Heat dissipation of ultrasonic probes

Abstract

The ultrasound imaging device has a housing having an exterior surface and an interior surface. The exterior surface is gripped by a user. The device has an array of acoustic elements that transmit ultrasonic energy and receive ultrasonic echoes. The array is at an end of the housing. The device includes a heat sink within the housing to receive heat generated by the array. The device includes a heat pipe within the housing to transfer heat from the end of the housing. The device includes a heat spreading material on the interior surface of the housing to dissipate heat. A distal portion of the heat pipe is in thermal contact with the heat sink and a proximal portion of the heat pipe is in thermal contact with a heat spreader material. The proximal and distal portions have flat profiles.

Description

Technical Field

[0001] The present disclosure generally relates to dissipating heat from an ultrasonic probe. For example, a low-resistance heat path (e.g., within the housing of the ultrasonic probe) connects a heat source to a large-area heat spreader that maximizes heat transfer from the heat source.

Background Art

[0002] Ultrasonic imaging systems are widely used for medical imaging and measurement. For example, an ultrasonic imaging system can be used to measure organs, lesions, tumors, or other structures within a patient's anatomical structure. During an ultrasonic imaging procedure, the user of the ultrasonic imaging system contacts a probe to the patient's body. An array of elements within the probe emits acoustic energy and receives reflected waves used to construct an image of the patient's anatomical structure. Many transducer arrays use piezoelectric materials to generate acoustic energy. While generating acoustic energy for transmission to the patient's anatomical structure, these piezoelectric transducers and the materials within the acoustic path also generate heat and raise the temperature within the probe.

Summary of the Invention

Problems to be Solved by the Invention

[0003] Increasing the amplitude of the transmitted sound wave generally increases the quality of the ultrasonic image acquired by the ultrasonic system, but increasing this amplitude also increases the heat generated. If the temperature of the probe is not controlled, this heat can cause discomfort or physical harm to the patient.

[0004] Government regulations determine how much temperature rise within a medical ultrasonic transducer is acceptable. As a result, the power transmitted to a medical ultrasonic transducer is often limited by the temperature rise. In addition, dissipating heat from an ultrasonic probe has proven difficult because it is often generated within and / or surrounded by materials with low thermal conductivity.

[0005] U.S. Patent Application Publication No. 2016 / 0174939 discloses an ultrasonic probe having a heat-absorbing backing layer, a heat spreader beneath the backing layer, and a heat pipe extending between the heat spreader and a heat sink to transfer heat to the outside of the ultrasonic probe.

[0006] U.S. Patent Application Publication No. 2021 / 059645 discloses an ultrasonic probe having a support structure using a thermally conductive material. [Means for solving the problem]

[0007] This invention is defined by the claims.

[0008] Embodiments of the present disclosure relate to systems, apparatus, and methods for efficiently dissipating heat from ultrasonic transducers having low-resistance thermal paths. Once heat is generated by the transducer array, the heat can be absorbed and dissipated by a heat sink positioned behind the transducer array. The heat sink includes a pair of fins extending from the heat sink toward the transducer array. The characteristic heat sink fins are embedded in a highly attenuating acoustic back material. One or more heat pipes also contact the heat sink and extend along the length of the ultrasonic probe. Heat may be transferred from the heat sink to these heat pipes via a thermal interface material. At the other end of the heat pipes, the pipes are brought into contact with a heat spreader material bonded to the inner surface of the ultrasonic probe housing. Heat can pass from the heat pipes to the heat spreader material via an additional thermal interface material, such as a gap-filling paste. From the heat spreader material, the heat can then be dissipated to the ultrasonic probe housing and the surrounding environment.

[0009] The described low-resistance thermal path advantageously allows the transducer array of the ultrasound probe to emit higher output acoustic energy without exceeding the regulated limit of the transducer surface temperature. This results in lower operating temperatures and increased probe radiant power. The increased radiant power allows the ultrasound system to generate higher quality ultrasound data. This, in turn, allows the ultrasound data to be more useful to physicians making diagnostic and / or treatment decisions, and thus to improving the patient's health.

[0010] In exemplary embodiments of this disclosure, an ultrasound imaging apparatus is provided. The apparatus is A housing comprising an outer surface and an inner surface, wherein the outer surface is configured to be grasped by a user, An array of acoustic elements configured to transmit ultrasonic energy and receive ultrasonic echoes associated with the ultrasonic energy, wherein the array of acoustic elements is located at the end of the housing, A heat sink is disposed within the housing and configured to receive heat generated by the array of acoustic elements, A heat pipe disposed within the housing and configured to transfer heat away from the ends of the housing, wherein the heat pipe comprises a proximal portion and a distal portion, A heat spreader material is disposed on the inner surface of the housing and configured to dissipate the heat. It has, The distal portion of the heat pipe is in thermal contact with the heat sink, and the proximal portion of the heat pipe is in thermal contact with the heat spreader material. The proximal and distal portions have flattened profiles.

[0011] In one embodiment, the heat pipe has a bent shape. In one embodiment, the heat spreader material comprises pyrolytic graphite. In one embodiment, the device further includes a conductive adhesive configured to bond the heat spreader material to the inner surface of the housing. In one embodiment, the device further includes electronic equipment disposed within the housing, communicating with an array of acoustic elements, the inner surface of the housing having a metallized portion that forms a shield for the electronic equipment against at least one of electromagnetic interference or high-frequency interference, the heat spreader material electrically communicates with the metallized portion via the conductive adhesive, and the heat spreader material includes part of the shield. In one embodiment, the heat sink comprises a body and a plurality of fins extending from the body, the plurality of fins being disposed between the array of acoustic elements and the body. In one embodiment, the device further includes an acoustic backing material disposed on the back surface of the array of acoustic elements, the plurality of fins being embedded within the acoustic backing material. In one embodiment, the device further includes a thermal interface material, the distal portion of the heat pipe is in thermal contact with the body of the heat sink, and the thermal interface material is disposed between the distal portion of the heat pipe and the body of the heat sink. In one embodiment, the device further includes a mounting bracket, the distal portion of the heat pipe is in thermal contact with the body of the heat sink, the distal portion of the heat pipe is coupled to the mounting bracket, and the mounting bracket is coupled to the body of the heat sink. In one embodiment, the body of the heat sink has a curved portion, and a plurality of fins extend from the curved portion such that the plurality of fins have a curved profile. In one embodiment, the heat pipe has a central portion between a proximal portion and a distal portion, the planarized profiles of the proximal and distal portions have a larger surface area for thermal contact, and the central portion has a non-planarized profile having a smaller surface area for thermal contact. In one embodiment, the device further includes electronic equipment that communicates with an array of acoustic elements and is disposed within a housing, and a spacer disposed between the electronic equipment and the heat pipe, configured to bias the proximal portion of the heat pipe closer to the inner surface of the housing than the central portion of the heat pipe. In one embodiment, the device further includes a thermal interface material disposed between the proximal portion of the heat pipe and the inner surface of the housing.In one embodiment, the device further includes an additional heat pipe, and the housing comprises a first part coupled to a second part, the proximal portion of the heat pipe being in thermal contact with the inner surface of the first part of the housing, and the proximal portion of the additional heat pipe being in thermal contact with the inner surface of the second part of the housing.

