Method for manufacturing a resin bond and apparatus for manufacturing a resin bond

Abstract

To provide a production method and production device for a resin bonded body having little warpage and high bonding strength.SOLUTION: There is provided a production method for a resin bonded body in which a first resin member and a second resin member are directly bonded. The method comprises: a surface treatment step of activating bonding surfaces of the first resin member and / or the second resin member; a bonding step of, after the surface treatment step, bonding the first resin member and the second resin member with their surfaces to be bonded in contact with each other to form a resin bonded body; and a thermal diffusion step of, after the bonding step, heating the resin bonded body. A temperature of the resin bonded body in the thermal diffusion step is adjusted to be higher than a higher one of temperatures of the first resin member and the second resin member in the bonding step.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a resin bonded body having good optical characteristics, high bonding strength, and no warpage, and an apparatus for the resin bonded body.

Background Art

[0002] For the purpose of further miniaturization of semiconductor devices and improvement of the optical characteristics of optical devices, an adhesive-less bonding technique for bonding various members without an adhesive has been studied. Among them, in the bonding of resin members, after bringing the bonding surfaces (hereinafter referred to as bonding surfaces) of the respective resin members into contact, a lamination technique in which the resin members are heated to the melting temperature and welded is widely used. However, in this method, the crystallinity, molecular structure, etc. of the entire resin member change (thermal deterioration), which has an adverse effect on the optical characteristics and mechanical strength. In addition, when heating the resin member, the dimensions of the resin member change due to thermal expansion, and the amount of dimensional change of the resin member increases as the heating temperature increases. That is, when welding resin members having different linear expansion coefficients at a high temperature, there is a problem that the bonded body after bonding these resin members warps after heating due to the difference in the amount of dimensional change of the resin members during heating. Therefore, a method for manufacturing a resin bonded body for suppressing thermal deterioration of resin members and warpage between different members and obtaining a strong bonding force has been studied.

[0003] Patent Document 1 discloses a method in which the bonding surfaces of resin members are each subjected to plasma treatment, the bonding surfaces are brought into contact, heated and pressed below the glass transition temperature of the resin members to bond them, and then the bonded body is further heated.

[0004] Further, Patent Document 2 discloses a method in which a bonding film made of an organic group is formed on the bonding surface of a resin member, the bonding film is subjected to plasma treatment, and then the bonding film and the adherend are pressed and bonded at a low temperature.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

[0006] Both Patent Documents 1 and 2 describe how keeping the temperature of the resin components below their melting point during bonding provides a certain level of suppression against thermal deterioration of the resin components and warping of the bonded body.

[0007] However, the method described in Patent Document 1 does not specify the relationship between the temperature of the resin members during bonding and the heating temperature for the resin joint, and depending on the relationship between these temperatures, it is difficult to manufacture a resin joint that is free from warping and has a strong bonding force.

[0008] Furthermore, the method described in Patent Document 2 requires the formation of a bonding film made of organic groups on the bonding surface of the resin members to be bonded, which has the problem of adversely affecting the optical properties.

[0009] The present invention has been made in view of the above-mentioned problems, and provides a method for directly joining resin members together, which suppresses warping of the resin joint and produces a resin joint having good optical properties and high bonding strength, and an apparatus for producing a resin joint that can realize this method. [Means for solving the problem]

[0010] [1] The present invention solves the above problems and is a method for manufacturing a resin joint in which a first resin member and a second resin member are directly joined together, A surface treatment step for activating the joining surfaces of the first resin member and / or the second resin member, After the surface treatment step described above, a bonding step is performed in which the first resin member and the second resin member are brought into contact with each other's joining surfaces and bonded together to form a resin joint, After the above bonding process, a heat diffusion step is performed to heat the resin bond so that its temperature is higher than the higher of the temperatures of the first resin member and the second resin member in the bonding process. It holds.

[0011] [2] In the method for manufacturing the resin joint described in [1] above, it is preferable that the temperature of the resin joint in the heat diffusion step is less than the lower of the melting temperatures of the first resin member and the second resin member. [3] In the method for manufacturing the resin joint described in [1] or [2] above, it is preferable that in the joining step, the first resin member and the second resin member are bonded together while applying an external force of tensile or compressive load in a direction parallel to the joining surface of the first resin member and / or while applying an external force of tensile or compressive load in a direction parallel to the joining surface of the second resin member.

[0012] [4] In any of the resin joint manufacturing methods described in [1] to [3] above, it is preferable that the external force applied to the first resin member and / or the second resin member in the joining step satisfies the following relationship (1). F2=((XA)·(T2-T1)+F1 / (B·S1))·Y·S2 [N] ···(1) The thermal expansion coefficient of the resin component with the larger thermal expansion coefficient: X[1 / °C] The Young's modulus of the resin component with the larger coefficient of thermal expansion: Y [MPa] Cross-sectional area of ​​the resin component with the larger coefficient of thermal expansion: S1 [mm²] 2 ], External force applied to the resin component with the larger coefficient of thermal expansion: F1 [N] The thermal expansion coefficient of the resin component with the smaller thermal expansion coefficient: A [1 / °C] Young's modulus of the resin component with the smaller coefficient of thermal expansion: B [MPa] Cross-sectional area of ​​the resin component with the smaller coefficient of thermal expansion: S2 [mm²] 2 ], External force applied to the resin component with the smaller coefficient of thermal expansion: F2 [N] Temperature of the resin bonded body 6 at the point in time when warping of the resin bonded body 6 is to be suppressed: T1 [°C] The higher of the temperatures of the first resin member and the second resin member 2 during the joining process: T2 [°C] However, F1 and F2 take positive values ​​under tensile load and negative values ​​under compressive load.

[0013] [5] In any of the resin joint manufacturing methods described in [1] to [4] above, it is preferable that in the joining step, the first resin member and the second resin member are bonded together while fixing the dimensions of the first resin member and / or the second resin member in the direction parallel to the joining surfaces. [6] In any of the resin joint manufacturing methods described in [1] to [5] above, it is preferable that the activation method in the surface treatment step is at least one selected from the group consisting of irradiating the joining surfaces of the first resin member and / or the second resin member with an ionizing substance, irradiating with electromagnetic waves, and bringing them into contact with an activated liquid. [7] In any of the methods for manufacturing the resin bond described in [1] to [6] above, it is preferable that the first resin member and / or the second resin member are thermoplastic resins.

