Metal surface pattern processing apparatus, metal surface pattern processing method

Abstract

To realize hairline processing with high designability on a metallic surface.SOLUTION: A metallic surface pattern processing apparatus comprises: a polishing head 60 which includes a polishing tool 80 and a motor 72 for spindle; a movement device which holds the polishing head 60 and a surface WH of a metallic component W in a relatively-movable manner; and a control device which controls the movement device. In a relative coordinate system with a plane being a processing object of the surface WH as an X-Y plane, the control device comprises: a spindle inclination processing unit which relatively inclines a spindle 74 with a Z-axis as a reference; a Z-axis movement processing unit which relatively moves the polishing tool 80 and the surface WH in a Z-axis direction to bring them into contact with each other; and an X-Y plane movement processing unit which relatively moves the surface WH and the polishing head 60 along the X-Y plane in such a state that the polishing tool 80 in which the spindle is relatively inclined is brought into contact with the surface WH. Consequently, a fan-like hairline pattern H is formed by the rotation of the polishing tool 80, in a band-like polishing object region G formed on the surface WH.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to a metal surface pattern processing apparatus for performing pattern processing on a metal surface and the like.

Background Art

[0002] Conventionally, in order to enhance the appearance of the surface of a metal part (workpiece), a hairline-like pattern has been formed on the surface. For example, in the hairline processing machine of Patent Document 1, a structure is disclosed in which a sanding belt is brought into contact with a workpiece conveyed by a conveyor and the surface of the workpiece is polished to form a hairline-like pattern.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, since the conventional hairline processing machine is limited to forming a hairline-like pattern on a straight line extending in the same direction over the entire surface of the workpiece, there is a problem that it is difficult to enhance the design property of the metal surface.

[0005] The present invention has been made in view of such circumstances, and an object thereof is to provide a metal surface pattern processing apparatus capable of realizing hairline processing with high design property on a metal surface.

Means for Solving the Problems

[0006] As a result of intensive studies by the present inventors, part or all of the above problems are achieved by the following means.

[0007] In other words, the present invention, which solves the problem, is a metal surface pattern processing apparatus for processing the surface of a metal to form a pattern, comprising: a polishing tool for polishing the surface to form a hairline pattern; a polishing head equipped with a spindle that rotatably holds the polishing tool and a spindle motor for rotating the spindle; a moving device that holds the polishing head and the surface so as to be able to move relative to each other; and a control device for controlling the moving device, wherein when a specific direction along the plane of the surface is defined as the X-axis, a direction along the plane perpendicular to the X-axis is defined as the Y-axis, the plane co-plane with the surface is defined as the XY plane, and a direction perpendicular to the X-axis and Y-axis is defined as the Z-axis, the moving device is controlled The control device comprises a spindle tilting processing unit that tilts the spindle relative to the main spindle with respect to the Z axis; a Z-axis movement processing unit that moves the polishing tool and the surface relative to each other in the Z-axis direction to bring the polishing tool and the surface into contact; and an XY plane movement processing unit that moves the surface and the polishing head relative to each other along the XY plane while the main spindle is tilted relative to each other and the polishing tool and the surface are in contact. The metal surface pattern processing apparatus is characterized in that a fan-shaped hairline pattern is formed on the surface by the rotation of the polishing tool within a band-shaped polished area formed on the surface by the relative movement of the polishing tool along the XY plane.

[0008] In relation to the metal surface pattern processing apparatus described above, the direction of relative movement of the polishing head in the XY plane by the XY plane movement processing unit is defined as the XY plane movement direction, and the side of the spindle closest to the surface is defined as the proximal end, and the side opposite the proximal end is defined as the distal end. The spindle tilt processing unit may be characterized by tilting the spindle relative to the proximal end in the XY plane such that the displacement direction of the distal end with respect to the proximal end in the XY plane (hereinafter referred to as the spindle tilt direction) contains a component in the opposite direction to the XY plane movement direction (hereinafter referred to as the XY plane anti-movement direction).

[0009] In relation to the metal surface pattern processing apparatus described above, the spindle tilting processing unit may be characterized by tilting the spindle relative to the spindle such that the spindle tilt direction coincides with the anti-movement direction of the XY plane.

[0010] In relation to the metal surface pattern processing apparatus described above, the relative movement direction of the polishing head in the XY plane by the XY plane movement processing unit is defined as the XY plane movement direction, and the side of the spindle closest to the surface is defined as the proximal end and the side opposite the proximal end is defined as the distal end. The spindle tilt processing unit may be characterized by tilting the spindle relative to the proximal end in the XY plane such that the displacement direction of the distal end with respect to the proximal end in the XY plane (hereinafter referred to as the spindle tilt direction) contains a component of the XY plane movement direction.

[0011] In relation to the metal surface pattern processing apparatus described above, the spindle tilting processing unit may be characterized in that, while the spindle is tilted relative to the main spindle, the XY plane movement processing unit moves the polishing tool and the surface relative to each other in the XY plane movement direction, while the Z-axis movement processing unit gradually brings the polishing tool and the surface closer together, or the XY plane movement processing unit moves the polishing tool and the surface relative to each other in the XY plane movement direction, while the spindle tilting processing unit gradually increases the amount of tilt of the main spindle, thereby gradually increasing the width of the polished area formed on the surface.

[0012] In relation to the metal surface pattern processing apparatus described above, the spindle tilting processing unit may be characterized by tilting the spindle relative to the Z-axis such that the tilt angle of the spindle with respect to the Z-axis is greater than 0 degrees and 45 degrees or less.

[0013] In relation to the metal surface pattern processing apparatus described above, the spindle tilting processing unit may be characterized by tilting the spindle relative to the Z-axis such that the tilt angle of the spindle with respect to the Z-axis is greater than 0 degrees and 15 degrees or less.

[0014] In relation to the metal surface pattern processing apparatus described above, when defining the area of ​​the polishing tool that can come into contact with the surface as the polishing surface, and defining the circular or annular rotational trajectory formed by the rotation of the polishing surface by the spindle as the polishing surface rotational trajectory, the spindle tilting processing unit and the Z-axis movement processing unit of the control device may be characterized in that, during polishing, a portion of the polishing surface rotational trajectory separates from the surface.

[0015] In relation to the metal surface pattern processing apparatus described above, when defining the outermost diameter of the polishing surface rotation trajectory with respect to the central axis of the main spindle as the polishing outer diameter, it may be characterized in that the contact width between the polishing surface rotation trajectory and the surface when the polishing surface rotation trajectory is viewed from a direction parallel to the XY plane and perpendicular to the main spindle tilt direction is set to one-quarter or more of the polishing outer diameter.

[0016] In relation to the metal surface pattern processing apparatus described above, the contact width may be set to one-third or more of the polishing outer diameter.

[0017] In relation to the metal surface pattern processing apparatus described above, the contact width may be set to be at least half of the polishing outer diameter.

[0018] In relation to the metal surface pattern processing apparatus described above, the contact width may be set to 9 / 10 or less of the polishing outer diameter.

[0019] In relation to the metal surface pattern processing apparatus described above, the contact width may be set to be 5 / 6 or less of the polishing outer diameter.

[0020] In relation to the metal surface pattern processing apparatus described above, the contact width may be set to three-quarters or less of the polishing outer diameter.

[0021] In relation to the metal surface pattern processing apparatus described above, the XY plane moving processing unit may be characterized in that it moves the surface and the polishing head relative to each other so that a part of the second polishing region is superimposed on a part of the first polishing region, thereby causing the hairline pattern in the first polishing region and the hairline pattern in the second polishing region to come into contact with the surface.

[0022] In relation to the metal surface pattern processing apparatus described above, the XY plane moving processing unit includes a reference direction moving processing unit that moves the surface and the polishing head relative to each other so as to include a component in a predetermined direction (hereinafter referred to as the reference direction) in the XY plane, thereby forming a strip-shaped polished region in the reference direction on the surface, and a counter-reference direction moving processing unit that, after processing by the reference direction moving processing unit, moves the surface and the polishing head relative to each other so as to include a component in the direction opposite to the reference direction (hereinafter referred to as the counter-reference direction) in the XY plane, thereby forming a strip-shaped polished region in the counter-reference direction that partially overlaps with the polished region in the reference direction, and is characterized in that both the hairline pattern in the polished region in the reference direction and the hairline pattern in the polished region in the counter-reference direction remain on the surface.

