electrostatic chuck

Abstract

To provide an electrostatic chuck capable of improving uniformity of temperature distribution in a plane of an object to be processed by reducing complexity of temperature control.SOLUTION: An electrostatic chuck comprises a ceramic dielectric substrate, a base plate, and a heater part. The heater part comprises a first heater element, a bypass layer, and first and second power feeding terminals. The first heater element comprises a plurality of zones including a first zone. The first zone comprises a first heater line and first and second power feeding parts. The first power feeding part is provided in a position in which it does not overlap the first power feeding terminal. The second power feeding part is provided in a position in which it does not overlap the second power feeding terminal. The first heater line comprises a first extension part provided with a first protrusion and a second extension part provided with a second protrusion. The first zone also includes a first facing region arranged so that the first protrusion and the second protrusion adjacently face each other. The first facing region is provided in a position in which it overlaps at least the first power feeding terminal or the second power feeding terminal.SELECTED DRAWING: Figure 15

Description

Technical Field

[0001] Aspects of the present invention generally relate to electrostatic chucks.

Background Art

[0002] In a plasma processing chamber for performing etching, CVD (Chemical Vapor Deposition), sputtering, ion implantation, ashing, etc., an electrostatic chuck is used as a means for adsorbing and holding an object to be processed such as a semiconductor wafer or a glass substrate. The electrostatic chuck applies electrostatic adsorption power to the built-in electrode and adsorbs a substrate such as a silicon wafer by electrostatic force.

[0003] In recent years, in IC chips including semiconductor elements such as transistors, miniaturization and improvement in processing speed have been demanded. Along with this, when forming semiconductor elements on a wafer, it has been demanded to improve the processing accuracy such as etching. The processing accuracy of etching indicates whether a pattern having a designed width and depth can be formed by processing the wafer. By improving the processing accuracy such as etching, semiconductor elements can be miniaturized and the integration density can be increased. That is, by improving the processing accuracy, miniaturization and high speed of the chip become possible.

[0004] It is known that the processing accuracy such as etching depends on the temperature of the wafer during processing. Therefore, in a substrate processing apparatus having an electrostatic chuck, in order to equalize the etching rate, it has been demanded to control the temperature distribution within the wafer surface during processing. As a method for controlling the temperature distribution within the wafer surface, a method using an electrostatic chuck incorporating a heater (heating element) is known.

[0005] In particular, with the miniaturization of semiconductor devices in recent years, there is a demand for faster heating and more precise control of the in-plane temperature distribution. As a means of achieving this, a two-layer structure of heaters consisting of a main heater and a sub-heater is known. Heater patterns when the heater is composed of multiple zones are also known. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Japanese Patent Publication No. 2004-111107 [Overview of the Initiative] [Problems that the invention aims to solve]

[0007] However, while creating multiple zones in the heater allows for more precise temperature control, it also creates design constraints on the shape of the heater pattern and increases the number of pads and terminals for power supply. This results in a new problem: numerous cool spots with relatively low temperatures and hot spots with relatively high temperatures within the heater surface, leading to a decrease in the uniformity of the temperature distribution across the wafer surface.

[0008] Therefore, one approach is to improve the uniformity of the temperature distribution across the wafer surface by dispersing cool spots and hot spots within the heater surface. However, dispersing cool spots and hot spots within the heater surface may complicate temperature control. The challenge lies in improving the uniformity of the temperature distribution across the wafer surface while minimizing the complexity of temperature control.

[0009] This invention is based on the recognition of the above problems and aims to provide an electrostatic chuck that can improve the uniformity of the in-plane temperature distribution of an object to be processed while suppressing the complexity of temperature control. [Means for solving the problem]

[0010] The first invention comprises a ceramic dielectric substrate having a first main surface on which an object to be processed is placed and a second main surface opposite to the first main surface; a base plate supporting the ceramic dielectric substrate having an upper surface on the side of the ceramic dielectric substrate, a lower surface opposite to the upper surface, and a refrigerant flow path for flowing a cooling medium; and a heater section for heating the ceramic dielectric substrate, wherein the heater section comprises a first heater element, a bypass layer which is a power supply path to the first heater element, and electrically connected to the bypass layer. The first heater element has a first power supply terminal and a second power supply terminal, and the first heater element is provided between the first main surface and the upper surface, and the first heater element has a plurality of zones, the plurality of zones of the first heater element has a first zone, the first zone has a first heater line that generates heat when current flows through it, and a first power supply unit and a second power supply unit that supply power to the first heater line, and the first power supply unit is provided in a position that does not overlap with the first power supply terminal in the Z direction perpendicular to the first main surface. The first heater line is electrically connected to the first power supply terminal via the bypass layer, and the second power supply unit is provided in a position that does not overlap with the second power supply terminal in the Z direction, and is electrically connected to the second power supply terminal via the bypass layer, and the first heater line has a plurality of extending portions that extend along the first direction and are aligned in a second direction perpendicular to the first direction, and a plurality of protruding portions provided in the plurality of extending portions that project in the second direction, and the plurality of extending portions have a first extending portion, a second extending portion, and The electrostatic chuck comprises a plurality of protrusions, each having a first protrusion provided on the first extension and a second protrusion provided on the second extension, the first protrusion projecting toward the second protrusion, and the first zone having a first opposing region where the first protrusion and the second protrusion are arranged adjacent to each other and facing each other, and the first opposing region being provided in a position that overlaps with at least one of the first power supply terminal and the second power supply terminal in the Z direction.

[0011] To improve the uniformity of the temperature distribution within the surface of the object being processed, increasing the number of zones in the heater unit increases the number of power supply units and other components needed to supply power to each zone. An increase in the number of power supply units and other components also increases the number of protrusions that must be provided on the heater line to avoid these components. Normally, current flows along the shortest path, so when current flows through a protrusion on the heater line, it flows more easily inside the protrusion than outside. As a result, the amount of heat generated outside the protrusion tends to be less than inside. In other words, the protrusion tends to become a cool spot. To improve the uniformity of the temperature distribution within the surface of the heater unit, one could consider dispersing the protrusions within the surface of the heater unit. However, dispersing the protrusions within the surface of the heater unit may complicate temperature control due to the dispersion of cool spots. On the other hand, concentrating the protrusions within the surface of the heater unit may result in lower temperatures in the cool spots, potentially reducing the uniformity of the temperature distribution within the surface of the heater unit. Furthermore, even if a refrigerant flow path for circulating a cooling medium is provided inside the base plate, the refrigerant flow path is not provided at the location where the power supply terminals for supplying power to the bypass layer are located. As a result, the location where the power supply terminals are located is less cooled than other locations and tends to become a hot spot. In contrast, with this electrostatic chuck, the first opposing region of the first zone, where the first and second protrusions are arranged adjacent to each other (i.e., the protrusions are concentrated), is located at a position that overlaps with at least one of the first and second power supply terminals. This suppresses the dispersion of cool spots, and by overlapping the first opposing region of the first zone, which is a cool spot, with the first and second power supply terminals, which are hot spots, a significant drop in temperature at the cool spots can be suppressed. In other words, temperature unevenness can be canceled out. Therefore, it is possible to improve the uniformity of the in-plane temperature distribution of the object being processed while suppressing the complexity of temperature control.

[0012] The second invention is an electrostatic chuck provided in the first invention, wherein the first zone has a central region located in the center of the first zone when viewed along the Z direction and an outer peripheral region located outside the central region, and the first opposing region is an electrostatic chuck provided in the central region.

[0013] This electrostatic chuck places the first opposing region of the first zone in the central region of the first zone, where the temperature tends to be higher than the outer region. By overlapping the first opposing region of the first zone, which is a cool spot, with the central region of the first zone, which is a hot spot, a significant drop in temperature in the cool spot can be suppressed. In other words, temperature unevenness can be canceled out. Therefore, it is possible to improve the uniformity of the in-plane temperature distribution of the object being processed while suppressing the complexity of temperature control.

[0014] The third invention is an electrostatic chuck in which, in the first invention, the plurality of zones of the first heater element are divided radially, and the first direction is the circumferential direction.

[0015] This electrostatic chuck allows for efficient control of the in-plane temperature of the object being processed.

[0016] The fourth invention is an electrostatic chuck in which, in the first invention, the plurality of zones of the first heater element are divided radially, and the first direction is radial.

[0017] This electrostatic chuck allows for efficient control of the in-plane temperature of the object being processed.

[0018] The fifth invention is an electrostatic chuck in which, in any one of the first to fourth inventions, the plurality of extending portions further have a third extending portion located between the first extending portion and the second extending portion in the second direction, and the third extending portion is provided in a position that does not overlap with the first protrusion and the second protrusion in the second direction.

[0019] The first and second protrusions are positioned adjacent to each other and facing each other. Therefore, the shortest distance between the first and second extensions may be greater than the shortest distance when neither the first nor the second protrusions are formed. With this electrostatic chuck, the third extending portion is positioned between the first and second extending portions, and does not overlap with the first and second protrusions, so the range of the first opposing region can be made relatively small. Therefore, the uniformity of the in-plane temperature distribution of the object being processed can be improved.

[0020] The sixth invention is an electrostatic chuck in which, in any one of the first to fourth inventions, the plurality of protrusions further have a third protrusion provided on the first extension and protruding toward the second protrusion, and the third protrusion is arranged adjacent to and facing the second protrusion.

[0021] This electrostatic chuck allows for the placement of a region (second opposing region) where the second and third protrusions are concentrated near the first opposing region, thereby relatively reducing the number of cool spots across the entire surface. Consequently, it is possible to improve the uniformity of the temperature distribution across the surface of the object being processed while suppressing the complexity of temperature control.

[0022] The seventh invention comprises a ceramic dielectric substrate having a first main surface on which an object to be processed is placed and a second main surface opposite to the first main surface; a base plate supporting the ceramic dielectric substrate having an upper surface on the ceramic dielectric substrate side, a lower surface opposite to the upper surface, and a refrigerant flow path for flowing a cooling medium; and a heater section for heating the ceramic dielectric substrate, wherein the heater section comprises a first heater element, a second heater element, a bypass layer which is a power supply path to the first heater element and the second heater element, and the bypass layer and electricity The heater element has a first power supply terminal, a second power supply terminal, a third power supply terminal, and a fourth power supply terminal which are electrically connected, the first heater element is provided between the first main surface and the upper surface, the second heater element is provided between the first main surface and the first heater element or between the first heater element and the upper surface, the first heater element has a plurality of zones, the plurality of zones of the first heater element has a first zone, the first zone has a first heater line which generates heat when current flows through it, and power supply to the first heater line The heater element has a first power supply section and a second power supply section, the first power supply section is located in a position that does not overlap with the first power supply terminal in the Z direction perpendicular to the first main surface and is electrically connected to the first power supply terminal via the bypass layer, the second power supply section is located in a position that does not overlap with the second power supply terminal in the Z direction and is electrically connected to the second power supply terminal via the bypass layer, the second heater element has a plurality of zones, the plurality of zones of the second heater element has a second zone, the second zone is electrically It has a second heater line that generates heat when a flow occurs, and a third power supply unit and a fourth power supply unit that supply power to the second heater line, wherein the third power supply unit is located in a position that does not overlap with the third power supply terminal in the Z direction and is electrically connected to the third power supply terminal via the bypass layer, and the fourth power supply unit is located in a position that does not overlap with the fourth power supply terminal in the Z direction and is electrically connected to the fourth power supply terminal via the bypass layer, and at least one of the third power supply terminal and the fourth power supply terminal is located in the Z direction,An electrostatic chuck provided at a position overlapping a virtual line segment connecting the center of the first power supply unit and the center of the second power supply unit.

[0023] In order to improve the uniformity of the temperature distribution within the plane of the object to be processed, when increasing the number of zones in the heater section, the number of power supply units and the like for supplying power to each zone increases. The power supply unit tends to become a cool spot. On the other hand, even when a refrigerant flow path for flowing a cooling medium is provided inside the base plate, no refrigerant flow path is provided at the position where the power supply terminal for supplying power to the bypass layer is provided. Therefore, the position where the power supply terminal is provided is less likely to be cooled compared to other positions and tends to become a hot spot. In contrast, according to this electrostatic chuck, at least one of the third power supply terminal and the fourth power supply terminal for supplying power to the second heater element via the bypass layer is provided at a position overlapping a virtual line segment connecting the center of the first power supply unit for supplying power to the first heater line and the center of the second power supply unit. Thereby, by providing the third power supply terminal and the fourth power supply terminal, which are hot spots, between the first power supply unit and the second power supply unit, which are cool spots, unevenness in temperature can be offset. Therefore, it is possible to improve the uniformity of the temperature distribution within the plane of the object to be processed while suppressing the complication of temperature control.

[0024] An eighth invention is an electrostatic chuck, in the seventh invention, at least one of the center of the third power supply terminal and the center of the fourth power supply terminal is provided at a position overlapping the virtual line segment.

[0025] According to this electrostatic chuck, the third power supply terminal and the fourth power supply terminal are provided at a position where at least one of the center of the third power supply terminal and the center of the fourth power supply terminal overlaps the virtual line segment. Thereby, the uniformity of the temperature distribution within the plane of the object to be processed can be improved.

[0026] The ninth invention is the seventh or eighth invention, wherein the first zone has a central region located at the center of the first zone and an outer peripheral region located outside the central region when viewed along the Z direction, and at least one of the first power supply part and the second power supply part is an electrostatic chuck provided in the central region.

[0027] According to this electrostatic chuck, at least one of the first power supply part and the second power supply part is provided in the central region of the first zone where the temperature is more likely to be higher than that in the outer peripheral region in the first zone. Thus, by overlapping the first power supply part or the second power supply part, which is a cool spot, with the central region of the first zone, which is a hot spot, a significant decrease in temperature at the cool spot can be suppressed. That is, the unevenness of temperature can be offset. Therefore, the uniformity of the temperature distribution within the plane of the object to be processed can be improved.

