Inspection support device, production management system, and inspection support method

Abstract

This inspection assistance device comprises: an image acquisition unit that acquires image data by capturing images of an upper surface and a back surface of a component in a supply step in which a component supply unit supplies the component to a component mounting machine in a pickable manner; a component analysis unit that, on the basis of the image data, determines the positional relationship of a feature portion on the back surface of the component with respect to the exterior of the component on the upper surface side thereof on the basis of the image data, and causes the positional relationship to be stored as feature portion information; and a storage unit in which mounting information, indicating a substrate on which the component picked by the component mounting machine has been mounted and the mounting position of the component on the substrate, is stored in association with the feature portion information in such a manner as to be readable by an inspection device that performs exterior inspection of the substrate having the component mounted thereon.

Description

Technical Field

[0006] , , ,

[0005] , ,

[0001] The present invention relates to an inspection support device, a production management system, and an inspection support method.

Background Art

[0002] In a production line of substrate products, an appearance inspection is performed to determine whether components mounted on a substrate are in specified mounting positions. In the appearance inspection, for example, an error from the mounting position of the component is measured based on the positional relationship of the outer shape of the component with respect to a reference position of the substrate (see Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, among the above components, there are those that are mounted so that characteristic parts such as bumps (electrodes) formed on the back surface of the component, like bump components for example, have a predetermined positional relationship with respect to the reference position of the substrate. For components mounted based on such characteristic parts on the back surface, there are individual differences in the positional relationship between the characteristic parts on the back surface and the outer shape visually recognized from the front surface. Therefore, in an appearance inspection that depends on the outer shape, there is concern that the inspection accuracy will decrease by the amount of the above individual differences.

[0005] This specification aims to provide an inspection support device capable of improving the accuracy of appearance inspection, a production management system including the inspection support device, and an inspection support method.

Means for Solving the Problems

[0006] This specification discloses an inspection support device comprising: an image acquisition unit that captures images of the front and back surfaces of a component and acquires image data in a supply process in which a component supply unit supplies a component to a component mounting machine in a manner that allows the component to be picked up; a component analysis unit that determines the positional relationship of a feature portion on the back surface of the component with respect to the appearance of the front surface of the component based on the image data and stores it as feature portion information; and a storage unit that associates mounting information indicating the mounting position of the component on the substrate on which the component has been picked up and mounted by the component mounting machine with the feature portion information and stores it in a manner that can be read by an inspection device that performs an appearance inspection of the substrate on which the component has been mounted.

[0007] This specification discloses a production management system comprising the above-described inspection support device, the parts supply unit, the parts mounting machine, and the inspection device. This specification discloses an inspection support device comprising: an image acquisition step of acquiring image data by imaging the front and back surfaces of a component in a supply process in which a component supply unit supplies a component to a component mounting machine in a manner that allows the component to be picked up; a component analysis step of determining the positional relationship of a feature portion on the back surface of the component with respect to the appearance of the front surface of the component based on the image data and storing it as feature portion information; and a storage step of associating mounting information, which indicates the mounting position of the component on the substrate on which the component mounting machine has picked up and mounted the component, with the feature portion information and storing it in a manner that can be read by an inspection device that performs an appearance inspection of the substrate on which the component has been mounted. [Effects of the Invention]

[0008] This configuration allows for improved accuracy in visual inspection. [Brief explanation of the drawing]

[0009] [Figure 1] This is a schematic diagram showing a production line to which the inspection support device and production management system in the embodiment are applied. [Figure 2] This is a schematic plan view showing a component mounting machine, a component supply unit, and a wafer supply device. [Figure 3]This is a plan view showing a part of the parts supply unit. [Figure 4] This is a side view of direction IV in Figure 3. [Figure 5] This is a functional block diagram of the production line. [Figure 6] This is a flowchart showing the inspection support process. [Figure 7] This figure shows an example of image data. [Figure 8] This figure shows feature information and mounting information based on image data. [Figure 9] This is a flowchart showing the inspection process performed by the inspection device. [Modes for carrying out the invention]

[0010] 1. Overview of the production management system 1 and inspection support device 30 The following describes embodiments of the production management system 1 and the inspection support device 30 with reference to the drawings. The production management system 1 and the inspection support device 30 are applied to a production line Ln, for example, which includes an inspection device 50, as shown in Figure 1. The production line Ln is configured by arranging multiple board-handling machines that perform predetermined board-handling tasks side by side.

