Double-sided adhesive tape for bonding polishing pads that facilitates the removal of air bubbles, and a chemical mechanical polishing apparatus using the adhesive tape.

Abstract

The present invention provides a double-sided adhesive tape for adhering a polishing pad, the double-sided adhesive tape including an upper release film layer, a first adhesive layer, an adhesive tape substrate laminated on a lower surface of the first adhesive layer, a second adhesive layer laminated on a lower surface of the adhesive tape substrate, and an air bubble discharge pattern shaped sheet layer laminated on the lower surface of the second adhesive layer, the air bubble discharge pattern being formed on the laminated surface with protruding lines, and a chemical mechanical polishing device to which the adhesive tape is applied.

Description

Technical Field

[0006]

[0001] This application claims the benefit of priority based on Korean Patent Application No. 10-2021-0182176 filed on Dec. 17, 2021, and all the contents disclosed in the documents of the Korean Patent Application are incorporated herein by reference.

[0002] The present invention relates to a double-sided adhesive tape for polishing pad adhesion that facilitates air bubble discharge and a chemical mechanical polishing apparatus to which the adhesive tape is applied.

Background Art

[0003] Double-sided adhesive tapes are widely used for joining parts, preventing gaps between surfaces, and filling gaps. For example, they can be used to apply a protective film to an electronic device to seal it and absorb shocks, and are also used in a method of fixing a CMP polishing pad to a platen.

[0004] When fixing the CMP polishing pad to the platen, a double-sided adhesive tape with a relatively large area is used. When using a double-sided adhesive tape with such a large area, air bubbles are frequently formed within the adhesive surface. Such air bubbles cause problems such as inhibiting the flatness of the polishing pad surface and weakening the adhesive force.

[0005] Specifically, when fixing the polishing pad to the platen, a double-sided adhesive tape that is located between the lower surface of the polishing pad and the upper surface of the platen and adheres them is used. If air bubbles are formed between the double-sided adhesive tape and the upper surface of the platen, the flatness of the upper surface of the polishing pad is inhibited, and the adhesive force of the polishing pad also becomes weaker. In particular, when the flatness is inhibited as described above, it is difficult to exhibit uniform polishing performance, and there is a problem that the portions protruding due to air bubbles wear out earlier.

[0006] Conventionally, when air bubbles formed at the interface as described above, they were removed by applying pressure from above with double-sided adhesive tape to push the bubbles to the edges. However, with this method, it is often impossible to remove the air bubbles.

[0007] Therefore, there is a need to develop a method that can easily remove the aforementioned bubbles. [Prior art documents] [Patent Documents]

[0008] [Patent Document 1] Korean Patent Publication No. 10-2013-0043589 [Overview of the project] [Problems that the invention aims to solve]

[0009] This invention was devised to solve the aforementioned problems of the prior art, The objective is to provide a double-sided adhesive tape for bonding polishing pads that can easily remove air bubbles generated on the bonding surface when using the double-sided adhesive tape, and a chemical-mechanical polishing apparatus to which the double-sided adhesive tape is applied. [Means for solving the problem]

[0010] To achieve the above objective, the present invention, Upper release film layer, The first adhesive layer, An adhesive tape substrate laminated on the lower surface of the first adhesive layer, A second adhesive layer laminated on the lower surface of the adhesive tape substrate and The present invention provides a double-sided adhesive tape for bonding polishing pads, which includes a bubble discharge pattern molded sheet layer laminated on the lower surface of the second adhesive layer and having a bubble discharge pattern formed by protruding lines on the laminated surface.

[0011] In one embodiment of the present invention, the bubble discharge pattern molded sheet layer may be laminated in such a state that the pattern formed by the protruding lines is recessed into the lower surface of the second adhesive layer.

[0012] In one embodiment of the present invention, the upper release film layer and the bubble discharge pattern molding sheet layer may be removed before use.

[0013] In one embodiment of the present invention, the second adhesive layer may be adhered to a surface where bubble removal is required.

[0014] In one embodiment of the present invention, the pattern formed by the protruding lines may be a stripe pattern or a polygonal pattern.

[0015] In one embodiment of the present invention, the polygonal pattern may be a quadrilateral pattern formed by linear protruding lines intersecting each other.

[0016] In one embodiment of the present invention, the cross-section in the width direction of the protruding line may be polygonal, circular with a portion of the lower side cut off, or elliptical with a portion of the lower side cut off.

