Method for repairing printed circuit boards and method for manufacturing recycled printed circuit boards

Abstract

To provide a method for repairing a printed circuit board and a method for manufacturing a recycled printed circuit board.SOLUTION: A method for repairing a printed circuit board on which a pad 110 or a pattern is damaged or peeled off, includes: an application step of applying a photoresist 410 to a predetermined range of a printed circuit board 100; an exposure step of, after the application step, performing exposure by using layout data of a circuit pattern of a repair portion to plate the circuit pattern; a developing step of, after the exposure step, removing an unnecessary part of the photoresist 410 by using developer; a plating step of, after the developing step, plating the predetermined range of the printed circuit board with a metal having conductivity; and a shaving step of, after the plating step, shaving the predetermined range until the predetermined range becomes flat.SELECTED DRAWING: Figure 14

Description

Technical Field

[0001] The present invention relates to a method for repairing a printed wiring board and a method for manufacturing a regenerated printed wiring board.

Background Art

[0002] In the manufacturing process of semiconductors such as ICs (Integrated Circuits), first, circuit pattern design is carried out, and a mask manufacturing process for drawing the designed circuit pattern on the surface of a glass plate is performed.

[0003] This glass plate becomes a master (original plate) for transferring the circuit to a wafer.

[0004] Next, a wafer manufacturing process for manufacturing a silicon wafer is performed, and a pre-process for baking the circuit pattern on the manufactured wafer is performed.

[0005] In the wafer manufacturing process, cutting of a silicon ingot and polishing of the fabricated wafer are performed.

[0006] In the pre-process, an oxide film is formed on the wafer surface, and a thin film of various materials is formed thereon to form a circuit pattern.

[0007] Also, in the pre-process, a wafer test is performed by contacting a probe (needle) with each of the hundreds of chips formed on the wafer to check for electrical problems.

[0008] Next, the wafer is cut into chips (dicing), the chips are fixed to a lead frame, the chips and the lead frame are connected with gold wires (wire bonding), and then a post-process of molding is performed to package the chips with resin to protect them from scratches and impacts.

[0009] In the post-process, after package assembly, an electrical characteristic test (final test) and an appearance inspection are performed.

Prior Art Documents

[0010] [Patent Document 1] Japanese Patent Publication No. 2005-166750 [Overview of the project] [Problems that the invention aims to solve]

[0011] In the final test, the IC is installed into an IC socket mounted on a performance board (test board for the tester) to connect the IC to the tester, and the test is performed.

[0012] The pads on the performance board and the IC sockets are connected by spring probes (pogo pins).

[0013] However, during final testing, when the IC is pressed into the IC socket, the spring probe may come into contact with the pads on the performance board, potentially damaging or peeling off the pads or patterns.

[0014] There was a problem where if even one pad was damaged or detached, contact resistance would increase or contact would become impossible, potentially rendering the performance board unusable.

[0015] Patent Document 1 describes a wiring repair method and wiring repair apparatus for repairing broken wires formed on electrical circuit boards such as liquid crystal panels, semiconductor substrates, and printed wiring boards.

[0016] This wiring repair method involves applying a masking agent to a wide area of ​​the broken wire on an electronic circuit board, in a plan view, and irradiating it with laser light. After removing the masking agent from the wiring area including the broken wire, a solution containing a conductive substance is applied to the wiring area from which the masking agent has been removed. This solution containing the conductive substance is then heated by irradiating it with laser light, causing a thin film of the conductive substance to deposit and connect the broken wire.

[0017] This ensures that the shape of the connection point for a broken wire matches the shape of the wiring on the electronic circuit board, allowing for precise repair of the wiring according to that shape.

[0018] However, the invention described in Patent Document 1 has the problem that it is difficult to use if the pads on a printed circuit board such as a performance board are damaged or peeled off.

[0019] Similar problems also occur in wafer testing during the wafer inspection process.

[0020] Specifically, the spring probe presses against the performance board during each wafer test, but if the position of the performance board pads and the position of the spring probe are not precisely aligned, the pads may be damaged or detached.

[0021] The objective of this invention is to repair damaged or detached printed circuit boards.

[0022] Another object of the present invention is to provide a method for repairing a damaged or detached printed circuit board.

