Liquid dispensing head and liquid dispensing device

Abstract

To solve the problem that when a temperature sensor is provided outside of a liquid discharge head, a difference between a temperature measured by the temperature sensor and a temperature of ink in a pressure chamber becomes larger compared to a difference between a temperature in the liquid discharge head and the temperature of the ink in the pressure chamber.SOLUTION: A liquid discharge head 510 includes: a piezoelectric element 300 including a first electrode 60, a second electrode 80 and a piezoelectric crystal 70; a diaphragm 50 deformed by driving the piezoelectric crystal 300; a pressure chamber substrate 10 provided with a pressure chamber 12 whose capacity changes due to deformation of the diaphragm 50; a wiring board 120; an individual lead electrode 91 for electrically connecting the wiring board 120 and the first electrode 60; a common lead electrode 92 for electrically connecting the wiring board 120 and the second electrode 80; and resistance wiring 401 electrically connected to the wiring board 120 and detecting a temperature of the pressure chamber 12.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to a liquid ejection head and a liquid ejection device.

Background Art

[0002] Patent Document 1 discloses a liquid ejection head having a piezoelectric element, a pressure chamber, and a nozzle communicating with the pressure chamber. This liquid ejection head is provided in a printer which is an example of a liquid ejection device. The control unit drives the piezoelectric element to change the volume of the pressure chamber, and ejects ink which is an example of the liquid supplied to the pressure chamber from the nozzle. Further, in the printer, a temperature sensor for measuring the ambient temperature outside the liquid ejection head is provided on the side surface of the carriage to which the liquid ejection head is attached. And the control unit drives and controls the piezoelectric element based on the ambient temperature measured by the temperature sensor.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In a liquid ejection device such as Patent Document 1, the temperature sensor is provided outside the liquid ejection head. Therefore, there is a possibility that the difference between the temperature measured by the temperature sensor and the temperature of the ink in the pressure chamber becomes larger than the difference between the temperature in the liquid ejection head and the temperature of the ink in the pressure chamber. In this case, there is a possibility that the liquid ejection device cannot perform ejection control of the liquid ejection head suitable for the temperature of the ink in the pressure chamber.

Means for Solving the Problems

[0005] The liquid discharge head includes a first electrode, a second electrode, and a piezoelectric body, and in the stacking direction in which the first electrode, the second electrode, and the piezoelectric body are stacked, the piezoelectric body is provided between the first electrode and the second electrode as a piezoelectric element; a diaphragm provided on one side of the stacking direction relative to the piezoelectric element, which deforms when the piezoelectric element is driven; a pressure chamber substrate provided on the one side of the stacking direction relative to the diaphragm, which has a plurality of pressure chambers whose volume changes when the diaphragm is deformed as a result of the deformation of the diaphragm; a wiring board; a first wiring that electrically connects the wiring board and the first electrode; a second wiring that electrically connects the wiring board and the second electrode; and a temperature detection unit electrically connected to the wiring board for detecting the temperature of the pressure chamber.

[0006] The liquid dispensing device comprises a liquid dispensing head and a control unit that controls the dispensing operation of the liquid from the liquid dispensing head. [Brief explanation of the drawing]

[0007] [Figure 1] A block diagram showing a schematic configuration of a liquid dispensing device equipped with a liquid dispensing head as one embodiment of the present disclosure. [Figure 2] An exploded perspective view showing the detailed configuration of the liquid dispensing head. [Figure 3] A plan view showing the liquid dispensing head. [Figure 4] Figure 3 shows a cross-sectional view of the liquid discharge head at the IV-IV section. [Figure 5] Detailed view of the main parts of the liquid discharge head shown in Figure 4. [Figure 6] Figure 3 is a cross-sectional view showing the VI-VI section of the liquid discharge head. [Figure 7] Detailed view of the main parts of the liquid discharge head according to Embodiment 2. [Figure 8] Detailed view of the main parts of the liquid discharge head according to Embodiment 3. [Figure 9] A plan view showing a liquid dispensing head according to Embodiment 4. [Figure 10] A plan view showing a modified example of the liquid discharge head according to Embodiment 4. [Figure 11] A plan view showing a modified example of the liquid discharge head according to Embodiment 4. [Figure 12] A plan view showing a liquid dispensing head according to Embodiment 5. [Figure 13] Detailed view of the main parts of the liquid discharge head according to another embodiment. [Figure 14] A cross-sectional view of a liquid dispensing head according to another embodiment. [Modes for carrying out the invention]

[0008] The present invention will be described below based on embodiments. In each figure, the same reference numerals are used for the same components, and redundant explanations are omitted.

[0009] In each figure, X, Y, and Z represent three mutually orthogonal spatial axes. In this specification, the directions along these axes are referred to as the X-axis, Y-axis, and Z-axis. When specifying directions, the positive direction is denoted as "+" and the negative direction as "-", and positive and negative signs are used in the direction notation. In each figure, the direction pointed to by the arrow is described as the + direction, and the opposite direction of the arrow is described as the - direction. The Z direction indicates the vertical direction, with the +Z direction indicating vertically downward and the -Z direction indicating vertically upward. Furthermore, the three X, Y, and Z spatial axes that are not limited to positive and negative directions are described as the X-axis, Y-axis, and Z-axis.

[0010] 1. Embodiment 1 In this embodiment, the liquid ejection device 500 is configured as an inkjet printer and ejects ink onto printing paper P to form an image. Ink is an example of a liquid. Alternatively, any type of medium, such as a resin film or fabric, may be used as the target for ink ejection instead of printing paper P.

[0011] As shown in Figure 1, the liquid dispensing device 500 comprises a liquid dispensing head 510, an ink tank 550, a transport mechanism 560, a moving mechanism 570, and a control unit 580.

[0012] The liquid ejection head 510 has a number of nozzles 21 and ejects ink in the +Z direction to form an image on the printing paper P. Further, the liquid ejection head 510 has a resistance wiring 401 which is an example of a temperature detection part. The detailed configuration of the liquid ejection head 510 will be described later. As the ink to be ejected, for example, a total of four colors of ink, namely black, cyan, magenta, and yellow, may be ejected. Note that not limited to the above four colors, inks of any color such as light cyan, light magenta, white, etc. may be ejected. The liquid ejection head 510 is mounted on a carriage 572 described later which the movement mechanism 570 has, and reciprocates in the main scanning direction along with the movement of the carriage 572. In the present embodiment, the main scanning direction is the +X direction and the -X direction.

[0013] The ink tank 550 stores the ink ejected from the liquid ejection head 510. The ink tank 550 is not mounted on the carriage 572. The ink tank 550 and the liquid ejection head 510 are connected by a resin tube 552, and ink is supplied from the ink tank 550 to the liquid ejection head 510 through such a tube 552. Note that instead of the ink tank 550, a bag-shaped liquid pack formed of a flexible film may be used.

[0014] The conveyance mechanism 560 conveys the printing paper P in the sub-scanning direction. The sub-scanning direction is a direction orthogonal to the X-axis direction which is the main scanning direction, and in the present embodiment, it is the +Y direction and the -Y direction. The conveyance mechanism 560 includes a conveyance rod 564 to which three conveyance rollers 562 are attached, and a conveyance motor 566 that rotationally drives the conveyance rod 564. When the conveyance motor 566 rotationally drives the conveyance rod 564, the plurality of conveyance rollers 562 rotate and the printing paper P is conveyed in the +Y direction in the sub-scanning direction. Note that the number of conveyance rollers 562 is not limited to three and may be any number. Also, a configuration in which a plurality of conveyance mechanisms 560 are provided may be adopted.

[0015] In addition to the carriage 572 described above, the moving mechanism 570 includes a conveyance belt 574, a moving motor 576, and a pulley 577. The carriage 572 mounts the liquid ejection head 510 in a state where ink can be ejected. The carriage 572 is attached to the conveyance belt 574. The conveyance belt 574 is stretched between the moving motor 576 and the pulley 577. When the moving motor 576 rotates and drives, the conveyance belt 574 reciprocates in the main scanning direction. Thereby, the carriage 572 attached to the conveyance belt 574 also reciprocates in the main scanning direction.

[0016] The control unit 580 controls the entire liquid ejection apparatus 500. For example, the control unit 580 controls the reciprocating operation of the carriage 572 along the main scanning direction, the conveyance operation of the printing paper P along the sub-scanning direction, and the ejection operation of the liquid ejection head 510. Further, in the present embodiment, the control unit 580 detects the temperature of the pressure chamber 12 described later based on the measured value measured by the temperature detection unit included in the liquid ejection head 510. The control unit 580 also functions as a drive control unit for the piezoelectric element 300 described later. That is, the control unit 580 outputs a drive signal based on the detected temperature of the pressure chamber 12 to the liquid ejection head 510 to drive the piezoelectric element 300, thereby controlling the ejection of ink onto the printing paper P. The control unit 580 may be composed of, for example, one or a plurality of processing circuits such as a CPU (Central Processing Unit) or an FPGA (Field Programmable Gate Array) and one or a plurality of storage circuits such as a semiconductor memory.

