102. Specifically, for example, the light source unit 41 is housed in a first housing box 401, and the exposure head 42 is housed in a second housing box 402. The second housing box 402, which houses the exposure head 42, is supported by the support frame 102, and the first housing box 401, which houses the light source unit 41, is positioned above (+Z side of) the second housing box 402 and is supported by the support frame 102 via the second housing box 402.

[0048] (Light source section 41) The light source unit 41 generates light that forms the basis of patterned light. Specifically, the light source unit 41 includes, for example, a laser oscillator that receives a drive signal from a laser drive unit and outputs laser light, and an illumination optical system that converts the light (spot beam) output from the laser oscillator into light with a uniform intensity distribution (neither of which are shown in the figure). The light (light beam) emitted from the light source unit 41 is guided to enter the exposure head 42. For example, if the first housing box 401 in which the light source unit 41 is housed is located above the second housing box 402 in which the exposure head 42 is housed, the light source unit 41 emits light downward (-Z direction), and the emitted light is reflected by the mirror 411 and enters the exposure head 42 (specifically, the spatial light modulator 71 provided in the exposure head 42). If one light source unit 41 is shared among multiple exposure heads 42, the light emitted from the light source unit 41 may be divided into multiple beams, and each divided beam may be guided to enter each exposure head 42.

[0049] (Exposure head 42) The exposure head 42 applies spatial modulation to the light emitted from the light source unit 41 to form patterned light, which is then irradiated onto the substrate W. Specifically, the exposure head 42 comprises, for example, a spatial light modulator 71, a first imaging optical system 72, a microlens array unit (hereinafter also referred to as the "MLA unit") 73, a sensor unit 74, and a second imaging optical system 75. The exposure head 42 may also further include a measuring instrument 76.

[0050] In the exposure head 42, a pattern light is formed by the spatial light modulator 71, and this pattern light is irradiated onto the substrate W through the first imaging optical system 72, the MLA section 73, and the second imaging optical system 75. In the example shown in the figure, the optical path of the pattern light is bent in an L-shape. That is, the spatial light modulator 71, the first imaging optical system 72, the MLA section 73, and the second imaging optical system 75 are arranged in this order along the L-shaped bent path. Specifically, for example, the first imaging optical system 72 is positioned such that its optical axis (first optical axis) K1 is aligned with a predetermined direction (Y direction in the example shown in the figure), and the spatial light modulator 71 is positioned on one side (-Y side) along the first optical axis K1, and the MLA section 73 is positioned on the other side (+Y side). In other words, the spatial light modulator 71, the first imaging optical system 72, and the MLA section 73 are arranged in a line (on a straight line) along the first optical axis K1. On the other hand, the second imaging optical system 75 is positioned such that its optical axis (second optical axis) K2 is aligned in a predetermined direction different from the first optical axis K1 (in the example shown in the figure, the Z direction). Furthermore, a mirror 77 is provided between the MLA section 73 and the second imaging optical system 75 at the position where the first optical axis K1 and the second optical axis K2 intersect, to guide the light traveling along the first optical axis K1 to the second optical axis K2. With this configuration in which each part 71, 72, 73, and 75 are arranged on an L-shaped bent path, the height of the exposure head 42 (and consequently the height of the exposure apparatus 100) can be reduced compared to a configuration in which each part 71, 72, 73, and 75 are arranged on a straight path extending in the Z direction, for example.

[0051] Furthermore, when the parts 71, 72, 73, and 75 are arranged along an L-shaped bent path, the second housing box 402 that houses the exposure head 42 is also made in an L-shaped bent form. Specifically, for example, the second housing box 402 includes a first part 402a that is positioned on the upper side of the support frame 102 and extends in the direction of extension of the first optical axis K1 (Y direction), and a second part 402b that is positioned on one side of the support frame 102 (the +Y side in the example shown in the figure) and extends in the direction of extension of the second optical axis K2 (Z direction). The first part 402a houses the spatial light modulator 71, the first imaging optical system 72, the MLA unit 73, and the sensor unit 74, while the second part 402b houses the second imaging optical system 75 and the measuring instrument 76.

[0052] <2-2. Configuration of each part of the exposure head 42> Next, the configuration of each part of the exposure head 42 will be explained in more detail with reference to Figure 4 and Figure 5. Figure 5 is a diagram illustrating the optical system of the exposure head 42. In Figure 5, for the sake of explanation, the first optical axis K1 and the second optical axis K2 are shown to be on the same straight line. That is, for the sake of explanation, the mirror 77 is omitted, and the spatial light modulator 71, the first imaging optical system 72, the MLA section 73, and the second imaging optical system 75 are arranged on the same straight line.

[0053] (Spatial light modulator 71) The spatial light modulator 71 forms patterned light by applying spatial modulation to light. Specifically, for example, the spatial light modulator 71 has multiple pixel sections, and applies spatial modulation to the light such that each pixel section is assigned attributes as necessary light that contributes to pattern drawing and attributes as unnecessary light that does not contribute to pattern drawing.

[0054] The spatial light modulator 71 specifically includes, for example, a DMD (Digital Micromirror Device) 710.

[0055] The configuration of the DMD710 will be explained with reference to Figures 4, 5, and 6. Figure 6 is a view of the DMD710 from the downstream side of the optical path of the pattern light emitted from it. Needless to say, Figure 6 is merely a schematic diagram for explanatory purposes and does not accurately represent the number of micromirrors 711 that the DMD710 is equipped with. Note that the expression "light is emitted" from an element includes not only cases where light is emitted by the element spontaneously emitting light, but also cases where light is emitted from the element when incident light is reflected by the element, and cases where light is emitted from the element when incident light is transmitted (passes through) the element.

[0056] The DMD710 has a configuration in which multiple micromirrors 711 are arranged in a two-dimensional manner, for example, on a memory cell, and the arrangement surface of the multiple micromirrors 711 is positioned to align with a plane (XZ plane) perpendicular to the extending direction (Y axis direction) of the first optical axis K1. When the spatial light modulator 71 includes the DMD710, each of the multiple micromirrors 711 forms one pixel portion in the spatial light modulator 71.

[0057] Each of the multiple micromirrors 711 is positioned at a location corresponding to one of the grid points of a grid pattern (first grid pattern) having a predetermined grid direction and a predetermined grid spacing. Specifically, each micromirror 711 is positioned such that its center (geometric center) coincides with one of the grid points of the first grid pattern. Specifically, the first grid pattern is such that one grid direction and the other grid direction are orthogonal to each other (in the example shown in the figure, one grid direction is along the X-axis and the other grid direction is along the Z-axis). Furthermore, the grid spacing of the first grid pattern for each grid direction is approximately equal to the dimensions of the micromirrors 711 in that grid direction. In this case, adjacent micromirrors 711 will be in contact without any gaps for each grid direction.

[0058] The number of micromirrors 711 in the DMD710 can be any number. For example, 1920 micromirrors 711 may be arranged in one grid direction (e.g., the X direction) and 1080 micromirrors 711 may be arranged in the other grid direction (e.g., the Z direction) (i.e., the DMD710 may have 1920 × 1080 = 19660 micromirrors 711).

[0059] Each micromirror 711 is a movable mirror with a variable angle. By controlling the angle of each micromirror 711 according to the pattern to be drawn, the incident light is spatially modulated, and patterned light is formed. In other words, in forming patterned light, the angle of each micromirror 711 is controlled according to the pattern to be drawn so that the necessary light that contributes to drawing the pattern and the unwanted light that does not contribute to drawing the pattern are reflected in different directions from the light incident on the DMD 710. Specifically, for example, the angle of each micromirror 711 is controlled so that the necessary light is reflected in the direction that it enters the first imaging optical system 72, and the unwanted light is reflected in the direction that it does not enter the first imaging optical system 72. In short, in the DMD 710, the direction in which light is reflected is switched for each micromirror 711, so that the reflected light from each micromirror 711 is assigned the attributes of necessary light that contributes to drawing the pattern and the attributes of unwanted light that does not contribute to drawing the pattern, and thus patterned light is formed. Needless to say, the "angle of the micromirror 711" referred to here is the angle that each micromirror 711 makes with respect to the incident light, and specifically, for example, the angle around the diagonal of the micromirror 711.

[0060] However, in this case, only a portion of the multiple micromirrors 711 provided in the DMD710 are used to form patterned light. In other words, the DMD710 is provided with more micromirrors 711 than the number of micromirrors 711 used to form patterned light. Specifically, for example, multiple micromirrors 711 arranged in the central region 71a of one of the multiple micromirrors 711 in one of the arrangement directions (i.e., one of the grid directions in the first grid pattern, and the Z direction in the example shown in the figure) are normally used to form patterned light, and one or more micromirrors 711 arranged in the regions 71b, 71b at both ends of the arrangement direction are normally not used to form patterned light. In the following, when distinguishing between micromirrors 711 used to form patterned light and micromirrors 711 not used to form patterned light, the former will be called "effective micromirrors 711a" and the latter will be called "reserve micromirrors 711b". Furthermore, the region 71a in which the effective micromirrors 711a are arranged is called the "effective region 71a," and the region 71b in which the auxiliary micromirrors 711b are arranged is called the "auxiliary region 71b."

[0061] (First imaging optical system 72) Refer again to Figures 4 and 5. The first imaging optical system 72 is an optical system that images pattern light emitted from the spatial light modulator 71 (i.e., pattern light formed in the spatial light modulator 71 and arriving therefrom). Specifically, the first imaging optical system 72 comprises, for example, a first lens barrel 721 that holds a first lens 72a and a second lens barrel 722 that holds a second lens 72b. Each of the lenses 72a and 72b is positioned on the optical path of the pattern light emitted from the spatial light modulator 71. Each of the first lens 72a and the second lens 72b may consist of one lens or multiple lenses.

[0062] The first lens 72a directs the patterned light from the spatial light modulator 71 into parallel light along the optical axis direction (Y-axis direction) to the second lens 72b. On the other hand, the second lens 72b forms an image-side telecentric optical system and directs the patterned light from the first lens 72a to the MLA section 73 in a state parallel to the optical axis direction (Y-axis direction). In addition, the first imaging optical system 72 may be a magnifying optical system that images the patterned light formed by the spatial light modulator 71 at a lateral magnification greater than 1x (for example, a lateral magnification of about 2x). In this case, for example, the radius of the second lens 72b is larger than the radius of the first lens 72a.

[0063] (MLA Department 73) The configuration of the MLA section 73 will be explained with reference to Figures 4 and 5, as well as Figures 7 and 8. Figure 7 is a view of the MLA section 73 from the upstream side of the optical path of the pattern light incident therein. Figure 8 is a cross-sectional view of the MLA section 73 from the direction of arrow B1 in Figure 7 (Figure 8(a)) and a cross-sectional view from the direction of arrow B2 in Figure 7 (Figure 8(b)). Needless to say, Figures 7 and 8 are merely schematic diagrams for explanatory purposes and do not accurately represent the number of microlenses 731 provided in the MLA section 73.

[0064] a. Microlens 731 The MLA section 73 is equipped with multiple microlenses 731, and each of the multiple microlenses 731 focuses light from each of the multiple pixel sections (or multiple micromirrors 711 if the spatial light modulator 71 is equipped with a DMD 710) of the spatial light modulator 71, thereby shaping the pattern light formed by the spatial light modulator 71 into a spot array. Specifically, as the pattern light passes through the MLA section 73, the light emitted from each effective micromirror 711a is focused and narrowed by each microlens 731 to form a spot of light (focused spot) for one pixel, thereby shaping the pattern light into a spot array composed of multiple focused spots. By shaping the pattern light into a spot array and projecting it onto the substrate W, it is possible to maintain a wide field of view while keeping the sharpness of the image projected onto the substrate W high, thereby achieving fine detail in rendering.

[0065] Specifically, the MLA section 73 has a configuration in which, for example, a plurality of microlenses 731 are arranged in a two-dimensional manner on the main surface of a substrate (for example, a substrate formed from quartz) 730, and the arrangement surface of the plurality of microlenses 731 is positioned to align with a plane (XZ plane) perpendicular to the extending direction (Y axis direction) of the first optical axis K1. Furthermore, the MLA section 73 is positioned such that the arrangement surface of the plurality of microlenses 731 coincides with the imaging plane of the first imaging optical system 72. In other words, the first imaging optical system 72 images the pattern light formed by the spatial light modulator 71 onto the arrangement surface of the plurality of microlenses 731 in the MLA section 73. In the following, the image formed on the microlens 731 by light reflected by a single micromirror 711 through the first imaging optical system 72 (in other words, the image formed on the MLA section 73 by light from a single micromirror 711 (i.e., a single pixel section in the spatial light modulator 71)) will be called "pixel image A".