[0023] In relation to the metal surface pattern processing apparatus described above, the XY plane moving processing unit includes a first reference direction moving processing unit that moves the surface and the polishing head relative to each other so as to include a component in a predetermined direction (hereinafter referred to as the reference direction) in the XY plane, thereby forming a strip-shaped first reference direction polished region on the surface, and a second reference direction moving processing unit that, after processing by the first reference direction moving processing unit, moves the surface and the polishing head relative to each other so as to include a component in the reference direction in the XY plane, thereby forming a strip-shaped second reference direction polished region that partially overlaps with the first reference direction polished region, wherein both the hairline pattern in the first reference direction polished region and the hairline pattern in the second reference direction polished region remain on the surface.

[0024] In relation to the above-described metal surface texture processing apparatus, the abrasive tool may include an abrasive portion composed of an abrasive material that contacts the surface, and a flexible portion that supports the abrasive portion from behind, and the flexible portion may be deformed when the abrasive portion contacts the surface.

[0025] In relation to the above-described metal surface texture processing apparatus, the polishing head may include a base supported by the moving device, and a spindle displacement mechanism that displaces at least the spindle and the abrasive tool in the axial direction of the spindle with respect to the base.

[0026] In relation to the above-described metal surface texture processing apparatus, the spindle displacement mechanism may have a biasing mechanism that biases the abrasive tool toward the surface.

[0027] In relation to the above-described metal surface texture processing apparatus, the moving device may be an articulated robot.

[0028] In relation to the above-described metal surface texture processing apparatus, the articulated robot may have at least five-axis joints.

[0029] The present invention, which solves the above problems, is a metal surface pattern processing method for forming a pattern on a metal surface by processing the surface of a metal surface using a metal surface pattern processing apparatus, wherein the metal surface pattern processing apparatus comprises a polishing tool for polishing the surface to form a hairline pattern, a polishing head equipped with a spindle that rotatably holds the polishing tool and a spindle motor for rotating the spindle, and a moving device that holds the polishing head and the surface so that they can move relative to each other, wherein a specific direction along the plane of the surface is the X-axis, a direction along the plane perpendicular to the X-axis is the Y-axis, the plane co-plane with the plane is the XY plane, and perpendicular to the X-axis and Y-axis. The method for processing metal surface patterns is characterized in that, when the direction in which the Z axis is defined is the Z axis, the main spindle and the polishing tool are tilted relative to each other with respect to the Z axis; the surface is moved relative to the main spindle in the Z axis direction to bring the polishing tool and the surface into contact; and with the main spindle tilted relative to the polishing tool and the surface in contact, the surface and the polishing head are moved relative to each other along the XY plane, and a fan-shaped hairline pattern is formed on the surface by the rotation of the polishing tool within a band-shaped polished area formed on the surface by the relative movement of the polishing tool along the XY plane.

[0030] In relation to the above-described metal surface pattern processing method, the method may also be characterized by forming a coating film on the surface on which the hairline pattern is formed.

[0031] In relation to the above-described metal surface pattern processing method, the method may also be characterized by adjusting the relative position between the hairline pattern and the pattern formed on the coating film.

[0032] In relation to the above-described metal surface pattern processing method, the coating film may be characterized by having a wood grain pattern. [Effects of the Invention]

[0033] According to the present invention, it is possible to achieve the excellent effect of realizing a highly aesthetic hairline finish on a metal surface. [Brief explanation of the drawing]

[0034] [Figure 1](A) is a front view showing the overall structure of a metal surface pattern processing apparatus according to an embodiment of the present invention, (B) is a diagram showing a coordinate system that defines the operating direction of the metal surface pattern processing apparatus, and (C) is a diagram showing the absolute coordinate system and the relative coordinate system. [Figure 2] (A) is a magnified front view showing the polishing head of the metal surface pattern processing apparatus, (B) is a magnified side view showing the polishing head, and (C) and (D) are front views showing modified versions of the polishing tool for the polishing head. [Figure 3] This is a block diagram showing the internal configuration of the control device for the metal surface pattern processing machine. [Figure 4] This is a block diagram showing the functional configuration (program configuration) of the control device for the metal surface pattern processing apparatus. [Figure 5] (A) is a side view showing the processing of a metal component by the polishing head of the metal surface pattern processing apparatus, and (B) is a plan view of the same processing configuration as (A) but with the polishing head omitted. [Figure 6] (A), (B), and (C) are plan views showing the processing of a metal component by the polishing head of the metal surface pattern processing apparatus, with the polishing head omitted. [Figure 7] (A), (B), and (C) are plan views showing the processing of a metal component by the polishing head of the metal surface pattern processing apparatus, with the polishing head omitted. [Figure 8] (A) and (B) are plan views showing a metal component processed by the polishing head of the metal surface pattern processing apparatus, with the polishing head omitted. [Figure 9] (A) and (B) are plan views showing modified examples of the processing method of a metal component by the polishing head of the metal surface pattern processing apparatus, with the polishing head omitted. [Figure 10] (A) and (B) are plan views showing modified examples of the metal surface pattern processing apparatus using the polishing head, with the polishing head omitted. [Figure 11] (A) and (B) are plan views showing modified examples of the processing method of a metal component by the polishing head of the metal surface pattern processing apparatus, with the polishing head omitted. [Figure 12] (A) is a magnified side view showing the polishing head of the metal surface pattern processing apparatus, and (B) is a magnified side view showing a modified version of the polishing head. [Figure 13] This is a plan view showing a metal component processed by the metal surface pattern processing device. [Figure 14] (A) is a front view showing the overall structure of a modified metal surface pattern processing apparatus, and (B) is a plan view showing the bed and metal components of the same metal surface pattern processing apparatus. [Figure 15] This is a front view showing the overall structure of the metal surface pattern processing apparatus for the modified example. [Figure 16] This is a magnified side view showing the polishing head of a metal surface pattern processing apparatus according to a modified example. [Modes for carrying out the invention]

[0035] Embodiments of the present invention will be described below with reference to the accompanying drawings. Figure 1(A) shows the overall configuration of the metal surface pattern processing apparatus 1 of this embodiment. The metal surface pattern processing apparatus 1 polishes the surface (workpiece surface) WH of a metal member W to form a hairline pattern. The metal member W is, for example, a plate material with a thickness of 1 mm to 50 mm, but the present invention is not limited thereto, and patterns can be formed on the surface WH of metal members W of various shapes.

[0036] The metal surface pattern processing apparatus 1 includes a bed 10 on which a metal member W is placed, a moving device 20, a polishing head 60 moved by the moving device 20, and a control device 100 that controls the moving device 20 and the polishing head 60.

[0037] (Coordinate axes)

[0038] For the sake of explanation, we will use an absolute coordinate system Qa and a relative coordinate system Qs here. The absolute coordinate system Qa is a coordinate system in which the top surface 12 of the fixed bed 10 is the XY plane. The relative coordinate system Qs is a coordinate system in which the virtual plane K, which is perpendicular to the perpendicular line of the currently being processed area (processing area R) on the surface WH of the metal member W, is the XY plane.

[0039] As shown in Figure 1(B), a predetermined direction within the virtual plane K in the relative coordinate system Qs is called the X-axis, the direction perpendicular to the X-axis within the same virtual plane K is called the Y-axis, and the direction perpendicular to both the X-axis and the Y-axis is called the Z-axis. Furthermore, the rotation direction around the X-axis in the relative coordinate system Qs is called the X-axis tilt Mx, the rotation direction around the Y-axis is called the Y-axis tilt My, and the rotation direction around the Z-axis is called the Z-axis tilt Mz. As shown in Figure 1(C), the workpiece surface WH may be a three-dimensional curved surface when viewed as a whole. When viewed from the absolute coordinate system Qa, the relative coordinate system Qs is displaced in accordance with the changes in the virtual planes K1, K2, and K3 of the workpiece area R1, R2, and R3 during the polishing process on the workpiece surface WH. In other words, the relative coordinate system Qs is a coordinate system that changes three-dimensionally with respect to the absolute coordinate system Qa. By storing data relating to the difference between the absolute coordinate system Qa and the relative coordinate system Qs (specifically, surface shape data of the workpiece surface WH), the relative coordinate system Qs can be transformed into the absolute coordinate system Qa. Furthermore, as shown in Figure 1(A), when the surface WH and the top surface 12 are parallel planes, the relative coordinate system Qs can be transformed into the absolute coordinate system Qa using only the data of the plate thickness (Z-direction difference value) of the metal member W.

[0040] (bed)

[0041] Returning to Figure 1(A), the bed 10 is a so-called mounting platform, on which the metal member W is placed. The metal member W is surrounded by a jig plate 14 of approximately the same thickness, and this jig plate 14 is fixed to the top surface 12. As a result, the planar movement of the top surface 12 on the metal member W is restricted by the jig plate 14. In addition to or instead of the jig plate 14, the metal member W can also be fixed by attraction by applying negative pressure to the top surface 12 of the bed 10. Similarly, the metal member W can also be fixed magnetically by applying magnetic force to the top surface 12 of the bed 10. Furthermore, the metal member W can also be clamped and fixed by providing a chuck on the top surface 12 of the bed 10.

