Substrate processing method
A multi-layer filler application method with varying viscosities and properties addresses the issue of gap filling in laminated substrates, ensuring reliable protection and maintaining substrate integrity during processing.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- EBARA CORP
- Filing Date
- 2022-06-29
- Publication Date
- 2026-05-26
AI Technical Summary
Existing methods fail to reliably fill gaps between the edge portions of laminated substrates with filler, leading to potential cracking and chipping during processing, and the filler may dissolve in post-processing solutions, causing damage.
A method involving multiple layers of fillers with varying viscosities and particle sizes is applied, where a first filler with low viscosity is used to penetrate gaps, followed by a second filler with higher viscosity and chemical resistance, and optionally a third filler with chemical resistance to protect the edges during post-processing.
The method ensures reliable filling of gaps without affecting post-processing steps, effectively protecting the laminated substrate edges from damage and maintaining performance.
Smart Images
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Abstract
Description
Technical Field
[0001] The present invention relates to a substrate processing method for suppressing cracks and chips in a laminated substrate manufactured by bonding a plurality of substrates, and particularly relates to a technique for applying a filler to a gap formed between edge portions of a plurality of substrates constituting the laminated substrate.
Background Art
[0002] In recent years, in order to achieve further high density and high functionality of semiconductor devices, the development of three-dimensional mounting technology for three-dimensionally integrating a plurality of substrates has been progressing. In the three-dimensional mounting technology, for example, the device surface of a first substrate on which an integrated circuit and electrical wiring are formed is bonded to the device surface of a second substrate on which an integrated circuit and electrical wiring are formed. Further, after the first substrate is bonded to the second substrate, the second substrate is thinned by a polishing device or a grinding device. In this way, integrated circuits can be stacked in a direction perpendicular to the device surfaces of the first substrate and the second substrate.
[0003] In the three-dimensional mounting technology, three or more substrates may be bonded. For example, after thinning the second substrate bonded to the first substrate, the third substrate may be bonded to the second substrate and the third substrate may be thinned. In this specification, the form of a plurality of substrates bonded to each other may be referred to as a "laminated substrate".
[0004] Normally, the edge portions of a substrate are pre-polished into a rounded shape or a chamfered shape in order to prevent cracks and chips. When a second substrate having such a shape is ground, as a result, sharp edges are formed on the second substrate. Such sharp edges (hereinafter referred to as knife edge portions) are formed by the back surface of the ground second substrate and the outer peripheral surface of the second substrate. Such knife edge portions are liable to chip due to physical contact, and the laminated substrate itself may be damaged during the conveyance of the laminated substrate. Further, if the bonding between the first substrate and the second substrate is not sufficient, the second substrate may crack during grinding.
[0005] Therefore, to prevent cracking and chipping at the knife edge, a filler is applied to the edge of the laminated substrate before grinding the second substrate. The filler is applied to the gap between the edge of the first substrate and the edge of the second substrate. The filler supports the knife edge formed after grinding the second substrate, preventing cracking and chipping at the knife edge. [Prior art documents] [Patent Documents]
[0006] [Patent Document 1] Japanese Patent Application Publication No. 5-304062 [Overview of the project] [Problems that the invention aims to solve]
[0007] However, when applying filler to the gap between the edge of the first substrate and the edge of the second substrate, the filler may not penetrate into minute gaps, especially near the bonding surface of the laminated substrate. Furthermore, the filled filler may dissolve in processing solutions used in post-processing steps such as polishing and cleaning. If the filler dissolves, it may adversely affect the performance of the laminated substrate and the process, such as causing scratches on the laminated substrate during post-processing.
[0008] Therefore, the present invention aims to provide a substrate processing method that can reliably fill the gap between the edge portion of the first substrate and the edge portion of the second substrate with a filler in a short time, and that can appropriately protect the edge portion of the laminated substrate without adversely affecting the post-processing step. [Means for solving the problem]
[0009] In one embodiment, a substrate processing method is provided for applying a filler to a laminated substrate in which a first substrate and a second substrate are joined, the method comprising the steps of applying a first filler to the gap between the edge portion of the first substrate and the edge portion of the second substrate, and applying a second filler to the gap after applying the first filler, wherein the first filler has a lower viscosity than the second filler. In one embodiment, the substrate processing method further includes a step of curing the applied first filler after applying the first filler, and the step of applying the second filler is performed after the first filler has been cured. In one embodiment, the first filler contains particles, the diameter of which is 1 μm or less.
[0010] In one embodiment, the second filler contains particles, and the diameter of the particles contained in the second filler is greater than the diameter of the particles contained in the first filler. In one embodiment, the first filler does not contain particles. In one embodiment, the viscosity of the first filler is 5 Pa·s or less. In one embodiment, the radial width of the applied first filler is smaller than the radial width of the applied second filler.
[0011] In one embodiment, the substrate processing method further includes a step of applying a third filler to the gap after applying the second filler, and a post-processing step of processing the laminated substrate after applying the third filler, wherein the third filler has chemical resistance and is not dissolved by the processing liquid used in the post-processing step. In one embodiment, the substrate processing method further includes the step of applying a third filler to the gap after applying the second filler, wherein the third filler has a higher viscosity than the second filler. In one embodiment, the substrate processing method further includes a step of curing the applied second filler after applying the second filler, and the step of applying the third filler is performed after the curing of the second filler. In one embodiment, the radial width of the applied second filler is greater than the radial width of the applied third filler.
[0012] In one embodiment, a substrate processing method is provided for applying a filler to a laminated substrate in which a first substrate and a second substrate are joined, the method comprising the steps of: applying a first filler to the gap between the edge portion of the first substrate and the edge portion of the second substrate; applying a second filler to the gap after applying the first filler; and a post-processing step of processing the laminated substrate after applying the second filler, wherein the second filler has chemical resistance and does not dissolve in the processing liquid used in the post-processing step. In one embodiment, the substrate processing method further includes a step of curing the applied first filler after applying the first filler, and the step of applying the second filler is performed after the first filler has been cured. In one embodiment, the first filler contains particles, the diameter of which is 1 μm or less. In one embodiment, the first filler does not contain particles.
