Manufacturing methods for electronic components

Abstract

To provide a method for manufacturing an electronic component capable of easily removing an insulation film in an end part of a conductive wire.SOLUTION: A method for manufacturing an electronic component includes the steps of: preparing a conductive wire including a conductor and an insulation film; removing the insulation film; and forming a terminal electrode. The insulation film covers the conductor. In the insulation film removing step, an insulation film located in an end part of a conductive wire is removed by irradiating the insulation film located in the end part with plasma. In the insulation film removing step, a terminal electrode is formed using the end part from which the insulation film has been removed.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] This disclosure relates to a method for manufacturing electronic components. [Background technology]

[0002] Electronic components equipped with conductive wires are known (for example, Patent Document 1). In Patent Document 1, the terminal electrodes are formed using the ends of conductive wires. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2000-164431 [Overview of the Initiative] [Problems that the invention aims to solve]

[0004] In electronic components, conductive wires covered with an insulating coating may be used to ensure insulation. In this case, it is conceivable to remove the insulating coating from the ends of the conductive wire. Machining can be difficult to remove the insulating coating from the ends of conductive wires, and there is a risk of damaging the ends of the conductive wires. When the insulating coating of conductive wires is removed by laser processing, there is a risk of damage to the conductive wire due to a rapid rise in temperature.

[0005] One aspect of this disclosure provides a method for manufacturing an electronic component in which an insulating coating can be easily removed from the end of a conductive wire. [Means for solving the problem]

[0006] A method for manufacturing an electronic component in one aspect of the present disclosure includes the steps of: preparing a conductive wire containing a conductor and an insulating coating; removing the insulating coating; and forming terminal electrodes. The insulating coating covers the conductor. In the step of removing the insulating coating, the insulating coating located at the end of the conductive wire is removed by irradiation of the insulating coating at the end. In the step of forming terminal electrodes, terminal electrodes are formed using the end from which the insulating coating has been removed.

[0007] In the process of removing the insulating coating in the manufacturing method of this electronic component, the insulating coating located at the end of the conductive wire is removed by irradiating the insulating coating at the end with plasma. In this case, the insulating coating can be selectively removed from the conductive wire while minimizing damage to the conductive wire. Therefore, the insulating coating can be easily removed at the end of the conductive wire.

[0008] In one embodiment described above, the process may further include a step of forming a defect in the insulating coating located at the end of the conductive wire. In the step of removing the insulating coating, plasma may be irradiated onto the insulating coating on which the defect has been formed. In this case, the insulating coating can be easily removed by plasma treatment, starting from the defect. Damage to the conductive wire can be further suppressed.

[0009] In one embodiment described above, during the process of forming a defect, the conductor located at the end of the conductive wire may be deformed by pressing the end of the conductive wire. In this case, a defect can be easily formed in the insulating coating by the deformation of the conductor.

[0010] In one of the above embodiments, during the process of forming a defect, a thin-walled portion may be formed at the end of the conductive wire by pressing the end of the wire. The thin-walled portion may have a thickness smaller than the maximum width of the conductive wire. In this case, a defect can be formed in the insulating coating even more easily by deformation of the conductor.

[0011] In one aspect, when the maximum width of the portion of the conductive wire other than the thin portion is r1 and the maximum length in the width direction of the thin portion is r2, 1.00 ≦ r2 / r1 ≦ 1000 may be satisfied. In this case, due to the deformation of the conductor, defects can be more easily formed in the insulating film.

[0012] In one aspect, the thin portion may have a pair of main surfaces facing each other. Due to the deformation of the conductor, defects can be more easily formed in the insulating film.

[0013] In one aspect, it may further have a step of bending the conductive wire. A part of the conductive wire may be covered by a resin molding part. The pair of main surfaces may include a first main surface and a second main surface. The first main surface of the bent conductive wire may be in contact with the outer surface of the resin molding part. In this case, terminal electrodes can be easily formed on the outer surface of the resin molding part by the ends of the conductive wire.

[0014] In one aspect, in the step of removing the insulating film, plasma may be irradiated on the second main surface of the pair of main surfaces. In this case, terminal electrodes that are electrically connected to other electronic components by mounting the electronic components can be easily formed.

[0015] In one aspect, it may further have a step of forming a resin molding part. The resin molding part may be formed before the step of bending the conductive wire. When the resin molding part is formed before the conductive wire is bent, it is easy to handle the conductive wire in the step of forming the resin molding part.

[0016] In one aspect, in the step of forming a defect, the ambient temperature around the end may be 50°C or higher and 250°C or lower. In this case, the conductor can be more easily deformed. Defects can be appropriately formed at the ends of the conductive wire.

[0017] In one of the above aspects, the plasma may be water vapor plasma. In this case, the rate of exposing the end of the conductive wire from the insulating film is improved. At the surface of the conductor at the end, the oxide is reduced. Formation of an oxide film on the surface of the conductive wire can be suppressed. Therefore, the manufacturing throughput is improved, and a desired electrical resistance value can be ensured at the end of the conductive wire.

[0018] In one of the above aspects, the conductive wire may form a coil inside the resin molding part. In this case, the insulating film prevents a short circuit in the coil, and a desired resistance value can be ensured in the coil.

[0019] In one of the above aspects, the cross-sectional area of the conductive wire is 7.85×10 -11 m 2 or more and 1×10 -8 m 2 or less may be acceptable. Even with such a configuration, the insulating film at the end of the conductive wire can be easily removed by irradiation with plasma. Miniaturization of the electronic component can be achieved, and the characteristics of the electronic component can also be ensured. For example, when the conductive wire forms a coil, a desired inductance can be ensured in the coil.

Advantages of the Invention

[0020] One aspect of the present disclosure provides a method for manufacturing an electronic component in which an insulating film can be easily removed at the end of a conductive wire.

