Temperature control device, temperature control method, and exposure apparatus
Patent Information
- Application Number
- CN202411850601.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-13
- Publication Date
- 2026-06-16
Smart Images
Figure CN122219022A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of semiconductor manufacturing technology, specifically relating to a temperature control device, a temperature control method, and an exposure equipment. Background Technology
[0002] In semiconductor manufacturing, to achieve uniform temperature control of a highly warped substrate and ensure the target material's temperature is uniform, adsorption structures are typically used to force the substrate to flatten. In some cases, the adsorption mechanism passes through a temperature control device, such as a temperature control plate, which necessitates through-holes on the temperature control plate for the adsorption mechanism to pass through. In other cases, the adsorption mechanism is located in a blind hole on the temperature control plate.
[0003] Some existing temperature control boards have internal channels for the flow of a temperature-controlled medium, such as water, in areas without through-holes or blind holes. The temperature-controlled medium flowing through these channels controls the temperature of the temperature control board, and consequently, the temperature of the substrate mounted on it. However, because there are no flow channels at the through-holes or blind holes, the temperature control speed of the substrate located at these locations differs significantly from that of other areas on the temperature control board. This results in poor temperature uniformity of the substrate over a certain period, failing to meet the high-precision temperature control requirements of the substrate. Other existing temperature control boards do not have flow channels; instead, they use platinum temperature control sheets attached to areas without through-holes or blind holes to achieve temperature control. Summary of the Invention
[0004] The purpose of this invention is to provide a temperature control device and an exposure equipment, which aims to improve the temperature control effect and accuracy of the target object and improve the temperature uniformity of the target object.
[0005] To achieve the above objectives, the present invention provides a temperature control device, comprising a temperature control unit, wherein the temperature control unit includes a first temperature control section and a second temperature control section; wherein:
[0006] The first temperature control unit includes a temperature control plate, the temperature control plate having a preset surface; a weak temperature control area and a strong temperature control area are formed on the preset surface, the strong temperature control area surrounding the weak temperature control area;
[0007] The second temperature control unit includes a first nozzle, which faces the preset surface and is arranged corresponding to the weak temperature control area.
[0008] Optionally, the temperature control plate is provided with a hole extending in a direction perpendicular to the preset surface, the hole including a through hole; or, the hole is a blind hole with its opening located on the preset surface.
[0009] The weak temperature control area includes the area where the hole is located, and the strong temperature control area includes the area of the preset surface other than the hole.
[0010] Optionally, the temperature control plate has a flow channel inside, and the flow channel is offset from the hole;
[0011] The area of the preset surface corresponding to the flow channel is the strong temperature control zone.
[0012] Optionally, the temperature control plate includes a plate body and a platinum temperature control sheet. The plate body has the hole, and the platinum temperature control sheet is attached to at least the surface of the plate body facing the first nozzle and is offset from the hole. The strong temperature control area includes the area on the surface of the plate body facing the first nozzle where the platinum temperature control sheet is attached.
[0013] Optionally, both the number of holes and the number of first nozzles are multiple, with the multiple first nozzles corresponding one-to-one with the multiple holes.
[0014] Optionally, the first nozzle is arranged coaxially with the corresponding orifice.
[0015] Optionally, the temperature difference between the temperature of the second temperature-controlled medium ejected from the first nozzle and the target temperature is greater than zero.
[0016] Optionally, the temperature difference between the second temperature-controlled medium ejected from the first nozzle and the target temperature is 0.1℃ to 0.2℃.
[0017] Optionally, the temperature control device further includes a temperature-controlled gas source, which includes a heat exchange module connected to the first nozzle.
[0018] Optionally, the temperature-controlled gas source further includes a flow splitting module and a throttle valve. The flow splitting module includes an input terminal and multiple output terminals. The input terminal is connected to the heat exchange module. Each throttle valve is disposed on one of the output terminals. Each first nozzle is connected to one of the throttle valves.
[0019] Optionally, the temperature control device includes at least two temperature control units, which are arranged sequentially.
[0020] Optionally, the temperature control device further includes a third temperature control unit, which includes a second nozzle, the projection of which onto the plane of the preset surface is offset from the preset surface.
[0021] To achieve the above objectives, the present invention also provides a temperature control method, executed based on the temperature control device as described above, the temperature control method comprising:
[0022] The temperature of the strong temperature control zone of the temperature control board is brought to a first preset temperature.
[0023] Transferring the target object to the temperature control board; and
[0024] The first nozzle sprays a second temperature-controlled medium with a second preset temperature onto the target object located on the temperature control plate.
[0025] Optionally, the first preset temperature is different from the second preset temperature.
[0026] Optionally, the target object is transported to the temperature control plate along a preset path, the preset path having preset segments, and the projection of the preset segments on the plane where the preset surface is located is offset from the preset surface;
[0027] The temperature control device further includes a third temperature control unit, which includes a second nozzle, the second nozzle being arranged corresponding to the preset road section;
[0028] The temperature control method also includes:
[0029] When the target object is transported along the preset road section, the second nozzle sprays the second temperature-controlled medium with a third preset temperature onto the target object located in the preset road section.
[0030] Optionally, the temperature control device includes at least two temperature control units;
[0031] The temperature control method includes the following operations performed on the same target object on each of the temperature control units:
[0032] The temperature of the strong temperature control zone of the temperature control board is brought to a first preset temperature.