[0012] In exemplary embodiments of this disclosure, an ultrasonic imaging apparatus is provided. The apparatus comprises a housing having an outer surface and an inner surface, the outer surface being configured to be grasped by a user; an array of acoustic elements configured to transmit ultrasonic energy and receive ultrasonic echoes associated with the ultrasonic energy, the array of acoustic elements being located at the end of the housing; an acoustic backing material located on the back surface of the array of acoustic elements; and a thermal path configured to dissipate heat generated by the array of acoustic elements away from the end of the housing and to dissipate heat across at least one of the inner surface or the outer surface of the housing, the thermal path comprising a heat sink located within the housing. A heat path comprising a heat sink having a heat sink, the heat sink comprising a body and fins extending from the body toward an array of acoustic elements, the fins being embedded in an acoustic backing material, and a heat pipe having a curved shape that fits into a housing, the heat pipe comprising a proximal portion and a distal portion, and a heat spreader material disposed on the inner surface of the housing, the proximal portion of the heat pipe being in thermal contact with the body of the heat sink, the distal portion of the heat pipe being in thermal contact with the heat spreader material, and the proximal and distal portions having a flat profile having a larger surface area for thermal contact.

[0013] Further aspects, features, and advantages of this disclosure will become apparent from the following detailed description.

[0014] Exemplary embodiments of this disclosure will be described with reference to the accompanying drawings. [Brief explanation of the drawing]

[0015] [Figure 1] This is a schematic perspective view of an ultrasound imaging system including a console and an ultrasound probe according to an aspect of the present disclosure. [Figure 2] This is a partially transparent perspective view of an ultrasonic probe according to an aspect of the present disclosure. [Figure 3] This is a schematic cross-sectional side view of an ultrasonic probe according to an aspect of the present disclosure. [Figure 4] This is a schematic cross-sectional front view or rear view of the distal portion of an ultrasonic probe according to an aspect of the present disclosure. [Figure 5] This is a schematic cross-sectional front view or rear view of an ultrasonic probe according to an aspect of the present disclosure. [Figure 6] This is a schematic perspective view of a portion of an ultrasonic probe housing according to an aspect of this disclosure. [Figure 7] This is a schematic diagram of the heat path through which heat is dissipated from an ultrasonic probe according to an aspect of this disclosure. [Modes for carrying out the invention]

[0016] For the purpose of facilitating understanding of the principles of this disclosure, the principles of this disclosure will be described here with reference to embodiments shown in the drawings and using specific language. Nevertheless, it will be understood that no limitation on the scope of this disclosure is intended. Any changes and further modifications to the described apparatus, and any further applications of the principles of this disclosure, are entirely conscientious and included within this disclosure as would normally be conceived by those skilled in the art to which this disclosure relates. In particular, features, components, and / or steps described in reference to one embodiment are fully conscientious to be combined with features, components, and / or steps described in reference to other embodiments of this disclosure. However, for the sake of brevity, numerous iterations of these combinations will not be described separately.

[0017] FIG. 1 is a schematic perspective view of an ultrasonic imaging system 100 according to an aspect of the present disclosure. The ultrasonic imaging system 100 includes a console 102 and an ultrasonic probe 108. The ultrasonic imaging system 100 can be used to acquire and display ultrasonic images of anatomical structures. In some situations, the system 100 may include additional elements and / or may be implemented without one or more of the elements shown in FIG. 1.

[0018] The ultrasonic probe 108 is sized, shaped, structurally arranged, and / or otherwise configured to be placed on or near the subject's anatomical structure to visualize the anatomical structure inside the subject's body. The subject may be a human patient or an animal. The ultrasonic probe 108 may be placed on the subject's body. In some embodiments, the ultrasonic probe 108 is placed proximate to and / or in contact with the subject's body. For example, the ultrasonic probe 108 may be placed directly on and / or adjacent to the subject's body. The view of the anatomical structure shown in the ultrasonic image depends on the position and orientation of the ultrasonic probe 108. To obtain ultrasonic data of the anatomical structure, the ultrasonic probe 108 can be appropriately positioned and oriented by a user such as a physician, an ultrasound examiner, and / or other medical personnel, such that the transducer array 112 emits ultrasonic waves and receives ultrasonic echoes from the desired portion of the anatomical structure. The ultrasonic probe 108 is portable and suitable for use in a medical environment. In some cases, the ultrasonic probe 108 may be referred to as an ultrasonic imaging device, a diagnostic imaging device, an external imaging device, a trans-thoracic echocardiogram (TTE) probe, and / or a combination thereof.

[0019] The ultrasonic probe 108 includes a housing 110 that is structurally arranged, sized, shaped, and / or otherwise configured for hand-held use by a user. The housing 110 can be referred to as a handle in some examples. The proximal portion 107 of the housing 110 can be referred to as a handle in some examples. The housing 110 surrounds and protects various components of the imaging device 108, such as an electronic circuit 116 and a transducer array 112. An internal structure, such as a spatial frame for fixing various components, can be disposed within the housing 110. In some embodiments, the housing 110 includes two or more portions that are joined to each other during manufacture. The housing 110 can be formed from any suitable material, including plastic, polymer, composite material, or combinations thereof.

