Method for manufacturing a thermal conductive film and apparatus for manufacturing the same.

By aligning plate-like particles in the thickness direction using an orientation channel, the method addresses inefficiencies in existing heat-conducting film production, resulting in improved thermal conductivity for heat dissipation applications.

JP7868530B2Active Publication Date: 2026-06-02KK TOYOTA CHUO KENKYUSHO
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2023-02-20
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

Existing methods for producing heat-conducting films are inefficient for mass production and do not effectively control the orientation of plate-like fillers, leading to suboptimal thermal conductivity.

Method used

A method involving a slurry of plate-like particles and resin is introduced into a molding channel with an upstream orientation channel, allowing for highly oriented plate-like particles to be aligned in the thickness direction, enabling efficient mass production of heat-conducting films.

Benefits of technology

The method achieves a highly oriented heat-conducting film with enhanced thermal conductivity in the thickness direction, suitable for heat dissipation in electronic devices.

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Patent Text Reader

Abstract

To provide a new method for producing a heat conducting film.SOLUTION: There is provided a production method for obtaining a heat conductive film in which plate-like particles are dispersed into a resin by flowing a slurry containing plate-like particles and a resin into a molding channel. Specifically speaking, an orientation channel composed of a narrow flow channel narrower than the molding channel is provided on an upstream side of the molding channel. The narrow flow channel forming the orientation channel may be single or plural. The orientation channel preferably has a cross-sectional shape with a flow channel index (K=(t / w)1 / 2×(1-2f / t)) of 0.3 to 3 calculated from a height of the narrow flow channel (t), a width of the narrow flow channel (w) and a size of plate-like particles (f). The plate-like particles are, for example, boron nitride particles in which heat conductivity (λ1) in an in-plane direction is larger than heat conductivity (λ2) in a plate thickness direction.SELECTED DRAWING: Figure 2
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Citation Information

Patent Citations

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