Brief Description of the Drawings

[0021] [Figure 1] It is a perspective view of the electronic component in the present embodiment. [Figure 2] It is a perspective view of the electronic component. [Figure 3] (a) to (c) are diagrams for explaining the cross-sectional shape of the conductive coil. [Figure 4] It is a flowchart showing an example of the method for manufacturing the electronic component in the present embodiment. [Figure 5]Figures (a) through (c) show a part of the manufacturing process in an example of an electronic component manufacturing method. [Figure 6] (a) through (c) are diagrams illustrating a bent conductive wire. [Figure 7] This diagram shows a part of the manufacturing process in an example of an electronic component manufacturing method. [Figure 8] This diagram shows a part of the manufacturing process in an example of an electronic component manufacturing method. [Figure 9] This diagram shows a part of the manufacturing process in an example of an electronic component manufacturing method. [Figure 10] (a) and (b) are diagrams showing a part of the manufacturing process in an example of an electronic component manufacturing method. [Figure 11] (a) is a diagram showing the characteristics of an electronic component, and (b) is a diagram showing the state of conductive wires in an electronic component. [Figure 12] (a) and (b) are diagrams showing the state of conductive wires in electronic components. [Figure 13] This diagram shows the state of conductive wires in electronic components. [Modes for carrying out the invention]

[0022] Embodiments of this disclosure will be described in detail below with reference to the attached drawings. In the description of the drawings, the same reference numerals are used for identical or equivalent elements, and redundant descriptions are omitted. Furthermore, the shapes of the various elements shown in the drawings of this disclosure do not necessarily match the actual shapes of the various elements, as they may have been modified for illustrative purposes. In this disclosure, "orthogonal," "perpendicular," "parallel," "planar," "identical," and "equal" mean "substantially orthogonal configuration," "substantially perpendicular configuration," "substantially parallel configuration," "substantially planar," "substantially identical configuration," and "substantially equal," respectively, and include configurations that are deviated within a predetermined tolerance range. The predetermined tolerance range includes, for example, the manufacturing tolerance range or a range greater than the manufacturing tolerance range.

[0023] First, an overview of the electronic components in this embodiment will be described with reference to Figures 1 and 2. Figures 1 and 2 are perspective views of the electronic components in this embodiment. In the example shown in this embodiment, electronic component 1 is a coil component that forms a coil.

[0024] The electronic component 1 comprises an outer casing 2, a pair of terminal electrodes 6 and 7, and a conductive wire 9. At least a portion of the conductive wire 9 is located inside the outer casing 2.

[0025] The outer casing 2 has an outer surface 10. The outer casing 2 has a pair of end faces 10a, a pair of side faces 10b, and a pair of side faces 10c as its outer surface 10. The pair of end faces 10a face each other in the Y-axis direction. The pair of side faces 10b face each other in the Z-axis direction. The pair of side faces 10c face each other in the X-axis direction. The pair of end faces 10a and the pair of side faces 10b are aligned along the X-axis direction. The outer surface 10 of the outer casing 2 includes at least one plane. For example, each of the pair of end faces 10a, the pair of side faces 10b, and the pair of side faces 10c is a plane. The X-axis direction, the Y-axis direction, and the Z-axis direction are orthogonal to each other.

[0026] In one example shown in this embodiment, the outer casing 2 has a rectangular parallelepiped shape in which the length in the Z-axis direction is smaller than the length in the Y-axis direction, and the length in the X-axis direction is smaller than the length in the Z-axis direction. The rectangular parallelepiped shape includes a rectangular parallelepiped shape in which the corners and edges are chamfered, and a rectangular parallelepiped shape in which the corners and edges are rounded. The outer casing 2 is formed of, for example, resin. As a modification of this embodiment, the outer casing 2 may have a rectangular parallelepiped shape in which the length in the Z-axis direction is smaller than the length in the Y-axis direction, and the length in the X-axis direction is smaller than the length in the Z-axis direction.

[0027] The pair of terminal electrodes 6 and 7 are arranged on the same plane. For example, the pair of terminal electrodes 6 and 7 are arranged on the same side surface 10b. Each of the pair of terminal electrodes 6 and 7 includes a thin-walled portion 20. The thin-walled portion 20 has a thickness smaller than the maximum width of the conductive wire 9. The thin-walled portion 20 may, for example, have a plate shape. The thin-walled portion 20 may, for example, have a rectangular shape in plan view.

[0028] The terminal electrode 6 has main surfaces 6a and 6b. The main surfaces 6a and 6b are a pair of planes facing each other in the Z-axis direction. The thin-walled portion 20 of the terminal electrode 6 has, for example, a pair of main surfaces 6a and 6b facing each other. The terminal electrode 7 has main surfaces 7a and 7b. The main surfaces 7a and 7b are a pair of planes facing each other in the Z-axis direction. The thin-walled portion 20 of the terminal electrode 7 has a pair of main surfaces 7a and 7b facing each other. The pair of main surfaces 6a and 6b and the pair of main surfaces 7a and 7b are, for example, planes. The thin-walled portion 20 may have irregularities on its surface and may be warped. The thickness of the thin-walled portion 20 may be non-uniform. The thin-walled portion 20 may, for example, have an oval shape in plan view.

[0029] The main surfaces 6a, 6b and 7a, 7b are, for example, perpendicular to the Z-axis direction. Main surfaces 6a and 7a are in contact with the same side surface 10b. The pair of terminal electrodes 6, 7 are, for example, located at both ends of the side surface 10b of the outer casing 2 in the Y-axis direction. The pair of terminal electrodes 6, 7 are spaced apart from each other and arranged in the Y-axis direction. Each terminal electrode 6, 7 has a rectangular shape in plan view, for example. Each terminal electrode 6, 7 extends in the X-axis direction. The longitudinal direction of each terminal electrode 6, 7 is along the X-axis direction, and the short direction of each terminal electrode 6, 7 is along the Y-axis direction. The short direction of each terminal electrode 6, 7 corresponds to the width direction of each terminal electrode 6, 7, i.e., the width direction of the thin-walled portion 20.

[0030] The conductive wire 9 includes a main body 11 and a pair of connecting parts 12 and 13. The main body 11 is located inside the outer casing 2. The pair of connecting parts 12 and 13 are each connected to the main body 11. In one example shown in this embodiment, the pair of connecting parts 12 and 13 are located inside the outer casing 2. In a variation of this embodiment, at least a portion of the pair of connecting parts 12 and 13 may be located outside the outer casing 2. In this disclosure, “connected” includes the meaning of being physically connected and being electrically connected even though they are physically separated. “Physically connected” includes the meaning of separate members that are in contact with each other and being integrated. “Electrically connected” means that they are electrically conductive. “Jointed” means that they are integrated by the same material or different materials. In other words, “jointed” means that they are formed continuously.

[0031] In one example shown in this embodiment, the main body 11 includes a coil 15. In other words, the conductive wire 9 forms a coil 15 inside the outer casing 2. The coil 15 forms a coil axis that, for example, is aligned with the X-axis direction. In other words, the coil axis of the coil 15 extends in the X-axis direction.