[0066] Each of the multiple microlenses 731 is positioned, for example, at a location corresponding to one of the grid points of the grid pattern (second grid pattern) that corresponds to the first grid pattern (i.e., the first grid pattern that defines the arrangement pattern of the multiple micromirrors 711). Specifically, each microlens 731 is positioned such that its center (geometric center) coincides with one of the grid points of the second grid pattern. For example, if the first grid pattern has one grid direction and the other grid direction that are mutually orthogonal, then the second grid pattern also has one grid direction and the other grid direction that are mutually orthogonal (in the example shown in the figure, one grid direction is along the X-axis and the other grid direction is along the Z-axis). Also, if the grid spacing of the first grid pattern for each grid direction is approximately the same as the dimensions of the micromirrors 711 in that grid direction, then the grid spacing of the second grid pattern for each grid direction is approximately the same as the dimensions of the pixel image A in that grid direction. In other words, in the second grid pattern, the grid spacing Ex in one grid direction (X direction) (i.e., the spacing between multiple microlenses 731 in that grid direction) is approximately equal to the dimension Ax of the pixel image A in that grid direction (Ex = Ax), and the grid spacing Ez in the other grid direction (Z direction) (i.e., the spacing between multiple microlenses 731 in that grid direction) is approximately equal to the dimension Az of the pixel image A in that grid direction (Ez = Az). In this case, for each grid direction, the pixel images A formed on adjacent microlenses 731 will be in contact without any gaps. However, each microlens 731 (or, if a reflective film 733 described later is provided on the peripheral portion of each microlens 731, the portion exposed from the reflective film 733) is smaller in size than the pixel image A.

[0067] The MLA section 73 is aligned with the spatial light modulator 71 with sufficient precision during the assembly stage of the exposure apparatus 100 so that it is in the correct position relative to the spatial light modulator 71. Specifically, the correct positional relationship means that each effective micromirror 711a of the DMD section 710 and each microlens 731 of the MLA section 73 correspond one-to-one, and that the light from each effective micromirror 711a (light reflected by each effective micromirror 711a) enters the corresponding microlens 731 and does not enter the adjacent microlens 731. In other words, the pixel image A formed by the light from each effective micromirror 711a overlaps with the microlens 731 corresponding to that effective micromirror 711a, and does not overlap with the microlens 731 that does not correspond to it. When the MLA section 73 and the spatial light modulator 71 are in such an appropriate positional relationship (hereinafter also referred to as the "appropriate state"), when the light emitted from each effective micromirror 711a and incident on the corresponding microlens 731 is focused and narrowed by the microlens 731 to form a focused spot, the light emitted from each effective micromirror 711a does not incident on the uncorresponding microlens 731. Therefore, the extinction ratio does not decrease, and the clarity of the drawing is maintained at a sufficiently high level.

[0068] b.Reflection area 732 The MLA section 73 further includes a reflection region 732 provided in the region outside the region (arrangement region) 73a in which a plurality of microlenses 731 are arranged. Specifically, the reflection region 732 is provided, for example, in the outer edge region 73b of the MLA section 73. However, the "outer edge region 73b" is a region on the MLA section 73 that corresponds to the reserve region 71b in the DMD section 710, which is the region in which the reserve micromirrors 711b are arranged. That is, the effective region 71a of the DMD section 710 corresponds to the arrangement region 73a of the MLA section 73, and the reserve region 71b of the DMD section 710 corresponds to the outer edge region 73b of the MLA section 73.

[0069] For example, in the DMD section 710, if a reserve section 71b is formed on the +Z side and -Z side of the effective section 71a (Figure 6), then in the MLA section 73, for example, an outer edge section 73b is formed on the +Z side and -Z side of the array section 73a, and a reflection section 732 is provided on either one or both of these two outer edge sections 73b. In Figure 7, a reflection section 732 is provided on both of the two outer edge sections 73b, but it is also possible that a reflection section 732 is provided on only one of the outer edge sections 73b.

[0070] As described above, each of the multiple microlenses 731 is positioned at a location corresponding to one of the grid points of the second grid pattern that corresponds to the first grid pattern. Here, the reflection region 732 is also positioned at a location corresponding to one of the grid points of the second grid pattern, similar to each microlens 731. Specifically, for example, the reflection region 732 is positioned such that its center (geometric center) coincides with one of the grid points of the second grid pattern. For example, if an outer edge region 73b is formed adjacent to an array region 73a along one grid direction (Z direction), the reflection region 732 is positioned such that the distance (distance between centers) Fz between the reflection region 732 and the microlens 731 in that grid direction (Z direction) is an integer multiple of the grid spacing (i.e., the array spacing of the multiple microlenses 731 in that grid direction) Ez (Fz = n × Ez, where "n" is an integer). Furthermore, the reflective region 732 is provided at the same position (i.e., the same X position as any of the microlenses 731) in the other grid direction (X direction).

[0071] As described above, each microlens 731 located in the array region 73a at a position corresponding to any of the grid points of the second grid pattern is incident on each effective micromirror 711a located in the effective region 71a at a position corresponding to any of the grid points of the first grid pattern (light reflected by each effective micromirror 711a). That is, the pixel image A formed by the light from each effective micromirror 711a overlaps with the microlens 731 corresponding to the effective micromirror 711a. Similarly, the reflection region 732 located in the outer edge region 73b at a position corresponding to any of the grid points of the second grid pattern is incident on the auxiliary micromirror 711b located in the auxiliary region 71b at a position corresponding to any of the grid points of the first grid pattern (light reflected by the auxiliary micromirror 711b). That is, the pixel image A formed by the light from any of the auxiliary micromirrors 711b overlaps with the reflection region 732. In the following, the auxiliary micromirror 711b corresponding to the reflection region 732 (i.e., the auxiliary micromirror 711b located in a position where light can be incident on the reflection region 732) will also be referred to as the "specific auxiliary micromirror 711bt".

[0072] As described above, each microlens 731 (or, in the case where a reflective film 733 described later is provided on the peripheral portion of each microlens 731, the portion exposed from the reflective film 733) is smaller in size than the pixel image A. In contrast, the reflective region 732 is larger in size than the pixel image A. Specifically, for example, the dimension Dx in one grid direction (X direction) of the reflective region 732 is larger than the dimension Ax of the pixel image A in that grid direction (Dx>Ax), and the dimension Dz in the other grid direction (Z direction) is larger than the dimension Az of the pixel image A in that grid direction (Dz>Az). In particular, it is preferable that the dimensions Dx and Dz in each grid direction are about 1.5 times the dimensions Ax and Az of the pixel image A in that grid direction (Dx=1.5×Ax, Dz=1.5×Az).

[0073] Furthermore, as described above, the grid spacing in each grid direction in the second grid pattern (i.e., the arrangement spacing of the multiple microlenses 731 in each grid direction) Ex, Ez, is approximately equal to the dimensions Ax, Az of the pixel image A in that grid direction (Ex=Ax, Ez=Az). Therefore, in other words, in the reflection region 732, the dimension Dx in one grid direction (X direction), which is one of the arrangement directions of the multiple microlenses 731, is greater than the arrangement spacing Ex of the microlenses 731 in that grid direction (Dx>Ex), and the dimension Dz in the other grid direction (Z direction), which is the other arrangement direction of the multiple microlenses 731, is greater than the arrangement spacing Ez of the microlenses 731 in that grid direction (Dz>Ez). In particular, it is preferable that the dimensions Dx, Dz in each grid direction are about 1.5 times the arrangement spacing Ex, Ez of the microlenses 731 in that grid direction (Dx=1.5×Ex, Dz=1.5×Ez).

[0074] The shape of the reflection region 732 in plan view can be anything; for example, it may be circular as shown in the figure. In this case, if the micromirror 711 (and thus the pixel image A) is rectangular, it is preferable that the radius of the reflection region 732 is greater than or equal to the radius of the circle circumscribed around the pixel image A. It is also preferable that the radius of the reflection region 732 is about 1.5 times the radius of the circle inscribed around the pixel image A.

[0075] The reflection region 732 is concave. In other words, the reflection region 732 is a concave mirror and behaves optically similarly to a concave lens. The light emitted from the specific auxiliary micromirror 711bt and incident on the reflection region 732 through the first imaging optical system 72 is substantially parallel light, so almost all of the reflected light reflected by the concave reflection region 732 passes through the focal point Fo (see Figures 9 and 10).

[0076] The concave reflective region 732 can be formed, for example, by providing a convex-shaped portion on a substrate (for example, a substrate formed from quartz, etc.) 730, and by providing a reflective film 733 on the convex-shaped portion. The reflective film 733 can be obtained, for example, by depositing a thin film of a metal (for example, chromium (Cr), nickel (Ni), aluminum (Al), etc.) using appropriate methods such as vapor deposition using a mask or sputtering. The reflective film 733 may be provided in areas other than where the reflective region 732 is to be formed. For example, the reflective film 733 may be provided over the entire outer edge region 73b. Alternatively, the reflective film 733 may be provided in the array region 73a over the peripheral portion of each microlens 731 and in the region between adjacent microlenses 731. By providing the reflective film 733 in such areas, the occurrence of light incident from the effective micromirror 711a to the corresponding microlens 731 leaking into the adjacent microlens 731 (and consequently degrading the resolution) is sufficiently suppressed.

[0077] (Recovery unit 74) The sensor unit 74 will be explained with reference to Figures 4 and 5, as well as Figures 9 and 10. Figures 9 and 10 are diagrams illustrating how light incident on the reflective region 732 provided in the MLA unit 73 is received by the sensor unit 74. They are: a view of the reflective region 732 along the optical path of the light incident thereon, seen from the upstream side of the optical path (Figures 9(a) and 10(a)); a cross-sectional view of the reflective region 732 and the sensor unit 74 seen from the direction of arrow B2 in Figure 7 (Figures 9(b) and 10(b)); and a view of the sensor region H of the sensor unit 74 along its normal vector (Figures 9(c) and 10(c)). Needless to say, Figures 9 and 10 are schematic diagrams for explanatory purposes.

[0078] As described above, light emitted from a predetermined position on the spatial light modulator 71 (specifically, light reflected by a specific auxiliary micromirror 711bt of the DMD 710) is incident on the reflective region 732 of the MLA section 73. The sensor section 74 detects the reflected light emitted from a predetermined position on the spatial light modulator 71, incident on the reflective region 732, and reflected there. If the MLA section 73 is provided with multiple reflective regions 732, a separate sensor section 74 is provided for each reflective region 732 to detect the reflected light reflected by that region.

[0079] Specifically, the sensor unit 74 is, for example, a two-dimensional sensor (two-dimensional light-receiving sensor) in which multiple light-receiving elements are arranged in two dimensions. As light-receiving elements, for example, PSDs, CMOS sensors, etc., can be used. In the following, the two-dimensional region in the sensor unit 74 in which the multiple light-receiving elements are arranged will also be called the "sensor region H".

[0080] As described above, in the exposure head 42, the spatial light modulator 71, the first imaging optical system 72, and the MLA unit 73 are arranged in a line along the first optical axis K1. The sensor unit 74 is positioned on the side of the spatial light modulator 71 (-Y side) relative to the MLA unit 73 in the direction of extension of the first optical axis K1 (Y axis direction). That is, the sensor unit 74 is positioned upstream of the MLA unit 73 with respect to the optical path of the pattern light (the optical path of the pattern light irradiated onto the substrate W from the spatial light modulator 71 through the first imaging optical system 72, the MLA unit 73, and the second imaging optical system 75). Furthermore, the sensor unit 74 is positioned away from the first optical axis K1 (i.e., away from the optical path of the pattern light). Specifically, for example, the sensor unit 74 is positioned outward from the various components arranged on the first optical axis K1 (for example, the lens barrels 721, 722, etc. of the first imaging optical system 72) when viewed along the first optical axis K1 (i.e., along the Y-axis).