[0023] Another object of the present invention is to provide a method for manufacturing recycled printed circuit boards. [Means for solving the problem]

[0024] The method for repairing a printed wiring board according to the first aspect of the present invention is a method for repairing a printed wiring board in which a pad or a pattern is damaged or peeled off, and a plating step of plating a predetermined range of the printed wiring board with a conductive metal; after the plating step, a scraping step of scraping the predetermined range until the predetermined range becomes flat; an application step of applying a photoresist to the portion scraped in the scraping step; after the application step, an exposure step of exposing using the layout data of the circuit pattern at the repair location and baking the circuit pattern; after the exposure step, a development step of removing unnecessary photoresist portions with a developer; after the development step, an etching step of performing etching to remove the unnecessary conductive metal along the circuit pattern and regenerating the circuit pattern at the repair location, which is a method for repairing a printed wiring board.

[0025] The scraping step may be to scrape until the conductive metal of the pattern provided on the printed wiring board is exposed.

[0026] With such a method, the circuit pattern can be easily regenerated, and the discarded printed wiring board can be used again.

[0027] The method for repairing a printed wiring board according to the second aspect of the present invention is a method for repairing a printed wiring board in which a pad or a pattern is damaged or peeled off, and an application step of applying a photoresist to a predetermined range of the printed wiring board; after the application step, an exposure step of exposing using the layout data of the circuit pattern at the repair location and baking the circuit pattern; after the exposure step, a development step of removing unnecessary photoresist portions with a developer; after the development step, a plating step of plating a predetermined range of the printed wiring board with a conductive metal; The method for repairing a printed circuit board includes a step of grinding down the predetermined area after the plating step until the predetermined area is flat.

[0028] Even this method of repairing printed circuit boards produces the same effect as the first phase.

[0029] A third aspect of the present invention relates to a method for repairing a printed circuit board, which is a method for repairing a printed circuit board in which a pad or pattern is damaged or peeled off, A grinding step in which a predetermined area of ​​the printed circuit board is ground down until the resin is reached, A plating step in which the portion removed by the aforementioned cutting step is plated with a conductive metal, After the plating process, a coating step is performed in which a photoresist is applied to the portion plated by the plating process. After the coating step, an exposure step is performed in which the circuit pattern is exposed using the layout data of the circuit pattern of the repair area to burn the circuit pattern into the surface. After the exposure step, a developing step is performed to remove unwanted photoresist portions with a developing solution. The method for repairing a printed circuit board includes an etching step, which, after the development step, involves etching to remove unnecessary conductive metal along the circuit pattern and regenerate the circuit pattern at the repair location.

[0030] Even this method of repairing printed circuit boards produces the same effect as the first and second phases.

[0031] A fourth aspect of the present invention relates to a method for repairing a printed circuit board in which a pad or pattern is damaged or peeled off, A grinding step in which a predetermined area of ​​the printed circuit board is ground down until the predetermined area is flat, The method for repairing a printed circuit board includes, after the aforementioned grinding step, a circuit printing step of printing a circuit pattern on a predetermined area of ​​the printed circuit board with a conductive metal.

[0032] This method of repairing printed circuit boards eliminates the need for plating, masking, and etching processes, and allows for easy restoration of circuit patterns, enabling the reuse of discarded printed circuit boards.

[0033] A fifth aspect of the present invention relates to a method for repairing a printed circuit board, which is a method for repairing a printed circuit board in which a pad or pattern is damaged or peeled off. An ink coating step of applying conductive ink to a predetermined area of ​​the printed circuit board, After the coating process, the printed circuit board The aforementioned A laser process is performed to draw the layout of the circuit pattern at the repair location on a surface coated with conductive ink using a laser beam within a predetermined range. The method for repairing a printed circuit board includes a cleaning step after the laser step, in which a cleaning solution is used to remove any unwanted conductive ink.

[0034] This method of repairing printed circuit boards eliminates the need for plating, masking, and etching processes, and allows for easy restoration of circuit patterns, enabling the reuse of discarded printed circuit boards.

