Wire Evaporation Equipment

Abstract

The present invention relates to a wire deposition apparatus, which includes a plurality of rollers around which a wire is wound and moved, a heater for intensively heating the wire passing through the rollers, a cathode for supplying deposition material to the wire, and an adhesion prevention unit for covering the outside of the wire except for the wire deposition space to prevent scattered particles from adhering to the wire.

Description

Technical Field

[0001] The present invention relates to a wire deposition apparatus, and more particularly, to a wire deposition apparatus capable of obtaining excellent thin film quality while substances reach the surface of a wire in a set area and have a certain directionality.

Background Art

[0002] Generally, as the expectation for the practical application of superconducting application technologies using high-temperature superconductors has been increasing, the development and research of high-temperature superconducting wires have been actively carried out worldwide.

[0003] As manufacturing methods for high-temperature superconducting wires, there are a method for manufacturing first-generation high-temperature superconducting wires by a PIT (Powder In Tube) process in which a precursor powder is filled into an Ag pipe and processed, and a method for manufacturing second-generation high-temperature superconducting wires for making high-temperature superconducting wires called CC (Coated Conductor) in technical terms.

[0004] CC, which is a second-generation high-temperature superconducting wire, is being researched and developed by many research institutions and companies worldwide. The manufacturing methods are diverse, and it has a more complex multilayer structure than first-generation high-temperature superconducting wires.

[0005] On the other hand, conventionally, there has been a problem that the rollers around which the wire is wound are damaged during the process of heating the wire at a high temperature, frequently resulting in poor wire deposition. Therefore, there is a need to improve this.

[0006] The background art of the present invention is described in Korean Registered Patent Publication No. 10-0910613 (registered on July 28, 2009, invention name: Continuous manufacturing apparatus for superconducting tape wire).

Summary of the Invention

Problems to be Solved by the Invention

[0007] This invention was devised to improve upon the aforementioned problems, and its purpose is to provide a wire deposition apparatus that can achieve excellent thin film quality while ensuring that the material reaches the surface of the wire within a set region and maintains a certain directionality. [Means for solving the problem]

[0008] The wire deposition apparatus according to the present invention includes: a plurality of roller sections on which a wire is wound and moved; a heater section for concentrated heating of the wire as it passes through the roller sections; a cathode section for providing a deposition material to the wire; and an adhesion prevention section for covering the outside of the wire, excluding the deposition space, to prevent the adhesion of scattered particles.

[0009] The heater section may include a first heater section positioned above the wire and heated when power is applied; and one or more first heat dissipation sections that cover the first heater section so as to leave only the lower part of the first heater section open and dissipate heat.

[0010] The heater section may include: a second heater section positioned above the wire, which is heated when power is applied and a lamp is lit; a second reflector section that covers the second heater section so that only the lower part of the second heater section is open and reflects the heat generated in the second heater section; and a second cooling section that comes into contact with the second reflector section and cools the second reflector section by moving cooling water through it.

[0011] The heater section may include: an upper heater section positioned above the wire and generating heat; an upper reflecting section covering the upper heater section so as to be open only below the upper heater section and reflecting the heat generated by the upper heater section; an upper cooling section for cooling the upper reflecting section; a lower heat dissipation section positioned between the wire and the cathode section and guiding the heat to concentrate on the wire; and a lower cooling section for cooling the lower heat dissipation section.

[0012] The lower heat dissipation section may include a through-hole in the center, a plurality of heat dissipation center sections stacked on the lower cooling section, and a plurality of heat dissipation side sections covering the edges of the heat dissipation center sections.

[0013] The heat dissipation center portion may include a center plate portion in which the through-hole portion is formed in the center; a plurality of center fixing holes formed in the center plate portion; and a center support portion that penetrates the center fixing holes and is attached to the lower cooling portion and supports the center plate portion.

[0014] The center support portion fixes the central part of the center plate portion, and the center fixing hole portion may have a rectangular hole shape in which the length increases from the center of the center plate portion to the edge.