[0020] The housing 110 and / or the ultrasonic probe 108 includes a proximal portion 107 that terminates at a proximal end 117 and a distal portion 105 that terminates at a distal end 115. In some examples, the ultrasonic probe 108 can be described as having a proximal portion 107 and a distal portion 105. The imaging assembly of the ultrasonic probe 108, which includes the transducer array 112, is disposed in the distal portion 105. All or a portion of the imaging assembly of the ultrasonic probe 108 can define the distal end 115. The transducer array 112 can be coupled directly or indirectly to the housing 110. The operator of the ultrasonic probe 108 can contact the distal end 115 of the ultrasonic probe 108 with the patient's body such that an anatomical structure is elastically compressed. For example, the imaging assembly including the transducer array 112 can be disposed directly on or adjacent to the body of the subject. In some examples, the distal portion 105 is disposed in direct contact with the body of the subject such that the transducer array 112 is adjacent to the body of the subject.

[0021] The ultrasound probe 108 is configured to acquire ultrasound imaging data related to any appropriate anatomical structure of the patient. For example, the ultrasound probe 108 may be used to examine any number of anatomical locations and histological types, including, but not limited to, organs including the liver, heart, kidneys, gallbladder, pancreas, and lungs, nervous system structures including tubules, intestines, brain, dural sac, spinal cord, and peripheral nerves, as well as the urinary tract, and blood vessels, blood chambers or other parts of the heart, and / or valves in other systems of the body. Anatomical structures may include blood vessels such as arteries or veins in the patient's vascular system, including the cardiovascular system, peripheral vascular system, neurovascular system, renal blood vessels, and / or any other appropriate lumens in the body. In addition to natural structures, the ultrasound probe 108 may be used to examine artificial structures such as heart valves, stents, shunts, filters, and other devices, but is not limited to these.

[0022] The transducer array 112 is configured to emit an ultrasonic signal and receive an ultrasonic echo signal corresponding to the emitted ultrasonic signal. The echo signal is a reflection of the ultrasonic signal from the anatomical structures of the subject's body. The ultrasonic echo signal can be processed by electronic circuits 116 in the ultrasonic probe 108 and / or console 102 to generate an ultrasonic image. The transducer array 112 is part of the imaging assembly of the ultrasonic probe 108 and includes an acoustic window / lens and matching material on the transmitting side of the transducer array 112 and an acoustic backing material on the back of the transducer array 112. The acoustic window and matching material have acoustic properties that facilitate the propagation of ultrasonic energy from the transmitting side of the transducer array 112 in a desired direction (e.g., outward towards the patient's body). The backing material has acoustic properties that prevent or limit the propagation of ultrasonic energy from the back of the transducer array 112 in an undesirable direction (e.g., inward away from the patient's body).

[0023] The transducer array 112 can contain any number of transducer elements. For example, the array can contain between one and 10,000 acoustic elements, including values ​​such as two acoustic elements, four acoustic elements, fifteen acoustic elements, sixty-four acoustic elements, one hundred and twenty-eight acoustic elements, five hundred and twenty-two acoustic elements, three hundred and twenty-five acoustic elements, nine hundred and twenty-five acoustic elements, and / or other values ​​greater than and less than. The transducer elements of the transducer array 112 can be arranged in any suitable configuration, such as a linear array, a planar array, a curved array, a curved array, a circumferential array, a ring array, a phased array, a matrix array, a one-dimensional (1D) array, a 1.x-dimensional array (e.g., a 1.5D array), or a two-dimensional (2D) array. The array of transducer elements (e.g., arranged in one or more rows, one or more columns, and / or one or more orientations) can be controlled and activated uniformly or independently. The transducer array 112 can be configured to acquire one-dimensional, two-dimensional, and / or three-dimensional images of the patient's anatomical structure. The ultrasonic transducer elements may be piezoelectric / piezoresistive elements, piezoelectric micro-machined ultrasonic transducer (PMUT) elements, capacitive micro-machined ultrasonic transducer (CMUT) elements, and / or any other suitable type of ultrasonic transducer element.

[0024] The transducer array 112 communicates with the electronic circuit 116 (e.g., electrically coupled). The electronic circuit 116 may be any suitable passive or active electronic component, including an integrated circuit (IC), for controlling the transducer array 112 to acquire ultrasonic image data and / or process the acquired ultrasonic image data or one or more printed control boards (PCBs). For example, the electronic circuit 116 may include one or more transducer control logic dies. The electronic circuit 116 may include one or more application-specific integrated circuits (ASICs). In some embodiments, one or more of the ICs may comprise a microbeamformer (μBF), acquisition controller, transceiver, power circuit, multiplexer circuit (MUX), etc. In some embodiments, the electronic circuit 116 may include a processor, memory, gyroscope, and / or accelerometer. The electronic circuit 116 may include PCB 270 as shown. Various electrical components 272, including but not limited to resistors, capacitors, transistors, any of the aforementioned components, or any other electrical components, can be mounted on the PCB. The PCB 270 and the electronic circuit 116, including the electrical components 272, are placed inside the ultrasonic probe 108 and enclosed by the housing 110.

[0025] The ultrasonic probe 108 includes a cable 114 that provides signal communication between the console 102 and one or more components of the ultrasonic probe 108 (e.g., the transducer array 112 and / or electronic circuit 116). The cable 114 includes a plurality of conductors 120 configured to carry electrical signals between the console 102 and the ultrasonic probe 108. The conductors 120 may be bare wires surrounded by one or more layers of insulating material. The insulating material is typically a polymer-based composite material, nylon, and / or polyvinyl chloride (PVC) synthetic plastic polymer. In some embodiments, the conductors may be coaxial. The coaxial structure can use a PTFE or expanded PTFE inner dielectric and a PET or PTFE outer dielectric. For example, electrical signals representing imaging data obtained by the transducer array 112 can be transmitted from the ultrasonic probe 108 to the console 102 via the conductors 120. Control signals and / or power can be transmitted from the console 102 to the ultrasonic probe 108 via the conductors 120. Cable 114 and / or conductor 120 can provide any type of wired connection, such as any version of dedicated connection, Ethernet® connection, Universal Serial Bus (USB) connection, or any version of mini USB.

[0026] The cable 114 may also include a conduit 118 surrounding the conductor 120. The conduit 118 is formed as a tube and is used to protect and route the conductor 120 within the cable 114 of the ultrasound imaging device 108. The conduit 118 may be flexible and may be made from polymer, plastic, metal, fiber, other suitable material, and / or a combination thereof. The conduit 118 protects the conductor 120 by preventing direct exposure to external elements. The distal portion 109 of the cable 114 is coupled to the proximal portion 107 of the housing 110 of the ultrasound probe 108.