[0017] In one embodiment of the present invention, the maximum width of the protruding line may be 50 μm to 250 μm, and the height may be 5 μm to 30 μm.

[0018] In one embodiment of the present invention, the quadrilateral pattern may have a width of 300 μm to 1000 μm between two non-adjacent sides.

[0019] In one embodiment of the present invention, the bubble discharge pattern molded sheet layer may include a molded sheet on which a bubble discharge pattern formed by protruding lines is formed on one surface, and a base film adhered to the other surface of the molded sheet.

[0020] Furthermore, the present invention is Polishing pad and including a surface plate to which the polishing pad is fixed, There is provided a chemical mechanical polishing apparatus, characterized in that the polishing pad is fixed to the surface plate using the double-sided adhesive tape for adhering the polishing pad of the present invention.

[0021] In one embodiment of the present invention, the lower surface of the polishing pad is adhered to the first adhesive layer of the double-sided adhesive tape, The upper surface of the surface plate may be adhered to the second adhesive layer of the double-sided adhesive tape.

Advantages of the Invention

[0022] The double-sided adhesive tape for adhering the polishing pad of the present invention forms a trench portion on the outer adhesive surface of the adhesive layer, which can discharge air bubbles. When air bubbles are generated at the adhesive interface, the air bubbles can be easily discharged outside the adhesive interface by applying pressure, providing an effect.

[0023] In addition, the chemical mechanical polishing apparatus of the present invention has excellent flatness on the upper surface of the polishing pad, exhibits uniform polishing performance, and the polishing pad adheres strongly to the surface plate, so it has the effect of improving the service life of the polishing pad.

Brief Description of the Drawings

[0024] [Figure 1] It is a cross-sectional view schematically showing an embodiment of the double-sided adhesive tape for adhering the polishing pad of the present invention. [Figure 2] It is an exploded cross-sectional view schematically showing an embodiment of the double-sided adhesive tape for adhering the polishing pad of the present invention. [Figure 3] It is a perspective view showing an embodiment of the forming sheet included in the double-sided adhesive tape for adhering the polishing pad of the present invention. [Figure 4] It is a photograph showing the adhesion state of the conventional double-sided adhesive tape for polishing pads. [Figure 5] It is a cross-sectional view schematically showing the form of air bubble generation when adhering a polishing pad using a conventional double-sided adhesive tape for polishing pads. [Figure 6]This is a schematic cross-sectional view showing another embodiment of the double-sided adhesive tape for bonding polishing pads of the present invention. [Figure 7] This is a cross-sectional view showing a polishing pad being bonded to a surface plate using the double-sided adhesive tape for bonding polishing pads of the present invention. [Figure 8] This is a schematic perspective view showing one embodiment of the chemical mechanical polishing apparatus of the present invention. [Figure 9] These are photographs showing the removal of air bubbles when using the double-sided adhesive tape for bonding polishing pads of the present invention (Example 1) and when using a conventional double-sided adhesive tape for bonding polishing pads (Comparative Example 1). [Figure 10] This photograph evaluates the presence or absence of liquid penetration (ink use) in the double-sided adhesive tape for bonding polishing pads of the present invention. [Figure 11] This photograph shows the test process and results of measuring the adhesive strength after inducing liquid penetration of the double-sided adhesive tape for bonding polishing pads of the present invention (Example 1) and a conventional double-sided adhesive tape for bonding polishing pads (Comparative Example 1). [Figure 12] This is a photograph showing the surface of the second adhesive layer included in the double-sided adhesive tape for bonding polishing pads of the present invention. [Modes for carrying out the invention]

[0025] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that they can be easily implemented by a person with ordinary skill in the art to which the present invention pertains. However, the present invention can be realized in a variety of different forms and is not limited to the embodiments described herein. Throughout the specification, the same reference numerals are used for similar parts.

[0026] When one constituent element is described as being "connected to, provided with, or provided for" another constituent element, it should be understood that it may be directly connected to or provided for the other constituent element, but other constituent elements may also exist in between. On the other hand, when one constituent element is described as being "directly connected to, provided with, or provided for" another constituent element, it should be understood that no other constituent elements exist in between. Similarly, other expressions describing the relationship between constituent elements, such as "on top of" and "directly on top of," or "between" and "immediately between," or "adjacent to" and "directly adjacent to," should be interpreted in the same way.