[0014] [8] The present invention solves the above problems and is a manufacturing apparatus for a resin joint in which a first resin member and a second resin member are directly joined, A surface treatment mechanism for activating the joining surfaces of the first resin member and / or the second resin member, The first resin member and the second resin member, whose joining surfaces have been activated by the above-described surface treatment mechanism, are brought into contact with each other to form a resin joint, and the joining mechanism further heats the resin joint to a temperature higher than the higher of the temperatures of the first resin member and the second resin member when they are joined together.

[0015] [9] The present invention for solving the above problems is a manufacturing apparatus for another aspect of a resin bonded body in which a first resin member and a second resin member are directly bonded, comprising: a surface treatment mechanism for activating the bonding surfaces of the first resin member and / or the second resin member; a bonding mechanism for bonding the first resin member and the second resin member, with at least one of the bonding surfaces activated by the surface treatment mechanism, by bringing the respective bonding surfaces into contact with each other to form a resin bonded body; a heat diffusion mechanism for heating the temperature of the resin bonded body to a temperature higher than the higher temperature of the temperatures of the first resin member and the second resin member when the first resin member and the second resin member are bonded together.

[0016]

[10] In the manufacturing apparatus for the resin bonded body according to [8] or [9] above, it is preferable that the bonding mechanism includes an external force applying mechanism capable of applying a tensile load and / or a compressive load in a direction parallel to the bonding surface of the first resin member, and / or capable of applying a tensile load and / or a compressive load in a direction parallel to the bonding surface of the second resin member.

[11] In the manufacturing apparatus for the resin bonded body according to any one of [8] to

[10] above, it is preferable that the bonding mechanism includes a dimension fixing mechanism for fixing the dimension in a direction parallel to the bonding surface of the first resin member and / or the second resin member.

Advantages of the Invention

[0017] According to the present invention, there are provided a manufacturing method and apparatus for a resin bonded body that has no warpage and has a high bonding strength.

Brief Description of the Drawings

[0018] [Figure 1] FIG. 1 is a schematic view showing a first embodiment of the manufacturing method of the resin bonded body of the present invention. [Figure 2] FIG. 2 is a schematic view showing a second embodiment of the manufacturing method of the resin bonded body of the present invention. [Figure 3]Figure 3 is a schematic diagram showing a third embodiment of the method for manufacturing a resin bond according to the present invention. [Figure 4] Figure 4 is a schematic diagram showing a fourth embodiment of the method for manufacturing a resin bond according to the present invention. [Figure 5] Figure 5 is a schematic diagram showing one embodiment of the manufacturing apparatus for resin bonded bodies according to the present invention. [Figure 6] Figure 6 is a schematic diagram showing a second embodiment of the manufacturing apparatus for resin bonded bodies according to the present invention. [Figure 7] Figure 7 is a schematic diagram showing a third embodiment of the manufacturing apparatus for resin bonded bodies according to the present invention. [Figure 8] Figure 8 is a schematic diagram showing a fourth embodiment of the resin bonding apparatus of the present invention. [Figure 9] Figure 9 is a schematic diagram showing a fifth embodiment of the resin bonding apparatus of the present invention. [Figure 10] Figure 10 is a schematic diagram showing a sixth embodiment of the resin bonding apparatus of the present invention. [Figure 11] Figure 11 is a schematic diagram showing the seventh embodiment of the resin bonding apparatus of the present invention. [Figure 12] Figure 12 is a schematic diagram showing the warping of the resin-bonded structure. [Figure 13] Figure 13 is a schematic diagram showing the evaluation of warpage of a resin-bonded structure. [Modes for carrying out the invention]

[0019] [First Embodiment of a Method for Manufacturing a Resin Bonded Body] Hereinafter, examples of embodiments of the present invention will be described with reference to the drawings. Figure 1 is a schematic diagram showing a first embodiment of the method for manufacturing a resin bonded body of the present invention. As shown in Figure 1, the manufacturing method of the first embodiment includes a surface treatment step 5 in which the surface 3 of the first resin member 1 that joins with the second resin member 2, and / or the surface 3' of the second resin member 2 that joins with the first resin member 1, is activated by a surface activation means 4, followed by a joining step 7 in which the first resin member 1 and the second resin member 2 are bonded together by bringing their respective joining surfaces 3 and 3' into contact to form a resin bonded body 6, and a heat diffusion step 9 in which the resin bonded body 6 is heated by a heating means 8.

[0020] The first resin member 1 and the second resin member 2 can be appropriately selected from thermosetting resins such as phenolic resin (PF), epoxy resin (EP), melamine resin (MF), and polyurethane (PU), or thermoplastic resins such as polyethylene (PE), polypropylene (PP), polyamide (PA), polyacetal (POM), polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), polyether ether ketone (PEEK), polytetrafluoroethylene (PTFE), polyvinyl chloride (PVC), polystyrene (PS), acrylonitrile butadiene styrene (ABS), polymethyl methacrylate (PMMA), polycarbonate (PC), polyetherimide (PEI), and polyamideimide (PAI), depending on the application. However, it is preferable to use thermoplastic resins rather than thermosetting resins. This is because thermoplastic resin materials have higher thermal mobility of molecular chains, resulting in greater entanglement of molecular chains at the bonding interface between the first resin member 1 and the second resin member 2. The greater the entanglement of these molecular chains, the stronger the intermolecular forces at the bonding interface, and the improved bonding strength. Furthermore, the resins used in the first resin member 1 and the second resin member 2 may be the same or different.

[0021] The surface treatment process 5, the bonding process 7, and the heat diffusion process 9 are described below.

[0022] [Surface treatment process] Surface treatment step 5 will now be described. In surface treatment step 5, the surface treatment means 4 is applied to the joint surface 3 of the first resin member 1 and / or the joint surface 3' of the second resin member 2 to activate the joint surface 3 and / or the joint surface 3'. The surface treatment in surface treatment step 5 may be applied to only one of the joint surface 3 or the joint surface 3', or to both the joint surface 3 and the joint surface 3'. In the following description of the surface treatment step, unless otherwise specified, the case in which the surface treatment is applied to the joint surface 3 of the resin member 1 will be described. When the surface treatment is applied to the joint surface 3', resin member 1 should be read as resin member 2 and joint surface 3 as joint surface 3'.

[0023] In this invention, "activation" means applying energy generated by the surface treatment means 4 to the bonding surface 3 of the resin member 1 to cleave the molecular chains of the bonding surface 3, and / or impart functional groups. By cleaving the molecular chains of the bonding surface 3, the thermal mobility of the molecular chains present on the bonding surface 3 can be increased. This thermal mobility of the molecular chains can be measured using a nanothermal microscope (nanoTA). Furthermore, the type and amount of functional groups can be confirmed by infrared absorption spectroscopy (IR). Examples of functional groups include polar functional groups such as hydroxyl groups and carboxyl groups.