[0028] The tenth invention is the seventh or eighth invention, wherein the first zone includes the outer peripheral edge of the first heater element, and the first zone has an inner peripheral part located radially inside the radial center line that bisects the first zone in the radial direction and an outer peripheral part located radially outside the radial center line and including the outer peripheral edge, and at least one of the first power supply part and the second power supply part is an electrostatic chuck provided in the inner peripheral part.

[0029] According to this electrostatic chuck, when the first zone includes the outer peripheral edge of the first heater element (that is, in the first zone located at the outermost peripheral part of the first heater element), at least one of the first power supply part and the second power supply part is provided in the inner peripheral part of the first zone where the temperature is more likely to be higher than that in the outer peripheral part. Thus, by providing the first power supply part or the second power supply part, which is a cool spot, in the inner peripheral part of the first zone, which is a hot spot, a significant decrease in temperature at the cool spot can be suppressed. That is, the unevenness of temperature can be offset. Therefore, the uniformity of the temperature distribution within the plane of the object to be processed can be improved.

Advantages of the Invention

[0030] According to an aspect of the present invention, an electrostatic chuck is provided that can improve the uniformity of the in-plane temperature distribution of an object to be processed while suppressing the complexity of temperature control. [Brief explanation of the drawing]

[0031] [Figure 1] This is a schematic perspective view of an electrostatic chuck according to an embodiment. [Figure 2] Figures 2(a) and 2(b) are schematic cross-sectional views showing a part of the electrostatic chuck according to the embodiment. [Figure 3] This is an exploded perspective view schematically showing the heater section according to the embodiment. [Figure 4] This is an exploded cross-sectional view schematically showing the heater section according to the embodiment. [Figure 5] This is a schematic plan view showing the main zone of the main heater element according to the embodiment. [Figure 6] This is a schematic plan view showing a subzone of a subheater element according to the embodiment. [Figure 7] This is a schematic plan view showing the positional relationship between the main zone of the main heater element and the subzone of the subheater element according to the embodiment. [Figure 8] This is a schematic plan view showing a part of the first zone of the heater section according to the embodiment. [Figure 9] This is a schematic plan view showing a part of the first zone of the heater section according to a modified embodiment. [Figure 10] This is a schematic plan view showing a part of the first zone of the heater section according to a modified embodiment. [Figure 11] This is a schematic plan view showing a part of the first zone of the heater section according to a modified embodiment. [Figure 12] This is a schematic plan view showing a part of the first zone of the heater section according to a modified embodiment. [Figure 13] This is a schematic plan view showing the positional relationship between a part of the first zone and the second zone of the heater section according to the first embodiment. [Figure 14] This is a schematic plan view showing the positional relationship between a part of the first zone and the second zone of the heater section according to the first embodiment. [Figure 15] This is a schematic plan view showing the first zone of the heater section according to the second embodiment. [Figure 16] This is a schematic plan view showing the first zone of the heater section according to the third embodiment. [Figure 17] This is a schematic plan view showing the first zone of the heater section according to the fourth embodiment. [Figure 18] This is a schematic plan view showing the first zone of the heater section according to the fifth embodiment. [Modes for carrying out the invention]

[0032] Embodiments of the present invention will be described below with reference to the drawings. In each drawing, similar components are denoted by the same reference numerals, and detailed descriptions are omitted as appropriate.

[0033] Figure 1 is a schematic perspective view of an electrostatic chuck according to an embodiment. Figures 2(a) and 2(b) are schematic cross-sectional views showing a part of the electrostatic chuck according to the embodiment. Figure 1 shows a cross-sectional view of a portion of the electrostatic chuck for illustrative purposes. Figure 2(a) is a cross-sectional view taken along the line A1-A2 shown in Figure 1. Figure 2(b) is an enlarged view of region B1 shown in Figure 2(a). Note that the object to be processed W is omitted in Figure 2(b).

[0034] As shown in Figures 1, 2(a), and 2(b), the electrostatic chuck 10 according to this embodiment comprises a ceramic dielectric substrate 100, a heater section 200, and a base plate 300.

[0035] The ceramic dielectric substrate 100 is, for example, a flat substrate made of a polycrystalline ceramic sintered body, and has a first main surface 101 on which a workpiece W such as a semiconductor wafer is placed, and a second main surface 102 on the opposite side of the first main surface 101.

[0036] In this specification, the direction perpendicular to the first main surface 101 is defined as the Z direction. In other words, the Z direction is the direction connecting the first main surface 101 and the second main surface 102. In other words, the Z direction is the direction from the base plate 300 toward the ceramic dielectric substrate 100. Furthermore, one of the directions perpendicular to the Z direction is defined as the X direction, and the direction perpendicular to both the Z direction and the X direction is defined as the Y direction. In this specification, "in-plane" refers to, for example, the XY plane. Also, in this specification, "plan view" refers to the view along the Z direction.

[0037] Examples of crystalline materials included in the ceramic dielectric substrate 100 include Al2O3, AlN, SiC, Y2O3, and YAG. By using such materials, the infrared transmittance, thermal conductivity, dielectric strength, and plasma durability of the ceramic dielectric substrate 100 can be improved.

[0038] An electrode layer 111 is provided inside the ceramic dielectric substrate 100. The electrode layer 111 is interposed between the first main surface 101 and the second main surface 102. In other words, the electrode layer 111 is formed to be inserted into the ceramic dielectric substrate 100. The electrode layer 111 is integrally sintered into the ceramic dielectric substrate 100.

[0039] Furthermore, the electrode layer 111 is not limited to being interposed between the first main surface 101 and the second main surface 102, but may also be attached to the second main surface 102.

[0040] The electrostatic chuck 10 generates an electric charge on the first main surface 101 side of the electrode layer 111 by applying an adsorption and holding voltage to the electrode layer 111, and adsorbs and holds the object to be processed W by electrostatic force.

[0041] The electrode layer 111 is provided along the first main surface 101 and the second main surface 102. The electrode layer 111 is an adsorption electrode for adsorbing and holding the object to be processed W. The electrode layer 111 may be unipolar or bipolar. Furthermore, the electrode layer 111 may be tripolar or other multipolar. The number and arrangement of the electrode layers 111 are selected as appropriate.

[0042] The base plate 300 is provided on the second main surface 102 side of the ceramic dielectric substrate 100 and supports the ceramic dielectric substrate 100. The base plate 300 has an upper surface 302 on the side facing the ceramic dielectric substrate 100 and a lower surface 303 on the opposite side of the upper surface 302. The base plate 300 is provided with a refrigerant flow path 301 for circulating a cooling medium. In other words, the refrigerant flow path 301 is provided inside the base plate 300. Examples of materials for the base plate 300 include aluminum, aluminum alloys, titanium, and titanium alloys.

[0043] The base plate 300 plays a role in regulating the temperature of the ceramic dielectric substrate 100. For example, when cooling the ceramic dielectric substrate 100, a cooling medium is introduced into the refrigerant channel 301, passed through the refrigerant channel 301, and then discharged from the refrigerant channel 301. This allows the cooling medium to absorb heat from the base plate 300, thereby cooling the ceramic dielectric substrate 100 mounted on it.

[0044] Furthermore, protrusions 113 are provided on the first main surface 101 side of the ceramic dielectric substrate 100 as needed. Grooves 115 are provided between adjacent protrusions 113. The grooves 115 are in communication with each other. A space is formed between the back surface of the object to be processed W mounted on the electrostatic chuck 10 and the grooves 115.

[0045] An introduction channel 321 is connected to the groove 115, penetrating the base plate 300 and the ceramic dielectric substrate 100. When a transfer gas such as helium (He) is introduced through the introduction channel 321 while the object to be processed W is adsorbed and held, the transfer gas flows into the space between the object to be processed W and the groove 115, allowing the object to be directly heated or cooled by the transfer gas.

[0046] The heater unit 200 heats the ceramic dielectric substrate 100. By heating the ceramic dielectric substrate 100, the heater unit 200 heats the object to be processed W through the ceramic dielectric substrate 100. In this example, the heater unit 200 is provided between the first main surface 101 and the second main surface 102. That is, the heater unit 200 is formed to be inserted into the ceramic dielectric substrate 100. In other words, the heater unit 200 is built into the ceramic dielectric substrate 100.

[0047] The heater section 200 may be provided separately from the ceramic dielectric substrate 100. In this case, the heater section 200 is provided, for example, between the ceramic dielectric substrate 100 and the base plate 300 via an adhesive layer. Examples of materials for the adhesive layer include heat-resistant resins such as silicone, which have relatively high thermal conductivity.

[0048] Figure 3 is an exploded perspective view schematically showing the heater section according to the embodiment. Figure 4 is an exploded cross-sectional view schematically showing the heater section according to the embodiment. As shown in Figures 3 and 4, in this example, the heater section 200 includes a first support plate 210, a first insulating layer 220, a sub-heater element 231, a second insulating layer 240, a main heater element 232, a third insulating layer 245, a bypass layer 250, a fourth insulating layer 260, a second support plate 270, and a power supply terminal 280.

[0049] The first support plate 210 is provided on top of the subheater element 231, the main heater element 232, the bypass layer 250, etc. The second support plate 270 is provided below the subheater element 231, the main heater element 232, the bypass layer 250, etc. The surface 211 (upper surface) of the first support plate 210 forms the upper surface of the heater section 200. The surface 271 (lower surface) of the second support plate 270 forms the lower surface of the heater section 200. When the heater section 200 is embedded in the ceramic dielectric substrate 100, the first support plate 210 and the second support plate 270 may be omitted.

[0050] The first support plate 210 and the second support plate 270 are support plates that support the subheater element 231 and the main heater element 232, etc. In this example, the first support plate 210 and the second support plate 270 sandwich and support the first insulating layer 220, the subheater element 231, the second insulating layer 240, the main heater element 232, the third insulating layer 245, the bypass layer 250, and the fourth insulating layer 260.

[0051] The first insulating layer 220 is provided between the first support plate 210 and the second support plate 270. The subheater element 231 is provided between the first insulating layer 220 and the second support plate 270. In this way, the subheater element 231 is provided overlapping the first support plate 210. In other words, the first insulating layer 220 is provided between the first support plate 210 and the subheater element 231. When the heater section 200 is embedded in the ceramic dielectric substrate 100, the ceramic dielectric substrate 100 also serves as the first insulating layer 220.

[0052] The second insulating layer 240 is provided between the subheater element 231 and the second support plate 270. The main heater element 232 is provided between the second insulating layer 240 and the second support plate 270. Thus, the main heater element 232 is provided on a different layer from the layer on which the subheater element 231 is provided. At least a portion of the main heater element 232 overlaps with the subheater element 231 in the Z direction. The third insulating layer 245 is provided between the main heater element 232 and the second support plate 270. The bypass layer 250 is provided between the third insulating layer 245 and the second support plate 270. The fourth insulating layer 260 is provided between the bypass layer 250 and the second support plate 270.

[0053] In other words, the subheater element 231 is provided between the first insulating layer 220 and the second insulating layer 240. In other words, the main heater element 232 is provided between the second insulating layer 240 and the third insulating layer 245. In other words, the bypass layer 250 is provided between the third insulating layer 245 and the fourth insulating layer 260.

[0054] The subheater element 231 contacts, for example, the first insulating layer 220 and the second insulating layer 240, respectively. The main heater element 232 contacts, for example, the second insulating layer 240 and the third insulating layer 245, respectively. The bypass layer 250 contacts, for example, the third insulating layer 245 and the fourth insulating layer 260, respectively.

[0055] The bypass layer 250 and the fourth insulating layer 260 are provided as needed and can be omitted. If the bypass layer 250 and the fourth insulating layer 260 are not provided, the third insulating layer 245 will be in contact with the second support plate 270. The following explanation will use the case where the heater section 200 has a bypass layer 250 and a fourth insulating layer 260 as an example.

[0056] The first support plate 210 has a relatively high thermal conductivity. For example, the thermal conductivity of the first support plate 210 is higher than that of the subheater element 231 and higher than that of the main heater element 232. Examples of materials for the first support plate 210 include metals containing at least one of aluminum, copper, and nickel, and multilayer graphite. The thickness (length in the Z direction) of the first support plate 210 is, for example, about 0.1 mm or more and 3.0 mm or less. More preferably, the thickness of the first support plate 210 is, for example, about 0.3 mm or more and 1.0 mm or less. The first support plate 210 improves the uniformity of the in-plane temperature distribution of the heater section 200. The first support plate 210 functions, for example, as a heat equalizing plate. The first support plate 210 suppresses warping of the heater section 200. The first support plate 210 improves the strength of the adhesion between the heater section 200 and the ceramic dielectric substrate 100.

[0057] The material, thickness, and function of the second support plate 270 are the same as those of the first support plate 210. For example, the thermal conductivity of the second support plate 270 is higher than that of the subheater element 231 and higher than that of the main heater element 232. In this embodiment, at least one of the first support plate 210 and the second support plate 270 may be omitted.

[0058] As the material for the first insulating layer 220, for example, insulating materials such as resin or ceramic can be used. Examples of the first insulating layer 220 being made of resin include polyimide and polyamide-imide. Examples of the first insulating layer 220 being made of ceramic include Al2O3, AlN, SiC, Y2O3, and YAG. The thickness (length in the Z direction) of the first insulating layer 220 is, for example, about 0.01 mm or more and 0.20 mm or less. The first insulating layer 220 joins the first support plate 210 and the subheater element 231. The first insulating layer 220 electrically insulates the first support plate 210 and the subheater element 231. Thus, the first insulating layer 220 has the function of electrical insulation and the function of surface bonding. Note that the first insulating layer 220 only needs to have an insulating function, and may also have other functions such as a heat conduction function or a diffusion prevention function.

