Negative-type photosensitive resin composition, method for manufacturing a cured relief pattern, and semiconductor device.

A negative-type photosensitive resin composition with a polyimide precursor, dye, and photopolymerization initiator addresses viscosity stability issues, ensuring high opacity and resolution for precise wiring in semiconductor devices.

JP7877183B2Active Publication Date: 2026-06-22ASAHI KASEI KOGYO KABUSHIKI KAISHA
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Patent Information

Application Number
JP2022186520
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2022-11-22
Publication Date
2026-06-22
Estimated Expiration
2042-11-22

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Abstract

To provide a negative photosensitive resin composition that offers superior resolution, realizes a polyimide film (cured relief pattern) with superior concealability of conductor patterns, and has high storage stability.SOLUTION: A negative photosensitive resin composition comprises the following components: (A) a polyimide precursor represented by the general formula (A1); (B) an organic dye; (C) a photopolymerization initiator; and (D) an organic solvent. The average transmittance of the component (B) from 400 nm to 700 nm is less than 46% when measured in a 0.003 mol / L solution of N-methyl-2-pyrrolidone (NMP). The component (C) does not have an oxime ester structure.SELECTED DRAWING: Figure 1
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Citation Information

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