[0027] Connector 124 is located on the proximal portion 113 of cable 114. Connector 124 is configured to be detachably coupled to console 102. Signal communication between the ultrasound probe 108 and console 102 is established when connector 124 is received into the receptacle 103 of console 102. In this regard, the ultrasound probe 108 can be electrically and / or mechanically coupled to console 102. Console 102 may be referred to as a computer or computing device in some examples. Console 102 includes a user interface 104 and a display 106. Console 102 is configured to process ultrasound imaging data acquired by ultrasound probe 108 to generate ultrasound images and output them to display 106. The user can control various aspects of the acquisition of ultrasound imaging data by ultrasound probe 108 and / or the display of ultrasound images by providing inputs in user interface 104. The imaging device 108 and display 106 can be communicatively coupled to console 102 directly or indirectly.

[0028] One or more image processing steps can be completed by the console 102 and / or the ultrasonic probe 108. The console 102 and / or the ultrasonic probe 108 may include one or more processors that communicate with memory. The processors may be application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), central processing units (CPUs), digital signal processors (DSPs), other hardware devices, firmware devices, or any combination thereof configured to perform the operations described herein. In some embodiments, the memory is random-access memory (RAM). In other embodiments, the memory is cache memory (e.g., processor cache memory), magnetoresistive RAM (MRAM), read-only memory (ROM), field-programmable gate array read-only memory (PROM), erasable field-programmable gate array read-only memory (EPROM), electrically erasable field-programmable gate array read-only memory (EEPROM), flash memory, solid-state memory devices, hard disk drives, other forms of volatile and non-volatile memory, or combinations of different types of memory. In some embodiments, the memory may include non-temporary computer-readable media. Memory can store instructions. Instructions may include instructions that, when executed by the processor, cause the processor to perform the operations described herein.

[0029] While console 102 is a movable cart in the embodiment illustrated in Figure 1, it is understood that console 102 may be a mobile device (e.g., a smartphone, tablet, laptop, or personal digital assistant (PDA)) having an integrated processor, memory, and display. For example, the touchscreen of the mobile device may be the user interface 104 and display 106.

[0030] Figure 2 is a partially transparent perspective view of an ultrasonic probe 108 according to an aspect of the present disclosure. Figure 2 shows exemplary embodiments of the transducer array 112, probe housing 110, and electronic circuit 116 described above with reference to Figure 1. Furthermore, Figure 2 shows an acoustic backing material 210, a heat sink 220, a heat pipe 230, and a spacer 240.

[0031] As shown in Figure 2, the transducer array 112 can be located in the distal portion 250 of the probe housing 110 near the distal end 255, and can be of any suitable type as described with reference to Figure 1. The housing 110 also includes a proximal region 260 and a proximal end 265, as shown. The acoustic backing material 210 can be located proximal to the transducer array 112 and distal to the heat sink 220. One purpose of the acoustic backing material is to absorb acoustic energy generated by the transducer array 112 that may propagate proximal from the transducer array 112. Further features of the acoustic backing material 210 will be described in more detail with reference to Figure 3 below.

[0032] The probe housing 110 may include multiple parts. For example, as shown in Figure 2, the housing 110 may include two parts: a housing portion 110a, shown in Figure 2 as a partially transparent component, and a housing portion 110b, shown in Figure 2 as a solid component and positioned opposite portion 110a.

[0033] The heatsink 220 may be positioned near the acoustic backing material 210. The heatsink 220 may be positioned within the housing 110 so as to be located near the transducer array 112. The purpose of the heatsink 220 is to absorb the heat generated by the transducer array 112 and / or the backing material 210 and dissipate that heat to the rest of the probe 108, as will be discussed in more detail below. In some embodiments, the transducer array 112 may be constructed from piezoelectric crystals to generate acoustic energy. These piezoelectric crystals may also generate heat that can be transferred to the patient's body beyond the regulatory limits for the allowable temperature of the ultrasound probe. The transducer array 112 can be a heat source within the probe 108. In many applications, the transducer array 112 itself may not be composed of a thermally conductive material. In addition, other components within the probe, such as the acoustic lens or other materials relating to the transducer array 112, may be composed of non-thermally conductive materials (e.g., polymers or ceramics). Therefore, the heatsink 220 can be made of a thermally conductive material, which can more efficiently dissipate heat from the transducer array 112 before the probe temperature reaches an unacceptable level.

[0034] Generally, the heat pipe 230 transfers heat from a heat source, such as the transducer array 112 and / or the acoustic backing material 210, at the distal portion 250 and / or distal end 255 of the probe housing 110. The heat pipe 230 shown in Figure 2 may include a distal portion 232 and a proximal portion 234. The heat pipe 230 is sometimes referred to simply as a heat pipe. The distal portion 232 of the heat pipe 230 is mechanically and thermally coupled to the heat sink 220. The proximal portion 234 of the heat pipe 230 is mechanically and thermally coupled to the heat spreader material within the housing 110, as will be described in more detail below. The purpose of the heat pipe 230 is to efficiently transfer heat from the heat sink 220 to the heat spreader material. As shown in the figure, the heat pipe 230 may be formed in a curved shape to create space for or avoid other components within the housing 110, such as the circuit 116, PCB 270, or electrical components 272. In some embodiments, the heat pipe 230 may be shaped to bend around one or more fastening structures, such as the screw receiver 280 or other methods, parts, or components within the housing 110.

[0035] The spacer 240 may be located within the housing 110 near the proximal portion 234 of the heat pipe 230, and the proximal portion 234 of the heat pipe 230 may be biased to contact a heat spreader material which may be located on the inner surface of the housing 110. Further embodiments of the spacer 240 and the heat spreader material are described in more detail below.

[0036] It should be noted that the probe 108 may include any suitable number of heat pipes 230 in addition to the heat pipe 230 shown in Figure 2. For example, one additional heat pipe 230 may be placed within the probe 108 in a similar shape to the illustrated heat pipe 230. This additional heat pipe 230 may be placed on the opposite side of the illustrated electronic circuit 116, which will be described in more detail with reference to Figure 3. In additional embodiments, it will be apparent that the additional heat pipe 230 may be placed in contact with both the heat sink 220 and the heat spreader material by changing the various shapes, arrangements, and / or configurations of the various components within the housing 108. Any heat pipe 230 illustrated or described may be of any suitable shape.