[0024] As described above, the surface treatment means 4 in the surface treatment step 5 can be any method that can activate the bonding surface 3 of the first resin member 1 by applying energy to it, and any method can be used. The surface treatment may be applied to only the bonding surface 3 or the bonding surface 3', or to both the bonding surface 3 and the bonding surface 3'.

[0025] As surface treatment means 4 for applying surface treatment, it is preferable to irradiate the joining surface 3 of the first resin member with an ionizing substance, irradiate it with electromagnetic waves, or bring it into contact with an activated liquid. Since these are low-temperature processes compared to flame treatment or Itro treatment, the joining surface 3 can be activated without thermal deformation. In addition, the amount of molecular chain cleavage and the amount of functional group addition can be easily controlled in all of these methods.

[0026] Furthermore, one or more of these methods may be applied. In addition, the amount of molecular chain cleavage and the amount of functional group addition at the bonding surface 3 of the first resin member 1 can be easily controlled by changing the intensity, time, frequency, etc. of the surface treatment.

[0027] In this invention, "ionizing substance" refers to a gas containing charged particles such as ions and electrons. The method for generating the ionizing substance is not particularly limited, but one example is applying a voltage (electric field) between opposing metal electrode plates with a gap between them. The type of gas used to generate the ionizing substance is not particularly limited, but examples include argon, helium, oxygen, water vapor, and nitrogen. By changing the type of gas and the density of the ionizing substance, the amount of molecular chain cleavage and the amount of functional group addition at the bonding surface 3 of the first resin member 1 can be easily controlled.

[0028] In this invention, "electromagnetic wave" refers to a wave formed by changes in the electric and magnetic fields in space. The shorter the wavelength of this wave, the greater its energy, and in particular, electromagnetic waves with a wavelength of 200 nm or less can be effectively activated by irradiating the bonding surface 3 of the first resin member 1 with them. Furthermore, by changing the amount (illuminance) and wavelength of the electromagnetic wave, the type and amount of functional groups generated on the bonding surface 3 of the first resin member 1 can be easily controlled.

[0029] In this invention, "active liquid" refers to a liquid containing one or more reactive species, such as atoms or molecules with highly reactive unpaired electrons (radicals), ions, or electrons (charged particles). The activity level, which indicates the degree of activation of the active liquid, can be evaluated by methods such as measuring the luminescence intensity generated from the reactive species, chemical quantitative measurements measuring the reaction amount between the reactive species and the test solution, or electron spin resonance analysis.

[0030] Examples of liquids used for activation include water, methanol, ethanol, acetic acid, and ammonia, and can be broadly selected depending on cost, safety, and the solubility of the first resin component 1. Furthermore, the activation liquid may be a mixture of two or more liquids or an aqueous solution.

[0031] [Joining process] The bonding process 7 will now be explained. In bonding process 7, the first resin member 1 and the second resin member 2 are bonded together to form a resin joint 6 with bonding strength. In bonding process 7, after the surface treatment process 5, the bonding surface 3 of the first resin member 1 and the bonding surface 3' of the second resin member 2 are brought into contact with each other. By bringing them into contact, molecular chain entanglement (hereinafter referred to as molecular diffusion) and condensation reactions (hereinafter referred to as covalent bond formation) between functional groups proceed at the interface between the bonding surface 3 of the first resin member 1 and the bonding surface 3' of the second resin member 2, and a resin joint 6 with a certain bonding strength can be produced. Because the resin joint 6 has a certain bonding strength, the bonding position at the interface of the resin joint 6 is fixed.

[0032] Furthermore, a heating means 8 may be provided in the joining process 7 to heat the first resin member 1 and / or the second resin member 2. Preferably, the temperature of the first resin member 1 and the second resin member 2 in the joining process 7 is below the lower of the two melting temperatures of the first resin member 1 and the second resin member 2. This is because exceeding the melting temperature can cause thermal alteration of the molecular structure of the resin members, potentially adversely affecting the mechanical and optical properties of the first resin member 1 and the second resin member 2.

[0033] Furthermore, in joining step 7, it is preferable that the temperatures of the first resin member 1 and the second resin member 2 be the same as the temperature of the resin joint 6 at the point in time when warping is to be suppressed, in order to suppress warping of the resin joint 6 caused by the difference in the amount of dimensional change due to heating. For example, when the resin joint 6 is used at room temperature (20°C), it is preferable that the temperatures of the first resin member 1 and the second resin member 2 in joining step 7 be 20°C. On the other hand, when the resin joint 6 is used in a heated environment (100°C), it is preferable that the temperatures of the first resin member 1 and the second resin member 2 in joining step 7 be 100°C.

[0034] The warpage of the resin joint 6 can be evaluated by placing the resin joint 6 on a horizontal platform and measuring the maximum height at which the four corners of the resin joint 6 are lifted off the platform. There are no specific requirements for the means of measuring the amount of warpage, but examples include dial gauges, optical flats, and 3D shape measurement using lasers.

[0035] Furthermore, the heating means 8 used to heat the first resin member 1 and the second resin member 2 in the joining process 7 can be an infrared heater, microwave heater, ultrasonic heater, hot press, hot air dryer, heating furnace, etc., and is not particularly limited.

[0036] Furthermore, it is preferable to press the first resin member 1 and the second resin member 2 together using a press or the like to prevent gaps from forming at the joint interface due to undulations, etc., on the joint surface 3 of the first resin member 1 and the joint surface 3' of the second resin member 2. Pressing them together increases the actual contact area between the first resin member 1 and the second resin member 2, thereby improving the bonding strength of the resin joint 6.

[0037] [Thermal diffusion process] The thermal diffusion step 9 will now be described. In the thermal diffusion step 9, the resin joint 6, formed by bonding the first resin member 1 and the second resin member 2 in the bonding step 7, is heated by the heating means 8 to promote molecular diffusion and covalent bond formation at the interface of the resin joint 6. As a result, the bonding strength of the resin joint 6 can be improved to any desired level.