[0035] A sixth aspect of the present invention relates to a method for repairing a printed circuit board in which a pad or pattern is damaged or peeled off, A pre-treatment process to grind down the pad portion that has been crushed and protruded from the designated area, After the aforementioned pretreatment step, an ink application step is performed in which conductive ink is applied to a predetermined area of ​​the printed circuit board. After the ink application step, a firing step is performed to fire the applied conductive ink, After the firing process, a coating step is performed to apply a photoresist to a predetermined area of ​​the printed circuit board. After the coating step, an exposure step is performed in which the circuit pattern is exposed using the layout data of the circuit pattern of the repair area to burn the circuit pattern into the surface. After the exposure step, a developing step is performed to remove unwanted photoresist portions with a developing solution. The method for repairing a printed circuit board includes an etching step, which, after the development step, involves etching to remove unnecessary conductive metal along the circuit pattern and regenerate the circuit pattern at the repair location.

[0036] Even with this type of printed circuit board repair method, the circuit pattern can be easily restored, allowing discarded printed circuit boards to be reused.

[0037] The seventh aspect of the present invention relates to a method for repairing a printed circuit board, which is a method for repairing a printed circuit board relating to the first to third aspects, and includes a circuit pattern step in which nickel plating and gold plating are performed after the etching step to regenerate the circuit pattern.

[0038] The eighth aspect of the present invention relates to a method for manufacturing a recycled printed circuit board, which is a printed circuit board in which the pads or patterns are damaged or peeled off. Recycled printed circuit boards using A method for manufacturing, A plating step in which a predetermined area of ​​the printed circuit board is plated with a conductive metal, After the plating process, a machining process is performed in which the predetermined range is machined until the predetermined range is flat. A coating step in which a photoresist is applied to the portion removed by the aforementioned cutting step, After the coating step, an exposure step is performed in which the circuit pattern is exposed using the layout data of the circuit pattern of the repair area to burn the circuit pattern into the surface. After the exposure step, a developing step is performed to remove unwanted photoresist portions with a developing solution. The method for manufacturing a printed circuit board includes an etching step, after the development step, in which etching is performed to remove unnecessary conductive metal along the circuit pattern and to regenerate the circuit pattern at the repair location.

[0039] This method makes it possible to manufacture recycled printed circuit boards.

[0040] A method for manufacturing a recycled printed circuit board according to the ninth aspect of the present invention is a printed circuit board in which the pads or patterns are damaged or peeled off. Recycled printed circuit boards using A method for manufacturing, A coating step of applying photoresist to a predetermined area of ​​the printed circuit board, After the coating step, an exposure step is performed in which the circuit pattern is exposed using the layout data of the circuit pattern of the repair area to burn the circuit pattern into the surface. After the exposure step, a developing step is performed to remove unwanted photoresist portions with a developing solution. After the development process, a plating process is performed in which a predetermined area of ​​the printed circuit board is plated with a conductive metal. The method for manufacturing a printed circuit board includes a machining step, after the plating step, in which the predetermined range is machined until the predetermined range is flat.

[0041] Even this method produces the same effect as the manufacturing method relating to the eighth phase.

[0042] A method for manufacturing a recycled printed circuit board according to the tenth aspect of the present invention is a printed circuit board in which the pads or patterns are damaged or peeled off. Recycled printed circuit boards using A method for manufacturing, A grinding step in which a predetermined area of ​​the printed circuit board is ground down until the resin is reached, A plating step in which the portion removed by the aforementioned cutting step is plated with a conductive metal, After the plating process, a coating step is performed in which a photoresist is applied to the portion removed by the cutting process. After the coating step, an exposure step is performed in which the circuit pattern is exposed using the layout data of the circuit pattern of the repair area to burn the circuit pattern into the surface. After the exposure step, a developing step is performed to remove unwanted photoresist portions with a developing solution. The method for manufacturing a printed circuit board includes an etching step, after the development step, in which etching is performed to remove unnecessary conductive metal along the circuit pattern and to regenerate the circuit pattern at the repair location.

[0043] Such a manufacturing method will produce the same effect as the manufacturing methods relating to the eighth and ninth phases.

