Semiconductor jig transport container

Abstract

To provide a semiconductor jig conveying container that houses and conveys a semiconductor jig.SOLUTION: A semiconductor jig conveying container comprises: a lower case having a top part opening; an upper cover having at least one side face annular groove; and at least one airtight rubber seal having a base part arranged on the side face annular groove and at least one flange which is connected to the base part and extended outside. In the case where the upper cover is bonded to the top part opening of the lower case, a flange of the airtight rubber seal is elastically bent, and closely adhered to an inner sidewall of the lower case to create an airtight state.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a jig transport container, and more particularly to a semiconductor jig transport container for storing and transporting semiconductor jigs.

Background Art

[0002] Conventional semiconductor jigs, for example, semiconductor transport carriers such as Front Opening Unified Pod (FOUP), photomask carriers, substrate carriers, and substrate carriers, and related parts thereof are packed with clean bags or cardboard boxes during transportation.

Summary of the Invention

Problems to be Solved by the Invention

[0003] However, the method of using a clean bag or cardboard box as described above has the following problems.

[0004] First, in either the case of a clean bag or cardboard box, the airtightness is not sufficient, so it is difficult to keep the semiconductor jig clean for a long time and it is easily contaminated. In addition, since both the clean bag and the cardboard box cannot be reused multiple times, it is difficult to reduce the packaging cost in the long term, and there is a problem of not being environmentally friendly. Also, the clean bag and the cardboard box cannot sufficiently protect the semiconductor jig housed inside, and the semiconductor jig may be easily damaged during transportation.

[0005] In addition, due to the characteristics of the material, the clean bag is likely to generate volatile organic compounds (VOCs) and cannot maintain a low humidity inside the bag for a long time.

[0006] In view of the above drawbacks of the prior art, as a result of intensive studies by the present inventors, they have succeeded in developing a semiconductor jig transport container having excellent airtightness and capable of maintaining cleanliness and a low humidity state inside the container.

[0007] Furthermore, because the semiconductor jig transport container has good structural strength, it can not only reliably protect the semiconductor jigs housed inside, but can also be reused multiple times.

[0008] Furthermore, the semiconductor jig transport container does not generate volatile organic compounds.

[0009] The terms "direction" or similar terms used throughout the specification of this invention, such as "front," "back," "left," "right," "top," "bottom," "inside," "outside," and "side," primarily refer to directions in the drawings. These terms are used to describe and illustrate each embodiment of the invention and do not limit the invention.

[0010] Throughout the specification of this invention, the classifiers "one" or "one" are used for parts and components. This is for convenience and to ensure that the invention is disclosed within the usual scope; therefore, in this invention, it should be interpreted as including both one and at least one. Furthermore, unless explicitly indicated otherwise, the concept of "single" also includes multiple.

[0011] Throughout the specification of this invention, synonyms such as "joining," "combining," or "attaching" primarily encompass both states where the members can be separated without damaging them after joining, and states where the members cannot be separated after joining. Those skilled in the art can select the appropriate term based on the materials of the members to be joined and their attachment needs. [Means for solving the problem]

[0012] To achieve the above-mentioned objectives and other objectives, the present invention provides a semiconductor jig transport container comprising: a lower case having a top opening; an upper cover having at least one side annular groove; and at least one airtight rubber seal having a base disposed in the side annular groove and at least one flange connected to the base and extending outward, wherein when the upper cover is coupled to the top opening of the lower case, the flange of the airtight rubber seal is elastically bent and adheres tightly to the inner wall of the lower case to create an airtight seal.

[0013] In the semiconductor jig transport container described above, the upper cover has an annular flange that covers the upper edge of the lower case and a downward projection that extends downward from the annular flange, and the side annular groove may be provided on the outer circumference of the downward projection.

[0014] In the semiconductor jig transport container described above, the upper cover may be equipped with an OHT chuck protruding from the top of the lower protrusion.

[0015] In the semiconductor jig transport container described above, the lower protrusion is integrally molded and connected to the OHT chuck, and the upper cover may have a flat portion, with the OHT chuck provided at the center of the flat portion.

[0016] In the semiconductor jig transport container described above, the lower case has a plurality of first overlapping sections, and the upper cover has a plurality of second overlapping sections. By stacking the plurality of first overlapping sections and the plurality of second overlapping sections on top of each other, a plurality of semiconductor jig transport containers of the same structure may be stacked and stored on top of each other.