[0027] Figure 1 is a schematic cross-sectional view showing one embodiment of the double-sided adhesive tape for bonding polishing pads of the present invention, and Figure 2 is a schematic exploded cross-sectional view showing one embodiment of the double-sided adhesive tape for bonding polishing pads of the present invention.

[0028] The double-sided adhesive tape (100) for bonding polishing pads of the present invention, as shown in Figures 1 and 2, is characterized by comprising an upper release film layer (10), a first adhesive layer (20), an adhesive tape substrate (30) laminated on the lower surface of the first adhesive layer, a second adhesive layer (40) laminated on the lower surface of the adhesive tape substrate, and a bubble discharge pattern molded sheet layer (50) laminated on the lower surface of the second adhesive layer, which includes a bubble discharge pattern formed by protruding lines on the laminated surface.

[0029] Figure 3 is a perspective view showing one embodiment of the molded sheet layer (50) included in the double-sided adhesive tape (100) for bonding polishing pads according to the present invention.

[0030] In one embodiment of the present invention, the bubble discharge pattern molded sheet layer (50) may be laminated in such a state that the pattern (52) formed by protruding lines is recessed into the lower surface of the second adhesive layer (40), as shown in Figure 1.

[0031] As described above, when the pattern (52) formed by the protruding lines is laminated in a state in which it is recessed into the lower surface of the second adhesive layer (40), when the bubble discharge pattern molded sheet layer (50) is removed during use, the bubble discharge pattern (42) will be imprinted on the lower surface of the second adhesive layer (40) to which it was bonded.

[0032] Therefore, when the double-sided adhesive tape (100) for bonding the polishing pad is bonded to the upper surface of the surface plate (Figure 7, 70) by the second adhesive layer (40), even if air bubbles are generated between the polishing pad (Figure 7, 60) and the surface plate (70), these can be easily removed by the engraved air bubble discharge pattern (e.g., trenches). Figure 7 schematically shows a configuration in which the double-sided adhesive tape (100) for bonding the polishing pad of the present invention is positioned between the polishing pad (60) and the surface plate (70), and the polishing pad (60) is fixed to the surface plate (70).

[0033] As shown in Figure 7, the double-sided adhesive tape (100) for bonding the polishing pad is bonded between the polishing pad (60) and the surface plate (70) with the upper release film layer (10) and the bubble discharge pattern molding sheet layer (50) removed. Figure 12 shows a photograph of the second adhesive layer (40) with the upper release film layer (10) and the bubble discharge pattern molding sheet layer (50) removed.

[0034] In one embodiment of the present invention, the second adhesive layer (40) may be adhered to a surface where bubble removal is required, for example, a surface plate (70).

[0035] According to conventional technology, when a polishing pad is fixed to a surface plate using double-sided adhesive tape for bonding the polishing pad as described above, air bubbles often form between the double-sided adhesive tape and the surface plate, as shown in Figures 4 and 5, and it is very difficult to remove such air bubbles.

[0036] As described above, when air bubbles are present between the polishing pad and the surface plate, the flatness of the upper surface of the polishing pad is hindered, and the adhesive strength of the polishing pad is also weakened. In particular, when flatness is hindered as described above, it becomes difficult for the polishing pad to exhibit uniform polishing performance, and the parts that protrude due to the air bubbles wear out more quickly.

[0037] However, when using the double-sided adhesive tape (100) for bonding polishing pads according to the present invention, the above-mentioned problems can be easily resolved.

[0038] In one embodiment of the present invention, the pattern (52) formed by the protruding lines may be formed as a stripe pattern or a polygonal pattern.

[0039] The polygonal pattern may be various shapes formed by linear protruding lines, such as triangles, quadrilaterals, pentagons, hexagons, etc., and the shape of the polygon is not particularly limited.

[0040] In one embodiment of the present invention, the polygonal pattern may be a quadrilateral pattern formed by intersecting linear protruding lines. For example, such a quadrilateral pattern may have the shape shown in Figure 3. Such a quadrilateral pattern forms a linearly imprinted bubble discharge pattern (42, e.g., trenches) on the lower surface of the second adhesive layer (40), which may be advantageous for efficiently removing bubbles.

