Ceramic electronic components, mounting board arrangement, and method for manufacturing ceramic electronic components

Abstract

To reduce an area required for an external electrode while improving reliability.SOLUTION: A ceramic electronic component comprises: a first internal electrode; a second internal electrode disposed in parallel with the first internal electrode; an element assembly which is interposed between the first and second internal electrodes and includes a dielectric enclosing the internal electrodes; and an external electrode electrically connected to ends of the internal electrodes. The element assembly includes a bottom face and a top face where the ends of the first and second internal electrodes are exposed. The dielectric includes a lower dielectric region adjacent to the bottom face, an upper dielectric region adjacent to the top face, and an intermediate height dielectric region disposed between the lower dielectric region and the upper dielectric region. The lower dielectric region has a ratio of an atomic concentration of one or more group-14 elements with respect to an atomic concentration of one or more group 2 elements higher than a ratio of an atomic concentration of one or more group-14 elements with respect to an atomic concentration of one or more group-2 elements in the upper dielectric region.SELECTED DRAWING: Figure 1

Claims

1. A substrate comprising at least one first internal electrode, at least one second internal electrode arranged parallel to the first internal electrode, and a dielectric interposed between the first internal electrode and the second internal electrode, surrounding the first and second internal electrodes, having a lower surface on which the ends of the first internal electrode and the ends of the second internal electrode are exposed, and an upper surface on the opposite side of the lower surface, wherein the dielectric comprises a lower dielectric region arranged adjacent to the lower surface, an upper dielectric region arranged adjacent to the upper surface, and an intermediate height dielectric region arranged between the lower dielectric region and the upper dielectric region, A first external electrode electrically connected to the end of the first internal electrode, The device comprises a second external electrode electrically connected to the end of the second internal electrode, Both the lower dielectric region and the upper dielectric region contain one or more Group 14 elements and one or more Group 2 elements, and the ratio of the atomic concentration of one or more Group 14 elements to the atomic concentration of one or more Group 2 elements in the lower dielectric region is higher than the ratio of the atomic concentration of one or more Group 14 elements to the atomic concentration of one or more Group 2 elements in the upper dielectric region. The intermediate-height dielectric region contains one or more Group 14 elements and one or more Group 2 elements, and the ratio of the atomic concentration of one or more Group 14 elements to the atomic concentration of one or more Group 2 elements in the upper dielectric region is lower than the ratio of the atomic concentration of one or more Group 14 elements to the atomic concentration of one or more Group 2 elements in the intermediate-height dielectric region. Ceramic electronic components.

2. The intermediate height dielectric region comprises one or more Group 14 elements and one or more Group 2 elements. The ratio of the atomic concentration of the first or more Group 14 elements to the atomic concentration of the first or more Group 2 elements in the lower dielectric region is higher than the ratio of the atomic concentration of the first or more Group 14 elements to the atomic concentration of the first or more Group 2 elements in the intermediate height dielectric region. The ceramic electronic component according to claim 1.

3. The toughness of the lower dielectric region is characterized by being higher than the toughness of the intermediate height dielectric region. The ceramic electronic component according to claim 1 or 2.

4. A body having at least one first internal electrode, at least one second internal electrode arranged parallel to the first internal electrode, and a dielectric interposed between the first internal electrode and the second internal electrode and surrounding the first internal electrode and the second internal electrode, having a lower surface on which the ends of the first internal electrode and the ends of the second internal electrode are exposed and an upper surface on the opposite side of the lower surface, wherein the dielectric comprises a lower dielectric region arranged adjacent to the lower surface, an upper dielectric region arranged adjacent to the upper surface, and an intermediate height dielectric region arranged between the lower dielectric region and the upper dielectric region, A first external electrode electrically connected to the end of the first internal electrode, The device comprises a second external electrode electrically connected to the end of the second internal electrode, Both the lower dielectric region and the upper dielectric region contain one or more Group 14 elements and one or more Group 2 elements, and the ratio of the atomic concentration of one or more Group 14 elements to the atomic concentration of one or more Group 2 elements in the lower dielectric region is higher than the ratio of the atomic concentration of one or more Group 14 elements to the atomic concentration of one or more Group 2 elements in the upper dielectric region. The hardness of the upper dielectric region is characterized by being higher than the hardness of the intermediate-height dielectric region. Ceramic electronic components.

5. The element further has another surface connecting the lower surface and the upper surface, and an upper angle portion formed by the other surface and the upper surface, and the upper dielectric region includes the upper angle portion. The ceramic electronic component according to claim 1 or 2.

6. The upper corner of the aforementioned base body is characterized by being chamfered. The ceramic electronic component according to claim 5.

7. The substrate has a plurality of first internal electrodes and a plurality of second internal electrodes that are alternately stacked with the dielectric material interposed between them, The first external electrode extends along the direction in which the first and second internal electrodes are stacked, The second external electrode extends along the direction in which the first and second internal electrodes are stacked, Each of the first internal electrodes has an exposed protrusion as the end of the first internal electrode, the lower end of which is exposed only on the lower surface. Each of the second internal electrodes is characterized in that it has an exposed protrusion as the end of the second internal electrode, the lower end of which is exposed only on the lower surface. The ceramic electronic component according to claim 1 or 2.