[0038] In the heat diffusion step 9, the temperature of the resin joint 6 is set higher than the higher of the temperatures of the first resin member 1 and the second resin member 2 in the bonding step 7. Even if the temperatures of the first resin member 1 and the second resin member 2 are lowered in the bonding step 7 to suppress warping of the resin joint 6, raising the temperature of the bonding interface of the resin joint 6 in the heat diffusion step 9 promotes molecular diffusion and covalent bond formation, resulting in a resin joint 6 with the desired bonding strength. Furthermore, since the position of the bonding interface of the resin joint 6 is fixed in the bonding step 7, even if the temperature of the resin joint 6 in the heat diffusion step 9 is set higher than the higher of the temperatures of the first resin member 1 and the second resin member 2 in the bonding step 7, the difference in the amount of dimensional change between the first resin member 1 and the second resin member 2 at the bonding interface of the resin joint 6 does not become large, and a resin joint 6 without warping can be manufactured.

[0039] Furthermore, the higher the temperature of the resin bond 6 in the heat diffusion step 9, the more molecular diffusion and covalent bond formation at the interface of the resin bond 6 progress, improving the bonding strength. However, it is preferable that the temperature of the resin bond 6 in the heat diffusion step 9 be below the lower of the melting temperatures (Tm) of the first resin member 1 and the second resin member 2. By keeping the temperature below the melting temperature, thermal deterioration of the first resin member 1 and the second resin member 2 can be suppressed, preventing deterioration of mechanical and optical properties.

[0040] The heating means 8 can be an infrared heater, microwave heater, ultrasonic heater, hot press, hot air dryer, heating furnace, etc., and is not particularly limited. Furthermore, multiple heating means 8 may be arranged side-by-side, or the heating means 8 used in the joining process 7 and the heating means 8 used in the heat diffusion process 9 may be different heating means 8.

[0041] [Second Embodiment of a Method for Manufacturing a Resin Bonded Body] Figure 2 is a schematic diagram showing a second embodiment of the method for manufacturing a resin joint according to the present invention. The difference from the first embodiment in Figure 1 is that external force applying means 10 and 10' are added to the joining process 7. The external force applying means 10 applies an external force of tensile or compressive load to the first resin member 1, thereby changing the dimensions of the first resin member 1. The external force applying means 10' applies an external force of tensile or compressive load to the second resin member 2, thereby changing the dimensions of the second resin member 2. By using the external force applying means 10 and 10', the amount of dimensional change due to thermal expansion of the first resin member 1 and the second resin member 2 in the joining process 7 can be precisely and freely adjusted. As a result, even slight differences in the amount of dimensional change between the first resin member 1 and the second resin member 2 in the joining process 7 are eliminated, and the warping of the resin joint 6 is further suppressed.

[0042] The external force applied by the external force applying means 10, 10' is preferably determined based on the following formula (1). In the following formula (1), the external forces represented by F1 and F2 are defined as follows: a positive value is a tensile load, and a negative value is a compressive load. When external forces are applied to the first resin member 1 and the second resin member 2, respectively, and the applied external forces are the values ​​determined based on the following formula (1), warping of the resin joint 6 can be eliminated regardless of the material and size of the first resin member 1 and the second resin member 2, or the temperature in the joining process 7. F2=((XA)·(T2-T1)+F1 / (B·S1))·Y·S2 ···(1) The coefficient of linear expansion of the resin component with the larger coefficient of linear expansion is X[1 / ℃]. The Young's modulus of the resin component with the larger coefficient of linear expansion: Y [MPa] Cross-sectional area of ​​the resin member with the larger coefficient of linear expansion: S1 [mm²] 2 ], External force applied to the resin member with the larger coefficient of linear expansion: F1 [N] The coefficient of thermal expansion of the resin component with the smaller coefficient of thermal expansion is A [1 / °C]. Young's modulus of the resin component with the smaller coefficient of linear expansion: B [MPa] Cross-sectional area of ​​the resin member with the smaller coefficient of thermal expansion: S2 [mm²] 2 ], External force applied to the resin component with the smaller coefficient of thermal expansion: F2 [N] Temperature of the resin bonded body 6 at the point in time when warping of the resin bonded body 6 is to be suppressed: T1 [°C] The higher of the temperatures of the first resin member and the second resin member 2 during the joining process: T2 [°C].

[0043] In the embodiment shown in Figure 2, both an external force applying means 10 and an external force applying means 10' are provided, but only one of them may be provided. For example, if only the external force applying means 10 is provided, the external force F1 or F2 applied to the second resin member 2 can be set to zero, and the external force F1 or F2 applied to the first resin member 1 can be determined based on the above formula (1). The same applies if only the external force applying means 10' is provided.

[0044] The change in dimensions of the first resin member 1 due to the external force applied by the external force applying means 10 can be determined by the following formula (2). This change can be confirmed by measuring the difference in dimensions of the first resin member 1 before and after the external force is applied by the external force applying means 10. The change in dimensions of the second resin member 2 due to the external force applied by the external force applying means 10' can be determined in the same way. ΔL = L·F / (a·b·E) ···(2) Dimensional change of the first resin member 1 due to the external force application means: ΔL [mm] Lengthwise dimension of the first resin component 1: L [mm] External force applied to the first resin member 1 by the external force application means: F[N] Width dimension of the first resin member 1: a [mm] Thickness dimension of the first resin component 1: b [mm] Young's modulus of the first resin component 1: E [MPa].

[0045] [Third Embodiment of a Method for Manufacturing a Resin Bonded Body] Figure 3 is a schematic diagram showing a third embodiment of the method for manufacturing a resin joint according to the present invention. The difference from the first embodiment shown in Figure 1 is that in the joining step 7, a dimension fixing means 11 for suppressing dimensional changes of the first resin member 1 and a dimension fixing means 11' for suppressing dimensional changes of the second resin member 2 are provided. These dimension fixing means 11 and 11' allow the amount of dimensional change caused by thermal expansion in the direction parallel to the respective joining surfaces 3 and 3' of the first resin member 1 and the second resin member 2 to be adjusted to an arbitrary value. As a result, the difference between the amount of dimensional change of the first resin member 1 and the amount of dimensional change of the second resin member 2 in the joining step 7 can be reduced, and warping of the resin joint 6 can be suppressed.

[0046] In the embodiment shown in Figure 3, both dimension fixing means 11 and dimension fixing means 11' are provided, but only one of them may be provided. For example, by providing only dimension fixing means 11 and adjusting the amount of dimensional change in the direction parallel to the joint surface 3 of the first resin member 1 to a certain value, the difference with the amount of dimensional change in the direction parallel to the joint surface 3' of the second resin member 2 can be reduced to some extent. The same applies when only dimension fixing step 11' is provided.