[0017] As shown in Figure 2, the liquid ejection head 510 ejects ink droplets in the Z-axis direction, more specifically in the +Z direction. The liquid ejection head 510 has as its constituent components a pressure chamber substrate 10, a communication plate 15, a nozzle plate 20, a compliance substrate 45, a diaphragm 50 (described later), a piezoelectric element 300 (described later), a protective substrate 30, a case member 40, and a wiring board 120. The pressure chamber substrate 10, communication plate 15, nozzle plate 20, compliance substrate 45, diaphragm 50, piezoelectric element 300, protective substrate 30, and case member 40 can also be considered an example of laminated members that form the liquid ejection head 510 when stacked.

[0018] The pressure chamber substrate 10 is made of, for example, a silicon substrate, a glass substrate, an SOI substrate, or various ceramic substrates. The pressure chamber substrate 10 can be considered an example of a substrate.

[0019] As shown in Figure 3, the pressure chamber substrate 10 has two rows of pressure chambers arranged in the X-axis direction, with each row containing multiple pressure chambers 12 aligned along the Y-axis. In other words, the liquid discharge head 510 has multiple pressure chambers 12, and these multiple pressure chambers 12 form rows of pressure chambers arranged along the Y-axis. The Y-axis direction is an example of a first direction, and the X-axis direction is an example of a second direction. A row of pressure chambers is an example of a group of pressure chambers. Of the two rows of pressure chambers, the row on the +X direction side is called the first row of pressure chambers, and the row of pressure chambers that is separated from the first row of pressure chambers in the -X direction along the X-axis is called the second row of pressure chambers. The +X direction is one example of the second direction, and the -X direction is the other example of the second direction. Figure 3 is a plan view of the liquid discharge head 510, but it shows the configuration around the pressure chamber substrate 10, and for the sake of clarity, the protective substrate 30 and case member 40 are omitted.

[0020] The multiple pressure chambers 12 constituting each row of pressure chambers are arranged on a straight line along the Y-axis so that their positions in the X-axis direction are the same. Pressure chambers 12 adjacent to each other in the Y-axis direction are separated by partition walls 11 as shown in Figure 6. Of course, the arrangement of the pressure chambers 12 is not particularly limited. For example, the arrangement of multiple pressure chambers 12 aligned in the Y-axis direction may be a so-called staggered arrangement, where each pressure chamber 12 is shifted by one in the X-axis direction.

[0021] Furthermore, the pressure chamber 12 in this embodiment is formed in a rectangular shape, for example, where the length in the X-axis direction is longer than the length in the Y-axis direction when viewed from the +Z direction in a plan view. Of course, the shape of the pressure chamber 12 when viewed from the +Z direction in a plan view is not particularly limited and may be a parallelogram, polygon, circle, oval, etc. Note that the oval shape referred to here is a shape based on a rectangle with semicircular ends in the longitudinal direction, and includes rounded rectangles, ellipses, egg shapes, etc.

[0022] As shown in Figures 2 and 4, the communication plate 15, nozzle plate 20, and compliance substrate 45 are sequentially stacked on the +Z direction side of the pressure chamber substrate 10.

[0023] The communication plate 15 is provided with a nozzle communication passage 16 that connects the pressure chamber 12 and the nozzle 21. The communication plate 15 is also provided with a first manifold section 17 and a second manifold section 18 that constitute part of a manifold 100, which is a common liquid chamber through which multiple pressure chambers 12 are connected. The first manifold section 17 is provided penetrating the communication plate 15 in the Z-axis direction. The second manifold section 18 is provided opening on the +Z side surface without penetrating the communication plate 15 in the Z-axis direction.

[0024] Furthermore, the connecting plate 15 is provided with an independent supply passage 19 for each of the pressure chambers 12, which communicates with one end of the pressure chamber 12 in the X-axis direction. The supply passage 19 connects the second manifold section 18 to each pressure chamber 12, supplying ink from the manifold 100 to each pressure chamber 12.

[0025] As the connecting plate 15, a silicon substrate, glass substrate, SOI substrate, various ceramic substrates, metal substrates, etc., can be used. Examples of metal substrates include stainless steel substrates. It is preferable that the connecting plate 15 be made of a material with a coefficient of thermal expansion approximately the same as that of the pressure chamber substrate 10. This makes it possible to suppress warping of the pressure chamber substrate 10 and the connecting plate 15 caused by differences in their coefficients of thermal expansion when the temperatures of the pressure chamber substrate 10 and the connecting plate 15 change.

[0026] The nozzle plate 20 is provided on the side of the communication plate 15 opposite to the pressure chamber substrate 10, that is, on the +Z direction side. Nozzles 21 are formed on the nozzle plate 20, which communicate with each pressure chamber 12 via nozzle communication passages 16.

[0027] In this embodiment, the multiple nozzles 21 are arranged in a line along the Y-axis. The nozzle plate 20 has two rows of nozzles, each row of multiple nozzles 21, spaced apart in the X-axis direction. The two rows of nozzles correspond to the first pressure chamber row and the second pressure chamber row, respectively. The multiple nozzles 21 in each row are arranged so that they are at the same position in the X-axis direction. The arrangement of the nozzles 21 is not particularly limited. For example, nozzles 21 arranged in a line along the Y-axis direction may be positioned with every other nozzle offset in the X-axis direction.

[0028] The material of the nozzle plate 20 is not particularly limited, and for example, silicon substrates, glass substrates, SOI substrates, various ceramic substrates, and metal substrates can be used. Examples of metal substrates include stainless steel substrates. Furthermore, organic materials such as polyimide resin can also be used as the material of the nozzle plate 20. However, it is preferable to use a material for the nozzle plate 20 that has approximately the same thermal expansion coefficient as the communication plate 15. This makes it possible to suppress warping of the nozzle plate 20 and the communication plate 15 caused by differences in thermal expansion coefficients when the temperature of the nozzle plate 20 and the communication plate 15 changes.

[0029] The compliance substrate 45 is provided together with the nozzle plate 20 on the side of the communication plate 15 opposite to the pressure chamber substrate 10, i.e., on the +Z direction side. This compliance substrate 45 is provided around the nozzle plate 20 and seals the openings of the first manifold section 17 and the second manifold section 18 provided on the communication plate 15. In this embodiment, the compliance substrate 45 comprises a sealing film 46 made of a flexible thin film and a fixed substrate 47 made of a hard material such as metal. The region of the fixed substrate 47 facing the manifold 100 is an opening 48 that is completely removed in the thickness direction. Therefore, one side of the manifold 100 is a compliance section 49 sealed only by the flexible sealing film 46.

[0030] On the other hand, on the side of the pressure chamber substrate 10 opposite to the nozzle plate 20, i.e., the side in the -Z direction, a diaphragm 50 and a piezoelectric element 300 that causes the diaphragm 50 to bend and deform, thereby generating a pressure change in the ink in the pressure chamber 12, are stacked, as will be described in more detail later. In other words, the diaphragm 50 is provided in the +Z direction relative to the piezoelectric element 300 in the Z-axis direction, and the pressure chamber substrate 10 is provided in the +Z direction relative to the diaphragm 50 in the Z-axis direction. The Z-axis direction is an example of the stacking direction, the +Z direction is one example of the stacking direction, and the -Z direction is another example of the stacking direction. Note that Figure 4 is a diagram to explain the overall configuration of the liquid discharge head 510, and the configuration of the piezoelectric element 300 is shown in a simplified manner.

[0031] A protective substrate 30, having approximately the same size as the pressure chamber substrate 10, is further bonded to the -Z-direction side of the pressure chamber substrate 10 using an adhesive or the like. The protective substrate 30 has a holding portion 31, which is a space for protecting the piezoelectric elements 300. The holding portion 31 is provided independently for each row of piezoelectric elements 300 arranged in the Y-axis direction, and two of them are formed side by side in the X-axis direction. In addition, the protective substrate 30 has a through hole 32 that penetrates in the Z-axis direction between the two holding portions 31 arranged side by side in the X-axis direction.

[0032] Furthermore, a case member 40 is fixed to the protective substrate 30, which together defines a manifold 100 communicating with multiple pressure chambers 12, in conjunction with the pressure chamber substrate 10. The case member 40 has substantially the same shape as the communication plate 15 described above when viewed from the -Z direction in plan view, and is joined to the protective substrate 30 as well as to the communication plate 15 described above.

[0033] Such a case member 40 has a housing section 41 on the side of the protective substrate 30 that is a space with a depth capable of accommodating the pressure chamber substrate 10 and the protective substrate 30. This housing section 41 has an opening area larger than the surface of the protective substrate 30 that is joined to the pressure chamber substrate 10. When the pressure chamber substrate 10 and the protective substrate 30 are housed in the housing section 41, the opening surface of the housing section 41 on the nozzle plate 20 side is sealed by a communication plate 15.

[0034] Furthermore, the case member 40 has third manifold sections 42 defined on both outer sides of the housing section 41 in the X-axis direction. The manifold 100 of this embodiment is composed of the first manifold section 17 and the second manifold section 18 provided on the communication plate 15, and the third manifold section 42. The manifold 100 is provided continuously along the Y-axis direction, and the supply communication passages 19 that connect each pressure chamber 12 to the manifold 100 are arranged side by side in the Y-axis direction.