8. Each of the first external electrode and the second external electrode has a base layer and a plating layer formed on the base layer, and the base layer is characterized in that it contains a metal, a common material dispersed in the metal, and one or more Group 14 elements dispersed in the metal. The ceramic electronic component according to claim 1 or 2.

9. The lower dielectric region is characterized by having a diffusion layer formed by the diffusion of the Group 14 elements in the underlying layer. The ceramic electronic component according to claim 8.

10. The dielectric is characterized by containing a ceramic material comprising at least one of the following: barium titanate, strontium titanate, calcium titanate, magnesium titanate, barium strontium titanate, barium calcium titanate, calcium zirconate, barium zirconate, and calcium zirconate titanate. The ceramic electronic component according to claim 1 or 2.

11. The one or more Group 2 elements are one or more of Be, Mg, Ca, Sr, and Ba, and the one or more Group 14 elements are one or more of C, Si, Ge, Sn, and Pb. The ceramic electronic component according to claim 1 or 2.

12. The characteristic is that the one or more Group 2 elements is Ba, and the one or more Group 14 elements is Si. The ceramic electronic component according to claim 1 or 2.

13. A body having at least one first internal electrode, at least one second internal electrode disposed parallel to the first internal electrode, and a dielectric interposed between the first internal electrode and the second internal electrode and surrounding the first internal electrode and the second internal electrode, having a lower surface on which the ends of the first internal electrode and the ends of the second internal electrode are exposed and an upper surface on the opposite side of the lower surface, wherein the dielectric comprises a lower dielectric region disposed adjacent to the lower surface, an upper dielectric region disposed adjacent to the upper surface, and an intermediate height dielectric region disposed between the lower dielectric region and the upper dielectric region, A first external electrode electrically connected to the end of the first internal electrode, The device comprises a second external electrode electrically connected to the end of the second internal electrode, Both the lower dielectric region and the upper dielectric region contain Si and Ba, and the ratio of the atomic concentration of Si to the atomic concentration of Ba in the lower dielectric region is higher than the ratio of the atomic concentration of Si to the atomic concentration of Ba in the upper dielectric region. The lower dielectric region is characterized by having a ratio of the atomic concentration of Si to the atomic concentration of Ba, which is between 1.3% and 3.9%. Ceramic electronic components.

14. The upper dielectric region is characterized by having a ratio of the atomic concentration of Si to the atomic concentration of Ba that is greater than 0% and less than or equal to 1.0%. The ceramic electronic component according to claim 13.

15. A ceramic electronic component according to claim 1 or 2, Implemented circuit board and A first land electrode formed on the aforementioned mounting substrate, A second land electrode formed on the aforementioned mounting substrate, A first solder layer connecting the first land electrode and the first external electrode, The second solder layer connects the second land electrode and the second external electrode. Circuit board structure.

16. A substrate is formed having at least one first internal electrode, at least one second internal electrode arranged parallel to the first internal electrode, and a dielectric interposed between the first internal electrode and the second internal electrode, surrounding the first internal electrode and the second internal electrode, wherein the dielectric comprises one or more group 14 elements and one or more group 2 elements, and having a lower surface on which the ends of the first internal electrode and the ends of the second internal electrode are exposed, and an upper surface opposite to the lower surface. A base material for the outer electrode base layer is applied to the region on the lower surface where the ends of the first internal electrode and the ends of the second internal electrode are exposed, and the base material for the outer electrode base layer is applied to the region where the ends of the first internal electrode and the second internal electrode are exposed, and the base material for the outer electrode base layer is applied to the region where the ends of the first internal electrode and the second internal electrode are exposed, The aforementioned base material is sintered to form a base layer, and the one or more Group 14 elements contained in the base material are diffused into the lower dielectric region of the dielectric, which is arranged adjacent to the region on the lower surface. The process includes forming a plating layer on each of the aforementioned underlayers, The dielectric comprises a lower dielectric region located adjacent to the lower surface, an upper dielectric region located adjacent to the upper surface, and an intermediate-height dielectric region located between the lower dielectric region and the upper dielectric region. The substrate material is characterized in that, after sintering, the atomic concentration of one or more Group 14 elements relative to the atomic concentration of one or more Group 2 elements in the upper dielectric region is lower than the atomic concentration of one or more Group 14 elements relative to the atomic concentration of one or more Group 2 elements in the intermediate height dielectric region. A method for manufacturing ceramic electronic components.

17. The formation of the aforementioned substrate is characterized by attaching a green sheet to the upper dielectric region, the green sheet having a ratio of the concentration of one or more Group 14 elements to the concentration of one or more Group 2 elements that is smaller than that of the intermediate-height dielectric. The method according to claim 16.

18. The characteristic is that the one or more Group 2 elements is Ba, and the one or more Group 14 elements is Si. The method according to claim 16 or 17.

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