Resin sheets, containers, carrier tapes, and electronic component packaging

A polystyrene-based resin sheet with specified mechanical properties addresses deformation issues in carrier tapes for miniaturized components, enhancing moldability and preventing pickup failures.

JP7875943B2Active Publication Date: 2026-06-18DENKA CO LTD

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
DENKA CO LTD
Filing Date
2023-03-02
Publication Date
2026-06-18

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Abstract

This resin sheet includes a base sheet containing a polystyrene resin, and has a maximum puncture elastic modulus of 2.4-6.4 MPa as calculated by the following procedure. Calculation procedure for maximum puncture elastic modulus: a measurement sample is fixed to a flat jig having a hole with a diameter of 1.0 mm in the center, the load L (N) and the strain amount ε in the piercing direction when a cylindrical needle with a flat tip and a diameter of 0.8 mm pierces the surface of the measurement sample perpendicularly at a speed of 0.5 mm / min are measured, and the maximum puncture elastic modulus is set as the value at which the ratio of the stress difference and the strain amount difference calculated using the formula (ΔL / S) / Δε (in the formula, S indicates the area (mm2) of the tip surface of the needle) is maximum at 0.1 ≤ ε ≤ 5.0.
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