Inductor components

Abstract

Provided is an inductor component that achieves a high efficiency of acquisition of inductance. The inductor component comprises an element body having a first main surface and a second main surface opposing each other, a coil provided on the element body and wound spirally along an axis, and a first outer electrode and a second outer electrode that are provided on the element body and electrically connected to the coil. The axis of the coil is disposed in parallel to the first main surface. The coil includes: a plurality of first coil wires provided on the first main surface side with respect to the axis and arrayed along the axis on a plane parallel to the first main surface; a plurality of second coil wires provided on the second main surface side with respect to the axis and arrayed along the axis on a plane parallel to the second main surface; a plurality of first through-wires extending from the first coil wires toward the second coil wires and arrayed along the axis; and a plurality of second through-wires extending from the first coil wires toward the second coil wires, provided on the opposite side to the first through-wires with respect to the axis and arrayed along the axis. The first coil wires, the first through-wires, the second coil wires, and the second through-wires are connected in this order to form at least a part of the spiral. In a cross section parallel to the first main surface and including the axis, the first through-wires each include an inner-peripheral end facing the axis, and an outer-peripheral end facing away from the axis. The length of the inner-peripheral end is greater than the length of the outer-peripheral end.

Description

Technical Field

[0001] The present disclosure relates to an inductor component.

Background Art

[0002] Conventionally, as an inductor component, there is one described in Japanese Patent No. 6652280 (Patent Document 1). The inductor component has a base body, a coil provided in the base body and wound along the axial direction, and a first external electrode and a second external electrode provided on the base body and electrically connected to the coil.

[0003] The coil has a plurality of coil patterns laminated along the axis. The coil patterns adjacent to each other in the axial direction are connected via conductive vias. The coil pattern has a wiring portion extending in a direction orthogonal to the axis, and a pad portion provided at an end of the wiring portion and connected to the conductive via. The width of the pad portion is wider than the width of the wiring portion in order to improve the connectivity between the pad portion and the conductive via.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] By the way, in the conventional inductor component as described above, since the width of the pad portion is wider than the width of the wiring portion, a part of the pad portion is located inside the coil in the radial direction of the coil compared to the wiring portion. For this reason, the inner diameter of the coil becomes small, and it cannot be said that the acquisition efficiency of inductance is necessarily high.

[0006] Therefore, an object of the present disclosure is to provide an inductor component capable of increasing the acquisition efficiency of inductance.

Means for Solving the Problems

[0007] To solve the aforementioned problems, an inductor component according to one aspect of this disclosure is provided. A base body including a first principal surface and a second principal surface that are opposite to each other, A coil provided on the aforementioned body and wound spirally along the axis, A first external electrode and a second external electrode are provided on the base body and electrically connected to the coil. Equipped with, The shaft of the coil is arranged parallel to the first main surface. The aforementioned coil is A plurality of first coil wirings are provided on the first main surface side with respect to the shaft and are arranged along the shaft on a plane parallel to the first main surface, A plurality of second coil wirings are provided on the second main surface side with respect to the shaft and are arranged along the shaft on a plane parallel to the second main surface, A plurality of first through-wirings extending from the first coil wiring toward the second coil wiring and arranged along the axis, A plurality of second through-wirings extend from the first coil wiring toward the second coil wiring, are provided on the opposite side of the axis from the first through-wiring, and are arranged along the axis. Includes, The first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a portion of the helical shape. In a cross-section parallel to the first main surface and including the axis, the first through-wiring includes an inner peripheral edge facing the axis and an outer peripheral edge facing the opposite side of the axis, wherein the length of the inner peripheral edge is longer than the length of the outer peripheral edge.

[0008] Here, the axis refers to the intersection line of the first plane passing through the center between the first coil wiring and the second coil wiring, and the second plane passing through the center between the first through wiring and the second through wiring. The inner periphery facing the axis refers to the region of the entire circumference of the first through-wiring that is projected onto the axis when the first through-wiring is projected onto the axis from a direction perpendicular to the axis. The outer periphery facing the opposite side of the axis refers to the region of the entire circumference of the first through-wiring that is projected onto the imaginary line, which is defined parallel to the axis on the opposite side of the axis from the first through-wiring, when the first through-wiring is projected onto the imaginary line from a direction perpendicular to the axis. The region of the entire circumference of the first through-wiring that is parallel to the direction perpendicular to the axis does not fall under the inner periphery or outer periphery. "An external electrode is provided on the base body" specifically means that the external electrode is provided on the outer surface of the base body. For example, this includes cases where the external electrode is provided directly on the outer surface of the base body, where the external electrode is provided on the outside of the base body via another component on the base body, or where a part of the external electrode is embedded in the base body and provided on the outer surface of the external electrode.

[0009] According to the above embodiment, the coil includes a first coil wiring, a first through wiring, a second coil wiring, and a second through wiring. The first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a portion of a spiral, which allows the inner diameter of the coil to be increased and the inductance acquisition efficiency to be increased. Furthermore, by increasing the inductance acquisition efficiency, the Q value can be increased. Furthermore, since the length of the inner edge of the first through-wiring is longer than the length of the outer edge of the first through-wiring, the surface area of ​​the inner surface of the coil can be increased, resulting in a lower electrical resistance at high frequencies and an improved Q factor at high frequencies.

[0010] To solve the aforementioned problems, an inductor component according to one aspect of this disclosure is provided. A base body including a first principal surface and a second principal surface that are opposite to each other, A coil provided on the aforementioned body and wound spirally along the axis, A first external electrode and a second external electrode are provided on the base body and electrically connected to the coil. Equipped with, The shaft of the coil is arranged parallel to the first main surface. The aforementioned coil is A plurality of first coil wirings are provided on the first main surface side with respect to the shaft and are arranged along the shaft on a plane parallel to the first main surface, A plurality of second coil wirings are provided on the second main surface side with respect to the shaft and are arranged along the shaft on a plane parallel to the second main surface, A plurality of first through-wirings extending from the first coil wiring toward the second coil wiring and arranged along the axis, A plurality of second through-wirings extend from the first coil wiring toward the second coil wiring, are provided on the opposite side of the axis from the first through-wiring, and are arranged along the axis. Includes, The first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a portion of the helical shape. When viewed from a direction perpendicular to the first main surface, the bisector of the angle between the first coil wiring connected to a reference first through wiring, which is one of the first through wirings, and the second coil wiring is defined, in a cross section parallel to the first main surface and including the axis, the reference first through wiring includes an inner peripheral edge facing the bisector and an outer peripheral edge facing the opposite side of the bisector, and the length of the inner peripheral edge is longer than the length of the outer peripheral edge.

[0011] Here, the angle between the first coil wiring and the second coil wiring is the angle between the center line of the width of the first coil wiring and the center line of the width of the second coil wiring, when viewed from a direction perpendicular to the first main surface. The inner peripheral edge facing the bisector side refers to the area projected onto the orthogonal line of the reference first through-wiring from the direction parallel to the bisector line toward the orthogonal line perpendicular to the bisector line among the peripheral edges of the entire circumference of the reference first through-wiring. The outer peripheral edge facing the side opposite to the bisector line refers to the area projected onto the virtual line of the reference first through-wiring from the direction parallel to the bisector line toward the virtual line parallel to the orthogonal line on the side opposite to the orthogonal line with respect to the reference first through-wiring. The area where the direction perpendicular to the peripheral edge among the peripheral edges of the entire circumference of the reference first through-wiring faces the direction parallel to the bisector line does not correspond to the inner peripheral edge and the outer peripheral edge.

[0012] According to the above embodiment, the coil includes a first coil wiring, a first through-wiring, a second coil wiring, and a second through-wiring. The first coil wiring, the first through-wiring, the second coil wiring, and the second through-wiring are connected in this order to form at least a part of a spiral shape. Therefore, the inner diameter of the coil can be increased, and the acquisition efficiency of inductance can be improved. Further, by increasing the inductance acquisition efficiency, the Q value can be increased. Furthermore, since the length of the inner peripheral edge of the reference first through-wiring is longer than the length of the outer peripheral edge of the reference first through-wiring, the surface area of the inner surface of the coil can be increased, the electrical resistance value at high frequencies can be reduced, and the Q value at high frequencies can be improved.

[0013] To solve the above problems, an inductor component according to one aspect of the present disclosure includes a body including a first main surface and a second main surface facing each other, a coil provided on the body and wound spirally along an axis, a first external electrode and a second external electrode provided on the body and electrically connected to the coil and includes the axis of the coil is arranged parallel to the first main surface, the coil includes a plurality of first coil wirings provided on the first main surface side with respect to the axis and arranged along the axis on a plane parallel to the first main surface, A plurality of second coil wirings provided on the second main surface side with respect to the axis and arranged along the axis on a plane parallel to the second main surface; A plurality of first through wirings extending from the first coil wiring toward the second coil wiring and arranged along the axis; A plurality of second through wirings extending from the first coil wiring toward the second coil wiring, provided on the side opposite to the first through wiring with respect to the axis, and arranged along the axis including; The first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to constitute at least a part of the spiral shape. In a cross section parallel to the first main surface and including the axis, the first through wiring includes an inner peripheral edge parallel to the axis and facing the axis side, and an outer peripheral edge parallel to the axis and facing the side opposite to the axis, and the length of the inner peripheral edge is longer than the length of the outer peripheral edge.

[0014] According to the embodiment, the coil includes a first coil wiring, a first through wiring, a second coil wiring, and a second through wiring. The first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to constitute at least a part of the spiral shape. Therefore, the inner diameter of the coil can be increased, and the acquisition efficiency of inductance can be improved. Also, by increasing the inductance acquisition efficiency, the Q value can be increased. Furthermore, since the length of the inner peripheral edge of the first through wiring is longer than the length of the outer peripheral edge of the first through wiring, the surface area of the inner surface of the coil can be increased, the electrical resistance value at high frequencies can be lowered, and the Q value at high frequencies can be improved.

[0015] To solve the above problems, an inductor component according to one aspect of the present disclosure includes a body including a first main surface and a second main surface facing each other; a coil provided on the body and wound spirally along an axis; a first external electrode and a second external electrode provided on the body and electrically connected to the coil and includes. The shaft of the coil is arranged parallel to the first main surface. The aforementioned coil is A plurality of first coil wirings are provided on the first main surface side with respect to the shaft and are arranged along the shaft on a plane parallel to the first main surface, A plurality of second coil wirings are provided on the second main surface side with respect to the shaft and are arranged along the shaft on a plane parallel to the second main surface, A plurality of first through-wirings extending from the first coil wiring toward the second coil wiring and arranged along the axis, A plurality of second through-wirings extend from the first coil wiring toward the second coil wiring, are provided on the opposite side of the axis from the first through-wiring, and are arranged along the axis. Includes, The first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a portion of the helical shape. When viewed from a direction perpendicular to the first main surface, and a bisector of the angle between the first coil wiring connected to a reference first through wiring which is one of the first through wirings and the second coil wiring is defined, in a cross section parallel to the first main surface and including the axis, the reference first through wiring includes an inner peripheral edge parallel to the direction perpendicular to the bisector and facing toward the bisector, and an outer peripheral edge parallel to the direction perpendicular to the bisector and facing away from the bisector, wherein the length of the inner peripheral edge is longer than the length of the outer peripheral edge.

[0016] Here, the angle between the first coil wiring and the second coil wiring is the angle between the center line of the width of the first coil wiring and the center line of the width of the second coil wiring, when viewed from a direction perpendicular to the first main surface.

[0017] According to the above embodiment, the coil includes a first coil wiring, a first through wiring, a second coil wiring, and a second through wiring. The first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a portion of a spiral, which allows the inner diameter of the coil to be increased and the inductance acquisition efficiency to be increased. Furthermore, by increasing the inductance acquisition efficiency, the Q value can be increased. Furthermore, since the length of the inner circumference of the reference first through-wiring is longer than the length of the outer circumference of the reference first through-wiring, the surface area of ​​the inner surface of the coil can be increased, resulting in a lower electrical resistance at high frequencies and an improved Q value at high frequencies.

[0018] Preferably, in one embodiment of the inductor component, the base material includes SiO2.

[0019] According to the above embodiment, insulation and rigidity can be imparted to the base body.

[0020] Preferably, in one embodiment of the inductor component, the inner periphery of the first through-wiring has a curved portion with a convex shape.