[0032] The pair of connectors 12 and 13 are spaced apart from each other. At least a portion of each connector 12 and 13 is exposed from the outer casing 2. The pair of connectors 12 and 13 are each connected to different terminal electrodes 6 and 7. The pair of connectors 12 and 13 are, for example, each connected to the ends of different coils 15. Each connector 12 and 13 forms a pair of ends of a conductive wire 9. For example, connector 12 is connected to the main surface 6a of terminal electrode 6. Connector 13 is connected to the main surface 7a of terminal electrode 7.

[0033] Each connecting portion 12, 13 includes an extended portion 21 and a curved portion 22. The extended portion 21 extends in a direction intersecting the side surface 10b. For example, each extended portion 21 extends in a direction perpendicular to the side surface 10b.

[0034] The curved portion 22 is curved. At each connection portion 12, 13, the curved portion 22 is connected to the extended portion 21. At connection portion 12, at least a portion of the curved portion 22 is exposed from the side surface 10b and connected to the terminal electrode 6. At connection portion 13, at least a portion of the curved portion 22 is exposed from the side surface 10b and connected to the terminal electrode 7. The curved portion 22 is curved, for example, from a direction intersecting the side surface 10b to a direction along the side surface 10b. In this disclosure, "curve" means "substantial curve," and includes not only structures formed by curved surfaces throughout, but also structures in which multiple planes are connected to form a curved shape as a whole.

[0035] For example, terminal electrode 6 is electrically connected to coil 15 through connection part 12. Terminal electrode 7 is electrically connected to coil 15 through connection part 13. For example, terminal electrode 6 and terminal electrode 7 are electrically connected to each other through a pair of connection parts 12, 13 and main body part 11.

[0036] Next, the detailed configuration of the electronic component 1 will be described with reference to Figures 1 to 3. The outer casing 2 includes a core portion 31 and a resin molded portion 32. The core portion 31 and the resin molded portion 32 are, for example, integrally molded from the same material. In a modified example of this embodiment, the core portion 31 and the resin molded portion 32 may be molded separately from the same or different materials. Even when the core portion 31 and the resin molded portion 32 are molded separately, the boundary between the core portion 31 and the resin molded portion 32 may be formed in such a way that it is not visible.

[0037] The core portion 31 is located inside the coil 15. The core portion 31 extends along the coil axis of the coil 15. The core portion 31 is in contact with the coil 15. For example, the coil 15 has a columnar shape extending in the X-axis direction. For example, the main body portion 11 of the conductive wire 9 is wound around the core portion 31. The coil 15 is wound around the core portion 31 in the circumferential direction. The coil 15 is wound helically around the core portion 31 with the core portion 31 as its axis.

[0038] The resin molded portion 32 forms the entire outer surface 10 of the outer body 2. The resin molded portion 32 forms a pair of end faces 10a, a pair of side faces 10b, and a pair of side faces 10c. The resin molded portion 32 covers the main body 11 of the conductive wire 9. In this disclosure, "cover" means to surround the object being covered so that it cannot be seen. "Cover" includes not only cases where the object is in direct contact with the object, but also cases where the object is separated from the object. For example, the resin molded portion 32 may cover the object from over other members, and may have portions where the object and the resin molded portion 32 are not in contact. For example, the core portion 31 may be covered by the resin molded portion 32 from over the conductive wire 9 wound around the core portion 31, and may have portions where the core portion 31 and the resin molded portion 32 are not in direct contact. In one example shown in this embodiment, the resin molded portion 32 is formed to be in contact with the conductive wire 9.

[0039] The core portion 31 and the resin molded portion 32 may be formed from, for example, only resin. The material of the core portion 31 and the resin molded portion 32 includes, for example, at least one of a thermosetting resin and a thermoplastic resin. The material of the core portion 31 and the resin molded portion 32 includes, as the thermosetting resin, at least one selected from the group consisting of epoxy resin, polyimide resin, phenolic resin, and unsaturated polyester resin. The polyimide resin is, for example, bismaleimide resin. The material of the core portion 31 and the resin molded portion 32 includes, for example, at least one selected from the group consisting of crystalline polystyrene, fluororesin, liquid crystal polymer, and polyphenylene sulfide (PPS). The fluororesin is, for example, polytetrafluoroethylene (PTFE) resin.

[0040] The conductive wire 9 includes a conductor 23 and an insulating coating 24. The conductor 23 corresponds to the core wire of the conductive wire 9. The insulating coating 24 covers the sides of the conductor 23. In the conductive wire 9, at least a portion of the conductor 23 at each connection point 12, 13 is exposed from the insulating coating 24. The conductor 23 at each connection point 12, 13 is connected to terminal electrodes 6, 7, respectively.

[0041] As an example shown in this embodiment, terminal electrodes 6 and 7 include a conductor 26 that is integrally formed with the conductor 23 of the conductive wire 9. For example, the thin-walled portion 20 is formed by the conductor 26. The conductor 26 of terminal electrode 6 forms the main surfaces 6a and 6b, and the conductor 26 of terminal electrode 7 forms the main surfaces 7a and 7b.

[0042] The materials of conductors 23 and 26 include, for example, at least one selected from the group consisting of oxygen-free copper, tough pitch copper, phosphorus-deoxidized copper, and copper-silver alloys. The material of the insulating coating 24 includes, for example, at least one selected from the group consisting of polyurethane, polyvinyl formal, polyester, polyesterimide, polyamideimide, and polyimide.

[0043] As a modification of this embodiment, the terminal electrodes 6 and 7 may include an insulating film that contacts the conductor 26. In this case, the insulating film that contacts the conductor 26 forms, for example, at least a part of the main surfaces 6a and 7a. Also in this case, the main surfaces 6b and 7b are formed by the conductor 26. For example, the main surfaces 6b and 7b are composed only of the conductor without including the insulating film. The material of the insulating film that contacts the conductor 26 among the terminal electrodes 6 and 7 is the same as, for example, the material of the insulating film 24.

[0044] The cross-sectional area of the conductive wire 9 is, for example, 7.85×10 -11 m 2 or more and 1×10 -8 m 2 or less. For example, the cross-sectional area of the main body portion 11 is 7.85×10 -11 m 2 or more and 1×10 -8 m 2 or less. In this specification, the "cross-sectional area" is the area of the cross-section. In this specification, the "cross-section" means the cross-section in the direction orthogonal to the direction in which the target portion extends.

