PCB processing machine and PCB processing method

Abstract

To shorten a waiting time during operation while substrate work using two robots is performed.SOLUTION: A substrate work machine 11 includes: a first robot 41A and a second robot 41B working on a substrate 1. A movable range MV1 of the first robot 41A overlaps at least a part of a moving range MV2 of the second robot 41B. The first robot 41A can perform specific work at least at two or more specific work positions, a first specific work position TW1 and a second specific work position TW2 different from the first specific work position TW1. In the case where the first robot 41A performs specific work, when the second robot 41B performs prescribed work, the first robot 41A is configured to select one of two or more specific work positions TW1, TW2 in accordance with a prescribed work position SW1 where the second robot 41B performs prescribed work.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The technology disclosed in this specification relates to a substrate working machine including a first robot and a second robot that perform operations on a substrate, and a substrate working method executed using the same.

Background Art

[0002] Conventionally, as a type of substrate working machine that performs operations on a substrate, a component mounting machine that mounts components on a substrate using two robots is known. As this type of component mounting machine, for example, there is the prior art disclosed in Patent Document 1.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, in the substrate working machine of the above prior art, since two robots perform operations on a single common substrate, the movable range of one robot is set to overlap with a part of the movable range of the other robot. For this reason, when trying to drive the two robots simultaneously and make them operate respectively, the movable ranges are restricted because the two robots interfere with each other, and one robot may interfere with the operation of the other robot. Therefore, there is a problem that waiting time may occur during the operation of the other robot when the operation of one robot is prioritized.

[0005] Therefore, this specification provides a technology for reducing the waiting time during operation when performing substrate work using two robots.

Means for Solving the Problems

[0006] This specification discloses a substrate work machine comprising a first robot for working on a substrate and a second robot for working on a substrate. The range of motion of the first robot overlaps with at least a portion of the range of motion of the second robot. The first robot is capable of performing specific tasks at at least two specific work positions, including a first specific work position and a second specific work position different from the first specific work position. When the first robot is performing a specific task and the second robot is performing a predetermined task, the first robot is configured to select one of the two or more specific work positions according to the predetermined work position where the second robot is performing the predetermined task. According to the above configuration, the waiting time during operation when working on a substrate using two robots can be reduced.

[0007] The substrate processing method disclosed herein also exhibits similar effects. [Brief explanation of the drawing]

[0008] [Figure 1] This is a schematic plan view showing the component mounting machine of the embodiment. [Figure 2] This is a schematic side view showing the component mounting machine of the embodiment. [Figure 3] This is a schematic diagram illustrating the operation of the component mounting machine in the embodiment. [Figure 4] This is a schematic diagram illustrating the operation of the component mounting machine in the embodiment. [Figure 5] This is a schematic diagram illustrating the operation of the component mounting machine in the embodiment. [Figure 6] This is a schematic diagram illustrating the operation of the component mounting machine in the embodiment. [Modes for carrying out the invention]

[0009] Hereinafter, a component mounting machine 11 (an example of a circuit board work machine) according to an embodiment of the present invention and a circuit board work method performed using it will be described with reference to the drawings.

[0010] As shown in Figures 1 and 2, the component mounting machine 11 comprises a substrate transport device 21, a first component supply device 31A, a second component supply device 31B, a first robot 41A, a second robot 41B, a first component camera 61A, a second component camera 61B, a first waste box 71A, a second waste box 71B, and a control device 81. In the following description, the horizontal width direction of the component mounting machine 11 (left-right direction in Figure 1) is defined as the X-axis direction, the horizontal depth direction of the component mounting machine 11 (up-down direction in Figure 1) is defined as the Y-axis direction, and the vertical direction perpendicular to the X and Y axes (plane direction in Figure 1) is defined as the Z-axis direction.

[0011] The substrate transport device 21 consists of a belt conveyor 22 and the like, and sequentially transports the substrate 1, on which the wiring circuit is formed, in the transport direction (in this embodiment, the X-axis direction). The substrate transport device 21 positions the substrate 1 at a predetermined position inside the component mounting machine 11. Then, after the component mounting operation on the substrate 1 is performed by the component mounting machine 11, the substrate transport device 21 transports the substrate 1 out of the component mounting machine 11.