[0047] The method for suppressing dimensional changes by the dimension fixing means 11 and 11' is not particularly limited, but for example, one example is to surround all surfaces of the first resin member 1 other than the joining surface 3 with the dimension fixing means 11, surround all surfaces of the second resin member 2 other than the joining surface 3' with the dimension fixing means 11', and then bring the joining surface 3 and the joining surface 3' into contact.

[0048] [Fourth Embodiment of a Method for Manufacturing a Resin Bonded Body] Figure 4 is a schematic diagram showing a fourth embodiment of the method for manufacturing a resin bonded body according to the present invention. The difference from the first embodiment shown in Figure 1 is that in the bonding step 7, an external force applying means 10 for applying an external force of tensile or compressive load to the first resin member 1 and a dimension fixing means 11' for suppressing dimensional changes of the second resin member 2 are provided.

[0049] For example, if the amount by which the first resin member 1 can be stretched by the tensile load applied by the external force application means 10 is limited due to the thickness and material of the first resin member 1, and it is difficult to match the dimensions of the first resin member 1 and the second resin member 2, the elongation of the second resin member 2 can be suppressed by the dimension fixing means 11. As a result, the difference in the amount of dimensional change caused by thermal expansion between the first resin member 1 and the second resin member can be adjusted, and warping of the resin joint 6 can be suppressed.

[0050] In the embodiment shown in Figure 4, the system includes an external force applying means 10 for applying a tensile or compressive load to the first resin member 1 and a dimension fixing means 11' for suppressing dimensional changes in the second resin member 2. However, it may also include an external force applying means 10' for applying a tensile or compressive load to the second resin member 2 and a dimension fixing means 11 for suppressing dimensional changes in the first resin member 1.

[0051] [First Embodiment of a Manufacturing Apparatus for Resin Bonded Bodies] Next, the manufacturing apparatus for resin bonded bodies of the present invention will be described. Figure 5 is a schematic diagram showing a first embodiment of the manufacturing apparatus for resin bonded bodies of the present invention. As shown in Figure 5, the manufacturing apparatus 101 for resin bonded bodies 6 of the first embodiment includes a surface treatment mechanism 16 and a bonding mechanism 20.

[0052] [Surface treatment mechanism] The surface treatment mechanism 16 will now be described. The surface treatment mechanism 16 consists of a surface treatment machine 12 and a resin member holder 13. The surface treatment mechanism 16 is a mechanism for surface treatment of the joint surface 3 of the first resin member 1 and / or the joint surface 3' of the second resin member 2, thereby activating the joint surface 3 and the joint surface 3'. In the following description of the surface treatment mechanism, unless otherwise specified, the description will focus on the case where the surface treatment is applied to the joint surface 3 of the resin member 1. When the surface treatment is applied to the joint surface 3', simply replace resin member 1 with resin member 2 and joint surface 3 with joint surface 3'.

[0053] The surface treatment machine 12 is preferably positioned opposite the bonding surface 3 of the first resin member 1, which is located in the resin member holder 13. This arrangement allows the energy supplied by the surface treatment machine 12 to be uniformly applied to the bonding surface 3. The surface treatment machine 12 preferably uses an ionizing substance irradiator that irradiates an ionizing substance, an electromagnetic wave irradiator that irradiates electromagnetic waves, or an activated liquid contact unit. These are low-temperature processes compared to flame treatment or Itro treatment, and can activate the bonding surface 3 without thermal deformation. Furthermore, all of these allow for easy control of the amount of molecular chain cleavage and the amount of functional group addition.

[0054] Furthermore, while it is sufficient to have any one of these surface treatment machines 12, multiple types may be provided. In addition, when using an ionizing material irradiator or an electromagnetic wave irradiator as the surface treatment machine 12, it is preferable to provide a gas supply nozzle 14 that supplies gas between the first resin member 1 held by the resin member holder 13 and the surface treatment machine 12. By providing the gas supply nozzle 14, the type of gas can be appropriately changed according to the type of the first resin member 1 and the light absorption properties of the electromagnetic waves.

[0055] It is preferable to provide the surface treatment machine 12 with process monitoring equipment 15 for process monitoring. By providing these process monitoring devices 15, abnormalities during surface treatment can be detected early.

[0056] It is preferable to modify the process monitoring equipment 15 as appropriate according to the object being monitored. If the surface treatment machine 12 is an ionizing substance irradiator, the type and degree of ionization of the ionizing substance can be determined by equipping it with an emission spectrometer that can measure the emission state of the ionizing substance. If the surface treatment machine 12 is an electromagnetic wave irradiator, the amount of electromagnetic light can be determined by equipping it with an illuminometer or luminance meter. If the surface treatment means 4 is an active liquid contact unit, the activity state of the active liquid can be determined by equipping it with a pH meter or dissolved oxygen meter. In addition, the type of gas, humidity, and temperature inside the surface treatment machine 12 can be monitored with a mass spectrometer, hygrometer, thermometer, etc.

[0057] [Joining mechanism] The bonding mechanism 20 will now be described. The bonding mechanism 20 consists of a bonding machine 17, a temperature monitoring device 18, and a heating device 19.

[0058] The bonding machine 17 is used to bring the bonding surface 3 of the first resin member 1 and the bonding surface 3' of the second resin member 2 into contact to form a resin bonded body 6, and a pressing means such as a press machine is an example. Alternatively, multiple pressing means may be arranged side by side. Furthermore, by using a hot press machine combined with a heater 19 as the bonding machine 17, it becomes possible to raise the temperature of the first resin member and the second resin member, which promotes molecular diffusion and covalent bond formation at the bonding interface, and further improves the bonding strength of the resin bonded body 6.

[0059] Alternatively, the bonding machine 17 may be a hot press machine combined with a heater 19 to bond the first resin member 1 and the second resin member 2 together to form a resin bond 6, after which the resin bond 6 may be further heated. The temperature of the resin bond 6 raised by this heating shall be higher than the higher of the two temperatures of the first resin member 1 and the second resin member 2 immediately before bonding with the bonding machine.

[0060] If the bonding machine 17 in the bonding mechanism 20 is a press machine, the pressing surface is preferably made of a soft rubber material such as silicone rubber or urethane rubber. By making the pressing surface out of such a material, cushioning is improved and uniform pressure can be applied to the pressing surface. As a result, the actual contact area between the bonding surface 3 of the first resin member 1 and the bonding surface 3' of the second resin member is increased, and the bonding strength of the resin joint 6 is further improved. Alternatively, a cushioning material made of rubber material (not shown) may be placed between the first resin member 1 and / or the second resin member 2 and the pressing surface.