[0033] The target object is transferred to the temperature control board;
[0034] The first nozzle, corresponding to the temperature control plate where the target object is located, sprays the second temperature control medium with the second preset temperature onto the target object located on the temperature control plate;
[0035] The first preset temperature of the strong temperature control region of the temperature control unit that operates later is higher than the first preset temperature of the strong temperature control region of the temperature control unit that operates earlier, and the second preset temperature of the second temperature control medium of the temperature control unit that operates later is higher than the second preset temperature of the second temperature control medium of the temperature control unit that operates earlier; or,
[0036] The first preset temperature of the strong temperature control region of the temperature control unit that operates later is lower than the first preset temperature of the strong temperature control region of the temperature control unit that operates earlier, and the second preset temperature of the second temperature control medium of the temperature control unit that operates later is lower than the second preset temperature of the second temperature control medium of the temperature control unit that operates earlier.
[0037] To achieve the above objectives, the present invention also provides an exposure apparatus, including a robotic arm, a target object storage unit, a workpiece stage, and a temperature control device as described in any of the preceding claims; the robotic arm is configured to move the target object between the target object storage unit, the workpiece stage, and the temperature control device.
[0038] Compared with the prior art, the temperature control device, temperature control method, and exposure equipment of the present invention have the following advantages:
[0039] The aforementioned temperature control device includes a temperature control unit, which comprises a first temperature control section and a second temperature control section. The first temperature control section includes a temperature control plate with a preset surface. A weak temperature control area and a strong temperature control area are formed on the preset surface, with the strong temperature control area surrounding the weak temperature control area. The second temperature control section includes a first nozzle, which faces the preset surface and is arranged corresponding to the weak temperature control area. The temperature control device is used to exchange heat with a target object to control its temperature. In use, the target object is supported on the temperature control plate and arranged face-to-face with the preset surface. The temperature of the strong temperature control area of the temperature control plate is a first preset temperature. Simultaneously, the first nozzle sprays a second temperature control medium with a second preset temperature onto the target object. Thus, the temperature control plate mainly controls the temperature of the portion of the target object corresponding to the strong temperature control area of the preset surface, and the first nozzle mainly controls the temperature of the portion of the target object corresponding to the weak temperature control area. This improves the temperature control effect and uniformity of the target object. Attached Figure Description
[0040] The accompanying drawings are provided to better understand the invention and are not intended to unduly limit the scope of the invention. Wherein:
[0041] Figure 1 This is a schematic diagram of the frame of a temperature control device according to an embodiment of the present invention;
[0042] Figure 2 This is a partial structural schematic diagram of a temperature control device provided according to an embodiment of the present invention;
[0043] Figure 3 This is a partial structural schematic diagram of the first temperature control unit of the temperature control device provided according to an embodiment of the present invention;
[0044] Figure 4 This is a partial structural diagram of the first temperature control unit of the temperature control device provided according to an embodiment of the present invention. Figure 4 and Figure 3 The observation directions are different;
[0045] Figure 5This is a partial structural diagram of the first temperature control unit of the temperature control device provided according to an embodiment of the present invention. Figure 6 and Figure 3 and Figure 4 The difference lies in the number of holes;
[0046] Figure 6 This is a temperature distribution cloud map of the temperature control board when the temperature control device provided by the present invention according to an embodiment is applied;
[0047] Figure 7 This is a temperature distribution cloud map of the target object located on the temperature control plate when the temperature control device provided by the present invention according to an embodiment is applied;
[0048] Figure 8 This is a temperature change curve of each sampling point on the target object located on the temperature control plate at different times when the temperature control device provided by the present invention according to an embodiment is applied.
[0049] [The annotations in the attached figures are explained below]:
[0050] 100-Temperature control unit, 110-First temperature control section, 111-Temperature control board, 1111-Preset surface, 1112-Through hole, 1113-Contact block, 1114-Temperature sensor, 112-Temperature-controlled liquid source, 121-First nozzle, 200-Temperature-controlled gas source, 210-Heat exchange module, 220-Flow divider block, 221-Input end, 222-Output end, 230-Throttle valve, 240-Flow meter, 10-Target object. Detailed Implementation
[0051] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the drawings only show components related to the present invention and are not drawn according to the actual number, shape, and size of components in the actual implementation. In the actual implementation, the type, quantity, and proportion of each component can be arbitrarily changed, and the component layout may also be more complex.
[0052] Furthermore, while each embodiment described below possesses one or more technical features, this does not imply that users of the present invention must simultaneously implement all technical features in any embodiment, or can only separately implement some or all technical features in different embodiments. In other words, provided it is feasible, those skilled in the art can, based on the disclosure of the present invention and depending on design specifications or implementation requirements, selectively implement some or all technical features in any embodiment, or selectively implement a combination of some or all technical features in multiple embodiments, thereby increasing the flexibility in implementing the present invention.