[0045] In the direction orthogonal to the extending direction of the conductive wire 9, the maximum width of the conductor 23 of the conductive wire 9 is, for example, 10 μm or more and 100 μm or less. When the maximum width of the portion other than the thin portion 20 of the conductive wire 9 is r1 and the maximum length in the width direction of the thin portion 20 is r2, 1.00 ≦ r2 / r1 ≦ 1000 is satisfied. The maximum width of the portion other than the thin portion 20 of the conductive wire 9 corresponds to, for example, the maximum width of the conductive wire 9 in the coil 15. The maximum width of the portion other than the thin portion 20 of the conductive wire 9 corresponds to, for example, the maximum width of the portion of the conductive wire 9 covered by the exterior body 2. The width direction of the thin portion 20 corresponds to the direction orthogonal to the extending direction of the thin portion 20.

[0046] For example, the cross-section of the conductive wire 9 is circular, as shown in Figure 3(a). The diameter of the conductor 23 of the conductive wire 9 is, for example, 10 μm or more and 100 μm or less. As a modification of this embodiment, the cross-section of the conductive wire 9 may be polygonal, as shown in Figures 3(b) and 3(c). For example, the cross-section of the conductive wire 9 may be octagonal, as shown in Figure 3(b). For example, the cross-section of the conductive wire 9 may be triangular, as shown in Figure 3(c). The shape of the conductive wire 9 is not limited to the shapes described above. For example, the diameter of the conductive wire 9 is determined by the size and required characteristics of the coil 15.

[0047] Viewed from the Z-axis direction, the connecting portions 12 and 13 are arranged along a direction intersecting the pair of side surfaces 10c. For example, viewed from the Z-axis direction, connecting portion 12 is closer to one of the pair of side surfaces 10c, and connecting portion 13 is closer to the other of the pair of side surfaces 10c. Viewed from the Z-axis direction, connecting portion 12 is closer to one of the pair of end faces 10a, and connecting portion 13 is closer to the other of the pair of end faces 10a.

[0048] Next, an example of a method for manufacturing an electronic component in the above-described embodiment will be explained with reference to Figures 4 to 10(b). Figure 4 is a flowchart of an example of a method for manufacturing an electronic component 1. Figures 5(a) to 10(b) are diagrams showing a part of the manufacturing process in an example of a method for manufacturing an electronic component 1.

[0049] First, a conductive wire 41 is prepared (step S1). A portion of the conductive wire 41 corresponds to the conductive wire 9. The conductive wire 41 includes a conductor 23 and an insulating coating 24. The insulating coating 24 covers the sides of the conductor 23. The cross-sectional area of ​​the conductive wire 41 is, for example, 7.85 × 10⁻⁶. -11 m 2 The above 1 x 10 -8 m 2The following applies: In a direction perpendicular to the extending direction of the conductive wire 41, the maximum width of the conductive wire 41 is, for example, 10 μm or more and 100 μm or less. The cross-sectional area of ​​the conductor 23 of the conductive wire 41 is, for example, 7.85 × 10 -11 m 2 The above 1 x 10 -8 m 2 The following applies: In a direction perpendicular to the extending direction of the conductive wire 41, the maximum width of the conductor 23 of the conductive wire 41 is, for example, 10 μm or more and 100 μm or less. The shape of the conductive wire 41 is not limited to the shape described above. For example, the diameter of the conductive wire 41 is determined by the size of the coil to be formed and the required characteristics.

[0050] Next, the coil 50 is formed (step S2). Figure 5(a) shows the state in which the coil 50 has been formed by the conductive wire 41. A portion of the conductive wire 41 forms the coil 50. A portion of the coil 50 corresponds to the coil 15. The conductive wire 41 is wound around the winding shaft 43 to form the coil 50. In step S2, after the conductive wire 41 has been wound around the winding shaft 43, the unnecessary portions 45 located at both ends of the conductive wire 41 are removed. The conductive wire 41 formed in step S2 includes the coil 50 and a pair of ends 51 connected to both ends of the coil 50, respectively. The pair of ends 51 are located at both ends of the conductive wire 41 from which the unnecessary portions 45 have been removed, and form the tips of the conductive wire 41 from which the unnecessary portions 45 have been removed.

[0051] In step S2, for example, the conductive wire 41 is wound onto the winding shaft 43 by a flyer winding method. For example, the conductive wire 41 is wound onto the winding shaft 43 while being heated by a heater. The winding shaft 43 is formed of, for example, a cemented carbide. A portion of the insulating coating 24 covering the conductor 23 of the conductive wire 41 melts due to the heat of the heater and is fused to the winding shaft 43 in the shape it is wound on. The fusion of the insulating coating 24 suppresses the unwinding of the conductive wire 41 wound on the winding shaft 43. After the conductive wire 41 is wound onto the winding shaft 43, the unnecessary portion 45 is removed and the winding shaft 43 is removed from the coil 50. As a result, an air-core coil including the coil 50 is formed by the conductive wire 41. In a modified version of this embodiment, the unnecessary portion 45 may be removed after the winding shaft 43 has been removed from the coil 50.

[0052] Next, a defect 53 is formed (step S3). In step S3, a defect 53 is formed on each end 51 of the conductive wire 41. The defect 53 corresponds to, for example, a crack, split, hole, or scratch formed in the insulating coating 24. The defect 53 is formed on the insulating coating 24 located at the end 51 of the conductive wire 41.

[0053] For example, each end 51 is clamped and pressed by a press machine PL, as shown in Figure 5(b). Each end 51 is pressed with a pressure of, for example, 1 MPa to 10 MPa. For example, each end 51 is heated when it is pressed. For example, each end 51 is heated so that the ambient temperature around it is between 50°C and 250°C. Below 250°C, the conductive wire is less likely to be damaged. More preferably, each end 51 is heated so that the ambient temperature around it is between 50°C and 200°C. Below 200°C, if a fusion layer is provided on the conductive wire, the fusion layer can be formed more appropriately.

[0054] When the end portion 51 is pressed, the conductor 23 deforms due to the malleability of the conductor 23 at the end portion 51. As shown in Figure 5(c), the deformation of the conductor 23 causes multiple defects 53 to form in the insulating coating 24 covering the conductor 23.

[0055] A thin-walled portion 55 is formed on the end 51 by pressing. The thin-walled portion 55 includes a conductor 26 formed by a deformation of a part of the conductor 23 and an insulating coating 24. The part of the end 51 that is deformed by pressing forms the thin-walled portion 55. The thin-walled portion 55 has a thickness smaller than the maximum width of the conductive wire 41. The thin-walled portion 55 has, for example, a plate shape. The thin-walled portion 55 has, for example, a rectangular shape in plan view. The thin-walled portion 55 includes, for example, a pair of opposing main surfaces 58, 59. The pair of main surfaces 58, 59 are, for example, flat. The thin-walled portion 55 may have irregularities on its surface and may be warped. The thickness of the thin-walled portion 55 may be non-uniform. The thin-walled portion 55 may have, for example, an oval shape in plan view. If the main surface 58 is the first main surface, then the main surface 59 corresponds to the second main surface.