[0012] The first component supply device 31A is located in front of the component mounting machine 11 (lower side in Figure 1, left side in Figure 2). The first component supply device 31A supplies multiple types of components 2 to the substrate 1 at multiple supply locations. The first component supply device 31A is equipped with multiple parts feeders 32. Each parts feeder 32 is configured to supply components 2 by feeding out a tape in which component storage sections are formed at predetermined intervals.

[0013] The second component supply device 31B is located opposite the first component supply device 31B on the opposite side of the substrate 1 (the rear side of the component mounting machine 11, the upper side in Figure 1, and the right side in Figure 2). The second component supply device 31B also supplies multiple types of components 2 at multiple supply locations. Similar to the first component supply device 31A, the second component supply device 31B is equipped with multiple parts feeders 32 for supplying components 2.

[0014] The first robot 41A and the second robot 41B are both XY robots that perform the task of mounting components 2 onto the substrate 1 (i.e., an example of a "predetermined task"), and are configured to be movable in the X-axis and Y-axis directions. In addition, the first robot 41A and the second robot 41B each also perform the task of discarding components 2 that are determined to be unmountable on the substrate 1 into the first waste box 71A or the second waste box 71B (i.e., an example of a "specific task"). The first robot 41A is positioned above the area extending from the center to the front of the component mounting machine 11. The second robot 41B is positioned above the area extending from the center to the rear of the component mounting machine 11.

[0015] The first robot 41A includes an X-axis slider 42A and a Y-axis slider 43A. The Y-axis slider 43A is stretched across a pair of left and right Y-axis guide rails 44 provided on the upper part of the main frame 12 along the front-rear direction (Y-axis direction), and moves along the Y-axis guide rails 44 by the drive of a Y-axis motor (not shown). The X-axis slider 42A is attached to an X-axis guide rail (not shown) provided on the lower surface of the Y-axis slider 43A along the left-right direction (X-axis direction), and moves along the X-axis guide rail by the drive of an X-axis motor (not shown). The first robot 41A is configured to move the mounting head 51A to any position on the XY plane by the cooperation of the X-axis slider 42A and the Y-axis slider 43A. In other words, the first robot 41A is equipped with an XY movement mechanism that moves the mounting head 51A in the X-axis direction and the Y-axis direction relative to the substrate 1.

[0016] The mounting head 51A is mounted on the X-axis slider 42A. The mounting head 51A comprises a head body 52, a suction nozzle 53, and a mark camera 54. The head body 52 has a plurality of nozzle holders (not shown) arranged at predetermined angular intervals. The suction nozzle 53 is capable of adsorbing a component 2 to its tip and is interchangeably mounted on each nozzle holder. The mark camera 54 is positioned near the head body 52 and captures reference marks and the like on the substrate 1 from above. As the mark camera 54, for example, a digital imaging device having an image sensor such as a CCD (Charge Coupled Device) or CMOS (Complementary Metal Oxide Semiconductor) is used. The mounting head 51A also comprises an R-axis motor for rotating the head body 52 around its axis, a Q-axis motor for rotating the nozzle holder around its axis (both not shown), and a lifting device 55 on which the nozzle holder is mounted so as to be able to move up and down. The R-axis motor rotates the head body 52, causing multiple nozzle holders to rotate (revolve) around the R-axis parallel to the Z-axis (i.e., around the axis of the head body 52). The Q-axis motor rotates (rotates) multiple nozzle holders around the Q-axis parallel to the Z-axis (i.e., around the axis of the nozzle holder). The mounting head 51A is also equipped with a negative pressure supply device that supplies negative pressure to the suction nozzle 53 and a positive pressure supply device that supplies positive pressure to the nozzle holder. As the nozzle holder revolves around the R-axis, the suction nozzle 53 attached to the nozzle holder can move to at least two or more lifting positions: a first lifting position SK1 and a second lifting position SK2 that is different from the first lifting position SK1. The suction nozzle 53 is movable up and down relative to the mounting head 51A at the first and second lifting positions SK1 and SK2. In this embodiment, there are two lifting positions, a first lifting position SK1 and a second lifting position SK2, which are positioned at a rotational angle interval of 180° from each other.