[0011] 2. Configuration of production line Ln As shown in Figure 1, the production line Ln is configured by installing multiple substrate handling machines in the direction of transport of the substrate 71. Each of the multiple substrate handling machines is connected to the host computer 2 in a communication manner. The host computer 2 controls the multiple production lines Ln in a coordinated manner.

[0012] The production line Ln comprises multiple printers as board-to-board work machines, multiple component mounting machines 10, a reflow oven, and an inspection device 50. The printers print paste-like solder onto the component mounting positions on the incoming boards 71. Each of the component mounting machines 10 mounts components onto the boards 71 ​​transported from the upstream side of the production line Ln. The configuration of the component mounting machines 10 will be described later. The reflow oven heats the boards 71 ​​transported from the upstream side of the production line Ln, melting the solder on the boards 71 ​​to perform soldering. The inspection device 50 performs visual inspection of the board products produced by the production line Ln. Details of the inspection device 50 will be described later.

[0013] In this embodiment, the factory for substrate products may have multiple production lines Ln. The configuration of each of the multiple production lines Ln may be appropriately added or changed depending on, for example, the type of substrate product to be produced. Specifically, the multiple production lines Ln may be appropriately equipped with substrate handling equipment such as buffer devices for temporarily holding the substrates 71 being transported, substrate supply devices, substrate inversion devices, various inspection devices, shielding devices, adhesive coating devices, ultraviolet irradiation devices, and inspection devices for performing functional inspections of the substrate products.

[0014] 3. Configuration of the parts mounting machine 10 As shown in Figure 2, the component mounting machine 10 includes a substrate transport device 11. The substrate transport device 11 sequentially transports the substrate 71 in the transport direction and positions the substrate 71 at a predetermined position within the machine. The component mounting machine 10 also includes a component supply device 12. The component supply device 12 supplies components to be mounted on the substrate 71. The component supply device 12 is equipped with feeders 122 in each of the multiple slots 121. For example, a tape feeder is used for the feeders 122, which feeds and moves a carrier tape containing a large number of components to supply components in a way that makes them available for collection.

[0015] As an apparatus for supplying components in the mounting process, in addition to the component supply apparatus 12 using the feeder 122 as described above, various component supply units corresponding to the mounting process can be applied. As the above-mentioned component supply units, a tray component supply apparatus that supplies relatively large components in a state of being aligned on a tray, and a wafer supply apparatus that supplies wafers divided into a plurality of dies are appropriately applied. The component supply unit has a configuration that functions as a part of the component supply apparatus 12 and a configuration that can operate independently as an external device of the component supply apparatus 12.

[0016] In the present embodiment, the component supply unit 20 is an external device of the component supply apparatus 12 and is arranged side by side with the component mounting machine 10 in the conveyance direction of the substrate 71. The component supply unit 20 accesses the inside of the machine from the side of the component mounting machine 10 (in the present embodiment, the upstream side in the conveyance direction of the substrate 71) and supplies a predetermined component in a collectable manner. Specifically, the component supply unit 20 is interposed between the wafer supply apparatus 40 that supplies the wafer 80 and the component mounting machine 10, and collectively supplies a plurality of dies acquired from the wafer supply apparatus 40 to the component mounting machine 10. Details of the component supply unit 20 will be described later.

[0017] The component mounting machine 10 includes a component transfer device 13. The component transfer device 13 transfers the component supplied by the component supply apparatus 12 to a predetermined mounting position on the substrate 71. The component transfer device 13 includes a head drive device 131, a moving stage 132, and a mounting head 133. The head drive device 131 moves the moving stage 132 in the horizontal directions (X direction and Y direction) by a linear motion mechanism. The mounting head 133 is detachably fixed to the moving stage 132 by a clamping member (not shown) and is provided so as to be movable horizontally inside the machine.