[0015] The wire deposition apparatus according to the present invention may further include: a cooling unit disposed between the heater unit and the roller unit, which is in direct contact with the wire and cools the wire. [Effects of the Invention]

[0016] In the wire deposition apparatus according to the present invention, the wire is heated by a heater section, wound around multiple roller sections, and moved while being deposited with the vapor. The heater section concentrates the heating of the wire to prevent damage to surrounding equipment, and the adhesion prevention section partially covers the wire to prevent scattered particles from adhering to the wire. [Brief explanation of the drawing]

[0017] [Figure 1] This is a schematic drawing showing a wire deposition apparatus according to one embodiment of the present invention. [Figure 2] This drawing schematically shows a roller section according to one embodiment of the present invention. [Figure 3] This drawing schematically shows a roller maintenance unit according to one embodiment of the present invention. [Figure 4] This drawing schematically shows a cooling unit according to one embodiment of the present invention. [Figure 5]A drawing schematically showing an anti - adhesion part according to an embodiment of the present invention. [Figure 6] A drawing schematically showing a heater part according to the first embodiment of the present invention. [Figure 7] A drawing schematically showing a heater part according to the second embodiment of the present invention. [Figure 8] A drawing schematically showing a heater part according to the third embodiment of the present invention. [Figure 9] A drawing schematically showing a lower heat - radiating part according to the third embodiment of the present invention. [Figure 10] A drawing schematically showing a cathode part according to an embodiment of the present invention.

Mode for Carrying Out the Invention

[0018] Hereinafter, embodiments of a wire deposition apparatus according to the present invention will be described with reference to the attached drawings. In such a process, the thickness of the lines and the sizes of the components illustrated in the drawings may be exaggerated for clarity and convenience of explanation. Also, the terms described later are terms defined in consideration of the functions in the present invention, and these may vary depending on the intention or convention of the user or operator. Therefore, the definitions of such terms should be given based on the content throughout this specification.

[0019] FIG. 1 is a drawing schematically showing a wire deposition apparatus according to an embodiment of the present invention. Referring to FIG. 1, a wire deposition apparatus 1 according to an embodiment of the present invention includes a roller part 10, a heater part 20, and a cathode part 30.

[0020] A wire 90 can be wound around and moved by two or more roller parts 10. Since the roller part 10 can be deformed in length on the axis, it is possible to prevent malfunction even when heated by the heater part 20. As an example, the roller parts 10 can be arranged such that a pair faces each other, or three or more can be arranged. The wire 90 can be deposited while passing through each roller part 10 several times.

[0021] The heater unit 20 can heat the wire 90 as it passes through the roller unit 10. For example, the heater unit 20 can be positioned between the roller units 10 and heat the wire 90 above as it passes through the roller units 10.

[0022] The cathode section 30 can provide a deposition material to the wire 90. For example, the roller section 10, the heater section 20, and the cathode section 30 can be housed in a chamber that can be converted to a vacuum state. The cathode section 30 may include a cathode supply section housed in the chamber that provides the deposition material, a cathode gas section that supplies gas to the chamber, and a cathode power section that supplies power to the chamber.

[0023] Figure 2 is a schematic diagram showing a roller section according to one embodiment of the present invention. Referring to Figure 2, the roller section 10 according to one embodiment of the present invention may include a roller support section 11, a roller shaft section 12, and a roller absorption section 13.

[0024] The roller support portion 11 can be fixedly installed in the chamber. For example, the roller support portion 11 may include a pair of first roller support portions 111 fixedly installed in the chamber facing each other, and a second roller support portion 112 formed in the first roller support portion 111 into which the roller shaft portion 12 can be inserted.

[0025] The second roller support portion 112 can have a hole formed in the center of the first roller support portion 111. A third roller support portion 113 can be attached to the second roller support portion 112. The third roller support portion 113 can function as a bearing.

[0026] The roller shaft portion 12 can be mounted on the roller support portion 11 so as to be rotatable. For example, the roller shaft portion 12 can be inserted at both ends into the second roller support portion 112 and supported by the third roller support portion 113 for rotation. The roller shaft portion 12 can pass through the third roller support portion 113. The roller shaft portion 12 can be supported by the third roller support portion 113 which is movable by the second roller support portion 112.

[0027] The roller absorption section 13 is positioned between the roller support section 11 and the roller shaft section 12, and can absorb the expansion of the roller shaft section 12. For example, the roller absorption section 13 can be built into the second roller support section 112 to support the roller shaft section 12.

