Vapor deposition apparatus and method for forming thin films using the same

Abstract

To provide a deposition apparatus capable of improving the productivity of film-deposited products in which gradient thin films are formed, and a thin film formation method using the same. [Solution] The vapor deposition apparatus 1 according to the present invention is a vapor deposition apparatus for forming a thin film having a film thickness gradient on a substrate W, and comprises a vapor deposition source 10 for evaporating a vapor deposition material D, a substrate holding device 20 arranged opposite to the vapor deposition source 10 and holding a plurality of substrates W, a plurality of mask plates 30 having slits 31 through which the evaporated vapor deposition material D can pass, and arranged between the vapor deposition source 10 and the substrate holding device 20, opposite each of the plurality of substrates W held by the substrate holding device, and a vacuum vessel 70 housing the vapor deposition source 10, the substrate holding device 20 and the mask plates 30. The mask plates 30 are configured to reciprocate along the surfaces of the substrates W arranged opposite each other.

Claims

1. A vapor deposition apparatus for forming a thin film having a film thickness gradient on a substrate, A vapor deposition source for evaporating the vapor deposition material, A substrate holding means is arranged opposite the deposition source and holds a plurality of the substrates, It has a slit through which the evaporated deposition material can pass, and the deposition source and the substrate holding means A plurality of substrates held by the substrate holding means are arranged opposite to each of them between them. A mask plate with a number of characters, A vacuum vessel housing the deposition source, the substrate holding means, and the mask plate, Equipped with, The mask plate is configured to be able to reciprocate along the surface of the substrates that are arranged opposite each other. The drive means is capable of rotating the substrate holding means around the rotation axis, A guide means for guiding the mask plate so that it can move back and forth along the surface of the substrate, The rotational force of the substrate holding means is transmitted to the guide means to cause the mask plate to reciprocate. A means for transmitting rolling force, A vapor deposition apparatus further equipped with the following features.

2. The substrate holding means has a plurality of substrate holding parts that individually hold a plurality of substrates, The vapor deposition apparatus according to claim 1, wherein the guiding means and the rotational force transmission means are provided for each of the plurality of substrate holding parts.

3. The system comprises a main body portion for holding the mask plate, a guide means mounting portion provided on the main body portion and attached to the guide means, and further comprises a plurality of mask plate holding means provided for each of the plurality of substrate holding portions, The guide means is formed in a ring-like shape, has a rail portion to which the guide means mounting portion can be attached, and is configured to rotate when the rotational force is transmitted. The deposition apparatus according to claim 2, wherein the main body is configured to reciprocate along the surface of the substrate as the guide mounting portion attached to the rail portion moves along the rail portion due to the rotation of the guide means.

4. The deposition apparatus according to claim 2, wherein the substrate holding portion has a substrate holding angle changing portion that can change the surface angle of the substrate with respect to the deposition direction of the thin film.

5. A vapor deposition apparatus for forming a thin film having a film thickness gradient on a substrate, A vapor deposition source for evaporating the vapor deposition material, A substrate holding means is arranged opposite the deposition source and holds a plurality of the substrates, A plurality of mask plates having slits through which the evaporated deposition material can pass, and positioned between the deposition source and the substrate holding means, facing each of the plurality of substrates held by the substrate holding means, A vacuum vessel housing the deposition source, the substrate holding means, and the mask plate, Equipped with, The mask plate is configured to be able to move back and forth along the surface of the substrates that are arranged opposite each other. A drive means capable of rotating the substrate holding means around a rotation axis, A rotational force transmission means that transmits the rotational force of the substrate holding means to a plurality of mask plates, causing the plurality of mask plates to revolve around the axis of the rotation shaft, A guide and support means for guiding and supporting a plurality of the mask plates so that they can revolve around the axis of the rotation shaft and reciprocate along the surfaces of the opposing substrates, A vapor deposition apparatus further equipped with the following features.

6. The aforementioned guide and support means is formed in a ring-like shape and has rail sections that movably guide and support a plurality of the mask plates. The deposition apparatus according to claim 5, wherein the plurality of mask plates are configured to move along the rail portion when the rotational force is transmitted, revolve around the axis of the rotation shaft, and reciprocate along the surfaces of the opposing substrates.

7. The vapor deposition apparatus according to claim 5, wherein the rotational force transmission means is a connecting member that connects the substrate holding means and a plurality of mask plates.

8. The deposition apparatus according to claim 1 or claim 5, wherein a plurality of slits are formed in the mask plate.

9. The deposition apparatus according to claim 3 or 6, wherein the rail portion is formed in a wave-like shape in which convex and concave portions alternately continue in the outer peripheral direction.

10. The deposition source is configured such that its central position in a plan view coincides with the central position of the substrate holding means. A vapor deposition apparatus according to any one of claims 1 to 7, which is arranged in [location].

11. A thin film having a film thickness gradient is deposited on the substrate using the deposition apparatus according to any one of claims 1 to 7. A method for forming a thin film.

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