[0056] For example, the thin-walled portion 55 includes a plurality of defective portions 53. The thin-walled portion 55 includes a pair of edges 55a and 55b. The pair of edges 55a and 55b face each other in the longitudinal direction of the thin-walled portion 55. The connecting portion 56 is connected to edge 55b of the pair of edges 55a and 55b. In step S3, the end portion 51 where the defective portion 53 was formed includes the thin-walled portion 55 and the connecting portion 56 connected to the thin-walled portion 55. The connecting portion 56 corresponds to the connecting portions 12 and 13.

[0057] For example, if the maximum width of the conductive wire 41 in the portion other than the thin-walled portion 55 is r1, and the maximum length in the width direction of the thin-walled portion 55 is r2, then 1.00 ≤ r2 / r1 ≤ 1000 is satisfied. The maximum width of the conductive wire 41 in the portion other than the thin-walled portion 55 corresponds, for example, to the maximum width of the conductive wire 41 in the coil 50. The maximum width of the conductive wire 41 in the portion other than the thin-walled portion 55 corresponds, for example, to the maximum width of the conductive wire 41 that is covered by the resin molded portion 62 in step S5 described later. The width direction of the thin-walled portion 55 corresponds to the direction perpendicular to the extension direction of the thin-walled portion 55.

[0058] Next, the end portion 51 is bent (step S4). For example, as shown in Figures 6(a) to 6(c), the end portion 51 is bent at the connection portion 56. For example, the end portion 51 is bent by 90°. The bending of the end portion 51 forms a curved portion 22 connected to the extended portion 21 at the connection portion 56. Figure 6(a) is a partially enlarged view of the thin-walled portion 55 and the connection portion 56. Figure 6(b) shows the conductive wire 41 as viewed from the direction of extension of the coil axis of the coil 50. Figure 6(c) shows the conductive wire 41 as viewed from a direction perpendicular to the coil axis of the coil 50 and perpendicular to the main surfaces 58, 59 of the thin-walled portion 55.

[0059] Next, the molded product 61 is formed (step S5). For example, as shown in Figure 7, a plurality of conductive wires 41, each containing a coil 50, are arranged in the mold 70. Subsequently, as shown in Figure 8, resin is filled into the mold 70. The mold 70 filled with resin is placed in an oven. The resin filled into the mold 70 is dried while heated in the oven, and then cured by further heating. As a result, a molded product 61 is formed in which a plurality of coils 50 are sealed by the resin.

[0060] The molded product 61 includes a resin molded portion 62 formed from resin and a plurality of conductive wires 41. In the molded product 61, the thin-walled portion 55 of each conductive wire 41 is exposed from the resin molded portion 62. A portion of the conductive wire 41 is covered by the resin molded portion 62. At least the coil 50 is covered by the resin molded portion 62. The resin molded portion 62 corresponds to the outer casing 2. A portion of the conductive wire 41 is covered by the outer casing 2.

[0061] The main surface 58 of the bent conductive wire 41 is in contact with the outer surface of the resin molded portion 62. The main surface 59 of the bent conductive wire 41 is exposed from the resin molded portion 62. The molded product 61 includes a molded surface 61a. The molded surface 61a is formed by the main surface 59 of the thin-walled portion 55 and the resin molded portion 62. Multiple main surfaces 59 of the thin-walled portion 55 are arranged on the molded surface 61a.

[0062] Next, plasma treatment is performed (step S6). In step S6, plasma is irradiated onto the insulating coating 24 located at the end 51 of the conductive wire 41. By irradiating the insulating coating 24 located at the end 51 of the conductive wire 41 with plasma, the insulating coating 24 located at the end 51 is removed. The plasma is irradiated onto the insulating coating 24 where the defective portion 53 is formed.

[0063] For example, as shown in Figure 9, plasma is irradiated onto the thin-walled portions 55 arranged on the molding surface 61a. The plasma is irradiated onto the main surface 59 of the thin-walled portions 55. For example, as shown in Figure 10(a), the main surfaces 59 of multiple thin-walled portions 55 are arranged on the molding surface 61a. By irradiating with plasma, the insulating coating 24 on the main surface 59 of each thin-walled portion 55 is removed, as shown in Figure 10(b).

[0064] Terminal electrodes 6 and 7 are formed using the end portion 51 from which the insulating coating 24 has been removed. For example, terminal electrodes 6 and 7 are formed from the thin-walled portion 55 from which the insulating coating 24 has been removed from the main surface 59 of each thin-walled portion 55. The insulating coating 24 remains on the main surface 58 of the thin-walled portion 55 from which the insulating coating 24 has been removed in the order of steps S4, S5, and S6. At least the main surfaces 6b and 7b of terminal electrodes 6 and 7 are formed of conductor 26. For example, the main surfaces 6a and 7a of terminal electrodes 6 and 7 are formed of insulating coating 24.

[0065] For plasma irradiation, a mask 75 is used, for example, as shown in Figure 9. The mask 75 defines the area of ​​the molded product 61 to be irradiated with plasma. The mask 75 has a plurality of openings 76. The plurality of openings 76 are positioned to correspond to the positions of the main surface 59 of the thin-walled portion 55.

[0066] For example, the molded product 61 formed in step S5 is placed between a pair of electrodes. For example, the molded product 61 is placed on one side of the pair of electrodes. A mask 75 is placed between the other electrode and the molded product 61.

[0067] The multiple openings 76 are arranged such that, when viewed from the Z-axis direction, each opening 76 and the main surface 59 of the thin-walled portion 55 overlap when the mask 75 is fixed to the molded product 61. In other words, the mask 75 is positioned so that the plasma passing through each opening 76 is irradiated onto the main surface 59 of the thin-walled portion 55. The plasma treatment performed in step S6 is, for example, a water vapor plasma treatment. In this case, the water vapor plasma is irradiated toward the molded product 61.

[0068] Next, dicing is performed (step S7). In step S7, the molded product 61 on which multiple terminal electrodes 6 and 7 are formed is cut to form multiple chip components. Each chip component corresponds to an electronic component 1. A pair of terminal electrodes 6 and 7 on each chip component may be plated. This plating process may be electrolytic plating or electroless plating. At least the main surfaces 6b and 7b of the terminal electrodes 6 and 7 may be provided with a rust-preventive layer in addition to the plating layer formed by the plating process, and flux may also be applied.

