Coil components, circuit boards, electronic devices, and methods for manufacturing coil components
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- TAIYO YUDEN KK
- Filing Date
- 2022-03-17
- Publication Date
- 2026-06-11
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Abstract
Claims
1. A circular section consisting of a conductor, A magnetic substrate comprising a first magnetic portion formed by bonding first metal particles having a particle size distribution in which D90, representing the particle size of 90% of the cumulative volume, is the first particle size, and a second magnetic portion formed by bonding second metal particles having a particle size distribution in which D90 is the second particle size, being larger than the first particle size, encompassing the circumferential portion, and including at least a part of the first magnetic portion on the outer circumference side of the circumferential portion, Equipped with, The coil component is characterized in that the first magnetic portion is provided on a part of the periphery of the circumferential portion including the entire outer circumference of the circumferential portion, or on a part of the periphery of the circumferential portion including both the entire outer circumference and the entire inner circumference of the circumferential portion, and the second magnetic portion is provided at a location other than the first magnetic portion.
2. The coil component according to claim 1, characterized in that, on the outer circumference side of the magnetic substrate, at the point where the thickness is thinnest in the direction of approaching and moving away from the circumferential portion, the first magnetic portion is included within half of the portion closest to the circumferential portion.
3. The coil component according to claim 1 or 2, characterized in that, on the outer circumference side of the magnetic substrate, at the point where the thickness is thinnest in the direction of approaching and receding from the circumferential portion, the first magnetic portion occupies more than half of that thickness.
4. The coil component according to any one of claims 1 to 3, characterized in that at least a portion of the second magnetic portion is located further outward from the first magnetic portion which is included on the outer periphery side of the circumferential portion.
5. A coil component according to any one of claims 1 to 4, characterized in that the short side of the external shape is 1.0 mm or less.
6. A coil component according to any one of claims 1 to 5, A circuit board characterized by comprising a substrate on which the coil component is mounted.
7. An electronic device characterized by comprising the circuit board described in claim 6.
8. A manufacturing method for producing a coil component according to any one of claims 1 to 5, A process of arranging a circular section consisting of a circular conductor, The process involves forming the second magnetic portion with a thickness of three times or more the second particle size, A step of forming the first magnetic portion with a thickness of less than three times the second particle size at a location on the outer periphery of the location where the circumferential portion is arranged, It has in any order, A method for manufacturing a coil component, characterized in that at least one of the steps of forming the first magnetic portion and forming the second magnetic portion is a step of forming the magnetic substrate integrally with the circumferential portion.
9. The method for manufacturing a coil component according to claim 8, characterized in that at least one of the steps of forming the first magnetic part and forming the second magnetic part includes a step of bonding metal particles by heat treatment.
10. The method for manufacturing a coil component according to claim 8 or 9, characterized in that the step of forming the magnetic substrate includes a step of bonding the first magnetic part and the second magnetic part by heat treatment.