[0042] The mobile device 20 is a multi-joint robot having at least five joints, and in this case, a six-axis multi-joint robot. The absolute coordinate system Qa is used in the description of the multi-joint robot. In detail, the mobile device 20 has a base 22, a first arm 24, a second arm 26, a third arm 28, a fourth arm 30, a hand 32, and a chuck 34. The base 22, which is fixed to the floor or the like, and the first arm 24 are connected by a first joint 23 having a rotation axis parallel to the Z-axis direction. This first joint 23 becomes the rotation axis in the Z-axis direction, which allows the first arm 24 to rotate along the XY plane. The first arm 24 and the second arm 26 are connected by a second joint 25 having a rotation axis parallel to the XY plane (in this case, a horizontal rotation axis). The second joint 25 allows the second arm 26 to function as a forearm that swings in the front-back direction. The second arm 26 and the third arm 28 are connected by a third joint 27 having a rotation axis parallel to the XY plane (in this case, a horizontal rotation axis). The third joint 27 allows the third arm 28 to function primarily as an upper arm that swings vertically. The third arm 28 and the fourth arm 30 are connected by a fourth joint 29 having a rotation axis parallel to the direction C1 in which both arms extend. The fourth joint 29 allows the fourth arm 30 to function primarily as a wrist swivel that twists relative to the third arm 28. The fourth arm 30 and the hand portion 32 are connected by a fifth joint 31 having a rotation axis perpendicular to the direction C1 in which the fourth arm 30 extends. The fifth joint 31 allows the hand portion 32 to function as a wrist bending portion that swings vertically relative to the fourth arm 30. The hand portion 32 and the chuck portion 34 are connected by a sixth joint 33 having a rotation axis parallel to the direction C2 in which both extend. The sixth joint 33 allows the chuck portion 34 to function as a wrist rotation portion that rotates relative to the hand portion 32 (wrist bending portion). The chuck portion 34 also serves as a gripping portion for holding the polishing head 60.

[0043] The moving device 20 controls the first joint 23, second joint 25, third joint 27, fourth joint 29, fifth joint 31, and sixth joint 33 on the absolute coordinate system Qa, thereby enabling the relative movement of the polishing head 60 and the metal member W in the X-axis, Y-axis, and Z-axis directions of the relative coordinate system Qs, as shown in Figure 1(B). Furthermore, the moving device 20 can displace the polishing head 60 and the metal member W in the X-axis tilt Mx direction, Y-axis tilt My direction, and Z-axis tilt Mz direction of the relative coordinate system Qs. In this embodiment, the case in which the polishing head 60 is displaced relative to all of the X-axis tilt Mx direction, Y-axis tilt My direction, and Z-axis tilt Mz direction is illustrated, but since the polishing head 60 has a built-in spindle 74, the relative displacement in the Z-axis tilt Mz direction can be omitted. Furthermore, in this embodiment, we have illustrated the case where the articulated robot, which serves as the mobile device 20, achieves all relative movement. However, it is also possible to incorporate some or all of the functions of the mobile device 20 into the bed 10.

[0044] (Polishing head)

[0045] As shown in enlarged view in Figures 2(A) and (B), the polishing head 60 includes a chuck portion 62, a base 64, a polishing tool side displacement mechanism 66, a biasing mechanism 86, a polishing tool side base 70, a spindle motor 72, a spindle 74, and a polishing tool 80.

[0046] The base 64 is composed of a member that has an L-shape when viewed from the side. In detail, the base 64 has a base portion 64A to which the chucked portion 62 is fixed, and a guide portion 64B that is continuous with the base portion 64A and on which the abrasive tool side displacement mechanism 66 is installed. The guide portion 64B is integrated with the base portion 64A and extends from the base portion 64A in the axial direction (attachment / detachment direction) of the chucked portion 62 and away from the chucked portion 62.

[0047] The chucked portion 62 is detachably gripped by the chuck portion 34 of the moving device 20. By making the chuck portion 34 electrically or air-driven, the polishing head 60 may be automatically attached and detached (replaced) by the control device 100 described later. In this embodiment, the attachment / detachment direction P of the chucked portion 62 and the axial direction J of the spindle 74 are shown as examples, but the present invention is not limited to this. For example, as shown in Figure 16, the attachment / detachment direction P of the chucked portion 62 and the axial direction J of the spindle 74 may be perpendicular.

[0048] The abrasive tool-side displacement mechanism 66 employs a linear guide and comprises a rail 66A fixed to the guide portion 64B of the base 64 and a carriage 66B that slides along the rail 66A. The carriage 66B is fixed to the back of the abrasive tool-side base 70. The abrasive tool-side displacement mechanism 66 guides the base 64 and the spindle 74 relative to each other in the direction of the linear guide (in this case, coinciding with the axial direction J of the spindle 74). The abrasive tool-side displacement mechanism 66 is provided with a stopper 67 that can engage with the abrasive tool-side base 70, and the stopper 67 engages with the abrasive tool-side base 70 when the abrasive tool 80 protrudes the most relative to the base 64 (hereinafter referred to as the abrasive tool maximum protrusion position) (see Figure 2(B)).

[0049] While this example illustrates the use of linear guides, the displacement mechanism is not limited to this. For example, various linear mechanisms capable of reciprocating motion, such as rack and pinion mechanisms, ball spline mechanisms, piston-crank mechanisms, and cylinder mechanisms, can be employed.

[0050] The spindle 74 is rotatably held via a bearing (not shown) fixed to the bearing base 70A of the polishing tool side base 70. In the spindle 74, the side closer to the surface WH of the metal member W being polished is referred to as the proximal end 74A, and the side opposite to this proximal end 74A is referred to as the distal end 74B. The polishing tool 80 is coaxially fixed to the proximal end 74A of the spindle 74. The spindle motor 72 is fixed to the polishing tool side base 70 and rotates the spindle 74. Here, the spindle motor 72 is shown as directly coupled to the spindle 74 via a coupling (not shown) or the like for rotational drive; however, it may be indirectly connected via gears or a belt.

[0051] In this embodiment, the biasing mechanism 86 is composed of a coil spring 86A, and biases the polishing tool 80 from the base 64 toward the linear motion axis (axial direction J of the main shaft 74) and toward its protruding side (towards the proximal end 74A of the main shaft 74). Specifically, the biasing mechanism 86 (coil spring 86A) is installed in a compressed state (a state in which a restoring force is generated in the coil spring 86A) between the base 64A of the base 64 and the receiving portion 70B of the polishing tool side base 70. As a result, even when no external force from the metal member W is acting on the polishing tool 80, a biasing force is generated between the receiving portion 70B of the polishing tool side base 70, so that the maximum protruding position of the polishing tool 80, in which it protrudes the most, is maintained. In other words, in the maximum protruding position of the polishing tool shown in Figure 2(B), a force (hereinafter referred to as the reference axial force) is applied to the polishing tool 80 in the direction of the tip (towards the proximal end of the main spindle 74) in the linear motion axis direction (axial direction J of the main spindle 74), including the biasing force from the biasing mechanism 86. This reference axial force also includes the axial J component of the weight of the main spindle 74, the polishing tool 80, the polishing tool side base 70, and the main spindle motor 72, in addition to the biasing force from the biasing mechanism 86.

[0052] On the other hand, when the moving device 20 presses the polishing head 60 against the metal member W, an external force (axial reaction force) with an axial direction J greater than the reference axial force acts on the polishing tool 80 from this metal member W. In this case, the polishing tool side displacement mechanism 66 displaces the main spindle 74 so that it retracts from the maximum protruding position of the polishing tool (see Figure 5(A)). This retraction amount L is automatically adjusted to a point where it balances the axial force acting on the main spindle 74 in the protruding direction, which is increased by the biasing force of the biasing mechanism 86 (coil spring 86A) by the amount of retraction L, and the axial reaction force from the metal member W. During machining, it is preferable to control the retraction amount L to be greater than 0.

[0053] Returning to Figure 2(A), the biasing mechanism 86 further includes a force adjustment section 86B for variably adjusting the biasing force. In this embodiment, the force adjustment section 86B is a screw-shaped displacement member that screws into the base 64 (base portion 64A). By rotating the screw, the amount of protrusion of the displacement member relative to the base 64 (base portion 64A) can be adjusted, thereby changing the amount of compression of the coil spring 86A. As a result, the reference axial force can be adjusted. In this embodiment, the case in which a compression coil spring is used as the biasing mechanism 86 is illustrated, but the present invention is not limited to this, and various spring mechanisms such as tension coil springs, torsion coil springs, leaf springs, disc springs, and torsion bars can be used. In addition to spring mechanisms, biasing can also be performed using elastic materials such as rubber.