[0035] Furthermore, the case member 40 is provided with supply ports 44 that communicate with the manifold 100 and supply ink to each manifold 100. In addition, the case member 40 is provided with connection ports 43 that communicate with the through holes 32 of the protective substrate 30 and through which the wiring board 120 is inserted.

[0036] In this embodiment of the liquid ejection head 510, ink is drawn in from a supply port 44 connected to an ink tank 550 via a tube 552. After filling the inside with ink from the manifold 100 to the nozzle 21, the head circuit 121 applies a voltage based on a drive signal to each piezoelectric element 300 corresponding to the pressure chamber 12. As a result, the diaphragm 50 flexes and deforms together with the piezoelectric element 300, increasing the pressure in each pressure chamber 12, and ink droplets are ejected from each nozzle 21.

[0037] The configuration described below, which includes the diaphragm 50 and piezoelectric element 300, and is laminated on the -Z side of the pressure chamber substrate 10, will be explained in detail below. The liquid discharge head 510, which is laminated on the -Z side of the pressure chamber substrate 10, has individual lead electrodes 91, a common lead electrode 92, a measuring lead electrode 93, and resistance wiring 401 in addition to the diaphragm 50 and piezoelectric element 300.

[0038] As shown in Figures 4 to 6, the diaphragm 50 is composed of an elastic film 51 made of silicon oxide provided on the pressure chamber substrate 10 side, and an insulating film 52 made of zirconium oxide provided on the elastic film 51. Liquid channels such as the pressure chamber 12 are formed by anisotropic etching of the pressure chamber substrate 10 from the +Z direction side, and the -Z direction side of the liquid channels such as the pressure chamber 12 is composed of the elastic film 51.

[0039] The composition of the diaphragm 50 is not particularly limited. The diaphragm 50 may be composed of either an elastic film 51 or an insulating film 52, or it may also include other films besides the elastic film 51 and the insulating film 52. Examples of materials for the other films include silicon and silicon nitride.

[0040] The piezoelectric element 300 is an example of a piezoelectric actuator that generates a pressure change in the ink in the pressure chamber 12. This piezoelectric element 300 has a first electrode 60, a piezoelectric body 70, and a second electrode 80, which are sequentially stacked from the +Z direction side (the side of the diaphragm 50) toward the -Z direction. In other words, the piezoelectric element 300 includes the first electrode 60, the second electrode 80, and the piezoelectric body 70, and in the Z-axis direction in which the first electrode 60, the second electrode 80, and the piezoelectric body 70 are stacked, the piezoelectric body 70 is provided between the first electrode 60 and the second electrode 80.

[0041] The first electrode 60 and the second electrode 80 are both electrically connected to the wiring board 120 and apply a voltage to the piezoelectric element 70 corresponding to a drive signal supplied from the head circuit 121 mounted on the wiring board 120. The first electrode 60 is supplied with a different drive voltage depending on the amount of ink ejected, and the second electrode 80 is supplied with a constant holding voltage regardless of the amount of ink ejected. The amount of ink ejected corresponds to the required volume change of the pressure chamber 12. This creates a potential difference between the first electrode 60 and the second electrode 80, causing the piezoelectric element 70 to deform. That is, when the piezoelectric element 300 is driven, the diaphragm 50 deforms or vibrates, and the volume of the pressure chamber 12 changes, thereby applying pressure to the ink contained in the pressure chamber 12, and the ink is ejected from the nozzle 21 via the nozzle communication passage 16.

[0042] Of the piezoelectric element 300, the portion in the piezoelectric body 70 that experiences piezoelectric strain when a voltage is applied between the first electrode 60 and the second electrode 80 is referred to as the active portion 310. Conversely, the portion in the piezoelectric body 70 that does not experience piezoelectric strain is referred to as the inactive portion 320. In other words, of the piezoelectric element 300, the portion of the piezoelectric body 70 sandwiched between the first electrode 60 and the second electrode 80 is the active portion 310, and the portion of the piezoelectric body 70 not sandwiched between the first electrode 60 and the second electrode 80 is the inactive portion 320. Furthermore, when the piezoelectric element 300 is driven, the part that actually displaces in the Z-axis direction is called the flexible part, and the part that does not displace in the Z-axis direction is called the non-flexible part. In other words, of the piezoelectric element 300, the part facing the pressure chamber 12 in the Z-axis direction is the flexible part, and the part outside the pressure chamber 12 is the non-flexible part. The active part 310 is also called the active component, and the inactive part 320 is also called the non-active component.

[0043] Generally, one electrode of the active section 310 is configured as an individual electrode independent of each active section 310, while the other electrode is configured as a common electrode common to multiple active sections 310. In this embodiment, the first electrode 60 constitutes an individual electrode, and the second electrode 80 constitutes a common electrode.

[0044] Specifically, the first electrode 60 is provided on the +Z side of the Z-axis direction relative to the piezoelectric body 70, and is divided for each pressure chamber 12 to form an independent individual electrode for each active part 310. That is, the first electrode 60 is provided individually for each of the multiple pressure chambers 12. The first electrode 60 is formed with a width narrower than the width of the pressure chamber 12 in the Y-axis direction. That is, in the Y-axis direction, the end of the first electrode 60 is located inside the region facing the pressure chamber 12.

[0045] Furthermore, the +X-direction end 60a and the -X-direction end 60b of the first electrode 60 are located outside the pressure chamber 12. For example, in the first pressure chamber row, as shown in Figure 5, the end 60a of the first electrode 60 is located on the +X-direction side of the +X-direction end 12a of the pressure chamber 12. The end 60b of the first electrode 60 is located on the -X-direction side of the -X-direction end 12b of the pressure chamber 12.

[0046] The material of the first electrode 60 is not particularly limited, but conductive materials such as metals like platinum (Pt), iridium (Ir), gold (Au), and titanium (Ti), or conductive metal oxides such as indium tin oxide (ITO), can be used. Alternatively, it may be formed by laminating multiple materials such as platinum (Pt), iridium (Ir), gold (Au), and titanium (Ti). In this embodiment, platinum (Pt) was used as the first electrode 60.

[0047] As shown in Figure 3, the piezoelectric element 70 is provided continuously along the Y-axis direction with a predetermined length in the X-axis direction. That is, the piezoelectric element 70 is provided continuously along the direction in which the pressure chambers 12 are arranged side by side with a predetermined thickness. The thickness of the piezoelectric element 70 is not particularly limited, but it is formed to a thickness of about 1000 nanometers to 4000 nanometers.

[0048] Furthermore, as shown in Figure 5, the length of the piezoelectric element 70 in the X-axis direction is longer than the length of the pressure chamber 12 in the X-axis direction. Therefore, on both sides of the pressure chamber 12 in the X-axis direction, the piezoelectric element 70 extends to the outside of the pressure chamber 12. This extension of the piezoelectric element 70 to the outside of the pressure chamber 12 in the X-axis direction improves the strength of the diaphragm 50. Consequently, when the active part 310 is driven to displace the piezoelectric element 300, it is possible to suppress the occurrence of cracks or other damage to the diaphragm 50 and the piezoelectric element 300.

[0049] Furthermore, for example, in the first pressure chamber row, as shown in Figure 5, the +X end 70a of the piezoelectric element 70 is located on the +X side, outside the end 60a of the first electrode 60. That is, the end 60a of the first electrode 60 is covered by the piezoelectric element 70. On the other hand, the -X end 70b of the piezoelectric element 70 is located on the +X side, inside the end 60b of the first electrode 60, and the end 60b of the first electrode 60 is not covered by the piezoelectric element 70.

[0050] Furthermore, as shown in Figures 3 and 6, the piezoelectric element 70 has grooves 71 formed in each partition wall 11, which are thinner than other areas. In this embodiment, the grooves 71 are formed by completely removing the piezoelectric element 70 in the Z-axis direction. That is, having a portion of the piezoelectric element 70 that is thinner than other areas includes portions where the piezoelectric element 70 has been completely removed in the Z-axis direction. Of course, the piezoelectric element 70 may also be formed thinner than other portions at the bottom surface of the grooves 71.

[0051] Furthermore, the length of the groove 71 in the Y-axis direction, that is, the width of the groove 71, is the same as or wider than the width of the partition wall 11. In this embodiment, the width of the groove 71 is wider than the width of the partition wall 11.

[0052] Such grooves 71 are formed to be rectangular in shape when viewed from the -Z direction. Of course, the shape of the groove 71 when viewed from the -Z direction is not limited to a rectangle, but may be a polygon with five or more sides, or it may be circular or elliptical, etc.

[0053] By providing grooves 71 in the piezoelectric body 70, the rigidity of the portion of the diaphragm 50 facing the Y-axis end of the pressure chamber 12, the so-called arm portion of the diaphragm 50, is reduced, thereby allowing the piezoelectric element 300 to be displaced more effectively.

[0054] Examples of piezoelectric material 70 include a perovskite crystal film made of a ferroelectric ceramic material exhibiting electromechanical conversion properties, formed on the first electrode 60, so-called perovskite crystal. As the material for the piezoelectric material 70, for example, ferroelectric piezoelectric materials such as lead zirconate titanate (PZT) or materials to which metal oxides such as niobium oxide, nickel oxide, or magnesium oxide are added can be used. Specifically, lead titanate (PbTiO3), lead zirconate titanate (Pb(Zr,Ti)O3), lead zirconate (PbZrO3), lead lanthanum titanate ((Pb,La),TiO3), lead zirconate titanate lanthanum ((Pb,La)(Zr,Ti)O3), or magnesium zirconium titanate lead (Pb(Zr,Ti)(Mg,Nb)O3) can be used. In this embodiment, lead zirconate titanate (PZT) was used as the piezoelectric material 70.