[0059] The material and thickness of the second insulating layer 240 are approximately the same as those of the first insulating layer 220. The material and thickness of the third insulating layer 245 are approximately the same as those of the first insulating layer 220. The material and thickness of the fourth insulating layer 260 are approximately the same as those of the first insulating layer 220.

[0060] The second insulating layer 240 joins the subheater element 231 and the main heater element 232. The second insulating layer 240 electrically insulates the subheater element 231 and the main heater element 232. Thus, the second insulating layer 240 has both an electrical insulating function and a surface bonding function. Note that the second insulating layer 240 only needs to have an insulating function, and may also have other functions such as a heat conduction function or a diffusion prevention function.

[0061] The third insulating layer 245 joins the main heater element 232 and the bypass layer 250. The third insulating layer 245 electrically insulates the main heater element 232 and the bypass layer 250. Thus, the third insulating layer 245 has both an electrical insulating function and a surface bonding function. The third insulating layer 245 only needs to have an insulating function; it may also have other functions such as a heat conduction function or a diffusion prevention function.

[0062] The fourth insulating layer 260 joins the bypass layer 250 and the second support plate 270. The fourth insulating layer 260 electrically insulates the bypass layer 250 and the second support plate 270. Thus, the fourth insulating layer 260 has both an electrical insulating function and a surface bonding function. Note that the fourth insulating layer 260 only needs to have an insulating function, and may also have other functions such as a heat conduction function or a diffusion prevention function.

[0063] When the subheater element 231 is provided inside the ceramic dielectric substrate 100, examples of materials for the subheater element 231 include metals containing at least one of titanium, chromium, nickel, copper, aluminum, molybdenum, tungsten, palladium, platinum, silver, tantalum, molybdenum carbide, and tungsten carbide. It is preferable that the material of the subheater element 231 includes both the above metals and a ceramic material. Examples of ceramic materials include aluminum oxide (Al2O3), yttrium oxide (Y2O3), and yttrium aluminum garnet (YAG_Y3Al5O 12Examples include aluminum nitride (AlN), silicon carbide (SiC), etc. Preferably, the ceramic material contained in the subheater element 231 is the same as the composition of the ceramic dielectric substrate 100. When the subheater element 231 is provided outside the ceramic dielectric substrate 100, examples of materials for the subheater element 231 include metals containing at least one of stainless steel, titanium, chromium, nickel, copper, aluminum, Inconel®, molybdenum, tungsten, palladium, platinum, silver, tantalum, molybdenum carbide, and tungsten carbide. The thickness (length in the Z direction) of the subheater element 231 is, for example, about 0.01 mm or more and 0.20 mm or less. The material and thickness of the main heater element 232 are the same as the material and thickness of the subheater element 231. For example, when the main heater element 232 is provided inside the ceramic dielectric substrate 100, the material of the main heater element 232 is the same as the material of the sub-heater element 231 when the sub-heater element 231 is provided inside the ceramic dielectric substrate 100. For example, when the main heater element 232 is provided outside the ceramic dielectric substrate 100, the material of the main heater element 232 is the same as the material of the sub-heater element 231 when the sub-heater element 231 is provided outside the ceramic dielectric substrate 100. The sub-heater element 231 and the main heater element 232 are electrically connected to the bypass layer 250, for example. On the other hand, the sub-heater element 231 and the main heater element 232 are electrically insulated from the first support plate 210 and the second support plate 270, respectively.

[0064] The sub-heater element 231 and the main heater element 232 each generate heat when current flows through them. By generating heat, the sub-heater element 231 and the main heater element 232 heat the ceramic dielectric substrate 100. The sub-heater element 231 and the main heater element 232 can, for example, make the temperature distribution in the plane of the object to be processed W uniform by heating the object to be processed W via the ceramic dielectric substrate 100. Alternatively, the sub-heater element 231 and the main heater element 232 can, for example, intentionally create temperature differences in the plane of the object to be processed W by heating the object to be processed W via the ceramic dielectric substrate 100.

[0065] The bypass layer 250 is arranged substantially parallel to the first support plate 210 and substantially parallel to the second support plate 270. The bypass layer 250 has a plurality of bypass sections 251. In this example, the bypass layer 250 has 10 bypass sections 251 (bypass sections 251a to bypass sections 251j). The number of bypass sections 251 is not limited to "10". The bypass layer 250 has a plate-like shape.

[0066] The bypass layer 250 is, for example, conductive. The bypass layer 250 is electrically connected to, for example, the subheater element 231 and the main heater element 232. The bypass layer 250 is the power supply path for the subheater element 231 and the main heater element 232. On the other hand, the bypass layer 250 is electrically insulated from, for example, the first support plate 210 and the second support plate 270 by an insulating layer.

[0067] The thickness (length in the Z direction) of the bypass layer 250 is, for example, approximately 0.03 mm or more and 0.30 mm or less. The thickness of the bypass layer 250 is greater than the thickness of the first insulating layer 220. The thickness of the bypass layer 250 is greater than the thickness of the second insulating layer 240. The thickness of the bypass layer 250 is greater than the thickness of the third insulating layer 245. The thickness of the bypass layer 250 is greater than the thickness of the fourth insulating layer 260.

[0068] For example, when the bypass layer 250 is provided on the outside of the ceramic dielectric substrate 100, the material of the bypass layer 250 may include metals containing at least one of stainless steel, titanium, chromium, nickel, copper, aluminum, Inconel®, molybdenum, tungsten, palladium, platinum, silver, tantalum, molybdenum carbide, and tungsten carbide. For example, when the heater section 200 (bypass layer 250, sub-heater element 231, and main heater element 232) is provided inside the ceramic dielectric substrate 100, the material of the bypass layer 250 is the same as the material of the sub-heater element 231 and the main heater element 232. On the other hand, the thickness of the bypass layer 250 is greater than the thickness of the sub-heater element 231 and greater than the thickness of the main heater element 232. Therefore, the electrical resistance of the bypass layer 250 is lower than the electrical resistance of the sub-heater element 231 and lower than the electrical resistance of the main heater element 232. This makes it possible to suppress the heat generation of the bypass layer 250, even if the material of the bypass layer 250 is the same as that of the sub-heater element 231 and the main heater element 232. In other words, it is possible to reduce the electrical resistance of the bypass layer 250 and reduce the amount of heat generated by the bypass layer 250.

[0069] Furthermore, the means of suppressing the electrical resistance of the bypass layer 250 and the amount of heat generated by the bypass layer 250 may be achieved not by the thickness of the bypass layer 250, but by using a material with a relatively low volume resistivity. In other words, the material of the bypass layer 250 may be different from the material of the subheater element 231 and the main heater element 232. Examples of materials for the bypass layer 250 include metals containing at least one of stainless steel, titanium, chromium, nickel, copper, aluminum, Inconel®, molybdenum, tungsten, palladium, platinum, silver, tantalum, molybdenum carbide, and tungsten carbide.

[0070] For example, when the bypass layer 250 is provided inside the ceramic dielectric substrate 100, the material of the bypass layer 250 can be the same as the material of the subheater element 231 when the subheater element 231 is provided inside the ceramic dielectric substrate 100. For example, when the bypass layer 250 is provided outside the ceramic dielectric substrate 100, the material of the bypass layer 250 can be the same as the material of the subheater element 231 when the subheater element 231 is provided outside the ceramic dielectric substrate 100.

[0071] The power supply terminal 280 is electrically connected to the bypass layer 250. When the heater unit 200 is provided between the base plate 300 and the ceramic dielectric substrate 100, the power supply terminal 280 is provided facing from the heater unit 200 toward the base plate 300. The power supply terminal 280 supplies power supplied from outside the electrostatic chuck 10 to the sub-heater element 231 and the main heater element 232 via the bypass layer 250. The power supply terminal 280 may also be directly connected to the sub-heater element 231 and the main heater element 232, for example. This would allow the bypass layer 250 to be omitted.

[0072] On the other hand, if the subheater element 231 and / or the main heater element 232 have a large number of zones, for example, 20 or more, 50 or more, or 100 or more, it becomes difficult to arrange the power supply terminals 280 corresponding to each zone. By providing a bypass layer 250, the degree of freedom in arranging the power supply terminals 280 is improved compared to when they are arranged for each zone.

[0073] The heater unit 200 has a plurality of power supply terminals 280. In this example, the heater unit 200 has 10 power supply terminals 280 (power supply terminals 280a to 280j). The number of power supply terminals 280 is not limited to "10". One power supply terminal 280 is electrically connected to one bypass unit 251. In other words, the number of power supply terminals 280 is the same as the number of bypass units 251. The hole 273 penetrates the second support plate 270. The power supply terminals 280 are electrically connected to the bypass units 251 through the hole 273.

[0074] The subheater element 231 has a first region 701 and a second region 702. The first region 701 and the second region 702 each have a first sub-power supply unit 231a, a second sub-power supply unit 231b, and a subheater line 231c. The subheater line 231c is electrically connected to the first sub-power supply unit 231a and the second sub-power supply unit 231b. The first sub-power supply unit 231a is provided at one end of the subheater line 231c, and the second sub-power supply unit 231b is provided at the other end of the subheater line 231c. The subheater line 231c generates heat when current flows through it. The first sub-power supply unit 231a and the second sub-power supply unit 231b supply power to the subheater line 231c. The subheater element 231 is electrically connected to the bypass layer 250 in the first sub-power supply section 231a and the second sub-power supply section 231b.

[0075] As shown by arrows C21 and C22 in Figure 4, when power is supplied to the power supply terminal 280a from outside the electrostatic chuck 10, current flows from the power supply terminal 280a to the bypass section 251a. As shown by arrows C23 and C24 in Figure 4, the current that flows into the bypass section 251a flows from the bypass section 251a to the first region 701 of the subheater element 231. As shown by arrows C25 and C26 in Figure 4, the current that flows into the first region 701 flows from the first region 701 to the bypass section 251b. More specifically, the current that flows into the bypass section 251a flows to the subheater line 231c of the first region 701 via the first sub-power supply section 231a of the first region 701, and then flows to the bypass section 251b via the second sub-power supply section 231b of the first region 701. As shown by arrows C27 and C28 in Figure 4, the current that flows into the bypass section 251b flows from the bypass section 251b to the power supply terminal 280b. As shown by arrow C29 in Figure 4, the current that flows into the power supply terminal 280b flows to the outside of the electrostatic chuck 10.

[0076] Similarly, when power is supplied to the power supply terminal 280c from outside the electrostatic chuck 10, the current flows in the following order as shown by arrows C31 to C39 in Figure 4: power supply terminal 280c, bypass section 251c, second region 702 of the subheater element 231, bypass section 251d, and power supply terminal 280d.

[0077] The main heater element 232 has main zones 601, 602, and 603. Each of the main zones 601 to 603 has a first main power supply unit 232a, a second main power supply unit 232b, and a main heater line 232c. The main heater line 232c is electrically connected to the first main power supply unit 232a and the second main power supply unit 232b. The first main power supply unit 232a is provided at one end of the main heater line 232c, and the second main power supply unit 232b is provided at the other end of the main heater line 232c. The main heater line 232c generates heat when current flows through it. The first main power supply unit 232a and the second main power supply unit 232b supply power to the main heater line 232c. The main heater element 232 is electrically connected to the bypass layer 250 in the first main power supply section 232a and the second main power supply section 232b.

[0078] As shown by arrows C41 and C42 in Figure 4, when power is supplied to the power supply terminal 280e from outside the electrostatic chuck 10, current flows from the power supply terminal 280e to the bypass section 251e. As shown by arrows C43 and C44 in Figure 4, the current that flows to the bypass section 251e flows from the bypass section 251e to the main zone 601 of the main heater element 232. As shown by arrows C45 and C426 in Figure 4, the current that flows to the main zone 601 flows from the main zone 601 to the bypass section 251f. More specifically, the current that flows to the bypass section 251e flows to the main heater line 232c of the main zone 601 via the first main power supply section 232a of the main zone 601, and then flows to the bypass section 251f via the second main power supply section 232b of the main zone 601. As shown by arrows C47 and C48 in Figure 4, the current that flows into the bypass section 251f flows from the bypass section 251f to the power supply terminal 280f. As shown by arrow C49 in Figure 4, the current that flows into the power supply terminal 280f flows to the outside of the electrostatic chuck 10.

[0079] Similarly, when power is supplied to the power supply terminal 280g from outside the electrostatic chuck 10, the current flows in the following order as shown by arrows C51 to C59: power supply terminal 280g, bypass section 251g, main zone 602 of the main heater element 232, bypass section 251h, and power supply terminal 280h.

[0080] Similarly, when power is supplied to the power supply terminal 280i from outside the electrostatic chuck 10, the current flows in the following order, as shown by arrows C61 to C69: power supply terminal 280i, bypass section 251i, main zone 603 of the main heater element 232, bypass section 251j, and power supply terminal 280j.

[0081] For example, the current flowing through the subheater element 231 and the current flowing through the main heater element 232 are controlled separately. In this example, the bypass sections 251 connected to the subheater element 231 (bypass sections 251a, 251b, 251c, 251d) and the bypass sections 251 connected to the main heater element 232 (bypass sections 251e, 251f, 251g, 251h, 251i, 251j) are different. The bypass sections 251 connected to the subheater element 231 and the bypass sections 251 connected to the main heater element 232 may be the same.

[0082] For example, by making the voltage applied to the power supply terminals 280 (280a, 280b, 280c, 280d) that supply power to the sub-heater element 231 different from the voltage applied to the power supply terminals 280 (280e, 280f, 280g, 280h, 280i, 280j) that supply power to the main heater element 232, the output of the sub-heater element 231 and the output of the main heater element 232 can be made different. In other words, the output of each heater element can be controlled independently.