[0018] The mounting head 133 supports a plurality of holding members so as to be movable up and down and rotatable around the rotation axis for each of the plurality of holding members. In the present embodiment, the holding member is a suction nozzle 134 that holds the component by sucking the negative pressure air supplied. Note that as the holding member, a chuck that holds the component by gripping the component or the like can be adopted.

[0019] The component mounting machine 10 includes a component camera 14 and a substrate camera 15. The component camera 14 and the substrate camera 15 are digital imaging devices having an image sensor such as a CMOS. The component camera 14 and the substrate camera 15 perform imaging based on control signals and transmit the image data acquired by the imaging. The component camera 14 is mounted on a base fixed to the installation floor and is configured to be able to image components held by the suction nozzle 134 from below. The substrate camera 15 is mounted on a movable table 132 so as to be able to move horizontally integrally with the mounting head 133. The substrate camera 15 is configured to be able to image the substrate 71 from above.

[0020] The component mounting machine 10 is equipped with a control device 16. The control device 16 mainly consists of a CPU, various memories, and control circuits. The control device 16 acquires and stores various data, such as control data and component information used to control the mounting process, from the host computer 2. The control data indicates the type of component to be mounted on the substrate 71 during the mounting process, the mounting position, the mounting angle, and the mounting order. The above mounting process includes a pick-and-place cycle (PP cycle) which repeatedly executes a picking operation in which a holding member (suction nozzle 134) picks up components supplied by the component supply device 12, and a mounting operation in which the components are mounted on the substrate 71 at a predetermined mounting position and at a predetermined mounting angle.

[0021] During the mounting process, the control device 16 controls the mounting operation by the mounting head 133 so that the component is mounted on the substrate 71 in a predetermined orientation. At this time, the control device 16 controls the mounting operation based on the component holding state by the suction nozzle 134 recognized using the component camera 14, and various data. In other words, the control device 16 picks up the component by bringing the suction nozzle 134 into contact with the suction position on the component specified by the component information. The control device 16 also processes the image data acquired by the component camera 14 to recognize the component's holding state.

[0022] Furthermore, during the mounting operation, the control device 16 lowers the suction nozzle 134 until the component comes into contact with the substrate 71, then raises the suction nozzle 134 and supplies positive pressure air to the suction nozzle 134 to attempt to release the component. The control device 16 then moves the suction nozzle 134 away from the component and moves the mounting head 133 to mount the component at the next mounting position.

[0023] 4. Configuration of the parts supply unit 20 As described above, the component supply unit 20 is positioned between the wafer supply device 40 and the component mounting machine 10. In this embodiment, the component supply unit 20 is a unit that supplies multiple dies 81 (components 90) acquired from the wafer supply device 40 to the component mounting machine 10 in a batch.

[0024] The wafer supply device 40 stores wafer pallets 41 in a pull-out manner in multiple storage shelves formed in the housing. The wafer pallet 41 holds the perimeter of the dicing sheet 42 while applying tension to it. Multiple wafers 80, divided into several dies 81 by the dicing process, are attached to the dicing sheet 42. The wafer supply device 40 pulls out a predetermined wafer pallet 41 using a pallet transport mechanism (not shown) and transports it to the supply position.

[0025] The wafer supply device 40 pushes up the dicing sheet 42 together with the wafer pallet 41, which is positioned at the supply position, from below using a pot (not shown) to supply a predetermined die 81 in a way that allows it to be collected. The wafer supply device 40 moves the pot horizontally according to the die 81 to be supplied. The wafer supply device 40, having the above configuration, may be positioned so that the supply position of the wafer pallet 41 is inside the component mounting machine 10. This allows the component transfer device 13 to directly collect the die 81 from the wafer supply device 40.

[0026] However, the wafer supply device 40 requires the movement of a pot for each die 81 supplied, and the wafer pallet 41 must be replaced after supplying a predetermined number of dies 81. Therefore, when performing a mounting process that mounts multiple dies 81 in succession, a waiting time may occur while waiting for the wafer supply device 40 to finish its supply operation. To address this, this embodiment adopts a configuration in which a component supply unit 20 is interposed between the component mounting machine 10 and the wafer supply device 40.