[0061] The temperature monitoring device 18 is a device for measuring the temperatures of the first resin member 1 and the second resin member 2. Examples of temperature measuring devices include, but are not limited to, radiation thermometers.

[0062] The heating device 19 heats the first resin member 1 and the second resin member 2 in the joining mechanism 20, and can be an infrared heater, microwave heater, ultrasonic heater, hot press, hot air dryer, heating furnace, etc.

[0063] [Second Embodiment of a Manufacturing Apparatus for Resin Bonds] Figure 6 is a schematic diagram showing a second embodiment of the manufacturing apparatus for resin bonded bodies of the present invention. The difference between the manufacturing apparatus 101 of the first embodiment shown in Figure 5 and the manufacturing apparatus 102 of this second embodiment is that it is equipped with a heat diffusion mechanism 21 after the bonding mechanism 20.

[0064] [Thermal diffusion mechanism] The heat diffusion mechanism 21 will now be described. The heat diffusion mechanism 21 consists of a temperature monitoring device 18 and a heater 19. The heat diffusion mechanism 21 is a mechanism for further heating the resin bonded body 6 after bonding using the heater 19, thereby improving the bonding strength of the resin bonded body 6.

[0065] The temperatures of the first resin member 1 and the second resin member 2 in the bonding mechanism 20 and the heat diffusion mechanism 21 are monitored by a temperature monitoring device 18, and the temperature of the resin joint 6 in the heat diffusion mechanism 21 is raised by a heater 19 so that it is higher than the higher of the temperatures of the first resin member 1 and the second resin member 2 in the bonding mechanism 20.

[0066] Since the heat diffusion mechanism 21 is equipped with a heater 19, the bonding mechanism 20 does not need to be equipped with a heater 19. [Third Embodiment of a Manufacturing Apparatus for Resin Bonds] Figure 7 is a schematic diagram showing a third embodiment of the manufacturing apparatus for resin bonded bodies of the present invention. The difference between the manufacturing apparatus 102 of the second embodiment in Figure 6 and the manufacturing apparatus 103 of this third embodiment is that the bonding mechanism 20 is equipped with external force application mechanisms 22 and 22'.

[0067] The external force application mechanism 22 applies a tensile or compressive load to the first resin member 1, thereby changing the dimensions of the first resin member 1. The external force application mechanism 22' applies a tensile or compressive load to the second resin member 2, thereby changing the dimensions of the second resin member 2. By using these external force application mechanisms 22 and 22', the amount of dimensional change due to thermal expansion of the first resin member 1 and the second resin member 2 in the joining mechanism 20 can be precisely and freely adjusted. As a result, even slight differences in the amount of dimensional change between the first resin member 1 and the second resin member 2 in the joining mechanism 20 are eliminated, and the warping of the resin joint 6 is further suppressed.

[0068] The external force application mechanisms 22 and 22' may be used to apply a tensile load to one of the two resin members and a compressive load to the other, or a tensile load or a compressive load may be applied to each of the two resin members.

[0069] In this way, by applying a tensile load to the first resin member 1 and the second resin member 2, the dimensions of each resin member can be stretched or compressed. As a result, the amount of dimensional change due to the expansion of the first resin member 1 and the second resin member 2 can be adjusted, and warping of the resin joint 6 can be suppressed. Furthermore, the direction in which the dimensions of the first resin member 1 and the second resin member 2 are stretched or compressed can be selected to be parallel to the respective joint surfaces 3 and 3'.

[0070] [Fourth Embodiment of a Manufacturing Apparatus for Resin Bonds] Figure 8 is a schematic diagram showing a fourth embodiment of the manufacturing apparatus for resin joints according to the present invention. The difference between the manufacturing apparatus 102 of the second embodiment in Figure 6 and the manufacturing apparatus 104 of this fourth embodiment is that the joining mechanism 20 includes a dimension fixing mechanism 23 that suppresses dimensional changes of the first resin member 1 and a dimension fixing mechanism 23' that suppresses dimensional changes of the second resin member 2. These dimension fixing mechanisms 23 and 23' can suppress the amount of dimensional change caused by thermal expansion in the direction parallel to the respective joining surfaces 3 and 3' of the first resin member 1 and the second resin member 2 to an arbitrary value. As a result, the difference between the amount of dimensional change of the first resin member 1 and the amount of dimensional change of the second resin member 2 within the joining mechanism 20 can be reduced, and warping of the resin joint 6 can be suppressed.

[0071] In the embodiment shown in Figure 8, both a dimension fixing mechanism 23 and a dimension fixing mechanism 23' are provided, but only one of them may be provided. For example, by providing only the dimension fixing mechanism 23 and suppressing the amount of dimensional change in the direction parallel to the joint surface 3 of the first resin member 1 to a certain value, the difference with the amount of dimensional change in the direction parallel to the joint surface 3' of the second resin member 2 can be adjusted to some extent. The same applies when only the dimension fixing mechanism 23' is provided.

[0072] The structure of the dimension fixing mechanisms 23 and 23' is not particularly limited, but for example, the dimension fixing mechanism 23 may be a structure that surrounds all surfaces of the first resin member 1 other than the joint surface 3, and the dimension fixing means 23' may be a structure that surrounds all surfaces of the second resin member 2 other than the joint surface 3'.

[0073] [Fifth Embodiment of a Manufacturing Apparatus for Resin Bonds] Figure 9 is a schematic diagram showing a fifth embodiment of the manufacturing apparatus for resin bonded bodies according to the present invention. The difference between the manufacturing apparatus 102 of the second embodiment in Figure 6 and the manufacturing apparatus 105 of this fifth embodiment is that the bonding mechanism 20 includes an external force application mechanism 22 that applies an external force of tensile or compressive load to the first resin member 1, and a dimension fixing mechanism 23' that suppresses dimensional changes of the second resin member 2.

[0074] For example, if the amount by which the first resin member 1 can be stretched by the tensile load applied by the external force application mechanism 22 is limited due to the thickness and material of the first resin member 1, and it is difficult to match the dimensions of the first resin member 1 and the second resin member 2, then the elongation of the second resin member 2 can be suppressed by the dimension fixing mechanism 23'. As a result, the difference in the amount of dimensional change caused by thermal expansion between the first resin member 1 and the second resin member can be adjusted, and warping of the resin joint 6 can be suppressed.