[0037] Figure 3 is a schematic cross-sectional side view of an ultrasonic probe 108 according to an embodiment of the present disclosure. The view of the ultrasonic probe 108 in Figure 3 is along a plane defined by the x and z axes. Figure 3 shows an acoustic backing material 210 and a heatsink 220 including a heatsink body 222 and heatsink fins 226. Figure 3 further shows a transducer array 112, an acoustic lens 310, a heat pipe 230 extending into the interior of the probe housing 110, a spacer 240, a mounting bracket 320, and a mechanical screw 322. A coordinate system indicator 390 is also shown. The indicator 390 shows the x and z axes.

[0038] The acoustic backing material 210 may be positioned on the back side of the transducer array 112 of the acoustic element. The acoustic backing material 210 may also be called an absorbent material, an acoustic insulating material, or any other appropriate term. The backing material 210 may be selected to absorb the acoustic energy generated by the transducer array 112. In this way, the backing material 210 can prevent acoustic energy from propagating proximal to the transducer array 112 and / or prevent acoustic energy that could be received from the proximal direction by the transducer array 112, resulting in more accurate ultrasonic data. The acoustic backing material is composed of any suitable material, including but not limited to epoxy resin or thermoplastic resin, and may include or not include fillers to enhance the dissipation of ultrasonic energy. In some embodiments, the acoustic backing material 210 is positioned directly adjacent to the transducer array 112, so the material 210 may conform to a similar shape to the transducer array 112, but it may be any suitable shape or size. In some embodiments, heat can also be generated by the interaction between sound waves and the acoustic backing material 210, so that the acoustic backing material 210 can act as a heat source within the probe 108.

[0039] The backing material 210 is positioned distal to the heat sink 220 as shown in the figure. The heat sink 220 may further be referred to as a heat sink. The heat sink 220 may also be any suitable shape or size. The heat sink 220 may be composed of a thermally conductive material, and may be nonmetals, metals, or metallic alloys such as silver, copper, gold, aluminum nitride, silicon carbide, aluminum, tungsten, graphite, zinc, other suitable materials, and / or combinations thereof. Given a high thermal conductivity of the heat sink 220, the heat sink can efficiently transfer heat from the transducer array 112 to the heat pipe 230.

[0040] In some embodiments, the heatsink 220 may include a body 222 and several fins 226. The heatsink body 222 has a proximal region 228 and a distal region 224. The fins 226 may extend from the distal region 224 of the body 222. The heatsink 220 may include any suitable number of fins 226. The fins 226 may also be of any suitable shape, pattern, and length, or may extend from the body 222 along any suitable path. In some embodiments, the fins 226 may extend distally from the heatsink body 222 toward the transducer array 112. For example, the fins 226 may be positioned between the transducer array 112 and the heatsink body 222. The set of fins 226 of the heatsink 220 may be embedded in an acoustic backing material 210, as shown in Figure 2. The acoustic backing material 210 may surround each of the fins 226, so that all outer points of the fins 226 are in contact with the acoustic backing material. In some embodiments, the acoustic backing material 210 may be a resin cast onto the fin 226.

[0041] Since the effectiveness of the heatsink 220 depends on both the distance between the heatsink fins 226 and the transducer array, and the length of the heatsink fins 226 themselves, the acoustic backing material 210 can be selected from a highly attenuating material. For example, the attenuation of the acoustic backing material 210 may be at least 15 dB / mm or greater than 15 dB / mm. By using a highly attenuating material for the acoustic backing material 210, less material 210 is needed to sufficiently attenuate unwanted acoustic energy, and the layer of material 210 between the transducer array 112 and the heatsink body can be made thinner. A thinner layer of backing material 210 allows for shorter, and therefore more effective, heatsink fins 226. These shorter fins 226 reduce the thermal resistance between the heat source (e.g., the transducer array 112) and the body 222 of the heatsink 220. The fins 226 of the heatsink 220 may be spaced a certain distance away from the transducer array 112. The fins 226 may be positioned very close to the transducer array 112 to optimize heat dissipation from the transducer array 112. For example, the distal end of the fins 226 may be positioned within 1 mm or less of the transducer array 112.

[0042] As shown in Figure 4, the body 222 of the heatsink 220 may include a curved upper section 224. The distal end of this curved upper section 224 may have substantially the same curvature as the transducer array 112 and acoustic lens 310 of the probe 108. Figure 4 further shows a fin 226 extending distally from the curved upper section 224 within the backing material 210.

[0043] Figure 3 further illustrates the heat pipes 230. The heat pipes 230 may be configured to dissipate heat from the device 108. The cross-section of the distal portion 232 of each heat pipe 230 is shown adjacent to the proximal region 228 of the heat sink body 222 and may be in physical and / or thermal contact with the heat sink 220. A thermal interface material 312 may be placed between the distal portion 232 of the heat pipe 230 and the proximal region 228 of the heat sink 220. Similar to the heat sink 220, the heat pipes 230 may be made of a thermally conductive material. For example, the heat pipes 230 may be made of aluminum or copper with water or ammonia as the working fluid. Furthermore, the heat pipes 230 may include various components and / or structures. For example, in some embodiments, each heat pipe 230 may include an envelope forming the outside of the heat pipe 230 and made of a highly thermally conductive material. The envelope can contain a wick structure and a working fluid. The wick structure can be attached to the inner wall of the envelope and can absorb and distribute the working fluid along the heat pipe. The wick may be made of any suitable material and may be a porous metal structure including but not limited to copper, aluminum, or other materials. The working fluid in the heat pipe 230 may be distilled water. In other embodiments, the working fluid may alternatively be ammonia, nitrogen, acetone, methanol, methylamine, pentane, propylene, or any other suitable working fluid.

[0044] The heat pipe 230 may be molded such that its distal region 232 is physically and / or thermally coupled to the proximal portion 228 of the heat sink 220, as shown in Figure 3. Additional features and embodiments of the shape and positioning of the heat pipe 230 will be described in more detail with reference to Figures 4 and 5. However, as shown in Figure 3, the distal portion 232 of the heat pipe 230 can be physically contacted with the proximal portion 228 of the heat sink 220 by a mounting bracket 320. The mounting bracket 320 may be molded to allow space for the heat pipe 230 to extend close to the heat sink body 222. Thus, the heat pipe 230 can be brought into contact with the heat sink 220, and the mounting bracket 320 can then be positioned on the heat pipe and secured to the heat sink 220 via one or more mechanical screws 322. The heatsink 220 may include one or more screw holes into which one or more machine screws 322 can be received, allowing the mounting bracket 320 to make firm contact with the heat pipe 230 and / or the heatsink 220, thereby fixing or connecting the heat pipe 230 to the heatsink 220. The mounting bracket 320 may be made of the same material as the heatsink 220 and / or the heat pipe 230, or it may be made of a different material.