[0083] For example, the current flowing through the first region 701 and the current flowing through the second region 702 of the subheater element 231 are controlled separately. In this example, the bypass sections 251 connected to the first region 701 (bypass sections 251a, 251b) and the bypass sections 251 connected to the second region 702 (bypass sections 251c, 251d) are different. The bypass section 251 connected to the first region 701 and the bypass section 251 connected to the second region 702 may be the same.

[0084] For example, by making the voltage applied to the power supply terminals 280 (power supply terminals 280a, 280b) that supply power to the first region 701 different from the voltage applied to the power supply terminals 280 (power supply terminals 280c, 280d) that supply power to the second region 702, the output of the first region 701 and the output of the second region 702 can be made different. In other words, the output of each region (subzone) can be controlled independently.

[0085] For example, the current flowing through the main zone 601, the main zone 602, and the main zone 603 of the main heater element 232 are controlled separately. In this example, the bypass sections 251 connected to the main zone 601 (bypass sections 251e, 251f), the bypass sections 251 connected to the main zone 602 (bypass sections 251g, 251h), and the bypass sections 251 connected to the main zone 603 (bypass sections 251i, 251j) are all different. The bypass sections 251 connected to the main zone 601, the bypass sections 251 connected to the main zone 602, and the bypass sections 251 connected to the main zone 603 may be the same.

[0086] For example, by making the voltage applied to the power supply terminals 280 (power supply terminals 280e, 280f) supplying power to main zone 601, the voltage applied to the power supply terminals 280 (power supply terminals 280g, 280h) supplying power to main zone 602, and the voltage applied to the power supply terminals 280 (power supply terminals 280i, 280j) supplying power to main zone 603 different, the outputs of main zone 601, main zone 602, and main zone 603 can be made different. In other words, the output of each main zone can be controlled independently.

[0087] The subheater element 231 generates less heat than the main heater element 232. In other words, the subheater element 231 is a low-output subheater, and the main heater element 232 is a high-output main heater.

[0088] In this way, the sub-heater element 231 generates less heat than the main heater element 232, thereby suppressing temperature unevenness within the surface of the object W being processed, which is caused by the pattern of the main heater element 232. Therefore, the uniformity of the temperature distribution within the surface of the object W being processed can be improved.

[0089] The volume resistivity of the subheater element 231 is higher than, for example, the volume resistivity of the main heater element 232. The volume resistivity of the subheater element 231 is the volume resistivity of the subheater line 231c. In other words, the volume resistivity of the subheater element 231 is the volume resistivity between the first sub-power supply unit 231a and the second sub-power supply unit 231b. To put it another way, the volume resistivity of the subheater element 231 is the volume resistivity along the path indicated by arrows C25 and C35 in Figure 4. Similarly, the volume resistivity of the main heater element 232 is the volume resistivity of the main heater line 232c. In other words, the volume resistivity of the main heater element 232 is the volume resistivity between the first main power supply unit 232a and the second main power supply unit 232b. In other words, the volume resistivity of the main heater element 232 is the volume resistivity along the paths indicated by arrows C45, C55, and C65 in Figure 4.

[0090] In this way, by making the volume resistivity of the subheater element 231 higher than that of the main heater element 232, the output (heat generation, power consumption) of the subheater element 231 can be made lower than that of the main heater element 232. As a result, the temperature unevenness within the surface of the object W being processed, caused by the pattern of the main heater element 232, can be suppressed by the subheater element 231. Therefore, the uniformity of the temperature distribution within the surface of the object being processed can be improved.

[0091] The area around the power supply terminal 280 is prone to becoming a temperature singularity (a point where the temperature differs relatively significantly from the surrounding area). In contrast, the provision of the bypass layer 250 allows for greater flexibility in the placement of the power supply terminal 280. For example, the power supply terminal 280, which is prone to becoming a temperature singularity, can be dispersed, making it easier for heat to diffuse around the singularity. This improves the uniformity of the in-plane temperature distribution of the object W being processed.

[0092] The provision of the bypass layer 250 allows for a configuration in which the power supply terminal 280, which has a large heat capacity, is not directly connected to the sub-heater element 231 and the main heater element 232. This improves the uniformity of the in-plane temperature distribution of the object W being processed. Furthermore, the provision of the bypass layer 250 eliminates the need to directly connect the power supply terminal 280 to the relatively thin sub-heater element 231 and the main heater element 232. This improves the reliability of the heater unit 200.

[0093] As mentioned above, the power supply terminal 280 is provided extending from the heater unit 200 toward the base plate 300. Therefore, power can be supplied to the power supply terminal 280 from the lower surface 303 of the base plate 300 (see Figures 2(a) and 2(b)) via a component called a socket or the like. This allows for heater wiring while preventing the power supply terminal 280 from being exposed inside the chamber where the electrostatic chuck 10 is installed.

[0094] In this example, the subheater element 231 is located above the main heater element 232. In other words, the subheater element 231 is located between the main heater element 232 and the first main surface 101. The positions of the subheater element 231 and the main heater element 232 may be reversed. That is, the main heater element 232 may be located above the subheater element 231. In other words, the main heater element 232 may be located between the first main surface 101 and the subheater element 231. From the viewpoint of temperature control, it is preferable that the subheater element 231 is located above the main heater element 232.

[0095] When the sub-heater element 231 is positioned above the main heater element 232, the distance between the sub-heater element 231 and the object W being processed is shorter than the distance between the main heater element 232 and the object W being processed. Because the sub-heater element 231 is relatively close to the object W being processed, it becomes easier to control the temperature of the object W using the sub-heater element 231. In other words, the sub-heater element 231 can more easily suppress temperature unevenness within the surface of the object W caused by the pattern of the main heater element 232. Therefore, the uniformity of the temperature distribution within the surface of the object W can be improved.

[0096] On the other hand, when the main heater element 232 is located above the sub-heater element 231, the high-output main heater element 232 is relatively close to the object W being processed. This improves the temperature responsiveness (heating rate and cooling rate) of the object W being processed.

[0097] In this example, the main heater element 232 is located between the bypass layer 250 and the sub-heater element 231 in the Z direction. In other words, the bypass layer 250 is located below both the sub-heater element 231 and the main heater element 232.

[0098] In this way, by providing the main heater element 232 between the bypass layer 250 and the sub-heater element 231 in the Z direction, the sub-heater element 231 and the main heater element 232 can be arranged on one side of the bypass layer 250. This allows the power supply terminal 280 to be connected to the bypass layer 250 from the opposite side of the sub-heater element 231 and the main heater element 232. Therefore, there is no need to provide holes in the sub-heater element 231 and the main heater element 232 for the power supply terminal 280 to pass through, which reduces temperature singularities on the heater pattern and improves the uniformity of the in-plane temperature distribution of the sub-heater element 231 and the main heater element 232.

[0099] The bypass layer 250 may be located above the subheater element 231 and the main heater element 232. In other words, the bypass layer 250 may be provided between the first support plate 210 and the subheater element 231. Alternatively, the bypass layer 250 may be provided between the first support plate 210 and the main heater element 232. Furthermore, the bypass layer 250 may be located between the subheater element 231 and the main heater element 232.

[0100] Furthermore, the number of heater elements in the heater unit 200 is not limited to "2". In other words, the heater unit 200 may have additional heater elements provided in layers different from the sub-heater element 231 and the main heater element 232. Also, the heater unit 200 may have only one of the sub-heater element 231 and the main heater element 232. In other words, either the sub-heater element 231 or the main heater element 232 may be omitted.

[0101] Figure 5 is a schematic plan view showing the main zone of the main heater element according to the embodiment. Figure 5 is a projection of the main heater element 232 shown in Figure 3 onto a plane perpendicular to the Z direction. As shown in Figure 5, the main heater element 232 has multiple main zones 600 divided radially Dr. In the main heater element 232, for example, independent temperature control is performed in each main zone 600. In this specification, "radial direction Dr" refers to the direction from the center of the heater element outward along the radius. "Circumferential direction Dc" refers to the direction along the outer circumference of the heater element.

[0102] In this example, the multiple main zones 600 have three main zones 601-603 aligned radially in the Dr. That is, the main heater element 232 is divided into three in the radial direction Dr. Each main zone 600 is arranged in the order of main zone 601, main zone 602, and main zone 603, moving outward from the center CT2 of the main heater element 232 in the radial direction Dr.

[0103] In this example, the main zone 601 is circular in shape with center CT2 in a plan view. The main zone 602 is annular in shape with center CT2 and is located outside the main zone 601 in a plan view. The main zone 603 is annular in shape with center CT2 and is located outside the main zone 602 in a plan view.

[0104] In this example, the radial width LM1 of main zone 601, the radial width LM2 of main zone 602, and the radial width LM3 of main zone 603 are all the same. However, the widths LM1 to LM3 may be different.

[0105] The number of main zones 600 and their shape in plan view are arbitrary. Furthermore, the main zones 600 may be divided in the circumferential direction Dc, or in the circumferential direction Dc and the radial direction Dr.

[0106] The main heater lines 232c that make up each main zone 600 are independent of each other. This allows a different voltage to be applied to each main zone 600 (main heater line 232c). Therefore, the output (amount of heat generated) can be controlled independently for each main zone 600. In other words, each main zone 600 is a heater unit that can perform independent temperature control, and the main heater element 232 is an assembly of heater units having multiple such heater units.

[0107] Each main zone 600 has, as described above, one first main power supply unit 232a, one second main power supply unit 232b, and one main heater line 232c. The main heater line 232c is a single electrode connecting the first main power supply unit 232a and the second main power supply unit 232b, and generates heat when current flows through it. The main zone 600 is a region composed of a continuous main heater line 232c connecting the first main power supply unit 232a and the second main power supply unit 232b.

[0108] Note that in Figure 5, for convenience, the radial ends Dr of each main zone 600 are shown touching, but in reality, there is a gap between them (i.e., a section where the main heater line 232c is not provided), and the radial ends Dr of adjacent main zones do not touch. The same applies to subsequent figures.

[0109] Figure 6 is a schematic plan view showing the subzone of the subheater element according to the embodiment. Figure 6 is a projection of the subheater element 231 described in Figure 3 onto a plane perpendicular to the Z direction. As shown in Figure 6, in this example, the subheater element 231 has multiple subzones 700 divided in the radial direction Dr and the circumferential direction Dc. In the subheater element 231, independent temperature control is performed in each subzone 700.

[0110] The multiple subzones 700 each consist of a first region 701 comprising subzones 701a to 701f aligned in the circumferential direction Dc, and a second region 702 comprising subzones 702a to 702f aligned in the circumferential direction Dc. In other words, the main heater element 232 is divided into two in the radial direction Dr. Furthermore, the first region 701 and the second region 702 are each divided into six in the circumferential direction Dc. The regions are arranged in the order of the first region 701 and the second region 702, moving outward in the radial direction Dr from the center CT1 of the subheater element 231.

[0111] The first region 701 is circular in shape with center CT1 in a plan view. The second region 702 is located outside the first region 701 and is an annular shape with center CT1 in a plan view.

[0112] The first region 701 has subzones 701a to 701f. In the first region 701, subzones 701a to 701f are arranged in a clockwise direction as subzone 701a, subzone 701b, subzone 701c, subzone 701d, subzone 701e, and subzone 701f. Each of the subzones 701a to 701f constitutes a part of the circular first region 701.

[0113] The second region 702 has subzones 702a to 702f. In the second region 702, subzones 702a to 702f are arranged in a clockwise direction as subzone 702a, subzone 702b, subzone 702c, subzone 702d, subzone 702e, and subzone 702f. In this example, subzone 702a is located outside subzone 701a. Subzone 702b is located outside subzone 701b. Subzone 702c is located outside subzone 701c. Subzone 702d is located outside subzone 701d. Subzone 702e is located outside subzone 701e. Subzone 702f is located outside subzone 701f. Each of the subzones 702a to 702f constitutes a part of the annular second region 702.

[0114] The radial width LS1 of the first region 701 and the radial width LS2 of the second region 702 are, for example, the same. Widths LS1 and LS2 may be different.

[0115] The number of subzones 700 is, for example, greater than the number of main zones 600. In other words, the subheater element 231 is divided into more zones than, for example, the main heater element 232. The number of subzones 700 may be the same as the number of main zones 600, or it may be less than the number of main zones 600.

[0116] By increasing the number of subzones 700 in the subheater element 231 compared to the number of main zones 600 in the main heater element 232, the subheater element 231 can control the temperature of a narrower area than the main heater element 232. This allows for finer temperature adjustments by the subheater element 231, improving the uniformity of the temperature distribution within the surface of the object W being processed.

[0117] The number of subzones 700 and their shapes in plan view are arbitrary. Furthermore, the subzones 700 do not have to be divided in the circumferential direction Dc. In other words, the first region 701 and the second region 702 do not have to contain multiple subzones 700 divided in the circumferential direction Dc.

[0118] The subheater lines 231c that make up each subzone 700 are independent of each other. This allows a different voltage to be applied to each subzone 700 (subheater line 231c). Therefore, the output (amount of heat generated) can be controlled independently for each subzone 700. In other words, each subzone 700 is a heater unit that can perform independent temperature control, and the subheater element 231 is an assembly of multiple such heater units.

[0119] Each subzone 700 has, as described above, one first sub-power supply unit 231a, one second sub-power supply unit 231b, and one sub-heater line 231c. The sub-heater line 231c is a single electrode connecting the first sub-power supply unit 231a and the second sub-power supply unit 231b, and generates heat when current flows through it. The subzone 700 is a region composed of a continuous sub-heater line 231c connecting the first sub-power supply unit 231a and the second sub-power supply unit 231b.

