Resin compositions, cured films, insulating films or protective films, antenna elements, and electronic components, display devices or semiconductor devices and methods for manufacturing the same.

Abstract

The purpose of the present invention is to provide: a resin composition which, even after a package reliability test, does not exhibit a decrease in elongation and has high cracking resistance; a cured film, insulating film, or protective film obtained from said resin composition; an electronic component; a display device; a semiconductor device; and a production method therefor.　In order to solve the above problem, a resin composition according to the present invention comprises a resin (A) and a solvent (E), wherein the resin (A) includes at least one substance selected from the group consisting of polyimides, polyamides, polybenzoxazole, precursors of these, and copolymers of these, and the resin (A) has a structure represented by formula (1).

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