[0021] According to the above embodiment, the stress applied to the curved portion of the inner peripheral edge of the first through-wiring can be distributed.

[0022] Preferably, in one embodiment of the inductor component, the plurality of first through-wirings include two of the first through-wirings whose orientations of the curved portions of the inner periphery are different from each other.

[0023] Here, the direction of the curved section refers to the direction connecting the midpoint of the curved section and the center line of the first through-wiring.

[0024] According to the above embodiment, the orientation of the curved portion of the first through-wiring can be changed according to the arrangement of the first coil wiring and the second coil wiring.

[0025] Preferably, in one embodiment of the inductor component, the length of the inner edge of the first through-wiring is 1.5 times or more the length of the outer edge of the first through-wiring.

[0026] According to the above embodiment, the length of the inner circumference of the first through-wiring can be increased, and the electrical resistance value at high frequencies can be further reduced.

[0027] Preferably, in one embodiment of the inductor component, the first end of the first coil wiring and the first end of the first through wiring are connected when viewed from a direction perpendicular to the first main surface, and the outer shape of the coil at the first end of the first coil wiring conforms to the outer shape of the coil at the first end of the first through wiring.

[0028] According to the above embodiment, the shape of the first end of the first coil wiring can be made to correspond to the shape of the first end of the first through wiring, and the DC electrical resistance of the connection portion between the first coil wiring and the first through wiring can be reduced.

[0029] Preferably, in one embodiment of the inductor component, the angle between the first coil wiring and the second coil wiring connected to the same first through-wiring, as viewed from a direction perpendicular to the first main surface, is 5° or more and 45° or less.

[0030] According to the above embodiment, the inductance can be improved because the coil is wound tightly.

[0031] Preferably, in one embodiment of the inductor component, in a cross-section perpendicular to the direction in which the first coil wiring extends, the upper surface located on the side of the first coil wiring opposite to the axis has a convex shape that protrudes upward on the side opposite to the axis.

[0032] According to the above embodiment, the distance between the upper surfaces of two axially adjacent first coil wirings can be increased, reducing the parasitic capacitance between adjacent first coil wirings and thereby increasing the self-resonant frequency of the inductor component.

[0033] Preferably, in one embodiment of the inductor component, the first external electrode is arranged on the first coil wiring, and the upper surface of the first coil wiring faces the first external electrode.

[0034] According to the above embodiment, the distance between the first external electrode and the upper surface of the first coil wiring can be increased, reducing the parasitic capacitance between the first external electrode and the first coil wiring, and thereby increasing the self-resonant frequency of the inductor component.

[0035] Preferably, in one embodiment of the inductor component, the first through-wiring and the second through-wiring are not parallel when viewed from a direction parallel to the axis.

[0036] According to the above embodiment, the distance between the first through-wiring and the second through-wiring can be increased, the inner diameter of the coil can be increased, and the Q value can be improved.

[0037] Preferably, in one embodiment of the inductor component, the base body includes SiO2, and the first through-wiring includes SiO2.

[0038] According to the above embodiment, the coefficient of thermal expansion of the first through-wiring can be matched with the coefficient of thermal expansion of the base material, thereby suppressing cracks between the first through-wiring and the base material.

[0039] Preferably, in one embodiment of the inductor component, the first through-wiring includes a gap or a resin portion.

[0040] According to the above embodiment, the stress caused by the difference in the coefficient of linear expansion between the first through-wiring and the base material can be absorbed by the void or resin portion, thereby relieving the stress.

[0041] Preferably, in one embodiment of the inductor component, the first through-wiring has a conductive layer located on the outer periphery when viewed from the direction in which the first through-wiring extends, and a non-conductive layer located inside the conductive layer.

[0042] According to the above embodiment, when used in the high-frequency band, the current mainly flows along the surface of the first through-wiring due to the skin effect, so providing a conductive layer on the outer periphery does not lower the Q value. Furthermore, providing a non-conductive layer on the inside relieves stress, and manufacturing costs can be reduced by not using a conductor.

[0043] Preferably, in one embodiment of the inductor component, the axial length of the coil is shorter than the inner diameter of the coil.

[0044] According to the above embodiment, the Q value can be improved because the coil length is short and the coil inner diameter is large.

[0045] Preferably, in one embodiment of the inductor component, the first through-wiring extends in a direction perpendicular to the first main surface, and the cross-sectional area of ​​at least one end of the first through-wiring in the extending direction is larger than the cross-sectional area of ​​the central part of the first through-wiring in the extending direction.

[0046] According to the above embodiment, the cross-sectional area of ​​the end of the first through-wiring can be increased, and the connectivity between the first through-wiring and at least one of the first coil wiring and the second coil wiring can be improved. Furthermore, when forming a hole in the base body and filling this hole with conductive material by fill plating or the like to form the first through-wiring in the base body, it is easier to fill the opening side of the hole with conductive material. And, since the cross-sectional area of ​​the end of the first through-wiring is large and the cross-sectional area of ​​the central part of the first through-wiring is small, it is easy to form the first through-wiring.

[0047] Preferably, in one embodiment of the inductor component, the first external electrode and the second external electrode are located inside the outer surface of the base body when viewed from a direction perpendicular to the first main surface.

[0048] According to the above embodiment, since the first external electrode and the second external electrode are not in contact with the outer surface of the base body, the load on the first external electrode and the second external electrode can be reduced when the individual inductor components are assembled, and deformation and peeling of the first external electrode and the second external electrode can be suppressed. For this reason, even if the inductor components are made smaller, deformation and peeling of the first external electrode and the second external electrode can be prevented.

[0049] Preferably, in one embodiment of the inductor component, an organic insulator is provided on the first main surface, wherein the element is an inorganic insulator, and the organic insulator is located inside the outer surface of the inorganic insulator when viewed from a direction perpendicular to the first main surface.

[0050] According to the above embodiment, since it has an organic insulator, the organic insulator is easily given fluidity, and when the first coil wiring is covered with the organic insulator, the organic insulator can be easily filled between adjacent first coil wirings, thereby improving insulation performance. Furthermore, since the organic insulator does not come into contact with the outer surface of the insulator, the load on the organic insulator can be reduced when it is pieced into individual inductor components, and deformation and peeling of the organic insulator can be suppressed. [Effects of the Invention]

[0051] According to an inductor component in one aspect of this disclosure, the efficiency of acquiring inductance can be increased. [Brief explanation of the drawing]

[0052] [Figure 1] This is a schematic perspective view of the inductor component of the first embodiment, as seen from the bottom side. [Figure 2] This is a cross-sectional view taken along line II-II in Figure 1. [Figure 3] This is a cross-sectional view taken along line III-III in Figure 1. [Figure 4] This is an XY cross-sectional view of the first and second through-wiring connections. [Figure 5] This is a magnified view of a portion of Figure 1. [Figure 6A] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 6B] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 6C] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 6D] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 6E] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 6F] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 6G] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 6H] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 6I] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 6J] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 6K] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 6L] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 6M] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 7A] This is a cross-sectional view showing a first modified example of an inductor component. [Figure 7B] This is a cross-sectional view showing a second modified example of an inductor component. [Figure 7C] This is a cross-sectional view showing a third modified example of an inductor component. [Figure 7D] This is a cross-sectional view showing a fourth modified example of an inductor component. [Figure 8] This is a schematic perspective view of the inductor component of the second embodiment, viewed from the bottom. [Figure 9] This is a cross-sectional view taken along line IX-IX in Figure 8. [Figure 10] This is a schematic bottom view of the coil as seen from the bottom. [Figure 11]This is an XY cross-sectional view of the first and second through-wiring connections. [Figure 12A] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 12B] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 12C] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 12D] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 12E] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 12F] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 12G] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 12H] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 13A] This is a cross-sectional view showing a first modified example of an inductor component. [Figure 13B] This is a cross-sectional view showing a second modified example of an inductor component. [Figure 13C] This is a cross-sectional view showing a third modified example of an inductor component. [Figure 14] This is an XY cross-sectional view of the first through-wiring showing the inductor component of the third embodiment. [Figure 15] This is an XY cross-sectional view of the first through-wiring showing the inductor component of the fourth embodiment. [Modes for carrying out the invention]

[0053] Hereinafter, an inductor component, which is one aspect of this disclosure, will be described in detail with reference to the illustrated embodiment. Note that the drawings include some schematic representations and may not reflect actual dimensions or proportions.

[0054] <First Embodiment> The inductor component 1 according to the first embodiment will be described below. Figure 1 is a schematic bottom view of the inductor component 1 as seen from the bottom. Figure 2 is a cross-sectional view taken along line II-II in Figure 1. Figure 3 is a cross-sectional view taken along line III-III in Figure 1. In Figure 1, for convenience, the external electrodes are shown as dashed lines. Also, in Figure 1, the element 10 is shown as transparent to allow for easy understanding of its structure, but it may be semi-transparent or opaque.

[0055] 1.Overview configuration The general configuration of inductor component 1 will now be described. Inductor component 1 is a surface-mount type inductor component used, for example, in a high-frequency signal transmission circuit. As shown in Figures 1, 2, and 3, inductor component 1 comprises a base body 10, a coil 110 provided on the base body 10 and wound spirally along axis AX, and a first external electrode 121 and a second external electrode 122 provided on the base body 10 and electrically connected to the coil 110.

[0056] The base body 10 has length, width and height. The base body 10 has first end faces 100e1 and second end faces 100e2 at both ends in the length direction, first side faces 100s1 and second side faces 100s2 at both ends in the width direction, and bottom faces 100b and top faces 100t at both ends in the height direction. In other words, the outer surface 100 of the base body 10 includes the first end faces 100e1 and second end faces 100e2, the first side faces 100s1 and second side faces 100s2, the bottom face 100b and top face 100t. The bottom face 100b corresponds to an example of the "first main face" described in the claims, and the top face 100t corresponds to an example of the "second main face" described in the claims.

[0057] As shown in the drawing, for the sake of explanation, the X direction will be defined as the longitudinal direction of the body 10, from the first end face 100e1 to the second end face 100e2. The Y direction will be defined as the width direction of the body 10, from the first side surface 100s1 to the second side surface 100s2. The Z direction will be defined as the height direction of the body 10, from the bottom surface 100b to the top surface 100t. The X, Y, and Z directions are mutually orthogonal directions, and when arranged in the order X, Y, Z, they form a right-handed system.

[0058] In this specification, the "outer surface 100 of the element 10," including the first end face 100e1, the second end face 100e2, the first side face 100s1, the second side face 100s2, the bottom face 100b, and the top face 100t, does not simply mean a surface facing the outer periphery of the element 10, but rather a surface that forms the boundary between the outside and inside of the element 10. Furthermore, "above the outer surface 100 of the element 10" does not refer to an absolute, unidirectional direction such as vertically upward as defined by the direction of gravity, but rather to a direction toward the outside, with respect to the outer surface 100 as the reference point, between the outside and inside that are bounded by the outer surface 100. Therefore, "above the outer surface 100" is a relative direction determined by the orientation of the outer surface 100. In addition, "above" an element includes not only a position above the element at a distance, i.e., a position above the element via another object or at a distance above it, but also a position directly above the element in contact with it.

[0059] The axis AX of the coil 110 is positioned parallel to the bottom surface 100b. The coil 110 includes a plurality of bottom wirings 11b provided on the bottom surface 100b side with respect to the axis AX and arranged along the axis AX on a plane parallel to the bottom surface 100b, a plurality of top wirings 11t provided on the top surface 100t side with respect to the axis AX and arranged along the axis AX on a plane parallel to the top surface 100t, a plurality of first through wirings 13 extending from the bottom wirings 11b toward the top wirings 11t and arranged along the axis AX, and a plurality of second through wirings 14 extending from the bottom wirings 11b toward the top wirings 11t, provided on the opposite side of the axis AX from the first through wirings 13 and arranged along the axis AX. The bottom wirings 11b, the first through wirings 13, the top wirings 11t, and the second through wirings 14 are connected in this order to form at least a portion of a spiral.

[0060] The bottom wiring 11b corresponds to an example of the "first coil wiring" described in the claims, and the top wiring 11t corresponds to an example of the "second coil wiring" described in the claims. The axis AX is the intersection of a first plane passing through the center between the bottom wiring 11b and the top wiring 11t and a second plane passing through the center between the first through wiring 13 and the second through wiring 14. In other words, the axis AX is a straight line passing through the center of the inner diameter portion of the coil 110. The axis AX of the coil 110 does not have dimensions in the direction perpendicular to the axis AX.