[0055] Furthermore, the material for the piezoelectric element 70 is not limited to lead-based piezoelectric materials containing lead; lead-free piezoelectric materials can also be used. Examples of lead-free piezoelectric materials include bismuth ironate ((BiFeO3), abbreviated as "BFO"), barium titanate ((BaTiO3), abbreviated as "BT"), potassium sodium niobate ((K,Na)(NbO3), abbreviated as "KNN"), potassium sodium lithium niobate ((K,Na,Li)(NbO3)), potassium sodium lithium tantalate niobate ((K,Na,Li)(Nb,Ta)O3), potassium bismuth titanate ((Bi1 / 2K1 / 2)TiO3, abbreviated as "BKT"), sodium bismuth titanate ((Bi1 / 2Na1 / 2)TiO3, abbreviated as "BNT"), and manganese. Examples include bismuth oxide (BiMnO3, abbreviated as "BM"), a composite oxide containing bismuth, potassium, titanium, and iron and having a perovskite structure (x[(BixK1-x)TiO3]-(1-x)[BiFeO3], abbreviated as "BKT-BF"), a composite oxide containing bismuth, iron, barium, and titanium and having a perovskite structure ((1-x)[BiFeO3]-x[BaTiO3], abbreviated as "BFO-BT"), and those to which metals such as manganese, cobalt, and chromium are added ((1-x)[Bi(Fe1-yMy)O3]-x[BaTiO3] (where M is Mn, Co, or Cr)).

[0056] As shown in Figures 3, 5, and 6, the second electrode 80 is provided on the -Z direction side of the Z-axis direction, opposite to the first electrode 60, relative to the piezoelectric body 70, and constitutes a common electrode common to multiple active parts 310. That is, the second electrode 80 is provided in common to multiple pressure chambers 12. The second electrode 80 is provided continuously in the Y-axis direction with a predetermined length in the X-axis direction. This second electrode 80 is also provided on the inner surface of the groove 71, that is, on the side surface of the groove 71 of the piezoelectric body 70 and on the insulating film 52 which is the bottom surface of the groove 71. Regarding the inside of the groove 71, the second electrode 80 may be provided only on a part of the inner surface of the groove 71, or it may not be provided over the entire inner surface of the groove 71.

[0057] Furthermore, for example, in the first pressure chamber row, as shown in Figure 5, the +X-direction end 80a of the second electrode 80 is positioned on the +X-direction side such that it is outside the end 60a of the first electrode 60, which is covered by the piezoelectric element 70. That is, the end 80a of the second electrode 80 is located on the +X-direction side, outside the end 12a of the pressure chamber 12, and outside the end 60a of the first electrode 60. In this embodiment, the end 80a of the second electrode 80 substantially coincides with the end 70a of the piezoelectric element 70 in the X-axis direction. Therefore, the +X-direction end of the active portion 310, i.e., the boundary between the active portion 310 and the inactive portion 320, is defined by the end 60a of the first electrode 60.

[0058] On the other hand, the -X end 80b of the second electrode 80 is located on the -X side, which is outside the -X end 12b of the pressure chamber 12, but on the +X side, which is inside the end 70b of the piezoelectric element 70. As described above, the end 70b of the piezoelectric element 70 is located inside the end 60b of the first electrode 60, which is on the +X side. Therefore, the end 80b of the second electrode 80 is located on the piezoelectric element 70, which is on the +X side, which is outside the end 60b of the first electrode 60. As a result, there is an exposed portion of the surface of the piezoelectric element 70 on the -X side of the end 80b of the second electrode 80.

[0059] Thus, since the end 80b of the second electrode 80 is positioned on the +X side of the end 70b of the piezoelectric body 70 and the end 60b of the first electrode 60, the -X side of the active portion 310, i.e., the boundary between the active portion 310 and the inactive portion 320, is defined by the end 80b of the second electrode 80.

[0060] The material of the second electrode 80 is not particularly limited, but, similar to the first electrode 60, conductive materials such as metals like platinum (Pt), iridium (Ir), gold (Au), and titanium (Ti), or conductive metal oxides such as indium tin oxide (ITO) can be used. Alternatively, multiple materials such as platinum (Pt), iridium (Ir), gold (Au), and titanium (Ti) may be laminated to form the second electrode 80. In this embodiment, iridium (Ir) was used as the second electrode 80.

[0061] Furthermore, outside the end 80b of the second electrode 80, that is, further to the -X direction from the end 80b of the second electrode 80, there is a wiring section 85 which is on the same layer as the second electrode 80 but is electrically discontinuous from the second electrode 80. The wiring section 85 is formed on the piezoelectric body 70 and extends over the first electrode 60 which extends further in the -X direction than the piezoelectric body 70, with a gap so as not to contact the end 80b of the second electrode 80. This wiring section 85 is provided independently for each active section 310. That is, multiple wiring sections 85 are arranged at predetermined intervals along the Y-axis. The wiring section 85 may be formed in a different layer from the second electrode 80, but it is preferable that it be formed in the same layer as the second electrode 80. This simplifies the manufacturing process of the wiring section 85 and reduces costs.

[0062] Furthermore, the first electrode 60 and the second electrode 80 constituting the piezoelectric element 300 are electrically connected to the first electrode 60, with individual lead electrodes 91 connected to the first electrode 60 and a common lead electrode 92, which is a common drive electrode, connected to the second electrode 80. The individual lead electrodes 91 are an example of first wiring, and the common lead electrode 92 is an example of second wiring. A flexible wiring board 120 is electrically connected to the ends of the individual lead electrodes 91 and the common lead electrode 92 opposite to the ends connected to the piezoelectric element 300. Multiple wirings for connecting to the control unit 580 and a power supply circuit (not shown) are formed on the wiring board 120. In this embodiment, the wiring board 120 is made of, for example, an FPC (Flexible Printed Circuit). However, instead of an FPC, it may be made of any flexible substrate such as an FFC (Flexible Flat Cable).

[0063] In this embodiment, the individual lead electrodes 91 and the common lead electrode 92 extend to be exposed within a through hole 32 formed in the protective substrate 30, and are electrically connected to the wiring board 120 within this through hole 32. A head circuit 121 having a switching element for driving the piezoelectric element 300 is mounted on the wiring board 120.

[0064] In this embodiment, the individual lead electrodes 91 and the common lead electrode 92 are made of the same layer but are formed to be electrically discontinuous. This simplifies the manufacturing process and reduces costs compared to forming the individual lead electrodes 91 and the common lead electrode 92 separately. Of course, the individual lead electrodes 91 and the common lead electrode 92 may be formed from different layers.

[0065] The material of the individual lead electrodes 91 and the common lead electrode 92 is not particularly limited as long as it is an conductive material, and for example, gold (Au), copper (Cu), titanium (Ti), tungsten (W), nickel (Ni), chromium (Cr), platinum (Pt), aluminum (Al), etc. can be used. In this embodiment, gold (Au) was used for the individual lead electrodes 91 and the common lead electrode 92. The individual lead electrodes 91 and the common lead electrode 92 may also have an adhesion layer to improve adhesion with the first electrode 60, the second electrode 80 and the diaphragm 50.

[0066] Individual lead electrodes 91 are provided for each active section 310, that is, for each first electrode 60. As shown in Figure 5, for example, in the first pressure chamber row, the individual lead electrodes 91 are connected via the wiring section 85 to the vicinity of the end 60b of the first electrode 60, which is located outside the piezoelectric element 70, and are led out in the -X direction onto the pressure chamber substrate 10, and actually onto the diaphragm 50.

[0067] On the other hand, as shown in Figure 3, for example, in the first pressure chamber row, the common lead electrode 92 is drawn out in the -X direction from the second electrode 80, which constitutes the common electrode on the piezoelectric body 70, to the diaphragm 50 at both ends in the Y-axis direction. The common lead electrode 92 also has an extended portion 92a and an extended portion 92b. As shown in Figures 3 and 5, for example, in the first pressure chamber row, the extended portion 92a extends along the Y-axis direction to a region corresponding to the end 12a of the pressure chamber 12, and the extended portion 92b extends along the Y-axis direction to a region corresponding to the end 12b of the pressure chamber 12. These extended portions 92a and 92b are provided continuously across the Y-axis direction for a plurality of active portions 310.

[0068] Furthermore, the extensions 92a and 92b extend from the inside of the pressure chamber 12 to the outside of the pressure chamber 12 in the X-axis direction. In this embodiment, the active portion 310 of the piezoelectric element 300 extends to the outside of the pressure chamber 12 at both ends of the pressure chamber 12 in the X-axis direction, and the extensions 92a and 92b extend along this active portion 310 to the outside of the pressure chamber 12.