[0027] The component supply unit 20 supplies multiple dies 81 acquired from the wafer supply device 40 to the component mounting machine 10 in a batch. Specifically, the component supply unit 20 comprises a stage drive device 21, a die transfer device 22, a die camera 23, an upper camera 24, a lower camera 25, and a supply control device 26.

[0028] The stage drive unit 21 includes a stage 211 having a horizontal mounting surface on which a plurality of dies 81 can be placed, and a pair of rails 212 that support the stage 211. In this embodiment, the stage 211 is made of a light-transmitting material. Specifically, the stage 211 is made of, for example, glass or acrylic. As shown in Figure 3, the stage 211 is provided with a plurality of reference marks 215 that are visible from above and below. The plurality of reference marks 215 are formed, for example, in a circular shape and arranged in a matrix at equal intervals.

[0029] A pair of rails 212 support the stage 211 so that it can slide in the transport direction of the substrate 71 (left-right direction in Figure 3). The stage 211 moves along the pair of rails 212 by a drive mechanism (not shown). This positions the stage 211 at the receiving position Ps1 where the die 81 is received from the die transfer device 22, the imaging position Ps2 where it is imaged by the upper camera 24 and the lower camera 25, and the supply position Ps3 where the die 81 is supplied in the work area Rw, which is inside the component mounting machine 10.

[0030] Furthermore, the stage 211 may be provided with a function to hold the placed die 81. This holding function is provided, for example, by an adhesive sheet pre-attached to the mounting surface of the stage 211, or by an adhesive applied to the mounting surface. Alternatively, for example, an air conduit opening may be formed on the mounting surface of the stage 211, and the die 81 placed in the opening may be held by supplying negative pressure air to this air conduit.

[0031] The die transfer device 22 transfers the die 81 supplied by the wafer supply device 40 to a predetermined mounting position on the stage 211. The die transfer device 22 includes a supply head 221 and a suction nozzle 222. The supply head 221 is configured to be movable in the horizontal direction (X direction and Y direction) by a drive mechanism not shown in the figure. The suction nozzle 222 is supported by the supply head 221 so as to be able to move up and down, and holds the die 81 by suction using supplied negative pressure air.

[0032] The die transfer device 22 described above is exemplified as having a supply head 221 which is an XY robot that moves horizontally, but it may also be configured as an articulated robot. For example, the die transfer device 22 can be configured to use an articulated robot to pick up the die 81 with an end effector such as a suction nozzle and place it in a predetermined position on the stage 211.

[0033] The die camera 23, the upper camera 24, and the lower camera 25 are digital imaging devices having image sensors such as CMOS. The die camera 23 is positioned between the wafer supply device 40 and the stage 211, and is configured to allow the die transfer device 22 to image the die 81 taken from the wafer supply device 40 from below. The image data acquired by the die camera 23 is used by the die transfer device 22 to recognize the holding state of the die 81.

[0034] As shown in Figure 4, the upper camera 24 and the lower camera 25 are positioned opposite each other in the vertical direction along the movement path of the stage 211. The upper camera 24 is configured to capture images of the die 81 placed on the stage 211 from above when the stage 211 is positioned at the imaging position Ps2. The lower camera 25 is configured to capture images of the die 81 placed on the stage 211 from below when the stage 211 is positioned at the imaging position Ps2.

[0035] The supply control device 26 works in conjunction with the wafer supply device 40 to perform a supply process to supply the dies 81 necessary for the mounting process by the component mounting machine 10. Specifically, the supply control device 26 causes the die transfer device 22 to pick up the die 81 supplied by the wafer supply device 40. The supply control device 26 recognizes the holding state based on image data acquired by the die camera 23. The holding state includes the presence or absence of the die 81 and the position and angle of the die 81 relative to the reference position of the supply head 221.

[0036] The supply control device 26 places the die 81 at a predetermined position on the stage 211 based on the holding state of the die 81. By repeating the sampling operation, state recognition, and placement operation for the die 81, multiple dies 81 are arranged in a matrix on the stage 211. Subsequently, the supply control device 26 moves the stage 211 from the receiving position Ps1 to the supply position Ps3. In this way, the component supply unit 20 transfers the component 90 (die 81) housed in the external wafer supply device 40 to the stage 211 and supplies the component 90 (die 81) on the stage 211 to the component mounting machine 10.

