Photosensitive resin composition

A photosensitive resin composition with specific components addresses the challenges of adhesion and transmission loss in optical waveguides, enabling high-speed communication through improved core formation and reduced signal attenuation.

JP7876417B2Inactive Publication Date: 2026-06-19AJINOMOTO CO INC
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
AJINOMOTO CO INC
Filing Date
2022-11-01
Publication Date
2026-06-19
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

Existing optical waveguides face challenges in achieving excellent plating adhesion, core formation properties, and low transmission loss, particularly in the context of silicon photonics where fine optical waveguides are required for high-speed communication.

Method used

A photosensitive resin composition comprising epoxy resin, a resin with a carboxyl group and ethylenic double bond, a photopolymerization initiator, and a non-developable polymer with a solubility parameter (SP value) of 9 (cal/cm³) 1/2 to 13 (cal/cm³) 1/2, which enables the formation of optical waveguides with improved adhesion and reduced transmission loss.

Benefits of technology

The composition allows for the manufacturing of optical waveguides with excellent plating adhesion, core formation properties, and low optical transmission loss, suitable for high-speed communication applications.

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Patent Text Reader

Abstract

To provide a photosensitive resin composition or the like, capable of manufacturing an optical waveguide with excellent plating adhesion, excellent core formation, and low transmission loss.SOLUTION: A photosensitive resin composition comprises: (A) an epoxy resin, (B) a resin containing carboxyl groups and ethylenic double bonds, (C) a photopolymerization initiator, and (D) a non-developable polymer with a solubility parameter (SP value) of 9 (cal / cm3)1 / 2 or more and 13 (cal / cm3)1 / 2 or less.SELECTED DRAWING: None
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