[0028] The roller shaft portion 12 can pass through the roller absorption portion 13. The roller absorption portion 13 can create a clearance space in the second roller support portion 112. When the roller shaft portion 12 is heated and expands in length, the roller absorption portion 13 can contract. The roller absorption portion 13 can come into close contact with the third roller support portion 113.

[0029] More specifically, the roller shaft portion 12 may include a shaft rotation portion 121, a shaft connecting portion 122, and a shaft coupling portion 123.

[0030] The rotating shaft portion 121 can be mounted on the roller support portion 11 so as to be rotatable. A pair of rotating shaft portions 121 can be mounted on each roller support portion 11 at a distance from each other.

[0031] As an example, the axial rotating portion 121 may include a first axial rotating portion 181 inserted into a second roller support portion 112 and locked to a third roller support portion 113, a second axial rotating portion 182 extending from one end of the first axial rotating portion 181 and inserted into the third roller support portion 113 and supported by the third roller support portion 113 so as to be rotatable, and a third axial rotating portion 184 extending outward from the other end of the first axial rotating portion 181.

[0032] The first and second rotating shafts 181 and 182 may have a cylindrical shape. The third rotating shaft 183 may be formed at the end of the first rotating shaft 181 and have a disc shape. The diameter of the third rotating shaft 183 may be larger than that of the first rotating shaft 181. The diameter of the second rotating shaft 182 may be smaller than that of the first rotating shaft 181.

[0033] The shaft connecting portion 122 can connect a pair of shaft rotating portions 121. For example, the shaft connecting portion 122 has a hollow cylindrical shape, and steps may be formed at both ends so that they can be locked onto the edges of the second shaft rotating portion 182.

[0034] The shaft coupling portion 123 can connect the shaft rotation portion 121 and the shaft connecting portion 122. For example, the shaft coupling portion 123 may include a first shaft coupling portion 191 positioned opposite the second shaft rotation portion 182, and a second shaft coupling portion 192 that is bent at the first shaft coupling portion 191 to cover the end of the shaft connecting portion 122.

[0035] The shaft coupling portion 123 may be located at one end or both ends of the shaft connecting portion 122. The third shaft rotating portion 183 may be bolted to the first shaft coupling portion 191.

[0036] The wire 90 can be directly wound around the outer surface of the shaft coupling portion 122 and moved. In addition, an additional roller support portion 14, which is attached to the shaft coupling portion 122 and around which the wire 90 is wound and moved, and an additional roller absorption portion 15, which maintains the clearance space of the shaft coupling portion 122, can be added. With these additions, the operability of the wire 90 can be guaranteed by a double bearing system.

[0037] One or more roller additional support sections 14 are arranged along the length of the shaft connecting section 122 and can support the wire 90. As an example, the roller additional support section 14 may include a pair of ring-shaped first additional support sections 141 and a second additional support section 142 positioned between the first additional support sections 141.

[0038] The outer diameter of the first additional support portion 141 is even larger than the outer diameter of the second additional support portion 142. Therefore, when the wire 90 is placed on the second additional support portion 142, the first additional support portions 141, which are located on both sides, can prevent the wire 90 from derailing.

[0039] The second additional support section 142 can function as a bearing. A wire 90 is placed in the second additional support section 142, which can suppress friction generated during the movement of the wire 90. Depending on the width of the wire 90 or the number of times the wire 90 is wound around the roller section 10, the roller additional support sections 14 can be arranged in a series. When the roller additional support sections 14 are arranged in a series, the first additional support section 141 and the second additional support section 142 can be arranged alternately.

[0040] A shaft mounting portion 129 may be formed on the outer circumferential surface of the shaft connecting portion 122. Such a shaft mounting portion 129 may have a recessed groove shape with an outer diameter smaller than that of the shaft connecting portion 122.

[0041] The shaft mounting portion 129 extends from the setting point of the shaft connecting portion 122 to its end, and the additional roller support portion 14 can be inserted from the end to the setting point. A shaft step portion 128 may be formed at the setting point so as to lock the additional roller support portion 14 in place.

[0042] The roller additional absorption section 15 is positioned between the roller additional support section 14 and the shaft coupling section 123, and can absorb the expansion of the roller additional support section 14. For example, the roller additional absorption section 15 may be positioned between the roller additional support section 14 located at the edge of a series of roller additional support sections 14 and the shaft coupling section 123.