[0053] As used herein, the singular forms “a,” “an,” and “the” include plural objects, and the plural form “multiple” includes two or more objects, unless otherwise expressly indicated. As used herein, the term “or” is generally used to include the meaning of “and / or,” unless otherwise expressly indicated, and the terms “installed,” “connected,” and “linked” should be interpreted broadly, for example, as a fixed connection, a detachable connection, or an integral connection. Connections can be mechanical or electrical. Connections can be direct or indirect through an intermediate medium, and can be internal communication between two elements or an interaction between two elements. Relational terms such as “first,” “second,” etc., are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations, nor do they indicate or imply relative importance or implicitly specify the number of indicated technical features. It should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Those skilled in the art can understand the specific meaning of the above terms in the present invention according to the specific circumstances.
[0054] One of the objectives of this invention is to provide a temperature control device that can be used to exchange heat with a target object located thereon to control the temperature of the target object, and has good temperature control accuracy so that the target object can have good temperature uniformity during the temperature control process.
[0055] The second objective of this invention is to provide a temperature control method based on the aforementioned temperature control device.
[0056] To make the objectives, advantages, and features of the present invention clearer, the temperature control device and method provided by the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clearly illustrate the objectives of the embodiments of the present invention. The same or similar reference numerals in the drawings represent the same or similar components.
[0057] <Example 1>
[0058] Figure 1 This diagram shows the frame of the temperature control device provided in this embodiment. Figure 2 A partial structural schematic diagram of the temperature control device is shown.
[0059] like Figure 1 and Figure 2 As shown, the temperature control device in this embodiment includes a temperature control unit 100, which includes a first temperature control section 110 and a second temperature control section (not shown in the figure). The first temperature control section 110 includes a temperature control plate 111, which has a preset surface 1111. A weak temperature control area and a strong temperature control area (not shown in the figure) are formed on the preset surface, with the strong temperature control area surrounding the weak temperature control area. The second temperature control section includes a first nozzle 121, which faces the preset surface 1111 and is arranged corresponding to the weak temperature control area of the hole 1112.
[0060] In this embodiment, as Figures 3 to 5 As shown, the temperature control plate 111 has a hole 1112 extending in a direction perpendicular to the preset surface, and the hole 1112 is a through hole. A flow channel (not shown in the figure) is also provided within the temperature control plate 111, and the flow channel is offset from the hole 1112; that is, the flow channel is located in the area of the temperature control plate 111 where the hole 1112 is not provided. The strong temperature control area refers to the area of the preset surface 1111 corresponding to the flow channel, and the weak temperature control area refers to the area where the hole 1112 is located. In this embodiment, the weak temperature control area can be referred to as the location of the hole 1112, and the strong temperature control area can be referred to as the area of the preset surface 1111 where the hole 1112 is not provided or the area of the preset surface 1111 corresponding to the flow channel.
[0061] The temperature control device further includes an adsorption mechanism (not shown in the figure). The adsorption mechanism includes a support rod and a suction cup. The suction cup is connected to one end of the support rod and is located between the preset surface 1111 and the first nozzle 121. The support rod partially passes through the hole 1112 and can reciprocate in a direction perpendicular to the preset surface 1111 to drive the suction cup to switch between a junction position and a heat exchange position. The heat exchange position is closer to the temperature control plate 111 than the junction position. When the adsorption mechanism is in the junction position, it can adsorb the target object 10 (e.g., ...) transmitted by the target object transmission mechanism. Figure 3 (as shown), and can carry the target object 20 from the handover position to the heat exchange position.
[0062] In this text, when the target object 10 is in the heat exchange position, the target object 10 is located on the temperature control plate 111, and the temperature control device can exchange heat with the target object 10 located on the temperature control plate 111 to achieve temperature control of the target object 10. It can be understood that when the temperature control device exchanges heat with the target object 10, the adsorption mechanism continuously adsorbs the target object 10 to fix its position.
[0063] Therefore, the temperature control method when exchanging heat with the target object 10 using the temperature control device may include:
[0064] Step S1: The temperature of the high-temperature control area on the preset surface 1111 reaches a first preset temperature. Specifically, a first temperature control medium with the first preset temperature is introduced into the flow channel, causing the temperature of the high-temperature control area to rise and remain at the first preset temperature.
[0065] Step S2: Use the adsorption mechanism to transfer and hold the target object 10 on the temperature control plate 111.
[0066] Step S3: The first nozzle 121 sprays the second temperature-controlled medium with a second preset temperature onto the target object 10 located on the temperature control plate 111.
[0067] It is understood that the first preset temperature and the second preset temperature are related to the target temperature of the target object 10. If the initial temperature of the target object 10 is higher than its target temperature, the temperature control method can be used to lower the temperature of the target object 10 to the target temperature. In this case, both the first preset temperature and the second preset temperature are lower than the target temperature. If the initial temperature of the target object 10 is lower than its target temperature, the temperature control method can be used to raise the temperature of the target object 10 to the target temperature. In this case, both the first preset temperature and the second preset temperature are higher than the target temperature.
[0068] The first temperature control medium is typically a liquid, including but not limited to water and oil. The second temperature control medium is a gas, specifically a compressed gas, such as compressed air, or other gases that do not react with the target material 10. The target material includes, but is not limited to, a substrate and a wafer.