[0041] In one embodiment of the present invention, the cross-section in the width direction of the protruding line may be a polygon, a circle with a portion of the lower side cut off, or an ellipse with a portion of the lower side cut off. The polygon may be, for example, a triangle or a quadrilateral, but is not limited to these.

[0042] In one embodiment of the present invention, the maximum width of the protruding line (Figure 3, A) is 50 μm to 250 μm, preferably 140 μm to 180 μm, and the height (Figure 3, B) may be 5 μm to 30 μm, preferably 7 μm to 15 μm. If the maximum width of the protruding line is smaller than the range described above, the efficiency of bubble removal may decrease, and if it exceeds the range described above, the adhesive strength of the second adhesive layer (40) may decrease, which is undesirable.

[0043] In the above, the longest width of the protruding line may be formed at the lowest end of the protruding line where it connects with a surface on which no protruding line is formed. However, if the widthwise cross-section of the protruding line is a circular or elliptical shape with a portion of the lower side cut off, the longest width of the protruding line may not be formed at the lowest end of the protruding line.

[0044] In one embodiment of the present invention, the rectangular pattern may have a width between two non-adjacent sides (Figure 3, C) of 300 μm to 1000 μm, preferably 500 μm to 650 μm. If the width between the two sides is smaller than the range described above, the adhesive strength of the second adhesive layer (40) may decrease, and if it exceeds the range described above, the bubble removal efficiency may decrease, which is undesirable.

[0045] In the aforementioned quadrilateral pattern, there are two widths between two non-adjacent sides, and these two widths may be formed to be the same size.

[0046] Figure 6 is a schematic cross-sectional view showing another embodiment of the double-sided adhesive tape for bonding polishing pads according to the present invention. As shown in Figure 6, the bubble discharge pattern molded sheet layer (50) may include a molded sheet (54) on which a bubble discharge pattern formed by protruding lines is formed on one surface, and a base film (55) bonded to the other surface of the molded sheet. In this case, when using the double-sided adhesive tape (200) for bonding polishing pads, the molded sheet (54) and the base film (55) bonded to the other surface of the molded sheet may be separated separately, or they may be provided bonded together and separated at once.

[0047] Figure 8 is a schematic perspective view showing one embodiment of the chemical mechanical polishing apparatus (300) of the present invention.

[0048] The chemical mechanical polishing apparatus (300) of the present invention includes a polishing pad (60) and a base plate (70) to which the polishing pad is fixed, characterized in that the polishing pad is fixed to the base plate using the double-sided adhesive tape for bonding polishing pads of the present invention (not described).

[0049] The chemical mechanical polishing apparatus (300) of the present invention is characterized in that there are no air bubbles between the double-sided adhesive tape for bonding the polishing pad and the surface plate (70). Therefore, the chemical mechanical polishing apparatus (300) of the present invention exhibits excellent flatness of the upper surface of the polishing pad (60) and uniform polishing performance, and the polishing pad (60) is strongly bonded to the surface plate (70), thus providing the effect of improving the service life of the polishing pad.

[0050] In the chemical mechanical polishing apparatus (300), the lower surface of the polishing pad (60) may be adhered to the first adhesive layer (10) of the double-sided adhesive tape, and the upper surface of the surface plate (70) may be adhered to the second adhesive layer (40) of the double-sided adhesive tape.

[0051] In addition to the characteristic configuration described above, the chemical mechanical polishing apparatus (300) may further include a polishing head (80), a conditioner (90), a polishing slurry supply nozzle (94), and the like. Furthermore, it may include, without limitation, other components that are provided in chemical mechanical polishing apparatuses known in this art, in addition to the configuration described above.

[0052] The present invention will be described in detail below with reference to examples and comparative examples. However, the examples of the present invention can be modified into various other forms, and the scope of the present invention should not be construed as being limited to the examples described below in detail. The examples of the present invention are provided to explain the present invention in more detail to a person of average skill in the art.

[0053] Example 1: Manufacturing of double-sided adhesive tape for bonding polishing pads A 50 μm thick PET adhesive tape substrate was laminated with an acrylic adhesive to create a first adhesive layer 55 μm thick on its upper surface, and a 25 μm thick PET release film was laminated on the upper surface of the first adhesive layer.