[0061] According to the above configuration, the coil 110 includes bottom wiring 11b, first through wiring 13, top wiring 11t, and second through wiring 14. The bottom wiring 11b, first through wiring 13, top wiring 11t, and second through wiring 14 are connected in this order to form at least a portion of a spiral, which allows the inner diameter of the coil 110 to be increased and the efficiency of inductance acquisition to be increased. Furthermore, by increasing the efficiency of inductance acquisition, the Q value can be increased.

[0062] Specifically, the pad portion of conventional inductor components and the bottom wiring 11b and top wiring 11t of this embodiment are "receiving portions" for wiring that penetrates the main body (conductive vias of conventional inductor components and the first through-wiring 13 and second through-wiring 14 of this embodiment), and therefore have a shape that spreads perpendicular to the direction in which the wiring penetrates the main body. In the configuration of conventional inductor components, since the conductive vias extend in a direction parallel to the coil axis, the pad portion tends to spread in a direction perpendicular to the coil axis, resulting in a structure that blocks the magnetic flux generated in the axial direction of the coil.

[0063] In contrast, in this embodiment, since the first through-wiring 13 and the second through-wiring 14 extend in a direction perpendicular to the axis AX of the coil 110, the bottom wiring 11b and the top wiring 11t spread in a direction parallel to the axis AX of the coil 110. Therefore, the bottom wiring 11b and the top wiring 11t are less likely to have a structure that blocks the magnetic flux generated in the direction of the axis AX. In other words, in this embodiment, a structure that does not easily block the magnetic flux can be made, and the inductance acquisition efficiency and Q value can be improved.

[0064] Figure 4 is an XY cross-sectional view of the first through-wiring 13 and the second through-wiring 14. As shown in Figure 4, in a cross-section parallel to the bottom surface 100b and including axis AX, the first through-wiring 13 includes an inner peripheral edge 131 facing towards axis AX, an outer peripheral edge 132 facing away from axis AX, and a side edge 133 parallel to the direction perpendicular to axis AX. The length of the inner peripheral edge 131 is longer than the length of the outer peripheral edge 132. For convenience, in Figure 4, the inner peripheral edge 131 is shown as a dotted line, the outer peripheral edge 132 as a dashed line, and the side edge 133 as a solid line.

[0065] The inner periphery 131 is the region projected onto axis AX from the entire circumference of the first through-wiring 13 when the first through-wiring 13 is projected onto axis AX from a direction perpendicular to axis AX. The outer periphery 132 is the region projected onto the virtual line BX from the entire circumference of the first through-wiring 13 when a virtual line BX parallel to axis AX is defined on the opposite side of axis AX from the first through-wiring 13, and the first through-wiring 13 is projected onto the virtual line BX from a direction perpendicular to axis AX.

[0066] According to the above configuration, the length of the inner peripheral edge 131 is longer than the length of the outer peripheral edge 132, so the surface area of ​​the inner surface of the first through-wiring 13 can be increased. This increases the surface area of ​​the inner surface of the coil 110, which lowers the electrical resistance at high frequencies and improves the Q value at high frequencies. Specifically, when a high-frequency signal passes through the coil 110, the skin effect causes the current to concentrate near the surface of the coil 110. In this embodiment, however, the inner peripheral edge 131 of the first through-wiring 13 where the high-frequency signal concentrates becomes relatively longer, thus lowering the electrical resistance and improving the Q value at high frequencies.

[0067] Furthermore, the second through-wiring 14 has the same configuration as the first through-wiring 13 and has the same effects as the first through-wiring 13 described above. Specifically, the second through-wiring 14 includes an inner peripheral edge 141 facing the axis AX, an outer peripheral edge 142 facing the opposite side of axis AX, and a side edge 143 parallel to the direction perpendicular to axis AX. The length of the inner peripheral edge 141 is longer than the length of the outer peripheral edge 142. This allows the inner surface area of ​​the second through-wiring 14 to be increased, which in turn allows the inner surface area of ​​the coil 110 to be increased, resulting in a lower electrical resistance at high frequencies and an improved Q value at high frequencies.

[0068] In addition, in the first through-wiring 13, the length of the inner peripheral edge 131 may be longer than the length of the outer peripheral edge 132, and in the second through-wiring 14, the length of the inner peripheral edge 141 may be shorter than or the same as the length of the outer peripheral edge 142.

[0069] 2.Each part configuration (Inductor component 1) The volume of inductor component 1 is 0.08 mm³. 3 The following conditions apply, and the length of the longest side of the inductor component 1 is 0.65 mm or less. The length of the longest side of the inductor component 1 refers to the largest value among the length, width, and height of the inductor component 1, and in this embodiment, it refers to the length in the X direction. With the above configuration, the volume of the inductor component 1 is small and the longest side of the inductor component 1 is short, so the weight of the inductor component 1 is reduced. Therefore, even if the external electrodes 121 and 122 are small, the required mounting strength can be obtained. In addition, the thickness of the inductor component 1 is preferably 0.2 mm or less. This makes the inductor component 1 thinner.

[0070] Specifically, the dimensions of inductor component 1 (length (X direction) × width (Y direction) × height (Z direction)) are 0.6 mm × 0.3 mm × 0.3 mm, 0.4 mm × 0.2 mm × 0.2 mm, 0.25 mm × 0.125 mm × 0.120 mm, etc. Also, the width and height do not have to be equal; for example, they may be 0.4 mm × 0.2 mm × 0.3 mm.

[0071] (Base model 10) The base material 10 contains SiO2. This allows the base material 10 to be given insulation and rigidity. The base material 10 is composed of, for example, a glass sintered body. The glass sintered body may also contain alumina, which can further increase the strength of the base material.

[0072] A glass sintered body is constructed, for example, by laminating insulating layers containing multiple glass particles. The lamination direction of the multiple insulating layers is the Z direction. That is, the insulating layers are layered and have main surfaces extending in the XY plane. Note that in the base body 10, the interfaces between the multiple insulating layers may not be clearly defined due to firing or other processes.

[0073] The element 10 may be composed of, for example, a glass substrate. The glass substrate may be a single-layer glass substrate, and since the majority of the element is glass, losses such as eddy current losses at high frequencies can be suppressed.

[0074] (Coil 110) The coil 110 comprises a plurality of bottom wirings 11b, a plurality of top wirings 11t, a plurality of first through wirings 13, and a plurality of second through wirings 14. The bottom wirings 11b, the first through wirings 13, the top wirings 11t, and the second through wirings 14 are connected in order to form at least a portion of the coil 110 wound in the direction of axis AX.

[0075] According to the above configuration, since the coil 110 is a so-called helical coil 110, the area in which the bottom wiring 11b, top wiring 11t, first through wiring 13 and second through wiring 14 run parallel along the winding direction of the coil 110 in a cross section perpendicular to the axis AX can be reduced, and the stray capacitance in the coil 110 can be reduced.

[0076] Here, a helical shape refers to a shape in which the total number of turns of the coil is greater than 1 turn, and the number of turns of the coil in a cross section perpendicular to the axis is less than 1 turn. "One turn or more" means that in a cross section perpendicular to the axis, the coil wiring has portions that run parallel in the winding direction and adjacent to each other in the radial direction when viewed from the axial direction, while "less than 1 turn" means that in a cross section perpendicular to the axis, the coil wiring does not have portions that run parallel in the winding direction and adjacent to each other in the winding direction when viewed from the axial direction.

[0077] The bottom wiring 11b extends in only one direction. Specifically, the bottom wiring 11b is slightly tilted in the X direction and extends in the Y direction. Multiple bottom wirings 11b are arranged parallel to each other along the X direction. In the photolithography process, for example, by using modified illumination such as annular illumination or dipole illumination, the pattern resolution in a specific direction can be increased, and a finer pattern can be formed. With the above configuration, since the bottom wiring 11b extends in only one direction, by using modified illumination in the photolithography process, for example, finer bottom wiring 11b can be formed, and the inductor component 1 can be miniaturized.

[0078] The top surface wiring 11t extends in only one direction. Specifically, the top surface wiring 11t has a shape that extends in the Y direction. Multiple top surface wirings 11t are arranged parallel to each other along the X direction. With the above configuration, since the top surface wiring 11t extends in only one direction, fine top surface wiring 11t can be formed by using, for example, deformed illumination in the photolithography process, and the inductor component 1 can be miniaturized.

[0079] The bottom wiring 11b and top wiring 11t are made of good conductive materials such as copper, silver, gold, or alloys thereof. The bottom wiring 11b and top wiring 11t may be metal films formed by plating, vapor deposition, sputtering, etc., or they may be metal sintered bodies formed by applying and sintering a conductive paste. Furthermore, the bottom wiring 11b and top wiring 11t may have a multilayer structure in which multiple metal layers are laminated. The thickness of the bottom wiring 11b and top wiring 11t is preferably 5 μm or more and 50 μm or less.

[0080] The first through-hole 13 is positioned within the through-hole V of the base body 10, on the first side surface 100s1 side with respect to the axis AX, and the second through-hole 14 is positioned within the through-hole V of the base body 10, on the second side surface 100s2 side with respect to the axis AX. The first through-hole 13 and the second through-hole 14 extend in directions perpendicular to the bottom surface 100b and the top surface 100t, respectively. This allows the lengths of the first through-hole 13 and the second through-hole 14 to be shortened, thereby suppressing DC resistance (Rdc). Multiple first through-holes 13 and multiple second through-holes 14 are each arranged parallel to each other along the X direction.

[0081] Preferably, the first through-wiring 13 contains SiO2. This allows the coefficient of thermal expansion of the first through-wiring 13 to match that of the base material 10 when the base material 10 contains SiO2, thereby suppressing cracks between the first through-wiring 13 and the base material 10. The first through-wiring 13 uses, for example, a conductive paste. The conductive material can be Ag, Cu, etc. Preferably, similarly, the second through-wiring 14 also contains SiO2.

[0082] Preferably, the inner peripheral edge 131 of the first through-wiring 13 has a convex curved portion. This allows the stress on the curved portion of the inner peripheral edge 131 of the first through-wiring 13 to be distributed. The entire inner peripheral edge 131 is curved, but only a part of the inner peripheral edge 131 may be curved. The outer peripheral edge 132 of the first through-wiring 13 is a straight line parallel to the axis AX, but it may also have a convex curved portion, allowing the stress on the curved portion of the outer peripheral edge 132 of the first through-wiring 13 to be distributed. The side edge 133 of the first through-wiring 13 is a straight line perpendicular to the axis AX.

[0083] Preferably, similarly, the inner peripheral edge 141 of the second through-wiring 14 has a convex curved portion. This allows the stress on the curved portion of the inner peripheral edge 141 of the second through-wiring 14 to be distributed. The outer peripheral edge 142 of the second through-wiring 14 is a straight line parallel to axis AX. The side edge 143 of the second through-wiring 14 is a straight line perpendicular to axis AX.

[0084] Preferably, the length of the inner peripheral edge 131 of the first through-wiring 13 is 1.5 times or more the length of the outer peripheral edge 132 of the first through-wiring 13. This allows for a longer inner peripheral edge 131 of the first through-wiring 13, thereby lowering the electrical resistance at high frequencies. In other words, since the current flows spirally along the inner diameter side of the coil 110, a larger inner peripheral edge 131 results in lower electrical resistance. For example, the length of the inner peripheral edge 131 is approximately 47 μm, and the length of the outer peripheral edge 132 is approximately 30 μm. To measure the length, WinRooF2018 manufactured by Mitani Corporation can be used to obtain the length of the peripheral edge (inner peripheral edge, outer peripheral edge) of the through-wiring from a cross-sectional image. When measuring the inner and outer peripheral edges, the position of the inner and outer peripheral edges to be measured should be specified. The cross-section to be measured should be the cross-section in the center of the extension direction of the first through-wiring 13.

[0085] Preferably, similarly, the length of the inner edge 141 of the second through-wiring 14 is 1.5 times or more the length of the outer edge 142 of the second through-wiring 14. This allows the length of the inner edge 141 of the second through-wiring 14 to be increased, and the electrical resistance value at high frequencies can be lowered.

