Thermosetting resin compositions, prepregs, laminates, metal-clad laminates, printed circuit boards, and high-speed communication modules.

By incorporating a specific maleimide compound into a thermosetting resin composition, the dielectric properties and heat resistance of printed circuit boards are enhanced, addressing compatibility issues with other resins and improving high-frequency performance.

JP7868510B2Active Publication Date: 2026-06-02RESONAC CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
RESONAC CORP
Filing Date
2021-12-17
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

Thermoplastic polymers used in printed circuit boards face issues with reduced heat resistance and poor handling due to poor compatibility with other resins, leading to separation and inadequate dielectric properties in the high-frequency band.

Method used

Incorporating a specific maleimide compound with a defined structure into a thermosetting resin composition, along with other compounds that do not react with the maleimide group, to enhance dielectric properties and improve compatibility.

Benefits of technology

The resulting thermosetting resin composition exhibits excellent dielectric properties in the high-frequency band, with improved heat resistance and reduced warpage, suitable for manufacturing prepregs, laminates, metal-clad laminates, printed circuit boards, and high-speed communication modules.

✦ Generated by Eureka AI based on patent content.

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Abstract

A thermosetting resin composition which contains (a) a maleimide compound which has at least one N-substituted maleimide group and (b) a compound which is represented by general formula (1) and is not reactive with a maleimide group of the component (a). (In the formula, Xb1 represents a single bond or a substituted or unsubstituted aliphatic hydrocarbon group having from 1 to 5 carbon atoms; each of Rb1 and Rb2 independently represents a substituted or unsubstituted aliphatic hydrocarbon group having from 1 to 10 carbon atoms, a substituted or unsubstituted aromatic hydrocarbon group having from 6 to 18 ring-forming carbon atoms, a substituted or unsubstituted heterocyclic aromatic hydrocarbon group having from 5 to 20 ring-forming atoms, an oxygen atom-containing group, or a group obtained by combining these groups; and each of m and n independently represents an integer from 0 to 5.)
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