[0054] The polishing tool 80 comprises a polishing section 82 that is worked with by an abrasive material in contact with the surface WH of the metal member W, and a flexible section 84 that is flexible and supports the polishing section 82 from the rear in the axial direction J. The polishing section 82 has a polishing surface 82A that is in contact with the metal member W, and hairline finishing is performed by the relative movement of the polishing surface 82A with the surface WH of the metal member W. Hairline finishing of the surface WH of the metal member W by the polishing tool 80 can be done dry or wet, but in this embodiment, the dry method is used. The polishing section 82 can be selected from, for example, abrasive paper, abrasive cloth (including nonwoven fabric), abrasive disc (abrasive plate), abrasive belt, abrasive brush, etc., but other abrasive materials can be used as long as they can finish the surface WH with a hairline finish.

[0055] The flexible portion 84 is an elastically deformable resin pad. Examples of resin pads include rubber pads, urethane pads, and sponge pads. Although not specifically shown here, a multi-layer structure may be created by providing flexible pads and / or non-flexible pads (e.g., metal pads) with different rigidities on the rear side of the flexible portion 84. The polishing portion 82 can be held by the flexible portion 84 using, for example, hook-and-loop fasteners (Velcro® fasteners), double-sided tape, or fixing jigs (not shown).

[0056] As shown in Figure 5(A), when an external force (axial reaction force) from the metal member W acts on the flexible portion 84, part or all of the flexible portion 84 deforms. The deformation (displacement) of the flexible portion 84 occurs dynamically while the polishing tool 80 is rotating on the main shaft 74. As a result, the polishing surface 82A of the polishing portion 82 also deforms (displaces) dynamically. In this embodiment, the rotational movement trajectory when the polishing surface 82A rotates and is dynamically displaced is defined as the "polishing surface rotation trajectory E".

[0057] Furthermore, although not specifically illustrated here, the polishing section 82 itself may be integrally constructed from a material that is deformable or expandable (flexible) in the axial direction. In that case, the polishing section 82 will also serve as part or all of the flexible section 84.

[0058] Furthermore, as shown in Figure 2(C), when the polishing part 82 is a polishing brush (e.g., a wire brush), the polishing surface 82A becomes a virtual surface formed by connecting the tips of the brush. At the same time, since the polishing brush itself is flexible, the polishing part 82 also serves as part or all of the flexible part 84. In that case, the rear of the polishing brush can be supported by a non-flexible pad 85 (e.g., a metal pad). Also, as shown in Figure 2(D), when the polishing part 82 is a polishing belt supported by a pair of rollers and rotated by a motor, the polishing surface 82A may be a curved surface. The polishing surface 82A can also be deformed by making the rollers flexible. Moreover, although the present invention exemplifies the case where the polishing tool 80 has a flexible part 84, the present invention is not limited to this, and the polishing surface 82A may not be flexible.

[0059] (Control device)

[0060] Figure 3 shows an example of the configuration of the control device 100. The control device 100 is connected to the moving device 20 and the polishing head 60 by an electrical communication path. In detail, the control device 100 includes a first joint drive unit 23A that drives the first joint 23, a first joint sensor 23B that detects the amount of drive of the first joint 23, a second joint drive unit 25A that drives the second joint 25, a second joint sensor 25B that detects the amount of drive of the second joint 25, a third joint drive unit 27A that drives the third joint 27, a third joint sensor 27B that detects the amount of drive of the third joint 27, a fourth joint drive unit 29A that drives the fourth joint 29, and a fourth joint sensor 2 9B is connected to and controls the following: a fifth joint drive unit 31A that drives the fifth joint 31, a fifth joint sensor 31B that detects the amount of drive of the fifth joint 31, a sixth joint drive unit 33A that drives the sixth joint 33, a sixth joint sensor 33B that detects the amount of drive of the sixth joint 33, a fifth joint drive unit 31A that drives the fifth joint 31, a fifth joint sensor 31B that detects the amount of drive of the fifth joint 31, a spindle motor 72 that drives the spindle 74, and a spindle sensor 72B that detects the amount of rotation of the spindle 74. The joint drive unit is a motor and motor driver, and the joint sensor and spindle sensor are encoders that detect the amount of rotation of the motor.

[0061] The control device 100 is a so-called computer and includes a CPU 141, RAM 142, ROM 143, input device 144, display device 145, memory 146, power supply 147, input / output interface 148, and bus 149.

[0062] The CPU 141 is the so-called central processing unit, where various programs are executed to perform various functions. The RAM 142 is so-called RAM (Random Access Memory) and is used as the working area for the CPU 141. The ROM 143 is so-called ROM (Read-Only Memory) and stores the basic OS and various programs (for example, measurement programs) executed by the CPU 141.

[0063] The input device 144 is a button, touch panel input key, keyboard, or mouse, used to input various types of information. The display device 145 is a display that shows programs or the progress of work processes. The memory 146 stores various data as needed. The power supply 147 supplies power for each component to operate. The input / output interface 148 is connected to the telecommunication path of the moving device 20 and the polishing head 60, and outputs control signals and receives detection signals transmitted from each sensor. The bus 149 is a wiring that connects the CPU 141, RAM 142, ROM 143, input device 144, display device 145, memory 146, power supply 147, input / output interface 148, etc., as an integrated unit for communication.

[0064] (Control program and processing method)

[0065] The basic OS and various programs (control programs) stored in ROM 143 are executed by CPU 141, and the control device 100 implements the functional blocks shown in Figure 4, thereby performing metal surface processing.

[0066] Specifically, the control device 100 includes a spindle tilt processing unit 260, a Z-axis movement processing unit 262, an XY plane movement processing unit 264, and a spindle rotation processing unit 266.

[0067] The spindle rotation unit 266 rotates the spindle 74. The spindle tilt unit 260 tilts the spindle 74 relative to the Z-axis at a relative angle α in the relative coordinate system Qs (see Figure 5(A)). The Z-axis movement unit 262 moves the polishing tool 80 and the surface WH of the metal member W in a direction that includes the Z-axis component of the relative coordinate system Qs, bringing the polishing tool 80 into contact with the surface WH. It is preferable that the spindle 74 is tilted by the spindle tilt unit 260 and then rotated by the spindle rotation unit 266 before the polishing tool 80 and surface WH come into contact by the Z-axis movement unit 262.

[0068] The XY plane movement processing unit 264 moves the polishing tool 80 and the surface WH, which are inclined relative to the main spindle 74 at a relative angle α, in a movement direction along the XY plane of the relative coordinate system Qs (hereinafter referred to as the XY plane movement direction Kf). The movement speed is preferably 30 mm / second or more, and more preferably 50 mm / second. On the other hand, the movement speed is preferably 300 mm / second or less, and more preferably 150 mm / second or less. Furthermore, it is preferable to control the movement speed at a constant speed.

[0069] As shown in Figure 5(B), the above functional blocks create a band-shaped relative movement trajectory (polished area G) between the polished surface 82A along the XY plane and the surface WH of the metal member W. Within this polished area G, a continuous fan-shaped (partially arc-shaped) hairline pattern H is formed by the rotation of the polishing tool 80.

[0070] The functional blocks will be described in more detail. The spindle tilt processing unit 260 has an anti-movement direction tilt processing unit 260A and a movement direction tilt processing unit 260B. As shown in Figures 5(A) and (B), the anti-movement direction tilt processing unit 260A tilts the spindle 74 at an angle α in the XY plane of the relative coordinate system Qs such that the displacement direction of the distal end 74B relative to the proximal end 74A of the spindle 74 (hereinafter referred to as the spindle tilt direction T) contains a component in the opposite direction to the XY plane movement direction Kf (hereinafter referred to as the XY plane anti-movement direction Kb). In particular, in this embodiment, the spindle 74 is tilted relative to the XY plane such that the spindle tilt direction T perfectly coincides with the XY plane anti-movement direction Kb. As shown in Figure 6(A), with respect to the relative coordinate system Qs, the XY plane movement direction Kf can change along the movement trajectory, so the XY plane anti-movement direction Kb also changes in conjunction. As a result, the spindle tilt direction T, which perfectly matches the anti-movement direction Kb in the XY plane, also changes dynamically along the movement trajectory. By controlling the tilt in this way, the width Gw1 of the polished area G can always be kept uniform, even if the movement direction Kf in the XY plane changes.

