Method for forming metal films

Abstract

To easily pull an electrolyte film away from a base material while keeping a plating solution in a housing and minimizing the deformation of the electrolyte film.SOLUTION: In a method for depositing a metallic film F, after placing a base material B on a placing stand 40, a metallic film F is deposited on a surface of the base material B while a plating solution L is in contact with the base material B through an electrolyte film 13. With the plating solution L sealed, at least one of the placing stand 40 or a housing body 15 is moved away from the other thereof, to pull the electrolyte film 13 away from the base material B. By the time of this pulling away, a circulation path 50 is shut off and the plating solution L in the housing 15 is sealed.SELECTED DRAWING: Figure 3A

Claims

1. The process of placing the substrate on the mounting table, A step of bringing the plating solution contained in the container into contact with the substrate via an electrolyte membrane attached to the lower part of the container, A step of applying a voltage between an anode, which is positioned above the electrolyte membrane and is insoluble in the plating solution, and the substrate, thereby allowing metal ions from the plating solution to pass through the electrolyte membrane and forming a metal film on the surface of the substrate, After forming the metal film, the step of moving at least one of the aforementioned stand or the container away from the other, thereby separating the electrolyte film from the substrate, Includes, During the film formation process, the pump is driven to circulate the plating solution contained in the container through a circulation path outside the container while forming the metal film. After the film formation is complete, the voltage between the anode and the substrate is released, and after the release of the voltage, the pump is kept running to circulate the plating solution through the circulation path, thereby discharging the gas generated at the anode during the formation of the metal film from the container to the outside. After the gas has been discharged, the pump is stopped to reduce the pressure of the plating solution inside the container to atmospheric pressure. A method for forming a metal film, wherein, after depressurizing to atmospheric pressure, and before the separation step, the circulation path is blocked and the plating solution inside the container is sealed by closing a supply-side on-off valve provided on the plating solution supply side of the container and a discharge-side on-off valve provided on the plating solution discharge side of the container.

2. The method for forming a metal film according to claim 1, wherein in the separation step, the stand described above is lowered relative to the housing.

3. The process includes removing the substrate on which the metal film has been formed from the stand described above, after the separation step, A method for forming a metal film according to claim 1, comprising repeating the steps from the placing step to the removal step.

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