[0017] In the semiconductor jig transport container described above, the number of flanges of the airtight rubber seal is two, and the two flanges are spaced apart vertically. When the upper cover is coupled to the top opening of the lower case, a second distance exists between the outer surface of the base and the inner wall of the lower case. When the two flanges of the airtight rubber seal are not bent, a third distance exists between the free ends of the two flanges, and the third distance may be greater than or equal to the second distance.

[0018] In the semiconductor jig transport container described above, the flange may have an inclined surface that slopes upward with respect to the horizontal plane of the base.

[0019] In the semiconductor jig transport container described above, a storage chamber is provided inside the lower case, and a valve component may be provided in the upper cover, with a portion of it penetrating into the storage chamber, for exhausting gas from the storage chamber or for airtight sealing.

[0020] In the semiconductor jig transport container described above, the valve component includes a valve nozzle and a valve plug, and the exhaust or airtightness of the valve nozzle may be controlled by opening or closing the valve plug.

[0021] In the semiconductor jig transport container described above, the valve nozzle has a passage that communicates with the containment chamber, the annular wall of the passage is provided with a plurality of notches, the valve plug is used to open or close the passage, and the total length of the passage may be less than the total length of the valve plug.

[0022] In the semiconductor jig transport container described above, the side walls of the lower case are formed to slope widely outward from bottom to top, and multiple lower cases of the same structure may be stacked on top of each other for storage.

[0023] In the semiconductor jig transport container described above, the lower case may have at least one component storage area inside.

[0024] In the above semiconductor jig transfer container, at least one barrier is provided inside the lower case, and the barrier may be made of LCP, COP, or metal.

[0025] In the above semiconductor jig transfer container, a plurality of locking portions for locking or unlocking the upper cover and the lower case may be further included by being provided around the boundary between the upper cover and the lower case.

[0026] In the above semiconductor jig transfer container, the upper cover and the lower case may be made of LCP, COP, or metal.

Advantages of the Invention

[0027] Thereby, when the upper cover of the semiconductor jig transfer container according to the present invention covers the top opening from above, the flange of the airtight rubber seal can be gradually and elastically bent upward. When the upper cover reaches a predetermined position, the flange adheres to the inner wall of the lower case and maintains that state, and by airtightly sealing the upper cover to the top opening of the lower case, the cleanliness and humidity in the accommodation chamber S can be maintained for a long time. Further, the semiconductor jig transfer container can conveniently suck the air inside the container from the outside through the valve to reduce the oxygen content and humidity inside the container, thereby providing a suitable storage environment for the semiconductor jigs inside the container.

Brief Description of the Drawings

[0028] [Figure 1] It is an exploded perspective view of an embodiment according to the present invention. [Figure 2] It is an exploded perspective view of an embodiment according to the present invention as viewed from another angle. [Figure 3] It is a perspective cross-sectional view of an assembled state of an embodiment according to the present invention. [Figure 4] It is a partial cross-sectional view showing a state where the upper cover is not coupled to the lower case in an embodiment according to the present invention. [Figure 5] This is a partial cross-sectional view showing the upper cover coupled to the lower case in an embodiment of the present invention. [Figure 6] This is a side cross-sectional view of an airtight rubber seal according to an embodiment of the present invention. [Figure 7] This is a partial perspective cross-sectional view of the upper cover of an embodiment according to the present invention. [Figure 8] This is a partial cross-sectional view showing the closed state of the valve after assembly according to an embodiment of the present invention. [Figure 9] This is a partial cross-sectional view showing the valve in the open state after assembly of an embodiment according to the present invention. [Figure 10] This is a partial cross-sectional view showing the upper cover of an embodiment according to the present invention. [Figure 11] This is a side cross-sectional view showing the lower case of an embodiment according to the present invention. [Figure 12] This is a perspective view showing embodiments of the present invention stacked on top of each other. [Figure 13] This is a perspective view showing the state in which a barrier is provided inside the lower case of an embodiment of the present invention. [Modes for carrying out the invention]

[0029] In order to fully understand the purpose, features, and effects of the present invention, the following specific embodiments will be described in detail with reference to the drawings.

[0030] Please refer to Figures 1 to 3. A preferred embodiment of the semiconductor jig transport container according to the present invention comprises a lower case 1, an upper cover 2 that is openably connected to the lower case 1, and an airtight rubber seal 3 coupled to the upper cover 2.