[0043] The roller additional absorption section 15 can be selectively positioned between the roller additional support sections 14 arranged in a single row. That is, the roller additional absorption section 15 can be positioned between a pair of opposing first additional support sections 141.

[0044] The roller absorption section 13 and the additional roller absorption section 15 can be wave washers or disc springs. For example, the roller absorption section 13 and the additional roller absorption section 15 can be wave washers or disc springs.

[0045] Either the roller absorption section 13 or the additional roller absorption section 15 can be a wave washer, and the other can be a disc spring. The roller absorption section 13 can contract when the shaft connection section 122 expands, thereby securing space for the expansion of the shaft connection section 122. The additional roller absorption section 15 can contract when the adjacent additional roller support section 14 expands, thereby securing space for the expansion of the additional roller support section 14.

[0046] The roller section 10 according to one embodiment of the present invention may further include a roller discharge section 16. The roller discharge section 16 can discharge gas that remains on the roller shaft section 12 that is not discharged during the vacuum process.

[0047] For example, the roller discharge section 16 may include a first discharge section 161 for discharging gas remaining inside the shaft connecting section 122, and a second discharge section 162 for discharging gas remaining between the shaft connecting section 122 and the additional roller support section 14.

[0048] The first discharge section 161 may have a hole shape that penetrates the first shaft rotation section 181 and the second shaft rotation section 182. In addition, the first discharge section 161 may have a hole shape that penetrates the third shaft rotation section 183 and the first shaft coupling section 191. The first discharge section 161 can discharge gas from inside the shaft coupling section 122.

[0049] The second discharge section 162 may include a second discharge mounting groove 119 that forms a groove for gas movement in the longitudinal direction of the shaft mounting section 129, and a second discharge step groove 118 formed in the shaft step section 128 and communicating with the second discharge mounting groove 119. Multiple second discharge sections 162 may be formed in the circumferential direction of the shaft mounting section 129.

[0050] Figure 3 is a schematic diagram showing a roller maintenance unit according to one embodiment of the present invention. Referring to Figure 3, the roller unit 10 according to one embodiment of the present invention may further include a roller maintenance unit 17.

[0051] The roller maintenance section 17 is positioned between the additional roller support sections 14 and can cover the space formed in the shaft connecting section 122 so that the additional roller support sections 14 are in close contact with the additional roller absorption section 15. The number of additional roller support sections 14 may vary depending on the working environment, and if the number of additional roller support sections 14 installed decreases, the remaining space can be covered by the roller maintenance section 17.

[0052] In other words, when two additional roller support units 14 are used after four additional roller support units 14 have been used, the two additional roller support units 14 and the corresponding roller retention units 17 are attached to the shaft connection unit 122. This allows the additional roller support units 14 and the additional roller absorption units 15 to maintain a tightly fitted state.

[0053] Figure 4 is a schematic diagram showing a cooling section according to one embodiment of the present invention. Referring to Figures 1 and 4, the wire deposition apparatus 1 according to one embodiment of the present invention may further include a cooling section 40.

[0054] The cooling unit 40 can cool the wire 90. By cooling the wire 90 heated by the heater unit 20, the cooling unit 40 can suppress the heating of the roller unit 10 by the wire 90. The cooling unit 40 is positioned between the heater unit 20 and the roller unit 10 and can be in direct contact with the wire 90.

[0055] The cooling unit 40 may include a cooling block unit 41 fixedly installed in the chamber and in contact with the wire 90, and a cooling circulation unit 42 that circulates cooling water through the cooling block unit 41 to cool it.

[0056] The cooling unit 40 is additionally positioned between the roller unit 10, which guides the wire 90 that does not pass through the heater unit 20, and the heater unit 20, thereby cooling the wire 90. On the other hand, the cooling circulation unit 42 can supply additional cooling water to the roller unit 10, thereby directly cooling the roller unit 10.

[0057] Figure 5 is a schematic diagram showing an adhesion prevention unit according to one embodiment of the present invention. Referring to Figures 1 and 5, the wire deposition apparatus 1 according to one embodiment of the present invention may further include an adhesion prevention unit 50.