[0069] As shown in Figure 5, a resistance wiring 401 (first resistance wiring) is provided on the -Z direction side of the diaphragm 50. The resistance wiring 401 is an example of a temperature sensing unit for detecting the temperature of the pressure chamber 12. The temperature sensing unit in this embodiment utilizes the characteristic that the electrical resistance value of metals, semiconductors, etc., changes with temperature. The material of the resistance wiring 401 is not particularly limited as long as it is a material whose electrical resistance value is temperature-dependent, and for example, gold (Au), platinum (Pt), iridium (Ir), aluminum (Al), copper (Cu), titanium (Ti), tungsten (W), nickel (Ni), chromium (Cr), etc. can be used. Of these, platinum (Pt) can be suitably adopted as the material for the resistance wiring 401 from the viewpoint of high stability and accuracy, as its resistance value changes significantly with temperature. The electrical resistance value is an example of a measured value of the temperature sensing unit being measured. In this embodiment, the resistive wiring 401 is formed on the -Z side surface of the diaphragm 50 in the same layer as the first electrode 60, but is electrically discontinuous with the first electrode 60. Therefore, the material of the resistive wiring 401 is platinum (Pt), the same as the first electrode 60. This simplifies the manufacturing process and reduces costs compared to the case where the resistive wiring 401 is formed separately from the first electrode 60. Of course, the resistive wiring 401 may also be formed on a different layer from the first electrode 60.

[0070] As shown in Figure 3, the resistance wiring 401 is continuous, with one end of the resistance wiring 401 on the +X side in the X-axis direction connected to the measuring lead electrode 93a, and the other end of the resistance wiring 401 on the -X side in the X-axis direction connected to the measuring lead electrode 93b. As a result, the resistance wiring 401 is electrically connected to the wiring board 120, and the control unit 580 can measure the electrical resistance value of the resistance wiring 401. The measuring lead electrodes 93, including measuring lead electrodes 93a and 93b, are an example of the connection portion of the resistance wiring 401 to the wiring board 120. In this embodiment, the resistance wiring 401 is covered by the piezoelectric element 70 and is located between the diaphragm 50 and the piezoelectric element 70 in the Z-axis direction.

[0071] The resistance wiring 401 comprises a first pressure chamber row-side meandering pattern that is on the +X direction side in the X-axis direction, and a second pressure chamber row-side meandering pattern that is on the -X direction side in the X-axis direction. The first pressure chamber row-side meandering pattern, when viewed from the -Z direction, meanders along the Y-axis direction at a position that overlaps with the supply communication passage 19 that communicates with each pressure chamber 12 constituting the first pressure chamber row. The second pressure chamber row-side meandering pattern, when viewed from the -Z direction, meanders along the Y-axis direction at a position that overlaps with the supply communication passage 19 that communicates with each pressure chamber 12 constituting the second pressure chamber row. In other words, the resistance wiring 401 comprises a first pressure chamber row-side meandering pattern corresponding to the first pressure chamber row formed by a plurality of pressure chambers 12, and a second pressure chamber row-side meandering pattern corresponding to the second pressure chamber row formed by a plurality of pressure chambers 12. Furthermore, as shown in Figures 4 and 5, the distance in the Z-axis direction between the -Z end of the pressure chamber 12 and the resistance wiring 401 is shorter than the Z-axis dimension of the pressure chamber 12. Also, for example, in the first pressure chamber row, the longest distance in the X-axis direction between the +X end 12a of the pressure chamber 12 and the resistance wiring 401 is shorter than the X-axis dimension of the pressure chamber 12. Therefore, the electrical resistance of the resistance wiring 401 is prone to changing in response to temperature changes in the pressure chamber 12.

[0072] In this embodiment, the measuring lead electrode 93, including measuring lead electrodes 93a and 93b, is made of the same single layer as the individual lead electrodes 91 and the common lead electrode 92, but is formed to be electrically discontinuous. This simplifies the manufacturing process and reduces costs compared to forming the measuring lead electrode 93 separately from the individual lead electrodes 91 and the common lead electrode 92. Of course, the measuring lead electrode 93 may also be formed from a different layer than the individual lead electrodes 91 and the common lead electrode 92.

[0073] The material of the measuring lead electrode 93 is not particularly limited as long as it is a conductive material, and for example, gold (Au), copper (Cu), titanium (Ti), tungsten (W), nickel (Ni), chromium (Cr), platinum (Pt), aluminum (Al), etc. can be used. In this embodiment, gold (Au) was used as the measuring lead electrode 93. Therefore, the material of the measuring lead electrode 93 is the same as that of the individual lead electrodes 91 and the common lead electrode 92. In addition, the measuring lead electrode 93 may have an adhesion layer to improve adhesion with the resistance wiring 401 and the diaphragm 50.

[0074] In this embodiment, the measuring lead electrode 93 extends to be exposed within a through hole 32 formed in the protective substrate 30 and is electrically connected to the wiring board 120 within this through hole 32. This allows the control unit 580 to obtain the electrical resistance value of the resistive wiring 401 via the wiring board 120. In this embodiment, the control unit 580 has pre-stored the correspondence between the electrical resistance value of the resistive wiring 401 and the temperature. Then, when driving the piezoelectric element 300, the control unit 580 measures the electrical resistance value of the resistive wiring 401 and detects the temperature of the pressure chamber 12 based on the correspondence between the electrical resistance value of the resistive wiring 401 and the temperature.

[0075] For example, if the temperature sensing unit is located outside the liquid ejection head 510, the difference between the temperature measured by the temperature sensing unit and the temperature inside the pressure chamber 12 may be larger than the difference between the temperature inside the liquid ejection head 510 and the temperature inside the pressure chamber 12. In this case, the liquid ejection device 500 may not be able to control the ejection of the liquid ejection head 510 to suit the temperature of the ink inside the pressure chamber 12. In this embodiment, the resistance wiring 401 is laminated on the diaphragm 50, which is a component of the liquid ejection head 510. That is, the resistance wiring 401 is located inside the liquid ejection head 510. As a result, since the liquid ejection head 510 has the resistance wiring 401, the difference between the temperature detected based on the measured electrical resistance value of the resistance wiring 401 and the temperature inside the pressure chamber 12 can be reduced compared to the case where the temperature of the external environment of the liquid ejection head 510 is measured. Furthermore, as a result, the liquid ejection device 500 can easily control the ejection of the liquid ejection head 510 to suit the temperature of the ink inside the pressure chamber 12.

[0076] As described above, the liquid discharge head 510 and the liquid discharge device 500 according to Embodiment 1 provide the following advantages.

[0077] The liquid discharge head 510 includes a first electrode 60, a second electrode 80, and a piezoelectric element 70, and in the Z-axis direction in which the first electrode 60, the second electrode 80, and the piezoelectric element 70 are stacked, the piezoelectric element 300 is provided with the piezoelectric element 70 between the first electrode 60 and the second electrode 80, a diaphragm 50 provided on the +Z direction side of the piezoelectric element 300 in the Z-axis direction, a pressure chamber substrate 10 provided on the +Z direction side of the diaphragm 50 in the Z-axis direction, the pressure chamber substrate 10 having a plurality of pressure chambers 12 whose volume changes due to the deformation of the diaphragm 50 due to the driving of the piezoelectric element 300, a wiring board 120, individual lead electrodes 91 that electrically connect the wiring board 120 and the first electrode 60, a common lead electrode 92 that electrically connects the wiring board 120 and the second electrode 80, and a resistance wiring 401 electrically connected to the wiring board 120 for detecting the temperature of the pressure chambers 12. According to this, since the liquid discharge head 510 has a resistance wiring 401, the difference between the temperature detected based on the measured value of the resistance wiring 401 and the temperature inside the pressure chamber 12 can be reduced compared to when the temperature of the external environment of the liquid discharge head 510 is measured.

[0078] The resistive wiring 401 is formed from the same material as the first electrode 60. This makes it easier to form the resistive wiring 401 using the same process as the first electrode 60.

[0079] The first electrode 60 is individually provided for each of the multiple pressure chambers 12 arranged in the Y-axis direction, and the second electrode 80 is provided in common for the multiple pressure chambers 12. The first electrode 60 is provided on the +Z direction side of the Z-axis direction relative to the piezoelectric body 70, and the second electrode 80 is provided on the -Z direction side of the Z-axis direction relative to the piezoelectric body 70. This makes it easy to drive the piezoelectric element 300 according to the required amount of ink to be ejected.

[0080] The wiring board 120 is equipped with a head circuit 121, which can apply a drive voltage to the first electrode 60 via individual lead electrodes 91 that changes in accordance with the amount of ink ejected, and can apply a constant holding voltage to the second electrode 80 via a common lead electrode 92, regardless of the amount of ink ejected. This makes it easy to drive the piezoelectric element 300 according to the required amount of ink ejected.

[0081] The individual lead electrodes 91 are provided in the Y-axis direction between the common lead electrode 92 and the measuring lead electrode 93. This allows the first electrode 60, the second electrode 80, and the resistance wiring 401 to be efficiently connected to the wiring board 120.

[0082] The liquid ejection device 500 includes a liquid ejection head 510 and a control unit 580 that controls the ejection operation of ink from the liquid ejection head 510. This configuration makes it easy to realize a system in which the ejection operation of the liquid ejection head 510 can be controlled.