[0081] The sensor unit 74 is positioned in a predetermined orientation with respect to the reflective area 732 of the MLA unit 73, and is fixedly mounted to the MLA unit 73 in a predetermined position relative to the reflective area 732.

[0082] Specifically, the sensor unit 74 is positioned such that the sensor region H is directed toward the focal point Fo of the concave reflection region 732. That is, the sensor unit 74 is positioned such that the normal to the sensor region H passes through the focal point Fo of the reflection region 732. Particularly preferably, the sensor unit 74 is positioned such that the normal to the sensor region H (center normal) Hn, which passes through the center (geometric center) Ho of the sensor region H, passes through the focal point Fo of the reflection region 732.

[0083] The sensor unit 74 is positioned so that at least a portion of the reflected light reflected in the reflection region 732 can be captured within the sensor region H, that is, so that a region (light-receiving region) T in which the reflected light is received is formed within the sensor region H. In Figures 9 and 10, a light-receiving region is shown when there is a hypothetical sensor region extending outside the sensor region H, in order to show that there may be reflected light outside the sensor region H that is not captured by it. If there is a sufficiently large hypothetical sensor region extending outside the sensor region H, a light-receiving region with a shape corresponding to the pixel image A is formed in this hypothetical sensor region, and the sensor unit 74 is positioned so that at least a portion of this light-receiving region can be captured within the sensor region H.

[0084] If the shape of each pixel portion of the spatial light modulator 71 (specifically, each micromirror 711 of the DMD portion 710) is polygonal, then the pixel image A will also be polygonal, and the light-receiving area in the virtual sensor region will be a substantially polygonal shape with multiple vertices To. For example, if the shape of each pixel portion (specifically, each micromirror 711) is rectangular, then the pixel image A will also be rectangular, and the light-receiving area in the virtual sensor region will be a substantially rectangular shape with four vertices To. Here, the position of the sensor portion 74 is defined such that the light-receiving area T, where reflected light is received in the sensor region H, is a region containing at least one vertex To. However, "vertex To" is the point where two non-parallel edges intersect. Preferably, as shown in Figure 9, the position of the sensor portion 74 is defined such that, in the proper state, the position where vertex To appears is the center Ho of the sensor region H.

[0085] When the positional relationship between the spatial light modulator 71 and the MLA unit 73 (i.e., the relative position of the spatial light modulator 71 with respect to the MLA unit 73) changes, the position of the pixel image A formed on the reflection region 732 by light from the specific auxiliary micromirror 711bt changes (Figures 9(a), 10(a)). This causes a change in the direction in which the reflected light reflected from the reflection region 732 spreads (Figures 9(b), 10(b)), and a change occurs in the position where the reflected light is received by the sensor unit 74, i.e., the position of the light-receiving region T (Figures 9(c), 10(c)). In other words, the position of the light-receiving region T reflects the positional relationship between the spatial light modulator 71 and the MLA unit 73, and by detecting the change in the position of the light-receiving region T, it is possible to detect a change in the positional relationship between the spatial light modulator 71 and the MLA unit 73. By detecting that the positional relationship between the spatial light modulator 71 and the MLA unit 73 has changed from its proper state, it is possible to detect a positional misalignment between the two. The method for detecting positional misalignment will be explained in detail later.

[0086] (Second imaging optical system 75) Refer again to Figures 4 and 5. The second imaging optical system 75 is an optical system that images pattern light emitted from the MLA section 73 (i.e., pattern light formed into a spot array through the MLA section 73) onto the substrate W, which is the object to be processed (more specifically, the upper surface of the photosensitive material layer R provided on the substrate W). Specifically, the second imaging optical system 75 includes, for example, a first lens barrel 751 that holds the first lens 75a and a second lens barrel 752 that holds the second lens 75b. Each of the lenses 75a and 75b is arranged on the optical path of the pattern light emitted from the MLA section 73. Each of the first lens 75a and the second lens 75b may consist of one lens or multiple lenses.

[0087] The second imaging optical system 75 forms, for example, a bilaterally telecentric optical system. By making the image side of the second imaging optical system 75 telecentric, even if the position of the substrate W (more specifically, the upper surface of the photosensitive material layer R provided on the substrate W) shifts in the optical axis direction, the size of the pattern light image projected onto the substrate W does not change. Therefore, for example, exposure accuracy is less likely to decrease even if there are variations in the thickness of the photosensitive material layer R. Also, by making the object side of the second imaging optical system 75 telecentric, even if the second lens 72b, MLA section 73, etc. of the first imaging optical system 72 are moved in the optical axis direction, the size of the pattern light image on the image side of the second imaging optical system 75 does not change. In addition, a magnifying optical system that magnifies and images the pattern light with a lateral magnification greater than 1x (for example, a lateral magnification of approximately 3x) may be applied to the second imaging optical system 75. In this case, for example, the radius of the second lens 75b is made larger than the radius of the first lens 75a.

[0088] (Measuring instrument 76) The measuring instrument 76 measures the distance between the exposure head 42 and the substrate W (more specifically, the upper surface of the photosensitive material layer R provided on the substrate W). Specifically, the measuring instrument 76 includes, for example, an irradiator 761 that irradiates the substrate W with laser light from an oblique direction (along an axis inclined with respect to the normal direction of the upper surface of the substrate W), and a light receiver 762 that receives the reflected light from the substrate W. In this configuration, the distance between the exposure head 42 and the surface of the substrate W can be determined based on the position where the reflected light is received by the light receiver 762. The measuring instrument 76 notifies the control unit 5 of the determined distance. The control unit 5 adjusts the position of each part of the exposure head 42 (for example, the positions (Y positions) of the second lens barrel 722 (and consequently the second lens 722a) and the MLA section 73 of the first imaging optical system 72, along the extending direction (Y direction) of the first optical axis K1) according to the notified separation distance, thereby aligning the imaging position (focus position) of the pattern light with the substrate W (more specifically, the upper surface of the photosensitive material layer R provided on the substrate W). The measuring instrument 76 may be provided at the lower end of the second lens barrel 752 of the second imaging optical system 75, as shown in Figure 4, or it may be provided at a distance from the second imaging optical system 75.

[0089] <2-3. Holding Unit 8> Next, the holding unit 8 that holds the spatial light modulator 71 and the MLA section 73 will be described with reference to Figure 11. Figure 11 is a schematic side view showing the spatial light modulator 71, the MLA section 73, and the holding unit 8 that holds them.

[0090] The holding unit 8 comprises a first holding section 81 for holding the spatial light modulator 71, a second holding section 82 for holding the MLA section 73, and a position changing section 83 for changing the relative positional relationship between the spatial light modulator 71 and the MLA section 73. The holding unit 8 may further include a holding section for holding the first imaging optical system 72 (specifically, the first lens barrel 721 and the second lens barrel 722). Part or all of the holding unit 8, together with the parts it holds, is housed in the first section 402a of the second housing box 402.

[0091] As described above, the first imaging optical system 72 is positioned such that its optical axis (first optical axis) K1 is aligned with a predetermined direction (the Y direction in the example shown in the figure). The first holding unit 81 holds the spatial light modulator 71 on one side (-Y side) of the first imaging optical system 72 along the first optical axis K1. The first holding unit 81 also holds the spatial light modulator 71 in a position such that the arrangement surface of the multiple micromirrors 711 is aligned with a plane (XZ plane) perpendicular to the first optical axis K1. On the other hand, the second holding unit 82 holds the MLA unit 73 on the other side (+Y side) of the first imaging optical system 72 along the first optical axis K1. The second holding unit 82 also holds the MLA unit 73 in a position such that the arrangement surface of the multiple microlenses 731 is aligned with a plane (XZ plane) perpendicular to the first optical axis K1.

[0092] Specifically, the first holding part 81 holds the spatial light modulator 71 at one end (the +Z side in the example shown) and is connected to the reference part 80 at the other end (the -Z side in the example shown). Similarly, the second holding part 82 holds the MLA part 73 at one end (the +Z side in the example shown) and is connected to the reference part 80 at the other end (the -Z side in the example shown). With this configuration, the spatial light modulator 71 is cantilevered above the reference part 80 by the first holding part 81, and the MLA part 73 is cantilevered above the reference part 80 by the second holding part 82. However, the reference part 80 is a member that provides a positional reference. The reference part 80 is formed separately from the second housing box 402 and fixed to the second housing box 402. However, the configuration of the reference part 80 is not limited to this. For example, the reference portion 80 may be formed by a part of the second housing box 402, or by a part of the support frame 102.

[0093] The position changing unit 83 changes the positional relationship between the spatial light modulator 71 and the MLA unit 73. Specifically, for example, the position changing unit 83 is provided on the first holding unit 81 and changes the position of the spatial light modulator 71 by moving it in a direction along the arrangement plane (XZ plane) of the plurality of micromirrors 711 in the DMD 710, thereby changing the positional relationship between the spatial light modulator 71 and the MLA unit 73. More specifically, for example, the position changing unit 83 includes a mechanism (first translation mechanism) that translates the spatial light modulator 71 in one of the two orthogonal axes that define the arrangement plane of the plurality of micromirrors 711, the X-axis direction and the Z-axis direction (i.e., each arrangement direction of the plurality of micromirrors 711) (for example, the X-axis direction), a mechanism (second translation mechanism) that translates the spatial light modulator 71 in the other direction (i.e., the Z-axis direction), and a mechanism (rotation mechanism) that moves the spatial light modulator 71 in the θ-axis direction (i.e., the rotation direction), which is the rotation direction around the Y-axis.

[0094] The specific configurations of the first translation mechanism, the second translation mechanism, and the rotation mechanism may be anything. For example, the first translation mechanism and the second translation mechanism may each include a linear motion mechanism and a linear guide. In this case, the linear motion mechanism may be, for example, a motor, a ball screw mechanism capable of converting rotational force applied by a hex wrench into a linear force, a stepping motor, or a piezoelectric element, which is a mechanism that automatically generates a linear force in response to an electrical signal. Alternatively, the rotation mechanism may include a rotary motor that automatically generates rotational force in response to an electrical signal. Or, the rotation mechanism may include a linear motion mechanism and a mechanism that converts the linear force applied by the linear motion mechanism into rotational force (specifically, for example, a rack-spur gear system, a link mechanism system, etc.). Alternatively, the rotation mechanism may be a mechanism that rotates an object using rotational force applied by a hex wrench or the like.

[0095] <3. Functional Section> Next, the functional elements of the control unit 5 will be described. The control unit 5 includes, for example, an motion control unit 501, a position deviation detection unit 502, a position correction unit 503, etc., as functional elements realized by the CPU 51 operating according to program P (Figure 3). However, some or all of these units 501, 502, and 503 may be realized by hardware such as dedicated logic circuits.

[0096] (Operation control unit 501) The operation control unit 501 comprehensively controls the operation of the exposure apparatus 100, controlling each part of the exposure apparatus 100 to execute a predetermined series of operations. Specifically, the control unit 5 is connected to the stage drive mechanism 2 (specifically, the rotation mechanism 21, sub-scanning mechanism 22, main scanning mechanism 23, etc.), the stage position measurement unit 3, and the exposure unit 4 (specifically, the light source unit 41, spatial light modulator 71, sensor unit 74, position change unit 83, etc.) via a bus line 55, a network line, a serial communication line, etc., and the operation control unit 501 controls each of these parts while exchanging data with them to execute a predetermined series of operations.

[0097] The operation control unit 501 controls each part of the exposure apparatus 100 to perform the exposure operation. Specifically, the operation control unit 501 causes the spatial light modulator 71 to form a pattern light and irradiates the substrate W held on the stage 1 with the formed pattern light through the MLA unit 73. In addition, the operation control unit 501 controls each part of the exposure apparatus 100 to perform a misalignment detection operation in parallel with the exposure operation. Specifically, the operation control unit 501 causes the sensor unit 74 to detect reflected light and causes the misalignment detection unit 502 to detect the misalignment (the misalignment between the spatial light modulator 71 and the MLA unit 73). The specific flow of the exposure operation and the misalignment detection operation will be explained later.

[0098] (Position deviation detection unit 502) The misalignment detection unit 502 detects the misalignment between the spatial light modulator 71 and the MLA unit 73 based on the detection information of reflected light from the sensor unit 74. However, the "misalignment" referred to here is the misalignment between the spatial light modulator 71 and the MLA unit 73 within the XZ plane (i.e., the XZ plane which is the arrangement plane of the multiple micromirrors 711 in the DMD 710 and the arrangement plane of the multiple microlenses 731 in the MLA unit 73).