[0086] Preferably, the orientation of the curved portion of the inner periphery 131 of all first through-wirings 13 is the same. The orientation of the curved portion is in the direction connecting the midpoint of the curved portion and the center line of the first through-wiring 13. The center line of the first through-wiring 13 is the line that passes through the centroid of the first through-wiring 13 in a cross section perpendicular to the extending direction of the first through-wiring 13. Here, since the entire inner periphery 131 is a curved portion, the orientation of the curved portion is in the direction connecting the midpoint of the inner periphery 131 and the center line of the first through-wiring 13. The orientation of the curved portion is in the direction perpendicular to axis AX. Note that in two first through-wirings 13, the orientation of the curved portion of the inner periphery 131 of one first through-wiring 13 and the orientation of the curved portion of the inner periphery 131 of the other first through-wiring 13 may be different from each other. This allows the orientation of the curved portion of the first through-wiring 13 to be changed according to the arrangement of the bottom wiring 11b and the top wiring 11t.

[0087] Preferably, similarly, the orientation of the curved portion of the inner periphery 141 of all second through-wirings 14 is the same. However, in two second through-wirings 14, the orientation of the curved portion of the inner periphery 141 of one second through-wiring 14 may be different from that of the other second through-wiring 14.

[0088] Figure 5 is an enlarged view of a part of Figure 1. As shown in Figure 5, when viewed from a direction perpendicular to the bottom surface 100b, the first end 11b1 of the bottom wiring 11b and the first end 13a of the first through wiring 13 are connected, and the outer shape of the coil 110 of the first end 11b1 of the bottom wiring 11b preferably follows the outer shape of the coil 110 of the first end 13a of the first through wiring 13. The outer side of the coil 110 refers to the outer peripheral surface side of the coil 110. Specifically, the outer shape of the first end 11b1 of the bottom wiring 11b follows the outer peripheral edge 132 and side edge 133 of the first end 13a of the first through wiring 13. With the above configuration, the shape of the first end 11b1 of the bottom wiring 11b can be made to correspond to the shape of the first end 13a of the first through wiring 13, and the DC electrical resistance of the connection portion between the bottom wiring 11b and the first through wiring 13 can be reduced.

[0089] In this case, preferably, the first end 11b1 of the bottom wiring 11b is larger than the first end 13a of the first through wiring 13. This ensures that even if the bottom wiring 11b is misaligned, the connection between the bottom wiring 11b and the first through wiring 13 can be maintained.

[0090] Preferably, similarly, when viewed from a direction perpendicular to the bottom surface 100b, the second end 11b2 of the bottom wiring 11b and the first end 14a of the second through wiring 14 are connected, and the outer shape of the coil 110 of the second end 11b2 of the bottom wiring 11b follows the outer shape of the coil 110 of the first end 14a of the second through wiring 14.

[0091] Specifically, the outer shape of the second end 11b2 of the bottom wiring 11b follows the outer peripheral edge 142 and side edge 143 of the first end 14a of the second through wiring 14. With the above configuration, the shape of the second end 11b2 of the bottom wiring 11b can be made to correspond to the shape of the first end 14a of the second through wiring 14, and the DC electrical resistance of the connection portion between the bottom wiring 11b and the second through wiring 14 can be reduced.

[0092] Preferably, as shown in Figure 2, when viewed from a direction perpendicular to the bottom surface 100b, the first end of the bottom wiring 11b and the first end of the top wiring 11t overlap, and the angle θ between the bottom wiring 11b and the top wiring 11t is acute. The angle θ is the angle between the center line of the width of the bottom wiring 11b (dotted line in Figure 2) and the center line of the width of the top wiring 11t (dotted line in Figure 2), when viewed from a direction perpendicular to the bottom surface 100b.

[0093] Preferably, as shown in Figure 2, the angle θ between the bottom wiring 11b and the top wiring 11t, both connected to the same first through-wiring 13, when viewed from a direction perpendicular to the bottom surface 100b, is 5° or more and 45° or less. The angle θ is the angle between the center line of the width of the bottom wiring 11b (the dashed line in Figure 2) and the center line of the width of the top wiring 11t (the dashed line in Figure 2), when viewed from a direction perpendicular to the bottom surface 100b.

[0094] According to the above configuration, the coil 110 is tightly wound, thereby improving the inductance. Since the angle θ is 45° or less, the coil length is shortened, leakage flux is reduced, and the Q value is increased. The coil length refers to the distance between the outermost ends of the bottom wiring 11b, top wiring 11t, first through wiring 13, and second through wiring 14 in the direction of axis AX. Since the angle θ is 5° or more, the possibility of two adjacent first through wirings 13 in the direction of axis AX contact is reduced, and the possibility of two adjacent second through wirings 14 in the direction of axis AX contact is also reduced. Note that for at least one pair of bottom wirings 11b and top wirings 11t, the angle θ should be between 5° and 45°.

[0095] Preferably, when viewed from a direction perpendicular to the bottom surface 100b, the angle θ between the bottom surface wiring 11b and the top surface wiring 11t, both connected to the same second through-wiring 14, is between 5° and 45°. This allows the coil 110 to be wound more densely, thereby improving its inductance.

[0096] Preferably, at least one of the bottom wiring 11b, top wiring 11t, first through wiring 13, and second through wiring 14 includes a void or resin portion. This allows the void or resin portion to absorb stress caused by the difference in the coefficient of thermal expansion between the wiring and the base body 10, thereby relieving the stress. As a method for forming the void, for example, a material that burns away by sintering can be used for the wiring material, and the void can be formed by sintering the wiring. As a method for forming the resin portion, for example, a conductive paste can be used for the wiring material to form the resin portion.

[0097] Preferably, at least one of the bottom wiring 11b and the top wiring 11t contains SiO2. This allows the coefficient of thermal expansion of the wiring to be matched with the coefficient of thermal expansion of the base material 10 when the base material 10 contains SiO2, thereby suppressing cracks between the wiring and the base material 10.

[0098] (First external electrode 121 and second external electrode 122) The first external electrode 121 is connected to the first end of the coil 110, and the second external electrode 122 is connected to the second end of the coil 110. The first external electrode 121 is positioned on the first end face 100e1 side with respect to the center in the X direction of the body 10 so as to be exposed from the outer surface 100 of the body 10. The second external electrode 122 is positioned on the second end face 100e2 side with respect to the center in the X direction of the body 10 so as to be exposed from the outer surface 100 of the body 10.

[0099] When viewed from a direction perpendicular to the bottom surface 100b, the first external electrode 121 and the second external electrode 122 are located inside the outer surface 100 of the base body 10. In other words, the first external electrode 121 and the second external electrode 122 are located inside the first end face 100e1, the second end face 100e2, the first side surface 100s1, and the second side surface 100s2 of the base body 10.

[0100] According to the above configuration, since the first external electrode 121 and the second external electrode 122 do not come into contact with the outer surface 100 of the base body 10, the load on the first external electrode 121 and the second external electrode 122 can be reduced when the inductor components are separated into individual pieces, and deformation and peeling of the first external electrode 121 and the second external electrode 122 can be suppressed. For this reason, even if the inductor components are made smaller, deformation and peeling of the first external electrode 121 and the second external electrode 122 can be prevented.

[0101] The first external electrode 121 may be provided continuously with the bottom surface 100b and the first end surface 100e1. In this case, since the first external electrode 121 is a so-called L-shaped electrode, a solder fillet can be formed on the first external electrode 121 when mounting the inductor component 1 onto the mounting board. Similarly, the second external electrode 122 may be provided continuously with the bottom surface 100b and the second end surface 100e2.

[0102] The first external electrode 121 has a bottom portion 121b provided on the bottom surface 100b and a via portion 121v embedded in the bottom surface 100b. The via portion 121v is connected to the bottom portion 121b. The via portion 121v is connected to the end of the bottom wiring 11b located on the first end surface 100e1 side in the axial AX direction.

[0103] The second external electrode 122 has a bottom portion 122b provided on the bottom surface 100b and a via portion 122v embedded in the bottom surface 100b. The via portion 122v is connected to the bottom portion 122b. The via portion 122v is connected to the end of the bottom wiring 11b located on the second end surface 100e2 side in the axial AX direction.

[0104] The first external electrode 121 has a base layer 121e1 and a plating layer 121e2 covering the base layer 121e1. The base layer 121e1 contains, for example, a conductive material such as Ag or Cu. The plating layer 121e2 contains, for example, a conductive material such as Ni or Sn. Part of the bottom portion 121b and the via portion 121v are made of the base layer 121e1. The other part of the bottom portion 121b is made of the plating layer 121e2. Similarly, the second external electrode 122 has a base layer and a plating layer covering the base layer. Note that the first external electrode 121 and the second external electrode 122 may be made of a single layer of conductive material.

[0105] (Manufacturing method for inductor component 1) Next, the manufacturing method of the inductor component 1 will be explained using Figures 6A to 6M. Figures 6A to 6H, 6K, and 6L correspond to the II-II cross section of Figure 1. Figures 6I, 6J, and 6M correspond to the III-III cross section of Figure 1.

[0106] As shown in Figure 6A, a first insulating layer 1011 is provided on the base substrate 1000 by printing. The material of the base substrate 1000 is, for example, a glass substrate, a silicon substrate, or an alumina substrate, and the material of the first insulating layer 1011 is, for example, a resin such as epoxy or polyimide, or an inorganic insulating film such as SiO or SiN.

[0107] As shown in Figure 6B, a second insulating layer 1012 is provided on the first insulating layer 1011 by printing. A groove 1012a is provided in the second insulating layer 1012. At this time, the groove 1012a is formed by, for example, a photolithography process. Alternatively, the groove may be formed from the beginning as a printed pattern.

[0108] As shown in Figure 6C, a top conductor layer 1011t is formed in the groove 1012a by printing. The material of the top conductor layer 1011t is, for example, Ag, Cu, Au, Al, or an alloy containing at least one of these elements, or solder paste. In this case, for example, the top conductor layer 1011t is formed as a printed pattern so that it remains only in the groove 1012a. Alternatively, the top conductor layer 1011t may be printed on the second insulating layer 1012 and then left only in the groove 1012a by a photolithography process.

[0109] As shown in Figure 6D, a third insulating layer 1013 is provided on the second insulating layer 1012 by printing. A first groove 1013a and a second groove 1013b are provided in the third insulating layer 1013. The first groove 1013a and the second groove 1013b are formed in the same manner as in Figure 6B.

[0110] As shown in Figure 6E, the first through-conductor layer 1131 is printed into the first groove 1013a, and the second through-conductor layer 1141 is printed into the second groove 1013b. The first through-conductor layer 1131 and the second through-conductor layer 1141 are formed in the same manner as in Figure 6C.

[0111] Repeating the above process, as shown in Figure 6F, a fourth insulating layer 1014 is provided on the third insulating layer 1013, and a second first through-conductor layer 1132 and a second second through-conductor layer 1142 are provided in each of the two grooves provided in the fourth insulating layer 1014. Furthermore, a fifth insulating layer 1015 is provided on the fourth insulating layer 1014, and a third first through-conductor layer 1133 and a third second through-conductor layer 1143 are provided in each of the two grooves provided in the fifth insulating layer 1015.

[0112] As shown in Figure 6G, a sixth insulating layer 1016 is provided on the fifth insulating layer 1015, and a bottom conductor layer 1011b is provided in a groove in the sixth insulating layer 1016. The material of the bottom conductor layer 1011b is the same as the material of the top conductor layer 1011t. As shown in Figure 6H, a seventh insulating layer 1017 is provided on the sixth insulating layer 1016.

[0113] As shown in Figure 6I, a groove 1017a is provided in the seventh insulating layer 1017 so that a portion of the bottom conductor layer 1011b is exposed. As shown in Figure 6J, a base conductor layer 1121e1 is provided on the seventh insulating layer 1017 and within the groove 1017a. The material of the base conductor layer 1121e1 is, for example, a resin paste such as Ag or Cu.

[0114] As shown in Figure 6K, the entire laminate is sintered in a furnace at a high temperature (e.g., 500°C or higher). The first to seventh insulating layers 1011 to 1017 are sintered to form the base body 10, the top conductor layer 1011t is sintered to form the top wiring 11t, the bottom conductor layer 1011b is sintered to form the bottom wiring 11b, the first through-conductor layers 1131 to 1133 from the first to third layers are sintered to form the first through-conductor 13, the second through-conductor layers 1141 to 1143 from the first to third layers are sintered to form the second through-conductor 14, and the base conductor layer 1121e1 is sintered to form the base layer 121e1. Therefore, the strength can be improved by sintering the insulating layers, and by sintering the conductor layers, unwanted resin components contained in the conductor layers are volatilized, and the conductor materials contained in the conductor layers fuse together, achieving high conductivity. The base substrate 1000 may be removed by decomposing its surface during sintering, or by mechanically removing it by grinding before or after sintering, or by chemically removing it by etching before or after sintering.