[0054] Next, with the lower surface of the adhesive tape substrate facing upward, a second adhesive layer with a thickness of 40 μm was laminated using a rubber-based adhesive to prepare a molded sheet with a rectangular pattern (Figure 3, 52) formed on one surface by protruding lines, and a bubble discharge pattern molded sheet with a base film bonded to the other surface of the molded sheet. These were then laminated so that the rectangular pattern was embedded in the second adhesive layer to produce a double-sided adhesive tape for bonding polishing pads.

[0055] The molded sheet layer film was manufactured by applying a polyethylene resin to a thickness of 35 μm onto a PET substrate film with a thickness of 75 μm, pressing the upper surface with a molding roller before the polyethylene resin hardened to form a rectangular pattern (Figure 3, 52) with protruding lines, and then hardening the resin.

[0056] Comparative Example 1: Manufacturing of double-sided adhesive tape for bonding polishing pads Similar to Example 1, the upper release film layer, the first adhesive layer, the adhesive tape substrate, and the second adhesive layer were laminated.

[0057] A 25 μm thick PET release film was laminated onto the lower surface of the second adhesive layer to manufacture a double-sided adhesive tape for bonding polishing pads.

[0058] Test Example 1: Evaluation of bubble removal ability The bubble-removal pattern molding sheet was removed from the double-sided adhesive tape for bonding polishing pads manufactured in Example 1, the lower surface of the second adhesive layer was bonded to an acrylic surface plate, and pressure was applied to remove the bubbles.

[0059] On the other hand, the release film was removed from the second adhesive layer of the double-sided adhesive tape for bonding polishing pads manufactured in Comparative Example 1, the lower surface of the second adhesive layer was bonded to an acrylic surface plate, and air bubbles were removed by applying pressure.

[0060] The experimental results are shown in Figure 9. As can be seen in Figure 9, in Example 1, where the double-sided adhesive tape for bonding polishing pads of the present invention was bonded, no air bubbles remained after air bubble removal by pressurization. However, in Comparative Example 1, which used a conventional double-sided adhesive tape that does not have an air bubble discharge pattern molded sheet, many air bubbles remained even after air bubble removal by pressurization.

[0061] Test Example 2: Evaluation of Cohesion and Shear Force Using samples of the double-sided adhesive tape for bonding polishing pads from Example 1 and Comparative Example 1, which were bonded to an acrylic surface plate in the same manner as in Test Example 1, the adhesive strength and shear strength were measured.

[0062] The aforementioned adhesive strength was measured using a tensile strength tester (UTM), and the shear strength was also measured using a tensile strength tester (UTM). The measurement results are shown in Table 1 below.

[0063] [Table 1]

[0064] (Note) Permanent side: The side to which the double-sided adhesive tape is attached to the pad (Bottom). Removal side: The side to which the double-sided adhesive tape is attached to the CMP Platen (= embossed side). From Table 1 above, it was confirmed that the double-sided adhesive tape for bonding polishing pads in Example 1, despite including a bubble discharge pattern on the second adhesive surface, exhibited adhesive strength and shear strength at the same level as Comparative Example 1, and was also confirmed to be suitable for use.

[0065] Test Example 3: Evaluation of adhesive residue generation Using a sample of the double-sided adhesive tape for bonding the polishing pad of Example 1, which was bonded to an acrylic surface plate in the same manner as in Test Example 1, the degree of adhesive residue generation was evaluated.

[0066] Specifically, after the double-sided adhesive tape for bonding the polishing pad was attached to the acrylic surface plate, the tape was removed 10 hours later, and it was checked whether any residue remained.

[0067] The results of the above experiment confirmed that no residue remained on the surface plate when the double-sided adhesive tape was removed.

[0068] Test Example 4: Evaluation of the presence or absence of liquid penetration on the side and the adhesive strength after liquid penetration. (1) Side liquid penetration test A side liquid penetration test was performed using a sample of the double-sided adhesive tape for bonding polishing pads from Example 1, which was bonded to an acrylic surface plate using the same method as in Test Example 1.

[0069] Specifically, ink was supplied to the edge portion of the double-sided adhesive tape used to attach the polishing pad, which was bonded to the acrylic surface plate. After maintaining this for 10 hours, the presence or absence of ink penetration was checked. As a result of the test, as shown in Figure 10, no ink penetration into the edge portion of the double-sided adhesive tape used to attach the polishing pad was observed.

[0070] (2) Evaluation of adhesive strength after liquid penetration induction Samples of double-sided adhesive tape for bonding polishing pads in Example 1 and Comparative Example 1 were manufactured and used, bonded to an acrylic surface plate using the same method as in Test Example 1.