[0069] In the above-described temperature control method, the temperature control plate 111 mainly exchanges heat with the portion of the target object 10 corresponding to the area of the preset surface 1111 where the holes 1112 are not provided, and the second temperature control medium sprayed by the first nozzle 121 mainly exchanges heat with the portion of the target object 10 corresponding to the holes 1112. This is because the temperature uniformity of the area of the preset surface 1111 where the holes 1112 are not provided is good, but the temperature at the holes 1112 is significantly different from the temperature of the surrounding area of the strongly temperature-controlled region (e.g., the area around the holes 1112). Figure 6 The temperature distribution cloud map of the temperature control board 111 described in the figure is shown below. Figure 6 The temperature control plate 111 has nine holes 1112 arranged in a 3×3 matrix. Specifically, if the first preset temperature is lower than room temperature, the temperature at the hole 1112 is higher than the temperature of the strongly temperature-controlled area surrounding the hole 1112; if the first preset temperature is higher than room temperature, the temperature at the hole 1112 is lower than the temperature of the strongly temperature-controlled area surrounding the hole 1112. Thus, if only the temperature control plate 111 is used for heat exchange with the target object 10, the rate of temperature change of the portion of the target object 10 corresponding to the area of the preset surface 1111 without the holes 1112 will be significantly different from the rate of temperature change of the portion of the target object 10 corresponding to the portion with the holes 1112. In this embodiment of the invention, based on the use of the temperature control plate 111, the first nozzle 121 is used to spray the second temperature control medium onto the portion of the target object 10 corresponding to the hole 1112. This allows the second temperature control medium to exchange heat with the portion of the target object 10 corresponding to the through hole 112, thereby reducing the difference in temperature change rate between the portion of the target object 10 corresponding to the area where the temperature control plate 111 does not have the hole 1112 and the portion corresponding to the hole 1112. This improves the temperature control uniformity of the target object 10 and enhances the temperature control effect and accuracy of the temperature control device.
[0070] Figure 7 and Figure 8 This is a schematic diagram illustrating the effect of using the temperature control device provided in this embodiment to perform the temperature control method. Figure 7 The image shown is a temperature distribution cloud map of the target object 10. Figure 8The image shows the temperature variation curves over time at nine sampling points on the target object 10 (the nine sampling points are labeled Ch 101, Ch 102, Ch 103, Ch 104, Ch 105, Ch 106, Ch 107, Ch 108, and Ch 109, respectively). Figure 7 As can be seen, the temperature difference between the portion of the target object 10 corresponding to the area without the hole 1112 on the preset surface 1111 and the portion of the target object 10 corresponding to the hole 1112 is no greater than 0.1℃. Figure 8 As can be seen, the maximum temperature difference between different sampling points on the target object 10 in the early stage of temperature control is no more than 4°C, and the temperature of each sampling point is basically the same in the later stage of temperature control, thus achieving the effect of making the temperature of each area of the target object 10 basically the same.
[0071] The first temperature control unit 110 further includes a contact block 1113, which is disposed on and protrudes from the preset surface 1111. The position of the end of the contact block 1113 away from the preset surface 1111 is the heat exchange position. That is, when the adsorption mechanism carries the target object 10 to the point where the target object 10 abuts against the contact block 1113, the target object 10 reaches the heat exchange position. The first nozzle 121 is disposed on the side of the contact block 1113 away from the preset surface 1111. In practice, the distance from the end of the contact block 1113 away from the preset surface 1111 to the preset surface 1111 is not equal to the distance from the first nozzle 121 to the preset surface 1111. For example, the distance from the end of the contact block 1113 away from the preset surface 1111 to the preset surface 1111 is approximately 0.2mm to 0.4mm, while the distance from the first nozzle 121 to the preset surface 1111 is approximately 45cm to 55cm. This results in the following: when the target object 10 is located on the temperature control plate 111 (i.e., the target object 10 is located at the heat exchange position), the distance from the target object 10 to the preset surface 1111 is not equal to its distance to the first nozzle 121. Consequently, the temperature loss of the energy provided by the temperature control plate 111 when it reaches the target object 10 is different from the temperature loss of the second temperature control medium when it reaches the target object 10. Therefore, in order to better improve the temperature change uniformity of the target object 10 during the temperature control process, it is preferable that the first preset temperature and the second preset temperature are different.
[0072] The difference between the first preset temperature and the second preset temperature, the distance from the target object 10 on the temperature control plate 111 to the preset surface 1111 and its distance to the first nozzle 121, the orifice diameter of the hole 1112, and the flow rate of the second temperature control medium interact with each other. In this embodiment of the invention, the difference between the first preset temperature and the second preset temperature is set to 0.1℃~0.2℃, and in actual operation, the flow rate of the second temperature control medium is adjusted according to the distance from the target object 10 on the temperature control plate 111 to the preset surface 1111 and its distance to the first nozzle 121, and the orifice diameter of the hole 1112. In a non-limiting embodiment, when the target object 10 is located on the temperature control plate 111, and the distance from the target object 10 to the preset surface 1111 is 0.2 mm to 0.4 mm, the distance from the target object 10 to the first nozzle 121 is 45 cm to 55 cm, and the orifice diameter of the hole 1112 is approximately 10 mm, the flow rate of the second temperature control medium sprayed by the first nozzle 121 can be determined in the range of 20 NL / min to 40 NL / min.
[0073] It should be noted that the difference between the first preset temperature and the second preset temperature of 0.1℃ to 0.2℃ means that if the initial temperature of the target object 10 is higher than the target temperature, the first preset temperature is 0.1℃ to 0.2℃ higher than the second preset temperature; if the initial temperature of the target object 10 is lower than the target temperature, the first preset temperature is 0.1℃ to 0.2℃ lower than the second preset temperature.