[0115] As shown in Figure 6L, the parts are separated along the cut line C. As shown in Figure 6M, a plating layer 121e2 is formed by barrel plating to cover the base layer 121e1, thereby forming the first external electrode 121. This completes the manufacture of the inductor component 1, as shown in Figure 2.

[0116] 3. Variant (First variation) Figure 7A is a diagram corresponding to the II-II cross-section in Figure 1, showing a first modified example of the inductor component. As shown in Figure 7A, in the inductor component 1A of the first modified example, the first through-wiring 13 and the second through-wiring 14 are not parallel when viewed from a direction parallel to the axis AX of the coil 110. This allows the distance between the first through-wiring 13 and the second through-wiring 14 to be increased, the inner diameter of the coil 110 can be increased, and the Q value can be improved.

[0117] Specifically, the first through-wiring 13 and the second through-wiring 14 are bent at the center such that the distance between them increases towards the center in the Z direction. In other words, the first through-wiring 13 and the second through-wiring 14 each have a shape that widens radially outward from the coil 110 towards the center in the Z direction. Furthermore, the first through-wiring 13 and the second through-wiring 14 each have a stepped shape along the Z direction. With the above configuration, when the first through-wiring 13 and the second through-wiring 14 are each formed by stacking multiple conductor layers, the first through-wiring 13 and the second through-wiring 14 can be easily formed in a stepped shape by stacking the conductor layers of each layer with a staggered arrangement.

[0118] (Second variation) Figure 7B is a diagram corresponding to the II-II cross-section in Figure 1, showing a second modified example of the inductor component. As shown in Figure 7B, in the inductor component 1B of the second modified example, the first through-wiring 13 and the second through-wiring 14 are not parallel when viewed from a direction parallel to the axis AX of the coil 110. This allows the distance between the first through-wiring 13 and the second through-wiring 14 to be increased, the inner diameter of the coil 110 to be increased, and the Q value to be improved.

[0119] Specifically, the first through-wiring 13 and the second through-wiring 14 are inclined such that the distance between them increases towards the top surface wiring 11t in the Z direction. In other words, the first through-wiring 13 and the second through-wiring 14 each have a shape that extends radially outward from the coil 110 by the amount of the top surface wiring 11t in the Z direction. Thus, the coil 110 has a trapezoidal shape when viewed from the axis AX direction. With the above configuration, the first through-wiring 13 and the second through-wiring 14 can be formed in a straight line and shortened, and the DC resistance of the first through-wiring 13 and the second through-wiring 14 can be reduced.

[0120] (Third variation) Figure 7C is a diagram corresponding to the II-II cross-section in Figure 1, showing a third modified example of the inductor component. As shown in Figure 7C, the inductor component 1C of the third modified example includes a first coil 110A and a second coil 110B, compared to the inductor component 1A of the first modified example shown in Figure 7A.

[0121] In the first coil 110A, the first through-wiring 13 and the second through-wiring 14 are not parallel when viewed from a direction parallel to the axis AX. This allows the distance between the first through-wiring 13 and the second through-wiring 14 to be increased, the inner diameter of the coil 110A can be increased, and the Q value can be improved.

[0122] Specifically, the first through-wiring 13 has the same configuration as the first through-wiring 13 of the inductor component 1A of the first modified example. On the other hand, the second through-wiring 14 has a straight shape parallel to the Z direction. In other words, the first through-wiring 13 is bent in the center such that the distance between the first through-wiring 13 and the second through-wiring 14 widens towards the center in the Z direction. The first through-wiring 13 has a stepped shape along the Z direction. According to the above configuration, when the first through-wiring 13 is formed by stacking multiple conductor layers, the first through-wiring 13 can be easily formed in a stepped shape by stacking the conductor layers of each layer with a staggered arrangement.

[0123] In the second coil 110B, the first through-wiring 13 and the second through-wiring 14 are not parallel when viewed from a direction parallel to the axis AX. This allows the distance between the first through-wiring 13 and the second through-wiring 14 to be increased, the inner diameter of the coil 110B can be increased, and the Q value can be improved.

[0124] Specifically, the second through-wiring 14 has the same configuration as the second through-wiring 14 of the inductor component 1A of the first modified example. On the other hand, the first through-wiring 13 has a straight shape parallel to the Z direction. That is, the second through-wiring 14 is bent in the center such that the distance between the first through-wiring 13 and the second through-wiring 14 widens towards the center in the Z direction. The second through-wiring 14 has a stepped shape along the Z direction. According to the above configuration, when the second through-wiring 14 is formed by stacking multiple conductor layers, the second through-wiring 14 can be easily formed in a stepped shape by stacking the conductor layers of each layer with a staggered arrangement.

[0125] (Fourth variation) Figure 7D is a diagram corresponding to the II-II cross-section in Figure 1, showing a fourth modified example of the inductor component. As shown in Figure 7D, the inductor component 1D of the fourth modified example includes a first coil 110A and a second coil 110B, compared to the inductor component 1B of the second modified example shown in Figure 7B.

[0126] In the first coil 110A, the first through-wiring 13 and the second through-wiring 14 are not parallel when viewed from a direction parallel to the axis AX. This allows the distance between the first through-wiring 13 and the second through-wiring 14 to be increased, the inner diameter of the coil 110A can be increased, and the Q value can be improved.

[0127] Specifically, the first through-wiring 13 has the same configuration as the first through-wiring 13 of the inductor component 1B of the second modified example. On the other hand, the second through-wiring 14 has a linear shape parallel to the Z direction. In other words, the first through-wiring 13 is inclined such that the distance between the first through-wiring 13 and the second through-wiring 14 becomes wider towards the top surface wiring 11t side in the Z direction. With the above configuration, the first through-wiring 13 and the second through-wiring 14 can be formed in a linear shape and shortened, and the DC resistance of the first through-wiring 13 and the second through-wiring 14 can be reduced.

[0128] In the second coil 110B, the first through-wiring 13 and the second through-wiring 14 are not parallel when viewed from a direction parallel to the axis AX. This allows the distance between the first through-wiring 13 and the second through-wiring 14 to be increased, the inner diameter of the coil 110B can be increased, and the Q value can be improved.

[0129] Specifically, the second through-wiring 14 has the same configuration as the second through-wiring 14 of the inductor component 1B of the second modified example. On the other hand, the first through-wiring 13 has a linear shape parallel to the Z direction. That is, the second through-wiring 14 is inclined such that the distance between the first through-wiring 13 and the second through-wiring 14 becomes wider towards the top surface wiring 11t side in the Z direction. With the above configuration, the first through-wiring 13 and the second through-wiring 14 can be formed in a linear shape, and the electrical resistance of the first through-wiring 13 and the second through-wiring 14 can be reduced.

[0130] <Second Embodiment> Figure 8 is a schematic bottom view of the second embodiment of the inductor component, viewed from the bottom. Figure 9 is a cross-sectional view taken along line IX-IX in Figure 8. In Figure 8, for convenience, the insulating layer is omitted, and the external electrodes are shown as dashed lines. Also, in Figure 8, the component 10 is depicted transparently to facilitate understanding of its structure. The second embodiment differs from the first embodiment mainly in the position of the coil axis, the orientation of the through-wiring, the material of the component, and the presence of an insulating layer. These differing configurations will be described below. Other configurations are the same as those of the first embodiment, and their description will be omitted.

[0131] 1.Each part configuration (Inductor component 1E) As shown in Figure 8, in the inductor component 1E, the axis AX of the coil 110 is perpendicular to the X direction. More specifically, the axis AX is parallel to the Y direction and passes through the center of the element 10 in the X direction. This reduces interference of the magnetic flux of the coil 110 by the first external electrode 121 and the second external electrode 122, thereby improving the efficiency of inductance acquisition.

[0132] The length of coil 110 in the axial direction AX is shorter than the inner diameter of coil 110. The length of coil 110 in the axial direction AX is also called the coil length. According to this, the Q value can be improved because the coil length is short and the coil inner diameter is large. The inner diameter of the coil refers to the equivalent diameter of a circle based on the minimum area of ​​the region enclosed by coil 110 when viewed through from the axial direction AX.

[0133] (Base model 10) The element 10 is an inorganic insulator. Preferably, the material of the element 10 is glass, as glass has high insulating properties, which can suppress eddy currents and increase the Q value. Preferably, the element 10 contains the element Si, which increases the thermal stability of the element 10, thereby suppressing changes in the dimensions of the element 10 due to heat and reducing variations in electrical properties.

[0134] The base body 10 is preferably a single-layer glass plate. This ensures the strength of the base body 10. In addition, since a single-layer glass plate has low dielectric loss, the Q value at high frequencies can be increased. Furthermore, since there is no sintering process like in a sintered body, deformation of the base body 10 during sintering can be suppressed, which suppresses pattern misalignment and allows for the provision of an inductor component with a small inductance tolerance.

[0135] From the viewpoint of manufacturing methods, a photosensitive glass plate, such as Foturan II (a registered trademark of Schott AG), is preferred as the material for the single-layer glass plate. In particular, it is preferable that the single-layer glass plate contains cerium oxide (ceria: CeO2), in which case the cerium oxide acts as a sensitizer, making processing by photolithography easier.

[0136] However, since single-layer glass plates can be processed by mechanical processes such as drilling and sandblasting, dry / wet etching using photoresist / metal masks, and laser processing, they may be glass plates that do not have photosensitivity. Furthermore, single-layer glass plates may be made by sintering glass paste or by known methods such as the float method.

[0137] (Insulator 22) As shown in Figure 9, the inductor component 1E has an insulator 22. The insulator 22 covers the bottom surface 100b and the top surface 100t of the main body 10, respectively. Note that the insulator 22 may be provided only on the bottom surface 100b of the two top surfaces 100t.

[0138] The insulator 22 is a component that protects the wiring (bottom wiring 11b, top wiring 11t) from external forces by covering it, preventing damage to the wiring and improving the insulation properties of the wiring. Preferably, the insulator 22 is an organic insulator. For example, the insulator 22 may be a resin film such as epoxy or polyimide, which is easy to form. In particular, it is preferable that the insulator 22 be made of a material with a low dielectric constant, so that when the insulator 22 is present between the coil 110 and the external electrodes 121, 122, the stray capacitance formed between the coil 110 and the external electrodes 121, 122 can be reduced. The insulator 22 can be formed, for example, by laminating a resin film such as ABF GX-92 (manufactured by Ajinomoto Fine Techno Co., Ltd.), or by applying and heat-curing a paste-like resin. The insulator 22 may also be an inorganic film such as an oxide, nitride, or oxynitride of silicon or hafnium, which has excellent insulating properties and can be made into a thin film.

[0139] Preferably, when the base material 10 is an inorganic insulator and the insulator 22 is an organic insulator, the organic insulator is located inside the outer surface 100 of the inorganic insulator when viewed from a direction perpendicular to the bottom surface 100b. As a result, because an organic insulator is present, it is easy to impart fluidity to the organic insulator, and when wiring (bottom wiring 11b, top wiring 11t) is covered with the organic insulator, the organic insulator can be easily filled between adjacent wiring, thereby improving insulation performance. Furthermore, since the organic insulator is not in contact with the outer surface of the inorganic insulator, the load on the organic insulator can be reduced when individual inductor components are formed, and deformation and peeling of the organic insulator can be suppressed.

[0140] (Coil 110) As shown in Figure 8, the bottom wiring 11b extends in only one direction. Specifically, the bottom wiring 11b has a shape that extends in the X direction. Multiple bottom wirings 11b are arranged parallel to each other along the Y direction. The top wiring 11t extends in only one direction. Specifically, the top wiring 11t extends in the X direction with a slight inclination in the Y direction. Multiple top wirings 11t are arranged parallel to each other along the Y direction.

[0141] The first through-hole 13 is positioned within the through-hole V of the base body 10, on the side of the first end face 100e1 relative to the axis AX, and the second through-hole 14 is positioned within the through-hole V of the base body 10, on the side of the second end face 100e2 relative to the axis AX. The first through-hole 13 and the second through-hole 14 extend in directions perpendicular to the bottom surface 100b and the top surface 100t, respectively. Multiple first through-holes 13 and multiple second through-holes 14 are arranged parallel to each other along the Y direction.