[0044] A method for manufacturing a refurbished printed circuit board according to the eleventh aspect of the present invention is a method for refurbishing a printed circuit board in which the pads are damaged or peeled off. Recycled printed circuit boards using A method for manufacturing, A grinding step in which a predetermined area of ​​the printed circuit board is ground down until the predetermined area is flat, The method for manufacturing a printed wiring board includes a circuit printing step, after the aforementioned grinding step, printing a circuit pattern on a predetermined area of ​​the printed wiring board with a conductive metal.

[0045] This manufacturing method eliminates the need for plating, masking, and etching processes, and allows for the production of recycled printed circuit boards.

[0046] A method for manufacturing a recycled printed circuit board according to the twelfth aspect of the present invention is a method for manufacturing a recycled printed circuit board using a printed circuit board in which the pads or patterns are damaged or peeled off, An ink coating step of applying conductive ink to a predetermined area of ​​the printed circuit board, After the coating step, a laser step is performed in which a circuit pattern is drawn on the conductive ink in a predetermined area of ​​the printed circuit board using a laser beam, and after the laser step, Cleaning Remove unwanted conductive ink portions using a liquid. Cleaning This is a method for manufacturing a printed circuit board, including the process.

[0047] Even with this manufacturing method, plating, masking, and etching processes are unnecessary, and recycled printed circuit boards can be manufactured.

[0048] A method for manufacturing a recycled printed circuit board according to the thirteenth aspect of the present invention is a printed circuit board in which the pads or patterns are damaged or peeled off. Recycled printed circuit boards using A method for manufacturing, A pre-treatment process to grind down the pad portion that has been crushed and protruded from the designated area, After the aforementioned pretreatment step, an ink application step is performed in which conductive ink is applied to a predetermined area of ​​the printed circuit board. After the ink application step, a firing step is performed to fire the applied conductive ink, After the firing process, a coating step is performed to apply a photoresist to a predetermined area of ​​the printed circuit board. After the coating step, an exposure step is performed in which the circuit pattern is exposed using the layout data of the circuit pattern of the repair area to burn the circuit pattern into the surface. After the exposure step, a developing step is performed to remove unwanted photoresist portions with a developing solution. The method for manufacturing a printed circuit board includes an etching step, after the development step, in which etching is performed to remove unnecessary conductive metal along the circuit pattern and to regenerate the circuit pattern at the repair location.

[0049] Even with this manufacturing method, recycled printed circuit boards can be produced.

[0050] The method for manufacturing a recycled printed circuit board according to the 14th surface of the present invention is a method for manufacturing a recycled printed circuit board according to the 8th to 10th surface, and includes a circuit pattern step in which nickel plating and gold plating are performed after the etching step to regenerate the circuit pattern. [Brief explanation of the drawing]

[0051] [Figure 1] A plan view of a printed circuit board according to one embodiment of the present invention. [Figure 2] A plan view of the printed circuit board of the same embodiment. [Figure 3] A plan view of a copper-plated printed circuit board according to the same embodiment. [Figure 4] A conceptual diagram of the side cross-section of a copper-plated printed circuit board according to the same embodiment. [Figure 5] A plan view of the printed circuit board of the same embodiment with a portion removed. [Figure 6]A conceptual diagram of a side cross-section of the printed circuit board of the same embodiment, with a portion of it removed. [Figure 7] A conceptual diagram of a side cross-section of the printed circuit board of the same embodiment, with a portion of it removed. [Figure 8] A conceptual diagram of a side cross-section of the printed circuit board of the same embodiment, with a portion of it removed. [Figure 9] A flowchart illustrating a method for repairing a printed circuit board according to one embodiment of the present invention. [Figure 10] A conceptual diagram of a side cross-section of a printed circuit board according to one embodiment of the present invention. [Figure 11] A conceptual diagram of the side cross-section of the printed circuit board of the same embodiment. [Figure 12] A conceptual diagram of the side cross-section of the printed circuit board of the same embodiment. [Figure 13] A conceptual diagram of the side cross-section of the printed circuit board of the same embodiment. [Figure 14] A flowchart illustrating a method for repairing a printed circuit board according to one embodiment of the present invention. [Figure 15] A flowchart illustrating a method for repairing a printed circuit board according to one embodiment of the present invention. [Figure 16] A conceptual diagram of a side cross-section of a printed circuit board according to one embodiment of the present invention. [Figure 17] A conceptual diagram of the side cross-section of the printed circuit board of the same embodiment. [Figure 18] A conceptual diagram of the side cross-section of the printed circuit board of the same embodiment. [Figure 19] A flowchart illustrating a method for repairing a printed circuit board according to one embodiment of the present invention. [Modes for carrying out the invention]