[0075] In the embodiment shown in Figure 9, the system includes an external force applying means 22 for applying a tensile or compressive load to the first resin member 1 and a dimension fixing means 23' for suppressing dimensional changes in the second resin member 2. However, it may also include an external force applying means 22' for applying a tensile or compressive load to the second resin member 2 and a dimension fixing means 23 for suppressing dimensional changes in the first resin member 1.

[0076] [Sixth Embodiment of a Manufacturing Apparatus for Resin Bonds] Figure 10 is a schematic diagram showing a sixth embodiment of the manufacturing apparatus for resin bonded bodies according to the present invention. The manufacturing apparatus 106 of this sixth embodiment is equipped with a resin member conveying mechanism 24 for automatically conveying the first resin member 1 and the second resin member 2 in the conveying direction 25. By automatically conveying the resin members using the resin member conveying mechanism 24, the production speed of the resin bonded bodies 6 can be improved.

[0077] The resin member transport mechanism 24 is not particularly limited, but examples include a belt conveyor that rotates a ring-shaped belt on a trolley to transport the first resin member 1 and the second resin member 2, and a transport robot that moves autonomously between processes to transport the first resin member 1 and the second resin member 2 in the transport direction 25.

[0078] [Seventh Embodiment of a Manufacturing Apparatus for Resin Bonds] Figure 11 is a schematic diagram showing the seventh embodiment of the manufacturing apparatus for resin joints according to the present invention. The manufacturing apparatus 107 of this seventh embodiment includes a resin member conveying mechanism 26, which consists of unwinding rolls 26a, 26a', a winding roll 26b, and conveying rolls 26c and 26d that convey to the joining mechanism 20. The first resin member 1 is unwound by the unwinding roll 26a, the second resin member 2 is unwound by the unwinding roll 26a', the first resin member 1 and the second resin member 2 are conveyed by the conveying roll 26c, the resin joint 6 is conveyed in the conveying direction 25 by the conveying roll 26d, and the resin joint 6 is wound up by the winding roll 26b. The following processing is performed on the first resin member 1 and the second resin member 2 while they are being conveyed. The surface treatment mechanism 16 is used to treat the surfaces of the joining surface 3 of the first resin member 1 and the joining surface 3' of the second resin member 2, which are held in a resin member holding mechanism 13 consisting of four conveying rolls 26c. The joining mechanism 20 bonds the joining surface 3 of the first resin member 1 and the joining surface 3' of the second resin member 2 together. The heat diffusion mechanism 21 heats the resin joint 6 to improve the bonding strength. Furthermore, by applying a tensile load to the first resin member 1 and the second resin member 2 using the external force application mechanism 22, which consists of unwinding rolls 26a and 26a', the amount of change in the dimensions of each resin member can be adjusted, and the warping of the resin joint 6 can be eliminated. As a result, even if the first resin member 1 and the second resin member 2 are thin, long members, resin joints 6 with little warping can be continuously manufactured, and the productivity of resin joints 6 can be increased compared to batch processing. Intermittent conveying may also be performed depending on the processing time at each step. [Examples]

[0079] The following examples illustrate the method for manufacturing a resin joint 6 that is free from warping and has high bonding strength according to the present invention, but the present invention is not limited to these examples.

[0080] [Example 1] The method for manufacturing the resin bond 6 of the present invention, as shown in Figure 1, was used. In this method, a biaxially oriented polypropylene (OPP) film with a thickness of 25 μm (Trefan® 25A-KW37, melting point temperature 160°C) was used for the first resin member 1, and a polymethyl methacrylate (PMMA) film with a thickness of 125 μm (Technoloy® S000, melting point temperature 150°C) was used for the second resin member 2.

[0081] First, in surface treatment step 5, the bonding surfaces 3 and 3' of the OPP film 1 and PMMA film 2 were activated by irradiating them with an ionizing substance 4.

[0082] After the surface treatment step 5, in the bonding step 7, the bonded surfaces 3 and 3' of the activated OPP film 1 and PMMA film 2 were brought into direct contact, and the resin bonded body 6 was produced by heat pressing while heating with a heating means 8 for 20 seconds. The temperatures of the OPP film 1 and PMMA film 2 during this heat pressing were measured with an infrared thermometer (Custom Corporation: IR-10), and both were found to be 90°C.

[0083] Following the bonding process 7, in the heat diffusion process 9, the resin bonded body 6 was heated by placing it on a hot plate for 20 seconds. The temperature of the resin bonded body 6 on the hot plate was measured with an infrared thermometer and found to be 100°C.

[0084] The bonding strength of the resin bonded body 6 prepared as described above was evaluated using a 90-degree peel tester (Nidec-Shimpo Corporation: FGS-50E) at a peeling speed of 5 cm / min. As a result, the bonding strength of the resin bonded body 6 was 4.1 N / cm. In addition, the amount of warpage of the resin bonded body 6 evaluated using the following procedure was 8 mm. Thus, in Example 1, as described above, by raising the temperature of the resin bonded body 6 in the heat diffusion step 9 higher than the temperatures of the OPP film 1 and PMMA film 2 in the bonding step 7, a strong bonding strength was obtained while suppressing the warpage of the resin bonded body 6.

[0085] <Evaluation of warpage of resin-bonded structures> The amount of warping of the resin-bonded structure was evaluated by following the steps 1 to 4 below. Step 1: As shown in Figure 12, place the resin-bonded body 6 on a flat surface, then draw a line along the main axis of its curvature. Step 2: Using the direction perpendicular to the main axis as the longitudinal direction and the direction parallel as the width direction, cut a sample 27 measuring 65 mm in the longitudinal direction and 10 mm in the width direction from the resin joint 6. Step 3: As shown in Figure 13, after gripping one end A in the longitudinal direction of the cut sample 27 with the film chuck 28 by 5 mm, lift the cut sample 27 65 mm relative to the flat table 30. Step 4: The amount of warping of the resin joint 6 was determined by measuring the distance 31 between the lowest point of the cut sample 27 and the flat base 30 with a ruler. In this evaluation, if there is absolutely no warping of the resin joint 6, the result will be 0 mm.

[0086] [Comparative Example 1] A resin bonded body 6 was fabricated under the same conditions as in Example 1, except that the heat diffusion step 9 was omitted and the temperatures of the OPP film 1 and PMMA film 2 in the bonding step 7 were 100°C. The bonding strength of the resin joint 6 prepared as described above was 3.5 N / cm, and the amount of warpage was 32 mm. Compared to Example 1, the amount of warpage of the resin joint 6 was larger.