[0037] 5. Configuration of the inspection support device 30 5-1. Overview of the mounting process and inspection device 50 of the parts mounting machine 10 The component mounting machine 10 recognizes the holding state of the component by the suction nozzle 134 based on image data acquired by the component camera 14 during the mounting process, and controls the mounting of the component at a predetermined mounting angle at a predetermined mounting position on the substrate 71. As a result, the component is mounted so that, for example, the electrodes of the component correspond to the lands formed on the substrate 71.

[0038] In this case, if the position of the electrodes relative to the outer shape of the component is constant, for example, if electrodes are formed at both ends in the longitudinal direction of a rectangular shape, the control device 16 can recognize the position of the electrodes based on the outer shape of the component. Similarly, the inspection device 50 that performs visual inspection recognizes the reference position of the substrate 71 and the appearance (including the outer shape) of the surface of each component based on image data acquired by imaging the substrate 71 on which a large number of components are mounted. The inspection device 50 then inspects the quality of the substrate 71 based on whether the mounting position and mounting angle of each component are within an acceptable range.

[0039] On the other hand, for components formed by dividing the wafer 80, such as the die 81, the position of the bumps (electrodes) is not constant relative to the outer shape. Therefore, in the mounting process for such components, the component mounting machine 10 recognizes the position of feature parts (such as bumps) on the back surface of the component based on image data acquired by imaging with the component camera 14. The component mounting machine 10 then controls the position and angle of the suction nozzle 134 so that the feature parts on the back surface of the component are in a predetermined positional relationship with a predetermined mounting position on the substrate 71.

[0040] For parts that are mounted based on the characteristic features on the back surface, there are individual differences in the positional relationship between the characteristic features on the back surface and the external shape visible from the front surface. Therefore, in the visual inspection by the inspection device 50, parts that are based on the characteristic features on the back surface may be excluded from inspection, or a certain degree of individual difference may be taken into consideration, raising concerns that the inspection accuracy may decrease compared to inspections based on the appearance of the front surface. To address this, the production management system 1 and inspection support device 30 of this embodiment employ the following configuration, which can improve the accuracy of visual inspections for such parts.

[0041] 5-2. Configuration of the Inspection Support Device 30 In this embodiment, the inspection support device 30 is incorporated into the parts supply unit 20, as shown in Figure 5. The inspection support device 30 comprises an image acquisition unit 31, a parts analysis unit 32, and a storage unit 33. The inspection support device 30 also performs inspection support processing as an example of an inspection support method, as shown in Figure 6. The image acquisition unit 31 captures images of the front surface 91 and back surface 93 of the parts 90 (die 81 in this embodiment) during the supply process in which the parts supply unit 20 supplies parts 90 to the parts mounting machine 10 in a manner that allows for collection, and acquires image data D1 (see image acquisition step, S11, S12 in Figure 6, and Figure 7).

[0042] The above supply process includes a series of operations from when the component supply unit 20 picks up the die 81 from the wafer supply device 40 until it moves the stage 211 to the supply position Ps3. In this embodiment, imaging to acquire image data D1 is performed by the upper camera 24 and the lower camera 25. Specifically, the image acquisition unit 31 performs imaging with the upper camera 24 and the lower camera 25 when the component supply unit 20 moves the stage 211 from the receiving position Ps1 to the supply position Ps3 and reaches the imaging position Ps2.

[0043] At this time, the image acquisition unit 31 acquires image data D1 obtained by simultaneously imaging the component 90 placed on the stage 211 from above and below. Figure 7 shows a composite image of the front surface 91 and back surface 93 of one die 81, which are located within the respective camera fields of the upper camera 24 and the lower camera 25, so that they form a pair. In addition to simultaneously imaging the die 81 from above and below as described above, the stage 211 may be stopped at the imaging position Ps2 and then imaged sequentially from above and below.

[0044] The part analysis unit 32 determines the positional relationship between the feature portion 95 (in this embodiment, the bump of the die 81) on the back surface 93 of the part 90 and the external appearance of the front surface 91 of the part 90 based on the image data D1, and stores it as feature portion information M1 (part analysis step, S13 in Figure 6). In other words, the part analysis unit 32 determines the feature portion 95 of the back surface 93 in relation to the external appearance of the die 81 when viewed from above.