[0074] It is understood that, since there is a gap between the target object 10 at the heat exchange position and the preset surface 1111, the temperature control plate 111 and the target object 10 mainly exchange heat through thermal radiation.
[0075] In this embodiment, the number of holes 1112 on the temperature control plate 111 is not less than the number of suction cups in the adsorption mechanism, and the specific arrangement of the holes 1112 is related to the arrangement of the suction cups. For example, in a non-limiting embodiment, such as Figure 5 As shown, the adsorption mechanism includes nine suction cups, which are arranged in a 3×3 array. Thus, the temperature control plate 111 can be provided with nine holes 1112, which are arranged in a 3×3 array. That is, all the holes 1112 are arranged in a one-to-one correspondence with all the suction cups, so that the support rod connected to one of the suction cups is partially inserted into the corresponding hole 1112.
[0076] Accordingly, the number of the first nozzles 121 is the same as the number of the through holes 112, and they are arranged in a one-to-one correspondence. Preferably, each first nozzle 121 is arranged coaxially with the corresponding through hole 112. In this way, the first nozzles 121 can spray the second temperature control medium onto the target object in a direction perpendicular to the target object, and the second temperature control medium diffuses outward from the axis of the hole 1112 to achieve the best temperature control effect.
[0077] It is understood that the size of the hole 1112 is related to the size of the support rod. Optionally, when the target object 10 warps, in order for the adsorption device of the temperature control device to adsorb the target object 10 flat, the suction cup needs to be set to a larger size. Correspondingly, the outer diameter of the support rod is also larger, generally greater than or equal to 10 mm. Therefore, the diameter of the hole 1112 is also greater than or equal to 10 mm.
[0078] Optionally, the temperature control device further includes a temperature-controlled gas source 200, which is connected to the first nozzle 121 and is used to provide the first nozzle 121 with the second temperature-controlled medium having the second preset temperature. Optionally, the temperature-controlled gas source 200 includes a heat exchange module 210. The heat exchange module 210 is used to heat the second temperature-controlled medium at room temperature to obtain the second temperature-controlled medium having the second preset temperature. The heat exchange module 210 is directly or indirectly connected to the first nozzle 121.
[0079] It is understood that if the second temperature control medium is compressed gas, the temperature control gas source 200 also includes a gas compression mechanism.
[0080] In a preferred embodiment, the temperature-controlled gas source further includes a flow-dividing module 220 and a throttling valve 230. The flow-dividing module 220 includes an input terminal 221 and multiple output terminals 222. In this embodiment, the number of output terminals 222 is the same as the number of the first nozzles 121. The input terminal 221 is connected to the heat exchange module 210, each output terminal 222 is connected to one of the throttling valves 230, and each throttling valve 230 is connected to one of the first nozzles 121. Thus, the temperature-controlled gas source 200 can provide each of the first nozzles 121 with the second temperature-controlled medium having the second preset temperature. It is understood that each throttling valve 230 is used to control the flow rate of the second temperature-controlled medium injected through the corresponding first nozzle 121, thereby allowing the flow rate of the second temperature-controlled medium injected by each of the first nozzles 121 to be individually controlled as needed.
[0081] Furthermore, the temperature-controlled gas source also includes a flow meter 240. Each of the throttle valves 230 is provided with a flow meter 240 at its front or rear end to collect the flow rate of the second temperature-controlled medium injected by the first nozzle 121.
[0082] Furthermore, the throttle valve 230 is a solenoid valve, controlled by a control unit, and closes before the target object 10 arrives at or leaves the heat exchange position, and opens during the process of the target object 10 being in the heat exchange position and undergoing heat exchange. Alternatively, the temperature-controlled gas source 200 also includes a control valve (not shown in the figure), which is disposed between the heat exchange module 210 and the input end 221 of the diverter block 220, and closes before the target object 10 arrives at or leaves the heat exchange position, and opens during the process of the target object 10 being in the heat exchange position and undergoing heat exchange.
[0083] Furthermore, the first temperature control unit 110 also includes a temperature-controlled liquid source 112, which includes a liquid storage unit, a heating mechanism, a pump, and other components. The liquid storage unit stores the first temperature-controlled medium; its inlet is connected to the outlet of the flow channel, and its outlet is connected to the inlet of the flow channel. The heat exchange mechanism is disposed in the liquid storage unit and is used to exchange heat with the first temperature-controlled medium in the liquid storage unit. The pump is disposed in the liquid storage unit and is used to pump the first temperature-controlled medium, after heat exchange in the liquid storage unit, to the flow channel, and to pump the first temperature-controlled medium in the flow channel back to the liquid storage unit.
[0084] And, such as Figure 4 As shown, the first temperature control unit 110 also includes a temperature sensor 1114. The temperature sensor 1114 can be disposed on the surface of the temperature control plate 111 that is opposite to the preset surface 1111, and is used to monitor the temperature of the temperature control plate 1111.
[0085] <Example 2>
[0086] The difference between this embodiment and Embodiment 1 is that the hole 1112 is a blind hole, and the opening of the blind hole is on the preset surface 1111.