[0087] [Comparative Example 2] Comparative Example 2 was prepared under the same conditions as Comparative Example 1, except that the temperatures of the OPP film 1 and PMMA film 2 in bonding step 7 were 90°C, and a resin bonded body 6 was manufactured. The bonding strength of the resin joint 6 prepared as described above was 1.2 N / cm, and the amount of warpage was 3 mm. Compared to Example 1, the bonding strength of the resin joint 6 was lower.

[0088] [Comparative Example 3] Comparative Example 3 was prepared under the same conditions as Example 1, except that the temperatures of the OPP film 1 and PMMA film 2 in the heat diffusion step 7 were 80°C, and a resin bonded body 6 was manufactured. The bonding strength of the resin joint 6 prepared as described above was 0.7 N / cm, and the amount of warpage was 3 mm. Compared to Example 1, the bonding strength of the resin joint 6 was lower. [Industrial applicability]

[0089] By using the resin bonding method and apparatus of the present invention, resin bonding materials with minimal warping and high bonding strength without the use of adhesives can be easily obtained. These resin bonding materials can be applied to, for example, optical films and microfluidic devices, but their applications are not limited to these. [Explanation of Symbols]

[0090] 1. First resin member 2. Second resin member 3, 3' joint surface 4. Surface treatment means 5. Surface treatment process 6. Resin bond 7 Joining process 8 Heating means 9. Thermal diffusion process 10, 10' External force application means 11, 11' Dimension fixing means 12 Surface treatment machines 13. Component holder 14 Gas supply nozzle 15 Process monitoring equipment 16 Surface treatment mechanism 17 Laminating machine 18 Temperature monitoring equipment 19 Heating machine 20 Joining mechanism 21. Thermal diffusion mechanism 22, 22' External force application mechanism 23, 23' Dimension fixing mechanism 24 Resin component transport mechanism 25 Conveying direction 26a, 26a' unwinding roll 26b Winding Roll 26c, 26d Conveyor Rolls 27 Cut Samples 28 Film Chuck 29 Support stand 30 flat table 31 Distance between the lowest point of the cut sample and the flat surface. 101-107 Manufacturing equipment for resin bonded bodies

Claims

1. A method for manufacturing a resin joint in which a single-leaf first resin member and a single-leaf second resin member are directly joined together, A surface treatment step for activating the joining surfaces of the first resin member and / or the second resin member, A bonding step is performed after the surface treatment step, in which the first resin member and the second resin member are bonded together by bringing their respective bonding surfaces into contact, while applying an external force of tensile or compressive load in a direction parallel to the bonding surface of the first resin member and / or while applying an external force of tensile or compressive load in a direction parallel to the bonding surface of the second resin member, thereby forming a resin bonded body. After the bonding step, a heat diffusion step is performed to heat the resin bond so that its temperature is higher than the higher of the temperatures of the first resin member and the second resin member in the bonding step. A method for manufacturing a resin bond having the following characteristics.

2. The method for manufacturing a resin joint according to claim 1, wherein the temperature of the resin joint in the heat diffusion step is less than the lower of the melting temperatures of the first resin member and the second resin member.

3. A method for manufacturing a resin bond according to claim 1, wherein the external force applied to the first resin member and / or the second resin member in the bonding step satisfies the following relation (1). F2=((X-A)・(T2-T1)+F1 / (B・S1))・Y・S2 [N] ...(1) The thermal expansion coefficient of the resin component with the larger thermal expansion coefficient is X [1 / °C]. The Young's modulus of the resin component with the larger coefficient of thermal expansion: Y [MPa] Cross-sectional area of ​​the resin component with the larger coefficient of thermal expansion: S1 [mm²] ２ ], External force applied to the resin component with the larger coefficient of thermal expansion: F1 [N] The thermal expansion coefficient of the resin component with the smaller thermal expansion coefficient is A [1 / °C]. The Young's modulus of the resin component with the smaller coefficient of thermal expansion: B [MPa] Cross-sectional area of ​​the resin component with the smaller coefficient of thermal expansion: S2 [mm²] ２ ], External force applied to the resin component with the smaller coefficient of thermal expansion: F2 [N] Temperature of the resin bonded body 6 at the point in time when warping of the resin bonded body 6 is to be suppressed: T1 [°C] The higher of the temperatures of the first resin member and the second resin member 2 during the joining process: T2 [°C] However, F1 and F2 take positive values ​​when under tensile load and negative values ​​when under compressive load.

4. A method for manufacturing a resin bond according to claim 1 or 2, wherein the activation method in the surface treatment step is at least one selected from the group consisting of irradiating the joining surfaces of the first resin member and / or the second resin member with an ionizing substance, irradiating with electromagnetic waves, and bringing them into contact with an active liquid.

5. A method for manufacturing a resin bond according to claim 1 or 2, wherein the first resin member and / or the second resin member is a thermoplastic resin.

6. A manufacturing apparatus for a resin joint in which a single-leaf first resin member and a single-leaf second resin member are directly joined, A surface treatment mechanism for activating the joining surfaces of the first resin member and / or the second resin member, A bonding mechanism comprising: a bonding mechanism comprising: a bonding mechanism which involves bonding a first resin member and a second resin member, each having activated at least one of their bonding surfaces by the surface treatment mechanism, by bringing their respective bonding surfaces into contact and bonding them together to form a resin bond; and a bonding mechanism which involves heating the resin bond to a temperature higher than the higher of the temperatures of the first resin member and the second resin member at the time of bonding the first resin member and the second resin member, and which has an external force application mechanism that can apply a tensile load and / or compressive load in a direction parallel to the bonding surface of the first resin member and / or can apply a tensile load and / or compressive load in a direction parallel to the bonding surface of the second resin member, Manufacturing equipment for resin-bonded products.

7. A manufacturing apparatus for a resin joint in which a single-leaf first resin member and a single-leaf second resin member are directly joined, A surface treatment mechanism for activating the joining surfaces of the first resin member and / or the second resin member, A bonding mechanism comprising a bonding body formed by bringing the bonding surfaces of a first resin member and a second resin member, each having activated at least one of their bonding surfaces by the surface treatment mechanism, into contact and bonding them together, the bonding mechanism having an external force application mechanism capable of applying a tensile load and / or compressive load in a direction parallel to the bonding surface of the first resin member, and / or a tensile load and / or compressive load in a direction parallel to the bonding surface of the second resin member, The resin bond comprises a heat diffusion mechanism that heats the resin bond to a temperature higher than the temperature of the first resin member and the second resin member when they are bonded together, whichever is hotter. Manufacturing equipment for resin-bonded products.

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