[0045] The following methods (A) and (B) can be used for the above determination process. In method (A), the part analysis unit 32 determines the positional relationship between the appearance of the surface 91 side of the part 90 and the feature part 95 based on the correspondence between multiple reference marks 215 included in the image data D1. In other words, the part analysis unit 32 determines the positional relationship between the bump 95 and the surface outline 92 by, for example, horizontally flipping the image of the back side 93 side and superimposing it onto the image of the front side 91 side, corresponding the four reference marks 215 (see Figure 8).

[0046] In method (B), the part analysis unit 32 determines the positional relationship between the appearance of the surface 91 side of the part 90 and the feature part 95 based on the correspondence between the outer shape of the surface 91 side (surface outline 92) and the outer shape of the back side 93 side (back side outline 94) of the part 90 recognized from the image data D1. In other words, the part analysis unit 32 determines the positional relationship of the bump 95 with respect to the surface outline 92 by, for example, reversing the image of the back side 93 side horizontally and aligning it so that the reversed back side outline 94 matches the surface outline 92 (see Figure 8).

[0047] Method (A) described above is effective when the shape obtained by horizontally reversing the back surface outline 94 differs from the front surface outline 92. Method (B) described above is effective when the reference mark 215 in the image data D1 is unclear or when the reference mark 215 is outside the camera's field of view, and when the positional relationship can be determined without relying on the reference mark 215. The component analysis unit 32 may switch or combine methods (A) and (B) described above depending on the imaging conditions and the status of the stage 211.

[0048] The component analysis unit 32 performs the analysis described above and determines the position of the feature portion 95 of the back surface 93 relative to the appearance of the front surface 91 for each of the multiple components 90. Then, the component analysis unit 32 calculates the position coordinates (X1, Y1), (X2, Y2), ... of the multiple bumps 95, for example, with the center of the component 90 as the origin (X0, Y0), and stores them as feature portion information M1.

[0049] The storage unit 33 stores mounting information M2, which indicates the substrate 71 on which the component 90 was picked up and mounted by the component mounting machine 10, and the mounting position of the component 90 on the substrate 71, in association with feature information M1 (storage step, S14 in Figure 6). In other words, the storage unit 33 obtains mounting information M2, which includes, for example, the identification code (ID) of the substrate 71 on which the component 90 analyzed by the component analysis unit 32 is mounted, and the mounting position (X11, Y11) on the substrate 71, from the control device 16 of the component mounting machine 10, and stores it in association with feature information M1 so as to be added to it.

[0050] The memory unit 33 acquires mounting information M2 from the control device 16 each time a component 90 is taken from the stage 211 and mounted on the substrate 71, or all at once after the completion of a series of PP cycles. The memory unit 33 then stores the feature information M1 and mounting information M2 in a format readable by the inspection device 50, which performs visual inspection in a process after the component mounting machine 10 on the production line Ln. The memory unit 33 accumulates feature information M1 and mounting information M2 as the component supply unit 20 performs a supply operation and the component mounting machine 10 performs the mounting process.

[0051] In an appearance inspection using image data acquired by imaging the substrate 71 from above, the inspection device 50 determines whether a component 90 to be inspected is mounted on the substrate 71 based on a characteristic section 95 on the back surface 93, based on the characteristic section information M1 and mounting information M2 corresponding to the component 90. In this embodiment, the inspection device 50 includes a notification unit 51 for notifying the inspection results to an external party.

[0052] The system further includes a notification unit 51 that, if the inspection results from the inspection device 50 do not meet a preset standard, notifies the parts mounting machine 10 of an execution command for corrective processing based on the inspection results, or notifies the operator of the inspection results (see Figure 5). The notification unit 51 may, for example, notify the parts mounting machine 10 of an execution command for corrective processing based on the inspection results if the inspection result is "defective". Alternatively, the notification unit 51 may notify the operator of the inspection results.