[0017] The second robot 41B includes an X-axis slider 42B and a Y-axis slider 43B. The Y-axis slider 43B is spanned across the above-described Y-axis guide rail 44 and moves along the Y-axis guide rail 44 by the drive of a Y-axis motor (not shown). The X-axis slider 42B is attached to an X-axis guide rail provided on the Y-axis slider 43B in the same manner as described above and moves along the X-axis guide rail by the drive of an X-axis motor (not shown). The second robot 41B is configured such that the mounting head 51B can be moved to an arbitrary position on the XY plane by the cooperation of the X-axis slider 42B and the Y-axis slider 43B. That is, the second robot 41B includes an XY moving mechanism that moves the mounting head 51B in the X-axis direction and the Y-axis direction with respect to the substrate 1.

[0018] The mounting head 51B is attached to the X-axis slider 42B. The mounting head 51B includes a head body 52, a suction nozzle 53, and a mark camera 54, similar to the above-described mounting head 51A. Further, the mounting head 51B includes an R-axis motor, a Q-axis motor, a lifting device 55, a negative pressure supply device, and a positive pressure supply device, similar to the above-described mounting head 51A.

[0019] As shown in FIG. 1, the mounting head 51A of the first robot 41A is configured to be movable inside the movable range MV1. Also, the mounting head 51B of the second robot 41B is configured to be movable inside the movable range MV2. The movable range MV1 of the mounting head 51A overlaps at least a part of the movable range MV2 of the mounting head 51B. The region where interference may occur between the mounting heads 51A and 51B due to the overlap of the movable range MV1 of the mounting head 51A and the movable range MV2 of the mounting head 51B is referred to as an interference region.

[0020] The first component camera 61A is provided between the first component supply device 31A and the substrate transfer device 21, at a position below the movement path of the mounting head 51A. The first component camera 61A is a parts camera that images the component 2 adsorbed by the mounting head 51A from below. The second component camera 61B is provided between the second component supply device 31B and the substrate transfer device 21, at a position below the movement path of the mounting head 51B. The second component camera 61B is a parts camera that images the component 2 adsorbed by the mounting head 51B from below. As the first component camera 61A and the second component camera 61B, for example, a digital imaging device having an imaging element such as a CCD or a CMOS is used.

[0021] The first waste box 71A is a container for discarding the component 2 determined to be non-mountable on the substrate 1, and has a rectangular opening on the upper surface side. The first waste box 71A is provided between the first component supply device 31A and the substrate transfer device 21, at a position near the first component camera 61A. In the first waste box 71A, the component 2 adsorbed by the mounting head 51A and determined to be non-mountable on the substrate 1 is discarded. The second waste box 71B also has the same configuration as the first waste box 71A, and is provided between the second component supply device 31B and the substrate transfer device 21, at a position near the second component camera 61B. In the second waste box 71B, the component 2 adsorbed by the mounting head 51B and determined to be non-mountable on the substrate 1 is discarded.

[0022] The control unit 81 is configured as a microprocessor centered around a CPU. In addition to the CPU, the control unit 81 includes ROM, HDD, RAM, and input / output interfaces. These are interconnected via a bus so that they can communicate with each other. Image signals from the first component camera 61A, the second component camera 61B, and the mark camera 54, as well as position detection signals from the X-axis sliders 43A and 43B, and position detection signals from the Y-axis sliders 42A and 42B are input to the control unit 81 via the input / output interfaces. On the other hand, control signals to the board transport device 21, control signals to the component supply devices 31A and 31B, drive signals to the first robot 41A and the second robot 41B, and drive signals to the mounting heads 51A and 51B are output from the control unit 81 via the input / output interfaces.