[0045] In some embodiments, the heat pipe 230 may be additionally or alternatively bonded to the heat sink 220 via soldering or thermally conductive epoxy. In some embodiments, the bracket 320 may be omitted. The heat pipe 230 may be mechanically and thermally bonded to the heat sink 220 and / or the bracket 320. In such embodiments, the soldering or thermally conductive epoxy may completely surround the outer surface of the distal portion 232 of the heat pipe 230, or may only be in contact with a portion of the heat pipe 230. In some embodiments, a thermal interface material may also be placed between the heat pipe 230 and the heat sink 220, as will be described in more detail with reference to Figure 4.

[0046] In the proximal portions 234, the heat pipe 230 may be pushed outward or away from the centerline or central longitudinal axis of the probe 108 by the spacer 240 shown in Figure 3. For example, in some embodiments, the proximal region 234 of the heat pipe 230 may gradually incline outward toward the housing 110 as the heat pipe 230 extends toward the heat sink 220. The spacer 240 can bring the proximal portion 234 of the heat pipe 230 into physical and / or thermal contact with the inner surface of the housing 110 and / or the heat spreader material on the inner surface of the housing 110. The spacer 240 may include an inner surface 242 positioned to face the centerline of the probe 108 and an outer surface 244 facing the outside of the probe 108. The spacer 240 may be positioned so that the heat pipe 230 is positioned away from the PCB 270 and electronic components 272 as shown. In this way, the inner surface 242 of the spacer 240 can make physical contact with the PCB 270 and the electronic components 272 mounted on the PCB 270. The outer surface 244 of the spacer 240 can make physical contact with the heat pipe 230. In this way, the spacer 240 separates the heat pipe 230 from the PCB 270 and the electronic components 272.

[0047] Figure 4 is a schematic cross-sectional front or rear view of an ultrasonic probe 108 according to an aspect of the present disclosure. Figure 4 is described in relation to Figure 5, which is a schematic cross-sectional front or rear view of an ultrasonic probe 108 according to an aspect of the present disclosure. The views of the ultrasonic probe 108 in Figures 4 and 5 are along a plane defined by the x and y axes. Figure 4 shows the distal region 250 of the probe 108 and, among other components, shows the acoustic lens 310, transducer array 112, acoustic backing material 210, heat sink 220, thermal interface material 312, heat pipe 230 having several different regions, screw receiver 280, mounting bracket 320, mechanical screw 322, PCB 270 and circuit 116 including electronic components 272, and housing 110.

[0048] As shown in Figure 4, the body 222 of the heatsink 220 has a proximal region 228 and a distal or curved region 224. The fins 226 may extend from the distal region 224 of the curved region 224 into the acoustic backing material 210 and may form a curved profile as shown by the curved dashed line in Figure 4. In other embodiments, the transducer array 112 may not form a curved profile. For example, as described with reference to Figure 1, the transducer array 112 may be linear or planar. In such embodiments, the heatsink 220 and heatsink fins 226 may not be curved but may be located near the transducer array 112 and may have a linear or planar profile.

[0049] The thermal interface material 312 may be positioned between the proximal portion 228 of the heat sink 220 and the distal outer surface of the heat pipe 230, as shown in the figure. This thermal interface material 312 may also be called a film. The material 312 may be a silicon-based material or any other suitable material. In some embodiments, the thermal interface material may include commercially available materials such as 3M Tape 8810, Berquist HF300P-0.004-00-10.5 / 250, or other materials. In some embodiments, the material 312 may be a situ-curing material. The material 312 may be a die-cut graphite sheet. The material 312 may be flexible to ensure that the heat sink 220 and the heat pipe 230 are brought into good thermal contact. The material 312 can also minimize the gap between the surface of the heat sink 220 and the heat pipe 230. With respect to the heat sink 220, the thermal interface material 312 may be positioned on the opposite side of the heat sink 220 as fins 226 of the heat sink 220.

[0050] As shown in Figure 4, the heat pipe 230 may include regions 432, 434, 436, and 438. The distal portion 232 of the heat pipe 230 between regions 432 and 434 may extend along the surface of the heat sink 220. Along this distal portion 232, the heat pipe 230 may have a flattened profile to maximize the surface area of ​​the heat pipe 230 in contact with the heat sink 220 and / or the thermal interface material 312, thereby optimizing heat transfer at this transition point. As shown in Figure 3, the cross-sectional shape of the heat pipe 230 along this portion between regions 432 and 434 may be elliptical with a flat top and bottom surface. In other embodiments, the cross-sectional shape may differ.

[0051] In region 434, the heat pipe 230 may be curved away from the heat sink 220. The heat pipe 230 may then be curved around other components such as the circuit 116, or other structures or components within the probe 108. Along this curve between region 434 and region 436 or along the central portion 233, the heat pipe 230 does not have to be flattened. The cross-sectional shape of the heat pipe 230 may be substantially circular from region 434 to region 436. Alternatively, the cross-sectional shape may differ. Since the cross-sectional shape of the heat pipe 230 is circular in the central region 233, the surface area of ​​the central portion 233 is smaller than the surface area of ​​the heat pipe 230 in either the distal region 232 or the proximal region 234.

[0052] The heat pipe 230 extending from region 436 to region 438 along the proximal portion 234 of the heat pipe to region 532 shown in Figure 5 may have a flat profile similar to the distal region 232 extending from region 432 to region 434. For example, the cross-sectional shape of the heat pipe 230 from region 436 to region 532 (Figure 5) may be similar to the cross-sectional shape from region 432 to region 434, for example, an ellipse with a flat top and bottom, or any other suitable shape. This flattening from region 436 to region 532 (Figure 5) can maximize the surface area of ​​the heat pipe 230 that comes into contact with the heat spreader material and / or the inner wall of the housing 110, thereby optimizing heat transfer at this junction.

[0053] The probe housing 110 may include an inner surface 610 and an outer surface 620, as shown in Figures 5 and 6. The heat spreader material 550 shown in Figure 5 may be bonded to the inner surface 610 of the housing 110. Figure 5 also includes a coordinate system indicator 490, again indicating the x and y axes. In some embodiments, the housing 110 may include two structures (e.g., two halves), part 110a and part 110b, which are joined together, as described with reference to Figure 2, as well as housing part 110b shown in Figure 6. The housing 110 may completely or partially enclose one or more of the components discussed herein. The heat spreader material 550 may be bonded to the inner surfaces of each housing part that together form the housing 110. In this way, one end of the heat pipe 230 shown in Figure 3 can be in physical and / or thermal contact with one heat spreader material 550 of one housing structure, and the other heat pipe 230 in Figure 3 can be in physical and / or thermal contact with the other heat spreader material 550 of the other housing structure.