[0013] In one embodiment, the steps of applying the first filler and applying the second filler are performed while rotating the laminated substrate, which is held in a vertical position. In one embodiment, the step of applying the third filler is performed while rotating the laminated substrate, which is held in a vertical position. [Effects of the Invention]
[0014] According to the present invention, by applying multiple layers of fillers with different viscosities and particle sizes to the gap between the edge of the first substrate and the edge of the second substrate, the fillers can be reliably filled into the gap in a short time. Furthermore, by applying a filler that has chemical resistance and does not dissolve in the processing solution used in the post-processing step, the edges of the laminated substrate can be properly protected without adversely affecting the post-processing step. [Brief explanation of the drawing]
[0015] [Figure 1] Figures 1(a) and 1(b) are enlarged cross-sectional views showing the edge of the substrate. [Figure 2] This is an enlarged cross-sectional view showing the edge portion of a multilayer substrate. [Figure 3] It is an enlarged cross-sectional view showing an edge portion of a laminated substrate where a filler is not applied to a minute gap. [Figure 4] It is a plan view showing an embodiment of a substrate processing apparatus. [Figure 5] It is a side view showing an embodiment of a substrate processing apparatus. [Figure 6] It is a schematic view showing an embodiment of a coating apparatus. [Figure 7] It is a flowchart showing an embodiment of a substrate processing method. [Figure 8] It is an enlarged cross-sectional view showing an edge portion of a laminated substrate filled with a first filler and a second filler. [Figure 9] It is a plan view showing another embodiment of a substrate processing apparatus. [Figure 10] It is a flowchart showing another embodiment of a substrate processing method. [Figure 11] It is an enlarged cross-sectional view showing an edge portion of a laminated substrate filled with a first filler, a second filler, and a third filler. [Figure 12] It is an enlarged cross-sectional view showing another embodiment of an edge portion of a laminated substrate filled with a first filler and a second filler. [Figure 13] It is a schematic view showing another embodiment of a filler application module. [Figure 14] It is a plan view showing another embodiment of a substrate processing apparatus. [Figure 15] It is a side view of the substrate processing apparatus shown in FIG. 14. [Figure 16] It is a side view showing still another embodiment of a substrate processing apparatus. [Figure 17] It is a view seen from the direction indicated by arrow A in FIG. 16. [Figure 18] It is a side view showing still another embodiment of a substrate processing apparatus. [Figure 19] It is a view seen from the direction indicated by arrow B in FIG. 18.
Embodiments for Carrying Out the Invention
[0016] Embodiments of the present invention will be described below with reference to the drawings. Figures 1(a) and 1(b) are enlarged cross-sectional views showing the edge portion E of a substrate W. More specifically, Figure 1(a) is a cross-sectional view of a so-called straight-type substrate W, and Figure 1(b) is a cross-sectional view of a so-called round-type substrate W. The edge portion E is the outermost surface of the substrate W that is inclined with respect to the flat surfaces (front and back surfaces), and has a rounded or chamfered shape. In the substrate W of Figure 1(a), the edge portion E is the outermost surface of the substrate W, composed of an upper inclined portion (upper bevel portion) B1, a lower inclined portion (lower bevel portion) B2, and a side portion (apex) B3. In the substrate W of Figure 1(b), the edge portion E is the portion with a curved cross-section that constitutes the outermost surface of the substrate W. The edge portion E is sometimes called the bevel portion.
[0017] Figure 2 is an enlarged cross-sectional view showing a laminated substrate Ws. The laminated substrate Ws has a structure in which a first substrate W1 and a second substrate W2 are joined at a bonding surface P. The first substrate W1 and the second substrate W2 used in this embodiment are circular. The laminated substrate Ws of this embodiment has a structure in which a round first substrate W1 and a second substrate W2 are joined, as shown in Figure 1(b), but in one embodiment the laminated substrate Ws may have a structure in which a straight first substrate W1 and a second substrate W2 are joined, as shown in Figure 1(a). In this specification, the edge portion of the laminated substrate Ws refers to the outer edge portion of the laminated substrate Ws, including the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2. The edge portions E1 and E2 are sometimes called bevel portions. A gap G is formed between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2. This gap G is formed around the entire circumference of the laminated substrate Ws.
[0018] The filler applied to the gap G between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2 mainly consists of a binder, a solvent, and particles, with the particles dispersed in the binder dissolved in the solvent. The particles are used to increase the volume of the filler and to adjust its viscosity. The gap G between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2 is particularly small near the bonding surface P of the laminated substrate Ws. Figure 3 is an enlarged cross-sectional view showing the edge of the laminated substrate Ws where the filler F is not filled into the tiny inner end of the gap G. If the viscosity of the filler F is high, the filler F will not penetrate into the tiny inner end of the gap G, resulting in the creation of a region Fn where the filler F is not filled.
[0019] Therefore, in this embodiment, by applying fillers with different viscosities in multiple layers, the filler is reliably filled into the minute gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2.
[0020] Figure 4 is a plan view showing one embodiment of the substrate processing apparatus 1, and Figure 5 is a side view showing one embodiment of the substrate processing apparatus 1. The substrate processing apparatus 1 is an apparatus for filling a laminated substrate Ws, in which a first substrate W1 and a second substrate W2 are joined, with a first filler F1 and a second filler F2. The substrate processing apparatus 1 includes a filler application module 9 configured to apply the first filler F1 and the second filler F2 to the laminated substrate Ws, and an operation control unit 10 that controls the operation of the filler application module 9. The filler application module 9 includes a substrate holding unit 2 for holding the laminated substrate Ws, a first application device 3A for applying the first filler F1, a second application device 3B for applying the second filler F2, and a curing device 4 for curing the applied first filler F1 and second filler F2.
[0021] The substrate holding unit 2 is a stage that holds the back surface of the laminated substrate Ws by vacuum suction. The filler coating module 9 further includes a rotating shaft 7 connected to the center of the substrate holding unit 2, and a rotating mechanism 8 that rotates the substrate holding unit 2 and the rotating shaft 7. The laminated substrate Ws is placed on the substrate holding unit 2 so that the center of the laminated substrate Ws coincides with the axis of the rotating shaft 7. The rotating mechanism 8 is equipped with a motor (not shown), and as shown in Figure 4, the rotating mechanism 8 is configured to rotate the substrate holding unit 2 and the laminated substrate Ws together in the direction indicated by the arrow, about the central axis Cr of the laminated substrate Ws.
[0022] The first coating device 3A is located radially outward of the laminated substrate Ws on the substrate holding section 2 and is configured to apply the first filler F1 to the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2 of the laminated substrate Ws. The second coating device 3B is located radially outward of the laminated substrate Ws on the substrate holding section 2 and is configured to apply the second filler F2 to the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2 of the laminated substrate Ws. In this embodiment, the first coating device 3A is located upstream of the second coating device 3B in the rotational direction of the laminated substrate Ws, but in one embodiment, the first coating device 3A may be located downstream of the second coating device 3B in the rotational direction of the laminated substrate Ws.
[0023] Figure 6 is a schematic diagram showing one embodiment of the coating apparatus. Figure 6 describes the configuration of the first coating apparatus 3A. The first coating apparatus 3A includes a syringe 21 for dispensing the first filler F1, a piston 22 that can reciprocate within the syringe 21, and a horizontal movement mechanism (not shown) for moving the syringe 21 closer to or further away from the laminated substrate Ws. This horizontal movement mechanism allows adjustment of the distance between the laminated substrate Ws and the filler discharge port 21a of the first coating apparatus 3A. In one embodiment, the horizontal movement mechanism may be omitted. In this case, the distance between the laminated substrate Ws and the filler discharge port 21a is predetermined so that the first filler F1 is appropriately injected into the gap G of the laminated substrate Ws.