[0087] Accordingly, in this embodiment, the suction cup used to adsorb the target object 20 can be fixedly disposed at the hole 1112.
[0088] <Example 3>
[0089] The difference between this embodiment and Embodiment 1 is that the temperature control plate 111 does not have the flow channel, but instead includes a plate body and a platinum temperature control sheet. The plate body has the hole 1112, and the platinum temperature control sheet is attached to at least the surface of the plate body facing the first nozzle 121, offset from the hole 1112, so that the platinum temperature control sheet does not obstruct the hole 1112. Thus, the strong temperature control area is the area on the surface of the plate body facing the first nozzle where the platinum temperature control sheet is attached.
[0090] It is understood that in this embodiment, the hole 1112 can be a through hole, and correspondingly, the suction cup disposed at the hole 1112 can move in a direction perpendicular to the preset surface 1111. Alternatively, the hole 1112 can also be a blind hole opening on the preset surface 1111, and correspondingly, the suction cup is fixedly installed at the hole 1112.
[0091] <Example 4>
[0092] In this embodiment, the temperature control device includes at least two temperature control units 100, which are arranged in any suitable manner, such as spaced apart in the horizontal direction or spaced apart in the vertical direction.
[0093] The temperature control method based on the temperature control device provided in this embodiment includes executing steps S1 to S3 using each of the temperature control units 100 to control the temperature of the same target object 10. Furthermore, for different temperature control units 100, the first preset temperature of the strong temperature control region and the second preset temperature of the second temperature control medium are different. If the initial temperature of the target object 10 is higher than the target temperature, then the first preset temperature of the strong temperature control region of the temperature control unit 100 that operates first is lower than the first preset temperature of the strong temperature control region of the temperature control unit that operates later, and the second preset temperature of the second temperature control medium of the temperature control unit 100 that operates first is lower than the second preset temperature of the second temperature control medium of the temperature control unit that operates later. If the initial temperature of the target object 10 is lower than the target temperature, then the first preset temperature of the strong temperature control area of the temperature control unit 100 that operates first is higher than the first preset temperature of the strong temperature control area of the temperature control unit that operates later, and the second preset temperature of the second temperature control medium of the temperature control unit 100 that operates first is higher than the second preset temperature of the second temperature control medium of the temperature control unit that operates later.
[0094] Here, "first" and "later" are defined based on time. "The temperature control unit 100 that operates first" refers to the temperature control unit 100 that first carries the target object 10 and controls its temperature. "The temperature control unit 100 that operates later" refers to the temperature control unit 100 that subsequently carries the target object 10 and controls its temperature. Further explanation will be given using an example where the temperature control device includes n temperature control units 100.
[0095] For ease of description, the nth temperature control unit 100 will be referred to as the first temperature control unit, the second temperature control unit, ..., the (n-1)th temperature control unit, and the nth temperature control unit, respectively. The first preset temperature corresponding to the first temperature control unit will be referred to as the first preset temperature a1, and the second preset temperature corresponding to the first temperature control unit will be referred to as the second preset temperature b1; the first preset temperature corresponding to the second temperature control unit will be referred to as the first preset temperature a2, the second preset temperature corresponding to the second temperature control unit will be referred to as the second preset temperature b2, ..., and the first preset temperature corresponding to the (n-1)th temperature control unit will be referred to as the first preset temperature a. n-1 The second preset temperature corresponding to the (n-1)th temperature control unit is referred to as the second preset temperature b. n-1 The first preset temperature corresponding to the nth temperature control unit is referred to as the first preset temperature a. n The second preset temperature corresponding to the nth temperature control unit is referred to as the second preset temperature b. n .
[0096] Furthermore, steps S1 to S3 executed based on the first temperature control unit are referred to as steps S11, S21, and S31, respectively; steps S1 to S3 executed based on the second temperature control unit are referred to as steps S12, S22, and S32, respectively; steps S1 to S3 executed based on the (n-1)th temperature control unit are referred to as steps S1n-1, S2n-1, and S3n-1, respectively; and steps S1 to S3 executed based on the nth temperature control unit are referred to as steps S1n, S2n, and S3n, respectively. Therefore, in this embodiment, the temperature control method includes:
[0097] Step S11: Make the temperature of the strong temperature control area of the first temperature control unit reach the first preset temperature a1.
[0098] Step S21: Transfer the target object 10 to the temperature control board 111 of the first temperature control unit.
[0099] Step S31: The first nozzle 121 of the first temperature control unit sprays the second temperature control medium having the second preset temperature b1 onto the target object 10.
[0100] Step S12: The temperature of the strong temperature control zone of the first temperature control unit reaches the first preset temperature a2. Step S22: The target object 10 is transferred to the temperature control plate 111 of the second temperature control unit.
[0101] Step S32: The first nozzle 121 of the second temperature control unit sprays the second temperature control medium having the second preset temperature b2 onto the target object 10.
[0102] ...
[0103] Step S1n-1: Make the temperature of the strong temperature control zone of the first temperature control unit reach the first preset temperature a. n-1 .
[0104] Step S2n-1: Transfer the target object 10 to the temperature control plate 111 of the second temperature control unit.
[0105] Step S3n-1: The first nozzle 121 of the second temperature control unit sprays a substance with the second preset temperature b onto the target object 10. n-1 The second temperature control medium.