[0071] The present invention is not limited to Figure 6(A). For example, as shown in Figure 6(B), the spindle tilt direction T may contain a component in the opposite direction to the XY plane movement direction Kf (hereinafter referred to as the XY plane counter-movement direction Kb), but the tilt control may be such that the spindle tilt direction T and the XY plane counter-movement direction Kb do not coincide in part or all of the polishing area G. Specifically, the spindle tilt direction T may include a component in the direction perpendicular to the XY plane counter-movement direction Kb (the band width direction). Assuming that the overall tilt angle with respect to the Z axis is the same in Figure 6(A) and Figure 6(B), in the case of Figure 6(B), the tilt component of the XY plane counter-movement direction Kb in the overall tilt angle decreases, and the tilt component in the band width direction increases. Accordingly, the horseshoe-shaped / bow-shaped contact surface B (details will be described later) of the polishing tool 80 rotates in the spindle tilt direction T. As a result, it becomes possible to actively reduce the width Gw2 of the polished area G compared to the width Gw1, while also biasing this width Gw2 to one side in the width direction. Furthermore, as shown in Figure 6(C), the more the inclination component in the width direction included in the overall inclination angle is increased, the smaller this width Gw2 can be made. In other words, the spindle tilting processing unit 260 can freely control the width of the polished area by appropriately controlling the overall inclination angle and the ratio of the inclination component in the XY plane counter-movement direction Kb to the inclination component in the width direction.

[0072] As shown in Figure 7(A), the movement direction tilt processing unit 260B tilts the main spindle 74 by an angle α such that the displacement direction of the distal end 74B relative to the proximal end 74A of the main spindle 74 (hereinafter referred to as the main spindle tilt direction T) contains a component in the same direction as the XY plane movement direction Kf in the XY plane of the relative coordinate system Qs. In particular, in this embodiment, the main spindle 74 is tilted relative to the XY plane so that the main spindle tilt direction T is in perfect agreement with the XY plane movement direction Kf.

[0073] As shown in Figure 7(B), when the relative inclination of the spindle 74 is large, the width Gw1 of the polished area G becomes small; when the relative inclination of the spindle 74 is medium, the width Gw2 of the polished area G becomes medium; and when the relative inclination of the spindle 74 is small, the width Gw3 of the polished area G becomes large. Therefore, as shown in Figures 7(B) and (C), when the spindle 74 is moved in the XY plane movement direction Kf by the XY plane movement processing unit 264, if the movement direction inclination processing unit 260B gradually decreases the inclination of the spindle at the same time, the width of the polished area G can be gradually increased. Furthermore, although not specifically shown here, when the spindle 74 is moved in the XY plane movement direction Kf, if the movement direction inclination processing unit 260B gradually increases the inclination of the spindle at the same time, the width of the polished area G can be gradually decreased. Here, we illustrate a case where the spindle tilt is gradually decreased and increased, but the present invention is not limited to this. The Z-axis movement processing unit 262 may also increase or decrease the width of the polished area G by gradually increasing the area of ​​the actual contact surface B by gradually reducing the distance between the surface WH and the polishing surface 82A, or by gradually decreasing the area of ​​the actual contact surface B by gradually increasing the distance between the surface WH and the polishing surface 82A. Furthermore, the anti-movement direction tilt processing unit 260A can also change the width of the polished area G by gradually decreasing and increasing the tilt amount or gradually increasing the distance between the surface WH and the polishing surface 82A when the spindle 74 moves in the XY plane movement direction Kf.

[0074] Returning to Figure 5(A), the spindle tilting section 260 is set so that the tilt angle α of the spindle 74 with respect to the Z axis is greater than 0 degrees and 45 degrees or less. Preferably, the tilt angle α is set to 15 degrees or less, and even more preferably, the tilt angle α is set to 5 degrees or less. On the other hand, it is preferable to set the tilt angle α to be greater than 1 degree. In this way, an aesthetically pleasing fan-shaped hairline pattern H can be formed.

[0075] Furthermore, through the cooperation of the spindle tilting section 260 and the Z-axis movement section 262, the relative position of the polishing head 60 and the surface WH is maintained such that, during polishing, a portion of the polishing surface rotation trajectory E moves away from the surface WH of the metal member W. Specifically, the edge E1 in the XY plane movement direction Kf of the polishing surface rotation trajectory E is moved away from the surface WH of the metal member W. At the same time, the edge E2 in the opposite direction to edge E1 of the polishing surface rotation trajectory E is pressed most strongly against the surface WH.

[0076] In this case, as shown in Figures 5(A) and (B), the control device 100 can define the actual contact surface B as the range in which a part of the polishing surface rotation trajectory E is in contact with the surface WH when viewed from a direction parallel to the XY plane of the relative coordinate system Qs and perpendicular to the spindle tilt direction T (hereinafter referred to as the tilt-orthogonal direction). This actual contact surface B approximates a shape with a part of a circle missing (a horseshoe shape). When the polishing surface rotation trajectory E is projected onto the XY plane of the relative coordinate system Qs, if the maximum diameter in the spindle tilt direction T is defined as the polishing outer diameter V, the contact width Bw when the actual contact surface B is viewed from the tilt-orthogonal direction is set to be at least one-quarter of the polishing outer diameter V. Preferably, the contact width Bw is set to be at least one-third of the polishing outer diameter V, and even more preferably, the contact width Bw is set to be at least half of the polishing outer diameter V. On the other hand, the control device 100 sets the contact width Bw to 9 / 10 or less of the polishing outer diameter V, preferably to 5 / 6 or less of the polishing outer diameter, and even more preferably to 3 / 4 or less of the contact width Bw.

[0077] As described above, in this embodiment, by setting the relative angle α to be greater than 0 degrees and the contact width Bw to be 9 / 10 or less of the polishing outer diameter V, a beautiful partially arc-shaped hairline pattern that is concave mainly along the XY plane movement direction Kf can be formed. Specifically, as shown in Figure 5(B), the surface pressure acting on the actual contact surface B is weakest at edge B1 on the XY plane movement direction Kf side and strongest at edge B2 on the opposite side. Since the polishing surface rotation trajectory E moves in the XY plane movement direction Kf relative to the surface WH, the actual contact surface B passing over the surface WH superimposes a hairline pattern that is gradually made deeper from the shallow unevenness on edge B1 side, and finally a vivid hairline pattern is formed by edge B2, which is the final polishing contact point.

[0078] Furthermore, if the relative angle α is set to 0 degrees or less, or if the entire rotational trajectory E of the polishing surface is set to the actual contact surface B, the edge G1 in the XY plane movement direction Kf of the circular actual contact surface B will come into contact, resulting in the superposition of both a convex fan-shaped hairline pattern along the XY plane movement direction Kf and a concave fan-shaped hairline pattern formed by the opposite edge G2. As a result, these patterns will mix together and will not form a coherent pattern. Additionally, if the relative angle α exceeds 45 degrees, or if the contact width Bw becomes less than one-quarter of the polishing outer diameter V, the edge G2 will come into local contact with the surface WH of the metal member W. This results in an extremely small band width Gw of the polished area G, reducing polishing efficiency and making the hairline pattern unstable, thus degrading its appearance.

[0079] Returning to the functional block in Figure 4, the XY plane movement processing unit 264 moves the polishing head 60 relative to a portion of the second polishing region that is formed afterward, so that it overlaps a portion of the first polishing region formed on the surface WH. As a result, the hairline pattern in the first polishing region and the hairline pattern in the second polishing region come into contact on the surface WH of the metal member W. This partial overlap polishing is set by the movement path of the polishing tool 80 by the XY plane movement processing unit 264.

[0080] Specifically, the XY plane movement processing unit 264 comprises a first reference direction movement processing unit 264A, a second reference direction movement processing unit 264B, a first anti-reference direction movement processing unit 264C, and a second anti-reference direction movement processing unit 264D. As shown in Figure 8(A), when a predetermined direction in the XY plane of the relative coordinate system Qs is defined as the reference direction Nf, and the direction directly opposite to the reference direction Nf is defined as the anti-reference direction Nb, the first reference direction movement processing unit 264A and the second reference direction movement processing unit 264B move the surface WH and the polishing head 60 relative to each other along the XY plane movement directions Kfa and Kfb which include the reference direction Nf component, thereby forming strip-shaped first and second reference direction polishing regions Gfa and Gfb on the surface WH.

[0081] Furthermore, the first anti-reference direction movement processing unit 264C and the second anti-reference direction movement processing unit 264D move the surface WH and the polishing head 60 relative to each other in the XY plane movement directions Kfc and Kfd, which include the anti-reference direction Nb component, to form strip-shaped first and second anti-reference direction polishing regions Gbc and Gbd on the surface WH.