[0099] Specifically, for example, the misalignment detection unit 502 determines the amount of misalignment between the spatial light modulator 71 and the MLA unit 73 based on the detection information of reflected light from the sensor unit 74 (specifically, for example, the amount of misalignment ΔG(X) in the X-axis direction, the amount of misalignment ΔG(Z) in the Z-axis direction, and if multiple reflection regions 732 are provided, the amount of misalignment ΔG(θ) in the θ-axis direction, which is the rotational direction around the Y-axis), and determines that a misalignment has occurred between the two if the determined amount of misalignment exceeds a preset tolerance range.

[0100] An example of how the positional displacement detection unit 502 determines the amount of positional displacement based on the detection information of reflected light from the sensor unit 74 will be explained with reference to Figures 9 and 10.

[0101] a. When there is one reflection region 732 If one reflective region 732 is provided, the positional displacement detection unit 502 determines the positional displacement amount ΔG(X) in the X-axis direction and the positional displacement amount ΔG(Z) in the Z-axis direction between the spatial light modulator 71 and the MLA unit 73, based on the reflected light detection information from the sensor unit 74 that acquires the reflected light from the reflective region 732.

[0102] Specifically, for example, the positional displacement detection unit 502 first analyzes the detection information from the sensor unit 74 (specifically, for example, the amount of light received at each light-receiving element arranged in the sensor region H, i.e., the amount of light received at each position within the sensor region H) to identify the region (light-receiving region) T where reflected light is being received. As described above, the position of the sensor unit 74 is defined so that the light-receiving region T appearing in the sensor region H includes the vertex To. Once the light-receiving region T is identified, the positional displacement detection unit 502 further identifies the position of the vertex To in the light-receiving region T.

[0103] Once the position of vertex To is determined, the positional displacement detection unit 502 determines the amount of displacement of the determined vertex To from the correct position (i.e., the position where vertex To appears in the correct state where there is no positional displacement between the spatial light modulator 71 and the MLA unit 73, which in the example of Figure 9 is the center Ho of the sensor region H). However, here, the axes defining the sensor region H are defined as an axis parallel to the X axis (Xp axis) when viewed along the Y axis (normal direction of the array plane (XZ plane) of the multiple microlenses 731) and an axis parallel to the Z axis (Zp axis) when viewed along the Y axis, and the positional displacement detection unit 502 determines the amount of displacement ΔT(Xp) of vertex To in the Xp axis direction and the amount of displacement ΔT(Zp) of vertex To in the Zp axis direction.

[0104] As described above, the position of the light-receiving region T (for example, the position of vertex To) reflects the positional relationship between the spatial light modulator 71 and the MLA unit 73. That is, the displacement amount ΔT(Xp) of vertex To in the Xp axis direction corresponds to the positional displacement amount ΔG(X) in the X axis direction between the spatial light modulator 71 and the MLA unit 73. Similarly, the displacement amount ΔT(Zp) in the Z axis direction corresponds to the positional displacement amount ΔG(Z) in the Z axis direction between the spatial light modulator 71 and the MLA unit 73. Therefore, the positional displacement detection unit 502 calculates the positional displacement amount ΔG(X) in the X axis direction based on the displacement amount ΔT(Xp) of vertex To in the Xp axis direction, and calculates the positional displacement amount ΔG(Z) in the Z axis direction based on the displacement amount ΔT(Zp) of vertex To in the Zp axis direction.

[0105] However, the light-receiving region T corresponds to the image formed by the reflected light reflected by the concave reflection region 732. Therefore, the position change of the pixel image A formed on the reflection region 732 is detected as a displacement of vertex To, with the positive and negative directions reversed. That is, the position change of the pixel image A in the X-axis direction is detected as a displacement of vertex To ΔT(Xp) in the Xp-axis direction, with the positive and negative directions reversed. Similarly, the position change of the pixel image A in the Z-axis direction is also detected as a displacement of vertex To ΔT(Zp) in the Zp-axis direction, with the positive and negative directions reversed. Furthermore, the position change of the pixel image A formed on the reflection region 732 is magnified and detected as a displacement of vertex To. That is, the position change of the pixel image A in the X-axis direction is magnified and detected as a displacement of vertex To ΔT(Xp) in the Xp-axis direction. Similarly, the position change of the pixel image A in the Z-axis direction is also magnified and detected as a displacement of vertex To ΔT(Zp) in the Zp-axis direction. Therefore, the positional displacement detection unit 502 performs appropriate calculations, such as reversing the positive and negative directions of the displacement amounts ΔT(Xp) and ΔT(Zp) of vertex To, and further reducing them by a predetermined reduction ratio, to calculate the amount of positional change of pixel image A, and consequently the positional displacement amounts ΔG(X) and ΔG(Z) between the spatial light modulator 71 and the MLA unit 73.

[0106] The magnification ratio when the position change of pixel image A is detected as the displacement of vertex To is determined according to the curvature of the reflection region 732, the distance between the sensor unit 74 and the reflection region 732, etc. That is, the smaller the radius of curvature of the reflection region 732, the greater the magnification ratio. Also, the larger the distance between the sensor unit 74 and the reflection region 732, the greater the magnification ratio. However, the smaller the radius of curvature of the reflection region 732, and the larger the distance between the sensor unit 74 and the reflection region 732, the wider the reflected light spreads, resulting in a decrease in the amount of light received by the sensor unit 74. In other words, there is a trade-off relationship between the magnification ratio and the amount of light received. Therefore, it is preferable that the radius of curvature of the reflection region 732, and / or the distance between the sensor unit 74 and the reflection region 732, be determined by taking into account the balance between the required magnification ratio (i.e., the detection sensitivity of the positional displacement) and the amount of light received by the sensor unit 74. However, if the size of the sensor area H is the same, the larger the magnification, the smaller the maximum amount of positional displacement that can be detected. Therefore, it is preferable to determine the required magnification from the maximum amount of positional displacement to be detected and the size of the sensor area H, and to define the radius of curvature of the reflective area 732, the distance between the sensor part 74 and the reflective area 732, etc., so that this is achieved.

[0107] b. When there are multiple reflection regions 732 If there are multiple reflective regions 732 (for example, two), the misalignment detection unit 502 determines the misalignment amount ΔG(X) in the X-axis direction, the misalignment amount ΔG(Z) in the Z-axis direction, and the misalignment amount ΔG(θ) in the θ-axis direction between the spatial light modulator 71 and the MLA unit 73, based on the reflected light detection information from the sensor unit 74 that acquires the reflected light from each reflective region 732.

[0108] Specifically, for example, the positional displacement detection unit 502 first calculates the positional displacement amounts ΔG1(X) and ΔG1(Z) in the X-axis direction and the Z-axis direction, respectively, based on the detection information obtained from the sensor unit 74 that detects reflected light reflected from one of the reflection regions 732, and stores these as the positional displacement amounts ΔG1(X) and ΔG1(Z) at the formation position (first position) of the reflection region 732. Similarly, the positional displacement detection unit 502 calculates the positional displacement amounts ΔG2(X) and ΔG2(Z) in the X-axis direction and the Z-axis direction, respectively, based on the detection information obtained from the sensor unit 74 that detects reflected light reflected from the other reflection region 732, and stores these as the positional displacement amounts ΔG2(X) and ΔG2(Z) at the formation position (second position) of the reflection region 732.

[0109] The misalignment detection unit 502 then determines the misalignment amounts ΔG(X) and ΔG(Z) between the spatial light modulator 71 and the MLA unit 73 in the X-axis and Z-axis directions, respectively, based on the two sets of misalignment amounts obtained. Specifically, for example, the misalignment detection unit 502 determines the X-axis misalignment amount ΔG(X) as the average of the X-axis misalignment amounts ΔG1(X) and ΔG2(X) at the first and second positions, respectively (ΔG(X)=(ΔG1(X)+ΔG2(X)) / 2). Similarly, the misalignment detection unit 502 determines the Z-axis misalignment amount ΔG(Z) as the average of the Z-axis misalignment amounts ΔG1(Z) and ΔG2(Z) at the first and second positions, respectively (ΔG(Z)=(ΔG1(Z)+ΔG2(Z)) / 2.

[0110] Furthermore, the misalignment detection unit 502 determines the misalignment amount ΔG(θ) between the spatial light modulator 71 and the MLA unit 73 in the θ-axis direction based on the two sets of misalignment amounts obtained. When the first position and the second position are opposite each other in the Z direction (Figure 7), the misalignment detection unit 502 determines the misalignment amount ΔG(θ) in the θ-axis direction as, for example, the difference in the misalignment amounts in the X-axis direction at each of the first and second positions divided by the distance Lz between the two positions in the Z direction (ΔG(θ)=(ΔG1(X)-ΔG2(X)) / Lz).

[0111] (Position correction unit 503) When the position misalignment detection unit 502 detects a position misalignment between the spatial light modulator 71 and the MLA unit 73, the position correction unit 503 controls the position change unit 83 to change the positional relationship between the spatial light modulator 71 and the MLA unit 73 so as to reduce the misalignment. Specifically, for example, the position correction unit 503 corrects the misalignment by changing the positional relationship between the spatial light modulator 71 and the MLA unit 73 by causing the position change unit 83 to change the position of the spatial light modulator 71.

[0112] For example, if a misalignment in the X-axis direction is detected (specifically, if the amount of misalignment ΔG(X) in the X-axis direction is not within a predetermined allowable range), the position correction unit 503 corrects the misalignment by controlling the first translation mechanism provided in the position changing unit 83 to translate the spatial light modulator 71 along the X-axis in a direction that reduces the misalignment. Also, for example, if a misalignment in the Z-axis direction is detected (specifically, if the amount of misalignment ΔG(Z) in the Z-axis direction is not within a predetermined allowable range), the position correction unit 503 corrects the misalignment by controlling the second translation mechanism provided in the position changing unit 83 to translate the spatial light modulator 71 along the Z-axis in a direction that reduces the misalignment. Furthermore, for example, if a misalignment in the θ-axis direction is detected (specifically, for example, if the amount of misalignment ΔG(θ) in the θ-axis direction is not within a predetermined allowable range), the position correction unit 503 controls the rotation mechanism of the position changing unit 83 to rotate the spatial light modulator 71 along the θ-axis in a direction that reduces the misalignment, thereby correcting the misalignment.

[0113] <4. Operation Flow> Next, the flow of operations performed in the exposure apparatus 100 will be explained. The operations described below are performed by the operation control unit 501, which is implemented in the control unit 5, controlling each part of the exposure apparatus 100.

[0114] <4-1. Exposure Operation> The exposure operation performed by the exposure apparatus 100 will be explained with reference to Figures 1, 2, and Figure 12. Figure 12 is a diagram illustrating the exposure operation. The exposure operation is usually performed repeatedly. That is, once the exposure operation on one substrate W is completed, the same exposure operation is then performed on another new substrate W.

[0115] When the substrate W to be processed (i.e., the substrate W on which a photosensitive material layer R such as resist is formed) is brought into the exposure apparatus 100 and held on the stage 1, and when the stage 1 is positioned at a predetermined exposure start position, the operation control unit 501 causes the light source unit 41 to output laser light. The light (light beam) emitted from the light source unit 41 is incident on each exposure head 42.

[0116] Light incident on each exposure head 42 is spatially modulated by a spatial light modulator 71 (specifically, DMD710) provided in the exposure head 42 to form patterned light. Specifically, when light emitted from the light source unit 41 is incident on a group of effective micromirrors 711a arranged in the effective area 71a of the DMD710, the operation control unit 501 controls the angle of each effective micromirror 711a based on pattern data D to form patterned light. More specifically, the operation control unit 501 generates a digital signal based on the pattern data D and sends the digital signal to the DMD710. The digital signal received by the DMD710 is written to a memory cell. As a result, the angle of each effective micromirror 711a becomes the angle corresponding to the digital signal. In this way, the angle of each of the group of effective micromirrors 711a provided by the DMD710 is controlled to correspond to the pattern data D, thereby spatially modulating the incident light and forming a patterned light corresponding to the pattern data D. However, "pattern data D" is data describing the pattern (for example, a circuit pattern) to be drawn on the substrate W (specifically, on the photosensitive material layer R), and is stored in a memory device 54, for example (Figure 3). As an example, pattern data D is image data obtained by converting vector data created with CAD software or the like into raster data.