[0069] As described above, for example, the electronic component 1 is formed by steps S1 to S7. The method for manufacturing the electronic component 1 may omit some of steps S1 to S7, or some of steps S1 to S7 may be replaced with different steps, and the order of the steps is not limited to the order described above. In particular, steps S4 to S6 may be performed in any order. Step S3 may be performed before step 6, after step S4, or after step S5. Step 5 may be performed before step 4.

[0070] If step S6 is performed before step S4 or step S5, plasma may be irradiated onto both the main surface 58 and the main surface 59 of the thin-walled portion 55. In this case, the insulating coating 24 on the main surface 58 and the main surface 59 is removed.

[0071] Next, the effects and advantages of the manufacturing method for the electronic component 1 in this embodiment and its modified form will be described.

[0072] In the process of removing the insulating coating 24 in the manufacturing method of the electronic component 1, the insulating coating 24 located at the end 51 of the conductive wire 41 is removed by irradiating the insulating coating 24 located at the end 51 of the conductive wire 41 with plasma. In this case, the insulating coating 24 can be selectively removed from the conductive wire 41 while suppressing damage to the conductive wire 41. Therefore, the insulating coating 24 can be easily removed at the end 51 of the conductive wire 41.

[0073] Even if the resin molded portion 62 and the insulating coating 24 are removed from the conductive wire 41, the properties will deteriorate if an oxide film is formed. If plasma is irradiated onto the end portion 51, the oxide film can be removed and its formation can be suppressed.

[0074] The manufacturing method described above further includes, for example, a step of forming a defect 53 in the insulating coating 24 located at the end 51 of the conductive wire 41. In the step of removing the insulating coating 24, plasma is irradiated onto the insulating coating 24 on which the defect 53 is formed. In this case, the insulating coating 24 can be easily removed by plasma treatment, starting from the defect 53. Damage to the conductive wire 41 can be further suppressed.

[0075] In the process of forming the defect portion 53 in the manufacturing method described above, the conductor 23 located at the end portion 51 is deformed by the pressing of the end portion 51 of the conductive wire 41. In this case, the deformation of the conductor 23 can easily form a defect portion 53 in the insulating coating 24.

[0076] In the process of forming the defect portion 53 in the manufacturing method described above, a thin-walled portion 55 is formed on the end portion 51 of the conductive wire 41 by pressing the end portion 51. The thin-walled portion 55 has a pair of main surfaces 58 and 59 that face each other. In this case, the defect portion 53 can be formed in the insulating coating 24 even more easily by deformation of the conductor 23.

[0077] In the manufacturing method described above, when the maximum width of the conductive wire 41 in the portion other than the thin-walled portion 55 is r1, and the maximum length in the width direction of the thin-walled portion 55 is r2, the condition 1.00 ≤ r2 / r1 ≤ 1000 is satisfied. In this case, a defect portion 53 can be more easily formed in the insulating coating 24 due to deformation of the conductor 23.

[0078] The manufacturing method described above further includes a step of bending the conductive wire 41. A portion of the conductive wire 41 is covered by a resin molded portion 62. The pair of main surfaces 58 and 59 include main surface 58 and main surface 59. The main surface 58 of the bent conductive wire 41 is in contact with the outer surface of the resin molded portion 62. In this case, terminal electrodes 6 and 7 can be easily formed on the outer surface of the resin molded portion 62 by the end 51 of the conductive wire 41.

[0079] In the process of removing the insulating coating 24 in the manufacturing method described above, plasma is irradiated onto the main surface 59 of the pair of main surfaces 58 and 59. In this case, terminal electrodes that are electrically connected to other electronic components by mounting the electronic component 1 can be easily formed.

[0080] The manufacturing method described above further includes a step of forming a resin molded part 62. The resin molded part 62 is formed before the step of bending the conductive wire 41. When the resin molded part 62 is formed before the conductive wire 41 is bent, the handling of the conductive wire 41 is easier in the step of forming the resin molded part 62.

[0081] In the process of forming the defect portion 53 in the manufacturing method described above, the ambient temperature around the end portion 51 is between 50°C and 250°C. In this case, the conductor 23 can be deformed more easily. The defect portion 53 can be properly formed at the end portion 51 of the conductive wire 41.

[0082] In the manufacturing method described above, the plasma may be a water vapor plasma. With a water vapor plasma, the cleaning of organic matter is five times faster than with a hydrogen plasma. Therefore, the speed at which the end 51 of the conductive wire 41 is exposed from the insulating coating 24 is improved compared to when other plasma treatments such as hydrogen plasma treatment are used. On the surface of the conductor 23 at the end 51, oxides are reduced. The formation of an oxide film on the surface of the conductor 23 can also be suppressed. Thus, the manufacturing throughput is improved, and a desired electrical resistance value can be ensured in the conductive wire 9.

[0083] According to the water vapor plasma treatment, the conductor 23 is surface-modified and made hydrophilic. For example, if the terminal electrodes 6 and 7 include a metal layer formed by plating or silver paste, improving the hydrophilicity of the conductor 23 can improve the adhesion between the metal layer and the conductor 23.

[0084] In the manufacturing method described above, the conductive wire 41 forms a coil 50 inside the resin molded part 62. In this case, the insulating coating 24 prevents short circuits in the coil 15, and a desired electrical resistance value can be ensured in the coil 15.

[0085] In the manufacturing method described above, the cross-sectional area of ​​the conductive wire 41 is 7.85 × 10 -11 m 2 The above 1 x 10 -8 m 2 The following applies. Even with this configuration, the insulating coating 24 on the end 51 of the conductive wire 41 can be easily removed by plasma irradiation. This allows for miniaturization of the electronic component 1 while also ensuring its characteristics. For example, when the conductive wire 9 forms a coil 15, a desired inductance can be ensured in the coil 15.

[0086] In the plasma irradiation step of the manufacturing method described above, a mask 75 having an opening 76 is positioned, and plasma passing through the opening 76 is irradiated onto the molded product 61. The opening 76 is positioned to correspond to the position of the main surface 59 of the thin-walled portion 55. In this case, the position of plasma irradiation onto the molded product 61 can be adjusted to a high degree of precision. Therefore, the portion of the molded product 61 that is removed by plasma irradiation can be selectively adjusted. Consequently, the versatility of the molded product 61 is improved.