[0023] Next, we will explain how to produce the circuit board 1 using the component mounting machine 11.

[0024] The first robot 41A normally picks up components 2 supplied from the front component supply device 31A with the suction nozzle 53 of the mounting head 51A and mounts them onto the substrate 1 transported by the substrate transport device 21 (an example of a predetermined operation). If the first robot 41A determines that the component 2 picked up by the suction nozzle 53 of the mounting head 51A cannot be mounted onto the substrate 1, it performs the operation of discarding the component 2 into the first waste box 71A (an example of a specific operation). Similarly, the second robot 41B normally picks up components 2 supplied from the rear component supply device 31B with the suction nozzle 53 of the mounting head 51B and mounts them onto the same substrate 1 (an example of a predetermined operation). Furthermore, if the second robot 41B determines that the component 2 picked up by the suction nozzle 53 of the mounting head 51B cannot be mounted onto the substrate 1, it performs the operation of discarding the component 2 into the second waste box 71B (an example of a specific operation). The following describes a case where two robots 41A and 41B are driven simultaneously, with the first robot 41A performing component disposal work and the second robot 41B performing circuit board mounting work. For convenience of explanation, the first robot 41A may be referred to as "the robot itself," and the second robot 41B as "the other robot."

[0025] Here, the movable ranges MV1 and MV2 of the two robots 41A and 41B partially overlap. Therefore, if the first robot 41A is performing a parts disposal task while the second robot 41B is performing a parts mounting task, mutual interference may occur between the two robots 41A and 41B. In other words, one robot may interfere with the other robot's movement, limiting the other robot's range of motion. Therefore, to avoid such mutual interference, the second robot 41B needs to be temporarily put on standby, which may result in a waiting time for the second robot 41B performing the parts mounting task. For example, since parts mounting work is executed according to a program, even if two robots 41A and 41B perform parts mounting work, their respective movements are predictable. Therefore, it is relatively easy to create an implementation program in advance to avoid mutual interference. In contrast, parts disposal work is not executed according to an implementation program, and the movements during the work are unpredictable. For this reason, if one of the two robots 41A and 41B performs parts mounting work and the other performs parts disposal work, it is not possible to program them in advance to avoid mutual interference.

[0026] Therefore, in this embodiment, the following method is used to determine the offset direction in the X-axis, the offset direction in the Y-axis, and the Z-axis to be used for disposal, thereby mitigating the problems caused by mutual interference. Specifically, the above determinations are made so that the robot's part disposal position is far from the opponent robot's predetermined work position (part mounting positions SW1, SW2). This increases the area in which the opponent robot can move within its own range of motion. This will be explained in detail using Figures 3 and 4.

[0027] Figures 3 and 4 show the state when the second robot 41B performs component mounting work in the interference region where the movable range MV1 of the mounting head 51A and the movable range MV2 of the mounting head 51B overlap. Specifically, the component mounting positions SW1 and SW2 of the second robot 41B are both set on the outer edge 1a of the substrate, which is close to the first robot 41A. Here, the reference line LC1 is defined as a straight line extending in the Y-axis direction through the center C1 of the first waste box 71A. In Figure 3, the component mounting position SW1 is set to the left of the reference line LC1, and in Figure 4, the component mounting position SW2 is set to the right of the reference line L1.

[0028] In this embodiment, the first robot 41A is capable of performing a specific task, which is a component disposal task, at at least two specific work positions TW1 and TW2, which are a first specific work position TW1 and a second specific work position TW2 that is different from the first specific work position TW1. The control device 81 causes the first robot 41A to perform a specific task, which is a circuit board disposal task, and the second robot 41B to perform a predetermined task, which is a component mounting task, simultaneously, according to a predetermined program for component mounting and component disposal. In this case, the control device 81 performs a selection step in which the first robot 41A selects one of the two specific work positions TW1 and TW2, depending on the component mounting positions SW1 and SW2, as determined by the second robot 41B.