[0117] The pattern light formed by the spatial light modulator 71 is guided to the MLA section 73 through the first imaging optical system 72, where it passes through a plurality of microlenses 731 to form a spot array. The pattern light formed into a spot array is then irradiated onto the substrate W on the stage 1 through the second imaging optical system 75. If we define the area on the substrate W irradiated with pattern light from one exposure head 42 in a single irradiation as a "unit exposure region Qi", then when pattern light is irradiated from each of the one or more exposure heads 42 provided in the exposure unit 4, the same number of unit exposure regions Qi as the exposure heads 42 are simultaneously irradiated with pattern light.

[0118] When the first irradiation is performed and pattern light is irradiated onto one or more unit exposure areas Qi (the same number as the exposure head 42), the operation control unit 501 controls the main scanning mechanism 23 to start moving the stage 1 in the main scanning direction (Y direction). As the stage 1 moves, the relative positional relationship between the substrate W held there and the exposure head 42 is changed. Then, the operation control unit 501 generates a reset pulse based on a signal (linear scale signal, encoder signal, etc.) sent from, for example, the linear motor 231 of the main scanning mechanism 23 and sends it to the DMD 710. When the reset pulse is received by the DMD 710, the spatial modulation pattern applied there (specifically, the angle of each effective micromirror 711a) is changed according to the position of the substrate W at that time. In other words, reset pulses are sent one after another in accordance with the movement of the stage 1, and each time a reset pulse is sent, pattern light corresponding to the position of the substrate W is output from the exposure head 42 and irradiated onto the substrate W on the stage 1. The nth irradiation is performed on a region adjacent to the unit exposure region Qi irradiated with pattern light in the (n-1)th irradiation in the main scanning direction. In this way, as the stage 1 holding the substrate W is moved in the main scanning direction relative to the exposure head 42, the exposure head 42 repeatedly irradiates the substrate W with pattern light, irradiating a strip-shaped region Qj extending in the main scanning direction on the substrate W. With respect to the main scanning direction, when the pattern light has irradiated the region to be exposed on the substrate W from one end to the other, one main scanning operation is completed.

[0119] For example, if multiple exposure heads 42 are arranged in a staggered pattern (i.e., a first row of exposure heads consisting of multiple exposure heads 42 (5 in the example shown) arranged in the sub-scanning direction (X direction), and a second row of exposure heads consisting of multiple exposure heads 42 (4 in the example shown) also arranged in the sub-scanning direction (X direction), are provided adjacent to each other in the main scanning direction (Y direction), and when viewed along the sub-scanning direction, the exposure heads 42 of the second row of exposure heads are arranged between adjacent exposure heads 42 in the first row of exposure heads), the stage 1 holding the substrate W is moved in the main scanning direction relative to these multiple exposure heads 42, and pattern light is repeatedly irradiated from each exposure head 42 multiple times, so that pattern light is irradiated in parallel to each of multiple adjacent strip-shaped regions Qj without any gaps. In other words, with one main scanning operation, pattern light is irradiated over a wide area consisting of multiple adjacent strip-shaped regions Qj.

[0120] Once one main scanning operation is completed, the motion control unit 501 controls the sub-scanning mechanism 22 to move the stage 1 in the sub-scanning direction (X direction) by a predetermined distance (the width of the area irradiated by the pattern light in one main scanning operation (dimension in the X direction)) (sub-scanning operation), and then causes the main scanning operation to be performed again.

[0121] Subsequently, the main scanning operation is repeated with sub-scanning operations in between until the pattern light is irradiated from one end to the other of the area to be exposed on the substrate W in the sub-scanning direction (i.e., until the entire area to be exposed is irradiated with pattern light). Needless to say, if the entire area to be exposed is irradiated with pattern light in a single main scanning operation, it is not necessary to repeat the main scanning operation with sub-scanning operations in between, and in this case the sub-scanning mechanism 53 can be omitted.

[0122] <4-2. Positional deviation detection operation> In the exposure apparatus 100, while the above exposure operation is being performed, an operation to detect misalignment between the spatial light modulator 71 and the MLA unit 73 (misalignment detection operation) is performed in parallel. The misalignment detection operation will be explained with reference to Figure 1, Figure 2, and Figure 13. Figure 13 is a diagram showing the flow of the misalignment detection operation. Note that if the exposure unit 4 is equipped with multiple exposure units 40 (i.e., multiple exposure heads 42), a misalignment detection operation to detect misalignment between the spatial light modulator 71 and the MLA unit 73 equipped in each of the multiple exposure heads 42 is performed in parallel.

[0123] Step S1 When the exposure operation is started (YES in step S1), the operation control unit 501 sends a start instruction to the misalignment detection unit 502 to start the misalignment detection operation.

[0124] Step S2 Upon receiving an instruction from the motion control unit 501 to start the positional displacement detection operation, the positional displacement detection unit 502 first acquires detection information from the sensor unit 74. As described above, when the exposure operation starts, light is emitted from the light source unit 41. A portion of the emitted light is incident on a group of effective micromirrors 711a arranged in the effective region 71a of the DMD 710, where it is spatially modulated to become patterned light. Meanwhile, a portion of the light emitted from the light source unit 41 is incident on specific auxiliary micromirrors 711bt arranged in the auxiliary region 71b of the DMD 710. After the exposure operation starts, the motion control unit 501 controls the angle of the specific auxiliary micromirrors 711bt so that the light incident on the specific auxiliary micromirrors 711bt is reflected in a direction that causes it to enter the first imaging optical system 72 (and consequently, the reflection region 732 of the MLA unit 73) at least at the timing when the sensor unit 74 should acquire detection information. Therefore, the light reflected by the specific auxiliary micromirror 711bt enters the reflection region 732 and is reflected there. The reflected light reflected in the reflection region 732 enters the sensor unit 74 and is detected there. The position displacement detection unit 502, having received an instruction from the operation control unit 501 to start the position displacement detection operation, acquires the detection information of the reflected light from the sensor unit 74.

[0125] Step S3 When the misalignment detection unit 502 acquires detection information from the sensor unit 74, it determines the amount of misalignment ΔG(θ) in the direction of the first axis (in this case, the θ axis) between the spatial light modulator 71 and the MLA unit 73 based on the acquired detection information. The manner in which the misalignment detection unit 502 determines the amount of misalignment based on the detection information is as described above.

[0126] Step S4 Next, the positional displacement detection unit 502 determines whether the positional displacement amount ΔG(θ) in the θ-axis direction identified in step S3 is within a preset tolerance range.

[0127] Step S5 If the positional displacement amount ΔG(θ) in the θ-axis direction is determined to be outside a predetermined allowable range (NO in step S4), the positional displacement detection unit 502 determines that a positional displacement in the θ-axis direction has occurred between the spatial light modulator 71 and the MLA unit 73. In this case, the positional displacement detection unit 502 notifies the position correction unit 503 of the positional displacement amount ΔG(θ) in the θ-axis direction identified in step S3. Upon receiving this notification, the position correction unit 503 corrects the positional displacement in the θ-axis direction. For example, if the position correction unit 503 receives notification that the spatial light modulator 71 is displaced by ΔG(θ) in the +θ direction relative to the MLA unit 73, the position correction unit 503 controls the rotation mechanism provided in the position change unit 83 to rotate the spatial light modulator 71 by ΔG(θ) in the -θ direction to correct the positional displacement.

[0128] Once the positional misalignment in the θ-axis direction is corrected, the process returns to step S2, and the positional misalignment detection unit 502 again acquires detection information from the sensor unit 74. Based on the latest acquired detection information, the positional misalignment detection unit 502 again identifies the amount of positional misalignment ΔG(θ) in the θ-axis direction between the spatial light modulator 71 and the MLA unit 73 (step S3), and determines again whether the identified amount of positional misalignment ΔG(θ) is within the acceptable range (step S4). If it is determined that the amount of positional misalignment ΔG(θ) is not within the acceptable range (NO in step S4), the positional misalignment in the θ-axis direction is corrected again (step S5). In other words, the process from steps S2 to S5 is repeated until the amount of positional misalignment ΔG(θ) in the θ-axis direction falls within the acceptable range.

[0129] Step S6 If the positional displacement amount ΔG(θ) in the θ-axis direction is determined to be within an acceptable range (YES in step S4), the positional displacement detection unit 502 determines that there is no positional displacement in the θ-axis direction between the spatial light modulator 71 and the MLA unit 73. In this case, the positional displacement detection unit 502 identifies the positional displacement amount ΔG(X) in the second axis direction (for example, the X axis) between the spatial light modulator 71 and the MLA unit 73 based on the detection information obtained from the sensor unit 74 in the most recent step S2.

[0130] Step S7 Next, the positional displacement detection unit 502 determines whether the positional displacement amount ΔG(X) in the X-axis direction identified in step S6 is within a preset tolerance range.

[0131] Step S8 If the positional displacement amount ΔG(X) in the X-axis direction is determined to be outside a predetermined allowable range (NO in step S7), the positional displacement detection unit 502 determines that a positional displacement in the X-axis direction has occurred between the spatial light modulator 71 and the MLA unit 73. In this case, the positional displacement detection unit 502 notifies the position correction unit 503 of the positional displacement amount ΔG(X) in the X-axis direction identified in step S6. Upon receiving this notification, the position correction unit 503 corrects the positional displacement in the X-axis direction. For example, if the position correction unit 503 receives notification that the spatial light modulator 71 is displaced by ΔG(X) in the +X direction relative to the MLA unit 73, the position correction unit 503 controls the first translational mechanism provided in the position changing unit 83 to translate the spatial light modulator 71 by ΔG(X) in the -X direction to correct the positional displacement.

[0132] Step S9 Once the positional misalignment in the X-axis direction is corrected, the positional misalignment detection unit 502 again acquires detection information from the sensor unit 74. Based on the latest acquired detection information, the positional misalignment detection unit 502 again identifies the amount of positional misalignment ΔG(X) in the X-axis direction between the spatial light modulator 71 and the MLA unit 73 (step S6), and again determines whether the identified amount of positional misalignment ΔG(X) is within the acceptable range (step S7). If it is determined that the amount of positional misalignment ΔG(X) is not within the acceptable range (NO in step S7), the positional misalignment in the X-axis direction is corrected again (step S8). In other words, the process from steps S6 to S9 is repeated until the amount of positional misalignment ΔG(X) in the X-axis direction falls within the acceptable range.

[0133] Step S10 If the positional displacement amount ΔG(X) in the X-axis direction is determined to be within an acceptable range (YES in step S7), the positional displacement detection unit 502 determines that there is no positional displacement in the X-axis direction between the spatial light modulator 71 and the MLA unit 73. In this case, the positional displacement detection unit 502 identifies the positional displacement amount ΔG(Z) in the third axis direction (for example, the Z axis) between the spatial light modulator 71 and the MLA unit 73 based on the detection information obtained from the sensor unit 74 in the most recent step S9.

[0134] Step S11 Next, the positional displacement detection unit 502 determines whether the Z-axis positional displacement amount ΔG(Z) identified in step S10 is within a preset tolerance range.

[0135] Step S12 If the Z-axis displacement amount ΔG(Z) is determined to be outside a predetermined allowable range (NO in step S11), the displacement detection unit 502 determines that a Z-axis displacement has occurred between the spatial light modulator 71 and the MLA unit 73. In this case, the displacement detection unit 502 notifies the position correction unit 503 of the Z-axis displacement amount ΔG(Z) identified in step S10. Upon receiving this notification, the position correction unit 503 corrects the Z-axis displacement. For example, if the position correction unit 503 receives notification that the spatial light modulator 71 is displaced by ΔG(Z) in the +Z direction relative to the MLA unit 73, it controls the second translation mechanism provided in the position change unit 83 to translate the spatial light modulator 71 by ΔG(Z) in the -Z direction to correct the displacement.

[0136] Step S13 Once the misalignment in the Z-axis direction is corrected, the misalignment detection unit 502 again acquires detection information from the sensor unit 74. Based on the latest acquired detection information, the misalignment detection unit 502 again identifies the amount of misalignment ΔG(Z) in the Z-axis direction between the spatial light modulator 71 and the MLA unit 73 (step S10), and again determines whether the identified amount of misalignment ΔG(Z) is within the acceptable range (step S11). If it is determined that the amount of misalignment ΔG(Z) is not within the acceptable range (NO in step S11), the misalignment in the Z-axis direction is corrected again (step S12). In other words, the process from steps S10 to S13 is repeated until the amount of misalignment ΔG(Z) in the Z-axis direction falls within the acceptable range.