[0106] Step S1n: Make the temperature of the strong temperature control zone of the first temperature control unit reach the first preset temperature a. n .
[0107] Step S2n: Transfer the target object 10 to the temperature control plate 111 of the second temperature control unit.
[0108] Step S3n: The first nozzle 121 of the second temperature control unit sprays a substance with the second preset temperature b onto the target object 10. n The second temperature control medium.
[0109] It is understood that steps S11, S12, S1n-1, and S1n can be executed simultaneously.
[0110] During the above process, if the initial temperature of the target object 10 is higher than the target temperature, then the first preset temperature a1, the first preset temperature a2, ... the first preset temperature a n-1 The first preset temperature a n The temperatures increase sequentially, including the second preset temperature b1, the second preset temperature b2, and so on up to the second preset temperature b. n-1 The second preset temperature b nThe temperature increases sequentially. If the initial temperature of the target object 10 is lower than the target temperature, then the first preset temperature a1, the first preset temperature a2, ..., the first preset temperature a n-1 The first preset temperature a n The temperature decreases, and the second preset temperature b1 is higher than the second preset temperature b2... the first preset temperature b n-1 The first preset temperature b n Decrease sequentially.
[0111] That is, in the initial stage of temperature control of the target object 10, the temperature difference between the first temperature control medium and the target object 10, and the temperature difference between the second temperature control medium and the target object 10, are both greater than the temperature difference between the target temperature and the initial temperature. However, in the later stage of temperature control, the temperature differences between the first temperature control medium and the target object 10, and the temperature differences between the second temperature control medium and the target object 10, are similar to the temperature difference between the target temperature and the initial temperature. This approach can increase the rate of temperature change of the target object 10 in the initial stage of temperature control, and improve the temperature control accuracy in the later stage.
[0112] It is understood that the temperature control unit 100 in this embodiment can be any of the temperature control units 100 in embodiments one to three, and two or more temperature control units 100 can be the same or at least partially different.
[0113] <Example 5>
[0114] The temperature control device provided in this embodiment further includes a third temperature control unit (not shown in the figure), the third temperature control unit includes a second nozzle, and the projection of the second nozzle on a plane parallel to the preset surface is offset from the preset surface.
[0115] Those skilled in the art will understand that during the process of transferring the target object 10 to the temperature control plate 111 using the target object transfer mechanism, the target object transfer mechanism carries the target object 10 along a preset path. In this embodiment, a portion of the preset path is defined as a preset segment, and the projection of the preset segment onto a plane parallel to the preset surface 1111 is offset from the preset surface 1111. The second nozzle is configured corresponding to the preset segment.
[0116] The temperature control method executed by the temperature control device provided in this embodiment includes steps S1 to S3, and also includes step S4. Step S4 includes: when the target object 10 is transported along the preset road segment, causing the second nozzle to spray the second temperature control medium having a third preset temperature onto the target object 10 located in the preset road segment. It can be understood that step S4 is performed before step S2.
[0117] It is understood that when the initial temperature of the target object 10 is higher than the target object temperature, the third preset temperature is lower than the initial temperature; conversely, when the initial temperature of the target object 10 is lower than the target temperature, the third preset temperature should be higher than the initial temperature. The relationship between the third preset temperature and the first and second preset temperatures is set as needed. Furthermore, the number of the second nozzles is set as needed, generally multiple.
[0118] Optionally, the second nozzle shares the temperature-controlled gas source 200 with the first nozzle 121, meaning the temperature-controlled gas source 200 is also connected to all the second nozzles. Specifically, the number of output terminals 222 included in the flow divider block 220 is not less than the sum of the number of the first nozzles 121 and the number of the second nozzles, and the number of throttle valves 230 is not less than the sum of the number of the first nozzles 121 and the number of the second nozzles. Furthermore, each first nozzle 121 is connected to one output terminal 222 of the flow divider block 220 through one throttle valve 230, and each second nozzle can also be connected to one output terminal 222 of the flow divider block 220 through one throttle valve 230. It can be understood that in this case, the third preset temperature is substantially equal to the second preset temperature.
[0119] Alternatively, the second nozzle and the first nozzle 121 do not share a single temperature-controlled gas source. That is, the temperature control device includes two temperature-controlled gas sources: a first temperature-controlled gas source and a second temperature-controlled gas source. The first temperature-controlled gas source is connected to the first nozzle 121 to provide the first nozzle 121 with the second temperature-controlled medium having the second preset temperature, and the second temperature-controlled gas source is connected to the second nozzle to provide the second nozzle with the second temperature-controlled medium having the third preset temperature.
[0120] In a further improvement, the temperature control device provided in this embodiment may also include two or more temperature control units.
[0121] It is understood that the temperature control unit 100 in this embodiment can be any of the temperature control units 100 in embodiments one to three, and two or more temperature control units 100 can be the same or at least partially different.
[0122] Furthermore, a third objective of the present invention is to provide an exposure apparatus comprising a robotic arm, a target object storage unit, a workpiece stage, and a temperature control device. The robotic arm is configured to transfer the target object between the target object storage unit, the workpiece stage, and the temperature control device. The temperature control device is any one of the temperature control devices provided in Embodiment 1, Embodiment 2, and Embodiment 3 described above.