[0053] 6. Inspection process using inspection device 50 The inspection process performed by the inspection device 50 in the production management system 1 equipped with the inspection support device 30 will be explained with reference to Figure 9. When performing the inspection process, the inspection device 50 obtains feature information M1 and mounting information M2 from the inspection support device 30. In addition, when the substrate 71 to be inspected is brought into the machine, the inspection device 50 reads the identification code attached to the substrate 71 and obtains the identification code (ID) of the substrate 71.

[0054] First, the inspection device 50 takes an image of the substrate 71 from above to acquire image data (S21). Next, based on the acquired image data, the inspection device 50 recognizes the reference position of the substrate 71 and the appearance of the surface 91 of each component 90 (S22). Subsequently, the inspection device 50 determines whether the mounting position and mounting angle of each of the multiple components 90 set as the inspection target are within the allowable range relative to the target mounting position and mounting angle (S23). At this time, the inspection device 50 may measure positional errors and angular errors as necessary.

[0055] In the above determination process (S23), the inspection device 50 makes a determination on the component 90 mounted on the substrate 71 based on the appearance of the surface 91, based on the appearance recognized in the appearance recognition process (S22). On the other hand, for the component 90 mounted on the substrate 71 based on the feature portion 95 of the back surface 93, the inspection device 50 first determines the mounting position of the component 90 on the substrate 71, and obtains mounting information M2 corresponding to this mounting position and feature portion information M1 associated with the mounting information M2.

[0056] Next, the inspection device 50 acquires the actual position of the feature portion 95 on the back surface 93 based on the appearance and feature portion information M1 recognized in the appearance recognition process (S22) (acquisition step). Then, the inspection device 50 measures the mounting accuracy based on the difference between the actual position of the feature portion 95 and the target position of the feature portion 95 on the substrate 71 (measurement step). Based on the measurement results, the inspection device 50 determines whether the feature portion 95 on the back surface 93 of the component 90 is in a predetermined positional relationship with respect to the reference position on the substrate 71. In this way, the inspection device 50 can identify the actual position of the feature portion 95 on the back surface 93 of the component 90, which cannot be seen after mounting, and reflect this in the appearance inspection.

[0057] If the inspection device 50 finds that the inspection results for all the components 90 designated as inspection targets meet the pre-set criteria (S24:Yes), it outputs a result of "good product" for the circuit board 71 (S25). On the other hand, if the inspection result for at least one of the multiple components 90 designated as inspection targets does not meet the pre-set criteria (S24:No), the notification unit 51 notifies the external system of the inspection result (S26).

[0058] In detail, the notification unit 51, in notification processing (S26), notifies the parts mounting machine 10 of an execution command for corresponding processing based on the inspection results. For example, if the defect rate reaches a predetermined value as a result of multiple visual inspections, the notification unit 51 notifies the parts mounting machine 10 to execute corresponding processing such as temporarily suspending the mounting process or changing various parameters in the mounting process to prevent similar defects from occurring. Alternatively, the notification unit 51 may notify the operator of the inspection results and prompt them to perform maintenance.

[0059] 7. Effects of the Configuration of the Embodiment With the above-described configuration of the production management system 1 and inspection support device 30, it becomes possible to recognize the position of the feature portion 95 (bump) on the back surface 93 of the part 90 (die 81) relative to the surface 91 during visual inspection. This allows for the measurement of errors from the mounting position based on the positional relationship of the feature portion 95 on the back surface 93 of the part 90 with respect to the reference position on the substrate 71. As a result, the accuracy of visual inspection can be improved.

[0060] 8. Modified embodiments of the embodiment In this embodiment, the image acquisition unit 31 of the inspection support device 30 acquires image data D1 by taking images with the upper camera 24 and the lower camera 25. Alternatively, the image acquisition unit 31 may acquire image data obtained by taking images from below of the part 90 that is held in order to transfer the part 90 to the stage 211. Specifically, image data obtained by taking images with the die camera 23 may be used.

[0061] In this embodiment, the component 90 is assumed to be a die 81 formed by dividing the wafer 80. In contrast, the inspection support device 30 can target other bump components, etc., as long as they are mounted based on the characteristic portion 95 of the back surface 93 of the component 90.