[0120] Note that in Figure 6, for convenience, the radial ends Dr of each subzone 700 are shown touching, but in reality, there are gaps between them (i.e., areas where the subheater line 231c is not provided), and the radial ends Dr of adjacent subzones 700 do not touch. The same applies to subsequent figures.

[0121] Figure 7 is a schematic plan view showing the positional relationship between the main zone of the main heater element and the subzone of the subheater element according to the embodiment. Figure 7 shows the positional relationship between the main heater element 232 shown in Figure 5 and the sub-heater element 231 shown in Figure 6, when superimposed and viewed along the Z direction. In Figure 7, the main zone 600 of the main heater element 232 is represented by a dashed line, and the subzone 700 of the sub heater element 231 is represented by a solid line.

[0122] As shown in Figure 7, the subheater element 231 and the main heater element 232 are arranged such that, for example, the center CT1 of the subheater element 231 and the center CT2 of the main heater element 232 overlap in the Z direction. Also, the outer edge 231e of the subheater element 231 and the outer edge 232e of the main heater element 232 overlap in the Z direction. The outer edge 231e of the subheater element 231 and the outer edge 232e of the main heater element 232 do not necessarily have to overlap in the Z direction.

[0123] Figure 8 is a schematic plan view showing a part of the first zone of the heater section according to the embodiment. Figure 8 shows a magnified view of a portion of the first zone 810 of the heater unit 200. The first zone 810 is one of several zones included in the first heater element of the heater unit 200. The first heater element may be a sub-heater element 231 or a main heater element 232. In other words, the first zone 810 may be one of the sub-zones 700 of the sub-heater element 231 or one of the main zones 600 of the main heater element 232.

[0124] As shown in Figure 8, the first zone 810 has a first heater line 833. The first zone 810 also has a first power supply unit 831 (see Figures 13 to 16) and a second power supply unit 832 (see Figures 13 to 16). The first heater line 833 generates heat when current flows through it. The first power supply unit 831 and the second power supply unit 832 supply power to the first heater line 833.

[0125] If the first zone 810 is one of the subzones 700, then the first power supply unit 831, the second power supply unit 832, and the first heater line 833 are the first sub-power supply unit 231a, the second sub-power supply unit 231b, and the sub-heater line 231c, respectively. If the first zone 810 is one of the main zones 600, then the first power supply unit 831, the second power supply unit 832, and the first heater line 833 are the first main power supply unit 232a, the second main power supply unit 232b, and the main heater line 232c, respectively.

[0126] The first heater line 833 has a plurality of extending portions 834 and a folded portion 835 (see Figures 13 to 16). The first heater line 833 has a structure in which the plurality of extending portions 834 are connected by the folded portion 835. As a result, the first heater line 833 functions as a single electrode connecting the first power supply unit 831 and the second power supply unit 832. The first heater line 833 also has a plurality of protrusions 836 provided on the plurality of extending portions 834. The protrusions 836 bend from the extending portions 834 that extend along a first direction and extend in a second direction. The thickness of the first heater line 833 in the protrusions 836 is, for example, the same as the thickness of the first heater line 833 in the extending portions 834.

[0127] The extension portion 834 extends along the first direction. The extension portions 834 are aligned in the second direction, which is perpendicular to the first direction. Each of the multiple projections 836 protrudes in the second direction. In this example, the first direction is the circumferential direction Dc, and the second direction is the radial direction Dr. That is, the extension portion 834 extends along the circumferential direction Dc and is aligned in the radial direction Dr. The projections 836 protrude in the radial direction Dr.

[0128] The multiple extensions 834 include a first extension 834a, a second extension 834b, and a third extension 834c. The third extension 834c is located between the first extension 834a and the second extension 834b in the second direction. That is, the first extension 834a and the second extension 834b are not adjacent, for example. The third extension 834c is provided as needed and is optional. That is, the first extension 834a and the second extension 834b may be adjacent. Even if the third extension 834c is provided, a part of the first extension 834a and a part of the second extension 834b may be adjacent.

[0129] The multiple protrusions 836 include a first protrusion 836a and a second protrusion 836b. The first protrusion 836a is provided on the first extension 834a and protrudes toward the second protrusion 836b. The second protrusion 836b is provided on the second extension 834b and protrudes toward the first protrusion 836a.

[0130] The first zone 810 has a first opposing region 841. In the first opposing region 841, the first protrusion 836a and the second protrusion 836b are arranged adjacent to each other and facing each other. That is, at least a portion between the first protrusion 836a and the second protrusion 836b does not include other parts of the first heater line 833 (e.g., other extending portions 834 or folded portions 835). However, a portion between the first protrusion 836a and the second protrusion 836b may include other parts of the first heater line 833 (e.g., other extending portions 834 or folded portions 835). The first opposing region 841 can become a cool spot with a relatively low temperature in the plane of the heater portion 200.

[0131] The first opposing region 841 is, for example, the interior of the region enclosed by the first virtual line VL1, the second virtual line VL2, the third virtual line VL3, and the fourth virtual line VL4. The first virtual line VL1 is a line that overlaps with one end (the inner end) of the first projection 836a in the second direction and extends along the first direction. The second virtual line VL2 is a line that overlaps with the other end (the outer end) of the second projection 836b in the second direction and extends along the first direction. The third virtual line VL3 is a line that overlaps with the end of the first projection 836a and the end of the second projection 836b in the first direction that is closer to the other end and extends along the second direction. The fourth virtual line VL4 is a line that extends along the second direction, overlapping with the other end of the first projection 836a in the first direction and the other end of the second projection 836b in the first direction, whichever is closer to the one end.

[0132] The first opposing region 841 includes at least a portion of the first projection 836a and at least a portion of the second projection 836b. In this example, the first opposing region 841 includes the entirety of the first projection 836a and the entirety of the second projection 836b. That is, one end of the first projection 836a in the first direction overlaps with one end of the second projection 836b in the first direction in the second direction. The other end of the first projection 836a in the first direction overlaps with the other end of the second projection 836b in the first direction in the second direction.

[0133] The first opposing region 841 does not necessarily have to include the entirety of the first protrusion 836a. Also, the first opposing region 841 does not necessarily have to include the entirety of the second protrusion 836b. In other words, one end of the first protrusion 836a in the first direction does not necessarily have to overlap with one end of the second protrusion 836b in the first direction in the second direction. The other end of the first protrusion 836a in the first direction does not necessarily have to overlap with the other end of the second protrusion 836b in the first direction in the second direction.

[0134] In this example, a portion of the third extension 834c is positioned to overlap with the first projection 836a and the second projection 836b in the second direction. That is, a portion of the third extension 834c is positioned to overlap with the first opposing region 841. On the other hand, another portion of the third extension 834c is positioned not to overlap with the first projection 836a and the second projection 836b in the second direction. That is, another portion of the third extension 834c is positioned not to overlap with the first opposing region 841. The entire third extension 834c may be positioned not to overlap with the first projection 836a and the second projection 836b, or a portion of it may be positioned to overlap with the first projection 836a and the second projection 836b.

[0135] If the third extension portion 834c is placed between the first protrusion 836a and the second protrusion 836b in the second direction, the size of the first opposing region 841 in the second direction increases. Also, since the first protrusion 836a and the second protrusion 836b, which are cool spots, are placed further apart, temperature control may become complicated. It is preferable to place the first protrusion 836a and the second protrusion 836b as close together as possible in the second direction, and to position the entire third extension portion 834c so as not to overlap with the first protrusion 836a and the second protrusion 836b.

[0136] Figure 9 is a schematic plan view showing a part of the first zone of the heater section according to a modified embodiment. As shown in Figure 9, in this example, the first direction is the circumferential direction Dc, and the second direction is the radial direction Dr. That is, the extended portion 834 extends along the circumferential direction Dc and aligns in the radial direction Dr. The protruding portion 836 protrudes in the radial direction Dr.

[0137] The multiple protrusions 836 include a first protrusion 836a and a second protrusion 836b, as well as a third protrusion 836c. The third protrusion 836c is provided on the first extension 834a and protrudes toward the second protrusion 836b. In the first direction, the third protrusion 836c is aligned with the first protrusion 836a.

[0138] In this example as well, the first zone 810 has a first opposing region 841. In the first opposing region 841, the first projection 836a and the second projection 836b are arranged adjacent to each other and facing each other. The first opposing region 841 includes a part of the first projection 836a and a part of the second projection 836b. That is, one end of the first projection 836a in the first direction does not overlap with one end of the second projection 836b in the first direction in the second direction. The other end of the first projection 836a in the first direction does not overlap with the other end of the second projection 836b in the first direction in the second direction.

[0139] The first opposing region 841 may, for example, include the entirety of the first projection 836a. That is, the other end of the first projection 836a in the first direction may overlap with the other end of the second projection 836b in the first direction in the second direction.

[0140] The first zone 810 further comprises a second opposing region 842. In the second opposing region 842, the third protrusion 836c and the second protrusion 836b are arranged adjacent to each other and facing each other. That is, at least a portion between the third protrusion 836c and the second protrusion 836b does not include other parts of the first heater line 833 (e.g., other extending portions 834 or folded portions 835). However, a portion between the third protrusion 836c and the second protrusion 836b may include other parts of the first heater line 833 (e.g., other extending portions 834 or folded portions 835). The second opposing region 842 can become a cool spot with a relatively lower temperature in the plane of the heater portion 200.

[0141] The second opposing region 842 is, for example, the interior of the region enclosed by the fifth virtual line VL5, the sixth virtual line VL6, the seventh virtual line VL7, and the eighth virtual line VL8. The fifth virtual line VL5 is a line that overlaps with one end (the inner end) of the third projection 836c in the second direction and extends along the first direction. The sixth virtual line VL6 is a line that overlaps with the other end (the outer end) of the second projection 836b in the second direction and extends along the first direction. The seventh virtual line VL7 is a line that overlaps with the end of the third projection 836c in the first direction and the end of the second projection 836b in the first direction that is closer to the other end, and extends along the second direction. The eighth virtual line VL8 is a line that extends along the second direction, overlapping with the other end of the third projection 836c in the first direction and the other end of the second projection 836b in the first direction, whichever is closer to the one end.

[0142] The second opposing region 842 includes at least a portion of the third projection 836c and at least a portion of the second projection 836b. In this example, the second opposing region 842 includes a portion of the third projection 836c and a portion of the second projection 836b. That is, one end of the third projection 836c in the first direction does not overlap with one end of the second projection 836b in the first direction in the second direction. The other end of the third projection 836c in the first direction does not overlap with the other end of the second projection 836b in the first direction in the second direction.

[0143] The second opposing region 842 may, for example, include the entirety of the third projection 836c. That is, one end of the third projection 836c in the first direction may overlap with one end of the second projection 836b in the second direction.

[0144] In this example, the second extension 834b has two additional protrusions on both sides of the second projection 836b in the first direction. In other words, in this example, five protrusions are arranged in close proximity. By arranging many protrusions in a concentrated manner, the number of cool spots across the entire surface can be relatively reduced. Therefore, it is possible to improve the uniformity of the temperature distribution within the surface of the object being processed while suppressing the complexity of temperature control.

[0145] The third extension portion 834c is provided, for example, in a position that does not overlap with the third projection portion 836c and the second projection portion 836b in the second direction. The third extension portion 834c is provided, for example, in a position that does not overlap with the second opposing region 842.

[0146] Figure 10 is a schematic plan view showing a part of the first zone of the heater section according to a modified embodiment. As shown in Figure 10, in this example, the first direction is the radial direction Dr, and the second direction is the circumferential direction Dc. That is, the extended portion 834 extends along the radial direction Dr and aligns in the circumferential direction Dc. The protruding portion 836 protrudes in the circumferential direction Dc.

[0147] In this example as well, the first zone 810 has a first opposing region 841. In the first opposing region 841, the first protrusion 836a and the second protrusion 836b are arranged adjacent to each other and facing each other. The first opposing region 841 is substantially the same as the example shown in Figure 8, so its explanation is omitted.

[0148] Figure 11 is a schematic plan view showing a part of the first zone of the heater section according to a modified embodiment. As shown in Figure 11, in this example, the first direction is the radial direction Dr, and the second direction is the circumferential direction Dc. That is, the extended portion 834 extends along the radial direction Dr and aligns in the circumferential direction Dc. The protruding portion 836 protrudes in the circumferential direction Dc.

[0149] The multiple protrusions 836 further include a third protrusion 836c, a fourth protrusion 836d, and a fifth protrusion 836e, in addition to the first protrusion 836a and the second protrusion 836b. The first protrusion 836a, the third protrusion 836c, and the fifth protrusion 836e are aligned in a first direction. The second protrusion 836b and the fourth protrusion 836d are aligned in a first direction. The third protrusion 836c is provided on the first extension 834a and protrudes toward the second protrusion 836b and the fourth protrusion 836d. The fifth protrusion 836e is provided on the first extension 834a and protrudes toward the fourth protrusion 836d. The fourth protrusion 836d is provided on the second extension 834b and protrudes toward the third protrusion 836c and the fifth protrusion 836e.

[0150] In this example as well, the first zone 810 has a first opposing region 841 and a second opposing region 842. In the first opposing region 841, the first protrusion 836a and the second protrusion 836b are arranged adjacent to each other and facing each other. In the second opposing region 842, the third protrusion 836c and the second protrusion 836b are arranged adjacent to each other and facing each other. The first opposing region 841 and the second opposing region 842 are substantially the same as those shown in the example in Figure 9, so their explanation is omitted.