[0142] As shown in Figure 9, in a cross-section perpendicular to the direction in which the bottom wiring 11b extends, the upper surface 11b3 located on the opposite side of the axis AX of the bottom wiring 11b preferably has a convex shape that protrudes upward on the opposite side of the axis AX. This allows the distance between the upper surfaces 11b3 of two adjacent bottom wirings 11b in the direction of axis AX to be increased, thereby reducing the parasitic capacitance between adjacent bottom wirings 11b in the direction of axis AX and increasing the self-resonant frequency of the inductor component 1E.

[0143] Preferably, similarly, in a cross section perpendicular to the direction in which the top wiring 11t extends, the upper surface 11t3 located on the opposite side of the axis AX of the top wiring 11t preferably has a convex shape that protrudes upward on the opposite side of the axis AX. This allows the distance between the upper surfaces 11t3 of two adjacent top wirings 11t in the direction of axis AX to be increased, thereby reducing the parasitic capacitance between adjacent top wirings 11t in the direction of axis AX and increasing the self-resonant frequency of the inductor component 1E.

[0144] Preferably, the first external electrode 121 is positioned on the bottom wiring 11b, and the upper surface 11b3 of the bottom wiring 11b faces the first external electrode 121. This allows the distance between the first external electrode 121 and the upper surface 11b3 of the bottom wiring 11b to be increased, reducing the parasitic capacitance between the first external electrode 121 and the bottom wiring 11b, and thereby increasing the self-resonant frequency of the inductor component 1E.

[0145] Preferably, the second external electrode 122 is similarly positioned on the bottom wiring 11b, and the upper surface 11b3 of the bottom wiring 11b faces the second external electrode 122. This allows the distance between the second external electrode 122 and the upper surface 11b3 of the bottom wiring 11b to be increased, reducing the parasitic capacitance between the second external electrode 122 and the bottom wiring 11b, and thereby increasing the self-resonant frequency of the inductor component 1E.

[0146] Furthermore, the first external electrode 121 and the second external electrode 122 do not necessarily have to be positioned directly above the bottom wiring 11b; they may be slightly separated from the bottom wiring 11b when viewed from a direction perpendicular to the bottom surface 100b. Even in this case, the parasitic capacitance between the first external electrode 121 and the second external electrode 122 and the bottom wiring 11b can be reduced.

[0147] Figure 10 is a schematic bottom view of the coil 110 as seen from the bottom surface 100b side. As shown in Figure 10, the first angle bisector (hereinafter referred to as the first bisector L1) of the first angle θ1 formed by the bottom wiring 11b and the top wiring 11t, which are connected to the reference first through wiring 13A, one of the first through wirings 13, when viewed from a direction perpendicular to the bottom surface 100b is defined.

[0148] As shown in Figure 11, in a cross-section parallel to the base surface 100b and including axis AX, the reference first through-wiring 13A includes an inner peripheral edge 131 facing the first bisector L1 and an outer peripheral edge 132 facing the opposite side of the first bisector L1. The length of the inner peripheral edge 131 is longer than the length of the outer peripheral edge 132.

[0149] The inner periphery 131 is the region projected onto the orthogonal line Lr, which is perpendicular to the first bisector L1, when the reference first through-wiring 13A is projected from a direction parallel to the first bisector L1 toward the orthogonal line Lr perpendicular to the first bisector L1. The outer periphery 132 is the region projected onto the virtual line Lv, which is perpendicular to the entire periphery of the reference first through-wiring 13A, when a virtual line Lv is defined on the opposite side of the reference first through-wiring 13A from the direction parallel to the first bisector L1 toward the virtual line Lv, and the reference first through-wiring 13A is projected toward the virtual line Lv.

[0150] According to the above configuration, the length of the inner peripheral edge 131 is longer than the length of the outer peripheral edge 132, so the surface area of ​​the inner surface of the reference first through-wiring 13A can be increased. This increases the surface area of ​​the inner surface of the coil 110, which lowers the electrical resistance at high frequencies and improves the Q value at high frequencies. Note that all first through-wirings 13 may have the same configuration as the reference first through-wiring 13A.

[0151] Similarly, as shown in Figure 10, the second angle bisector (hereinafter referred to as the second bisector L2) of the second angle θ2 formed between the bottom wiring 11b, which is connected to the reference second through-wiring 14A (one of the second through-wirings 14), and the top wiring 11t is defined when viewed from a direction perpendicular to the bottom surface 100b.

[0152] As shown in Figure 11, in a cross-section parallel to the bottom surface 100b and including axis AX, the reference second through-wiring 14A includes an inner peripheral edge 131 facing the second bisector L2 and an outer peripheral edge 132 facing the opposite side of the second bisector L2. The length of the inner peripheral edge 131 is longer than the length of the outer peripheral edge 132. This allows the inner surface area of ​​the reference second through-wiring 14A to be increased, which in turn allows the inner surface area of ​​the coil 110 to be increased, resulting in a lower electrical resistance at high frequencies and an improved Q value at high frequencies. Note that all second through-wirings 14 may have the same configuration as the reference second through-wiring 14A.

[0153] Preferably, the direction of the curved portion of the inner edge 131 of the reference first through-wiring 13A coincides with the first bisector L1. Here, since the entire inner edge 131 is curved, the direction of the curve is the direction connecting the midpoint of the inner edge 131 and the center line of the first through-wiring 13. Note that all first through-wirings 13 may have the same configuration as the reference first through-wiring 13A.

[0154] Preferably, the direction of the curved portion of the inner edge 131 of the reference second through-wiring 14A coincides with the second bisector L2. Here, since the entire inner edge 131 is curved, the direction of the curve is the direction connecting the midpoint of the inner edge 131 and the center line of the second through-wiring 14. Note that all second through-wirings 14 may have the same configuration as the reference second through-wiring 14A.

[0155] Furthermore, the angles between all bottom wirings 11b and top wirings 11t may be different, in which case all bisectors will not be parallel. Also, the direction of the curved portion of the inner periphery 131 of all first through wirings 13 may be the same or different. The direction of the curved portion of the inner periphery 141 of all second through wirings 14 may be the same or different.

[0156] (Manufacturing method for inductor component 1E) Next, the manufacturing method of inductor component 1E will be explained using Figures 12A to 12H. Figures 12A to 12H correspond to the IX-IX cross section in Figure 8.

[0157] As shown in Figure 12A, copper foil 2001 is printed onto the base substrate 2000. The material of the base substrate 2000 is the same as that of the base substrate 1000 in the first embodiment.

[0158] As shown in Figure 12B, a glass substrate 2010, which will become the base body 10, is placed on the base substrate 2000. For example, the base substrate 2000 and the glass substrate 2010 are brought into close contact using conductive tape, pins, frames, or other jigs. The glass substrate 2010 has through holes V. The glass substrate 2010 is, for example, a TGV (Through Glass Via) substrate. A TGV substrate is a substrate in which through holes have been formed in advance by a laser or photolithography. The glass substrate 2010 may also be, for example, a TSV (Through Silicon Via) substrate, or any other material. Furthermore, Ti / Cu or other necessary conductive materials may be deposited on the surface of the glass substrate 2010 in advance as a seed by sputtering or other methods.

[0159] As shown in Figure 12C, a first through-conductor layer 2013, which will become the first through-wiring 13, is formed in the through-hole V of the glass substrate 2010. Although not shown, a second through-conductor layer, which will become the second through-wiring 14, is similarly formed in the through-hole V. Specifically, the first through-conductor layer 2013 is formed by electroplating the through-hole V of the glass substrate 2010 by supplying power from the copper foil 2001 on the base substrate 2000. Alternatively, a seed layer may be formed on the surface of the glass substrate 2010 or the inner surface of the through-hole V by sputtering, and the through-conductor layer may be formed using known methods such as filled plating, conformal plating, or a printed filling method of conductive paste. If there is unwanted plating growth on the surface of the glass substrate 2010, the unwanted parts are removed by polishing, CMP, wet etching (etch back), or dry etching.

[0160] As shown in Figure 12D, the base substrate 2000 is peeled off from the glass substrate 2010. At this time, the base substrate 2000 may be removed mechanically by grinding or other means, or chemically by etching or other means.

[0161] As shown in Figure 12E, a bottom conductor layer 2011b, which will become the bottom wiring 11b, and a top conductor layer 2011t, which will become the top wiring 11t, are formed on the glass substrate 2010. Specifically, a seed layer (not shown) is provided over the entire surface of the glass substrate 2010, and a patterned photoresist is formed on the seed layer. A copper layer is formed on the seed layer at the openings in the photoresist by electroplating. The photoresist and seed layer are removed by wet etching or dry etching. This forms a bottom conductor layer 2011b and a top conductor layer 2011t patterned in any shape. At this time, the bottom conductor layer 2011b and the top conductor layer 2011t may be formed one at a time, or both may be formed simultaneously. Furthermore, the shape of the top surface of the top wiring and bottom wiring may be made to be a convex curve by optimizing the stirring conditions of the additives and electroplating solution.

[0162] As shown in Figure 12F, insulating layers 2022, which will serve as insulators 22, are provided on the top and bottom surfaces of the glass substrate 2010 so as to cover the conductive layer. At this time, the insulating layer 2022 on the bottom surface and the insulating layer 2022 on the top surface may be formed one at a time, or both may be formed simultaneously. Subsequently, holes 2022a are provided on the bottom conductive layer 2011b of the insulating layer 2022 on the bottom surface using photolithography or laser processing.

[0163] As shown in Figure 12G, a first external electrode conductor layer 2121, which will become the first external electrode 121, is provided on the bottom insulating layer 2022. At this time, the first external electrode conductor layer 2121 is connected to the bottom conductor layer 2011b via a hole 2022a. Specifically, a Pd catalyst (not shown) is provided on the bottom insulating layer 2022, and Ni and Au plating layers are formed by electroless plating. A patterned photoresist is formed on the plating layers. The plating layer at the openings of the photoresist is removed by wet etching or dry etching. This forms the first external electrode conductor layer 2121 patterned in any shape. Alternatively, a seed layer (not shown) is provided on the bottom insulating layer 2022, and a patterned photoresist is formed on the seed layer. Next, the seed layer at the openings of the photoresist is removed by wet etching or dry etching. A Ni and Au plating layer may be formed on the remaining seed layer by electroless plating. Although not shown in the diagram, a second external electrode conductor layer, which will become the second external electrode 122, is similarly provided on the insulating layer 2022 on the bottom side.

[0164] Here, since the first external electrode conductor layer 2121 is formed to conform to the shape of the upper surface of the bottom insulating layer 2022, the upper surface of the first external electrode conductor layer 2121 has a depression in the region overlapping with the hole 2022a. Alternatively, the upper surface of the first external electrode conductor layer 2121 may be formed to be flat.

[0165] As shown in Figure 12H, the components are separated along the cut line C. This allows for the manufacture of the inductor component 1E, as shown in Figure 9.

[0166] 2. Variations (First variation) Figure 13A is a diagram corresponding to the IX-IX cross-section in Figure 8, showing a first modified example of the inductor component. As shown in Figure 13A, in the inductor component 1F of the first modified example, the first external electrode 121 is connected to the first through-wiring 13 instead of the bottom wiring 11b. That is, the first end of the first through-wiring 13 is connected to the first external electrode 121, and the second end of the first through-wiring 13 is connected to the top wiring 11t. With this, even if the number of turns of the coil is changed, the coil can be easily connected to the first external electrode 121. Similarly, the second external electrode 122 may be connected to the second through-wiring 14 instead of the bottom wiring 11b.

[0167] (Second variation) Figure 13B is a diagram corresponding to the IX-IX cross-section in Figure 8, showing a second modified example of the inductor component. As shown in Figure 13B, in the inductor component 1G of the second modified example, the first through-wiring 13 extends in a direction perpendicular to the bottom wiring 11b, and the cross-sectional area of ​​each end 13e in the direction of extension of the first through-wiring 13 is larger than the cross-sectional area of ​​the central part 13m in the direction of extension of the first through-wiring 13. In other words, in the cross-section along the direction of extension of the first through-wiring 13, the width in the direction perpendicular to the direction of extension of the first through-wiring 13 increases continuously from the central part 13m toward both ends 13e.