[0058] The adhesion prevention section 50 covers the outside of the wire 90, excluding the vapor deposition space, thereby preventing scattered particles from adhering to the wire 90 outside the vapor deposition space. As an example, the adhesion prevention section 50 may include an adhesion prevention box section 51 having a box shape that surrounds the roller section 10 and the heater section 20.

[0059] A protective deposition hole 53 for vapor deposition is formed in the lower part of the protective box section 51, and a protective passage hole 54 for the wire 90 to pass through may be formed in the upper part of the protective box section 51. The protective box section 51 can be disassembled and assembled and can be fixedly installed in the chamber via a separate support base.

[0060] Figure 6 is a schematic diagram showing a heater section according to a first embodiment of the present invention. Referring to Figure 6, the heater section 20 according to the first embodiment of the present invention may include a first heater section 610 and a first heat dissipation section 620.

[0061] The first heater section 610 is positioned above the wire 90 and can be heated when power is applied. The first heater section 610 can be a sheath heater, a ceramic mold heater, or a PTC heater.

[0062] One or more first heat dissipation sections 620 cover the first heater section 610 so that only the lower part of the first heater section 610 is open, and heat can be discharged. The first heat dissipation sections 620 cover the first heater section 610 so that the wire 90 passing below the first heater section 610 is heated intensively, and the transfer of radiant heat to the periphery of the first heater section 610 can be blocked.

[0063] Figure 7 is a schematic diagram showing a heater section according to a second embodiment of the present invention. Referring to Figure 7, the heater section 20 according to the second embodiment of the present invention may include a second heater section 710, a second reflector section 720, and a second cooling section 730.

[0064] The second heater section 710 is positioned above the wire 90, and when power is applied, the lamp can be lit and heated. As an example, a halogen lamp may be used as the second heater section 710. Multiple second heater sections 710 may be arranged to cross above the wire 90.

[0065] The second reflector 720 can cover the second heater section 710 such that only the lower part of the second heater section 710 is open. The second reflector 720 can reflect the heat generated in the second heater section 710. The second heater section 710 can be mounted on the second reflector 720. In addition, the second heater section 710 can be mounted on the second cooling section 730.

[0066] The second cooling unit 730 is in contact with the second reflecting unit 720, and cooling water is moved to cool the second reflecting unit 720. The second cooling unit 730 can be fixedly installed in the chamber by separate fixing means.

[0067] The second reflector 720 may be attached to or coated on the inner wall of the second cooling section 730. As the second reflector 720, an infrared reflector coated with gold material on the inner wall of the second cooling section 730 may be used.

[0068] The second permeable section 740 covers the lower part of the second cooling section 730 and allows heat generated in the second heater section 710 to pass through.

[0069] Figure 8 is a schematic diagram showing a heater section according to a third embodiment of the present invention. Referring to Figure 8, the heater section 20 according to the third embodiment of the present invention may include an upper heater section 810, an upper reflector section 820, an upper cooling section 830, a lower heat dissipation section 840, and a lower cooling section 850.

[0070] The upper heater section 810 is positioned above the wire 90 and can generate heat. For example, the upper heater section 810 may be the first heater section 610 in Figure 6 or the second heater section 710 in Figure 7, and various heaters can be applied to heat the wire 90.

[0071] The upper reflector 820 can cover the upper heater section 810 so that only the lower part of the upper heater section 810 is open. The upper reflector 820 can reflect the heat generated by the upper heater section 810. The upper heater section 810 can be mounted on the upper reflector 820. The upper reflector 820 can be mounted on the upper cooling section 830.

[0072] The upper cooling section 830 is in contact with the upper reflecting section 820, and cooling water is moved to cool the upper reflecting section 820. The upper cooling section 830 may be fixedly installed in the chamber by separate fixing means. The upper reflecting section 820 may be attached to or coated on the inner wall of the upper cooling section 830.

[0073] The lower heat dissipation section 840 is positioned between the wire 90 and the cathode section 30, and can guide heat so that it is concentrated on the wire 90. For example, multiple lower heat dissipation sections 840 can be stacked, and heat can be transferred by passing through the stacked lower heat dissipation sections 840. The lower heat dissipation section 840 can suppress the transfer of radiant heat from the upper heater section 810 to surrounding equipment.