[0151] In this example, the first zone 810 further comprises a third opposing region 843 and a fourth opposing region 844. In the third region 843, the third protrusion 836c and the fourth protrusion 836d are arranged adjacent to each other and facing each other. In the fourth opposing region 844, the fifth protrusion 836e and the fourth protrusion 836d are arranged adjacent to each other and facing each other. The third opposing region 843 and the fourth opposing region 844 are substantially the same as the first opposing region 841 and the second opposing region 842, except that the protrusions 836 that constitute them are different, so their description is omitted. The third opposing region 843 and the fourth opposing region 844 can become cool spots with relatively lower temperatures within the plane of the heater section 200.

[0152] Figure 12 is a schematic plan view showing a part of the first zone of the heater section according to a modified embodiment. As shown in Figure 12, the first zone 810 may have a fifth opposing region 845. The fifth opposing region 845 is provided, for example, at a corner 838 where the first heater line 833 bends. In the fifth opposing region 845, parts of the first heater line 833 are arranged to face each other adjacent to each other. The fifth opposing region 845 can become a cool spot with a relatively lower temperature within the plane of the heater section 200.

[0153] Figures 13 and 14 are schematic plan views illustrating the positional relationship between a part of the first zone and the second zone of the heater section according to the first embodiment. Figures 13 and 14 show enlarged views of a portion of the first zone 810 and the second zone 910 of the heater unit 200. The second zone 910 is one of several zones included in the second heater element of the heater unit 200. The second heater element is a different heater element from the first heater element. The second heater element may be a sub-heater element 231 or a main heater element 232. In other words, the second zone 910 may be one of the sub-zones 700 of the sub-heater element 231 or one of the main zones 600 of the main heater element 232. The second zone 910 overlaps with the first zone 810 in the Z direction.

[0154] As shown in Figure 13, the second zone 910 includes a third power supply unit 931, a fourth power supply unit 932, and a second heater line 933. The second heater line 933 generates heat when current flows through it. The third power supply unit 931 and the fourth power supply unit 932 supply power to the second heater line 933. Note that in Figure 14, the third power supply unit 931, the fourth power supply unit 932, and the second heater line 933 are omitted.

[0155] If the second zone 910 is one of the subzones 700, the third power supply unit 931, the fourth power supply unit 932, and the second heater line 933 are the first sub-power supply unit 231a, the second sub-power supply unit 231b, and the sub-heater line 231c, respectively. If the second zone 910 is one of the main zones 600, the third power supply unit 931, the fourth power supply unit 932, and the second heater line 933 are the first main power supply unit 232a, the second main power supply unit 232b, and the main heater line 232c, respectively.

[0156] In the following explanation, we will use the example where the first zone 810 is one of the main zones 600 of the main heater element 232, and the second zone 910 is one of the subzones 700 of the subheater element 231. However, the first zone 810 may be one of the subzones 700 of the subheater element 231, and the second zone 910 may be one of the main zones 600 of the main heater element 232.

[0157] As shown in Figure 14, the second zone 910 has a central region 911 and an outer peripheral region 912. The central region 911 is located in the center of the second zone 910 in a plan view. The outer peripheral region 912 is located outside the central region 911 in a plan view. For example, when the second zone 910 is heated, the temperature of the central region 911 becomes higher than the temperature of the outer peripheral region 912.

[0158] In this example, the second zone 910 is the region enclosed by the inner circumferential end 921, the outer circumferential end 922, the side end 923, and the side end 924. The inner circumferential end 921 coincides with one end in the second direction (the inner end in the radial direction Dr) of any of the third power supply unit 931, the fourth power supply unit 932, and the second heater line 933 that constitute the second zone 910. The outer circumferential end 922 coincides with the other end in the second direction (the outer end in the radial direction Dr) of any of the third power supply unit 931, the fourth power supply unit 932, and the second heater line 933 that constitute the second zone 910. In this example, the inner circumferential end 921 and the outer circumferential end 922 are arc-shaped.

[0159] The side end 923 is located between one end of the inner circumference end 921 and one end of the outer circumference end 922. The side end 923 overlaps with one end in the first direction (one end in the circumferential direction Dc) of any of the third power supply unit 931, the fourth power supply unit 932, and the second heater line 933 that constitute the second zone 910. The side end 924 is located between the other end of the inner circumference end 921 and the other end of the outer circumference end 922. The side end 924 overlaps with the other end in the first direction (the other end in the circumferential direction Dc) of any of the third power supply unit 931, the fourth power supply unit 932, and the second heater line 933 that constitute the second zone 910. In this example, the side ends 923 and 924 are straight lines.

[0160] The central region 911 includes, for example, the center 915 of the second zone 910. The center 915 is the intersection of the center line RL21 in the second direction (radial direction Dr) between the inner circumferential end 921 and the outer circumferential end 922, and the center line CL21 in the first direction (circumferential direction Dc) between the side end 923 and the side end 924.

[0161] The central region 911 is the region between the center line RL22 in the second direction (radial direction Dr) between the inner circumferential end 921 and the center line RL21, and the center line RL23 in the second direction (radial direction Dr) between the outer circumferential end 922 and the center line RL21, and between the center line CL22 in the first direction (circumferential direction Dc) between the side end 923 and the center line CL21, and the center line CL23 in the first direction (circumferential direction Dc) between the side end 924 and the center line CL21. In other words, the central region 911 is the interior of the region enclosed by the center lines RL22, RL23, CL22, and CL23.

[0162] The outer periphery region 912 is the region located outside the centerlines RL22, RL23, CL22, and CL23 (i.e., on the opposite side from the center 915). Specifically, the outer periphery region 912 is located between the centerline RL22 and the inner periphery end 921, between the centerline RL23 and the outer periphery end 922, between the centerline CL22 and the side end 923, and between the centerline CL23 and the side end 924.

[0163] In this example, the first opposing region 841 of the first zone 810 is located in a position that overlaps with the central region 911 of the second zone 910 in the Z direction.

[0164] In this specification, "the first opposing region 841 is provided in a position that overlaps with the central region 911" means that at least a part of the first opposing region 841 overlaps with the central region 911 in the Z direction. In other words, even if the first opposing region 841 is provided on the boundary between the central region 911 and the outer peripheral region 912, the first opposing region 841 is considered to be provided in the central region 911. To put it another way, if the first opposing region 841 does not overlap with the central region 911 in the Z direction, the first opposing region 841 is considered to be provided in the outer peripheral region 912. The same applies to the second opposing region 842, the third opposing region 843, the fourth opposing region 844, and the fifth opposing region 845.

[0165] Increasing the number of zones in the heater unit 200 improves the uniformity of the temperature distribution within the surface of the object W being processed. This increases the number of power supply units and terminals for supplying power to each zone. As the number of power supply units increases, the number of protrusions 836 provided on the heater line to avoid these power supply units also increases. Normally, current flows along the shortest path, so when current flows through the protrusions 836 of the heater line, current flows more easily inside the protrusion 836 than outside it. As a result, the amount of heat generated outside the protrusion 836 tends to be less than inside it. In other words, the protrusions 836 tend to become cool spots.

[0166] To improve the uniformity of the temperature distribution within the plane of the heater unit 200, for example, the protrusions 836 could be dispersed within the plane of the heater unit 200. However, if the protrusions 836 are dispersed within the plane of the heater unit 200, the cool spots will be dispersed, which may complicate temperature control. On the other hand, if the protrusions 836 are concentrated within the plane of the heater unit 200, the temperature at the cool spots will become lower, which may reduce the uniformity of the temperature distribution within the plane of the heater unit 200.

[0167] In contrast, according to this embodiment, the first opposing region 841 of the first zone 810, where the first protrusion 836a and the second protrusion 836b are arranged adjacent to each other and facing each other (i.e., the protrusions 836 are concentrated), is located in the second zone 910 at a position that overlaps with the central region 911, which tends to be hotter than the outer peripheral region 912. This suppresses the dispersion of cool spots, and by overlapping the first opposing region 841 of the first zone 810, which is a cool spot, with the central region 911 of the second zone 910, which is a hot spot, a significant drop in temperature in the cool spots can be suppressed. In other words, temperature unevenness can be canceled out. Therefore, it is possible to improve the uniformity of the in-plane temperature distribution of the object W to be processed while suppressing the complexity of temperature control.

[0168] It is preferable that at least one of the second opposing region 842, the third opposing region 843, the fourth opposing region 844, and the fifth opposing region 845 is located in a position that overlaps with the central region 911 of the second zone 910 in the Z direction. Since these regions, like the first opposing region 841, tend to become cool spots, overlapping them with the central region 911 of the second zone 910, which is a hot spot, can suppress a significant drop in temperature in the cool spot.

[0169] Figure 15 is a schematic plan view showing the first zone of the heater section according to the second embodiment. As shown in Figure 15, the first zone 810 has a central region 811 and an outer peripheral region 812. The central region 811 is located in the center of the first zone 810 in a plan view. The outer peripheral region 812 is located outside the central region 811 in a plan view. For example, when the first zone 810 is heated, the temperature of the central region 811 becomes higher than the temperature of the outer peripheral region 812.

[0170] In this example, the first zone 810 is the region enclosed by the inner circumferential end 821, the outer circumferential end 822, the side end 823, and the side end 824. The inner circumferential end 821 coincides with one end in the second direction (the inner end in the radial direction Dr) of any of the first power supply unit 831, the second power supply unit 832, and the first heater line 833 that constitute the first zone 810. The outer circumferential end 822 coincides with the other end in the second direction (the outer end in the radial direction Dr) of any of the first power supply unit 831, the second power supply unit 832, and the first heater line 833 that constitute the first zone 810. In this example, the inner circumferential end 821 and the outer circumferential end 822 are arc-shaped.

[0171] The side end 823 is located between one end of the inner circumference end 821 and one end of the outer circumference end 822. The side end 823 overlaps with one end in the first direction (one end in the circumferential direction Dc) of any of the first power supply unit 831, the second power supply unit 832, and the first heater line 833 that constitute the first zone 810. The side end 824 is located between the other end of the inner circumference end 821 and the other end of the outer circumference end 822. The side end 824 overlaps with the other end in the first direction (the other end in the circumferential direction Dc) of any of the first power supply unit 831, the second power supply unit 832, and the first heater line 833 that constitute the first zone 810. In this example, the side ends 823 and 824 are straight lines.

[0172] The central region 811 includes, for example, the center 815 of the first zone 810. The center 815 is the intersection of the radial center line RL11 between the inner circumferential end 821 and the outer circumferential end 822 and the circumferential center line CL11 between the side end 823 and the side end 824.

[0173] The central region 811 is the region between the center line RL12 in the second direction (radial direction Dr) between the inner circumferential end 821 and the center line RL11, and the center line RL13 in the second direction (radial direction Dr) between the outer circumferential end 822 and the center line RL11, and between the center line CL12 in the first direction (circumferential direction Dc) between the side end 823 and the center line CL11, and the center line CL13 in the first direction (circumferential direction Dc) between the side end 824 and the center line CL11. In other words, the central region 811 is the interior of the region enclosed by the center lines RL12, RL13, CL12, and CL13.

[0174] The outer periphery region 812 is the region located outside the centerlines RL12, RL13, CL12, and CL13 (i.e., on the opposite side from the center 815). Specifically, the outer periphery region 812 is located between the centerline RL12 and the inner periphery end 821, between the centerline RL13 and the outer periphery end 822, between the centerline CL12 and the side end 823, and between the centerline CL13 and the side end 824.

[0175] In this example, the first opposing region 841 of the first zone 810 is located in the central region 811 of the first zone 810.

[0176] In this specification, "provided in the central region 811" means that at least a portion of the first opposing region 841 overlaps with the central region 811 in the Z direction. In other words, even if the first opposing region 841 is provided on the boundary between the central region 811 and the outer peripheral region 812, the first opposing region 841 is considered to be provided in the central region 811. To put it another way, if the first opposing region 841 does not overlap with the central region 811 in the Z direction, the first opposing region 841 is considered to be provided in the outer peripheral region 812. The same applies to the second opposing region 842, the third opposing region 843, the fourth opposing region 844, and the fifth opposing region 845.

[0177] According to this embodiment, the first opposing region 841 of the first zone 810, where the first protrusion 836a and the second protrusion 836b are arranged adjacent to each other and facing each other (i.e., the protrusions 836 are concentrated), is located in the central region 811 of the first zone 810, where the temperature tends to be higher than that of the outer peripheral region 812. This suppresses the dispersion of cool spots, and by placing the first opposing region 841 of the first zone 810, which is a cool spot, in the central region 811 of the first zone 810, which is a hot spot, a significant drop in temperature in the cool spots can be suppressed. In other words, temperature unevenness can be offset. Therefore, it is possible to improve the uniformity of the in-plane temperature distribution of the object W to be processed while suppressing the complexity of temperature control.

[0178] It is preferable that at least one of the second opposing region 842, the third opposing region 843, the fourth opposing region 844, and the fifth opposing region 845 be located in the central region 811 of the first zone 810. Since these regions, like the first opposing region 841, tend to become cool spots, placing them in the central region 811 of the first zone 810, which is a hot spot, can suppress a significant drop in temperature in the cool spots.

[0179] In this example, the heater unit 200 includes a first heater element including a first zone 810, a bypass layer 250 (see Figures 3 and 4) which is a power supply path to the first heater element, and a first power supply terminal 281 and a second power supply terminal 282 electrically connected to the bypass layer 250. The first power supply terminal 281 and the second power supply terminal 282 are, for example, a pair of power supply terminals 280 connected to the same bypass layer 250. The first power supply terminal 281 and the second power supply terminal 282 are, for example, one of the power supply terminals 280a to 280j described above, respectively.

[0180] The first power supply unit 831 is positioned in the Z direction so as not to overlap with the first power supply terminal 281. The first power supply unit 831 is electrically connected to the first power supply terminal 281 via the bypass layer 250. The second power supply unit 832 is positioned in the Z direction so as not to overlap with the second power supply terminal 282. The second power supply unit 832 is electrically connected to the second power supply terminal 282 via the bypass layer 250.