[0024] Syringe 21 has a hollow structure and is configured to be filled with a first filler F1. Piston 22 is located inside syringe 21. Syringe 21 has a filler discharge port 21a at its tip for dispensing the first filler F1. The tip of syringe 21, including the filler discharge port 21a, may be detachably configured. The shape of the filler discharge port 21a is selected appropriately depending on the physical properties (e.g., viscosity) of the first filler F1 to be applied. The filler discharge port 21a is positioned to face the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2.
[0025] The first coating device 3A is connected to a gas supply source via a gas supply line 25. When gas (e.g., dry air or nitrogen gas) is supplied from the gas supply source to the syringe 21, the piston 22 moves forward within the syringe 21. As the piston 22 moves forward, the first filler F1 in the syringe 21 is discharged from the filler discharge port 21a.
[0026] The gas supply line 25 is equipped with a pressure regulator 26 and an on-off valve 27. The on-off valve 27 is an actuator-driven valve, such as an electric valve or a solenoid valve. When the on-off valve 27 is opened, gas is supplied from the gas supply source to the first coating device 3A, and the first coating device 3A applies the first filler F1 to the laminated substrate Ws. When the on-off valve 27 is closed, the supply of gas to the first coating device 3A is stopped, thereby stopping the application of the first filler F1. The pressure regulator 26 can adjust the amount of the first filler F1 discharged from the filler discharge port 21a per unit time by adjusting the pressure of the gas supplied from the gas supply source to the first coating device 3A. The operation of the pressure regulator 26 and the on-off valve 27 is controlled by the operation control unit 10.
[0027] Figure 6 illustrates the configuration of the first coating apparatus 3A. However, since the second coating apparatus 3B has a similar configuration to the first coating apparatus 3A, a redundant explanation will be omitted. The second coating apparatus 3B is configured to fill the syringe 21 with the second filler F2 and coat the laminated substrate Ws with the second filler F2. The operation of the second coating apparatus 3B is controlled by the operation control unit 10. In one embodiment, the gas supply source connected to the second coating apparatus 3B may be the same as the gas supply source connected to the first coating apparatus 3A. In this case, the gas supply source may be connected to the gas supply line 25 of the first coating apparatus 3A and the gas supply line 25 of the second coating apparatus 3B, respectively.
[0028] In one embodiment, the first coating device 3A and the second coating device 3B may be equipped with a screw feeder instead of the combination of syringe 21 and piston 22.
[0029] As shown in Figures 4 and 5, the curing device 4 is located radially outward of the laminated substrate Ws on the substrate holding section 2. The curing device 4 is positioned downstream of the first coating device 3A and the second coating device 3B in the rotational direction of the laminated substrate Ws, and is configured to cure the first filler F1 and the second filler F2 applied to the laminated substrate Ws by the first coating device 3A and the second coating device 3B. The curing of the first filler F1 and the second filler F2 by the curing device 4 is performed while the laminated substrate Ws is rotated. In this embodiment, the first filler F1 and the second filler F2 are thermosetting fillers. An example of such a filler is a thermosetting resin.
[0030] The curing device 4 is an air heater configured to blow hot air onto the first filler F1 and second filler F2 applied to the laminated substrate Ws. The curing device 4 is configured to allow adjustment of the air pressure and temperature of the blown hot air. The first filler F1 and second filler F2, heated by the hot air, harden through a crosslinking reaction. If the first filler F1 and second filler F2 contain a solvent, the solvent is evaporated by heating. The curing device 4 is not limited to an air heater; it may also be a lamp heater or other configuration as long as it can heat and harden the first filler F1 and second filler F2.
[0031] In this embodiment, the first filler F1 and the second filler F2 are thermosetting fillers, but in one embodiment, the first filler F1 and the second filler F2 may be UV-curable fillers. In this case, the curing device 4 may be a UV irradiation device that cures the first filler F1 and the second filler F2 by irradiating them with ultraviolet light. If the first filler F1 and the second filler F2 contain a solvent, the solvent may be evaporated by heating them using an air heater or the like.
[0032] The operation of the filler coating module 9, which includes a first coating device 3A, a second coating device 3B, a curing device 4, a rotating mechanism 8, a pressure regulating device 26, and an on-off valve 27, is controlled by an operation control unit 10. The operation control unit 10 consists of at least one computer. The operation control unit 10 includes a storage device 10a that stores a program for controlling the operation of the filler coating module 9, and a processing unit 10b that performs calculations according to the instructions contained in the program. The storage device 10a includes a main memory such as random access memory (RAM) and an auxiliary storage device such as a hard disk drive (HDD) or a solid-state drive (SSD). Examples of processing units 10b include a CPU (central processing unit) and a GPU (graphics processing unit). However, the specific configuration of the operation control unit 10 is not limited to these examples.
[0033] Figure 7 is a flowchart showing one embodiment of the substrate processing method. In step S101, the operation control unit 10 gives a command to the rotation mechanism 8 of the filler coating module 9 to rotate the substrate holding unit 2 and the laminated substrate Ws at a predetermined rotational speed. In step S102, the operation control unit 10 issues a command to the on-off valve 27 connected to the first coating device 3A to open the on-off valve 27 and supply gas from the gas supply source to the first coating device 3A. This operation injects the first filler F1 into the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2 of the rotating laminated substrate Ws. After applying the first filler F1, the syringe 21 of the first coating device 3A may be moved away from the laminated substrate Ws. In step S103, the operation control unit 10 gives a command to the curing device 4 of the filler coating module 9 to heat the laminated substrate Ws and cure the applied first filler F1.
[0034] In step S104, the operation control unit 10 issues a command to the on-off valve 27 connected to the second coating device 3B to open the on-off valve 27 and supply gas from the gas supply source to the second coating device 3B. This operation injects the second filler F2 into the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2 of the rotating laminated substrate Ws. The second filler F2 is applied so as to overlap the hardened first filler F1. After applying the second filler F2, the syringe 21 of the second coating device 3B may be moved away from the laminated substrate Ws. In step S105, the operation control unit 10 gives a command to the curing device 4 of the filler coating module 9 to heat the laminated substrate Ws and cure the applied second filler F2.
[0035] Figure 8 is an enlarged cross-sectional view showing a laminated substrate Ws filled with a first filler F1 and a second filler F2. The second filler F2 is located radially outside the first filler F1 and is applied so as to cover the first filler F1. The first filler F1 and the second filler F2 consist of a binder, a solvent, and particles, with the particles dispersed in the binder dissolved in the solvent.