[0083] 2. Embodiment 2 Next, a resistive wiring 451 provided in the liquid discharge head 510 of Embodiment 2 will be described as one embodiment of the present disclosure. Parts common to both the liquid discharge head 510 of Embodiment 1 and this embodiment are denoted by the same reference numerals, and their descriptions are omitted.

[0084] In Embodiment 1, the resistance wiring 401 was laminated on the -Z-direction side of the diaphragm 50 so as to be in the same layer as the first electrode 60 and electrically discontinuous with the first electrode 60. In contrast, the resistance wiring 451 in this embodiment is provided on the -Z-direction side of the piezoelectric body 70, as shown in Figure 7. The resistance wiring 451 is an example of a temperature sensing unit for detecting the temperature of the pressure chamber 12. The material of the resistance wiring 451 is not particularly limited as long as it is a material whose electrical resistance value is temperature-dependent, and for example, gold (Au), platinum (Pt), iridium (Ir), aluminum (Al), copper (Cu), titanium (Ti), tungsten (W), nickel (Ni), chromium (Cr), etc. can be used. In this embodiment, the resistance wiring 451 is laminated on the -Z-direction side of the piezoelectric body 70 so as to be in the same layer as the second electrode 80 and electrically discontinuous with the second electrode 80. Therefore, the material of the resistive wiring 451 is iridium (Ir), the same as that of the second electrode 80. This simplifies the manufacturing process and reduces costs compared to forming the resistive wiring 451 separately from the second electrode 80. Of course, the resistive wiring 451 may also be formed in a different layer from the second electrode 80.

[0085] As described above, according to the liquid discharge head 510 of Embodiment 2, the resistance wiring 451 is formed of the same material as the second electrode 80, so when forming the resistance wiring 451 it is easy to form it using the same process as the second electrode 80.

[0086] 3. Embodiment 3 Next, a resistive wiring 461 provided in the liquid discharge head 510 of Embodiment 3 will be described as one embodiment of the present disclosure. Parts common to both the liquid discharge head 510 of Embodiment 1 and this embodiment are denoted by the same reference numerals, and their descriptions are omitted.

[0087] In Embodiment 1, the resistance wiring 401 was formed on the same layer as the first electrode 60, and laminated on the -Z-direction side of the diaphragm 50 so as to be electrically discontinuous with the first electrode 60. In contrast, the resistance wiring 461 in this embodiment is provided on the -Z-direction side of the piezoelectric element 70, as shown in Figure 8. The resistance wiring 461 is an example of a temperature sensing unit for detecting the temperature of the pressure chamber 12. The material of the resistance wiring 461 is not particularly limited as long as it is a material whose electrical resistance value is temperature-dependent, and for example, gold (Au), platinum (Pt), iridium (Ir), aluminum (Al), copper (Cu), titanium (Ti), tungsten (W), nickel (Ni), chromium (Cr), etc. can be used.

[0088] In this embodiment, the resistance wiring 461 is formed on the same layer as the measuring lead electrodes 93, including measuring lead electrodes 93a and 93b, and is laminated on the -Z side surface of the piezoelectric body 70 so as to be electrically continuous with the measuring lead electrodes 93. That is, the resistance wiring 461 is the same wiring as the measuring lead electrodes 93. For this reason, the resistance wiring 461 in this embodiment consists of the same single layer as the individual lead electrodes 91 and the common lead electrode 92, but is formed to be electrically discontinuous. Therefore, the material of the resistance wiring 461 is gold (Au), the same material as the individual lead electrodes 91 and the common lead electrode 92. This simplifies the manufacturing process and reduces costs compared to the case where the resistance wiring 461 is formed individually with the individual lead electrodes 91 and the common lead electrode 92. Of course, the resistance wiring 461 may be formed on a different layer from the individual lead electrodes 91, the common lead electrode 92, and the measuring lead electrode 93.

[0089] As described above, according to the liquid discharge head 510 of Embodiment 3, the resistance wiring 461 is formed of the same material as either the individual lead electrodes 91 or the common lead electrodes 92, so when forming the resistance wiring 461 it is easy to form it using the same process as either the individual lead electrodes 91 or the common lead electrodes 92.

[0090] 4. Embodiment 4 Next, the resistor wiring of the liquid discharge head 510 of Embodiment 4, as one embodiment of the present disclosure, will be described. Parts common to the liquid discharge head 510 of Embodiment 1 are denoted by the same reference numerals, and their descriptions are omitted.

[0091] The resistance wiring 401 of Embodiment 1 had a first pressure chamber row-side meandering pattern corresponding to the first pressure chamber row formed by the plurality of pressure chambers 12, and a second pressure chamber row-side meandering pattern corresponding to the second pressure chamber row formed by the plurality of pressure chambers 12. That is, the liquid discharge head 510 of Embodiment 1 had one resistance wiring 401 corresponding to the first pressure chamber row and the second pressure chamber row. In contrast, the liquid discharge head 510 of this embodiment may have a plurality of temperature sensing units provided corresponding to a plurality of pressure chamber groups formed by the plurality of pressure chambers 12, as shown in Figures 9 to 11. With this, the liquid discharge head 510 can detect the temperatures of the plurality of pressure chambers 12 by dividing them into a plurality of groups.

[0092] In this embodiment, as shown in Figure 9, the pressure chamber group formed by a plurality of pressure chambers 12 located on the -Y side from the center in the Y-axis direction of the first pressure chamber row is described as the first pressure chamber group G1, the pressure chamber group formed by a plurality of pressure chambers 12 located on the +Y side from the center in the Y-axis direction of the first pressure chamber row is described as the second pressure chamber group G2, the pressure chamber group formed by a plurality of pressure chambers 12 located on the -Y side from the center in the Y-axis direction of the second pressure chamber row is described as the third pressure chamber group G3, and the pressure chamber group formed by a plurality of pressure chambers 12 located on the +Y side from the center in the Y-axis direction of the second pressure chamber row is described as the fourth pressure chamber group G4. Note that the -Y direction is one example in the first direction, and the +Y direction is the other example in the first direction.

[0093] For example, as shown in Figure 9, the liquid discharge head 510 may include a resistance wiring 402 (second resistance wiring) having a meandering pattern that meanders along the Y-axis direction at a position that overlaps with the supply communication passage 19 communicating with each pressure chamber 12 constituting the first pressure chamber row when viewed from the -Z direction, and a resistance wiring 403 (third resistance wiring) having a meandering pattern that meanders along the Y-axis direction at a position that overlaps with the supply communication passage 19 communicating with each pressure chamber 12 constituting the second pressure chamber row when viewed from the -Z direction. The resistance wiring 402 and the resistance wiring 403 are examples of temperature sensing units for detecting the temperature of the pressure chamber 12. The measuring lead electrode 93 may also include measuring lead electrode 93a, measuring lead electrode 93b, measuring lead electrode 93c, and measuring lead electrode 93d.

[0094] The resistance wiring 402 is continuous, with one end connected to the measuring lead electrode 93a and the other end connected to the measuring lead electrode 93c. Similarly, the resistance wiring 403 is continuous, with one end connected to the measuring lead electrode 93b and the other end connected to the measuring lead electrode 93d. As a result, the resistance wiring 402 is electrically connected to the wiring board 120, and the control unit 580 can measure the electrical resistance of the resistance wiring 402. Similarly, the resistance wiring 403 is electrically connected to the wiring board 120, and the control unit 580 can measure the electrical resistance of the resistance wiring 403.

[0095] In this case, the multiple pressure chamber groups include a first pressure chamber row and a second pressure chamber row. According to this, the liquid discharge head 510 of this embodiment can drive piezoelectric elements 300 corresponding to the ink temperature in the pressure chambers 12 constituting each pressure chamber row when the ink temperature in the pressure chambers 12 constituting the first pressure chamber row and the ink temperature in the pressure chambers 12 constituting the second pressure chamber row are different. Furthermore, according to this, the liquid discharge device 500 can more easily control the discharge of the liquid discharge head 510 to suit the ink temperature in the pressure chambers 12.

[0096] Furthermore, as shown in Figure 10, for example, the liquid discharge head 510 may also include a resistance wiring 404 (fourth resistance wiring) having a meandering pattern that meanders along the Y-axis direction at a position overlapping with the supply passage 19 communicating with each pressure chamber 12 constituting the first pressure chamber group G1 when viewed from the -Z direction, and a meandering pattern that meanders along the Y-axis direction at a position overlapping with the supply passage 19 communicating with each pressure chamber 12 constituting the third pressure chamber group G3; and a resistance wiring 405 (fifth resistance wiring) having a meandering pattern that meanders along the Y-axis direction at a position overlapping with the supply passage 19 communicating with each pressure chamber 12 constituting the second pressure chamber group G2 when viewed from the -Z direction, and a meandering pattern that meanders along the Y-axis direction at a position overlapping with the supply passage 19 communicating with each pressure chamber 12 constituting the fourth pressure chamber group G4. The resistance wiring 404 and the resistance wiring 405 are examples of temperature sensing units for detecting the temperature of the pressure chamber 12. Furthermore, the measuring lead electrode 93 may include measuring lead electrode 93a, measuring lead electrode 93b, measuring lead electrode 93c, and measuring lead electrode 93d.