[0062] In this embodiment, the inspection support device 30 is configured to be integrated into the parts supply unit 20. However, the inspection support device 30 may be configured as a separate device from the parts supply unit 20, provided that it can acquire image data D1 during the supply process of the parts supply unit 20 and perform analysis of the parts 90. For example, the inspection support device 30 may be integrated into a line management device installed for each parts mounting machine 10, host computer 2, and production management system Ln, and may be configured to input image data acquired by imaging and perform analysis of the parts 90. [Explanation of symbols]

[0063] 1: Production management system, 10: Parts mounting machine, 20: Parts supply unit, 21: Stage drive device, 211: Stage, 215: Reference mark, 22: Die transfer device, 23: Die camera, 24: Upper camera, 25: Lower camera, 26: Supply control device, 30: Inspection support device, 31: Image acquisition unit, 32: Parts analysis unit, 33: Memory unit, 40: Wafer supply device, 50: Inspection device, 51: Notification unit, 71: Substrate, 80: Wafer, 81: Die, 81: Part, 91: Surface, 92: Surface outline, 93: Back side, 94: Back side outline, 95: Feature area (bump), D1: Image data, M1: Feature area information, M2: Mounting information

Claims

1. In a supply process in which a parts supply unit supplies parts to a parts mounting machine in a manner that allows for collection, an image acquisition unit captures images of the front and back surfaces of the parts to acquire image data, A component analysis unit that determines the positional relationship between the external appearance of the front surface of the component and the feature portion on the back surface of the component based on the image data and stores it as feature portion information, A storage unit stores information indicating the mounting position of the component on the substrate, which has been picked up and mounted by the component mounting machine, in association with the feature information, so that it can be read by an inspection device that performs an external inspection of the substrate on which the component has been mounted. Equipped with, The component supply unit supplies the component to the component mounting machine with the component placed on a stage made of a light-transmitting material. The aforementioned stage is provided with multiple reference marks that are visible from above and below. The component analysis unit is an inspection support device that determines the positional relationship between the surface appearance of the component and the characteristic part based on the correspondence between a plurality of reference marks included in the image data.

2. The aforementioned component is a die formed by dividing a wafer, The inspection support device according to claim 1, wherein the characteristic portion on the back surface of the component is a bump formed on the die.

3. The inspection support apparatus according to claim 2, wherein the component supply unit is interposed between a wafer supply device that supplies the wafer and the component mounting machine, and supplies a plurality of dies obtained from the wafer supply device to the component mounting machine in a batch.

4. The inspection device, An acquisition step is to recognize the appearance of the front side of the component based on image data obtained by imaging the component mounted on the substrate to be inspected, and to obtain the actual position of the feature portion on the back side based on the mounting information and the feature portion information, An inspection support apparatus according to any one of claims 1 to 3, comprising: a measurement step of measuring mounting accuracy based on the difference between the actual position of the feature portion and the target position of the feature portion on the substrate.

5. A production management system comprising the inspection support device according to any one of claims 1 to 4, the parts supply unit, the parts mounting machine, and the inspection device.

6. The production management system according to claim 5, further comprising a notification unit that, when the inspection results from the inspection device do not meet a predetermined standard, notifies the component mounting machine of an execution command for corresponding processing based on the inspection results, or notifies the operator of the inspection results.

7. In a supply process in which a parts supply unit supplies parts to a parts mounting machine in a manner that allows for collection, an image acquisition step is performed to capture images of the front and back surfaces of the parts and acquire image data; A component analysis step in which, based on the image data, the positional relationship between the feature portion on the back surface of the component and the external appearance of the front surface of the component is determined and stored as feature portion information, A storage step involves associating the substrate on which the component mounting machine has picked up and mounted the component, and mounting information indicating the mounting position of the component on the substrate, with the feature information, and storing this information in a readable format by an inspection device that performs an external inspection of the substrate on which the component has been mounted. Equipped with, The component supply unit supplies the component to the component mounting machine with the component placed on a stage made of a light-transmitting material. The aforementioned stage is provided with multiple reference marks that are visible from above and below. The part analysis step is an inspection support method that determines the positional relationship between the appearance of the surface side of the part and the characteristic part based on the correspondence between a plurality of reference marks included in the image data.

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