[0071] As shown in Figure 11, water was supplied to the edge portion of each sample of the double-sided adhesive tape for bonding the polishing pads, maintained for 10 hours, and then the adhesive strength was measured using a tensile strength tester (UTM). The results are shown in Figure 11.

[0072] From the table in Figure 11, it was confirmed that the double-sided adhesive tape for bonding the polishing pad in Example 1, despite including a bubble discharge pattern on the second adhesive surface, had an adhesive strength after liquid penetration that was at the same level as that of Comparative Example 1.

[0073] Although the present invention has been described in relation to the preferred embodiments described above, various modifications and variations are possible without deviating from the spirit and scope of the invention. Therefore, the appended claims include such modifications and variations, insofar as they fall within the spirit of the invention. [Explanation of symbols]

[0074] 10 Upper release film layer 20 First adhesive layer 30 Adhesive tape base material 40 Second adhesive layer 42 Bubble discharge pattern 50 Bubble discharge pattern molded sheet layer 52 Pattern formed by protruding lines 54 Molded sheet 55 Base film 60 Polishing pad 70 Surface plate 80 Grinding head 82 wafers, 92 conditioners 94 Polishing slurry supply nozzle 100, 200: Double-sided adhesive tape for bonding polishing pads 300 Chemical mechanical polishing equipment

Claims

1. Upper release film layer, The first adhesive layer, An adhesive tape substrate laminated on the lower surface of the first adhesive layer, A second adhesive layer laminated on the lower surface of the adhesive tape substrate, and This is a double-sided adhesive tape for bonding polishing pads, comprising a bubble discharge pattern molded sheet layer laminated on the lower surface of the second adhesive layer and including a bubble discharge pattern formed by protruding lines on the laminated surface, The bubble discharge pattern molded sheet layer is laminated in such a state that the bubble discharge pattern formed by the protruding line is recessed into the lower surface of the second adhesive layer. The bubble discharge pattern molded sheet layer includes a molded sheet on which the bubble discharge pattern formed by the protruding lines is formed on one surface and a base film adhered to the other surface of the molded sheet. The bubble discharge pattern formed by the protruding line is a stripe pattern or a polygonal pattern. When the bubble discharge pattern molded sheet layer is removed from the second adhesive layer, the bubble discharge pattern molded sheet layer forms a stripe pattern or polygonal pattern that is imprinted on the lower surface of the second adhesive layer and functions as a passage for bubbles to escape from the second adhesive layer. A double-sided adhesive tape for bonding polishing pads, characterized in that the molded sheet is a polyethylene resin sheet and the base film is a polyethylene terephthalate film.

2. The double-sided adhesive tape for bonding polishing pads according to claim 1, characterized in that the upper release film layer is removed during use.

3. The double-sided adhesive tape for bonding polishing pads according to claim 2, characterized in that the second adhesive layer is bonded to a surface where bubble removal is required.

4. The double-sided adhesive tape for bonding polishing pads according to claim 1, characterized in that the polygonal pattern is a quadrilateral pattern formed by linear protruding lines intersecting each other.

5. The cross-section in the width direction of the aforementioned protruding line is polygonal, circular with a portion of the lower side cut off, or elliptical with a portion of the lower side cut off. The double-sided adhesive tape for bonding polishing pads according to claim 1, characterized in that the circular or elliptical lower portion, from which a portion of the lower portion has been cut off, is joined to the upper surface of the molded sheet.

6. The double-sided adhesive tape for bonding polishing pads according to claim 1, characterized in that the maximum width of the protruding line is 50 μm to 250 μm and the height is 5 μm to 30 μm.

7. The double-sided adhesive tape for bonding polishing pads according to claim 6, characterized in that the width between two non-adjacent sides of the quadrilateral pattern is 300 μm to 1000 μm.

8. Polishing pad and The polishing pad is fixed to a surface plate, A chemical mechanical polishing apparatus characterized in that the polishing pad is fixed to the surface plate using the double-sided adhesive tape for adhering polishing pads according to claim 1.

9. The lower surface of the polishing pad is adhered to the first adhesive layer of the double-sided adhesive tape. The chemical mechanical polishing apparatus according to claim 8, characterized in that the upper surface of a surface plate is adhered to the second adhesive layer of the double-sided adhesive tape.

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