[0054] The heat spreader material 550 may be configured to efficiently dissipate heat. The element 550 may be composed of a thermally conductive material such as a pyrolytic graphite sheet. The element 550 may also be composed of any other suitable material such as copper, aluminum including, for example, aluminum 1100, or other material having high thermal conductivity, other suitable planar thermally conductive material, and / or a combination thereof. The heat spreader material 550 may also be called a heat spreader, heat sink, heat spreader material, or any other suitable term. The heat spreader material 550 may be laminated on the inner surface of the housing 110. For example, an adhesive may be placed on one side of the heat spreader material 550 that is positioned in contact with the inner surface 610 of housing portions 110a and / or 110b. The element 550 may be of any suitable size or shape. The element 550 may conform to the inner contour of the housing 110. The element 550 may be configured to be as large as possible, or to contact as much of the largest surface area of ​​the inner surface of the housing 110 as possible, in order to optimize heat transfer from the element 550 to the housing 110 and subsequently to the external environment.

[0055] The thermal interface material 520 may be placed between the proximal region 234 of the heat pipe 230 and the heat spreader material 550 with which the pipe 230 is in physical and / or thermal contact. In some embodiments, this thermal interface material 520 is thermally conductive and facilitates heat transfer between the heat pipe 230 and the heat spreader material 500, similar to how the thermal interface material 312, described with reference to Figure 4, facilitates heat transfer between the distal portion 232 of the heat pipe 230 and the proximal portion 228 of the heat sink 220. In some embodiments, the thermal interface material 520 may be substantially the same as the thermal interface material 312. In other embodiments, the thermal interface 520 may be different from the thermal interface material 312. The thermal interface materials 520 and / or 312 may also be called gap-filling paste, thermal interface paste, gap-filling material, filler material, interface material, or any other appropriate term.

[0056] In some embodiments, the thermal interface material 520 may be a gap-filling paste applied between the proximal portion 234 of the heat pipe 230 (e.g., from region 438 to region 532 of the pipe 230) and the heat spreader material 550. The thermal interface material 520 may be thermally conductive. In some embodiments, the material 520 may have adhesive properties for fixing the proximal portion 234 of the heat pipe 230 to the heat spreader material 550. In some embodiments, after the spacer 240 is positioned adjacent to the heat pipe 230 during assembly, and before the housing structures 110a and 110b are seated together and enclose the internal components, the spacer 240 can be biased outward so that the proximal region 234 of the heat pipe 230 protrudes outward along the z-axis more than the housing 110 allows. As a result, the act of seating the two structures 110a and 110b of the housing 110 on the assembly pushes the proximal region 234 of the heat pipe inward along the z-axis, compressing the spacer 240 and thus applying pressure to the heat pipe 230, forming secure contact with the heat spreader 550. As the spacer 240 brings the proximal region 234 of the heat pipe 230 into closer contact with the heat spreader material 550, the thermal interface paste 520 flows and displaces, resulting in a larger area where the proximal region 234 of the heat pipe 230 can contact the thermal decomposition heat spreader 550. One purpose of the thermal interface material 520 may be to fill any gap between the heat pipe 230 and the spreader 550 in order to maximize heat transfer. Any appropriate amount of thermal interface material 520 can be placed between the pipe 230 and the spreader 550. In some embodiments, a thermal interface material approximately 3 to 4 mm thick is placed between the proximal portion 234 of the pipe 230 and the heat spreader 550.

[0057] Figure 5 further illustrates the aforementioned spacer 240. As shown in Figure 3, one spacer 240 may be positioned inside each proximal portion 234 of the heat pipe 230. In this way, a single heat pipe can be positioned between one spacer 240 and one heat spreader 550. In some embodiments, the spacer 240 may include two separate structures. The thickness of the spacer 240 may be minimum in the distal region 242 of the spacer 240, and the thickness may increase in the proximal direction, such that the spacer is maximum in the proximal region 244 of the spacer 240. In this way, the spacer 240 can form a wedge-shaped structure. In any configuration, the spacer 240 can bias the proximal portion 234 of the heat pipe 230 closer to the inner surface of the housing 110 than the central portion 233 of the heat pipe 230. The central portion 233 is sometimes referred to as the curved portion.

[0058] Figure 6 is a schematic perspective view of a portion of an ultrasonic probe housing 110 according to an aspect of the present disclosure. Figure 6 shows one structure that may be included in the housing 110 of the probe 108, or may be half of the structure forming the housing 110. Shown bonded to the inner surface of the housing 110 is a heat spreader material 550. As previously stated, the heat spreader material 550 may be laminated to the inner surface of the housing 110, or bonded by any other suitable means. The spreader 550 may be configured to maximize the contact surface area between the spreader 550 and the inner surface of the housing 110, and therefore may extend as far along the inner surface of the housing 110 as possible. The outer surface of the housing 110 shown may be configured to be grasped by a user of the ultrasonic system 100.

[0059] The heat spreader film 550 may be die-cut from a bulk pyrolysis graphite sheet (PGS) having an integrated pressure-sensitive adhesive (PSA) on one side and a laminated protective PET film on the other side. The shape and relief cut of the heat spreader 550 may be configured to maximize surface area contact with the inner surface of the transducer housing 110. One heat spreader 550 may be applied to the inner surfaces of both left and right housing halves 110 to eliminate or minimize wrinkles while maximizing the wetting area to the housing 110.

[0060] To supplement the EMI RFI shielding of the transducer probe 108, the PGS sheet of the heat spreader 550 may be electrically shielded by metallizing the inner surface of the transducer housing using conductive paint or metal plating and utilizing conductive PSA adhesive on the PGS film. The housing 110 can form an electrical and / or magnetic shield for the electronic equipment 116 within the probe 108. This shield may include various conductive components arranged along the inner or outer surface of the housing 110. This shield can prevent various electromagnetic or high-frequency signals from altering the performance of various components within the probe 108. In some embodiments, the PGS sheet of the heat spreader 550 may be integrated into this shield or may be a component of this shield. In some embodiments, the heat spreader may be die-formed metal foil.