[0031] For details, please refer to Figures 2 to 4. The lower case 1 has an internal housing chamber S and a top opening 11 communicating with the housing chamber S, and a semiconductor jig can be inserted into or removed from the housing chamber S from the top of the lower case 1. The upper cover 2 has at least one side annular groove 21, and the airtight rubber seal 3 has a base 31 and at least one flange 32. The base 31 is positioned in the side annular groove 21, and the flange 32 is connected to the base 31 and extends outward. The upper cover 2 is used to cover the top opening 11 of the lower case 1. When the upper cover 2 is attached to the lower case 1, the side annular groove 21 of the upper cover 2 is located inside the lower case 1.

[0032] Please refer to Figures 4 and 5. With this configuration, when the upper cover 2 covers the top opening 11 from top to bottom, the flange 32 of the airtight rubber seal 3 contacts the inner wall 1a of the lower case 1. Depending on the degree to which the upper cover 2 is pushed downward, the flange 32 partially adheres to the inner wall 1a of the lower case 1 and is gradually bent upward elastically. When the upper cover 2 reaches a predetermined position, the flange 32 adheres tightly to the inner wall 1a of the lower case 1 due to its elastic recovery ability and maintains that state, and the upper cover 2 airtightly seals the top opening 11 of the lower case 1, thereby maintaining cleanliness and humidity inside the housing chamber S for a long time. In addition, the airtight rubber seal 3 can effectively prevent the upper cover 2 from falling off the lower case 1 by increasing the contact area with the inner wall 1a of the lower case 1 as the flange 32 elastically deforms to adhere tightly to the inner wall 1a of the lower case 1, thereby stabilizing the connection between the two parts.

[0033] For more details, please refer to Figures 2 and 5. In the embodiment according to the present invention, the upper cover 2 has an annular flange 22 that covers the upper edge of the lower case 1 and a downward projection 23 that extends downward from the inside of the annular flange 22. When the upper cover 2 seals the top opening 11 of the lower case 1, the downward projection 23 protrudes slightly into the housing chamber S, and the side annular groove 21 is provided on the outer circumference of the downward projection 23. As a result, the upper cover 2 of this embodiment can be easily molded, and the ease of assembly and bonding stability between the upper cover 2, the lower case 1 and the airtight rubber seal 3 can be improved.

[0034] Please refer to Figures 4 and 5. In the embodiment according to the present invention, the base portion 31 of the airtight rubber seal 3 has an outer surface 311. When the flange 32 of the airtight rubber seal 3 is not bent, a first distance D1 exists between the outer surface 311 of the base portion 31 and the free end 321 of the flange 32. When the upper cover 2 is coupled to the top opening 11 of the lower case 1, a second distance D2 exists between the outer surface 311 of the base portion 31 and the inner wall 1a of the lower case 1. The first distance D1 may be greater than the second distance D2. This ensures that the flange 32 of the airtight rubber seal 3 in this embodiment is elastically deformed and adheres tightly to the inner wall 1a of the lower case 1.

[0035] Please also refer to Figures 5 and 6. In the embodiment according to the present invention, the flange 32 is inclined upward with respect to the horizontal plane of the base 31, that is, it has a slope 322 with an angle θ greater than 0 with respect to the horizontal plane of the base 31. As a result, the airtight rubber seal 3 of this embodiment has a flange 32 that is suitably inclined upward, so that during the process of joining the upper cover 2 to the top opening 11 of the lower case 1, the flange 32 elastically deforms along a desired direction, thereby ensuring that the slope 322 of the flange 32 continues to adhere tightly to the inner wall 1a of the lower case 1.

[0036] Please also refer to Figures 4 and 5. In the embodiment according to the present invention, the number of airtight rubber seals 3 may be two, and the two flanges 32 may be spaced apart vertically. This allows one airtight rubber seal 3 to have two portions that elastically deform and adhere tightly to the inner wall 1a of the lower case 1, thereby improving the airtightness of the semiconductor jig transport container.

[0037] In the embodiment according to the present invention, when the two flanges 32 of the airtight rubber seal 3 are not bent, a third distance D3 exists between the free ends 321 of the two flanges 32. The third distance D3 may be greater than or equal to the second distance D2. This prevents a decrease in airtightness due to interference between the two flanges 32 when they are bent and deformed.