[0137] If the Z-axis displacement amount ΔG(Z) is determined to be within an acceptable range (YES in step S11), and if the instruction to end the displacement detection operation has not arrived, i.e., if the exposure operation has not ended (NO in step S14), the process in step S3 is performed again. That is, the displacement detection unit 502 identifies the θ-axis displacement amount ΔG(θ) between the spatial light modulator 71 and the MLA unit 73 based on the detection information acquired from the sensor unit 74 in the most recent step S13. After that, the processes from step S4 onwards are performed again. In other words, while the exposure operation is being performed, the series of processes from steps S3 to S13 are repeated in parallel.

[0138] Step S14 When the exposure operation is completed (YES in step S14), the motion control unit 501 sends a termination instruction to the misalignment detection unit 502 to terminate the misalignment detection operation. Upon receiving the termination instruction from the motion control unit 501, the misalignment detection unit 502 terminates the series of processes.

[0139] <5. Effects> The exposure apparatus 100 according to the above embodiment includes a spatial light modulator 71 having a plurality of pixel sections, a microlens array section (MLA section) 73 having a plurality of microlenses 731, each of which collects light from each of the plurality of pixel sections (if the spatial light modulator 71 has a DMD 710, a plurality of micromirrors 711), a reflection region 732 provided in the MLA section 73, a sensor section 74 that detects reflected light that is reflected by the reflection region 732 from light emitted from a predetermined position of the spatial light modulator 71 and incident on the reflection region 732, and a positional misalignment detection section 502 that detects a positional misalignment between the spatial light modulator 71 and the MLA section 73 based on the detection information from the sensor section 74.

[0140] In this configuration, the sensor unit 74 detects the reflected light emitted from a predetermined position on the spatial light modulator 71, incident on the reflection region 732 of the MLA unit 73, and reflected from the reflection region 732. When the positional relationship between the spatial light modulator 71 and the MLA unit 73 changes, changes occur in the position where the reflected light is received by the sensor unit 74. In other words, the position where the reflected light is received by the sensor unit 74 reflects the positional relationship between the spatial light modulator 71 and the MLA unit 73, and by detecting changes in the position where the reflected light is received, it is possible to detect a positional shift between the spatial light modulator 71 and the MLA unit 73. Here, since the reflected light reflected by the MLA unit 73 is used to detect the positional shift, the sensor unit 74 is positioned upstream of the MLA unit 73 in the optical path of the light irradiated from the spatial light modulator 71 through the MLA unit 73 to the object to be processed, and detects the reflected light here. Therefore, regardless of the position of the component located downstream of the MLA unit 73 (for example, the stage 1 on which the substrate W, which is the object to be processed, is placed) in the optical path, it is possible to detect positional misalignment, and positional misalignment can be detected even in the middle of the exposure operation.

[0141] Furthermore, in the exposure apparatus 100 according to the above embodiment, the reflection region 732 is concave. With this configuration, the amount of misalignment between the spatial light modulator 71 and the MLA section 73 is magnified and detected at a magnification rate corresponding to the radius of curvature of the concave surface. Therefore, the detection sensitivity of misalignment can be sufficiently increased.

[0142] Furthermore, in the exposure apparatus 100 according to the above embodiment, the sensor unit 74 is positioned such that the normal to its sensor region H passes through the focal point Fo of the reflection region 732. With this configuration, the reflected light reflected in the reflection region 732 can be effectively received in the sensor region H of the sensor unit 74.

[0143] Furthermore, in the exposure apparatus 100 according to the above embodiment, the sensor area H of the sensor unit 74 is a two-dimensional area, and the position of the sensor unit 74 is defined such that the area T in which reflected light is received (light-receiving area) in the sensor area H includes the vertex To. With this configuration, the positional relationship between the spatial light modulator 71 and the MLA unit 73 can be easily determined from the position of the vertex To. In particular, if the position of the sensor unit 74 is defined such that the position where the vertex To appears in a proper state where there is no positional misalignment between the spatial light modulator 71 and the MLA unit 73 is the center of the sensor area H, then positional misalignment in all 360 degrees can be detected.

[0144] Furthermore, in the exposure apparatus 100 according to the above embodiment, the dimension Dx of the reflection region 732 is larger than the spacing Ex between the microlenses 731 in the arrangement direction of the multiple microlenses 731 (for example, the X direction). For example, if the spacing Ex between the multiple microlenses 731 in the arrangement direction is approximately the same as the dimension Ax of the pixel image A, then the fact that the dimension Dx of the reflection region 732 is larger than the spacing Ex between the microlenses 731 means that the reflection region 732 is larger than the pixel image A (Dx>Ex=Ax). As described above, when the positional relationship between the spatial light modulator 71 and the MLA unit 73 changes, the position of the pixel image A formed on the reflection region 732 changes. If the reflection region 732 is larger than the pixel image A, then reflected light can be sufficiently generated even if the position of the pixel image A changes. In other words, reflected light that reflects the change in the positional relationship between the spatial light modulator 71 and the MLA unit 73 can be sufficiently generated.

[0145] Furthermore, in the exposure apparatus 100 according to the above embodiment, each of the multiple pixel units (multiple micromirrors 711 when the spatial light modulator 71 includes a DMD 710) is provided at a position corresponding to one of the grid points of the first grid pattern, each of the multiple microlenses 731 is provided at a position corresponding to one of the grid points of the second grid pattern corresponding to the first grid pattern, and the reflection region 732 is provided at a position corresponding to one of the grid points of the second grid pattern in the outer edge region 73b, which is the region outside the array region 73a of the multiple microlenses 731. With this configuration, light emitted from any of the pixel units (any of the micromirrors 711 when the spatial light modulator 71 includes a DMD 710) of the spatial light modulator 71 can be incident on the reflection region 732, just as on each microlens 731. In other words, reflected light can be formed using the spare pixel units (spare micromirrors 711b) that are not used to form the pattern light in the spatial light modulator 71.

[0146] Furthermore, the exposure apparatus 100 according to the above embodiment includes an operation control unit 501, which causes the exposure operation to be performed in parallel by forming a pattern light with the spatial light modulator 71 and irradiating the substrate W, which is the object to be processed, with the formed pattern light through the MLA unit 73, and a positional misalignment detection operation to be performed by having the sensor unit 74 detect the reflected light and having the positional misalignment detection unit 502 detect the positional misalignment. With this configuration, for example, even if a positional misalignment occurs between the spatial light modulator 71 and the MLA unit 73 during the exposure operation, it can be detected in real time.

[0147] <6. Variation> <6-1. Modified Sensor Section> Modified versions of the sensor section will be explained with reference to Figures 14 and 15. Figures 14 and 15, like Figures 9 and 10, are diagrams to explain how light incident on the reflective region 732 provided in the MLA section 73 is received by the modified sensor sections 74a and 74b. They are: a view of the reflective region 732 along the optical path of the light incident thereon, seen from the upstream side of the optical path (Figures 14(a) and 15(a)); a cross-sectional view of the reflective region 732 and the sensor sections 74a and 74b seen from the direction of arrow B2 in Figure 7 (Figures 14(b) and 15(b)); and a view of the sensor area L of the sensor sections 74a and 74b seen along its normal vector (Figures 14(c) and 15(c)). Needless to say, Figures 14 and 15 are schematic diagrams for explanatory purposes.

[0148] The exposure apparatus 100 according to this modified example is equipped with a pair of sensor units 74a and 74b instead of the sensor unit 74 according to the above embodiment.

[0149] As described above, light emitted from a predetermined position on the spatial light modulator 71 (specifically, light reflected by a specific auxiliary micromirror 711bt of the DMD 710) is incident on the reflective region 732 of the MLA section 73. The pair of sensor sections 74a and 74b detect the reflected light emitted from a predetermined position on the spatial light modulator 71, incident on the reflective region 732, and reflected there. When the MLA section 73 is provided with multiple reflective regions 732, a pair of sensor sections 74a and 74b are individually provided to detect the reflected light reflected in each reflective region 732.

[0150] Each of the pair of sensor units 74a and 74b is a so-called line sensor, a one-dimensional sensor (one-dimensional light-receiving sensor) in which multiple light-receiving elements are arranged in one dimension (line shape). As light-receiving elements, for example, PSDs, CMOS sensors, etc., can be used. In the following, the one-dimensional region in each sensor unit 74a and 74b in which multiple light-receiving elements are arranged will also be called the "sensor region L".

[0151] As described above, in the exposure head 42, the spatial light modulator 71, the first imaging optical system 72, and the MLA unit 73 are arranged in a line along the first optical axis K1. The pair of sensor units 74a and 74b are positioned on the side of the spatial light modulator 71 (-Y side) relative to the MLA unit 73 in the direction of extension of the first optical axis K1 (Y axis direction), similar to the sensor unit 74 in the embodiment described above. That is, the pair of sensor units 74a and 74b are positioned upstream of the MLA unit 73 with respect to the optical path of the pattern light. Furthermore, the pair of sensor units 74a and 74b are positioned off-center from the first optical axis K1.

[0152] Each of the pair of sensor units 74a and 74b is positioned in a predetermined orientation with respect to the reflective area 732 of the MLA unit 73, and is fixedly mounted to the MLA unit 73.

[0153] Specifically, each of the pair of sensor units 74a and 74b is positioned such that the sensor area L is directed toward the focal point Fo of the concave reflection area 732. That is, each sensor unit 74a and 74b is positioned such that the normal to the sensor area L passes through the focal point Fo of the reflection area 732. Particularly preferable is that each sensor unit 74a and 74b is positioned such that the normal to the sensor area L (center normal) Ln, which passes through the center (geometric center) Lo of the sensor area L, passes through the focal point Fo of the reflection area 732.

[0154] Furthermore, the pair of sensor units 74a and 74b are arranged in a non-parallel orientation to each other. Specifically, for example, one sensor unit (first sensor unit) 74a is arranged in a manner such that its sensor area L extends along an axis parallel to the X axis (Xp axis) when viewed along the Y axis (normal direction of the arrangement plane (XZ plane) of the multiple microlenses 731). The other sensor unit (second sensor unit) 74b is arranged in a manner such that its sensor area L extends along an axis parallel to the Z axis (Zp axis) when viewed along the Y axis.

[0155] Each sensor unit 74a, 74b is positioned so that at least a portion of the reflected light reflected in the reflection region 732 can be captured within the sensor region L, that is, so that a region (receiving region) T in which the reflected light is received is formed within the sensor region L. In Figures 14 and 15, to show that there may be reflected light outside each sensor region L that is not captured, the receiving region is shown when there is a hypothetical sensor region extending outside each sensor region L. If there is a sufficiently large hypothetical sensor region extending outside each sensor region L, a receiving region with a shape corresponding to the pixel image A is formed in this hypothetical sensor region, and each sensor unit 74a, 74b is positioned so that at least a portion of this receiving region can be captured within the sensor region L.

[0156] As described above, if the shape of each pixel portion of the spatial light modulator 71 (specifically, each micromirror 711 of the DMD portion 710) is polygonal, then the pixel image A will also be polygonal, and the light-receiving area in the virtual sensor region will be a substantially polygonal shape with multiple sides. For example, if the shape of each pixel portion (specifically, each micromirror 711) is rectangular, then the pixel image A will also be rectangular, and the light-receiving area in the virtual sensor region will be a substantially rectangular shape with four sides. Here, the position of the first sensor portion 74a is defined such that the light-receiving area T, where reflected light is received in the sensor region L of the first sensor portion 74a, includes an intersection Ti with at least one side (i.e., at least one of the four sides, which is not parallel to the extending direction (Xp axis) of the sensor region L, preferably an orthogonal side). Preferably, as shown in Figure 14, the position of the first sensor portion 74a is defined such that, in the proper state, the position where the intersection Ti appears is the center Lo of the sensor region L. Similarly, the position of the second sensor unit 74b is defined such that the light-receiving area T, where reflected light is received in the sensor area L of the second sensor unit 74b, is a region that includes the intersection Tj of at least one side (i.e., at least one of the four sides, which is a side not parallel to the extending direction (Zp axis) of the sensor area L, preferably a side that is orthogonal). Preferably, as shown in Figure 14, the position of the second sensor unit 74b is defined such that the position where the intersection Tj appears in the proper state is the center Lo of the sensor area L.