[0036] Examples of binders include inorganic binders containing alkali metal silicates, and organic binders composed of silicone resins or epoxy resins. Binders may also contain solvents. Examples of particles include inorganic particles such as silica and alumina.
[0037] The first filler F1 has a lower viscosity than the second filler F2. The gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2 is minute, especially near the bonding surface P of the laminated substrate Ws. Since a filler with low viscosity can easily penetrate minute gaps, the first filler F1 may have a low viscosity of 5 Pa·s or less. The viscosity of the first filler F1 and the second filler F2 is adjusted by the amount of solvent, the amount of particles, the size of the particles, etc. In one embodiment, the first filler F1 may not contain any particles.
[0038] The radial width x1 of the applied first filler F1 is smaller than the radial width x2 of the applied second filler F2. In one embodiment, the volume of the applied first filler F1 is smaller than the volume of the applied second filler F2. Low viscosity fillers contain a large amount of solvent, so after curing, the final volume of filler filled is smaller. Therefore, when filling the same volume of filler, a low viscosity filler requires a larger application amount than a high viscosity filler. It also requires the evaporation of a larger amount of solvent. Consequently, when filling the same volume of filler, a low viscosity filler takes longer to apply and cure than a high viscosity filler. Therefore, by applying a second filler F2, which has a higher viscosity than the first filler F1, in a larger volume than the first filler F1, the filler can be filled in a shorter time.
[0039] The thickness of the applied first filler F1 (a dimension along the thickness direction of the laminated substrate Ws) may be 10 μm or less. In one example, the diameter of the particles contained in the first filler F1 is 1 μm or less. As a result, the first filler F1 fills the area without gaps up to the vicinity of the bonding surface P. The diameter of the particles contained in the second filler F2 is larger than the diameter of the particles contained in the first filler F1. Larger diameter particles can efficiently increase the volume of the second filler F2, thereby increasing the mechanical strength of the second filler F2.
[0040] In one embodiment, the first filler F1 and / or the second filler F2 may not contain particles.
[0041] Next, other embodiments of the substrate processing method will be described. The laminated substrate Ws filled with the first filler F1 and the second filler F2 is processed in post-processing steps such as a polishing step (e.g., chemical mechanical polishing) and a cleaning step. The polishing step is a step of polishing the surface of the laminated substrate Ws by supplying a polishing liquid onto the polishing surface and sliding the laminated substrate Ws against the polishing surface. The cleaning step is a step of cleaning the surface of the polished laminated substrate Ws by supplying a cleaning liquid to the polished laminated substrate Ws.
[0042] In the post-processing stage, treatment solutions such as alkaline polishing solutions and acidic cleaning solutions are used. The second filler F2 is located on the outermost edge of the gap G in the laminated substrate Ws and may dissolve due to the treatment solutions used in the post-processing stage. If the second filler F2 dissolves, it may cause damage to the laminated substrate Ws and adversely affect the performance of the laminated substrate and the process.
[0043] Therefore, in this embodiment, the laminated substrate Ws is effectively protected by further applying a chemical-resistant filler that does not dissolve in the processing solution used in the post-processing step to the radially outer layer.
[0044] Figure 9 is a plan view showing another embodiment of the substrate processing apparatus 1. The configuration of the substrate processing apparatus 1 in this embodiment, which is not specifically described, is the same as the configuration of the substrate processing apparatus 1 in the above embodiment described with reference to Figures 4 and 5, so the redundant description is omitted. In this embodiment, the filler coating module 9 further comprises a third coating apparatus 3C for coating the third filler F3 onto the laminated substrate Ws.
[0045] The third coating device 3C is located radially outward of the laminated substrate Ws on the substrate holding section 2, and is configured to apply the third filler F3 to the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2 of the laminated substrate Ws. In this embodiment, the third coating device 3C is located downstream of the first coating device 3A and the second coating device 3B in the rotational direction of the laminated substrate Ws, but the positional relationship between the first coating device 3A, the second coating device 3B, and the third coating device 3C is not limited to this. In one embodiment, the third coating device 3C may be located upstream of the first coating device 3A and the second coating device 3B in the rotational direction of the laminated substrate Ws.
[0046] The configuration of the third coating apparatus 3C is the same as that of the first coating apparatus 3A, which was described with reference to Figure 6, so a redundant explanation will be omitted. The third coating apparatus 3C is configured such that the third filler F3 is filled inside the syringe 21 and the third filler F3 is applied to the laminated substrate Ws. The operation of the third coating apparatus 3C is controlled by the operation control unit 10. In one embodiment, the gas supply source connected to the third coating apparatus 3C may be the same as the gas supply source connected to the first coating apparatus 3A. In this case, the gas supply source may be connected to the gas supply line 25 of the first coating apparatus 3A and the gas supply line 25 of the third coating apparatus 3C, respectively.
[0047] In one embodiment, the first coating device 3A, the second coating device 3B, and the third coating device 3C may be equipped with a screw feeder instead of a combination of syringe 21 and piston 22.
[0048] Figure 10 is a flowchart showing another embodiment of the substrate processing method. In step S201, the operation control unit 10 gives a command to the rotation mechanism 8 of the filler coating module 9 to rotate the substrate holding unit 2 and the laminated substrate Ws at a predetermined rotational speed. In step S202, the operation control unit 10 issues a command to the on-off valve 27 connected to the first coating device 3A to open the on-off valve 27 and supply gas from the gas supply source to the first coating device 3A. This operation injects the first filler F1 into the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2 of the rotating laminated substrate Ws. After applying the first filler F1, the syringe 21 of the first coating device 3A may be moved away from the laminated substrate Ws. In step S203, the operation control unit 10 commands the curing device 4 of the filler coating module 9 to heat the laminated substrate Ws and cure the applied first filler F1.
[0049] In step S204, the operation control unit 10 commands the on-off valve 27 connected to the second coating device 3B to open the on-off valve 27 and supply gas from the gas supply source to the second coating device 3B. This operation injects the second filler F2 into the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2 of the rotating laminated substrate Ws. The second filler F2 is applied so as to overlap the hardened first filler F1. After applying the second filler F2, the syringe 21 of the second coating device 3B may be moved away from the laminated substrate Ws. In step S205, the operation control unit 10 gives a command to the curing device 4 of the filler coating module 9 to heat the laminated substrate Ws and cure the applied second filler F2.
[0050] In step S206, a command is given to the on-off valve 27 connected to the third coating device 3C to open the on-off valve 27 and supply gas from the gas supply source to the third coating device 3C. This action injects the third filler F3 into the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2 of the rotating laminated substrate Ws. The third filler F3 is applied so as to overlap the hardened second filler F2. After applying the third filler F3, the syringe 21 of the third coating device 3C may be moved away from the laminated substrate Ws. In step S207, the operation control unit 10 gives a command to the curing device 4 of the filler coating module 9 to heat the laminated substrate Ws and cure the applied third filler F3.