[0038] Notably, in this embodiment, the number of side annular grooves 21 of the upper cover 2 may be one, in which case the side annular groove 21 accommodates the base 31 of one airtight rubber seal 3. In other embodiments, the number of side annular grooves 21 of the upper cover 2 may be multiple, in which case two adjacent side annular grooves 21 are provided with a gap between them vertically, and each of the multiple side annular grooves 21 can accommodate the base 31 of one airtight rubber seal 3. As a result, the upper cover 2 can be provided with more airtight rubber seals 3, further improving the airtightness of the semiconductor jig transport container. For example, by having two side annular grooves 21, the semiconductor jig transport container can ensure good airtightness, and the upper cover 2 and the lower case 1 can be suitably and stably coupled while still being easy to separate. Furthermore, the upper cover 2 may have a different number of side annular grooves 21 formed therein according to actual needs, and a corresponding number of airtight rubber seals 3 may be placed therein. Therefore, it is not limited to the configuration in which one or two side annular grooves 21 are installed as described above.

[0039] Please refer to Figures 3, 7 to 9. In addition to the embodiments described above, in embodiments of the present invention, the upper cover 2 may be provided with a valve component that partially penetrates into the containment chamber S and performs gas exhaust or airtight sealing within the containment chamber S. The valve component may include a valve nozzle 24 and a valve plug 25. For example, the valve nozzle 24 has at least one vent 241 and is connected to the lower protrusion 23 of the upper cover 2 and extends into the containment chamber S. The valve plug 25 is operably provided on the valve nozzle 24 so as to selectively close the vent 241 of the valve nozzle 24. That is, when the valve plug 25 is in the closed state (as shown in Figure 8), the containment chamber S does not communicate with the outside of the upper cover 2. On the other hand, when the valve plug 25 is in the open state (as shown in Figure 9), the containment chamber S can communicate with the outside of the upper cover 2 via the vent 241. As a result, the upper cover 2 of this embodiment, while coupled to the lower case 1, can control the valve plug 25 to open or close it, thereby adjusting the humidity and airtightness within the containment chamber S. However, the present invention does not limit the specific structure of the valve nozzle 24 and the valve plug 25, as long as the above effects can be achieved.

[0040] More specifically, in the embodiment according to the present invention, the valve nozzle 24 is substantially tubular and has a passage inside that communicates with the housing chamber S. The valve nozzle 24 has an annular wall 242, and the vent 241 penetrates the inner and outer surfaces of the annular wall 242. For example, the vent 241 may be in the form of a through hole, or it may be in the form of a cut and extend a predetermined distance from the bottom of the annular wall 242 to the information, but is not limited to these. In this embodiment, it is preferable that a plurality of vents 241 (cuts) are provided and arranged on the annular wall 242 at equal angular intervals. The annular wall 242 of the valve nozzle 24 may be integrally molded and connected to the lower protrusion 23 of the upper cover 2, or it may be additionally assembled and connected to the through hole of the lower protrusion 23. The present invention is not limited thereto.

[0041] The valve plug 25 may comprise a valve stem 251, an elastic plug 252, and a stop seat 253. Both ends of the valve stem 251 are connected to the elastic plug 252 and the stop seat 253, respectively. The lower end of the valve stem 251 penetrates the annular wall 242 of the valve nozzle 24, and the stop seat 253 is formed to have at least a portion of its width greater than the inner diameter of the annular wall 242 so that it remains located outside the lower end of the annular wall 242. The elastic plug 252 may also have at least one locking block 2521. The locking block 2521 is located close to the valve stem 251 and is provided protruding from the outer circumferential surface of the elastic plug 252.

[0042] Please refer to Figures 7 and 8. The elastic plug 252 of the valve plug 25 can close the inside of the annular wall 242, and its outer surface can be in close contact with the inner surface of the annular wall 242, thereby closing the valve plug 25. As a result, the housing chamber S cannot communicate with the outside of the upper cover 2 through the vent 241. The elastic plug 252 may be made of an elastic material (for example, rubber) to improve airtightness. In addition, the locking block 2521 of the elastic plug 252 is inserted into the corresponding vent 241 to assist in positioning the valve plug 25, thereby preventing the elastic plug 252 of the valve plug 25 from easily falling off the valve nozzle 24. Furthermore, the structure of the elastic plug 252 may be a tapered shape that is wider at the top and narrower at the bottom, and the upper half of the annular wall 242 may be formed into a corresponding shape to improve the degree of contact between the two. Here, as shown in Figure 8, in order to strictly control the exhaust or airtightness of the valve nozzle 24 by opening or closing the valve plug 25, the total length L1 of the passage of the valve nozzle 24 is made smaller than the total length L2 of the valve plug 25.

