Method for manufacturing a display device

JP7876827B2Active Publication Date: 2026-06-22MAGNOLIA WHITE CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
MAGNOLIA WHITE CORP
Filing Date
2022-02-08
Publication Date
2026-06-22

AI Technical Summary

Technical Problem

Existing methods for manufacturing display devices with organic light-emitting diodes (OLEDs) face challenges in maintaining reliability during the manufacturing process.

Method used

A method involving the formation of a lower electrode on a substrate, followed by the creation of a ribbed partition wall structure with overlapping insulating layers and organic layers, and the subsequent formation of upper electrodes and cap layers, culminating in a sealing layer to enhance structural integrity and reliability.

Benefits of technology

The method enhances the structural integrity and reliability of OLED-based display devices by providing a robust partition wall and sealing system, thereby reducing potential degradation and improving the longevity of the display elements.

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Patent Text Reader

Abstract

To suppress reduction in reliability.SOLUTION: A method of manufacturing a display device according to one embodiment includes the following steps of; arranging a processing substrate formed with a lower electrode on a stage in a chamber, forming a first insulating layer overlapped with the lower electrode in a state where a first distance is formed between the stage and a counter electrode, and then, forming a second insulating layer on the first insulating layer in a state where a second distance longer than the first distance is formed between the stage and the counter electrode; patterning the first insulating layer and the second insulating layer to form a rib having an opening overlapped with the lower electrode; forming a barrier having a lower part located on the rib and an upper part located on the lower part and protruding from a lateral face of the lower part; forming an organic layer; forming an upper electrode; forming a cap layer; and forming an encapsulation layer.SELECTED DRAWING: Figure 6
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Citation Information

Patent Citations

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  • JP2009032673A