[0074] The lower cooling section 850 can cool the lower heat dissipation section 840. For example, heat transferred through the lower heat dissipation section 840 can be cooled through the lower cooling section 850. The lower cooling section 850 may have a hole in its center, and the upper heater section 810, the wire 90, and the cathode section 30 may be arranged so that they face each other on a vertical line.

[0075] The lower cooling section 850 may include a lower cooling block section 851, a lower cooling circulation section 852 that guides the circulation of cooling water in the lower cooling block section 851, and a lower cooling partition section 853 that is connected to the edge of the lower cooling block section 851.

[0076] Figure 9 is a schematic diagram showing a lower heat dissipation section according to a third embodiment of the present invention. Referring to Figure 9, the lower heat dissipation section 840 according to the third embodiment of the present invention may include a heat dissipation center section 841 and a heat dissipation side section 842.

[0077] Multiple heat dissipation center sections 841 have through-holes 849 in their central portions and can be stacked on the lower cooling section 850. For example, the heat dissipation center sections 841 can be stacked vertically on the lower cooling block section 751.

[0078] Multiple heat dissipation side sections 842 can cover the edge of the heat dissipation center section 841. For example, multiple heat dissipation side sections 842 arranged horizontally can be in close contact with the lower cooling partition section 853 and fixed to the lower cooling partition section 853 by fixing means.

[0079] More specifically, the heat dissipation center section 841 may include a center plate section 891, a center fixing hole section 892, and a center support section 893.

[0080] The center plate portion 891 may have a through-hole portion 849 formed in its central part. For example, the center plate portion 891 has the shape of a rectangular plate, and multiple portions of it may be stacked on the lower cooling block portion 851.

[0081] The center fixing holes 892 can be formed in the center plate portion 891. For example, the center fixing holes 892 may include a first fixing hole portion 881 located in the center of the center plate portion 891, which has the shape of a rectangular plate, and second fixing holes 882 located on both the left and right sides of the first fixing hole portion 881.

[0082] The center support portion 893 is attached to the lower cooling portion 850 by passing through the center fixing hole portion 892, and can support the center plate portion 891. For example, the center support portion 893 may be a pin, bolt, etc. that is attached to the lower cooling block portion 851 and protrudes upward, and a nut can be selectively attached to fix the center plate portion 891.

[0083] The center support portion 893 fixes the central part of the center plate portion 891, and the center fixing hole portion 892 may have a rectangular hole shape in which the length increases from the center of the center plate portion 891 towards the edge.

[0084] The first fixing hole portion 881 is sized to correspond to the center support portion 893, and the central portion of the center plate portion 891 in which the first fixing hole portion 881 is formed can be fixed by the center support portion 893.

[0085] Multiple second fixing holes 882 may be formed on both the left and right sides of the first fixing hole 881. The length of the rectangular holes in the second fixing holes 882 may increase as they move from the first fixing hole 881 towards both the left and right ends of the center plate 891. This prevents interference with the center support 893 even if the center plate 891 is heated and expands.

[0086] Figure 10 is a schematic diagram showing a cathode section according to one embodiment of the present invention. Referring to Figure 10, the cathode section 30 according to one embodiment of the present invention may include a cathode cooling section 31, a cathode magnet section 32, and a cathode material section 33.

[0087] The cathode cooling section 31 has a cathode flow channel section 312 formed in the cathode block section 311, through which cooling water can be circulated. In this case, the cathode flow channel section 312 can be formed integrally with the cathode block section 311 through gun drilling and welding to improve thermal conductivity.

[0088] The cathode cooling section 31 has an open top, the cathode magnet section 32 is built into the cathode cooling section 31 and provides magnetic force, and the cathode material section 33 is exposed to the outside on the upper surface of the cathode magnet section 32 and can provide the deposited material.

[0089] The operation of the wire deposition apparatus according to one embodiment of the present invention having the structure described above is as follows.

[0090] The wire 90 introduced into the chamber is wound around multiple roller sections 10 several times and moved, the wire 90 positioned between the roller sections 10 is heated by the heater section 20, and the substance supplied from the cathode section 30 is deposited onto the wire 90.

[0091] When the roller section 10 is heated by the heater section 20, the roller shaft section 12 expands, and the roller absorption section 13 supports the expanding roller shaft section 12 while contracting.