[0051] Figure 11 is an enlarged cross-sectional view showing a laminated substrate Ws filled with a first filler F1, a second filler F2, and a third filler F3. The second filler F2 is located radially outside the first filler F1 and is applied to cover the first filler F1. The third filler F3 is located radially outside the second filler F2 and is applied to cover the second filler F2. The first filler F1 and the second filler F2 are the same as those described in the embodiment with reference to Figure 8, so their redundant description is omitted. The third filler F3 consists of a binder, a solvent, and particles, with the particles dispersed in the binder dissolved in the solvent. In one embodiment, the third filler F3 may not contain particles.
[0052] Examples of binders include inorganic binders containing alkali metal silicates, and organic binders composed of silicone resins or epoxy resins. Binders may also contain solvents. Examples of particles include inorganic particles such as silica and alumina.
[0053] The third filler F3 has chemical resistance and is not dissolved by the processing solution used in the post-processing step. Here, "not dissolved" does not only mean that the third filler F3 is not dissolved at all, but also that the third filler F3 does not substantially disintegrate.
[0054] The radial width x1 of the applied first filler F1 is smaller than the radial width x2 of the applied second filler F2. In one embodiment, the volume of the applied first filler F1 is smaller than the volume of the applied second filler F2. Low viscosity fillers contain a large amount of solvent, so after curing, the final volume of filler filled is smaller. Therefore, when filling the same volume of filler, a low viscosity filler requires a larger application amount than a high viscosity filler. It also requires the evaporation of a larger amount of solvent. Consequently, when filling the same volume of filler, a low viscosity filler takes longer to apply and cure than a high viscosity filler. Therefore, by applying a second filler F2, which has a higher viscosity than the first filler F1, in a larger volume than the first filler F1, the filler can be filled in a shorter time.
[0055] The radial width x2 of the applied second filler F2 is greater than the radial width x3 of the applied third filler F3. In one embodiment, the volume of the applied second filler F2 is greater than the volume of the applied third filler F3. If the volume of the third filler F3, which has high chemical resistance to the processing liquid used in the post-processing step, is large, it becomes difficult to easily remove the third filler F3 from the laminated substrate Ws in a later step. Therefore, by applying the third filler F3 in a volume smaller than that of the second filler F2, the second filler F2 is adequately protected in the post-processing step, and the third filler F3 can be easily removed from the laminated substrate Ws.
[0056] The embodiments described with reference to Figures 9 to 11 are not limited to fillers having the physical properties described above, as long as three different fillers are used. In one embodiment, the three fillers are fillers with different viscosities, the second filler F2 may have a higher viscosity than the first filler F1, and the third filler F3 may have a higher viscosity than the second filler F2. The viscosities of the first filler F1, the second filler F2, and the third filler F3 are adjusted by the type of binder, the amount of solvent, the amount of particles, the size of the particles, and so on.
[0057] Figure 12 is an enlarged cross-sectional view showing another embodiment of the edge portion of a laminated substrate Ws filled with a first filler F1 and a second filler F2. In this embodiment, a third chemical-resistant filler F3, as described with reference to Figure 11, is applied as the second filler F2. The configuration of the substrate processing apparatus 1 in this embodiment is the same as the configuration of the substrate processing apparatus 1 in the embodiment described with reference to Figures 4 and 5, so the redundant explanation is omitted.
[0058] The second filler F2 is located radially outside the first filler F1 and is applied to cover the first filler F1. The first filler F1 and the second filler F2 consist of a binder, a solvent, and particles, with the particles dispersed in the binder dissolved in the solvent.
[0059] Examples of binders include inorganic binders containing alkali metal silicates, and organic binders composed of silicone resins or epoxy resins. Binders may also contain solvents. Examples of particles include inorganic particles such as silica and alumina.
[0060] The thickness of the applied first filler F1 (a dimension along the thickness direction of the laminated substrate Ws) may be 10 μm or less. In one example, the diameter of the particles contained in the first filler F1 is 1 μm or less. As a result, the first filler F1 fills the area without gaps up to the vicinity of the bonding surface P.
[0061] The second filler F2 has chemical resistance so that it does not dissolve in the processing solution used in the post-processing step. Here, "does not dissolve" is not limited to the second filler F2 not dissolving at all, but also includes the fact that the second filler F2 does not substantially disintegrate. Furthermore, if the filler is removed from the laminated substrate Ws in a later step, the radial width x2 of the applied second filler F2 may be such that it does not hinder the removal of the second filler F2.
[0062] In one embodiment, the first filler F1 and / or the second filler F2 may not contain particles.
[0063] Figure 13 is a schematic diagram showing another embodiment of the coating apparatus. In this embodiment, the filler coating module 9 comprises only one coating apparatus 3. The configuration of the filler coating module 9, which is not specifically described, is the same as the configuration of the first coating apparatus 3A described with reference to Figure 6, so a redundant explanation is omitted.
[0064] The coating device 3 is a coating device for coating the first filler F1 and the second filler F2, as described in the embodiment with reference to Figure 8. The syringe 21 of the coating device 3 is filled with the first filler F1 and the second filler F2 in order from the filler discharge port 21a.
[0065] The coating device 3 is connected to a gas supply source via a gas supply line 25. When gas (e.g., dry air or nitrogen gas) is supplied from the gas supply source to the syringe 21, the piston 22 moves forward within the syringe 21. As the piston 22 moves forward, the first filler F1 in the syringe 21 is first discharged from the filler discharge port 21a. Once all of the first filler F1 has been discharged, the second filler F2 is then discharged from the filler discharge port 21a.
[0066] The coating device 3 may be configured to coat the first filler F1, the second filler F2, and the third filler F3, as described in the embodiment with reference to Figure 11. In this case, the syringe 21 of the coating device 3 is filled with the first filler F1, the second filler F2, and the third filler F3 in order from the filler discharge port 21a.
[0067] According to this embodiment, since only one coating device 3 is required, the device configuration is not complex, and since there is no need to replace the syringe 21, the number of man-hours can be reduced.
[0068] In yet another embodiment of the filler application module 9, the first filler F1, the second filler F2, and the third filler F3 are filled in separate syringes 21, and the filler to be applied may be changed by replacing the syringe 21 attached to the filler application module 9.
[0069] Figure 14 is a plan view showing another embodiment of the substrate processing apparatus 1. Figure 15 is a side view of the substrate processing apparatus 1 shown in Figure 14. The configuration of this embodiment, which is not specifically described, is the same as the configuration of the embodiment described with reference to Figures 4 and 5, so redundant descriptions are omitted. In this embodiment, the filler coating module 9 includes a substrate holding device 30 instead of the substrate holding part 2, the rotating shaft 7, and the rotating mechanism 8.