[0052] Embodiments of the present invention will be described below with reference to the drawings. <First Embodiment> Figure 1 shows an example of a performance board 100 in which the pad 110 on the resin 200 is damaged and peeled off. Figure 9 is a flowchart of the repair method or the manufacturing method of a refurbished printed circuit board according to the first embodiment.

[0053] The surface of a printed circuit board does not have a solder resist coating, and there are areas where metal foil such as copper or gold is exposed; these areas are called pads or lands.

[0054] Pads are used for soldering surface-mount components or for inputting and outputting signals from the middle of a circuit, and they come in square or circular shapes.

[0055] Lands are located around through-holes and are used to pass leaded components through the through-holes for soldering.

[0056] A pattern, in printed circuit boards, refers to the electrically conductive wiring created on the circuit board using copper foil. On performance boards, wiring is routed outwards from multiple pads arranged in a row, using patterns.

[0057] As shown in Figures 3 and 4, first, a predetermined area of ​​the performance board 100, including the pads 110 or patterns, is plated with copper 310 (step S11, plating process). Specifically, the frame A of the predetermined area shown in Figure 2 is plated with copper.

[0058] This results in copper plating over the crushed or peeled pad 110 or pattern.

[0059] In this embodiment, the pads are plated with copper 310, but before plating with copper 310, the pads 110 or patterns may be crushed, and any portion of the pads 110 or patterns that extends beyond the original pad or pattern area may be scraped off to prevent short circuits between the pads 110 or patterns.

[0060] Any portion of the pad 110 or pattern that extends beyond the original pad 110 or pattern area may be dissolved by etching, burned with a laser, or blown away with a CO2 blaster or the like.

[0061] Furthermore, while a performance board is used in this embodiment, other types of printed circuit boards may also be used.

[0062] In this embodiment, copper is used, but other conductive metals such as gold or silver may also be used.

[0063] Next, as shown in Figures 5 and 6, the copper-plated portion B is scraped from above (scraped state C), exposing the original circuit pattern copper 320 (pad 110 or pattern) as represented by C (step S12, scraping process).

[0064] Specifically, the copper 310 plated portion B is scraped down to the gold and nickel portions of the original circuit pattern, exposing the copper 320 of the original circuit pattern.

[0065] In other words, the copper-plated portion B is scraped away until the copper of the original circuit pattern is exposed (reached the base).

[0066] As a result, as shown in Figure 6, the copper 320 in the original circuit pattern and the plated copper 310 become planar (flat).

[0067] Furthermore, a "circuit pattern" refers to a pattern created using conductive metal foil, such as copper foil.

[0068] Furthermore, in this embodiment, the cutting process is carried out until the copper 320 plated on the original circuit pattern is exposed, but it is sufficient if the surface becomes flat (planar, flat), and it is not necessary to expose the copper 320.

[0069] Next, as shown in Figure 7, photoresist 410 is applied to the scraped portion C (step S13, coating step).

[0070] Next, after the photoresist 410 coating process, the scraped area C is exposed to light using a photomask 500 with the same layout (layout data) as the circuit pattern of the repair area (scraped area C) (step S14, exposure process).

[0071] In other words, light is shone through the photomask 500 to imprint the circuit pattern.

[0072] In this embodiment, the layout (layout data) of the circuit pattern at the repair location is used, but it does not necessarily have to be the same layout (layout data) as before the repair; any repairable layout (layout data) is acceptable.

[0073] In this embodiment, the photomask 500 is irradiated with light while in contact with the photoresist 410.

[0074] The photomask may be irradiated with light from a distance through a reduction lens without contacting the photoresist 410, thereby imprinting the circuit pattern.

[0075] A "photomask" is a component used in the manufacturing process of integrated circuits such as LSIs. It is a transparent glass plate with a very fine circuit pattern etched onto its surface light-shielding film, and it serves as the master plate when transferring the circuit onto a silicon wafer.