[0043] Refer to Figures 3 and 9. Operationally, the valve nozzle 24 may be sucked from the outside of the upper cover 2 by a suction device (e.g., a vacuum suction machine). In this case, the valve plug 25, which was originally in a closed state, moves upward due to the suction of the suction device, and the valve plug 25 opens as the outer surface of the elastic plug 252 no longer adheres to the inner surface of the annular wall 242. In embodiments in which the elastic plug 252 is equipped with the locking block 2521, the locking block 2521 is elastically deformed by the force while the elastic plug 252 is being sucked upward, and thus falls out of the corresponding vent 241. When the valve plug 25 moves upward and the stop sheet 253 comes into contact with the lower end of the annular wall 242, the stop sheet 253 can prevent the entire valve plug 25 from falling out of the valve nozzle 24. As a result, a low-oxygen, low-humidity, and low-pressure environment is formed in the containment chamber S through the ventilation opening 241, where air is drawn in by the suction device.

[0044] Please refer to Figures 3 and 8. After the suction device stops, the valve plug 25 may fall naturally, but it is preferable to push it back to the closed state with a downward force in order to maintain a low-oxygen, low-humidity, and low-pressure environment in the containment chamber S. At this time, the low-pressure environment in the containment chamber S is also improved when the upper cover 2 seals the top opening 11 of the lower case 1. By achieving good airtightness together with the airtight rubber seal 3, the valve plug 25 can maintain a low-oxygen, low-humidity, and low-pressure environment in the containment chamber S for an even longer period of time, and the cleanliness of the items contained in the containment chamber S can be ensured.

[0045] Furthermore, the upper cover 2 may be provided with a humidity sensor that is inserted into the containment chamber S to detect the humidity inside the containment chamber S in real time, in order to obtain an indicator of whether or not to stop the suction device. The humidity sensor makes it possible to read the humidity inside the containment chamber S in real time even during use. Before opening the upper cover 2, the valve plug 25 can be switched to the open position to allow air to leak naturally and reduce the vacuum level inside the containment chamber S, thereby making it easier to open the upper cover 2 from above the lower case 1.

[0046] Notably, in the embodiment of the present invention, both the lower case 1 and the upper cover 2 may be made of a low-hygroscopic material, such as LCP (Liquid Crystal Polymer), COP (cyclo-olefin polymers), or a metal material. As a result, the lower case 1 and upper cover 2 of this embodiment can effectively reduce the generation of volatile organic compounds and delay the recovery of humidity in the containment chamber S, thereby protecting the semiconductor jigs inside the container from contamination by volatile organic compounds and extending the period during which a low-humidity environment can be maintained inside the semiconductor jig transport container. Furthermore, the lower case 1 and upper cover 2 can be repeatedly washed and reused, can be dried to prevent water contamination, and have excellent structural strength to improve protection for semiconductor jigs inside the container.

[0047] Please refer to Figures 2, 3, and 10. In addition to the embodiments described above, in the embodiment according to the present invention, the upper cover 2 has an OHT (Overhead Hoist Transfer) chuck 26 that protrudes from the upper surface of the lower protrusion 23. As a result, when the upper cover 2 is coupled to the lower case 1, the OHT system grips the OHT chuck 26 of the upper cover 2, thereby enabling the semiconductor jig transport container of this embodiment to be transported and transmitted by an automated system. The OHT chuck 26 may be attached to the lower protrusion 23, or, for ease of attachment, it may be integrally molded with the lower protrusion 23 and protrude upward as shown in Figure 10. The OHT chuck 26 is preferably located in the center of the upper cover 2 so that the semiconductor jig transport container is stably gripped by the OHT system.

[0048] Furthermore, in an embodiment in which the lower protrusion 23 is integrally molded and bonded to the OHT chuck 26, a flat portion 27 may be provided on the upper surface of the upper cover 2, and the OHT chuck 26 may be provided at the center of the flat portion 27. This makes the flat portion 27 easier to remove during the manufacturing process, and the upper cover 2 having the OHT chuck 26 can be manufactured more easily and quickly.