[0097] The resistance wiring 404 is continuous, with one end connected to the measuring lead electrode 93a and the other end connected to the measuring lead electrode 93b. Similarly, the resistance wiring 405 is continuous, with one end connected to the measuring lead electrode 93c and the other end connected to the measuring lead electrode 93d. As a result, the resistance wiring 404 is electrically connected to the wiring board 120, and the control unit 580 can measure the electrical resistance of the resistance wiring 404. Similarly, the resistance wiring 405 is electrically connected to the wiring board 120, and the control unit 580 can measure the electrical resistance of the resistance wiring 405.

[0098] In this case, the multiple pressure chamber groups include a first pressure chamber group G1 and a second pressure chamber group G2. Alternatively, the multiple pressure chamber groups include a third pressure chamber group G3 and a fourth pressure chamber group G4. According to this, the liquid discharge head 510 of this embodiment can drive the piezoelectric element 300 corresponding to the ink temperature in the pressure chamber 12 constituting each pressure chamber group when the ink temperature in the pressure chamber 12 constituting one side of the pressure chamber row differs from the ink temperature in the pressure chamber 12 constituting the other side of the pressure chamber row. Furthermore, according to this, the liquid discharge device 500 can more easily control the discharge of the liquid discharge head 510 to suit the ink temperature in the pressure chamber 12.

[0099] Furthermore, as shown in Figure 11, for example, the liquid discharge head 510 may include: a resistance wiring 406 (sixth resistance wiring) having a meandering pattern that meanders along the Y-axis direction at a position overlapping with the supply communication passage 19 communicating with each pressure chamber 12 constituting the first pressure chamber group G1 when viewed from the -Z direction; a resistance wiring 407 (seventh resistance wiring) having a meandering pattern that meanders along the Y-axis direction at a position overlapping with the supply communication passage 19 communicating with each pressure chamber 12 constituting the second pressure chamber group G2 when viewed from the -Z direction; a resistance wiring 408 (eighth resistance wiring) having a meandering pattern that meanders along the Y-axis direction at a position overlapping with the supply communication passage 19 communicating with each pressure chamber 12 constituting the third pressure chamber group G3; and a resistance wiring 409 (ninth resistance wiring) having a meandering pattern that meanders along the Y-axis direction at a position overlapping with the supply communication passage 19 communicating with each pressure chamber 12 constituting the fourth pressure chamber group G4 when viewed from the -Z direction. Resistance wiring 406, resistance wiring 407, resistance wiring 408, and resistance wiring 409 are examples of temperature sensing units for detecting the temperature of the pressure chamber 12. The measuring lead electrode 93 may also include measuring lead electrode 93a, measuring lead electrode 93b, measuring lead electrode 93c, measuring lead electrode 93d, measuring lead electrode 93e, measuring lead electrode 93f, measuring lead electrode 93g, and measuring lead electrode 93h.

[0100] Resistance wiring 406 is continuous, with one end connected to the measuring lead electrode 93e and the other end connected to the measuring lead electrode 93a. Similarly, resistance wiring 407 is continuous, with one end connected to the measuring lead electrode 93c and the other end connected to the measuring lead electrode 93g. Resistance wiring 408 is continuous, with one end connected to the measuring lead electrode 93f and the other end connected to the measuring lead electrode 93b. Resistance wiring 409 is continuous, with one end connected to the measuring lead electrode 93d and the other end connected to the measuring lead electrode 93h. This connects resistance wiring 406 to the wiring board 120, allowing the control unit 580 to measure the electrical resistance of resistance wiring 406. Furthermore, the resistor wiring 407 is connected to the wiring board 120, allowing the control unit 580 to measure the electrical resistance of the resistor wiring 407. Similarly, the resistor wiring 408 is connected to the wiring board 120, allowing the control unit 580 to measure the electrical resistance of the resistor wiring 408. Finally, the resistor wiring 409 is connected to the wiring board 120, allowing the control unit 580 to measure the electrical resistance of the resistor wiring 409.

[0101] In this case, the multiple pressure chamber groups include a first pressure chamber group G1, a second pressure chamber group G2, a third pressure chamber group G3, and a fourth pressure chamber group G4. According to this, the liquid discharge head 510 of this embodiment can drive the piezoelectric element 300 corresponding to the ink temperature in the pressure chamber 12 constituting each pressure chamber group when the ink temperature in the pressure chamber 12 constituting the first pressure chamber group G1, the ink temperature in the pressure chamber 12 constituting the third pressure chamber group G3, the ink temperature in the pressure chamber 12 constituting the second pressure chamber group G2, and the ink temperature in the pressure chamber 12 constituting the fourth pressure chamber group G4 are different. Furthermore, according to this, the liquid discharge device 500 can more easily control the discharge of the liquid discharge head 510 to suit the ink temperature in the pressure chamber 12.

[0102] 5. Embodiment 5 Next, the measuring lead electrode 93 and resistance wiring 410 provided in the liquid discharge head 510 of Embodiment 5, as one embodiment of the present disclosure, will be described. Parts common to the liquid discharge head 510 of Embodiment 1 are denoted by the same reference numerals, and their descriptions are omitted.

[0103] In Embodiment 1, the measuring lead electrode 93 included measuring lead electrode 93a and measuring lead electrode 93b, with one end of the resistance wiring 401 connected to measuring lead electrode 93a and the other end of the resistance wiring 401 connected to measuring lead electrode 93b. In contrast, as shown in Figure 12, the measuring lead electrode 93 in this embodiment includes measuring lead electrode 93i and measuring lead electrode 93j. The measuring lead electrode 93, including measuring lead electrode 93i and measuring lead electrode 93j, is an example of a connection portion between the resistance wiring 410 and the wiring board 120.

[0104] Furthermore, the liquid discharge head 510 of this embodiment has a resistance wiring 410. The resistance wiring 410 is an example of a temperature sensing unit for detecting the temperature of the pressure chamber 12. The resistance wiring 410 is continuous, and one end of the resistance wiring 410 on the +X side in the X-axis direction is connected to a measuring lead electrode 93i, and the other end of the resistance wiring 410 on the -X side in the X-axis direction is connected to a measuring lead electrode 93j. As a result, the resistance wiring 410 is electrically connected to the wiring board 120, and the control unit 580 can measure the electrical resistance value of the resistance wiring 410.

[0105] In this embodiment, the measuring lead electrode 93 is provided between the individual lead electrodes 91 and the common lead electrode 92 in the Y-axis direction. This allows the first electrode 60, the second electrode 80, and the resistance wiring 410 to be efficiently connected to the wiring board 120.

[0106] Furthermore, as in this embodiment, the measuring lead electrode 93 may be provided between the individual lead electrodes 91 and the common lead electrode 92 in the Y-axis direction, while multiple temperature sensing units corresponding to multiple pressure chamber groups may be provided as in Embodiments 2 to 4.

[0107] The liquid discharge head 510 and the liquid discharge device 500 according to the above embodiment of the present invention are based on having the configuration described above, but it is of course possible to make partial changes or omissions to the configuration without departing from the spirit of the present invention. Furthermore, the above embodiment and the other embodiments described below can be combined and implemented to the extent that they do not contradict the technical description. Other embodiments will be described below.

[0108] In each of the above embodiments, the control unit 580 does not necessarily have a function to measure the electrical resistance of the resistance wiring 401 and detect the temperature of the pressure chamber 12. Alternatively, the liquid discharge head 510 may have a function to measure the electrical resistance of the resistance wiring 401 and detect the temperature of the pressure chamber 12. In this case, for example, the liquid discharge head 510 may include a temperature detection circuit having a storage unit SA that stores in advance the correspondence between the measured value in the temperature detection unit and the temperature, a measured value acquisition unit MA that measures the measured value in the temperature detection unit, and a temperature acquisition unit TA that acquires the temperature when driving the piezoelectric element 300 based on the correspondence stored in the storage unit SA and the measured value acquired by the measured value acquisition unit MA. The measured value in the temperature detection unit may also be an electrical resistance value, in which case the measured value acquisition unit MA may be a resistance acquisition unit MA. Alternatively, the liquid discharge head 510 may have the storage unit SA, the measured value acquisition unit MA, and the temperature acquisition unit TA in the head circuit 121. Furthermore, when driving the piezoelectric element 300, the liquid discharge head 510 may measure the electrical resistance value of the resistance wiring 401 and detect the temperature of the pressure chamber 12 based on the correspondence between the electrical resistance value of the resistance wiring 401 and the temperature.

[0109] In each of the above embodiments, the method for measuring the electrical resistance of the resistive wiring 401 is not particularly limited. For example, known two-terminal measurement methods or four-terminal measurement methods can be used.

[0110] In each of the above embodiments, the resistance wiring does not have to be provided for all of the pressure chambers 12. For example, in Embodiment 1, the resistance wiring 401 may be provided for a plurality of pressure chambers 12 constituting the first pressure chamber row, but not for the pressure chambers 12 constituting the second pressure chamber row. Alternatively, the resistance wiring 401 may be provided for some of the pressure chambers 12 among the plurality of pressure chambers 12 constituting the first pressure chamber row, and for some of the pressure chambers 12 among the plurality of pressure chambers 12 constituting the second pressure chamber row.