[0082] In this case, the chronological execution procedure of the program is, for example, in the order of first reference direction movement processing unit 264A, first reverse reference direction movement processing unit 264C, second reference direction movement processing unit 264B, and second reverse reference direction movement processing unit 264D. In the first reverse reference direction movement processing unit 264C, the first reverse reference direction polishing region Gbc is superimposed on a part M1 of the already formed first reference direction polishing region Gfa. In this embodiment, the other side edge (lower side in the figure) of the strip shape of the first reference direction polishing region Gfa is superimposed on one side edge (upper side in the figure) of the first reverse reference direction polishing region Gbc. As a result, both the fan-shaped hairline pattern H in the first reference direction polishing region Gfa and the fan-shaped hairline pattern H in the first reverse reference direction polishing region Gbc remain on the surface WH of the metal member W, and they come into contact with each other to form an S-shaped hairline pattern.

[0083] Furthermore, in the second reference direction movement processing unit 264B, the second reference direction polishing region Gfb is superimposed on a portion M2 of the already formed first inverse reference direction polishing region Gbc. In this embodiment, the other side edge (lower side in the figure) of the strip shape of the first inverse reference direction polishing region Gbc is superimposed on one side edge (upper side in the figure) of the second reference direction polishing region Gfb. As a result, both the fan-shaped hairline pattern H in the first inverse reference direction polishing region Gbc and the fan-shaped hairline pattern H in the second reference direction polishing region Gfb are left on the surface WH of the metal member W, making it possible to form an S-shaped hairline pattern.

[0084] Furthermore, in the second anti-reference direction movement processing unit 264D, the second anti-reference direction polishing region Gbd is superimposed on a portion M3 of the already formed second reference direction polishing region Gfb. In this embodiment, the other side edge (lower side in the figure) of the strip shape of the second reference direction polishing region Gfb is superimposed on one side edge (upper side in the figure) of the second anti-reference direction polishing region Gbd. As a result, both the fan-shaped hairline pattern H in the second reference direction polishing region Gfb and the fan-shaped hairline pattern H in the second anti-reference direction polishing region Gbd remain on the surface WH of the metal member W, making it possible to form an S-shaped hairline pattern.

[0085] In the control example above, the first reference direction movement processing unit 264A, the first reverse reference direction movement processing unit 264C, the second reference direction movement processing unit 264B, and the second reverse reference direction movement processing unit 264D are shown to be superimposed in that order, but the present invention is not limited thereto. For example, as shown in Figure 8(B), the first reference direction movement processing unit 264A and the second reference direction movement processing unit 264B may be executed first to form the first and second reference direction polishing regions Gfa and Gfb with a gap between them, and then the first reverse reference direction movement processing unit 264C and the second reverse reference direction movement processing unit 264D may be executed to form the first and second reverse reference direction polishing regions Gbc and Gbd that superimpose on these.

[0086] Figure 9(A) shows modified control configurations of the first reference direction movement processing unit 264A and the second reference direction movement processing unit 264B. In this configuration, the second reference direction movement processing unit 264B, which is executed after the first reference direction movement processing unit 264A, superimposes the second reference direction polishing region Gfb with a portion M1 of the already formed first reference direction polishing region Gfa. In this embodiment, the other side edge (lower side in the figure) of the strip shape of the first reference direction polishing region Gfa and the one side edge (upper side in the figure) of the second reference direction polishing region Gfb are superimposed. As a result, it is possible to retain both the fan-shaped hairline pattern H in the first reference direction polishing region Gfa and the fan-shaped hairline pattern H in the second reference direction polishing region Gfb on the surface WH of the metal member W. The first reference direction movement processing unit 264A and the second reference direction movement processing unit 264B may be repeated while moving in the strip width direction.

[0087] Furthermore, as shown in the modified example in Figure 9(B), it is also preferable that in the second reference direction movement processing unit 264B, the polishing start point of the second reference direction polishing region Gfb is shifted by a predetermined amount Nw in the reference direction Nf from the polishing start point of the first reference direction polishing region Gfa. By repeating the superposition process of the first and second reference direction movement processing units 264A and 264B, a scale-like hairline pattern can be formed. In addition, the same control as in Figures 9(A) and 9(B) can be achieved in the first reverse reference direction movement processing unit 264C and the second reverse reference direction movement processing unit 264D.

[0088] Furthermore, Figures 8 and 9 illustrate a case in which the first reference direction movement processing unit 264A, the second reference direction movement processing unit 264B, the first anti-reference direction movement processing unit 264C, and the second anti-reference direction movement processing unit 264D move relative to each other in directions parallel to each other, i.e., in directions that coincide with the reference direction Nf or the anti-reference direction Nb, thereby overlapping the side edges of the strip-shaped polished area. However, the present invention is not limited to this.

[0089] For example, in Figure 10(A), the first reference direction movement processing unit 264A moves the surface WH and the polishing head 60 relative to each other along the XY plane movement direction Kfa, which coincides with the reference direction Nf, to form a strip-shaped first reference direction polished region Gfa on the surface WH. Meanwhile, the first anti-reference direction movement processing unit 264C moves the surface WH and the polishing head 60 relative to each other along the XY plane movement direction Kfc, which includes the anti-reference direction Nb component but is not parallel to it, to form a strip-shaped first anti-reference direction polished region Gbc on the surface WH. As a result, the first anti-reference direction movement processing unit 264C can form the first anti-reference direction polished region Gbc non-parallel to the already formed first reference direction polished region Gfa, thereby intersecting a portion of it M1.

[0090] Similarly, in Figure 10(B), for example, in the second reference direction movement processing unit 264B, which is executed after the first reference direction movement processing unit 264A, the second reference direction polishing region Gfb can be extended non-parallel to the already formed first reference direction polishing region Gfa, while including the component of the reference direction Nf, thereby intersecting a portion of the first reference direction polishing region M1.

[0091] Furthermore, while the control examples in Figures 8 to 10 illustrate cases where the first reference direction movement processing unit 264A, the second reference direction movement processing unit 264B, the first inverse reference direction movement processing unit 264C, and the second inverse reference direction movement processing unit 264D move the polishing head 60 relatively in a linear manner, the present invention is not limited thereto. For example, in Figure 11(A), the first reference direction movement processing unit 264A moves the polishing head 60 relatively in a meandering or sawtooth manner in the direction Kfa which includes a component of the reference direction Nf, thereby forming a band-shaped polished region Gfa in the first reference direction on the surface WH. Also, the first inverse reference direction movement processing unit 264C moves the polishing head 60 relatively in a meandering or sawtooth manner in the direction Kbc which includes a component of the inverse reference direction Nb, thereby forming a band-shaped polished region Gbc in the first inverse reference direction on the surface WH. By shifting the phases of the meandering or sawtooth movements relative to each other, the polished region Gfa in the first reference direction and the polished region Gbc in the first inverse reference direction can be periodically made to intersect.

[0092] Similarly, in Figure 11(B), for example, the first reference direction movement processing unit 264A moves the polishing head 60 in a meandering or sawtooth manner relative to the surface WH in the direction Kfa which contains a component of the reference direction Nf, thereby forming a band-shaped polished area Gfa in the first reference direction on the surface WH. The second reference direction movement processing unit 264B also moves the polishing head 60 in a meandering or sawtooth manner relative to the surface WH in the direction Kfb which contains a component of the reference direction Nf, thereby forming a band-shaped polished area Gfb in the second reference direction on the surface WH. By shifting the phases of the meandering or sawtooth movements relative to each other, the polished area Gfa in the first reference direction and the polished area Gfb in the second reference direction can be made to intersect periodically. When light from a light source (e.g., a point light source) is shone onto this periodically intersecting fan-shaped hairline pattern, dot-like reflective dots arranged at intervals in the reference direction Nf are visually formed on the surface WH, and these reflective dots move depending on the viewing angle. As a result, an extremely beautiful appearance can be created.

[0093] Incidentally, as already explained in Figure 1(C), the surface WH of the metal member W is not necessarily flat. For example, even if a metal plate is used as the metal member W, the thickness of the plate may not be uniform throughout, or the metal plate may be curved. In this embodiment, as shown in Figure 12(A), even if the surface WH of the metal member W fluctuates in the Z-axis direction with respect to the absolute coordinate system Qa, the polishing tool 80 can be displaced in the Z-axis direction to follow the surface WH of the metal member W by the polishing tool side displacement mechanism 66 and biasing mechanism 86 in the polishing head 60. As a result, it is possible to form a stable hairline pattern H while omitting follow-up control on the moving device 20 side, thereby improving aesthetics.