[0157] As described above, when the positional relationship between the spatial light modulator 71 and the MLA unit 73 changes, the position of the pixel image A formed on the reflection region 732 by the light from the specific auxiliary micromirror 711bt changes (Figures 14(a), 15(a)). This causes a change in the direction in which the reflected light reflected from the reflection region 732 spreads (Figures 14(b), 15(b)), and a change occurs in the position where the reflected light is received by each sensor unit 74a, 74b, i.e., the position of the light-receiving region T (Figures 14(c), 15(c)). In other words, the position of the light-receiving region T reflects the positional relationship between the spatial light modulator 71 and the MLA unit 73, and by detecting the change in the position of the light-receiving region T, it is possible to detect a change in the positional relationship between the spatial light modulator 71 and the MLA unit 73 (and consequently, a positional shift between the two).

[0158] If a pair of sensor units 74a and 74b are provided instead of the sensor unit 74, the misalignment detection unit 502 detects the misalignment between the spatial light modulator 71 and the MLA unit 73 based on the detection information of reflected light from the pair of sensor units 74a and 74b. Specifically, for example, the misalignment detection unit 502 identifies the amount of misalignment between the spatial light modulator 71 and the MLA unit 73 (specifically, for example, the misalignment amount ΔG(X) in the X-axis direction, the misalignment amount ΔG(Z) in the Z-axis direction, and if multiple reflection regions 732 are provided, the misalignment amount ΔG(θ) in the θ-axis direction) based on the detection information of reflected light from each sensor unit 74a and 74b, and determines that a misalignment has occurred between them if each of the identified amounts of misalignment exceeds a preset allowable range.

[0159] a. When there is one reflection region 732 If one reflective region 732 is provided, the positional displacement detection unit 502 determines the positional displacement amount ΔG(X) in the X-axis direction and the positional displacement amount ΔG(Z) in the Z-axis direction between the spatial light modulator 71 and the MLA unit 73, based on the detection information of the reflected light from a pair of sensor units 74a and 74b that acquire the reflected light from the reflective region 732.

[0160] Specifically, for example, the misalignment detection unit 502 analyzes the detection information from the first sensor unit 74a to identify the region (receiving region) T where reflected light is being received. As described above, the position of the first sensor unit 74a is defined such that the receiving region T appearing in the sensor region L includes the intersection Ti. Once the receiving region T is identified, the misalignment detection unit 502 further identifies the position of the intersection Ti in the receiving region T. Once the position of the intersection Ti is identified, the misalignment detection unit 502 identifies the displacement amount ΔT(Xp) of the identified intersection Ti from its proper position (i.e., the position where the intersection Ti appears in a proper state where there is no misalignment between the spatial light modulator 71 and the MLA unit 73, which in the example of Figure 14 is the center Lo of the sensor region L). Similarly, the misalignment detection unit 502 analyzes the detection information from the second sensor unit 74b to identify the receiving region T and further identifies the position of the intersection Tj in the receiving region T. Once the location of intersection Tj is identified, the positional displacement detection unit 502 determines the displacement amount ΔT(Zp) of the identified intersection Tj from the correct position.

[0161] As described above, the position of the light-receiving region T (for example, the positions of intersections Ti and Tj) reflects the positional relationship between the spatial light modulator 71 and the MLA unit 73. That is, the displacement amount ΔT(Xp) of intersection Ti in the sensor region L extending in the Xp axis direction corresponds to the positional displacement amount ΔG(X) in the X axis direction between the spatial light modulator 71 and the MLA unit 73, and the displacement amount ΔT(Zp) of intersection Tj in the sensor region L extending in the Zp axis direction corresponds to the positional displacement amount ΔG(Z) in the Z axis direction between the spatial light modulator 71 and the MLA unit 73. Therefore, the positional displacement detection unit 502 calculates the positional displacement amount ΔG(X) in the X axis direction based on the displacement amount ΔT(Xp) of intersection Ti obtained from the detection information of the first sensor unit 74a, and calculates the positional displacement amount ΔG(Z) in the Z axis direction based on the displacement amount ΔT(Zp) of intersection Tj obtained from the detection information of the second sensor unit 74b.

[0162] b. When there are multiple reflection regions 732 If there are multiple (for example, two) reflective regions 732, the misalignment detection unit 502 determines the amount of misalignment ΔG(X) in the X-axis direction, the amount of misalignment ΔG(Z) in the Z-axis direction, and the amount of misalignment ΔG(θ) in the θ-axis direction between the spatial light modulator 71 and the MLA unit 73, based on the detection information of the reflected light from a pair of sensor units 74a and 74b that acquire the reflected light from each reflective region 732.

[0163] Specifically, for example, the misalignment detection unit 502 calculates the X-axis and Z-axis misalignment amounts ΔG1(X) and ΔG1(Z) at the formation position of the reflection region 732 based on detection information obtained from a pair of sensor units 74a and 74b that detect reflected light reflected from one reflection region 732, in the same manner as described above. Furthermore, it calculates the X-axis and Z-axis misalignment amounts ΔG2(X) and ΔG2(Z) at the formation position of the reflection region 732 based on detection information obtained from a pair of sensor units 74a and 74b that detect reflected light reflected from the other reflection region 732. Then, based on the two sets of misalignment amounts obtained, the misalignment detection unit 502 determines the X-axis, Z-axis, and θ-axis misalignment amounts ΔG(X), ΔG(Z), and ΔG(θ) between the spatial light modulator 71 and the MLA unit 73.

[0164] In the exposure apparatus 100 according to this modified example, the sensor regions L of the sensor sections 74a and 74b are one-dimensional regions, and the positions of each sensor section 74a and 74b are defined such that the region T where reflected light is received in the sensor region L (light-receiving region) includes the intersections Ti and Tj of the sensor region L with non-parallel edges. With this configuration, the positional relationship between the spatial light modulator 71 and the MLA section 73 can be easily determined from the positions of the intersections Ti and Tj. In particular, if the positions of each sensor section 74a and 74b are defined such that the position where the intersections Ti and Tj appear in the correct state is the center Lo of the sensor region L, then positional deviations in both positive and negative directions can be detected.

[0165] <6-2. Other variations> In the above embodiment, the number of reflective regions 732 provided in the MLA section 73 may be one, two, or three or more. The more reflective regions 732 there are, the more accurately the amount of positional misalignment between the spatial light modulator 71 and the MLA section 73 can be determined. Conversely, the fewer reflective regions 732 there are, the simpler the device configuration can be. However, in order to calculate the amount of positional misalignment ΔG(θ) in the rotational direction (θ-axis direction) in addition to the positional misalignment amounts ΔG(X) and ΔG(Z) in the translational direction (directions along the X and Z axes), it is preferable to provide two or more reflective regions 732. Needless to say, if it is not necessary to calculate the positional misalignment amount ΔG(θ) in the rotational direction (for example, if the position changing section 83 does not have a rotation mechanism), a configuration with only one reflective region 732 is acceptable.

[0166] Furthermore, the positions in which the reflection regions 732 are formed can also be changed as appropriate. For example, when two reflection regions 732 are provided, the two reflection regions 732 may be positioned opposite each other in the Z direction with the array region 73a in between (for example, Figure 7), or opposite each other in the X direction with the array region 73a in between, or opposite each other with the array region 73a from its diagonal direction. Also, one, two, three, or four reflection regions 732 may each be provided near the corners of the array region 73a.

[0167] Furthermore, the size of the reflection region 732 can also be changed as appropriate. For example, it is preferable that the size of the reflection region 732 be defined based on the maximum value of the positional displacement to be detected. Specifically, for example, it is preferable that the size of the reflection region 732 be defined so that when a positional displacement equivalent to the maximum value occurs between the spatial light modulator 71 and the MLA unit 73, the pixel image A is captured within the reflection region 732. As an example, suppose that when a positional displacement equivalent to the maximum value occurs between the spatial light modulator 71 and the MLA unit 73 in the +X direction, the pixel image A is displaced by ΔA(X) in the +X direction, and when a positional displacement equivalent to the maximum value occurs between the spatial light modulator 71 and the MLA unit 73 in the -X direction, the pixel image A is displaced by ΔA(X) in the -X direction. In this case, it is also preferable that the dimension Dx of the reflection region 732 in the X direction be the value obtained by adding the maximum displacement ΔA(X) of the pixel image A in the +X direction and the -X direction to the dimension Ax of the pixel image A in the grid direction (Dx = Ax + 2ΔA(X)). The same applies to the other grid direction (Z direction).

[0168] Furthermore, the shape of the reflection region 732 can also be changed as appropriate. For example, in the above embodiment, the reflection region 732 is a concave surface, but the reflection region 732 is not limited to a concave surface. However, it is preferable that the reflection region 732 is a surface that is not perpendicular to the normal direction of the array plane (XZ plane) of the plurality of microlenses 731 (i.e., the direction of extension of the first optical axis K1 (Y axis direction), and the incident direction of light emitted from a predetermined position of the spatial light modulator 71 (specifically, light reflected by a specific auxiliary micromirror 711bt of the DMD 710)). For example, the reflection region 732 may be a flat inclined surface, a convex surface, etc., that is inclined not perpendicular to the normal direction of the array plane of the plurality of microlenses 731.

[0169] In the above embodiment, the reflection region 732 is illuminated by light from a specific auxiliary micromirror 711bt, which is one of the multiple auxiliary micromirrors 711b provided by the DMD 710. In other words, reflected light was formed using the auxiliary micromirrors 711b provided by the DMD 710. However, reflected light does not necessarily have to be formed using the auxiliary micromirrors 711b. For example, a dedicated micromirror or dedicated light-emitting unit for forming reflected light may be provided at a predetermined position in the DMD 710, and the light from this unit may be illuminated by light from this unit into the reflection region 732 to obtain reflected light. Needless to say, in this case, the reflection region 732 does not need to be located at a position corresponding to any of the grid points of the second grid pattern.

[0170] In the above embodiment, the manner in which the reflective region 732 is formed can be anything. For example, as described above, the reflective region 732 may be formed by providing a convex-shaped portion on a substrate 730 made of a light-transmitting material and providing a reflective film 733 thereon. Alternatively, the reflective region 732 may be formed by creating a concave shape on a metal plate or the like.

[0171] In the above embodiment, the MLA section 73 is configured such that a plurality of microlenses 731 and a reflective region 732 are provided on a common substrate 730. However, the configuration of the MLA section 73 is not limited to this. For example, the MLA section 73 may be configured such that a member having a reflective region 732 is attached to a member having a plurality of microlenses 731 arranged on a substrate (MLA main body).

[0172] In the above embodiment, the sensor unit 74 is fixedly mounted to the MLA unit 73, but the sensor unit 74 may be fixedly mounted to the spatial light modulator 71. Alternatively, the sensor unit 74 may be mounted on a reference unit that can provide a position reference (for example, the reference unit 80 of the holding unit 8). If the sensor unit 74 is not fixedly mounted to the MLA unit 73 or the spatial light modulator 71, for example, when determining the amount of positional displacement, the appropriate position of vertex To in the sensor region H can be calculated by taking into account the relative positional relationship between the sensor unit 74 and the MLA unit 73 at that time, and the amount of positional displacement can be determined using the latest appropriate position.

[0173] In the above embodiment, the light reception time for the sensor unit 74 to receive reflected light can be appropriately defined. For example, by extending the light reception time, the amount of light received can be increased while maintaining the magnification ratio.

[0174] In the above embodiment, one sensor unit 74 is provided for each of the one or more reflective regions 732 provided in the MLA unit 73 to receive the reflected light reflected from the reflective region 732. However, multiple sensor units 74 for detecting the reflected light reflected from each reflective region 732 may be provided. Similarly, in the above modified example, multiple pairs of sensor units 74a and 74b for detecting the reflected light reflected from each reflective region 732 may be provided.