[0049] Please refer to Figures 2 and 11. In addition to the embodiments described above, in the embodiments according to the present invention, the side wall 12 of the lower case 1 may be formed to be widely inclined outward from bottom to top. This allows for storage space to be saved by stacking multiple lower cases 1 of the same structure on top of each other.

[0050] Furthermore, in the embodiment of the present invention, the side wall 12 of the lower case 1 may have an uneven structure. This strengthens the structure of the side wall 12 and improves impact resistance.

[0051] Please refer to Figures 1 and 3. In addition to the embodiments described above, the embodiments according to the present invention may have at least one parts storage area 13 inside the lower case 1. The parts storage area 13 may be, for example, a local groove made of the bottom plate 14 of the lower case 1, or a small box placed in the storage chamber S, but is not limited to these. As a result, parts such as a dehumidifier to reduce humidity inside the storage chamber S, screws, and airtight rubber seals 3 for spare parts can be stored inside the lower case 1 of this embodiment.

[0052] Please refer to Figures 1, 2, and 12. In addition to the embodiments described above, in embodiments according to the present invention, the lower case 1 may have a plurality of first overlapping sections 15, and the upper cover 2 may have a plurality of second overlapping sections 28. As a result, when the upper cover 2 is fixed to the top of the lower case 1, the plurality of first overlapping sections 15 and the plurality of second overlapping sections 28 can be stacked on top of each other, allowing multiple semiconductor jig transport containers of the same structure to be stacked and stored together.

[0053] The plurality of first overlapping portions 15 are provided on the bottom plate 14 of the lower case 1, and in their form, for example, they are a plurality of bumps provided on the outer bottom surface of the bottom plate 14, and can function as support legs for the lower case 1, but are not limited to that. On the other hand, the plurality of second overlapping portions 28 are provided on the upper surface of the upper cover 2, and in their form, for example, they are a plurality of recesses that are recessed downward from the upper surface of the lower protrusion 23. As a result, when two sets of semiconductor jig transport containers are stacked vertically, the plurality of first overlapping portions 15 of the upper lower case 1 are inserted into the plurality of second overlapping portions 28 of the lower upper cover 2, and furthermore, the lower edge of the upper lower case 1 is surrounded by the recessed lower protrusion 23, so that the semiconductor jig transport containers of this embodiment can be stacked vertically stably. In other embodiments, the corresponding first overlapping portions 15 and second overlapping portions 28 may be arranged with the protrusions reversed compared to the above embodiment, or they may be other equivalent structures that can limit horizontal displacement. The present invention is not limited to these.

[0054] Please refer to Figure 13. In addition to the embodiments described above, in the embodiments of the present invention, the lower case 1 may be provided with at least one barrier 16, which is, for example, a barrier plate and / or a barrier box. The barrier 16 may similarly be made of a low-hygroscopic material such as LCP, COP, or metal. This prevents contact contamination between semiconductor jigs by separating the carrier and / or each component within the lower case 1 of this embodiment using the barrier 16.

[0055] Please refer to Figures 2, 3, and 5. In addition to the embodiments described above, in the embodiments according to the present invention, a plurality of locking parts 4 may be provided around the boundary between the upper cover 2 and the lower case 1. For example, the locking parts 4 are provided on the outer circumference of the annular flange 22 of the upper cover 2 and the outer circumference of the upper edge of the lower case 1. This makes it possible to stabilize the connection between the upper cover 2 and the lower case 1 and prevent them from easily separating by further locking the locking parts 4 after the upper cover 2 of this embodiment has been coupled to the lower case 1. In particular, it is possible to effectively prevent the upper cover 2 from falling off when the semiconductor jig transport container is gripped by an automated system. On the other hand, when attempting to open the upper cover 2, it is necessary to switch the locking parts 4 to the unlocked state in advance. The number of locking parts 4 is not limited, but may be one or more as needed. The specific form of the locking parts 4 is not limited to those disclosed in the drawings, as long as it has an equivalent structure that can be locked and unlocked.

[0056] Furthermore, the semiconductor jig transport container according to the present invention is not only applicable to the storage of wafer cassettes, but can also be used to store semiconductor transport carriers such as mask carriers, substrate carriers, and substrate carriers, as well as related components and other semiconductor jigs that require a high degree of cleanliness, making it highly practical.

