Silver powder, method for manufacturing silver powder, silver powder manufacturing apparatus, and resin-curing conductive paste

Silver powder with controlled particle size and shrinkage properties, produced using a specific method, addresses the issues of high resistivity and printability in low-temperature firing, improving conductive paste performance for solar cell electrodes.

JP7876020B2Active Publication Date: 2026-06-18DOWA ELECTRONICS MATERIALS CO LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
DOWA ELECTRONICS MATERIALS CO LTD
Filing Date
2025-02-26
Publication Date
2026-06-18

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Abstract

To provide a silver powder capable of imparting excellent volume resistivity and fine line printability to a conductive paste.SOLUTION: The present invention relates to a silver powder having a volume-based cumulative 50% diameter D50 of 0.1-1.0 μm as measured by laser diffraction, a ratio of D50 to BET diameter DBET of 1.3 or less, and a shrinkage rate of at least 1% at 200°C as measured by thermomechanical analysis.SELECTED DRAWING: Figure 5
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