Brazing material, joint, ceramic circuit board, and method for manufacturing the joint

The brazing material with Ag, Cu, and Ti addresses thermal stress and cost issues by bonding ceramic substrates and copper plates at lower temperatures, ensuring stable and cost-effective joints for large substrates.

JP7872727B2Inactive Publication Date: 2026-06-10NITERRA MATERIALS CO LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
NITERRA MATERIALS CO LTD
Filing Date
2021-02-10
Publication Date
2026-06-10
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

⚠Technical Problem

Existing methods for bonding ceramic substrates and copper plates at lower temperatures face challenges such as high thermal stress, equipment load, and high costs due to the use of Ag in brazing materials, while sputtering methods are not suitable for large substrates.

⚗Method used

A brazing material composed of Ag, Cu, and Ti, characterized by an endothermic peak between 550°C to 700°C during the heating process, which allows for bonding at reduced temperatures and includes activated metals like Ti to form a reaction layer, reducing thermal stress and cost.

🎯Benefits of technology

Enables bonding at 800°C or lower with reduced thermal stress and warping, suitable for large substrates, and provides a stable joint with enhanced reliability and cost-effectiveness.

✦ Generated by Eureka AI based on patent content.

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Abstract

According to one embodiment of the present invention, a brazing filler material for bonding a ceramic substrate and a metal plate to each other is characterized by having an endothermic peak within the range of from 550°C to 700°C in the temperature raising step in the DSC curve as determined by a differential scanning calorimeter (DSC). It is preferable that the brazing filler material contains Ag, Cu and Ti. In addition, it is preferable that the brazing filler material has two or more endothermic peaks within the range of from 550°C to 650°C in the temperature raising step.
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