[0070] The substrate holding device 30 includes three or more (four in this embodiment) rollers 31 that can contact the peripheral edge of the laminated substrate Ws, a roller rotation mechanism (not shown) that rotates each roller 31 about its axis, and a roller movement mechanism (not shown) that moves each roller 31. In this embodiment, the substrate holding device 30 has four rollers 31, but the substrate holding device 30 may have three or five or more rollers.
[0071] The four rollers 31 are arranged around the reference center point O of the substrate holder 30. The rollers 31 are configured to contact the peripheral edge of the laminated substrate Ws and hold the laminated substrate Ws horizontally. That is, the laminated substrate Ws is held horizontally by the rollers 31 of the substrate holder 30. As shown in Figure 14, when the laminated substrate Ws is held horizontally by the rollers 31 of the substrate holder 30, the top and bottom surfaces of the laminated substrate Ws are each located within a virtual plane extending horizontally.
[0072] The roller rotation mechanism is connected to four rollers 31 and is configured to rotate the four rollers 31 in the same direction at the same speed. The configuration of the roller rotation mechanism is arbitrary as long as it can rotate three or more rollers 31 in the same direction at the same speed, and known rotation mechanisms can be used as roller rotation mechanisms. Examples of roller rotation mechanisms include combinations of motors, pulleys (and / or gears), and rotating belts.
[0073] The roller movement mechanism is connected to four rollers 31 and is configured to move each roller 31 toward the reference center point O of the substrate holding device 30 and toward the reference center point O. The roller movement mechanism allows the four rollers 31 to move between a holding position in which the peripheral edge of the laminated substrate Ws is held by the rollers 31 (see solid line in Figure 14) and a release position in which the laminated substrate Ws is released from the rollers 31 (see dotted line in Figure 14).
[0074] The configuration of the roller moving mechanism is arbitrary as long as the four rollers 31 can be moved between a holding position and a release position, and known moving mechanisms can be used as roller moving mechanisms. Examples of roller moving mechanisms include piston cylinder mechanisms and combinations of ball screws and motors (stepping motors).
[0075] The roller rotation mechanism and roller movement mechanism of the substrate holding device 30 are electrically connected to the operation control unit 10. The operation control unit 10 is configured to control the operation of the roller rotation mechanism and roller movement mechanism of the substrate holding device 30.
[0076] The laminated substrate Ws is transported by a transport device (not shown) to a position where its axis coincides with the reference center point O of the substrate holding device 30. At this time, the rollers 31 are in the released position. Next, the roller moving mechanism moves the four rollers 31 to the holding position, so that the peripheral edge of the laminated substrate Ws is held by the four rollers 31. This action holds the laminated substrate Ws horizontally on the four rollers 31. By rotating the four rollers 31 that have been moved to the holding position using the roller rotation mechanism, the laminated substrate Ws is rotated around its axis.
[0077] When the roller movement mechanism moves the four rollers 31 from the holding position to the release position, the four rollers 31 separate from the periphery of the laminated substrate Ws, and the laminated substrate Ws can be released from the four rollers 31. The released laminated substrate Ws is then transported by a transport device (not shown) for the next processing.
[0078] The application of the first filler F1 by the first coating device 3A, the application of the second filler F2 by the second coating device 3B, and the curing of the first filler F1 and the second filler F2 by the curing device 4 are performed while rotating the laminated substrate Ws, which is held horizontally by the substrate holding device 30.
[0079] In one embodiment, the roller rotation mechanism may be configured to rotate only some of the rollers 31. For example, the roller rotation mechanism may be connected to two of the four rollers 31 and configured to rotate the two rollers 31 in the same direction at the same speed. In this case, the other two rollers 31 are configured to rotate freely. When the two rollers 31 connected to the roller rotation mechanism rotate while the four rollers 31 are in a holding position, the other two rollers 31 rotate in response to the rollers 31 connected to the roller rotation mechanism via the laminated substrate Ws.
[0080] In one embodiment, the roller moving mechanism may be configured to move only some of the rollers 31. For example, the roller moving mechanism may be connected to two of the four rollers 31, and move these two rollers 31 between a holding position and a release position. In this case, the other two rollers 31 are fixed in the holding position beforehand. The laminated substrate Ws is transported by the transport device to a position where the peripheral edge of the laminated substrate Ws contacts the two fixed rollers 31. The laminated substrate Ws can be held horizontally by moving the two rollers 31 connected to the roller moving mechanism to the holding position. The laminated substrate Ws can be released by moving the two rollers 31 connected to the roller moving mechanism to the release position.
[0081] In the embodiment described above, the rollers 31 of the substrate holding unit 2 and the substrate holding device 30 are configured to hold the laminated substrate Ws horizontally. That is, the laminated substrate Ws is held horizontally by the rollers 31 of the substrate holding unit 2 or the substrate holding device 30. The application of the first filler F1 by the first coating device 3A and the application of the second filler F2 by the second coating device 3B (and the application of the third filler F3 by the third coating device 3C) are performed while rotating the laminated substrate Ws, which is held horizontally by the rollers 31 of the substrate holding unit 2 or the substrate holding device 30. However, the method of holding the laminated substrate Ws is not limited to the embodiment described above, as long as the first filler F1, the second filler F2 (and the third filler F3) can be applied to the gap G. For example, the filler coating module 9 may have a substrate holding unit or substrate holding device configured to hold the laminated substrate Ws vertically. When the laminated substrate Ws is held in a vertical position, the top and bottom surfaces of the laminated substrate Ws are each located within a virtual plane that extends vertically in a direction perpendicular to the horizontal direction.
[0082] Figure 16 is a side view showing yet another embodiment of the substrate processing apparatus 1. Figure 17 is a view from the direction indicated by arrow A in Figure 16. The configuration of this embodiment, which is not specifically described, is the same as the configuration of the embodiment described with reference to Figures 4 and 5, so the redundant explanation is omitted. Figure 16 is a view of the back side of the laminated substrate Ws. In this embodiment, the filler coating module 9 is equipped with a substrate holding part 35, a rotating shaft 36, and a rotating mechanism 38 instead of the substrate holding part 2, rotating shaft 7, and rotating mechanism 8.
[0083] The substrate holding portion 35 is configured to hold the back surface of the laminated substrate Ws by vacuum suction. As shown in Figure 17, the holding surface 35a of the substrate holding portion 35 that holds the back surface of the laminated substrate Ws is a surface perpendicular to the horizontal plane. The laminated substrate Ws is held so as to be perpendicular to the horizontal plane. That is, the laminated substrate Ws is held in a vertical position by the substrate holding portion 35.
