Adhesive resin composition

JP7872939B2Active Publication Date: 2026-06-11TOYOBO MC CORP

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
TOYOBO MC CORP
Filing Date
2022-09-08
Publication Date
2026-06-11

AI Technical Summary

🎯Benefits of technology

【0009】 本発明によれば、硬化剤を実質的に含有しないため、優れたポットライフ性を有し、かつ高いハンダ耐熱性、各種基材への接着性の特性にも優れた接着剤樹脂組成物を提供することができる。

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Abstract

This adhesive resin composition is characterized by containing a polyester resin (A) and satisfying the requirements: (i) the adhesive resin composition contains substantially no hardener and (ii) the adhesive resin composition, after having been heated at 200°C for 1 hour, has a tetrahydrofuran-insoluble content of 10 mass% or higher. This adhesive resin composition has satisfactory pot life properties and is excellent in terms of soldering heat resistance, adhesiveness to various substates, and other properties, although containing substantially no hardener. Also provided are: a laminate or adhesive sheet which includes an adhesive layer obtained from this adhesive resin composition; a printed wiring board or packaging material which includes the laminate as a constituent element; and a layered film for decorating three-dimensional molded articles or a film for metal-can laminating which includes the adhesive sheet as a constituent element.
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Claims

[Claim 1] An adhesive resin composition comprising a polyester resin (A) and characterized by satisfying the following requirements (i) to (vi). (i) The adhesive resin composition is substantially free of curing agents. (ii) The tetrahydrofuran-insoluble content of the adhesive resin composition after heat treatment at 200°C for 1 hour is 10% by mass or more. (iii) The polyester resin (A) comprises a polyol component including a diol (a) having two primary hydroxyl groups and no alicyclic structure, and further includes either or both of a diol (b) having an alicyclic structure and a diol (c) having one primary hydroxyl group and one secondary hydroxyl group and no alicyclic structure. (iv) Of the total polyol components constituting the polyester resin (A), the copolymerization ratio of diol (a) having two primary hydroxyl groups and no alicyclic structure is 20 to 80 mol%, and when diol (b) having an alicyclic structure is included, the copolymerization ratio is 5 to 50 mol%, and when diol (c) having one primary hydroxyl group and one secondary hydroxyl group and no alicyclic structure is included, the copolymerization ratio is 5 to 75 mol%. (v) The polyester resin (A) comprises a polycarboxylic acid component having a benzene skeleton and an unsaturated dicarboxylic acid (d), and further includes at least one selected from the group consisting of aliphatic dicarboxylic acids, alicyclic dicarboxylic acids, and polycarboxylic acids having a naphthalene skeleton. (vi) In the polycarboxylic acid components constituting the polyester resin (A), the copolymerization ratio of unsaturated dicarboxylic acid (d) is 5 to 20 mol%, and when a polycarboxylic acid having a naphthalene skeleton is included, the usage ratio (molar ratio) of polycarboxylic acid having a benzene skeleton / polycarboxylic acid having a naphthalene skeleton is 95 / 5 to 70 / 30, and when aliphatic dicarboxylic acid components and / or alicyclic dicarboxylic acid components are included, their copolymerization ratio is 5 to 40 mol% of the total polycarboxylic acid components. [Claim 2] The adhesive resin composition according to claim 1, wherein the acid value of the polyester resin (A) is 100 eq / ton or more. [Claim 3] The adhesive resin composition according to claim 1 or 2, wherein the polyester resin (A) has a branched structure. [Claim 4] The adhesive resin composition according to claim 1 or 2, wherein the adhesive resin composition further comprises one or more catalysts (B). [Claim 5] The adhesive resin composition according to claim 1 or 2, wherein the tetrahydrofuran insoluble content of the polyester resin (A) after heat treatment at 120°C for 15 minutes is less than 10% by mass. [Claim 6] A laminate having an adhesive layer made of the adhesive resin composition according to claim 1 or 2. [Claim 7] An adhesive sheet having an adhesive layer made of the adhesive resin composition according to claim 1 or 2. [Claim 8] A printed circuit board comprising the laminate described in claim 6 as a component. [Claim 9] A packaging material comprising the laminate described in claim 6 as a component. [Claim 10] A laminated film for decorating a three-dimensional molded product, comprising the adhesive sheet described in claim 7 as a component. [Claim 11] A film for laminating metal cans, comprising the adhesive sheet described in claim 7 as a component.