[0094] In this embodiment, a coil spring or the like is used as the biasing mechanism 86 as an example, but the present invention is not limited thereto. For example, Figure 12(B) shows a case where a cylinder mechanism operated by air pressure or hydraulic pressure is used as the biasing mechanism 86. When using a cylinder mechanism, the biasing force can be dynamically changed during hairline processing by controlling the air pressure or hydraulic pressure adjustment device with the control device 100. In addition, an electrically operated mechanism such as an electromagnetic solenoid or a linear motor can be used as the biasing mechanism 86, and the biasing force can be generated and adjusted by power control.

[0095] As described above, the metal surface pattern processing apparatus 1 of this embodiment polishes the surface WH of the metal member W while tilting the main spindle 74 relative to it in a predetermined direction, thereby stably forming a fan-shaped hairline pattern. In particular, in this embodiment, the XY plane movement processing unit 264 of the control device 100 can overlap the band-shaped polished areas G formed on the surface WH. As a result, for example, as shown in Figure 13(A), it is possible to form a fan-shaped hairline pattern over the entire surface WH of the plate-shaped metal member W without leaving any area untouched, thereby providing an extremely aesthetically pleasing surface decoration, and the metal member W can be used as a decorative building material for walls, floors, ceilings, etc.

[0096] Furthermore, as shown in Figure 13(B), it is preferable to further form a coating film TM on the hairline pattern of the surface WH of the plate-shaped metal member W using a printing device such as an inkjet printer. The coating film TM preferably includes a design (pattern) using opaque color ink or light-transparent color ink. In this case, it is even more preferable to adjust the position (positioning) of the hairline pattern and the design (pattern) on the coating film TM using the printing device. In this embodiment, it is desirable to form the coating film TM over the entire surface of the metal member W. This allows the gloss, which changes depending on the viewing angle due to the hairline pattern of the surface WH, and the design freely drawn on the coating film TM to be superimposed based on appropriate position adjustment, thereby creating a highly aesthetic design. Furthermore, since the adhesion of the coating film TM is improved by the hairline pattern of the surface WH, the advantage of the coating film TM being less likely to peel off is also obtained.

[0097] In particular, it is preferable that the coating film™ includes a wood grain design, for example, one that contains at least a portion of a light-transparent color ink. Actual wood (solid wood) has an uneven surface formed by fine fibers on its cut surface, and the appearance changes depending on whether light is shone parallel to the fiber direction or perpendicular to the fiber direction. The hairline pattern on the surface WH can substitute for the role of this unevenness in the fiber direction of the wood. Decorations such as the annual rings of wood can be depicted by the design (pattern) of the coating film™. Moreover, the coating film™ can reduce (absorb) the excessive glossiness of the hairline pattern on the metal component, thus creating a unique glossiness similar to that of wood. Note that the coating film is not limited to the above example, and for example, a coating film made by firing a vitreous glaze at high temperature, such as enamel, may also be used.

[0098] As an example of the application of the metal surface pattern processing apparatus 1 of this embodiment, as shown in Figure 14(A), a surface shape measuring device 300 may be provided to measure the position in the Z-axis direction of the surface WH of the metal member W and the inclination angle of the surface WH, with respect to the absolute coordinate system Qa. The surface shape measuring device 300 may be, for example, a laser distance meter such as a LIDAR that measures the distance to the surface WH non-contact multi-point by irradiating the surface WH with a laser and measuring the scattered light. Alternatively, by attaching a touch probe 400 to the moving device 20 instead of the polishing head 60, the moving device 20 itself can be used as the surface shape measuring device 300. In this case, the position in the Z-axis direction of the surface WH of the metal member W is measured by bringing the touch probe 400 into contact with a plurality of measurement points D as shown in Figure 14(B). The surface shape data measured by the surface shape measuring device 300 is stored in the memory 146 of the control device 100, and is reflected in the coordinate transformation processing units of the spindle tilt processing unit 260, Z-axis movement processing unit 262, and XY plane movement processing unit 264 of the control device 100 (i.e., coordinate transformation processing of the relative coordinate system Qs based on the absolute coordinate system Qa). Even if the surface shape measuring device 300 is not present, if the three-dimensional shape data of the surface WH of the metal member W is known, the same coordinate transformation processing can be achieved by storing that three-dimensional shape data in the memory 146.

[0099] Furthermore, if the metal member W is a plate member or the like, and its surface WH is guaranteed to be parallel to the XY plane of the absolute coordinate system Qa, then the XY plane of the absolute coordinate system Qa and the XY plane of the relative coordinate system Qs will always be parallel, and the relative difference in the Z axis will be equivalent to the plate thickness. In this case, the surface shape measuring device 300 can be omitted by storing only the plate thickness data in memory 146 or by reflecting it in the program.

[0100] Furthermore, while this embodiment illustrates a case where a single polishing head 60 (single polishing tool 80) is used to create a hairline finish on the surface WH of a metal member W, the present invention is not limited to this. For example, as shown in Figure 15, multiple polishing heads 60 of different types of polishing tools 80 can be installed in a tool changer 500, and the moving device 20 can change the polishing heads 60 itself while creating a hairline finish on the surface WH of the metal member W.

[0101] Furthermore, although this embodiment illustrates the use of a vertical articulated robot as the moving device 20, the present invention is not limited to this. For example, various robots can be used, such as SCARA robots, Rectangular coordinate robots, cylindrical coordinate robots, polar coordinate robots, etc. Moreover, it is not limited to so-called robots, and an XYZ moving arm device (which can be considered a type of Rectangular coordinate robot) may also be used. In addition, the bed 10 can also be moved using a planar moving table that moves in the XY plane direction and a lifting table that moves up and down in the Z direction.

[0102] It should be noted that the present invention is not limited to the embodiments described above, and various modifications can be made without departing from the spirit of the invention. [Explanation of Symbols]

[0103] 1. Metal surface pattern processing device 10 beds 12 Top surface 14. Jig plate 20 Mobile device 22 Base 23 First joint 23A First joint drive unit 23B First joint sensor 24 First Arm 25 Second joint 25A Second joint drive unit 25B Second joint sensor 26 Second Arm 27 Third joint 27A Third joint drive unit 27B Third joint sensor 28 Third Arm 29. Fourth joint 29A Fourth joint drive unit 29B Fourth joint sensor 30 Fourth Arm 31. Fifth joint 31A Fifth joint drive unit 31B Fifth joint sensor 32 Hand section 33 Sixth joint 33A Sixth joint drive unit 33B Sixth Joint Sensor 34. Chuck section 60 polishing heads 62 Chucked part 64 base 64A base 64B Information Department 66. Displacement mechanism on the abrasive side 66A Rail 66B Carriage 67 Stopper 70 Polishing tool side pedestal 70A Bearing Base 70B Receiving part 72. Main spindle motor 72B Spindle Sensor 74 Main axis 74A Proximal end 74B Distal end 80 Polishing tools 82 Polishing section 82A Polished surface 84 Flexible part 85 pads 86 Biasing mechanism 86B Force adjustment part 100 Control device 260 Spindle tilting section 262 Z-axis movement processing unit 264 XY plane movement processing section 266 Spindle Rotation Processing Unit B Actual contact surface Bw hit width E. Rotational trajectory of the polishing surface G Area to be polished Gw band width H Hairline pattern Qa Absolute Coordinate System Qs relative coordinate system R machining target area T Main axis tilt direction V Polished outer diameter W Metal component WH surface

Claims

1. A metal surface pattern processing apparatus that processes the surface of a metal to form a pattern, A polishing head comprising a polishing tool that polishes the surface to form a hairline pattern, a spindle that rotatably holds the polishing tool, and a spindle motor that rotates the spindle, A moving device that holds the polishing head and the surface so that they can move relative to each other, The system comprises a control device for controlling the aforementioned mobile device, When defining a specific direction along the plane of the surface as the X-axis, a direction along the plane perpendicular to the X-axis as the Y-axis, the plane co-plane with the surface as the X-Y plane, and a direction perpendicular to the X-axis and Y-axis as the Z-axis, The control device that controls the aforementioned mobile device is A spindle tilting processing unit that tilts the spindle relative to the Z-axis, A Z-axis movement processing unit moves the polishing tool and the surface relative to each other in the Z-axis direction to bring the polishing tool and the surface into contact, A metal surface pattern processing apparatus comprising: an X-Y plane movement processing unit that moves the surface and the polishing head relative to each other along the X-Y plane while the main spindle is in contact with the polishing tool which is tilted relative to the surface, wherein a fan-shaped hairline pattern is formed on the surface by the rotation of the polishing tool within a band-shaped polished area formed on the surface by the relative movement of the polishing tool along the X-Y plane.

