Powder and laminates using the same
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- RICOH CO LTD
- Filing Date
- 2021-09-16
- Publication Date
- 2026-06-09
AI Technical Summary
【0012】 本発明によれば、金属酸化物のコーティングに対して、簡単に強靱な金属酸化物表面を生成できる粉体を提供することができる。
Smart Images

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Abstract
Claims
1. A powder containing a metal oxide that satisfies the following conditions (1) and (2), Initial bulk density is 0.9 g / cm³ 3 1.0g / cm or more 3 The following: The aforementioned metal oxide includes copper-aluminum oxide, A powder used in the aerosol deposition method. (1) In the frequency distribution curve obtained by volume-based particle size distribution measurement using the laser diffraction / scattering method, the particle size peaks are located in the ranges of 0.1 μm or more and less than 5 μm, and 5 μm or more and less than 50 μm. (2) The difference between the tap bulk density and the initial bulk density has the following relationship: 0.88 g / cm³ 3 ≤ (tap bulk density - initial bulk density) ≤ 0.94 g / cm³ 3
2. The powder according to claim 1, wherein, in the above condition (1), the particle size peaks are in the range of 1 μm or more and 2 μm or less, and 10 μm or more and 12 μm or less.
3. A laminate comprising a layer containing the powder described in claim 1 or 2.
4. The laminate according to claim 3, wherein a layer containing the powder described in claim 1 or 2 is provided on a layer containing an organic material.
5. A layer containing organic material, A layer containing a silicone compound is formed in contact with the layer containing the organic material, A layer containing the powder according to claim 1 or 2, formed in contact with the layer containing the silicone compound, The laminate according to claim 4, having the following characteristics.
6. A method for manufacturing a laminate, comprising the step of providing a layer containing the powder described in claim 1 or 2 on a layer containing an organic material by an aerosol deposition method.