[0092] When the additional roller support section 14 expands, the additional roller absorption section 15 supports the expanding additional roller support section 14 while contracting. At this time, the roller shaft section 12 and the additional roller support section 14 surrounding the roller shaft section 12 are each equipped with bearings to ensure the operability of the wire 90.

[0093] The roller discharge section 16 guides the gas remaining inside the roller section 10 to be discharged stably, and the roller maintenance section 17 can replace the space where the additional roller support section 14 is removed depending on the working environment.

[0094] The heater unit 20 is positioned above the wire 90 and concentrates heat on the wire 90 as it moves below, employing a heat dissipation and reflection structure to suppress the transfer of radiant heat to other equipment.

[0095] The lower heat dissipation section 840 is designed to be stacked in multiple units. The center of each of the multiple lower heat dissipation sections 840 is fixed, and the length of the center fixing hole 892 formed in the lower heat dissipation section 840 increases from the center towards the edge. Therefore, even if the lower heat dissipation section 840 expands due to the high heat of the upper heater section 810, the mounting state can be stably maintained.

[0096] The cooling unit 40 is positioned between the roller unit 10 and the heater unit 20, and by directly contacting the heated wire 90 and cooling the wire 90, it is possible to prevent overheating of the roller unit 10 around which the wire 90 is wound. Such cooling units 40 can be positioned on both the left and right sides of the heater unit 20, and if necessary, the cooling water from the cooling unit 40 can pass through the roller unit 10 to directly cool the roller unit 10.

[0097] The adhesion prevention section 50 is positioned to surround the entire outer surface of the wire 90, excluding the vapor deposition space. This prevents evaporated particles scattered by the cathode section 30 from adhering to the wire 90 in the area excluding the vapor deposition space.

[0098] In one embodiment of the present invention, the wire deposition apparatus 1 allows the wire 90 to be heated by a heater unit 20 and deposited while being wound around a plurality of roller units 10 and moved. The heater unit 20 concentrates the heating of the wire 90 to prevent damage to surrounding equipment, and the adhesion prevention unit 50 partially covers the wire 90 to prevent scattered particles from adhering to the wire 90.

[0099] Although the present invention has been described with reference to the embodiments illustrated in the drawings, these are merely illustrative, and a person with ordinary skill in the art will understand that a variety of modifications and equivalent other embodiments are possible therefrom. Therefore, the true scope of technical protection of the present invention should be defined by the following claims.

Claims

1. Multiple roller sections around which the wire is wound and moved; A heater unit that concentrates heating of the wire passing through the roller section; A cathode portion that provides a vapor-deposited material to the wire; and Includes an adhesion prevention part that covers the outside of the wire material, excluding the vapor deposition space of the wire material, to prevent the adhesion of scattered particles; The heater section An upper heater section positioned above the aforementioned wire to generate heat; An upper reflector that covers the upper heater section so that only the lower part of the upper heater section is open, and reflects the heat generated by the upper heater section; An upper cooling section for cooling the upper reflective section; A lower heat dissipation section is positioned between the wire and the cathode section to guide heat so that it is concentrated on the wire; and A wire deposition apparatus characterized by including a lower cooling section for cooling the lower heat dissipation section.

2. The lower heat dissipation section is Multiple heat dissipation center sections are stacked on the lower cooling section, with a through-hole section formed in the center; and The wire deposition apparatus according to claim 1, characterized by including a plurality of heat dissipation side portions that cover the edge of the heat dissipation center portion.

3. The aforementioned heat dissipation center section A center plate portion in which the through-hole portion is formed in the central part; Multiple center fixing holes formed in the center plate portion; and The wire deposition apparatus according to claim 2, characterized by including a center support portion that penetrates the center fixing hole portion and is attached to the lower cooling portion and supports the center plate portion.

4. The aforementioned center support portion fixes the central part of the center plate portion, The wire deposition apparatus according to claim 3, characterized in that the center fixing hole portion has a rectangular hole shape in which the length increases from the center portion to the edge of the center plate portion.

5. The wire deposition apparatus according to claim 1, further comprising: a cooling unit disposed between the heater unit and the roller unit, which is in direct contact with the wire and cools the wire.

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