[0029] As shown in Figure 3, when the second robot 41B performs component mounting at component mounting position SW1, the control device 81 selects a specific work position TW1. At this time, the first robot 41A performs component disposal by raising and lowering the suction nozzle 53 at the first lifting position SK1. That is, the first robot 41A selects one of two or more lifting positions SK1, SK2 based on the distance from the center of the mounting head 51A to the component mounting position SW1. Specifically, the first robot 41A determines the Z-axis to be used for disposal by selecting the first lifting position SK1 (the lifting position located on the left in Figure 3) so that the distance from the center of the mounting head 51A to the component mounting position SW1 is long.

[0030] Furthermore, the first robot 41A selects one of two or more specific work positions based on the distance in the X-axis direction from the center of the suction nozzle 53 to the component mounting position SW1, such that the distance is maximized. Specifically, the mounting head 51A of the first robot 41A is offset to the right in Figure 3 along the X-axis. The first robot 41A also selects one of two or more specific work positions based on the distance in the Y-axis direction from the center of the suction nozzle 53 to the component mounting position SW1, such that the distance is maximized. Specifically, the mounting head 51A of the first robot 41A is offset downward in Figure 3 along the Y-axis. In this case, the suction nozzle 53 that holds the component 2 may also be rotated so that the long side 2a of the component 2 is parallel to the X-axis direction (see the solid line in Figure 5). In this way, the amount of offset along the Y-axis can be increased compared to when the short side 2b of the component 2 is parallel to the X-axis direction (see the dashed line in Figure 5).

[0031] On the other hand, as shown in Figure 4, when the second robot 41B performs component mounting at component mounting position SW2, the control device 81 selects a specific work position TW2. At this time, the first robot 41A performs component disposal by raising and lowering the suction nozzle 53 at the first lifting position SK2. The first robot 41A selects one of two or more lifting positions based on the distance from the center of the mounting head 51A to the component mounting position SW2. Specifically, the first robot 41A selects the first lifting position SK2 (the lifting position located on the right in Figure 3) so that the distance from the center of the mounting head 51A to the component mounting position SW2 is long, and determines the Z-axis to be used for disposal.

[0032] Furthermore, the first robot 41A selects one of two or more specific work positions based on the distance in the X-axis direction from the center of the suction nozzle 53 to the component mounting position SW2, such that the distance is maximized. Specifically, the mounting head 51A of the first robot 41A is offset to the left in Figure 3 along the X-axis. Also, the first robot 41A selects one of two or more specific work positions based on the distance in the Y-axis direction from the center of the suction nozzle 53 to the component mounting position SW1, such that the distance is maximized. Specifically, the mounting head 51A of the first robot 41A is offset downward in Figure 3 along the Y-axis. In this case, as described above, the suction nozzle 53 may also be rotated so that the long side 2a of the component 2 is parallel to the X-axis direction.

[0033] In the example above, we described the case where the first robot 41A performs component disposal while the second robot 41B performs component mounting. However, the same configuration can be used in the reverse case, where the second robot 41B performs component disposal while the first robot 41A performs component mounting. That is, the second robot 41B selects a work position for component disposal according to the component mounting position where the first robot 41A performs component mounting. This prevents the component mounting work of the first robot 41A from being interfered with by the component disposal work of the second robot 41B.

[0034] Furthermore, if part 2 is brought too close to the side wall 72 of the waste box 71A when offsetting it, there is a risk that part 2, which was intended to be discarded, may fall outside the waste box 71A. To avoid such a situation, an appropriate distance (margin Mx, My) from the side wall 72 of the waste box 71A to part 2 when discarding part 2 may be set using the method shown below. As shown in Figure 6, for example, let L1 be the length of the long side 2a of part 2 and L1 be the length of the short side 2b. Also, let OFx be the offset amount along the X axis and OFy be the offset amount along the Y axis. The margin Mx in the X axis direction is set to the larger of "the sum of half the length of the long side 2a L1 and a predetermined X-axis offset amount OFx" and "the product of the length of the long side 2a L1 and a predetermined coefficient k". Furthermore, the Y-axis margin My is set to the larger of "the sum of half the length L2 of the short side 2b and a predetermined Y-axis offset amount OFy" and "the product of the length L2 of the short side 2b and a predetermined coefficient k". The X-axis offset amount OFx, the Y-axis offset amount OFy, and the coefficient k are all specified in the shape data of part 2. The coefficient k is specified based on the part size, for example, 0.25. With this setting method, appropriate margins Mx and My are set for the X and Y axes respectively, thus reducing the risk of part 2 falling outside the waste box 71A.