[0181] The first opposing region 841 is provided in a position that overlaps with at least one of the first power supply terminal 281 and the second power supply terminal 282 in the Z direction. For example, the first opposing region 841 is provided in a position that overlaps with the first power supply terminal 281 and the second power supply terminal 282 in the Z direction. For example, the first opposing region 841 may be provided in a position that overlaps with the first power supply terminal 281 but does not overlap with the second power supply terminal 282 in the Z direction. For example, the first opposing region 841 may be provided in a position that overlaps with the second power supply terminal 282 but does not overlap with the first power supply terminal 281 in the Z direction.

[0182] In this specification, "the first opposing region 841 is provided in a position that overlaps with the first power supply terminal 281" means that at least a part of the first opposing region 841 overlaps with the first power supply terminal 281 in the Z direction. In other words, even if the first opposing region 841 is provided on the boundary between the first power supply terminal 281 and the rest of the device, it is considered that the first opposing region 841 is provided in a position that overlaps with the first power supply terminal 281. To put it another way, if the first opposing region 841 does not overlap with the first power supply terminal 281 in the Z direction, it is considered that the first opposing region 841 is provided in a position that does not overlap with the first power supply terminal 281. The same applies to the second power supply terminal 282. The same also applies to the second opposing region 842, the third opposing region 843, the fourth opposing region 844, and the fifth opposing region 845.

[0183] Even if a refrigerant flow path 301 for circulating a cooling medium is provided inside the base plate 300, the refrigerant flow path 301 is not provided at the location where the power supply terminal 280 for supplying power to the bypass layer 250 is located. Therefore, the location where the power supply terminal 280 is located is less cooled than other locations and is prone to becoming a hot spot.

[0184] According to this embodiment, the first opposing region 841 of the first zone 810, where the first protrusion 836a and the second protrusion 836b are arranged adjacent to each other and facing each other (i.e., the protrusions 836 are concentrated), is positioned to overlap with at least one of the first power supply terminal 281 and the second power supply terminal 282. This suppresses the dispersion of cool spots, and by overlapping the first opposing region 841 of the first zone 810, which is a cool spot, with the first power supply terminal 281 and the second power supply terminal 282, which are hot spots, a significant drop in temperature in the cool spots can be suppressed. In other words, temperature unevenness can be canceled out. Therefore, it is possible to improve the uniformity of the in-plane temperature distribution of the object W to be processed while suppressing the complexity of temperature control.

[0185] It is preferable that at least one of the second opposing region 842, the third opposing region 843, the fourth opposing region 844, and the fifth opposing region 845 is located in a position that overlaps with at least one of the first power supply terminal 281 and the second power supply terminal 282 in the Z direction. Since these regions, like the first opposing region 841, tend to become cool spots, overlapping them with the hot spots, the first power supply terminal 281 and the second power supply terminal 282, can suppress a significant drop in temperature in the cool spots.

[0186] Figure 16 is a schematic plan view showing the first zone of the heater section according to the third embodiment. As shown in Figure 16, in this example, the first zone 810 includes the outer edge 810e of the first heater element. In other words, in this example, the first zone 810 is located at the outermost edge of the first heater element. If the first zone 810 is one of the subzones 700, the outer edge 810e is the outer edge 231e of the subheater element 231. If the first zone 810 is one of the main zones 600, the outer edge 810e is the outer edge 232e of the main heater element 232.

[0187] The first zone 810 has an inner circumference 851 and an outer circumference 852. The inner circumference 851 is the portion located on one side of the second direction (radial direction Dr) relative to the center line RL11 in the second direction (radial direction Dr). The outer circumference 852 is the portion located on the other side of the second direction (radial direction Dr) relative to the center line RL11 in the second direction (radial direction Dr). The outer circumference 852 includes the outer edge 810e of the first heater element. The center line RL11 in the second direction (radial direction Dr) passes through the center in the second direction (radial direction Dr) between the inner end 821 and the outer end 822 of the first zone 810. In other words, the center line RL11 in the second direction (radial direction Dr) bisects the first zone 810 in the second direction (radial direction Dr). For example, when the first zone 810 is heated, the temperature of the inner circumference 851 becomes higher than the temperature of the outer circumference 852.

[0188] In this example, the first opposing region 841 of the first zone 810 is located on the inner circumference 851 of the first zone 810.

[0189] In this specification, "provided on the inner circumference 851" means that at least a portion of the first opposing region 841 overlaps with the inner circumference 851 in the Z direction. In other words, even if the first opposing region 841 is provided on the boundary between the inner circumference 851 and the outer circumference 852, it is considered to be provided on the inner circumference 851. To put it another way, if the first opposing region 841 does not overlap with the inner circumference 851 in the Z direction, it is considered to be provided on the outer circumference 852. The same applies to the second opposing region 842, the third opposing region 843, the fourth opposing region 844, and the fifth opposing region 845.

[0190] According to this embodiment, the first opposing region 841 of the first zone 810, where the first protrusion 836a and the second protrusion 836b are arranged adjacent to each other and facing each other (i.e., the protrusions 836 are concentrated), is located in the inner circumferential region 851 of the first zone 810, where the temperature tends to be higher than that of the outer circumferential region 852. This suppresses the dispersion of cool spots, and by locating the first opposing region 841 of the first zone 810, which is a cool spot, in the inner circumferential region 851 of the first zone 810, which is a hot spot, a significant drop in temperature in the cool spots can be suppressed. In other words, temperature unevenness can be offset. Therefore, it is possible to improve the uniformity of the in-plane temperature distribution of the object W to be processed while suppressing the complexity of temperature control.

[0191] It is preferable that at least one of the second opposing region 842, the third opposing region 843, the fourth opposing region 844, and the fifth opposing region 845 be located on the inner circumference 851 of the first zone 810. Since these regions, like the first opposing region 841, tend to become cool spots, providing them on the inner circumference 851 of the first zone 810, which is a hot spot, can suppress a significant drop in temperature in the cool spots.

[0192] The multiple zones of the first heater element, including the first zone 810, are divided radially in the Dr direction, and the first direction is preferably the circumferential direction Dc. This allows for efficient control of the in-plane temperature of the object W being processed.

[0193] The multiple zones of the first heater element, including the first zone 810, are divided in the radial direction Dr, and it is also preferable that the first direction is the radial direction Dr. This allows for efficient control of the in-plane temperature of the object W being processed.

[0194] As described above, the first protrusion 836a and the second protrusion 836b are arranged adjacent to each other and facing each other. Therefore, the shortest distance between the first extension 834a and the second extension 834b may be greater than the shortest distance when the first protrusion 836a and the second protrusion 836b are not formed. Therefore, it is preferable that the multiple extensions 834 of the first zone 810 have a third extension 834c located between the first extension 834a and the second extension 834b in the second direction. This prevents the gap between the first extension 834a and the second extension 834b from becoming too wide due to the third extension 834c. In this case, it is also preferable that the third extension 834c is provided in a position that does not overlap with the first protrusion 836a and the second protrusion 836b in the second direction. This makes the range of the first opposing region 841 relatively small. Therefore, the uniformity of the in-plane temperature distribution of the object W being processed can be improved.

[0195] Furthermore, the multiple protrusions 836 of the first zone 810 may have a third protrusion 836c provided on the first extension 834a that protrudes toward the second protrusion 836b. In this case, it is preferable that the third protrusion 836c be arranged adjacent to and facing the second protrusion 836b. By arranging a region (second opposing region 842) that aggregates the second protrusion 836b and the third protrusion 836c near the first opposing region 841 in this way, the number of cool spots in the entire plane can be relatively reduced. Therefore, it is possible to improve the uniformity of the temperature distribution in the plane of the object W to be processed while suppressing the complexity of temperature control.

[0196] Figure 17 is a schematic plan view showing the first zone of the heater section according to the fourth embodiment. In this example, the heater unit 200 includes a first heater element including a first zone 810, a second heater element including a second zone 910, a bypass layer 250 (see Figures 3 and 4) which is a power supply path to the first and second heater elements, and a first power supply terminal 281, a second power supply terminal 282, a third power supply terminal 283, and a fourth power supply terminal 284 electrically connected to the bypass layer 250. The first power supply terminal 281 and the second power supply terminal 282 are, for example, a pair of power supply terminals 280 connected to the same bypass layer 250. The third power supply terminal 283 and the fourth power supply terminal 284 are, for example, a pair of power supply terminals 280 connected to the same bypass layer 250. The first power supply terminal 281, the second power supply terminal 282, the third power supply terminal 283, and the fourth power supply terminal 284 are, for example, each one of the power supply terminals 280a to 280j described above.

[0197] The first power supply unit 831 of the first zone 810 is located in a position that does not overlap with the first power supply terminal 281 in the Z direction. The first power supply unit 831 is electrically connected to the first power supply terminal 281 via the bypass layer 250. The second power supply unit 832 of the first zone 810 is located in a position that does not overlap with the second power supply terminal 282 in the Z direction. The second power supply unit 832 is electrically connected to the second power supply terminal 282 via the bypass layer 250.

[0198] The third power supply section 931 of the second zone 910 is located in a position that does not overlap with the third power supply terminal 283 in the Z direction. The third power supply section 931 is electrically connected to the third power supply terminal 283 via the bypass layer 250. The fourth power supply section 932 of the second zone 910 is located in a position that does not overlap with the fourth power supply terminal 284 in the Z direction. The fourth power supply section 932 is electrically connected to the fourth power supply terminal 284 via the bypass layer 250.

[0199] In this example, at least one of the third power supply terminal 283 and the fourth power supply terminal 284 is positioned in the Z direction to coincide with a virtual line segment VLS connecting the center CT3 of the first power supply unit 831 and the center CT4 of the second power supply unit 832.

[0200] In this specification, "the third power supply terminal 283 is provided in a position that overlaps with the virtual line segment VLS" means that at least a part of the third power supply terminal 283 overlaps with the virtual line segment VLS in the Z direction. In other words, the third power supply terminal 283 is considered to be provided in a position that overlaps with the virtual line segment VLS not only when it is at position P1, but also when it is at position P2 or position P3. When the third power supply terminal 283 is at position P1, the center CT5 of the third power supply terminal 283 overlaps with the virtual line segment VLS. When the third power supply terminal 283 is at position P2 or P3, the center CT5 of the third power supply terminal 283 does not overlap with the virtual line segment VLS. The same applies to the fourth power supply terminal 284. When the fourth power supply terminal 284 is at position P1, the center CT6 of the fourth power supply terminal 284 coincides with the virtual line segment VLS. When the fourth power supply terminal 284 is at position P2 or P3, the center CT6 of the fourth power supply terminal 284 does not coincide with the virtual line segment VLS.

[0201] According to the embodiment, at least one of the third power supply terminal 283 and the fourth power supply terminal 284 for supplying power to the second heater element via the bypass layer 250 is provided at a position that overlaps with the virtual line segment VLS connecting the center CT3 of the first power supply unit 831, which supplies power to the first heater line 833, and the center CT4 of the second power supply unit 832. By providing the hot spots, the third power supply terminal 283 and the fourth power supply terminal 284, between the cool spots, the first power supply unit 831 and the second power supply unit 832, temperature unevenness can be canceled out. Therefore, it is possible to improve the uniformity of the in-plane temperature distribution of the object to be processed W while suppressing the complexity of temperature control.

[0202] Furthermore, it is preferable that at least one of the central CT5 of the third power supply terminal 283 and the central CT6 of the fourth power supply terminal 284 be located at a position that overlaps with the virtual line segment VLS. In other words, it is preferable that at least one of the central CT5 of the third power supply terminal 283 and the fourth power supply terminal 284 be at position P1. This makes it possible to improve the uniformity of the in-plane temperature distribution of the object W being processed.

[0203] In this example, the first zone 810 includes the outer edge 810e of the first heater element. That is, in this example, the first zone 810 is located at the outermost periphery of the first heater element. In this example, the first zone 810 also has an inner periphery 851 and an outer periphery 852. The inner periphery 851 and outer periphery 852 are substantially the same as the inner periphery 851 and outer periphery 852 in Figure 16 above, so their description is omitted.

[0204] In this example, both the first power supply unit 831 and the second power supply unit 832 are provided on the inner circumference 851 of the first zone 810. When the first zone 810 is located at the outermost periphery of the first heater element, it is preferable that at least one of the first power supply unit 831 and the second power supply unit 832 is provided on the inner circumference 851 of the first zone 810.

[0205] In this specification, "provided on the inner circumference 851" of the first power supply section 831 means that at least a part of the first power supply section 831 overlaps with the inner circumference 851 in the Z direction. In other words, even if the first power supply section 831 is provided on the boundary between the inner circumference 851 and the outer circumference 852, it is considered to be provided on the inner circumference 851. To put it another way, if the first power supply section 831 does not overlap with the inner circumference 851 in the Z direction, it is considered to be provided on the outer circumference 852. The same applies to the second power supply section 832, the third power supply section 931, and the fourth power supply section 932.

[0206] According to the embodiment, when the first zone 810 includes the outer peripheral edge 810e of the first heater element (i.e., in the first zone 810 located at the outermost periphery of the first heater element), at least one of the first power supply unit 831 and the second power supply unit 832 is provided in the inner peripheral portion 851 of the first zone 810, where the temperature tends to be higher than that of the outer peripheral portion 852. By providing the first power supply unit 831 and the second power supply unit 832, which are cool spots, in the inner peripheral portion 851 of the first zone 810, which is a hot spot, a significant drop in temperature in the cool spots can be suppressed. In other words, temperature unevenness can be offset. Therefore, the uniformity of the in-plane temperature distribution of the object to be processed W can be improved.