[0084] The rotating shaft 36 is connected to the central part of the substrate holding section 35. The laminated substrate Ws is held in the substrate holding section 35 such that the center of the laminated substrate Ws coincides with the axis of the rotating shaft 36. The rotating mechanism 38 is equipped with a motor (not shown), and as shown in Figure 16, the rotating mechanism 38 is configured to rotate the substrate holding section 35 and the laminated substrate Ws together in the direction indicated by the arrow, about the central axis Cr of the laminated substrate Ws.
[0085] The filler application module 9 includes a first application device moving mechanism (not shown) for moving the first application device 3A and a second application device moving mechanism (not shown) for moving the second application device 3B. The first application device moving mechanism and the second application device moving mechanism are connected to the first application device 3A and the second application device 3B, respectively, and are configured to move the first application device 3A and the second application device 3B between an application position where filler is applied and a standby position where filler application is prohibited. For example, the standby positions of the first application device 3A and the second application device 3B are set further away from the laminated substrate Ws than the application positions so as not to interfere with the operation of other equipment such as the transport of the laminated substrate Ws.
[0086] In this embodiment, the coating positions of the first coating device 3A and the second coating device 3B are located above the laminated substrate Ws held by the substrate holding section 35, facing the gap G of the laminated substrate Ws. When the first coating device 3A or the second coating device 3B at the coating position dispenses the filler, the filler falls toward the gap G of the laminated substrate Ws, and as a result, the filler can be applied to the gap G of the laminated substrate Ws. In this embodiment, the standby position is set to a position further radially outward from the laminated substrate Ws than the coating position. Figures 16 and 17 show the state in which the first coating device 3A is positioned at the coating position.
[0087] The substrate holding unit 35, the rotating mechanism 38, the first coating device moving mechanism, and the second coating device moving mechanism are electrically connected to the operation control unit 10, and the operation of the substrate holding unit 35, the rotating mechanism 38, the first coating device moving mechanism, and the second coating device moving mechanism is controlled by the operation control unit 10.
[0088] When the first coating device 3A applies the first filler F1, the first coating device moving mechanism moves the first coating device 3A to the coating position. While the first coating device 3A is applying the first filler F1, the second coating device 3B is positioned in standby. The first coating device moving mechanism may be configured to adjust the distance between the first coating device 3A and the laminated substrate Ws. For example, the operation control unit 10 may cause the first coating device moving mechanism to adjust the distance between the first coating device 3A and the laminated substrate Ws according to the physical properties of the first filler F1, such as its viscosity, so that the first filler F1 is properly injected into the gap G in the laminated substrate Ws.
[0089] After the first filler F1 is applied by the first coating device 3A, when the second filler F2 is applied by the second coating device 3B, the first coating device moving mechanism moves the first coating device 3A to the standby position, and the second coating device moving mechanism moves the second coating device 3B to the application position. The second coating device moving mechanism may be configured to adjust the distance between the second coating device 3B and the laminated substrate Ws. For example, the operation control unit 10 may have the second coating device moving mechanism adjust the distance between the second coating device 3B and the laminated substrate Ws according to the physical properties of the second filler F2, such as its viscosity, so that the second filler F2 is properly injected into the gap G in the laminated substrate Ws.
[0090] The application of the first filler F1 by the first coating device 3A, the application of the second filler F2 by the second coating device 3B, and the curing of the first filler F1 and the second filler F2 by the curing device 4 are performed while rotating the laminated substrate Ws, which is held vertically by the substrate holding unit 35.
[0091] In one embodiment, the filler coating module 9 may not include a first coating device moving mechanism and a second coating device moving mechanism, and the first coating device 3A and the second coating device 3B may be positioned adjacent to and above the laminated substrate Ws held by the substrate holding section 35. In this case, the distance between the first coating device 3A and the laminated substrate Ws, and the distance between the second coating device 3B and the laminated substrate Ws are predetermined so that the first filler F1 and the second filler F2 are appropriately injected into the gap G of the laminated substrate Ws.
[0092] As shown in Figure 16, the curing device 4 is located radially outward of the laminated substrate Ws held by the substrate holding section 35. The curing device 4 is positioned downstream of the coating positions of the first coating device 3A and the second coating device 3B in the rotational direction of the laminated substrate Ws, and is configured to cure the first filler F1 and the second filler F2 applied to the laminated substrate Ws by the first coating device 3A and the second coating device 3B.
[0093] Figure 18 is a side view showing yet another embodiment of the substrate processing apparatus 1. Figure 19 is a view from the direction indicated by arrow B in Figure 18. The configuration of this embodiment, which is not specifically described, is the same as the configuration of the embodiment described with reference to Figures 16 and 17, so redundant descriptions are omitted. In this embodiment, the filler coating module 9 includes a substrate holding device 40 instead of the substrate holding section 35, the rotating shaft 36, and the rotating mechanism 38.
[0094] The substrate holding device 40 includes three or more (four in this embodiment) rollers 41 that can contact the peripheral edge of the laminated substrate Ws, a roller rotation mechanism (not shown) that rotates each roller 41 about its axis, and a roller movement mechanism (not shown) that moves each roller 41. In this embodiment, the substrate holding device 40 has four rollers 41, but the substrate holding device 40 may have three or five or more rollers.
[0095] The four rollers 41 are arranged around the reference center point O of the substrate holder 40. The rollers 41 are configured to contact the peripheral edge of the laminated substrate Ws and hold the laminated substrate Ws vertically. That is, the laminated substrate Ws is held in a vertical position by the rollers 41 of the substrate holder 40. As shown in Figure 18, when the laminated substrate Ws is held in a vertical position by the rollers 41 of the substrate holder 40, the top and bottom surfaces of the laminated substrate Ws are each located in a virtual plane extending vertically.
[0096] The roller rotation mechanism is connected to four rollers 41 and is configured to rotate the four rollers 41 in the same direction at the same speed. The configuration of the roller rotation mechanism is arbitrary as long as it can rotate three or more rollers 41 in the same direction at the same speed, and known rotation mechanisms can be used as roller rotation mechanisms. Examples of roller rotation mechanisms include combinations of motors, pulleys (and / or gears), and rotating belts.
[0097] The roller movement mechanism is connected to four rollers 41 and is configured to move each roller 41 toward the reference center point O of the substrate holding device 40 and toward the reference center point O. The roller movement mechanism allows the four rollers 41 to move between a holding position in which the peripheral edge of the laminated substrate Ws is held by the rollers 41 (see solid line in Figure 18) and a release position in which the laminated substrate Ws is released from the rollers 41 (see dotted line in Figure 18). The configuration of the roller movement mechanism is arbitrary as long as the four rollers 41 can be moved between the holding position and the release position, and known movement mechanisms can be used as the roller movement mechanism. Examples of roller movement mechanisms include a piston cylinder mechanism and a combination of a ball screw and a motor (stepping motor).
[0098] The roller rotation mechanism and roller movement mechanism of the substrate holding device 40 are electrically connected to the operation control unit 10, and the operation of the roller rotation mechanism and roller movement mechanism of the substrate holding device 40 is controlled by the operation control unit 10.