[0035] As described above, in the component mounting machine 11 of this embodiment, the first robot 41A is capable of performing a specific task, component disposal, at two specific work positions TW1 and TW2, namely the first specific work position TW1 and the second specific work position TW2. When the first robot 41A is performing component disposal, and the second robot 41B is performing a predetermined task, component mounting, the first robot 41A is configured to select one of the two specific work positions TW1 and TW2, depending on the mounting position SW1 where the second robot 41B will mount component 2. Therefore, according to this embodiment, the waiting time of the second robot 41B can be reduced by the first robot 41A selecting a specific work position so as not to interfere with the operation of the second robot 41B. Similarly, the waiting time of the first robot 41A can be reduced by the second robot 41B selecting a specific work position so as not to interfere with the operation of the first robot 41A. Therefore, the decrease in throughput of the component mounting machine 11 can be minimized, and circuit boards 1 with components 2 mounted can be produced efficiently.

[0036] Furthermore, in the component mounting machine 11 of this embodiment, by selecting positions SK1 and SK2 for raising and lowering the suction nozzle 53 when performing component disposal, it is possible to avoid interfering with the operation of the robot 41A or 41B that performs component mounting work. In other words, by selecting an appropriate Z-axis to be used for component disposal, the area in which the partner robot performing component mounting work can move increases, resulting in a reduction in waiting time. Similarly, by offsetting the component disposal position in the X-axis and Y-axis directions so that the positions of the suction nozzle 53 in the X-axis and Y-axis directions when performing component disposal are as far away as possible from the component mounting position of the robot 41A or 41B performing component mounting work, the area in which the partner robot 41A or 41B can move can be increased. This reduces the waiting time for the partner robot 41A or 41B performing component mounting work.

[0037] Although one embodiment of the technology disclosed herein has been described in detail above, the technology disclosed herein is not limited to the above embodiment. In the above embodiment, the first robot 41A and the second robot 41B were arranged facing each other, but the configuration is not limited to this. For example, in other embodiments, the first robot 41A and the second robot 41B may be arranged side by side without facing each other.

[0038] Furthermore, in the above embodiment, the suction nozzle 53 was able to move up and down relative to the mounting head 51A at two positions, a first lifting position SK1 and a second lifting position SK2, but the configuration is not limited to this. For example, in other embodiments, the suction nozzle may be able to move up and down relative to the mounting head 51A at three or more positions.

[0039] In the above embodiment, the component disposal operation was designated as a specific operation and the component mounting operation as a predetermined operation, but the configuration is not limited to this. For example, in other embodiments, the transfer of viscous fluid (e.g., flux) to a component by one robot or the cleaning and washing of the adsorption nozzle may be designated as a specific operation, and the component mounting operation by the other robot may be designated as a predetermined operation. Alternatively, the component disposal operation by one robot may be designated as a specific operation, and the application of viscous fluid to a component or the component inspection operation by the other robot may be designated as a predetermined operation.

[0040] In the above embodiment, the first waste box 71A is provided near the first component camera 61A, and the second waste box 71B is provided near the second component camera 61B, but the configuration is not limited to this. For example, in other embodiments, the first waste box 71A and the second waste box 71B may be provided at positions different from those shown in Figure 1. Also, the waste box 71A and the second waste box 71B may not be provided for the first robot 41A and the second robot 41B respectively, but may be shared. Furthermore, the shape of the openings of the waste box 71A and the second waste box 71B does not have to be rectangular, but may be other shapes.