[0207] Figure 18 is a schematic plan view showing the first zone of the heater section according to the fifth embodiment. As shown in Figure 18, in this example, the first power supply unit 831 and the second power supply unit 832 are located in the central region 811 of the first zone 810. Otherwise, it is substantially the same as the first zone of the heater unit according to the fourth embodiment shown in Figure 17.

[0208] More specifically, the first zone 810 has a central region 811 and an outer region 812. In this example, the central region 811 is the region between the center line RL12 and the center line RL13. That is, the central region 811 is the interior of the region enclosed by the center line RL12 and the center line RL13. The outer region 812 is located between the center line RL12 and the inner perimeter 821, and between the center line RL13 and the outer perimeter 822. Otherwise, it is substantially the same as the central region 811 and outer region 812 in Figure 15 above.

[0209] In this example, both the first power supply unit 831 and the second power supply unit 832 are located in the central region 811 of the first zone 810. Preferably, at least one of the first power supply unit 831 and the second power supply unit 832 is located in the central region 811 of the first zone 810.

[0210] In this specification, "the first power supply unit 831 is provided in the central region 811" means that at least a part of the first power supply unit 831 overlaps with the central region 811 in the Z direction. In other words, even if the first power supply unit 831 is provided on the boundary between the central region 811 and the outer peripheral region 812, it is considered that the first power supply unit 831 is provided in the central region 811. To put it another way, if the first power supply unit 831 does not overlap with the central region 811 in the Z direction, it is considered that the first power supply unit 831 is provided in the outer peripheral region 812. The same applies to the second power supply unit 832, the third power supply unit 931, and the fourth power supply unit 932.

[0211] According to this embodiment, at least one of the first power supply unit 831 and the second power supply unit 832 is located in the central region 811 of the first zone 810, where the temperature tends to be higher than that of the outer peripheral region 812. By overlapping the first power supply unit 831 and the second power supply unit 832, which are cool spots, with the central region 811 of the first zone 810, which is a hot spot, a significant drop in temperature in the cool spots can be suppressed. In other words, temperature unevenness can be canceled out. Therefore, the uniformity of the in-plane temperature distribution of the object to be processed W can be improved.

[0212] In this example as well, at least one of the third power supply terminal 283 and the fourth power supply terminal 284 for supplying power to the second heater element via the bypass layer 250 is positioned to coincide with the virtual line segment VLS connecting the center CT3 of the first power supply unit 831, which supplies power to the first heater line 833, and the center CT4 of the second power supply unit 832. By positioning the hot spots, the third power supply terminal 283 and the fourth power supply terminal 284, between the cool spots, the first power supply unit 831 and the second power supply unit 832, temperature unevenness can be canceled out. Therefore, it is possible to improve the uniformity of the in-plane temperature distribution of the object to be processed W while suppressing the complexity of temperature control.

[0213] The embodiment may include the following configurations.

[0214] (Composition 1) A ceramic dielectric substrate having a first main surface on which the object to be processed is placed, and a second main surface opposite to the first main surface, A base plate having an upper surface on the ceramic dielectric substrate side, a lower surface opposite to the upper surface, and a refrigerant flow path for a cooling medium, and supporting the ceramic dielectric substrate, A heater section for heating the ceramic dielectric substrate, Equipped with, The heater section comprises a first heater element, a bypass layer which is a power supply path to the first heater element, and a first power supply terminal and a second power supply terminal electrically connected to the bypass layer. The first heater element is provided between the first main surface and the upper surface, The first heater element has multiple zones, The plurality of zones of the first heater element have a first zone, The first zone includes a first heater line that generates heat when an electric current flows through it, and a first power supply unit and a second power supply unit that supply power to the first heater line. The first power supply unit is provided in a position that does not overlap with the first power supply terminal in the Z direction perpendicular to the first main surface, and is electrically connected to the first power supply terminal via the bypass layer. The second power supply unit is provided in a position in the Z direction that does not overlap with the second power supply terminal, and is electrically connected to the second power supply terminal via the bypass layer. The first heater line has a plurality of extending portions that extend along a first direction and are aligned in a second direction perpendicular to the first direction, and a plurality of protruding portions provided on the plurality of extending portions that project in the second direction, The plurality of extensions include a first extension and a second extension, The plurality of protrusions include a first protrusion provided on the first extension and a second protrusion provided on the second extension. The first projection protrudes toward the second projection, The second projection protrudes toward the first projection, The first zone has a first opposing region in which the first protrusion and the second protrusion are arranged adjacent to each other and facing each other. The first opposing region is provided in a position that overlaps with at least one of the first power supply terminal and the second power supply terminal in the Z direction, and is an electrostatic chuck.

[0215] (Configuration 2) The first zone, when viewed along the Z direction, has a central region located in the center of the first zone and an outer peripheral region located outside the central region. The first opposing region is the electrostatic chuck according to configuration 1, provided in the central region.

[0216] (Composition 3) The plurality of zones of the first heater element are divided radially, The electrostatic chuck according to configuration 1 or 2, wherein the first direction is the circumferential direction.

[0217] (Composition 4) The plurality of zones of the first heater element are divided radially, The electrostatic chuck according to configuration 1 or 2, wherein the first direction is the radial direction.

[0218] (Composition 5) The plurality of extensions further include a third extension located between the first extension and the second extension in the second direction. The electrostatic chuck according to any one of configurations 1 to 4, wherein the third extension portion is provided in a position that does not overlap with the first and second protrusions in the second direction.

[0219] (Composition 6) The plurality of protrusions further have a third protrusion provided on the first extension and projecting toward the second protrusion, The electrostatic chuck according to any one of configurations 1 to 5, wherein the third protrusion is arranged adjacent to and opposite the second protrusion.

[0220] (Composition 7) A ceramic dielectric substrate having a first main surface on which the object to be processed is placed, and a second main surface opposite to the first main surface, A base plate having an upper surface on the ceramic dielectric substrate side, a lower surface opposite to the upper surface, and a refrigerant flow path for a cooling medium, and supporting the ceramic dielectric substrate, A heater section for heating the ceramic dielectric substrate, Equipped with, The heater section comprises a first heater element, a second heater element, a bypass layer which is a power supply path to the first heater element and the second heater element, and a first power supply terminal, a second power supply terminal, a third power supply terminal, and a fourth power supply terminal electrically connected to the bypass layer. The first heater element is provided between the first main surface and the upper surface, The second heater element is provided between the first main surface and the first heater element or between the first heater element and the upper surface. The first heater element has multiple zones, The plurality of zones of the first heater element have a first zone, The first zone includes a first heater line that generates heat when an electric current flows through it, and a first power supply unit and a second power supply unit that supply power to the first heater line. The first power supply unit is provided in a position that does not overlap with the first power supply terminal in the Z direction perpendicular to the first main surface, and is electrically connected to the first power supply terminal via the bypass layer. The second power supply unit is provided in a position in the Z direction that does not overlap with the second power supply terminal, and is electrically connected to the second power supply terminal via the bypass layer. The second heater element has multiple zones, The plurality of zones of the second heater element have a second zone, The second zone includes a second heater line that generates heat when current flows through it, and a third power supply unit and a fourth power supply unit that supply power to the second heater line. The third power supply unit is provided in a position that does not overlap with the third power supply terminal in the Z direction, and is electrically connected to the third power supply terminal via the bypass layer. The fourth power supply unit is provided in a position that does not overlap with the fourth power supply terminal in the Z direction, and is electrically connected to the fourth power supply terminal via the bypass layer. An electrostatic chuck wherein at least one of the third power supply terminal and the fourth power supply terminal is provided at a position that coincides with a virtual line segment connecting the center of the first power supply unit and the center of the second power supply unit in the Z direction.

[0221] (Composition 8) The electrostatic chuck according to configuration 7, wherein at least one of the centers of the third power supply terminal and the fourth power supply terminal is located at a position that coincides with the virtual line segment.

[0222] (Composition 9) The first zone, when viewed along the Z direction, has a central region located in the center of the first zone and an outer peripheral region located outside the central region. At least one of the first power supply unit and the second power supply unit is an electrostatic chuck according to configuration 7 or 8, provided in the central region.

[0223] (Composition 10) The first zone includes the outer edge of the first heater element, The first zone has an inner circumferential portion located radially inside the radial center line that bisects the first zone radially, and an outer circumferential portion located radially outside the radial center line and including the outer edge, At least one of the first power supply unit and the second power supply unit is provided on the inner circumference of the electrostatic chuck according to configuration 7 or 8.

[0224] As described above, according to the embodiment, an electrostatic chuck is provided that can improve the uniformity of the in-plane temperature distribution of the object to be processed while suppressing the complexity of temperature control.

[0225] Embodiments of the present invention have been described above. However, the present invention is not limited to these descriptions. Modifications made by those skilled in the art to the above-described embodiments are also included within the scope of the present invention, as long as they retain the features of the present invention. For example, the shape, dimensions, material, arrangement, and mounting configuration of each element of the electrostatic chuck are not limited to those exemplified and can be modified as appropriate. Furthermore, the elements of each of the embodiments described above can be combined to the extent technically possible, and these combinations are also included within the scope of the present invention insofar as they include the features of the present invention. [Explanation of Symbols]

[0226] 10 Electrostatic Chuck 100 Ceramic dielectric substrates 101 First Main Surface 102 Second Main Surface 111 Electrode layer (adsorption electrode) 113 Convex part 115 Groove 200 Heater section 210 1st support plate 211 sides 220 First insulating layer 231 Subheater element 231a, 231b First and second sub-power supply units 231c Sub-heater line 231e Outer edge 232 Main Heater Element 232a, 232b First and second main power supply sections 232c Main heater line 232e Outer edge 240 Second insulating layer 245 Third insulating layer 250 Bypass Layer 251, 251a~251j Bypass section 260 Fourth insulating layer 270 Second support plate 271 sides 273 holes 280, 280a~280j power supply terminals 281-284 1st-4th power supply terminals 300 base plate 301 Refrigerant flow path 302 Top surface 303 Bottom surface 321 Introductory path 600, 601-603 Main Zone 700, 701a~701f, 702a~702f subzones 701, 702 1st, 2nd area 810 Zone 1 810e outer edge 811 Central area 812 Outer area 815 center 821 Inner end 822 Outer edge 823, 824 side edge 831, 832 First and Second Power Supply Units 833 First Heater Line 834 Extension 834a~834c 1st~3rd extension part 835 Folded section 836 Protrusion 836a~836e 1st~5th protrusion 838 Corner 841~845 1st~5th opposing area 851 Inner circumference 852 Outer perimeter 910 Zone 2 911 Central area 912 Outer area 915 center 921 Inner end 922 Outer edge 923, 924 side edge 931, 932 Third and Fourth Power Supply Units 933 Second Heater Line CL11~CL13, CL21~CL23 center line CT1~CT6 center Dc circumferential direction Dr radial direction LM1~LM3, LS1, LS2 Radial width RL11~RL13, RL21~RL23 center line VL1~VL8 Virtual Lines W - Items to be processed

Claims

1. A ceramic dielectric substrate having a first main surface on which the object to be processed is placed, and a second main surface opposite to the first main surface, A base plate having an upper surface on the ceramic dielectric substrate side, a lower surface opposite to the upper surface, and a refrigerant flow path for a cooling medium, and supporting the ceramic dielectric substrate, A heater section for heating the ceramic dielectric substrate, Equipped with, The heater section comprises a first heater element, a bypass layer which is a power supply path to the first heater element, and a first power supply terminal and a second power supply terminal electrically connected to the bypass layer. The first heater element is provided between the first main surface and the upper surface, The first heater element has a plurality of zones, The plurality of zones of the first heater element have a first zone, The first zone includes a first heater line that generates heat when an electric current flows through it, and a first power supply unit and a second power supply unit that supply power to the first heater line. The first power supply unit is provided in a position that does not overlap with the first power supply terminal in the Z direction perpendicular to the first main surface, and is electrically connected to the first power supply terminal via the bypass layer. The second power supply unit is provided in a position that does not overlap with the second power supply terminal in the Z direction, and is electrically connected to the second power supply terminal via the bypass layer. The first heater line has a plurality of extending portions that extend along a first direction and are aligned in a second direction perpendicular to the first direction, and a plurality of protruding portions provided on the plurality of extending portions that project in the second direction, The plurality of extensions include a first extension and a second extension. The plurality of protrusions include a first protrusion provided on the first extension and a second protrusion provided on the second extension. The first projection protrudes toward the second projection, The second projection protrudes toward the first projection, The first zone has a first opposing region in which the first protrusion and the second protrusion are arranged adjacent to each other and facing each other. The first opposing region is provided in a position that overlaps with at least one of the first power supply terminal and the second power supply terminal in the Z direction, and is an electrostatic chuck.

2. The first zone, when viewed along the Z direction, has a central region located in the center of the first zone and an outer peripheral region located outside the central region. The electrostatic chuck according to claim 1, wherein the first opposing region is provided in the central region.

3. The plurality of zones of the first heater element are divided radially, The electrostatic chuck according to claim 1, wherein the first direction is the circumferential direction.

4. The plurality of zones of the first heater element are divided radially, The electrostatic chuck according to claim 1, wherein the first direction is the radial direction.

5. The plurality of extensions further have a third extension located between the first extension and the second extension in the second direction. The electrostatic chuck according to any one of claims 1 to 4, wherein the third extension is provided in a position that does not overlap with the first protrusion and the second protrusion in the second direction.

6. The plurality of protrusions further have a third protrusion provided on the first extension and projecting toward the second protrusion, The electrostatic chuck according to any one of claims 1 to 4, wherein the third protrusion is arranged adjacent to and opposite to the second protrusion.

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