[0076] Next, the unwanted photoresist portion is removed with a developing solution (step S15, developing process).

[0077] Next, etching is performed to remove unwanted copper along the circuit pattern, as shown in Figure 8, and to regenerate the original circuit pattern (Step S16, etching process).

[0078] Etching methods include wet etching, which uses aqueous solutions of acids or alkalis, and dry etching, which uses plasma generated from gases.

[0079] Next, nickel plating and gold plating are performed to restore the circuit pattern (step S17, second plating process).

[0080] <Second Embodiment> Figures 10 to 13 show a method for repairing a printed circuit board or a method for repairing a refurbished printed circuit board according to the second embodiment. Figure 14 is a flowchart of a method for repairing a printed circuit board or a refurbished printed circuit board according to the second embodiment. As shown in Figure 10, the pads 110 or patterns are crushed, and the portion of the pads 110 or patterns that extends beyond the original pad or pattern area is scraped off to prevent short circuits between the pads 110 or patterns (step S21, pre-treatment step).

[0081] Pads that extend beyond the original pad 110 or pattern area may be dissolved by etching or blown away with a CO2 blaster or the like.

[0082] Next, as shown in Figure 10, a photoresist 410 is applied to a predetermined area of ​​the performance board 100 (step S22, coating step).

[0083] "Photoresist" refers to a liquid chemical substance primarily composed of polymers, photosensitive agents, and solvents that reacts to light and has the ability to withstand etching.

[0084] Photoresist 410 is deposited, for example, by spin coating, and the film thickness is several hundred nanometers to several micrometers.

[0085] "Spin coating" refers to a coating method that uses a device that utilizes high-speed centrifugal force to form a coating film on a flat substrate.

[0086] In photoresist 410, the parts that receive light undergo a chemical reaction, changing the polarity and molecular weight of the polymer, thereby adding developability.

[0087] Solder resist 400 is the solder resist that was on the printed circuit board before repair.

[0088] Specifically, Solder Resist 400 is an ink that covers the surface of a printed circuit board (PWB) and acts as an insulating film to protect the circuit pattern.

[0089] Next, as shown in Figure 11, the solder resist 400 and photoresist 410 are masked with the photomask 500 and exposed (step S23, exposure step).

[0090] This process burns the circuit pattern of the area being repaired.

[0091] Next, the photoresist 410 on the masked pad 110 or pattern area is removed using a developer (step S24, development step).

[0092] In the case of positive film, the photoresist 410 is removed from the areas that were exposed to light, and in the case of negative film, it is removed from the areas that were not exposed to light. However, either positive or negative film can be used.

[0093] In this embodiment, a positive type is used, and the photoresist 410 in the exposed area is removed.

[0094] Next, as shown in Figure 12, a predetermined area is plated with copper 310 (step S25, plating process). Specifically, this is the same as in Figure 3 of the first embodiment.

[0095] Next, as shown in Figure 13, in order to remove the copper 310 between the pads 110, the top is scraped down to the height of the original pad 110, exposing the copper 320 of the pad 110 (step S26). , cutting process Specifically, it is the same as in Figure 5 of the first embodiment.

[0096] Furthermore, the height to be removed from the circuit pattern only needs to be flat, and it is not necessary to remove it down to the original height of the circuit pattern as long as the copper 310 between the pads 110 is removed.

[0097] Next, nickel plating and gold plating are performed to restore the circuit pattern (step S27, second plating process).

[0098] As shown in Figure 13, by leaving the photoresist 410 around the copper 310 (the area around the pad 110 is covered with photoresist 410), deformation of the pad 110 by the spring probe can be prevented.

[0099] In other words, even if the spring probe makes contact with the pad 110 at a position offset from the center, the presence of photoresist 410 around the pad 110 supports the spring probe, preventing partial damage to the pad 110 due to the pressure of the spring probe.

[0100] <Third Embodiment> As shown in Figure 15, in the third embodiment, first a predetermined portion of frame A is shaved down to the resin 200 (step S31, shaving process).

[0101] In other words, not only the damaged pad 110 within the predetermined range of frame A, but also the undamaged pads 110 (copper 320), etc., are ground down until they reach the resin 200.