[0168] According to this, the cross-sectional area of ​​the end portion 13e of the first through-wiring 13 can be increased, and the connectivity between the first through-wiring 13 and at least one of the bottom wiring 11b and the top wiring 11t can be improved. Furthermore, when forming a through-hole V as a hole portion in the base body 10 and filling this through-hole V with conductive material by fill plating or the like to form the first through-wiring 13 in the through-hole V, it is easier to fill the opening side of the through-hole V with conductive material. And since the cross-sectional area of ​​the end portion 13e of the first through-wiring 13 is large and the cross-sectional area of ​​the central portion 13m of the first through-wiring 13 is small, it is easy to form the first through-wiring 13.

[0169] Furthermore, the cross-sectional area of ​​one end 13e of the first through-wiring 13 may be larger than the cross-sectional area of ​​the central part 13m of the first through-wiring 13. Similarly, the cross-sectional area of ​​at least one end of the second through-wiring 14 may be larger than the cross-sectional area of ​​the central part 13m of the first through-wiring 13.

[0170] (Third variation) Figure 13C is a diagram corresponding to the IX-IX cross-section in Figure 8, showing a third modified example of the inductor component. As shown in Figure 13C, in the inductor component 1H of the third modified example, the first through-wiring 13 has a conductive layer 13s located on the outer circumference when viewed from the direction in which the first through-wiring 13 extends, and a non-conductive layer 13u located inside the conductive layer 13s. With this configuration, when used in the high-frequency band, the current mainly flows on the surface of the first through-wiring 13 due to the skin effect, so providing the conductive layer 13s on the outer circumference does not lower the Q value. In addition, by providing the non-conductive layer 13u on the inside, stress can be relieved, and manufacturing costs can be reduced by not using a conductor.

[0171] An example of a method for forming a conductive layer 13s and a non-conductive layer 13u is described. A seed layer is provided on the inner surface of the through-hole V of the base body 10 by sputtering or electroless plating. Then, a plating layer is formed on the seed layer by electroplating. In this way, multiple conductive layers 13s, such as Ti / Cu / electrolytic Cu or Pd / electroless Cu / electrolytic Cu, can be formed on the outer circumference of the first through-wiring 13. Subsequently, the inside of the conductive layer 13s is sealed with resin by printing or heat pressing to form a non-conductive layer 13u made of resin. In this way, while current is flowing through the surface (conductive layer 13s) of the first through-wiring 13, stress can be relieved by the non-conductive layer 13u inside the first through-wiring 13.

[0172] Similarly, the second through-wiring 14 may have a conductive layer located on the outer periphery when viewed from the direction in which the second through-wiring 14 extends, and a non-conductive layer located inside the conductive layer.

[0173] <Third Embodiment> Figure 14 is an XY cross-sectional view of the first through-wiring showing a third embodiment of the inductor component. The third embodiment differs from the first embodiment (Figure 4) in the inner and outer edges of the first through-wiring, and these differing configurations will be described below. The other configurations are the same as those of the first embodiment, and their description will be omitted.

[0174] As shown in Figure 14, in the inductor component 1I of the third embodiment, in a cross-section parallel to the bottom surface 100b and including the axis AX, the first through-wiring 13I includes an inner peripheral edge 131 parallel to the axis AX and facing toward the axis AX, and an outer peripheral edge 132 parallel to the axis AX and facing away from the axis AX. The length of the inner peripheral edge 131 is longer than the length of the outer peripheral edge 132. As a result, since the length of the inner peripheral edge 131 is longer than the length of the outer peripheral edge 132, the surface area of ​​the inner surface of the first through-wiring 13I can be increased. Therefore, the surface area of ​​the inner surface of the coil can be increased, the electrical resistance value at high frequencies is reduced, and the Q value at high frequencies is improved.

[0175] The first through-wiring 13I further includes a side edge 133 connecting the inner edge 131 and the outer edge 132. The side edge 133 is straight and inclined with respect to a direction perpendicular to the axis AX. The side edge 133 faces away from the axis AX. The distance between the two side edges 133 widens from the outer edge 132 toward the inner edge 131. In other words, the cross-sectional shape of the first through-wiring 13I is trapezoidal. Note that the side edge 133 may be curved instead of straight.

[0176] Furthermore, although not shown in the diagram, the second through-wiring may have the same configuration as the first through-wiring 13I, and will have the same effects and advantages as the first through-wiring 13I described above.

[0177] <Fourth Embodiment> Figure 15 is an XY cross-sectional view of the first through-wiring showing a fourth embodiment of the inductor component. The fourth embodiment differs from the second embodiment (Figure 11) in the inner and outer edges of the reference first through-wiring, and this difference in configuration will be described below. The other configurations are the same as those of the second embodiment, and their description will be omitted.

[0178] As shown in Figure 15, in the inductor component 1J of the fourth embodiment, when the angle bisector L1 of the angle θ between the bottom wiring 11b and the top wiring 11t connected to the reference first through wiring 13J, viewed from a direction perpendicular to the bottom surface 100b, is defined, the reference first through wiring 13A includes an inner peripheral edge 131 that is parallel to the direction perpendicular to the bisector L1 and faces toward the bisector L1, and an outer peripheral edge 132 that is parallel to the direction perpendicular to the bisector L1 and faces away from the bisector L1. The length of the inner peripheral edge 131 is longer than the length of the outer peripheral edge 132. As a result, since the length of the inner peripheral edge 131 is longer than the length of the outer peripheral edge 132, the surface area of ​​the inner surface of the reference first through wiring 13J can be increased. Therefore, the surface area of ​​the inner surface of the coil can be increased, the electrical resistance value at high frequencies is reduced, and the Q value at high frequencies is improved.

[0179] The standard first through-wiring 13J further includes a side edge 133 connecting the inner edge 131 and the outer edge 132. The side edge 133 is straight and inclined with respect to the bisector L1. The side edge 133 faces away from the bisector L1. The distance between the two side edges 133 widens from the outer edge 132 toward the inner edge 131. In other words, the cross-sectional shape of the standard first through-wiring 13J is trapezoidal. Note that the side edge 133 may be curved instead of straight.

[0180] Furthermore, all first through-wirings may have the same configuration as the standard first through-wiring 13A. Also, although not shown in the figures, the standard second through-wirings may have the same configuration as the standard first through-wiring 13J and have the same effects as the standard first through-wiring 13J described above. In this case, all second through-wirings may have the same configuration as the standard second through-wirings.

[0181] This disclosure is not limited to the embodiments described above, and design modifications are possible without departing from the gist of this disclosure. For example, the features of each of the first to fourth embodiments may be combined in various ways.

[0182] In the first and second embodiments described above, the first through-wiring includes an inner edge, an outer edge, and a side edge, but it may also include only the inner edge and the outer edge without the side edge. In this case, the inner edge and the outer edge may be convex curves; for example, the radius of curvature of the inner edge is larger than the radius of curvature of the outer edge. Alternatively, the inner edge and the outer edge may be concave curves. Furthermore, the second through-wiring may be the same as the first through-wiring.

[0183] This disclosure includes the following aspects: <1> A base body including a first principal surface and a second principal surface that are opposite to each other, A coil provided on the aforementioned body and wound spirally along the axis, A first external electrode and a second external electrode are provided on the base body and electrically connected to the coil. Equipped with, The shaft of the coil is arranged parallel to the first main surface. The aforementioned coil is A plurality of first coil wirings are provided on the first main surface side with respect to the shaft and are arranged along the shaft on a plane parallel to the first main surface, A plurality of second coil wirings are provided on the second main surface side with respect to the shaft and are arranged along the shaft on a plane parallel to the second main surface, A plurality of first through-wirings extending from the first coil wiring toward the second coil wiring and arranged along the axis, A plurality of second through-wirings extend from the first coil wiring toward the second coil wiring, are provided on the opposite side of the axis from the first through-wiring, and are arranged along the axis. Includes, The first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a portion of the helical shape. An inductor component wherein, in a cross-section parallel to the first main surface and including the axis, the first through-wiring includes an inner peripheral edge facing the axis and an outer peripheral edge facing the opposite side of the axis, and the length of the inner peripheral edge is longer than the length of the outer peripheral edge. <2> A base body including a first principal surface and a second principal surface that are opposite to each other, A coil provided on the aforementioned body and wound spirally along the axis, A first external electrode and a second external electrode are provided on the base body and electrically connected to the coil. Equipped with, The shaft of the coil is arranged parallel to the first main surface. The aforementioned coil is A plurality of first coil wirings are provided on the first main surface side with respect to the shaft and are arranged along the shaft on a plane parallel to the first main surface, A plurality of second coil wirings are provided on the second main surface side with respect to the shaft and are arranged along the shaft on a plane parallel to the second main surface, A plurality of first through-wirings extending from the first coil wiring toward the second coil wiring and arranged along the axis, A plurality of second through-wirings extend from the first coil wiring toward the second coil wiring, are provided on the opposite side of the axis from the first through-wiring, and are arranged along the axis. Includes, The first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a portion of the helical shape. When viewed from a direction perpendicular to the first main surface, and a bisector of the angle between the first coil wiring connected to a reference first through wiring which is one of the first through wirings and the second coil wiring is defined, in a cross section parallel to the first main surface and including the axis, the reference first through wiring includes an inner peripheral edge facing the bisector and an outer peripheral edge facing the opposite side of the bisector, and the length of the inner peripheral edge is longer than the length of the outer peripheral edge, an inductor component. <3> A base body including a first principal surface and a second principal surface that are opposite to each other, A coil provided on the aforementioned body and wound spirally along the axis, A first external electrode and a second external electrode are provided on the base body and electrically connected to the coil. Equipped with, The shaft of the coil is arranged parallel to the first main surface. The aforementioned coil is A plurality of first coil wirings are provided on the first main surface side with respect to the shaft and are arranged along the shaft on a plane parallel to the first main surface, A plurality of second coil wirings are provided on the second main surface side with respect to the shaft and are arranged along the shaft on a plane parallel to the second main surface, A plurality of first through-wirings extending from the first coil wiring toward the second coil wiring and arranged along the axis, A plurality of second through-wirings extend from the first coil wiring toward the second coil wiring, are provided on the opposite side of the axis from the first through-wiring, and are arranged along the axis. Includes, The first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a portion of the helical shape. An inductor component wherein, in a cross-section parallel to the first main surface and including the axis, the first through-wiring includes an inner peripheral edge parallel to the axis and facing toward the axis, and an outer peripheral edge parallel to the axis and facing away from the axis, the length of the inner peripheral edge being longer than the length of the outer peripheral edge. <4> A base body including a first principal surface and a second principal surface that are opposite to each other, A coil provided on the aforementioned body and wound spirally along the axis, A first external electrode and a second external electrode are provided on the base body and electrically connected to the coil. Equipped with, The shaft of the coil is arranged parallel to the first main surface. The aforementioned coil is A plurality of first coil wirings are provided on the first main surface side with respect to the shaft and are arranged along the shaft on a plane parallel to the first main surface, A plurality of second coil wirings are provided on the second main surface side with respect to the shaft and are arranged along the shaft on a plane parallel to the second main surface, A plurality of first through-wirings extending from the first coil wiring toward the second coil wiring and arranged along the axis, A plurality of second through-wirings extend from the first coil wiring toward the second coil wiring, are provided on the opposite side of the axis from the first through-wiring, and are arranged along the axis. Includes, The first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a portion of the helical shape. When viewed from a direction perpendicular to the first main surface, and a bisector of the angle between the first coil wiring connected to a reference first through-wiring, which is one of the first through-wirings, and the second coil wiring is defined, in a cross section parallel to the first main surface and including the axis, the reference first through-wiring includes an inner peripheral edge parallel to the direction perpendicular to the bisector and facing toward the bisector, and an outer peripheral edge parallel to the direction perpendicular to the bisector and facing away from the bisector, wherein the length of the inner peripheral edge is longer than the length of the outer peripheral edge. <5> The aforementioned substrate contains SiO2, <1> from <4> An inductor component listed in any one of the following. <6> The inner periphery of the first through-wiring has a curved portion with a convex shape. <1> or <2> The inductor components listed below. <7> The plurality of first through-wirings include two of the first through-wirings whose orientations of the curved portions of their inner periphery are different from each other. <6> The inductor components listed below. <8> The length of the inner edge of the first through-wiring is 1.5 times or more the length of the outer edge of the first through-wiring. <1> from <7> An inductor component listed in any one of the following. <9> Viewed from a direction perpendicular to the first main surface, the first end of the first coil wiring and the first end of the first through wiring are connected, and the outer shape of the coil at the first end of the first coil wiring conforms to the outer shape of the coil at the first end of the first through wiring. <1> from <8> An inductor component listed in any one of the following. <10> When viewed from a direction perpendicular to the first main surface, the angle between the first coil wiring and the second coil wiring connected to the same first through-wiring is between 5° and 45°. <1> from <9> An inductor component listed in any one of the following. <11> In a cross-section perpendicular to the direction in which the first coil wiring extends, the upper surface of the first coil wiring located on the side opposite to the axis has a convex shape that protrudes upward on the side opposite to the axis. <1> from <10> An inductor component listed in any one of the following. <12> The first external electrode is arranged on the first coil wiring, The upper surface of the first coil wiring faces the first external electrode, <11> The inductor components listed below. <13> Viewed from a direction parallel to the aforementioned axis, the first through-wiring and the second through-wiring are not parallel. <1> from <12> An inductor component listed in any one of the following. <14> The aforementioned substrate contains SiO2, The first through-wiring includes SiO2, <1> from <13> An inductor component listed in any one of the following. <15> The first through-wiring includes a gap or a resin part. <1> from <14> An inductor component listed in any one of the following. <16> The first through-wiring comprises a conductive layer located on the outer periphery when viewed from the direction in which the first through-wiring extends, and a non-conductive layer located inside the conductive layer. <1> from <15> An inductor component listed in any one of the following. <17> The axial length of the coil is shorter than the inner diameter of the coil. <1> from <16> An inductor component listed in any one of the following. <18> The first through-wiring extends in a direction perpendicular to the first main surface, The cross-sectional area of ​​at least one of the ends of the first through-wiring in the direction of extension is greater than the cross-sectional area of ​​the central part of the first through-wiring in the direction of extension. <1> from <17> An inductor component listed in any one of the following. <19> Viewed from a direction perpendicular to the first main surface, the first external electrode and the second external electrode are located inside the outer surface of the body. <1> from <18> An inductor component listed in any one of the following. <20> Furthermore, the first main surface is provided with an organic insulator, The aforementioned element is an inorganic insulator, and the organic insulator is located inside the outer surface of the inorganic insulator when viewed from a direction perpendicular to the first main surface. <1> from <19> An inductor component listed in any one of the following. [Explanation of symbols]