[0123] While the present invention has been disclosed above, it is not limited thereto. Those skilled in the art can make various modifications and variations to the present invention without departing from its spirit and scope. Therefore, if such modifications and variations fall within the scope of the claims and their equivalents, the present invention also intends to include such modifications and variations.
Claims
1. A temperature control device, characterized in that, Includes a temperature control unit, which comprises a first temperature control section and a second temperature control section; wherein: The first temperature control unit includes a temperature control plate, the temperature control plate having a preset surface; a weak temperature control area and a strong temperature control area are formed on the preset surface, the strong temperature control area surrounding the weak temperature control area; The second temperature control unit includes a first nozzle, which faces the preset surface and is arranged corresponding to the weak temperature control area.
2. The temperature control device according to claim 1, characterized in that, The temperature control board is provided with holes extending in a direction perpendicular to the preset surface. The holes include through holes or blind holes with openings located on the preset surface. The weak temperature control area includes the area where the hole is located, and the strong temperature control area includes the area of the preset surface other than the hole.
3. The temperature control device according to claim 2, characterized in that, The temperature control plate has internal flow channels, which are offset from the holes. The area of the preset surface corresponding to the flow channel is the strong temperature control area.
4. The temperature control device according to claim 2, characterized in that, The temperature control plate includes a plate body and a platinum temperature control sheet. The plate body has the hole. The platinum temperature control sheet is attached to at least the surface of the plate body facing the first nozzle and is offset from the hole. The strong temperature control area includes the area on the surface of the plate body facing the first nozzle where the platinum temperature control sheet is attached.
5. The temperature control device according to claim 2, characterized in that, Both the number of holes and the number of first nozzles are multiple, and the multiple first nozzles are arranged in a one-to-one correspondence with the multiple holes.
6. The temperature control device according to claim 2, characterized in that, The first nozzle is arranged coaxially with the corresponding orifice.
7. The temperature control device according to claim 1, characterized in that, The temperature difference between the temperature of the second temperature-controlled medium ejected from the first nozzle and the target temperature is greater than zero.
8. The temperature control device according to claim 7, characterized in that, The temperature difference between the second temperature-controlled medium ejected from the first nozzle and the target temperature is 0.1℃~0.2℃.
9. The temperature control device according to claim 1, characterized in that, The temperature control device further includes a temperature control gas source, which includes a heat exchange module connected to the first nozzle.
10. The temperature control device according to claim 9, characterized in that, The temperature-controlled gas source also includes a flow distribution module and a throttling valve. The flow distribution module includes an input terminal and multiple output terminals. The input terminal is connected to the heat exchange module. Each throttling valve is disposed on one of the output terminals. Each first nozzle is connected to one of the throttling valves.
11. The temperature control device according to claim 1, characterized in that, The temperature control device includes at least two temperature control units, which are arranged sequentially.
12. The temperature control device according to claim 1, characterized in that, The temperature control device further includes a third temperature control unit, which includes a second nozzle, the projection of which on the plane of the preset surface is offset from the preset surface.
13. A temperature control method, executed based on the temperature control device as described in claim 1, characterized in that, The temperature control method includes: The temperature of the strong temperature control zone of the temperature control board is brought to a first preset temperature. Transferring the target object to the temperature control board; and The first nozzle sprays a second temperature-controlled medium with a second preset temperature onto the target object located on the temperature control plate.
14. The temperature control method according to claim 13, characterized in that, The first preset temperature is different from the second preset temperature.
15. The temperature control method according to claim 13, characterized in that, The target object is transported to the temperature control plate along a preset path. The preset path has preset segments, and the projection of the preset segments onto the plane where the preset surface is located is offset from the preset surface. The temperature control device further includes a third temperature control unit, which includes a second nozzle, the second nozzle being arranged corresponding to the preset road section; The temperature control method also includes: When the target object is transported along the preset road section, the second nozzle sprays the second temperature-controlled medium with a third preset temperature onto the target object located in the preset road section.
16. The temperature control method according to claim 13, characterized in that, The temperature control device includes at least two temperature control units; The temperature control method includes the following operations performed on the same target object on each of the temperature control units: The temperature of the strong temperature control zone of the temperature control board is brought to a first preset temperature. The target object is transferred to the temperature control board; The first nozzle, corresponding to the temperature control plate where the target object is located, sprays the second temperature control medium with the second preset temperature onto the target object located on the temperature control plate; The first preset temperature of the strong temperature control region of the temperature control unit that operates later is higher than the first preset temperature of the strong temperature control region of the temperature control unit that operates earlier, and the second preset temperature of the second temperature control medium of the temperature control unit that operates later is higher than the second preset temperature of the second temperature control medium of the temperature control unit that operates earlier; or, The first preset temperature of the strong temperature control region of the temperature control unit that operates later is lower than the first preset temperature of the strong temperature control region of the temperature control unit that operates earlier, and the second preset temperature of the second temperature control medium of the temperature control unit that operates later is lower than the second preset temperature of the second temperature control medium of the temperature control unit that operates earlier.
17. An exposure apparatus, characterized in that, It includes a robotic arm, a target object storage unit, a workpiece stage, and a temperature control device as described in any one of claims 1-12; the robotic arm is configured to move the target object between the target object storage unit, the workpiece stage, and the temperature control device.