[0099] The laminated substrate Ws is transported by a transport device (not shown) to a position where its axis coincides with the reference center point O of the substrate holding device 40. At this time, the rollers 41 are in the released position. Next, the roller moving mechanism moves the four rollers 41 to the holding position, so that the peripheral edge of the laminated substrate Ws is held by the four rollers 41. This action holds the laminated substrate Ws vertically on the four rollers 41. By rotating the four rollers 41 that have been moved to the holding position using the roller rotation mechanism, the laminated substrate Ws is rotated around its axis.
[0100] When the roller movement mechanism moves the four rollers 41 from the holding position to the release position, the four rollers 41 separate from the periphery of the laminated substrate Ws, and the laminated substrate Ws can be released from the four rollers 41. The released laminated substrate Ws is then transported by a transport device (not shown) for the next processing.
[0101] The application of the first filler F1 by the first coating device 3A, the application of the second filler F2 by the second coating device 3B, and the curing of the first filler F1 and the second filler F2 by the curing device 4 are performed while rotating the laminated substrate Ws, which is held vertically by the substrate holding device 40.
[0102] In one embodiment, the roller rotation mechanism may be configured to rotate only some of the rollers 41. For example, the roller rotation mechanism may be connected to two of the four rollers 41, causing the two rollers to rotate in the same direction at the same speed. In this case, the other two rollers 41 are configured to rotate freely. When the two rollers 41 connected to the roller rotation mechanism rotate while the four rollers 41 are in a holding position, the other two rollers 41 rotate in response to the two rollers 41 connected to the roller rotation mechanism via the laminated substrate Ws.
[0103] In one embodiment, the roller moving mechanism may be configured to move only some of the rollers 41. For example, the roller moving mechanism may be connected to two of the four rollers 41, and move these two rollers 41 between a holding position and a release position. In this case, the other two rollers 41 are fixed in the holding position beforehand. The laminated substrate Ws is transported by the transport device to a position where the peripheral edge of the laminated substrate Ws contacts the two fixed rollers 41. The laminated substrate Ws can be held vertically by moving the two rollers 41 connected to the roller moving mechanism to the holding position. The laminated substrate Ws can be released by moving the two rollers 41 connected to the roller moving mechanism to the release position.
[0104] Each embodiment described with reference to Figures 14 to 19 may also be applied to each embodiment described with reference to Figures 9 and 13. For example, the embodiment described with reference to Figures 16 and 17 may be applied to the embodiment described with reference to Figure 9, and the application of the first filler F1 by the first coating device 3A, the application of the second filler F2 by the second coating device 3B, the application of the third filler F3 by the third filling device 3C, and the curing of the first filler F1, second filler F2, and third filler F3 by the curing device 4 may be performed while rotating the laminated substrate Ws held vertically by the substrate holding unit 35.
[0105] The embodiments described above are intended to enable persons with ordinary skill in the art to implement the present invention. Various modifications of the above embodiments can be made naturally by those skilled in the art, and the technical idea of the present invention can be applied to other embodiments as well. Therefore, the present invention is not limited to the embodiments described, but is to be interpreted in the broadest sense according to the technical idea defined by the claims. [Explanation of Symbols]
[0106] 1. Substrate processing apparatus 2 Board holding part 3. Coating device 3A First coating apparatus 3B 2nd coating device 3C Third coating apparatus 4 Curing equipment 7 Rotation axis 8 rotation mechanism 9. Filler application module 10 Operation Control Unit 10a storage device 10b Processing unit 21 Syringe 21a Filling material discharge port 22 pistons 25 Gas supply line 26 Pressure Regulator 27. Shut-off valves 30 Substrate holding device 31 Rollers 35 Board holding part 36 Rotation axis 38 Rotation mechanism 40 Substrate holding device 41 Rollers
Claims
1. A substrate processing method comprising applying a filler to a laminated substrate in which a first substrate and a second substrate are joined, A step of applying a first filler to the gap between the edge portion of the first substrate and the edge portion of the second substrate, The process includes applying a second filler to the gap after applying the first filler, A substrate processing method wherein the first filler has a lower viscosity than the second filler.
2. The process further includes a step of curing the applied first filler after applying the first filler, The substrate processing method according to claim 1, wherein the step of applying the second filler is performed after the first filler has hardened.
3. The substrate processing method according to claim 1 or 2, wherein the first filler contains particles, and the diameter of the particles is 1 μm or less.
4. The substrate processing method according to claim 3, wherein the second filler contains particles, and the diameter of the particles contained in the second filler is greater than the diameter of the particles contained in the first filler.
5. The substrate processing method according to claim 1 or 2, wherein the first filler does not contain particles.
6. The substrate processing method according to claim 1, wherein the viscosity of the first filler is 5 Pa·s or less.
7. The substrate processing method according to claim 1, wherein the radial width of the applied first filler is smaller than the radial width of the applied second filler.
8. The process involves applying the second filler, followed by applying the third filler to the gap, The process further includes a post-processing step of processing the laminated substrate after applying the third filler, The substrate processing method according to claim 1 or 2, wherein the third filler has chemical resistance so as not to dissolve in the processing liquid used in the post-processing step.
9. The process further includes applying a third filler to the gap after applying the second filler, The substrate processing method according to claim 1 or 2, wherein the third filler has a higher viscosity than the second filler.
10. The process further includes a step of curing the applied second filler after applying the second filler, The substrate processing method according to claim 8, wherein the step of applying the third filler is performed after the second filler has hardened.
11. The substrate processing method according to claim 8, wherein the radial width of the applied second filler is greater than the radial width of the applied third filler.
12. A substrate processing method comprising applying a filler to a laminated substrate in which a first substrate and a second substrate are joined, A step of applying a first filler to the gap between the edge portion of the first substrate and the edge portion of the second substrate, The process involves applying the first filler, followed by applying the second filler to the gap, The process includes a post-processing step of processing the laminated substrate after applying the second filler, A substrate processing method wherein the second filler has chemical resistance so as not to dissolve in the processing liquid used in the post-processing step.
13. The process further includes a step of curing the applied first filler after applying the first filler, The substrate processing method according to claim 12, wherein the step of applying the second filler is performed after the first filler has hardened.
14. The substrate processing method according to claim 12 or 13, wherein the first filler contains particles, and the diameter of the particles is 1 μm or less.
15. The substrate processing method according to claim 12 or 13, wherein the first filler does not contain particles.
16. The substrate processing method according to claim 1 or 12, wherein the steps of applying the first filler and applying the second filler are performed while rotating the laminated substrate which is held in a vertical position.
17. The substrate processing method according to claim 8, wherein the step of applying the third filler is performed while rotating the laminated substrate which is held in a vertical position.