[0184] 1.1A-1J Inductor Component 10 Base Body 11b Bottom wiring (first coil wiring) 11b1 First end 11b2 Second end 11b3 Top surface 11t Top-mounted wiring (second coil wiring) 11t3 top surface 13, 13A, 13I, 13J First through-wiring 131 Inner periphery 132 Outer edge 13a First end 13e end 13m central part 13s conductive layer 13u non-conductive layer 14,14A Second through-wiring 141 Inner periphery 142 Outer edge 14a First end 22 Insulator 100b Base (First main surface) 100t Top surface (second main surface) 110, 110A, 110B coils 121 1st external electrode 121b Bottom part 121V via section 121e1 Base layer 121e2 Plating layer 122 2nd external electrode 122b Bottom part 122V via section AX axis BX virtual line L1,L2 bisector Lr perpendicular line Lv virtual line V through hole θ, θ1, θ2: Angle between the bottom wiring and the top wiring.

Claims

1. A glass-containing body including a first principal surface and a second principal surface facing each other, A coil provided on the aforementioned body and wound spirally along the axis, A first external electrode and a second external electrode are provided on the aforementioned body and electrically connected to the coil. Equipped with, The shaft of the coil is arranged parallel to the first main surface. The aforementioned coil is A plurality of first coil wirings are provided on the first main surface side with respect to the shaft and are arranged along the shaft on a plane parallel to the first main surface, A plurality of second coil wirings are provided on the second main surface side with respect to the shaft and are arranged along the shaft on a plane parallel to the second main surface, A plurality of first through-wirings extending from the first coil wiring toward the second coil wiring and arranged along the axis, A plurality of second through-wirings extend from the first coil wiring toward the second coil wiring, are provided on the opposite side of the axis from the first through-wiring, and are arranged along the axis. Includes, The first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a portion of the helical shape. In a cross-section parallel to the first main surface and including the axis, the first through-wiring includes an inner periphery facing the axis and an outer periphery facing the opposite side of the axis, the inner periphery and the outer periphery are located inside the body, the inner periphery has a curved portion of a convex curve, and the length of the inner periphery is longer than the length of the outer periphery. The body has a first side surface and a second side surface that face each other with respect to the shaft between the first main surface and the second main surface, the first through-wiring is arranged on the first side surface side with respect to the shaft, and the second through-wiring is arranged on the second side surface side with respect to the shaft. In a cross-section perpendicular to the axis, the second end of the first through-wiring is connected to the second main surface side of the first end of the first coil wiring, and a portion of the first end of the first coil wiring protrudes toward the first side surface of the body more than the second end of the first through-wiring. The plurality of first through-wirings include two of the first through-wirings whose orientations of the curved portions of their inner periphery are different from each other, making them an inductor component.

2. A glass-containing body including a first principal surface and a second principal surface facing each other, A coil provided on the aforementioned body and wound spirally along the axis, A first external electrode and a second external electrode are provided on the aforementioned body and electrically connected to the coil. Equipped with, The shaft of the coil is arranged parallel to the first main surface. The aforementioned coil is A plurality of first coil wirings are provided on the first main surface side with respect to the shaft and are arranged along the shaft on a plane parallel to the first main surface, A plurality of second coil wirings are provided on the second main surface side with respect to the shaft and are arranged along the shaft on a plane parallel to the second main surface, A plurality of first through-wirings extending from the first coil wiring toward the second coil wiring and arranged along the axis, A plurality of second through-wirings extend from the first coil wiring toward the second coil wiring, are provided on the opposite side of the axis from the first through-wiring, and are arranged along the axis. Includes, The first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a portion of the helical shape. When viewed from a direction perpendicular to the first main surface, and a bisector of the angle between the first coil wiring connected to a reference first through-wiring, which is one of the first through-wirings, and the second coil wiring is defined, in a cross section parallel to the first main surface and including the axis, the reference first through-wiring includes an inner periphery facing the bisector and an outer periphery facing the opposite side of the bisector, the inner periphery and the outer periphery are located inside the main body, the inner periphery has a curved portion of a convex curve, and the length of the inner periphery is longer than the length of the outer periphery, The body has a first side surface and a second side surface that face each other with respect to the shaft between the first main surface and the second main surface, the first through-wiring is arranged on the first side surface side with respect to the shaft, and the second through-wiring is arranged on the second side surface side with respect to the shaft. In a cross-section perpendicular to the axis, the second end of the first through-wiring is connected to the second main surface side of the first end of the first coil wiring, and a portion of the first end of the first coil wiring protrudes toward the first side surface of the body more than the second end of the first through-wiring. The plurality of first through-wirings include two of the first through-wirings whose orientations of the curved portions of their inner periphery are different from each other, making them an inductor component.

3. A base body including a first principal surface and a second principal surface that are opposite to each other, A coil provided on the aforementioned body and wound spirally along the axis, A first external electrode and a second external electrode are provided on the aforementioned body and electrically connected to the coil. Equipped with, The shaft of the coil is arranged parallel to the first main surface. The aforementioned coil is A plurality of first coil wirings are provided on the first main surface side with respect to the shaft and are arranged along the shaft on a plane parallel to the first main surface, A plurality of second coil wirings are provided on the second main surface side with respect to the shaft and are arranged along the shaft on a plane parallel to the second main surface, A plurality of first through-wirings extending from the first coil wiring toward the second coil wiring and arranged along the axis, A plurality of second through-wirings extend from the first coil wiring toward the second coil wiring, are provided on the opposite side of the axis from the first through-wiring, and are arranged along the axis. Includes, The first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a portion of the helical shape. An inductor component wherein, in a cross-section parallel to the first main surface and including the axis, the first through-wiring includes an inner peripheral edge parallel to the axis and facing toward the axis, and an outer peripheral edge parallel to the axis and facing away from the axis, the length of the inner peripheral edge being longer than the length of the outer peripheral edge.

4. A base body including a first principal surface and a second principal surface that are opposite to each other, A coil provided on the aforementioned body and wound spirally along the axis, A first external electrode and a second external electrode are provided on the aforementioned body and electrically connected to the coil. Equipped with, The shaft of the coil is arranged parallel to the first main surface. The aforementioned coil is A plurality of first coil wirings are provided on the first main surface side with respect to the shaft and are arranged along the shaft on a plane parallel to the first main surface, A plurality of second coil wirings are provided on the second main surface side with respect to the shaft and are arranged along the shaft on a plane parallel to the second main surface, A plurality of first through-wirings extending from the first coil wiring toward the second coil wiring and arranged along the axis, A plurality of second through-wirings extend from the first coil wiring toward the second coil wiring, are provided on the opposite side of the axis from the first through-wiring, and are arranged along the axis. Includes, The first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a portion of the helical shape. When viewed from a direction perpendicular to the first main surface, and a bisector of the angle between the first coil wiring connected to a reference first through-wiring, which is one of the first through-wirings, and the second coil wiring is defined, in a cross section parallel to the first main surface and including the axis, the reference first through-wiring includes an inner peripheral edge parallel to the direction perpendicular to the bisector and facing toward the bisector, and an outer peripheral edge parallel to the direction perpendicular to the bisector and facing away from the bisector, wherein the length of the inner peripheral edge is longer than the length of the outer peripheral edge.

5. The aforementioned element is SiO ２ An inductor component according to any one of claims 1 to 4, including the above.

6. The inductor component according to any one of claims 1 to 4, wherein the length of the inner peripheral edge of the first through-wiring is 1.5 times or more the length of the outer peripheral edge of the first through-wiring.

7. An inductor component according to any one of claims 1 to 4, wherein, when viewed from a direction perpendicular to the first main surface, the first end of the first coil wiring and the second end of the first through wiring are connected, and the outer shape of the coil at the first end of the first coil wiring conforms to the outer shape of the coil at the second end of the first through wiring.

8. An inductor component according to any one of claims 1 to 4, wherein, when viewed from a direction perpendicular to the first main surface, the angle between the first coil wiring and the second coil wiring connected to the same first through-wiring is 5° or more and 45° or less.

9. The inductor component according to any one of claims 1 to 4, wherein, in a cross-section perpendicular to the direction in which the first coil wiring extends, the upper surface of the first coil wiring located on the side opposite to the axis has a convex shape that protrudes upward on the side opposite to the axis.

10. The first external electrode is arranged on the first coil wiring, The inductor component according to claim 9, wherein the upper surface of the first coil wiring faces the first external electrode.

11. The inductor component according to any one of claims 1 to 4, wherein, when viewed from a direction parallel to the shaft, the first through-wiring and the second through-wiring are not parallel.

12. The aforementioned element is SiO ２ Includes, The first through-wiring is SiO ２ An inductor component according to any one of claims 1 to 4, including the above.

13. The inductor component according to any one of claims 1 to 4, wherein the first through-wiring includes a gap or a resin portion.

14. The inductor component according to any one of claims 1 to 4, wherein the first through-wiring comprises a conductive layer located on the outer periphery when viewed from the direction in which the first through-wiring extends, and a non-conductive layer located inside the conductive layer.

15. The inductor component according to any one of claims 1 to 4, wherein the axial length of the coil is shorter than the inner diameter of the coil.

16. The first through-wiring extends in a direction perpendicular to the first main surface, The inductor component according to any one of claims 1 to 4, wherein the cross-sectional area of ​​at least one of the ends of the first through-wiring in the extending direction is greater than the cross-sectional area of ​​the central part of the first through-wiring in the extending direction.

17. The inductor component according to any one of claims 1 to 4, wherein, when viewed from a direction perpendicular to the first main surface, the first external electrode and the second external electrode are located inside the outer surface of the main body.

18. Furthermore, the first main surface is provided with an organic insulator, The inductor component according to any one of claims 1 to 4, wherein the base material is an inorganic insulator, and the organic insulator is located inside the outer surface of the inorganic insulator when viewed from a direction perpendicular to the first main surface.

19. The inductor component according to any one of claims 1 to 4, wherein the base body is a single-layer glass substrate.

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