[0102] As with the first and second embodiments, the material only needs to be sanded to a flat surface, and it is not necessary to sand until the resin 200 is reached. Alternatively, the resin 200 may also be sanded.

[0103] Next, the removed portion is plated with copper 310 (step S32, plating process).

[0104] Next, photoresist 410 is applied to the plated area (step S33, coating process).

[0105] Next, using the photomask 500 of the circuit pattern layout (layout data) of the repair area, exposure is performed (step S34). exposure process).

[0106] Next, etching is performed to remove unwanted copper 310 along the circuit pattern and regenerate the original circuit pattern (step S35, etching process).

[0107] Next, nickel plating and gold plating are performed to restore the circuit pattern (step S36, second plating process).

[0108] <Fourth Embodiment> Furthermore, although plating was performed with copper 310 in the first to third embodiments, instead of plating, a conductive ink such as conductive Cu nano ink may be applied and fired to deposit copper.

[0109] Specifically, as shown in Figures 16 to 19, first, the pad 110 is crushed, and the portion of the pad that extends beyond the original pad 110 area is shaved off to prevent short circuits between the pads 110 (step S41, pre-treatment step).

[0110] Any portion of the pad that extends beyond the original pad 110 area can be dissolved by etching or blown away with a CO2 blaster or similar device.

[0111] Next, as shown in Figure 16, conductive Cu nano ink 600 is applied to a predetermined area (step S42, ink application step).

[0112] Next, the coated conductive Cu nano ink 600 is irradiated with a xenon lamp to sinter the conductive Cu nano ink 600 and deposit copper 610 (step S43, sintering step).

[0113] In this embodiment, the conductive Cu nano ink 600 is fired by irradiation with a xenon lamp, but it may also be fired by irradiation with LED light or laser light.

[0114] Next, as shown in Figure 17, photoresist 410 is applied onto the deposited copper 610 (step S44, coating step).

[0115] In this embodiment, the conductive Cu nano ink 600 is fired and then the photoresist 410 is applied. However, a surface grinding process may be performed before applying the photoresist 410 to flatten the surface.

[0116] Next, after applying the photoresist 410, exposure is performed using a photomask 500 with the same layout as the circuit pattern of the repair area (step S45). exposure process).

[0117] Next, the photoresist 410 on the masked pad 110 or pattern area is removed using a developer (step S46, development step).

[0118] Next, as shown in Figure 18, etching is performed to remove unwanted copper 610 along the circuit pattern and regenerate the original circuit pattern (step S47, etching process).

[0119] Next, nickel plating and gold plating are performed to restore the circuit pattern (step S48, second plating process).

[0120] <Other Embodiments> In the first to third embodiments, plating was performed with copper 310, but instead of plating, the circuit pattern may be directly printed using a 3D printer with a conductive metal such as copper, silver, or gold (circuit printing process).

[0121] In this case, since the circuit pattern is printed, the plating, masking, and etching processes are unnecessary.

[0122] Furthermore, in the first to fourth embodiments, a photomask 500 was used to regenerate the original circuit pattern, but ultraviolet laser light may also be used (laser process).

[0123] In other words, instead of using the photomask 500, the circuit pattern can be directly drawn onto the photoresist 410 using ultraviolet laser light to regenerate the original circuit pattern (laser process).

[0124] After the laser process, the photoresist 410 on the masked pad 110 or pattern area is removed using a developer (development process).

[0125] After the circuit pattern is restored, an etching process is used to remove unwanted copper along the circuit pattern.

[0126] Furthermore, in the first to fourth embodiments, unnecessary copper was removed along the circuit pattern by etching to regenerate the original circuit pattern. However, the circuit pattern may also be regenerated by printing the circuit pattern using a conductive ink such as conductive Cu nano ink by inkjet or gravure printing (circuit printing step), and then firing the conductive ink (firing step) to deposit metal such as copper.

[0127] In this case, since the circuit pattern is drawn directly, the plating process, exposure The etching process is not required.