[0111] In each of the above embodiments, the meandering pattern of the resistance wiring does not have to meander along the Y-axis direction at a position that overlaps with the supply passage 19 communicating with the corresponding pressure chamber 12 when viewed from the -Z direction. For example, in Embodiment 1, the meandering pattern of the resistance wiring 401 on the first pressure chamber row side may meander along the X-axis direction at a position that overlaps with the supply passage 19 communicating with each pressure chamber 12 constituting the first pressure chamber row when viewed from the -Z direction.

[0112] In each of the above embodiments, the resistance wiring does not need to be meandering as long as it is positioned to overlap with the supply passage 19 that communicates with the corresponding pressure chamber 12 when viewed from the -Z direction.

[0113] In each of the above embodiments, the resistance wiring may be provided so as to pass through a position that overlaps with the corresponding pressure chamber 12 when viewed from the -Z direction. For example, in Embodiment 1, the resistance wiring 401 may be provided so as to pass through a position that is outside the first electrode 60 in the Y-axis direction when viewed from the -Z direction, and that overlaps with the pressure chamber 12.

[0114] In each of the above embodiments, the first electrode 60 may be a common electrode and the second electrode 80 may be an individual electrode. In this case, the first electrode 60 is provided on the +Z direction side of the Z-axis with respect to the piezoelectric body 70 and is provided in common for multiple pressure chambers 12. The second electrode 80 is provided on the -Z direction side of the Z-axis with respect to the piezoelectric body 70 and is provided individually for multiple pressure chambers 12. In this case, the first electrode 60 is connected to a common lead electrode 92 and the second electrode 80 is connected to an individual lead electrode 91.

[0115] In each of the above embodiments, the temperature sensing unit does not have to be a resistor; it may be a thermocouple, for example, as long as it can detect the temperature of the pressure chamber 12 based on the measurement value in the temperature sensing unit. For example, in Embodiment 1, when the resistor 401 is replaced with a thermocouple, a temperature sensing junction where one end of two types of metal wires constituting the thermocouple are connected may be placed at a position that overlaps with the supply communication passage 19 communicating with the multiple pressure chambers 12 constituting the first and second pressure chamber rows when viewed from the -Z direction. Then, by electrically connecting the other end of one metal wire to the measuring lead electrode 93a and the other end of the other metal wire to the measuring lead electrode 93b, the control unit 580 becomes able to measure the thermoelectric voltage of the thermocouple, which is the potential difference between the other end of one metal wire and the other metal wire. Furthermore, when driving the piezoelectric element 300, the control unit 580 may measure the thermoelectric voltage of the thermocouple and detect the temperature of the pressure chamber 12 based on the thermoelectric voltage of the thermocouple and the temperature near the wiring board 120 detected by a temperature sensor separately provided on the wiring board 120. In this case, the two types of metal wiring constituting the thermocouple may be laminated together with one of the first electrode 60, the second electrode 80, the individual lead electrodes 91, or the common lead electrode 92. For example, as shown in Figure 13, in Embodiment 1, one of the two types of metal wiring constituting the thermocouple 471, the metal wiring 471a, is laminated on the -Z side surface of the piezoelectric body 70 so as to be on the same layer as the second electrode 80 and electrically discontinuous with the second electrode 80. Furthermore, the other metal wiring 471b constituting the thermocouple 471 may be laminated on the -Z direction side surface of the metal wiring 471a so as to be in the same layer as the individual lead electrodes 91 and the common lead electrode 92, and electrically discontinuous with the individual lead electrodes 91 and the common lead electrode 92. In addition, the material of the second electrode 80 may be platinum (Pt), the material of the metal wiring 471a may be platinum (Pt), and the material of the metal wiring 471b may be gold (Au).

[0116] In each of the above embodiments, a discharge channel may be connected to the nozzle 21, and ink may be discharged from the nozzle 21 while circulating liquid from the supply channel through the nozzle 21 to the discharge channel. For example, as shown in Figure 14, in addition to the supply port 44 located on the -X side, a discharge port 200 located on the +X side may be provided, and two nozzle communication passages 16 may be connected by a channel extending in the X-axis direction, with the nozzle 21 provided in the middle of the connection portion. In this case, the flow of ink supplied from the supply port 44 is controlled by a pump (not shown) so that it flows in the order of the pressure chamber 12 on the -X side, the nozzle communication passage 16, and the pressure chamber 12 on the +X side, and is discharged from the discharge port 200. By performing the above-described series of ink supply and discharge circulating operations while discharging ink from the nozzle 21, it is possible to suppress the increase in viscosity caused by ink evaporation near the nozzle 21. In Figure 14, a case is described in which two pressure chambers 12 are connected to one nozzle 21, and ink is ejected from one nozzle 21 by driving two piezoelectric elements 300. However, one pressure chamber 12 may be connected to one nozzle 21. For example, in Figure 14, the piezoelectric element 300 on the +X direction side may not be provided. [Explanation of Symbols]

[0117] 10...Pressure chamber substrate, 11...Partition wall, 12...Pressure chamber, 15...Communication plate, 16...Nozzle communication passage, 17...First manifold section, 18...Second manifold section, 19...Supply communication passage, 20...Nozzle plate, 21...Nozzle, 30...Protective substrate, 31...Holding section, 32...Through hole, 40...Case member, 41...Housing section, 42...Third manifold section, 43...Connection port, 44...Supply port, 45...Compliance substrate, 46...Sealing film, 47...Fixed substrate, 48...Opening, 49...Compliance section, 50...Diaphragm, 51...Elastic film, 52...Insulator film, 60...First electrode, 70...Piezoelectric element, 71...Groove section, 80...Second electrode, 85...Wiring section, 91...Individual lead electrode, 92...Common lead electrode, 93,93a,93b,93c,93d,93e,93f,93 g, 93h, 93i, 93j… Measuring lead electrodes, 100… Manifold, 120… Wiring board, 121… Head circuit, 300… Piezoelectric element, 310… Active part, 320… Inactive part, 401, 402, 403, 404, 405, 406, 407, 408, 409, 410, 451, 461… Resistor wiring, 500… Liquid dispensing device, 510… Liquid dispensing head, 55 0...Ink tank, 552...Tube, 560...Conveying mechanism, 562...Conveying roller, 564...Conveying rod, 566...Conveying motor, 570...Moving mechanism, 572...Carriage, 574...Conveying belt, 576...Moving motor, 577...Pulley, 580...Control unit, G1...First pressure chamber group, G2...Second pressure chamber group, G3...Third pressure chamber group, G4...Fourth pressure chamber group.

Claims

1. It includes a first electrode, a second electrode, and a piezoelectric material, the first electrode, the second electrode, and the In the stacking direction in which the piezoelectric material is stacked, the piezoelectric material is between the first electrode and the second electrode. A piezoelectric element provided therein, A diaphragm provided on one side of the stacking direction relative to the piezoelectric element, wherein the piezoelectric element A diaphragm that deforms due to the movement of this child, A pressure chamber substrate provided on one side of the diaphragm in the stacking direction, Multiple pressure chambers whose volume changes due to the deformation of the diaphragm are aligned along a first direction that intersects the stacking direction. A pressure chamber substrate is provided on which a row of pressure chambers is arranged in such a manner, A first wiring for applying a voltage to the first electrode, A second wiring for applying a voltage to the second electrode, Resistor wiring and, A temperature acquisition unit that acquires the temperature of the pressure chamber based on the electrical resistance value of the aforementioned resistance wiring is provided. death, The resistor wiring is any of the first electrode, the second electrode, the first wiring, or the second wiring. It is made of the same material as the other, The resistance wiring intersects the stacking direction and the first direction more than the pressure chamber row. A meandering pattern located on one side of the direction, comprising three or more elements extending along the first direction. A meandering pattern is constructed by connecting the extending portions in series so that they are aligned in the second direction. A liquid dispensing head characterized by containing [a specific ingredient].

2. The resistive wiring is formed of the same material as the first electrode, characterized in that 1 The liquid dispensing head described above.

3. The resistive wiring is formed of the same material as the second electrode, characterized in that 1 The liquid dispensing head described above.

4. The resistor wiring is formed of the same material as either the first wiring or the second wiring. The liquid dispensing head according to claim 1, characterized by having

5. When the direction intersecting the aforementioned stacking direction is defined as the first direction, The first electrode is provided individually for each of the multiple pressure chambers arranged in the first direction, The second electrode is provided in common to the plurality of pressure chambers, The first electrode is provided on one side of the piezoelectric body in the stacking direction, The second electrode is characterized in that it is provided on the other side of the stacking direction relative to the piezoelectric material. A liquid dispensing head according to any one of claims 1 to 4.

6. A drive voltage that changes in accordance with the amount of liquid discharged is supplied to the first electrode via the first wiring. The voltage is applied and a constant holding voltage is maintained via the second wiring, regardless of the amount of liquid discharged. Liquid discharge according to claim 5, further comprising a head circuit for applying to electrodes. Head out.

7. A wiring board that electrically connects to each of the first wiring, the second wiring, and the resistor wiring. The liquid dispensing head according to any one of versions 1 to 6, further characterized by having the above features.

8. A liquid dispensing head according to any one of claims 1 to 7, The system is characterized by having a control unit that controls the liquid discharge operation from the liquid discharge head. A liquid dispensing device.

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