[0057] Although the present invention has been disclosed in preferred embodiments as described above, a person with ordinary skill in the art to which the present invention pertains should understand that these embodiments are merely illustrative and do not limit the scope of the present invention. Modifications and substitutions equivalent to those in the embodiments are included within the scope of the present invention. Therefore, the scope of protection of the present invention is as defined by the claims. The claims should be interpreted most broadly to include all modifications and similar treatments. [Explanation of Symbols]

[0058] 1. Lower case 1a Inner wall 11 Top opening 12 Side wall 13 Parts storage area 14 Bottom plate 15. First polymerization section 16 Barriers 2 Top cover 21 Side annular groove 22 Annular flange 23 Lower protrusion 24 Valve Nozzles 241 Ventilation opening 242 Ring Wall 25 Valve Plug 251 Valve stem 252 Elastic Plug 2521 Locking block 253 Stop Sheet 26 OHT Chuck 27 Flat area 28. Second Polymerization Section 3. Airtight rubber seal 31 Base 311 Exterior 32 flange 321 Free end 322 Slope 4. Locking part D1 1st distance D2 2nd distance D3 3rd distance L1, L2 Total length S Confinement Chamber θ angle

Claims

1. A lower case having a top opening, An upper cover having at least one side annular groove, An airtight rubber seal having a base portion disposed in the side annular groove and at least one flange connected to the base and extending outward, Equipped with, When the upper cover is connected to the top opening of the lower case, the flange of the airtight rubber seal is elastically bent and adheres tightly to the inner wall of the lower case to create an airtight seal. The number of flanges of the airtight rubber seal is two, and the two flanges are spaced apart vertically. When the upper cover is connected to the top opening of the lower case, a second distance exists between the outer surface of the base and the inner wall of the lower case. When the two flanges of the airtight rubber seal are not bent, a third distance exists between the free ends of the two flanges. A semiconductor jig transport container characterized in that the third distance is greater than or equal to the second distance.

2. The semiconductor jig transport container according to claim 1, characterized in that the upper cover has an annular flange covering the upper edge of the lower case and a downward projection extending downward from the annular flange, and the side annular groove is provided on the outer circumference of the downward projection.

3. The semiconductor jig transport container according to claim 2, characterized in that the upper cover is provided with an OHT chuck protruding from the top of the lower protrusion.

4. The semiconductor jig transport container according to claim 3, characterized in that the lower protrusion is integrally molded and connected to the OHT chuck, and the upper cover has a flat portion, with the OHT chuck provided at the center of the flat portion.

5. The lower case has a plurality of first overlapping sections, and the upper cover has a plurality of second overlapping sections. A semiconductor jig transport container according to claim 1, characterized in that a plurality of semiconductor jig transport containers having the same structure are stacked and stored on top of each other by stacking a plurality of the first overlapping parts and a plurality of the second overlapping parts on top of each other.

6. The semiconductor jig transport container according to claim 1, characterized in that the flange has an inclined surface that slopes upward with respect to the horizontal plane of the base.

7. A storage chamber is provided inside the lower case. The semiconductor jig transport container according to claim 1, characterized in that the upper cover is provided with a valve component that partially penetrates into the containment chamber and is used for exhausting gas or creating an airtight seal in the containment chamber.

8. The aforementioned valve component includes a valve nozzle and a valve plug. A semiconductor jig transport container according to claim 7, characterized in that the exhaust or airtightness of the valve nozzle is controlled by opening or closing the valve plug.

9. The valve nozzle has a passage that communicates with the housing chamber, and the annular wall of the passage has a plurality of notches. The valve plug is used to open or close in accordance with the passage, The semiconductor jig transport container according to claim 8, characterized in that the total length of the passage is smaller than the total length of the valve plug.

10. The semiconductor jig transport container according to claim 1, characterized in that the side wall of the lower case is formed to be widely sloped outward from bottom to top, and a plurality of lower cases having the same structure can be stacked and stored on top of each other.

11. The semiconductor jig transport container according to claim 1, characterized in that the lower case has at least one component storage area inside.

12. The lower case is equipped with at least one barrier inside, The semiconductor jig transport container according to claim 1, characterized in that the barrier is composed of LCP, COP, or metal.

13. The semiconductor jig transport container according to claim 1, further comprising a plurality of locking parts provided around the boundary between the upper cover and the lower case for locking or unlocking the upper cover and the lower case.

14. A semiconductor jig transport container according to any one of claims 1 to 13, characterized in that the upper cover and the lower case are made of LCP, COP, or metal.

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