2. When defining the relative movement direction of the polishing head in the X-Y plane by the X-Y plane movement processing unit as the X-Y plane movement direction, and defining the side of the main spindle closer to the surface as the proximal end and the side opposite the proximal end as the distal end, The spindle tilting processing unit is characterized by tilting the spindle relative to the X-Y plane such that the displacement direction of the distal end relative to the proximal end in the X-Y plane (hereinafter referred to as the spindle tilt direction) contains a component in the opposite direction to the X-Y plane movement direction (hereinafter referred to as the X-Y plane anti-movement direction). The metal surface pattern processing apparatus according to claim 1.

3. The spindle tilting processing unit is characterized by tilting the spindle relative to itself so that the spindle tilt direction coincides with the anti-movement direction in the X-Y plane. The metal surface pattern processing apparatus according to claim 2.

4. When defining the relative movement direction of the polishing head in the X-Y plane by the X-Y plane movement processing unit as the X-Y plane movement direction, and defining the side of the main spindle closer to the surface as the proximal end and the side opposite the proximal end as the distal end, The spindle tilting processing unit is characterized by tilting the spindle relative to the X-Y plane such that the displacement direction of the distal end relative to the proximal end in the X-Y plane (hereinafter referred to as the spindle tilt direction) contains a component of the X-Y plane movement direction. The metal surface pattern processing apparatus according to claim 1.

5. The spindle tilting processing unit, with the spindle tilted relative to itself, The X-Y plane movement processing unit moves the polishing tool and the surface relative to each other in the X-Y plane movement direction, while the Z-axis movement processing unit gradually brings the polishing tool and the surface closer together, or the X-Y plane movement processing unit moves the polishing tool and the surface relative to each other in the X-Y plane movement direction, while the spindle tilt processing unit gradually increases the tilt amount of the spindle, thereby gradually increasing the width of the polished area formed on the surface. The metal surface pattern processing apparatus according to claim 4.

6. The spindle tilting processing unit is characterized by tilting the spindle relative to the Z-axis such that the tilt angle of the spindle is greater than 0 degrees and 45 degrees or less. The metal surface pattern processing apparatus according to claim 1.

7. The spindle tilting processing unit is characterized by tilting the spindle relative to the Z-axis such that the tilt angle of the spindle is greater than 0 degrees and 15 degrees or less. The metal surface pattern processing apparatus according to claim 1.

8. The region of the polishing tool that can come into contact with the surface is defined as the polishing surface, and, When defining the circular or annular rotational trajectory formed by the rotation of the polishing surface by the aforementioned main shaft as the polishing surface rotational trajectory, The spindle tilting processing unit and the Z-axis movement processing unit in the control device are characterized in that, during polishing, the relative position of the polishing head and the surface is maintained such that a portion of the rotational trajectory of the polishing surface separates from the surface. The metal surface pattern processing apparatus according to claim 1.

9. The relative movement direction of the polishing head in the X-Y plane by the X-Y plane movement processing unit is defined as the X-Y plane movement direction, and the side of the spindle closest to the surface is defined as the proximal end, and the side opposite to the proximal end is defined as the distal end, and furthermore, the displacement direction of the distal end relative to the proximal end in the X-Y plane is defined as the spindle tilt direction, When defining the outermost diameter of the polishing surface as the diameter of the outermost edge of the rotational trajectory of the main axis of the main axis, The characteristic feature is that when the rotational trajectory of the polishing surface is viewed from a direction parallel to the X-Y plane and perpendicular to the spindle tilt direction, the contact width between the rotational trajectory of the polishing surface and the surface is set to one-quarter or more of the outer diameter of the polishing surface. The metal surface pattern processing apparatus according to claim 8.

10. The contact width is set to be one-third or more of the polishing outer diameter, The metal surface pattern processing apparatus according to claim 9.

11. The contact width is set to be at least half of the polishing outer diameter, The metal surface pattern processing apparatus according to claim 9.

12. The contact width is set to be 9 / 10 or less of the outer diameter of the polishing, The metal surface pattern processing apparatus according to claim 10.

13. The contact width is characterized by being set to 5 / 6 or less of the outer diameter of the polishing, The metal surface pattern processing apparatus according to claim 9.

14. The contact width is set to be three-quarters or less of the polishing outer diameter, The metal surface pattern processing apparatus according to claim 9.

15. The X-Y plane movement processing unit is characterized in that it moves the surface and the polishing head relative to each other so that a portion of the second polishing region is superimposed on a portion of the first polishing region, thereby causing the hairline pattern in the first polishing region and the hairline pattern in the second polishing region to come into contact with the surface. The metal surface pattern processing apparatus according to claim 1.

16. The X-Y plane movement processing unit is, A reference direction movement processing unit that moves the surface and the polishing head relative to each other so as to include a component in a predetermined direction (hereinafter referred to as the reference direction) in the X-Y plane, thereby forming a strip-shaped reference direction polished region on the surface, The system includes a counter-reference direction movement processing unit that, after processing in the reference direction movement processing unit, moves the surface and the polishing head relative to each other so as to include a component in the direction opposite to the reference direction (hereinafter referred to as the counter-reference direction) in the X-Y plane, thereby forming a band-shaped counter-reference direction polishing region that partially overlaps with the reference direction polishing region, The surface is characterized by retaining both the hairline pattern in the polished area in the reference direction and the hairline pattern in the polished area in the counter-reference direction. The metal surface pattern processing apparatus according to claim 15.

17. The X-Y plane movement processing unit is, A first reference direction movement processing unit moves the surface and the polishing head relative to each other so as to include a component in a predetermined direction (hereinafter referred to as the reference direction) in the X-Y plane, thereby forming a strip-shaped first reference direction polished region on the surface, The system includes a second reference direction movement processing unit that, after processing by the first reference direction movement processing unit, moves the surface and the polishing head relative to each other so as to include the component of the reference direction in the X-Y plane, thereby forming a strip-shaped second reference direction polishing region that partially overlaps with the first reference direction polishing region, The surface is characterized by retaining both the hairline pattern in the polished area in the first reference direction and the hairline pattern in the polished area in the second reference direction. The metal surface pattern processing apparatus according to claim 15.

18. The aforementioned polishing tool is A polishing section composed of an abrasive material that comes into contact with the aforementioned surface, It comprises a flexible part that supports the polishing part from the rear, The flexible portion is characterized in that it deforms when the polishing portion comes into contact with the surface. The metal surface pattern processing apparatus according to claim 1.

19. The polishing head is The base supported by the aforementioned mobile device, A spindle displacement mechanism that displaces at least the spindle and the polishing tool in the axial direction of the spindle relative to the base, A feature comprising: The metal surface pattern processing apparatus according to claim 1.

20. The spindle displacement mechanism is characterized by having a biasing mechanism that biases the polishing tool toward the surface. The metal surface pattern processing apparatus according to claim 19.

21. The aforementioned mobile device is characterized by being a multi-joint robot. The metal surface pattern processing apparatus according to claim 1.

22. The aforementioned articulated robot is characterized by having at least five joints. The metal surface pattern processing apparatus according to claim 21.

23. A metal surface pattern processing method that forms a pattern on the surface of a metal by processing the surface of the metal using a metal surface pattern processing apparatus, The aforementioned metal surface pattern processing apparatus is A polishing head comprising a polishing tool that polishes the surface to form a hairline pattern, a spindle that rotatably holds the polishing tool, and a spindle motor that rotates the spindle, The device comprises the polishing head and a moving device that holds the surface so that it can move relative to it. When defining a specific direction along the plane of the surface as the X-axis, a direction along the plane perpendicular to the X-axis as the Y-axis, the plane co-plane with the surface as the X-Y plane, and a direction perpendicular to the X-axis and Y-axis as the Z-axis, The main spindle and the polishing tool are inclined relative to each other with respect to the Z-axis, and the surface is moved relative to the main spindle and the polishing tool is brought into contact with the surface in the direction of the Z-axis. The method comprises the step of moving the surface and the polishing head relative to each other along the X-Y plane while the main shaft is in contact with the polishing tool, which is tilted relative to the main shaft. A method for processing metal surface patterns, characterized in that a fan-shaped hairline pattern is formed within a band-shaped polished area formed on the surface by the rotation of the polishing tool as the polishing tool moves relative to the surface along the X-Y plane.

24. The method is characterized by forming a coating film on the surface on which the hairline pattern is formed. The method for processing a metal surface pattern according to claim 23.

25. The method is characterized by adjusting the relative position between the hairline pattern and the pattern formed on the coating film. The method for processing a metal surface pattern according to claim 24.

26. The aforementioned coating film is characterized by having a wood grain pattern. The method for processing a metal surface pattern according to claim 24.

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