[0087] Here, in order to explain the above effects, examples and comparative examples of this disclosure will be described with reference to Figures 11(a), 11(b), 12(a), 12(b), and 13. Note that this disclosure is not limited to the following examples. Here, an electronic component having the same configuration as electronic component 1 and an electronic component as a comparative example were fabricated, and their electrical resistance values ​​were confirmed.

[0088] The electronic components of Examples 1 to 6 were manufactured by steps S1 to S6 described above. The electronic components of Comparative Examples 1 and 2 were manufactured by omitting step S5 and performing step S6 after steps S1 to S4 described above.

[0089] In Examples 1-6 and Comparative Examples 1 and 2, the cross-section of the conductive wire 41 forming the coil 50 is circular. The outer diameter of the conductive wire 41 forming the coil 50 is 34 μm, and the diameter of the conductor of the conductive wire 41 forming the coil 50 is 25 μm. In step S2, each end 51 is pressed with a pressure of 1 MPa to 10 MPa to form a thin-walled portion 55.

[0090] As shown in Figure 11, in Examples 1 and 4, and Comparative Example 1, each end 51 was pressed with a pressure of 1 MPa. In Examples 2 and 5, each end 51 was pressed with a pressure of 5 MPa. In Examples 3 and 6, and Comparative Example 2, each end 51 was pressed with a pressure of 10 MPa. In Examples 1 to 3 and Comparative Examples 1 and 2, the ambient temperature around the end 51 when it was pressed was 23°C. In Examples 4 to 7, the ambient temperature around the end 51 when it was pressed was 50°C.

[0091] In the fabrication of the electronic components of Examples 1 to 6, the maximum width of the thin-walled portion 55 differs from one another, while the maximum width of the conductive wire 41 in the coil 50 is the same for both. In the electronic components of Comparative Examples 1 and 2, the maximum width of the thin-walled portion 55 differs from one another, while the maximum width of the conductive wire 41 in the coil 50 is the same for both. In the table in Figure 11(a), the maximum width of the conductive wire 41 in the portion other than the thin-walled portion 55 is r1, and the maximum length in the width direction of the thin-walled portion 55 is r2. Therefore, it is considered that the larger the value of "r2 / r1", the larger the defect portion 53 formed in the thin-walled portion 55.

[0092] In the electronic components of Examples 1 to 6, water vapor plasma treatment was performed in step S5. This water vapor plasma treatment was carried out under conditions of an output of 800 W, a flow rate of 20 sccm, and a pressure of 10 Pa. Since step S5 was omitted in Comparative Examples 1 and 2, the electronic components of Comparative Examples 1 and 2 were not subjected to plasma treatment.

[0093] In the electronic components of Examples 1 to 6 and Comparative Examples 1 and 2 formed as described above, the electrical resistance between a pair of terminal electrodes was measured. Each terminal electrode 6 and 7 was positioned on the outer surface and connected to a conductive wire 9. The pair of terminal electrodes 6 and 7 were each connected to different ends of the conductive wire 9.

[0094] As a result of the measurements, as shown in the table in Figure 11(a), the electrical resistance values ​​in Comparative Examples 1 and 2 exceeded the measurement limit. The electrical resistance values ​​in Examples 1 to 6 were 0.301 to 0.332 Ω. Thus, it was confirmed that the electrical resistance values ​​in Examples 1 to 6 were significantly reduced compared to the electrical resistance values ​​in Comparative Examples 1 and 2. Therefore, it was confirmed that the insulating coating 24 was removed by plasma treatment. The value of “r2 / r1” in Comparative Example 2 was equivalent to the value of “r2 / r1” in Example 2, but the electrical resistance value in Comparative Example 2 exceeded the measurement limit.

[0095] The table in Figure 11(b) shows the width and thickness of the thin-walled portion 55 formed in process S2. The graph in Figure 12(a) shows the relationship between the width of the thin-walled portion 55 formed in process S2 and the pressure applied to the end portion 51. The graph in Figure 12(b) shows the relationship between the thickness of the thin-walled portion 55 formed in process S2 and the pressure applied to the end portion 51. The width of the thin-walled portion 55 corresponds to the maximum length of the thin-walled portion 55 in the width direction.

[0096] In Examples 1 and 4, where the end portion 51 was pressed at 1 MPa, the width of the thin-walled portion 55 in Example 4 was greater than the width of the thin-walled portion 55 in Example 1. In Examples 2 and 5, where the end portion 51 was pressed at 5 MPa, the width of the thin-walled portion 55 in Example 5 was greater than the width of the thin-walled portion 55 in Example 2. In Examples 3 and 6, where the end portion 51 was pressed at 10 MPa, the width of the thin-walled portion 55 in Example 6 was greater than the width of the thin-walled portion 55 in Example 3. Therefore, it was confirmed that if the ambient temperature when the end portion 51 is pressed is heated, the width of the thin-walled portion 55 tends to increase. It was confirmed that if the ambient temperature around the end portion 51 is 50°C or higher, the width of the thin-walled portion 55 tends to increase.

[0097] The table in Figure 13 shows the change in maximum width due to pressing of the end 51 for each conductive wire 41 with different maximum widths. The maximum width of the conductive wire 41 before pressing is L1, and the maximum width of the conductive wire 41 after pressing is L2. As shown in Figure 13, it was confirmed that when the maximum width of the conductive wire 41 before pressing is 0.01 mm, the maximum width of the conductive wire 41 can be deformed to between 0.011 mm and 10 mm by pressing. When the maximum width of the conductive wire 41 before pressing is 0.1 mm, it was confirmed that the maximum width of the conductive wire 41 can be deformed to between 0.101 mm and 10 mm by pressing. Therefore, the condition 1.00 ≤ L2 / L1 ≤ 1000 is derived. Thus, it was confirmed that 1.00 ≤ r2 / r1 ≤ 1000 can be satisfied when the maximum width of the conductive wire 41 in the part other than the thin-walled portion 55 is r1, and the maximum length in the width direction of the thin-walled portion 55 is r2.

[0098] While embodiments and modifications of this disclosure have been described above, this disclosure is not necessarily limited to the embodiments and modifications described above, and various modifications are possible without departing from its essence.

[0099] For example, in the embodiments and modifications described above, the case was described in which the electronic component 1 is a coil component and the terminal electrodes 6 and 7 are connected to both ends of the coil 15, respectively. However, the electronic component 1 may include circuit elements other than a coil. In this case, the ends of the coil 15 may be connected to other circuit elements. The conductive wire 9 may not form the coil 15 but may be a lead wire connected to a circuit element inside the electronic component.