[0041] Although specific examples of the present invention have been described in detail above, these are merely illustrative and do not limit the scope of the claims. The technologies described in the claims include various modifications and changes to the specific examples illustrated above. The technical elements described in this specification or drawings exhibit technical usefulness individually or in various combinations, and are not limited to the combinations described in the claims at the time of filing. Furthermore, the technologies illustrated in this specification or drawings can achieve multiple objectives simultaneously, and achieving even one of these objectives itself constitutes technical usefulness. [Explanation of Symbols]

[0042] 1: Circuit board 2: Parts 11: Component mounting machine as a circuit board work machine 41A: The first robot 41B: The second robot 42A, 42B: X-axis sliders that make up the XY movement mechanism 43A, 43B: Y-axis sliders that make up the XY movement mechanism 51A, 51B: Heads implemented as heads 53: Suction nozzle as a nozzle 71A, 71B: Disposal boxes MV1, MV2: Range of motion SW1, SW2: Component mounting positions as designated working positions TW1: First part disposal location as the first specific work location TW2: Second part disposal location as a second specific work location SK1: First lifting position SK2: Second lifting position

Claims

1. The first robot performs work on the circuit board, The system includes a second robot that performs work on the aforementioned substrate, The range of motion of the first robot described above overlaps with at least a portion of the range of motion of the second robot described above. The first robot is capable of performing specific tasks at at least two specific work positions, including a first specific work position and a second specific work position different from the first specific work position. When the first robot performs the specific task, and the second robot performs a predetermined task, the first robot is configured to select one of the two or more specific work positions according to the predetermined work position in which the second robot performs the predetermined task. The second robot is positioned opposite the first robot with the substrate in between. The first robot and the second robot are robots that perform the task of mounting components onto the substrate. The aforementioned specific operation is the operation of disposing of the component that is determined to be unmountable on the substrate into a waste box. The aforementioned predetermined operation is the operation of mounting the components onto the circuit board, and the circuit board work machine.

2. The first robot described above is A nozzle capable of adsorbing the aforementioned component, The head on which the nozzle is mounted so as to be able to move up and down, The system includes an XY movement mechanism that moves the head in the X and Y directions relative to the substrate, The nozzle is movable up and down relative to the head at at least two or more lifting positions, including a first lifting position and a second lifting position different from the first lifting position. The first robot is configured such that when a first specific work position is selected, it raises and lowers the nozzle at the first lifting position to perform the specific work, while when a second specific work position is selected, it raises and lowers the nozzle at the second lifting position to perform the specific work. The substrate work machine according to claim 1, wherein when the first robot performs the specific task, and the second robot performs the predetermined task, the first robot is configured to select one of the two or more lifting positions based on the distance from the center of the head to the predetermined work position.

3. The substrate work machine according to claim 2, wherein when the first robot performs the specific work, and the second robot performs the predetermined work, the first robot is configured to select one of the two or more specific work positions based on the distance in the X direction from the center of the head to the predetermined work position.

4. The substrate work machine according to claim 2, wherein when the first robot performs the specific work, and the second robot performs the predetermined work, the first robot is configured to select one of the two or more specific work positions based on the distance in the Y direction from the center of the head to the predetermined work position.

5. A first robot that performs the task of mounting components onto a circuit board, The system comprises a second robot that faces the first robot across the substrate and performs the task of mounting components onto the substrate, The range of motion of the first robot described above overlaps with at least a portion of the range of motion of the second robot described above. The first robot is a circuit board work machine that is capable of performing a specific operation in which a component that is determined to be unmountable on the circuit board is disposed of in a waste box at at least two specific work positions, namely a first specific work position and a second specific work position different from the first specific work position, and the method is performed using a circuit board work machine, A first execution step in which the first robot performs the specific task, A second execution step in which the second robot performs a predetermined operation of mounting the components onto the substrate, A substrate work method comprising: a selection step, in which, when the first execution step and the second execution step are executed simultaneously, the first robot selects one of the two or more specific work positions according to a predetermined work position in which the second robot performs the predetermined work.

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