[0128] The present invention can also be implemented in various improved, modified, or altered forms without departing from its spirit. [Explanation of Symbols]

[0129] 100 Performance Boards (Printed Circuit Boards) 110 pads 200 Resin (Prepreg Resin) 310 Copper 320 Copper 400 Solder Resist 410 Photoresist 500 Photomasks 600 Conductive Cu Nano Ink

Claims

1. A method for repairing a printed circuit board in which a pad or pattern is damaged or peeled off, A coating step of applying photoresist to a predetermined area where the pads or patterns of the printed circuit board are damaged or peeled off, After the coating step, an exposure step is performed in which the circuit pattern is exposed using the layout data of the circuit pattern of the repair area to burn the circuit pattern into the surface. After the exposure step, a developing step is performed to remove unwanted photoresist portions with a developing solution. After the development step, a plating step is performed in which the predetermined area of ​​the printed circuit board is plated with a conductive metal. The process includes, after the plating process, a grinding step in which the predetermined range is ground down until the predetermined range is flat, A method for repairing printed circuit boards by leaving a photoresist around a conductive metal.

2. A method for manufacturing printed circuit boards for regeneration, A plating process in which a predetermined area of ​​a printed circuit board is plated with a conductive metal, After the plating process, a machining process is performed in which the predetermined range is machined until the predetermined range is flat. A coating step in which a photoresist is applied to the portion removed by the aforementioned cutting step, After the coating step, an exposure step is performed in which the circuit pattern is exposed using the layout data of the circuit pattern of the repair area to burn the circuit pattern into the surface. After the exposure step, a developing step is performed to remove unwanted photoresist portions with a developing solution. After the development process, etching is performed to remove unnecessary conductive metal along the circuit pattern and to regenerate the circuit pattern at the repair location. A method for manufacturing a printed circuit board, comprising a second plating step of performing nickel plating or gold plating after the etching step to regenerate the circuit pattern.

3. A method for manufacturing printed circuit boards for regeneration, A coating step of applying photoresist to a predetermined area where a pad or pattern on a printed circuit board is damaged or peeled off, After the coating step, an exposure step is performed in which the circuit pattern is exposed using the layout data of the circuit pattern of the repair area to burn the circuit pattern into the surface. After the exposure step, a developing step is performed to remove unwanted photoresist portions with a developing solution. After the development step, a plating step is performed in which the predetermined area of ​​the printed circuit board is plated with a conductive metal. The process includes, after the plating process, a grinding step in which the predetermined range is ground down until the predetermined range is flat, A method for manufacturing a printed circuit board, in which a photoresist is left around a conductive metal.

4. A method for manufacturing printed circuit boards for regeneration, A grinding process in which a predetermined area of ​​the printed circuit board is ground down until the resin is reached, A plating step in which the portion removed by the aforementioned cutting step is plated with a conductive metal, After the plating process, a coating step is performed in which a photoresist is applied to the portion removed by the cutting process. After the coating step, an exposure step is performed in which the circuit pattern is exposed using the layout data of the circuit pattern of the repair area to burn the circuit pattern into the surface. After the exposure step, a developing step is performed to remove unwanted photoresist portions with a developing solution. After the development process, etching is performed to remove unnecessary conductive metal along the circuit pattern and to regenerate the circuit pattern at the repair location. A method for manufacturing a printed circuit board, comprising a second plating step of performing nickel plating or gold plating after the etching step to regenerate the circuit pattern.

5. A method for manufacturing printed circuit boards for regeneration, A pre-treatment process to grind down the pad portion that has been crushed and protruded from the designated area, After the pretreatment step, an ink application step is performed in which conductive ink is applied to the predetermined area of ​​the printed circuit board. After the ink application step, a firing step is performed to fire the applied conductive ink, After the firing process, a coating step is performed to apply a photoresist to the predetermined area of ​​the printed circuit board. After the coating step, an exposure step is performed in which the circuit pattern is exposed using the layout data of the circuit pattern of the repair area to burn the circuit pattern into the surface. After the exposure step, a developing step is performed to remove unwanted photoresist portions with a developing solution. After the development process, etching is performed to remove unwanted metal deposited from the conductive ink along the circuit pattern, thereby regenerating the circuit pattern at the repaired area. A method for manufacturing a printed circuit board, comprising a second plating step of performing nickel plating or gold plating after the etching step to regenerate the circuit pattern.

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