[0175] In the above embodiment, the first grid pattern (and consequently the corresponding second grid pattern) on which the multiple pixel sections of the spatial light modulator 71 (or, if the spatial light modulator 71 includes a DMD section 710, the multiple micromirrors 711) are arranged does not need to have orthogonal grid directions. For example, the first grid pattern may have grid directions that form a 60-degree angle. Needless to say, in this case, the second grid pattern on which the multiple microlenses 731 in the MLA section 73 are arranged also has grid directions that form a 60-degree angle.

[0176] In the above embodiment, the shape of each pixel portion (or each micromirror 711 if the spatial light modulator 71 includes a DMD portion 710) in the spatial light modulator 71 can be anything. For example, each micromirror 711 may be rectangular (rectangular or square) or a polygonal shape other than rectangular. As an example, each micromirror 711 can be a square with a side size of about 10.8 μm.

[0177] In the above embodiment, the spatial light modulator 71 is said to be equipped with a DMD 710, but the configuration of the spatial light modulator 71 is not limited to this. For example, the spatial light modulator 71 may be equipped with a planar light valve (PLV), a grating light valve (GLV), or LCOS (Liquid Crystal On Silicon) instead of the DMD 710. For example, the spatial light modulator 71 may be configured to include a transmissive liquid crystal that can switch between transmitting and shielding light emitted from the backlight for each pixel. That is, the spatial light modulator 71 may form patterned light by applying spatial modulation to light by switching between transmitting and shielding light for each pixel.

[0178] Furthermore, if the spatial light modulator 71 is equipped with, for example, a DMD 710, as described above, each of the multiple micromirrors 711 reflects the light emitted from the light source unit 41, thereby emitting patterned light. In this configuration, the DMD 710 can be considered as a light-emitting unit, and each micromirror 711 can be considered as a unit light-emitting region in the light-emitting unit. Needless to say, the spatial light modulator 71 is not limited to emitting light by reflecting light in each of the multiple unit light-emitting regions. That is, each of the multiple unit light-emitting regions provided by the spatial light modulator 71 is not limited to emitting light by reflection of light, like the micromirrors 711, but may, for example, emit light by spontaneous emission (self-luminescence), or emit light by transmitting light.

[0179] In the above embodiment, the position changing unit 83 changed the positional relationship between the spatial light modulator 71 and the MLA unit 73 by moving the spatial light modulator 71 and changing its position, but the configuration of the position changing unit 83 is not limited to this. That is, the position changing unit 83 only needs to include at least one of a first position changing unit that changes the position of the spatial light modulator 71 and a second position changing unit that changes the position of the MLA unit 73. In other words, the position changing unit 83 only needs to change the positional relationship between the spatial light modulator 71 and the MLA unit 73 by moving at least one of the spatial light modulator 71 and the MLA unit 73 in at least one of the X-axis direction, the Z-axis direction, and the θ direction. Furthermore, the position changing unit 83 does not need to have all of the first translation mechanism, the second translation mechanism, and the rotation mechanism; for example, the rotation mechanism may be omitted.

[0180] If the position changing unit 83 includes at least one of a first position changing unit that changes the position of the spatial light modulator 71 and a second position changing unit that changes the position of the MLA unit 73, the position correction unit 503 can correct the misalignment by controlling one or both of the position changing units to reduce the misalignment when a misalignment between the spatial light modulator 71 and the MLA unit 73 is detected. In other words, when correcting the misalignment, either the position of the spatial light modulator 71 or the MLA unit 73 may be changed, or both may be changed. For example, if it is known whether the cause of the misalignment lies in the spatial light modulator 71 or the MLA unit 73, the position of the component that caused the misalignment may be changed. However, it is particularly preferable to change the position of the spatial light modulator 71 without changing the position of the MLA unit 73, since the irradiation position of the pattern light on the substrate W is not changed.

[0181] In the above embodiment, the position correction unit 503 is not an essential element and may be omitted. For example, if a positional misalignment is detected between the spatial light modulator 71 and the MLA unit 73, the detected misalignment amount may be displayed on the display unit 56, and the operator, upon seeing this, may input the direction and amount of movement of the spatial light modulator 71 (and / or the MLA unit 73) via the operation unit 57, and the position change unit 83 corrects the misalignment by moving the spatial light modulator 71 (and / or the MLA unit 73) in accordance with this input. However, the position change unit 83 is also not an essential element and may be omitted. For example, if a positional misalignment is detected between the spatial light modulator 71 and the MLA unit 73, a process may be performed to notify the operator of this fact.

[0182] In the holding unit 8 according to the above embodiment, a mechanism may be further provided to move the first holding part 81 that holds the spatial light modulator 71, or / or the second holding part 82 that holds the MLA part 73, in the direction of extension of the first optical axis K1 (Y-axis direction) relative to the reference part 80. Also, if the holding unit 8 includes holding parts that hold each lens barrel 721, 722 of the first imaging optical system 72, a mechanism may be further provided to move each holding part in the direction of extension of the first optical axis K1 (Y-axis direction) relative to the reference part 80. In this case, the Y positions of the spatial light modulator 71, the MLA part 73, or / or the lens barrels 721, 722 of the first imaging optical system 72 can be changed. For example, the Y position of at least one of the MLA section 73 and the second lens barrel 722 (and consequently the second lens 722a) may be adjusted according to the separation distance (separation distance between the exposure head 42 and the substrate W) measured by the measuring instrument 76, so that the imaging position (focus position) of the pattern light is aligned with the substrate W (more specifically, the upper surface of the photosensitive material layer R provided on the substrate W).

[0183] In the above embodiment, the detection and correction of positional displacement were performed individually for each of the translational directions, the X-axis and the Z-axis (steps S6 to S9 and S10 to S13 in Figure 13). However, the detection of positional displacement in the X-axis and Z-axis directions may be performed at the same time, and the correction of positional displacement in the X-axis and Z-axis directions may also be performed at the same time.

[0184] In the above embodiment, the timing of the misalignment detection operation, the duration for which the misalignment detection operation continues, etc., can be changed as appropriate. For example, the series of processes from step S2 to step S13 (Figure 13) may be performed once at predetermined intervals from the start to the end of the exposure operation. Furthermore, the misalignment detection operation does not necessarily have to be performed in parallel with the exposure operation; for example, the misalignment detection operation may be performed at a time when the exposure operation is not taking place.

[0185] In the above embodiment, the number of exposure units 40 (i.e., the number of exposure heads 42) provided by the exposure unit 4 may be any number. For example, the exposure unit 4 may have only one exposure unit 40. Also, if the exposure unit 4 has multiple exposure units 40 (i.e., multiple exposure heads 42), the arrangement of the multiple exposure heads 42 may be anything. For example, the multiple exposure heads 42 may be arranged in the sub-scanning direction (X direction) with gaps corresponding to a natural number multiple of the width of the strip-shaped region Qj (dimension in the X direction). In this case, during the sub-scanning operation, the stage 1 only needs to be moved by the width of the strip-shaped region Qj.

[0186] In the above embodiment, the spatial light modulator 71, the first imaging optical system 72, the MLA section 73, and the second imaging optical system 75 are arranged on an L-shaped path in the exposure head 42. However, these sections 71, 72, 73, and 75 may be arranged on a straight path extending, for example, in the Z direction. Also, in the above embodiment, the exposure head 42 is equipped with a measuring instrument 76. However, the measuring instrument 76 may be omitted.

[0187] In the above embodiment, the stage drive mechanism 2 is provided with a rotation mechanism 21, but the rotation mechanism 21 may be omitted. In this case, for example, the rotational alignment performed by rotating the stage 1 may be replaced by applying a known rotation correction, such as an affine transformation, to the pattern data D.

[0188] In the above embodiment, one or both of the guide units 222, 232 provided in the sub-scanning mechanism 22 and the main scanning mechanism 23 may be configured using LM guides (registered trademark) as mechanical elements that guide the linear motion part of the machine using "rolling". In addition, one or both of the sliding members 222b, 232b provided in each guide unit 222, 232 may be configured using air bearings.

[0189] In the above embodiment, the stage 1 was moved relative to the exposure unit 4 during the exposure operation, but the exposure unit 4 may be moved relative to the stage 1. In other words, the exposure apparatus 100 only needs to have a drive mechanism that moves the stage 1 and the exposure unit 4 relative to each other.

[0190] In the above embodiment, the pattern data D may be a single image data showing a pattern to be formed on the entire surface of the substrate W, or the single image data may be divided and held in a form corresponding to the portion that each exposure head 42 is responsible for drawing.

[0191] In the above embodiment, the method for detecting the misalignment between the spatial light modulator 71 and the MLA section 73 was exemplified when applied to an exposure apparatus 100 that irradiates a substrate W on which a photosensitive material layer R is formed with patterned light. However, this method for detecting misalignment may also be applied to various apparatuses that irradiate an object to be processed with patterned light (for example, an apparatus that irradiates metal powder with patterned light to solidify the metal powder into a desired shape and form a three-dimensional object).

[0192] As described above, the exposure apparatus has been described in detail, but the above description is illustrative in all respects and is not limiting. It is understood that countless variations not illustrated can be envisioned without falling outside the scope of this disclosure. Furthermore, the components described in the above embodiments and each variation can be combined or omitted as appropriate, as long as they do not contradict each other. [Explanation of symbols]

[0193] 100 Exposure equipment Stage 1 2-stage drive mechanism 3. Stage position measurement unit 4. Exposure area 41 Light source section 42 Exposure heads 71. Spatial Light Modulator 711 Micromirror 72 First imaging optical system 73 Microlens array section (MLA section) 73 731 Microlens 732 Reflection area 74, 74a, 74b Sensor section 75. Second imaging optical system 5. Control Unit 501 Operation Control Unit 502 Position deviation detection unit 503 Position correction section 8 Holding Unit 81 1st holding part 82 Second holding part 83 Position change section

Claims

1. A spatial light modulator having multiple pixel sections, A microlens array unit comprising multiple microlenses, each of which collects light from each of the multiple pixel units, The reflection region provided in the microlens array section, A sensor unit that detects reflected light that is reflected by the reflection region from light emitted from a predetermined position of the spatial light modulator and incident on the reflection region, A positional misalignment detection unit detects the positional misalignment between the spatial light modulator and the microlens array unit based on the detection information from the sensor unit, An exposure apparatus equipped with the following features.

2. An exposure apparatus according to claim 1, The reflective region is concave. Exposure apparatus.

3. An exposure apparatus according to claim 2, The sensor unit is positioned such that the normal to its sensor region passes through the focal point of the reflection region. Exposure apparatus.

4. An exposure apparatus according to any one of claims 1 to 3, The sensor area of ​​the aforementioned sensor unit is a two-dimensional area. The position of the sensor portion is defined such that the region in the sensor area where the reflected light is received includes the vertex. Exposure apparatus.

5. An exposure apparatus according to claim 4, The position of the sensor unit is defined such that the position where the vertex appears in a proper state where there is no misalignment between the spatial light modulator and the microlens array unit is the center of the sensor area. Exposure apparatus.

6. An exposure apparatus according to any one of claims 1 to 3, The sensor region of the aforementioned sensor unit is a one-dimensional region. The position of the sensor portion is defined such that the region in the sensor region where the reflected light is received includes the intersection of an edge that is not parallel to the extending direction of the sensor region. Exposure apparatus.

7. An exposure apparatus according to claim 6, The position of the sensor unit is defined such that the position where the intersection appears in a proper state where there is no misalignment between the spatial light modulator and the microlens array unit is the center of the sensor area. Exposure apparatus.

8. An exposure apparatus according to any one of claims 1 to 3, With respect to the arrangement direction of the plurality of microlenses, the dimensions of the reflection region are larger than the spacing between the plurality of microlenses. Exposure apparatus.

9. An exposure apparatus according to any one of claims 1 to 3, Each of the plurality of pixel portions is provided at a position corresponding to one of the grid points of the first grid pattern, Each of the plurality of microlenses is provided at a position corresponding to one of the grid points of the second grid pattern that corresponds to the first grid pattern, The reflection region is located in the region outside the array region of the plurality of microlenses, at a position corresponding to one of the grid points of the second grid pattern. Exposure apparatus.

10. An exposure apparatus according to any one of claims 1 to 3, An operation control unit that causes the spatial light modulator to form a pattern light and irradiate the object to be processed with the formed pattern light through the microlens array to perform an exposure operation in parallel, and the sensor unit to detect the reflected light and the positional misalignment detection unit to detect the positional misalignment, An exposure apparatus equipped with the following features.

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