[0100] In the embodiments and modifications described above, the electronic component 1 includes a core portion 31 disposed inside the coil 15. However, the electronic component 1 does not necessarily have to include a core portion 31. The inside of the coil 15 may be hollow.

[0101] In the embodiments and modifications described above, the core portion 31 extends in the X-axis direction, which is shorter than the Y-axis direction. However, the core portion 31 may also extend in the Y-axis direction, which is longer than the Z-axis direction and the X-axis direction.

[0102] The terminal electrodes 6 and 7 may be formed separately from the conductor 23 of the conductive wire 9 and may include a metal layer electrically connected to the conductor 23. For example, the terminal electrodes 6 and 7 may be formed from a metal layer formed separately from the conductive wire 41 and the end portion 51 of the conductive wire 41 from which the insulating coating 24 has been removed.

[0103] For example, terminal electrodes 6 and 7 may be formed by placing a metal layer on a thin-walled portion 55 from which the insulating coating 24 has been removed. In this case, the metal layer is placed on the main surface 59 of the thin-walled portion 55. For example, the metal layer covers the main surface 59.

[0104] The thin-walled portion 55 does not necessarily have to be formed by the conductive wire 41. In this case as well, the terminal electrodes 6 and 7 may be formed by the metal layer and the end portion 51 of the conductive wire 41 from which the insulating coating 24 has been removed, or they may be formed by the metal layer alone. The thin-walled portion 20 may be formed by the metal layer and the conductive wire 9, or it may be formed by the metal layer alone.

[0105] The metal layers on the terminal electrodes 6 and 7 may be formed, for example, by sputtering. In this case, the metal constituting the metal layer can be densely deposited on the surface of the end portion 51 at the atomic level. Since contact of the surface of the end portion 51 with air is suppressed, the formation of an oxide film on the surface of the end portion 51 can also be suppressed. Therefore, the reliability of the electrical connection between the metal layer and the conductive wire 9 can be further improved. After the end portion 51 of the conductive wire 41 is formed without contact with air by plasma treatment, a metal layer may be formed on the surface of the formed end portion 51 without contact with air. In this case, the formation of an oxide film on the surface of the end portion 51 can be further suppressed. After the insulating coating 24 on the conductive wire 41 is removed without contact with air by plasma treatment, sputtering may be performed on the surface of the end portion of the conductive wire 41 without contact with air.

[0106] The above metal layer may be formed by a plating process. For example, the above metal layer may be formed by performing electroless plating followed by electroplating. In this case, after the electroless plating process has formed a more dense metal film on the surface of the end 51 than electroplating, the film formed by the electroless plating process can be thickened by the electroplating process. The speed of metal layer formation can also be further improved. Therefore, manufacturing throughput can be improved, and the reliability of the electrical connection between the conductive wire 9 and the metal layer can be ensured. The electroless plating process may include acid treatment of the surface of the end 51. The above electroless plating process may include acid treatment of the surface of the end of the conductive wire 41.

[0107] The above metal layer may be formed by drying the electrode paste after it has been applied to the resin molded part 32. The electrode paste is applied to the resin molded part 32 by, for example, a screen printing method. The electrode paste is, for example, silver paste. The above metal layer may also be formed by soldering. After the terminal electrodes 6 and 7 are formed by the above process, the terminal electrodes 6 and 7 may be further plated.

[0108] In step S2, the conductive wire 41 may be wound around a resin winding shaft to form a coil 50. After the conductive wire 41 is wound around the winding shaft, the winding shaft does not need to be removed from the coil 50. In this case, for example, the winding shaft is cut by dicing and forms part of the outer casing 2.

[0109] In the embodiments and modifications described above, the defect 53 is shown to be formed by pressing the end portion 51. However, the method of forming the defect 53 is not limited to this. For example, a part of the insulating coating 24 may be scraped off. In this case, the defect 53 corresponds to the scraped portion of the insulating coating 24.

[0110] Plasma treatment is not limited to water vapor plasma treatment. Plasma treatment may be, for example, oxygen plasma treatment or hydrogen plasma treatment. [Explanation of Symbols]

[0111] 1...Electronic component, 6,7...Terminal electrode, 41...Conductive wire, 10...Outer surface, 50...Coil, 55...Thin-walled section, 23,26...Conductor, 24...Insulating coating, 62...Resin molded section, 51...End section, 53...Defective section, 58,59...Main surface.

Claims

1. A step of preparing a conductive wire comprising a conductor and an insulating coating covering the conductor, A step of pressing the end of the conductive wire to deform the conductor located at the end, forming a defect in the insulating coating located at the end due to the deformation of the conductor, and forming a thin-walled portion at the end that includes a first main surface and a second main surface facing each other and having a thickness smaller than the maximum width of the conductive wire, A step of removing the insulating coating located at the end of the conductive wire by irradiating the insulating coating located at the end with plasma, The process includes a step of forming a terminal electrode using the end portion from which the insulating coating has been removed, A method for manufacturing an electronic component, wherein, in the step of removing the insulating coating, the plasma is irradiated onto the second main surface of the thin portion of the insulating coating on which the defective portion is formed.

2. The method for manufacturing an electronic component according to Claim 1, wherein the defective portion includes at least one of a crack, a split, a hole, and a scratch in the insulating coating.

3. When the maximum width of the conductive wire in the portion other than the thin-walled portion is r1, and the maximum length in the width direction of the thin-walled portion is r2, 1.00 ≤ r² / r¹ ≤ 1000 A method for manufacturing an electronic component according to claim 1 or 2, wherein the condition is met.

4. The process further includes bending the conductive wire, A portion of the conductive wire is covered by a resin-molded part formed from resin. The method for manufacturing an electronic component according to any one of claims 1 to 3, wherein the first main surface of the bent conductive wire is in contact with the outer surface of the resin molded portion.

5. The process further includes the step of forming the aforementioned resin molded part. The method for manufacturing an electronic component according to claim 4, wherein the resin molded portion is formed before the step of bending the conductive wire.

6. A method for manufacturing an electronic component according to any one of claims 1 to 5, wherein in the step of forming the defective portion, the ambient temperature around the end portion is 50°C or more and 250°C or less.

7. The method for manufacturing an electronic component according to any one of claims 1 to 6, wherein the plasma is a water vapor plasma.

8. A method for manufacturing an electronic component according to any one of claims 1 to 7, wherein a portion of the conductive wire forms a coil.

9. The cross-sectional area of ​​the conductive wire is 7.85 × 10 －１１ I understand ２ The above 1 x 10 －８ I understand ２ The method for manufacturing an electronic component according to any one of claims 1 to 8, as follows:

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