[0061] In some embodiments, the heat spreader material 550 may be attached to the inner surface of the housing 110 using a conductive PSA adhesive, which enables the PGS to be part of the EMI RFI shielding circuit. In other embodiments, the heat spreader material 550 does not need to be attached with a conductive PSA adhesive. Rather, a thin, flexible, non-conductive adhesive can be used. A thin, non-conductive adhesive may still allow electrical contact between the PGS sheet and the conductive coating and / or plating on the inner surface of the housing (part of the EMI RFI shielding circuit) when the PGS film is sufficiently wetted to the housing. The inner surface of the housing 110 may further include a metallized portion that forms a shield for the electronic equipment 116 in the probe 108 against electromagnetic and / or high-frequency interference. The heat spreader 550 can be electrically communicated with this metallized portion of the housing 110. This can be done using a conductive adhesive or by any other suitable means. Once the heat spreader 550 is bonded to the housing 110, the heat spreader 550 can form part of the electromagnetic shield. In some embodiments, the heat spreader material 550 may be a single material sheet or many material sheets. Some of the sheets may overlap completely or partially to form the heat spreader material 550.

[0062] Figure 7 is a schematic diagram of a heat path 700 through which heat can be dissipated from the ultrasonic probe 108, according to an aspect of this disclosure. It should be noted that any component or step along the described heat path 700 may be modified and / or combined with other steps.

[0063] Heat can be generated by the transducer array 112, the matching layer, the acoustic lens 310, the acoustic backing material 210, or various other components within the probe 108. The heat generated by the transducer array 112 can be partially absorbed by the acoustic backing material 210, which is located directly behind the transducer array 112. The heat generated by the transducer array can then be transferred to the fins 226 of the heatsink 220. The heat can then pass through the heatsink 220 and be transferred to the heat pipe 230, which is in physical and / or thermal contact with the heatsink 220 via the thermal interface material 312. The heat can then pass through the heat pipe to the heat spreader material 550. The heat may also pass through the thermal interface material 520. The heat may also, or alternatively, pass through layers of thermal interface material as previously described with reference to Figure 5. The heat can then be transferred from the heat spreader material 550 to the inner and / or outer surfaces of the probe housing 110, and from there to the ambient environment. In this way, heat is dissipated from the distal surface of the ultrasound probe 108, keeping the surface temperature, which may often be in physical contact with the patient's skin, within any regulated temperature limits.

[0064] Those skilled in the art will recognize that the above-described apparatus, systems, and methods can be modified in various ways. Accordingly, those skilled in the art will understand that the embodiments contained herein are not limited to the specific exemplary embodiments described above. In this regard, while exemplary embodiments have been shown and described, a wide range of modifications, changes, and substitutions are contemplated in the foregoing disclosure. It will be understood that such modifications can be made without departing from the claims.

Claims

1. An ultrasonic imaging device, A housing comprising an outer surface and an inner surface, wherein the outer surface is configured to be grasped by a user, An array of acoustic elements configured to transmit ultrasonic energy and receive ultrasonic echoes associated with the ultrasonic energy, wherein the array of acoustic elements is located at the end of the housing, A heat sink is disposed within the housing and configured to receive heat generated by the array of acoustic elements, A heat pipe disposed within the housing and configured to transfer heat away from the ends of the housing, wherein the heat pipe comprises a proximal portion and a distal portion, A heat spreader material is disposed on the inner surface of the housing and configured to dissipate the heat. It has, The distal portion of the heat pipe is in thermal contact with the heat sink, and the proximal portion of the heat pipe is in thermal contact with the heat spreader material. The heat pipe comprises a central portion between the proximal portion and the distal portion, the proximal portion and the distal portion having a flattened cross-sectional profile having a surface area for thermal contact, and the central portion having a non-flattened cross-sectional profile for thermal contact having a surface area smaller than the surface area of ​​the proximal portion and the distal portion. Ultrasound imaging device.

2. The apparatus according to claim 1, wherein the heat pipe has a bent shape.

3. The apparatus according to claim 1 or 2, wherein the heat spreader material comprises pyrolysis graphite.

4. The apparatus according to any one of claims 1 to 3, further comprising a conductive adhesive configured to bond the heat spreader material to the inner surface of the housing.

5. The housing further comprises electronic equipment that communicates with the array of acoustic elements and is located within the housing. The inner surface of the housing is provided with a metallized portion that forms a shield for the electronic device against at least one of electromagnetic interference or high-frequency interference. The heat spreader material communicates electrically with the metallized portion via the conductive adhesive, such that the heat spreader material comprises the shield portion. The apparatus according to claim 4.

6. The apparatus according to any one of claims 1 to 5, wherein the heat sink comprises a main body and a plurality of fins extending from the main body, and the plurality of fins are arranged between the array of acoustic elements and the main body.

7. The apparatus according to claim 6, further comprising an acoustic backing material disposed on the back surface of the array of acoustic elements, wherein the plurality of fins are embedded within the acoustic backing material.

8. Further equipped with thermal interface material, The distal portion of the heat pipe is in thermal contact with the body of the heat sink. The thermal interface material is disposed between the distal portion of the heat pipe and the body of the heat sink. The apparatus according to claim 6 or 7.

9. With additional mounting brackets, The distal portion of the heat pipe is in thermal contact with the body of the heat sink. The distal portion of the heat pipe is connected to the mounting bracket. The mounting bracket is connected to the body of the heat sink. The apparatus according to any one of claims 6 to 8.

10. The body of the heat sink has a curved portion, The plurality of fins extend from the curved portion such that the plurality of fins have a curved profile. The apparatus according to any one of claims 6 to 9.

11. The array of acoustic elements communicates with the electronic equipment located within the housing, A spacer is positioned between the electronic device and the heat pipe and configured to bias the proximal portion of the heat pipe closer to the inner surface of the housing than the central portion of the heat pipe. The apparatus according to any one of claims 1 to 10, further comprising the above.

12. The apparatus according to any one of claims 1 to 11, further comprising a thermal interface material disposed between the proximal portion of the heat pipe and the inner surface of the housing.

13. Equipped with even more heat pipes, The housing comprises a first portion which is coupled to a second portion, The proximal portion of the heat pipe is in thermal contact with the inner surface of the first portion of the housing. The proximal portion of the further heat pipe is in thermal contact with the inner surface of the second portion of the housing. The apparatus according to any one of claims 1 to 12.

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